TWI474888B - Lightning scribing device - Google Patents
Lightning scribing device Download PDFInfo
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- TWI474888B TWI474888B TW101113523A TW101113523A TWI474888B TW I474888 B TWI474888 B TW I474888B TW 101113523 A TW101113523 A TW 101113523A TW 101113523 A TW101113523 A TW 101113523A TW I474888 B TWI474888 B TW I474888B
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- frame
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- stone
- support plate
- laser light
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Description
本發明係有關於一種用於對玻璃基板、藍寶石基板、半導體基板等脆性材料基板照射雷射光束而形成劃線溝槽之雷射劃線裝置。The present invention relates to a laser scribing apparatus for irradiating a brittle material substrate such as a glass substrate, a sapphire substrate, or a semiconductor substrate with a laser beam to form a scribe groove.
一般而言如下方法已為人所知：於分割脆性材料基板之過程中，一邊沿著劃線預定線對脆性材料基板之表面照射雷射光一邊使其相對地移動，藉此形成劃線溝槽，且上述方法已揭示於例如專利文獻1中。In general, a method is known in which a surface of a brittle material substrate is irradiated with a laser beam while being irradiated with a laser beam along a predetermined line of a scribe line, thereby forming a scribe groove. The above method has been disclosed, for example, in Patent Document 1.
雷射劃線裝置中，將脆性材料基板載置於在相互正交之X方向與Y方向上可移動之X-Y平台上之工作台上，一邊照射雷射光一邊使工作台向X方向及Y方向移動，從而於脆性材料基板上形成劃線溝槽。支持處理大型基板之X-Y平台之台盤係使用溫度變化小並且物理性、機械強度優異之石定盤。石定盤與精密機械加工領域中所使用者相同，係將花崗岩(granite)形成為厚板狀，且上下表面之水平度經過精密加工。In the laser scribing device, the brittle material substrate is placed on a table on an XY stage movable in the X direction and the Y direction orthogonal to each other, and the table is irradiated with the laser light in the X direction and the Y direction. Moving to form a scribe groove on the brittle material substrate. A plate that supports the X-Y platform for processing large substrates uses a stone plate having a small temperature change and excellent physical and mechanical strength. The stone plate is the same as the user in the field of precision machining. The granite is formed into a thick plate shape, and the level of the upper and lower surfaces is precisely machined.
圖4係表示組裝有石定盤之先前之雷射劃線裝置之概略前視圖。Figure 4 is a schematic front elevational view showing a prior laser scribing apparatus incorporating a stone plate.
於由金屬製之框材組成之下部框架31之上表面，經由可調整高度之連結部32而固定有以石定盤33為基台之金屬製之上部框架34。於石定盤33之上表面設置有包含X平台36及Y平台38之X-Y平台39，上述X平台36配置成可沿著於X 方向(圖4之前後方向)上延伸設置之軌道35移動，上述Y平台38配置成於該X平台上可沿著於Y方向(圖4之左右方向)上延伸設置之軌道37移動。於Y平台38上經由圍繞垂直軸(縱軸)旋轉之旋轉機構40而設置有工作台41，於工作台41上載置有所應加工之脆性材料基板W。A metal upper frame 34 having a stone fixing plate 33 as a base is fixed to the upper surface of the lower frame 31 by a metal frame material via a height-adjustable connecting portion 32. An X-Y platform 39 including an X platform 36 and a Y platform 38 is disposed on the upper surface of the stone plate 33, and the X platform 36 is configured to be along the X The rail 35 extending in the direction (the front and rear direction of FIG. 4) is moved, and the Y platform 38 is disposed so as to be movable along the rail 37 extending in the Y direction (the left-right direction of FIG. 4) on the X platform. A table 41 is provided on the Y stage 38 via a rotating mechanism 40 that rotates about a vertical axis (vertical axis), and a brittle material substrate W to be processed is placed on the table 41.
於上部框架34之最上部安裝有雷射光源42及用來確認位置之觀察部(未圖示)。雷射光源42之內部包括雷射振盪源、將來自雷射振盪源之光導引至雷射光照射部43之反射鏡及聚光透鏡等光學元件。構成為將脆性材料基板W載置於工作台41上，使雷射光自雷射光照射部43照射至脆性材料基板W，並且藉由X-Y平台39使工作台41朝向X方向以及Y方向移動，藉此可對脆性材料基板W加工X方向以及Y方向之劃線溝槽。A laser light source 42 and an observation portion (not shown) for confirming the position are attached to the uppermost portion of the upper frame 34. The inside of the laser light source 42 includes a laser oscillation source, an optical element that guides light from the laser oscillation source to the mirror of the laser light irradiation unit 43, and a collecting lens such as a collecting lens. The brittle material substrate W is placed on the table 41, and the laser beam is irradiated from the laser beam irradiation unit 43 to the brittle material substrate W, and the table 41 is moved in the X direction and the Y direction by the XY stage 39. This can process the scribe groove in the X direction and the Y direction on the brittle material substrate W.
[專利文獻1]日本專利特開2010-089143號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-089143
於上述雷射劃線裝置中，石定盤33配置於下部框架31之上方，於石定盤33之上表面組裝上部框架34。石定盤33構成為與上部框架34、下部框架31一併組裝為一體之構造，以作為成為整個裝置之骨架之框架之一部分而發揮功能。而且，石定盤33位於上部與下部框架31、34之間，石定盤載置面配置成到達自裝置之設置面R起向上相當於間隔L1 之位置處，該間隔L1 係將下部框架31及連結部32之高度合計而成，從而成為裝置之重心上浮之「高腰」結構。In the above-described laser scribing apparatus, the stone fixing plate 33 is disposed above the lower frame 31, and the upper frame 34 is assembled on the upper surface of the stone fixing plate 33. The stone fixing plate 33 is configured to be integrally assembled with the upper frame 34 and the lower frame 31, and functions as a part of the frame of the skeleton of the entire apparatus. Furthermore, the stone surface plate 33 is located between the upper and lower frame 31 and 34, the stone surface plate mounting surface configured to reach the set R from the device surface upward at a position corresponding to the date of 1 L interval, the interval L 1 between the lower lines The height of the frame 31 and the connecting portion 32 is combined to form a "high waist" structure in which the center of gravity of the device rises.
即，由於通常於石定盤33之上表面載置機器並且操作者使用該些機器，因此一般係成套地使用石定盤載置面之高度L1 設為800~850 mm左右之下部框架31及石定盤33，以使石定盤33之上表面之高度達到人容易操作之高度。That is, since generally above the stone surface of the mounting platen 33 and the machine operator to use the plurality of machine, it is generally used in sets based mounting surface of the stone surface plate is set to a height L 1 of about 800 ~ 850 mm under the frame portion 31 And the stone plate 33, so that the height of the upper surface of the stone plate 33 reaches a height that is easy for humans to operate.
然而，於雷射劃線裝置中，藉由重複利用X-Y平台39進行之工作台41之往返移動而連續進行多次劃線加工，但於進行上述往返移動之動作時，會產生以X-Y平台39為振動源之振動。若石定盤33如上述例般配置於下部框架31與上部框架34之間(高度800 mm左右)，則上述振動會自X-Y平台39經由石定盤33傳遞至整個上、下部框架。However, in the laser scribing apparatus, the scribing process is continuously performed a plurality of times by repeating the reciprocating movement of the table 41 by the XY stage 39, but when the reciprocating movement is performed, the XY stage 39 is generated. It is the vibration of the vibration source. If the stone fixing plate 33 is disposed between the lower frame 31 and the upper frame 34 (having a height of about 800 mm) as in the above-described example, the vibration is transmitted from the X-Y stage 39 to the entire upper and lower frames via the stone fixing plate 33.
若觀察伴隨工作台移動而產生之振動，則工作台41藉由X-Y平台39而向X方向或Y方向移動，移動至端部為止而停止之瞬間產生較大之急遽的加速度變化(慣性力)，而且會產生因工作台掃描速度越大則越大之減速而導致之急遽加速度變化，從而較大之慣性力發揮作用而振動變大。When the vibration generated by the movement of the table is observed, the table 41 is moved in the X direction or the Y direction by the XY stage 39, and a moment of rapid stop (inertial force) is generated at the moment of stopping to the end. Moreover, there is a sudden acceleration change due to the deceleration which is larger as the scanning speed of the table is larger, and the larger inertial force acts to increase the vibration.
所產生之振動會隨著時間之推移而衰減，但若於因前一次之工作台移動而產生之振動還未完全衰減之狀態下，開始下一次之工作台移動(朝向與前一次不同之方向移動)，則於仍殘留振動之狀態下移動，若移動中進行雷射劃線加工，而形成受到振動影響之劃線溝槽，從而難以提高劃線精度。The generated vibration will attenuate over time, but if the vibration generated by the previous table movement has not been completely attenuated, the next table movement will start (toward the different direction from the previous one). When moving, the vibration is still moved, and if the laser scribing is performed during the movement, the scribe groove affected by the vibration is formed, and it is difficult to improve the scribing accuracy.
因此，為了提高劃線精度，必須抑制振動，使得以小於 原本X-Y平台可發揮之最大移動速度之速度進行往返運動，或者待機直至移動至端部為止之時刻振動完全停止後再開始下一次移動。Therefore, in order to improve the scribing accuracy, it is necessary to suppress the vibration so that it is smaller than The original X-Y platform can perform the reciprocating motion at the speed of the maximum moving speed, or the standby motion until the end of the vibration is completely stopped before starting the next movement.
因此，於必須抑制振動影響方面，提高劃線加工之生產量有限。Therefore, in terms of the necessity of suppressing the influence of vibration, the production amount of the scribing process is limited.
再者，設置有經組裝石定盤33之先前裝置之工廠內部之環境溫度會有發生變化之情形。於此情形時，於膨脹係數比金屬小之石定盤33之上表面，由於是以螺栓等直接固定金屬製之上部框架34，因此與固定在石定盤33之上部框架34之下端部分相比，上部框架34之最上部之橫框部分會因熱膨脹而產生較大變形，結果導致該部分撓曲變形。即使稍微產生上述撓曲變形，被支持於上部框架34之雷射光源42之照***度或觀察機器之讀取精度亦會產生誤差，使得來自雷射光照射部43之光束照射方向產生紊亂，而難以加工符合設定之準確之劃線溝槽。Further, the ambient temperature inside the factory in which the prior device of the assembled stone fixing plate 33 is provided may be changed. In this case, the upper surface of the lower frame 33 is fixed to the upper surface of the lower frame 33 of the stone fixing plate 33 because the expansion coefficient is larger than the upper surface of the metal plate 33. In contrast, the uppermost frame portion of the upper frame 34 is largely deformed by thermal expansion, resulting in deflection of the portion. Even if the above-described deflection is slightly generated, an irradiation precision of the laser light source 42 supported by the upper frame 34 or a reading accuracy of the observation machine may cause an error, so that the direction of the light beam irradiation from the laser light irradiation portion 43 is disturbed, which is difficult. Process the exact scribe groove that meets the settings.
因此，本發明之目的在於提供一種抑制劃線動作時之振動，且可藉由雷射高精度且準確地形成劃線溝槽之劃線裝置。Accordingly, it is an object of the present invention to provide a scribing apparatus capable of suppressing vibration during a scribing operation and forming a scribe groove with high precision and accuracy by laser.
為了解決上述課題而完成之本發明之劃線裝置包括：框架，其由框材立體地組成，該框材至少包含立設於四角之柱框、於上述柱框之下部將上述柱框之間水平連結之下部橫框、及於上述柱框之上部將上述柱框之間水平連結之上部橫框；底部支持板，其於由上述框架包圍之內側空間之 設置面附近被支持於上述下部橫框；石定盤，其載置於上述底部支持板上；移動平台，其安裝於上述石定盤之上表面；工作台，其由上述移動平台可移動地支持並且載置脆性材料基板；上部支持板，其於上述石定盤之上方被支持於上述上部橫框；雷射光源，其被支持於上述上部支持板；以及雷射光照射部，其將來自上述雷射光源之雷射光照射至上述脆性材料基板上。The scribing apparatus of the present invention completed to solve the above problems includes: a frame which is three-dimensionally composed of a frame material, and the frame material includes at least a column frame which is erected at four corners, and between the column frames at a lower portion of the column frame a horizontally connected lower frame and a horizontal frame connected to the upper frame at an upper portion of the column frame; and a bottom support plate at an inner space surrounded by the frame The setting surface is supported by the lower horizontal frame; the stone fixing plate is placed on the bottom supporting plate; the moving platform is mounted on the upper surface of the stone fixing plate; and the table is movably moved by the moving platform Supporting and mounting a substrate of a brittle material; an upper support plate supported by the upper horizontal frame above the stone plate; a laser source supported by the upper support plate; and a laser beam irradiation portion, which will come from The laser light of the above-mentioned laser light source is irradiated onto the above-mentioned brittle material substrate.
此處，較佳為將自設置面到底部支持板之上表面之高度即石定盤載置面高度L2 設為50 mm~400 mm。Here, it is preferable that the height from the installation surface to the upper surface of the bottom support plate, that is, the height of the stone mounting surface L 2 is set to 50 mm to 400 mm.
由移動平台(X-Y平台)驅動之工作台急速停止時之慣性力而產生之水平方向之振動，雖會經由載置移動平台之石定盤而傳遞至框架，然而石定盤之高度離設置面越遠則振動週期越長，離設置面越近則週期越短。一般來說，振動週期越長則衰減越需耗費時間，因此藉由縮短振動之頻率可縮短衰減時間。The horizontal vibration generated by the inertial force when the table driven by the mobile platform (XY platform) is rapidly stopped is transmitted to the frame via the stone plate on which the moving platform is placed, but the height of the stone plate is away from the setting surface. The farther the vibration period is, the closer the setting surface is, the shorter the period is. In general, the longer the vibration period, the more time consuming the attenuation, so the attenuation time can be shortened by shortening the frequency of the vibration.
因此，本發明中，在將底部支持板配置於接近裝置設置面之位置並於其上配置石定盤之構造上，設法縮短自設置面到石定盤之載置面之高度。藉此，即便因工作台之急速停止而產生振動，但由於為短週期振動，故會於短時間內衰減，且於下一次工作台開始移動之前，前一次振動會完全停止，從而可進行受振動影響較小之劃線加工。Therefore, in the present invention, in the structure in which the bottom support plate is disposed at a position close to the installation surface of the apparatus and the stone fixing plate is disposed thereon, it is sought to shorten the height from the installation surface to the mounting surface of the stone fixing plate. Therefore, even if the vibration occurs due to the rapid stop of the table, the vibration is short-cycle, so it will be attenuated in a short time, and the previous vibration will be completely stopped before the next stage starts moving, so that the vibration can be performed. Scribing processing with less vibration impact.
藉此，可高精度地進行劃線溝槽之加工，並且移動平台亦可高速運轉，從而可提高裝置性能。Thereby, the processing of the scribe groove can be performed with high precision, and the moving platform can also be operated at a high speed, thereby improving the performance of the device.
此處，只要將自設置面到石定盤之載置面之高度即定盤載置面高度L2 設為50 mm~400 mm，則可大幅地使水平方向上之振動衰減，且高度越低，越能夠進一步增強衰減效果。Here, if the height of the fixed plate mounting surface height L 2 from the installation surface to the mounting surface of the stone plate is 50 mm to 400 mm, the vibration in the horizontal direction can be greatly attenuated, and the height is increased. Low, the more the attenuation effect can be further enhanced.
再者，石定盤經由底部支持板而被支持於下部橫框(框架)，由於石定盤未直接固定於框架，因此能夠抑制因溫度變化所引起之框架與石定盤之熱膨脹係數差導致之變形之影響。Furthermore, the stone fixing plate is supported by the lower horizontal frame (frame) via the bottom support plate, and since the stone fixing plate is not directly fixed to the frame, it is possible to suppress the difference in thermal expansion coefficient between the frame and the stone fixing plate caused by the temperature change. The effect of the deformation.
上述發明中，上述石定盤與上述底部支持板較佳為以單側被固定、另一側可自由膨脹之方式而避免因熱膨脹係數差導致底部支持板變形之方式被支持。In the above invention, it is preferable that the stone fixing plate and the bottom supporting plate are supported so as to be fixed on one side and freely expandable on the other side to prevent deformation of the bottom supporting plate due to a difference in thermal expansion coefficient.
因包括抑制因熱膨脹係數差導致底部支持板變形之逃逸機構，故可相對於溫度變化進行高精度之雷射劃線加工。Since it includes an escape mechanism that suppresses deformation of the bottom support plate due to a difference in thermal expansion coefficient, high-precision laser scribing processing can be performed with respect to temperature changes.
以下，根據圖1~圖3詳細說明本發明之雷射劃線裝置。圖1係表示本發明之雷射劃線裝置之框架部分之立體圖，圖2係本發明之雷射劃線裝置之局部剖面前視圖。Hereinafter, the laser scribing apparatus of the present invention will be described in detail with reference to Figs. 1 to 3 . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a frame portion of a laser scribing apparatus of the present invention, and Fig. 2 is a partial cross-sectional front view showing a laser scribing apparatus of the present invention.
框架1由立設於四角之四根柱框1a、將該等柱框1a之間水平連結之下部橫框1b及上部橫框1c、以及為了加固而視需要設置之中部橫框1d組成為立方體狀(亦可為長方體)。該等框材1a、1b、1c、1d由相同金屬材料之角管、例如板厚9 mm左右之鐵或不鏽鋼而形成。The frame 1 is composed of four column frames 1a standing at four corners, horizontally connecting the lower frame 1b and the upper frame 1c between the column frames 1a, and a middle frame 1d as a cube for reinforcement. Shape (can also be cuboid). The frame members 1a, 1b, 1c, and 1d are formed of an angle tube of the same metal material, for example, iron or stainless steel having a thickness of about 9 mm.
本實施形態中，下部橫框1b由合計五根框材構成，該合計五根框材中除了將相鄰接之柱框1a之最下部之間水平連 結之四根框材以外，還有將相向之一對下部橫框1b、1b之中央之間水平連結之另一根下部橫截橫框1e。於柱框1a之下端面安裝對設置面R進行高度調整之調節器18，又，於下部橫框1b安裝移動用之腳輪19。In the present embodiment, the lower horizontal frame 1b is composed of a total of five frame members, and the total of the five frame members is horizontally connected to the lowermost portion of the adjacent column frame 1a. In addition to the four frame members, there is another lower cross-sectional transverse frame 1e that horizontally connects one of the opposing faces to the center of the lower horizontal frames 1b, 1b. The adjuster 18 for height adjustment of the installation surface R is attached to the lower end surface of the column frame 1a, and the caster 19 for movement is attached to the lower horizontal frame 1b.
而且，於接近設置面R之位置上，石定盤3經由底部支持板2並由下部橫框1b(以及下部橫截橫框1e)水平地支持。Further, at a position close to the setting surface R, the stone fixing plate 3 is horizontally supported via the bottom support plate 2 and by the lower horizontal frame 1b (and the lower cross-sectional horizontal frame 1e).
上部橫框1c構成為藉由將相鄰接之柱框1a之最上部之間水平連結之四根框材而形成方形，於其上載置上部支持板20而固定。於上部支持板20上載置下述雷射光源16，進而以雷射光照射部17自形成於上部支持板20之開口部21朝向下方照射雷射光之方式支持。The upper horizontal frame 1c is formed by forming four square frames which are horizontally connected between the uppermost portions of the adjacent column frames 1a, and is fixed by placing the upper support plate 20 thereon. The laser light source 16 described below is placed on the upper support plate 20, and is further supported by the laser beam irradiation unit 17 from the opening 21 formed in the upper support plate 20 toward the lower side.
而且，中部橫框1d構成為由將柱框1a之中央部之間水平連結之四根框材而形成方形。Further, the middle horizontal frame 1d is formed in a square shape by four frame members horizontally connecting the central portions of the column frame 1a.
石定盤3由溫度變化小並且物理性、機械強度優異之花崗岩(granite)形成為厚板狀，且上下表面之水平度經過精密加工。The stone plate 3 is formed into a thick plate shape by granite having a small temperature change and excellent physical and mechanical strength, and the level of the upper and lower surfaces is precisely processed.
底部支持板2大於石定盤3所佔之面(投影面)，以能夠完全載置石定盤3之底面，框架1與石定盤3以不直接接觸之方式安裝於由框架1包圍之內側空間內。而且，如圖2所示，以石定盤3之一側面經由角狀安裝片4以及螺栓5固定於底部支持板2之方式安裝，石定盤3之相反側之側緣部未由按壓片6固定而可自由膨脹，上表面輕輕地與按壓片6接觸。藉此，當周圍溫度產生變化時，底部支持板2不會受到石定盤3約束而允許熱膨脹，不會因與石定盤3之熱膨脹 係數差產生之影響而產生偏向底部支持板2之變形，進而不會對框架1造成由與石定盤3之熱膨脹係數差引起之影響。The bottom support plate 2 is larger than the surface (projection surface) occupied by the stone fixing plate 3 so as to be able to completely mount the bottom surface of the stone fixing plate 3, and the frame 1 and the stone fixing plate 3 are attached to the inner side surrounded by the frame 1 without being in direct contact. Within the space. Further, as shown in FIG. 2, one side of the stone fixing plate 3 is attached to the bottom support plate 2 via the angular mounting piece 4 and the bolt 5, and the side edge portion on the opposite side of the stone fixing plate 3 is not pressed. 6 is fixed and free to expand, and the upper surface is gently in contact with the pressing piece 6. Thereby, when the ambient temperature changes, the bottom support plate 2 is not restrained by the stone fixing plate 3 to allow thermal expansion, and does not expand due to thermal expansion with the stone fixing plate 3. The influence of the coefficient difference causes deformation of the bottom support plate 2, which does not cause the frame 1 to be affected by the difference in thermal expansion coefficient from the stone plate 3.
就人為操作性之觀點來說，以往將自設置面R至石定盤3下表面之石定盤載置高度L2 設為800 mm左右，但由於下述之因工作台之移動而產生之振動頻率依存於距離設置面R之高度，故較佳為將石定盤載置高度L2 設為50 mm~400 mm，更佳為設為50 mm~200 mm以下，以充分提高所產生之振動頻率而使振動於短時間內衰減。From the viewpoint of human operability, the stone mounting plate height L 2 from the setting surface R to the lower surface of the stone fixing plate 3 has been set to about 800 mm in the past, but it is caused by the movement of the table as described below. oscillation frequency depends on the height from the setting surface R, it is preferably mounted to the stone surface plate height L 2 is set to 50 mm ~ 400 mm, more preferably set to 50 mm ~ 200 mm or less in order to sufficiently increase arising The vibration frequency causes the vibration to decay in a short time.
如圖2以及圖3所示，於石定盤3之上表面設置包含X平台9及Y平台12之X-Y平台13，上述X平台9配置成利用驅動軸8而可沿著於X方向上延伸設置之軌道7移動，上述Y平台12配置成於上述X平台9上利用驅動軸11而可沿著於平面上與X方向正交之Y方向上延伸設置之軌道10移動。於Y平台12上經由圍繞縱軸旋轉之旋轉機構14而設置有工作台15，工作台15上載置應加工之脆性材料基板W。As shown in FIG. 2 and FIG. 3, an XY stage 13 including an X platform 9 and a Y platform 12 is disposed on the upper surface of the stone plate 3, and the X platform 9 is configured to extend along the X direction by using the drive shaft 8. The set rail 7 is moved, and the Y stage 12 is disposed so as to be movable on the X platform 9 by the drive shaft 11 so as to be movable along the rail 10 extending in the Y direction orthogonal to the X direction on the plane. A table 15 is provided on the Y stage 12 via a rotating mechanism 14 that rotates about a longitudinal axis, and the table 15 is placed with a brittle material substrate W to be processed.
在被支持於上部橫框1c之上部支持板20上，如上述般安裝雷射光源16及雷射光照射部17。雖省略圖示，但雷射光源16中包含雷射振盪源、用以將來自雷射振盪源之雷射導引至雷射光照射部17之反射鏡及聚光透鏡等光學系統元件。又，於上部支持板20上亦具備用以檢測對照射雷射光之點並修正偏差之光學系統觀察部(攝像機)。進而，當藉由進行雷射照射之加熱及加熱後之冷卻而進行利用熱應力之劃線加工時，亦於上部支持板20上安裝冷媒噴射機構。The laser light source 16 and the laser light irradiation portion 17 are mounted as described above on the upper support plate 20 supported by the upper horizontal frame 1c. Although not shown in the drawings, the laser light source 16 includes a laser oscillation source, and an optical system element such as a mirror for guiding the laser from the laser oscillation source to the laser beam irradiation unit 17 and a collecting lens. Further, the upper support plate 20 is also provided with an optical system observation portion (camera) for detecting a point at which the laser light is irradiated and correcting the deviation. Further, when the scribing by thermal stress is performed by heating by laser irradiation and cooling after heating, a refrigerant injection mechanism is also attached to the upper support plate 20.
其次，說明本發明之劃線加工之動作。於對脆性材料基板W加工劃線溝槽之情形時，藉由搬送機器人(未圖示)等將脆性材料基板W載置於工作台15上，將雷射光自雷射光照射部17照射至脆性材料基板W上，並且藉由X-Y平台13使工作台15朝向X方向以及Y方向移動，而對脆性材料基板W加工X方向以及Y方向上之劃線溝槽。Next, the operation of the scribing process of the present invention will be described. When the scribe groove is processed on the brittle material substrate W, the brittle material substrate W is placed on the table 15 by a transfer robot (not shown) or the like, and the laser light is irradiated from the laser light irradiation unit 17 to the brittleness. On the material substrate W, the table 15 is moved in the X direction and the Y direction by the XY stage 13, and the scribe groove in the X direction and the Y direction is processed on the brittle material substrate W.
上述構成中，於由框架1(柱框1a、下部橫框1b、上部橫框1c)包圍之內部空間內，在接近於裝置之設置面R之底部支持板2上配置石定盤3，因此由X-Y平台13進行之工作台15之移動所產生之振動頻率會向高頻率頻移相當於將自設置面R到石定盤3之高度L2 縮短之量。其結果，即便產生因X-Y平台13之運動所引起之振動，亦可於短時間內衰減，即使在使工作台15反覆運動之情形時，移動方向改變時所產生之振動亦會迅速衰減而不會累積，從而可抑制振動。藉此，能夠高精度地進行劃線溝槽之加工，並且亦可實現X-Y平台13之高速運轉，從而提高裝置性能。In the above configuration, in the internal space surrounded by the frame 1 (the column frame 1a, the lower horizontal frame 1b, and the upper horizontal frame 1c), the stone fixing plate 3 is placed on the bottom support plate 2 close to the installation surface R of the apparatus. The frequency of the vibration generated by the movement of the table 15 by the XY stage 13 shifts to a high frequency equivalent to the amount of the height L 2 from the set surface R to the stone plate 3 is shortened. As a result, even if vibration due to the movement of the XY stage 13 occurs, it can be attenuated in a short time, and even when the table 15 is repeatedly moved, the vibration generated when the moving direction is changed is rapidly attenuated without It accumulates, which suppresses vibration. Thereby, the processing of the scribe groove can be performed with high precision, and the high speed operation of the XY stage 13 can also be realized, thereby improving the performance of the device.
再者，由於不使石定盤3與框架1直接接觸，並且以石定盤3之一側面經由安裝片4及螺栓5而固定於底部支持板2、石定盤3之相反側之側緣部於藉由按壓片6從上表面按壓之狀態下可滑動之方式將石定盤3保持於底部支持板2，因此當金屬製之底部支持板2以及保持該底部支持板2之框架1因周圍溫度之變化而產生熱膨脹時，底部支持板2不受石定盤3約束而可自由膨脹，框架1整體不受石定盤3影響而均勻地膨脹，從而可抑制框架1之一部分撓曲而產生變 形。藉此，藉由框架1抑制組裝於上部之雷射光源16、光學系統觀察器以及雷射光照射部17之移位，而可加工高精度之劃線溝槽。Furthermore, since the stone fixing plate 3 is not in direct contact with the frame 1, and one side of the stone fixing plate 3 is fixed to the side edges of the bottom support plate 2 and the opposite side of the stone fixing plate 3 via the mounting piece 4 and the bolt 5 The stone fixing plate 3 is held by the bottom support plate 2 in a state where the pressing piece 6 is slidably pressed from the upper surface, so that the metal bottom support plate 2 and the frame 1 holding the bottom support plate 2 are When the thermal expansion occurs due to a change in the ambient temperature, the bottom support plate 2 is freely expanded without being restrained by the stone fixing plate 3, and the frame 1 is uniformly expanded without being affected by the stone fixing plate 3, thereby suppressing the deflection of a part of the frame 1. Produce change shape. Thereby, the frame 1 can suppress the displacement of the laser light source 16 assembled to the upper portion, the optical system viewer, and the laser beam irradiation portion 17, and the high-precision scribe groove can be processed.
本發明中，底部支持板2不受石定盤3約束而可自由熱膨脹之安裝方法並不限定於上述實施例。例如，雖省略圖示，但亦可於石定盤3中形成如在與連結用螺栓之外周面之間留出膨脹間隙之大小之螺栓***孔，將螺栓從該螺栓***孔螺入石定盤3而將石定盤3與底板2連結。In the present invention, the mounting method in which the bottom support plate 2 is free from thermal expansion by the stone fixing plate 3 is not limited to the above embodiment. For example, although not shown in the drawings, a bolt insertion hole having a size of an expansion gap between the outer peripheral surface of the bolt for connection may be formed in the stone fixing plate 3, and the bolt may be screwed into the hole from the bolt insertion hole. The disk 3 is connected to the bottom plate 2 by the disk 3.
以上，說明了本發明之代表實施例，但本發明未必僅特定為上述實施例。例如，亦可去除實施例中所表示之框架底面之腳輪19及調節器18而將框架1直接設置於設置面R上。The representative embodiments of the present invention have been described above, but the present invention is not necessarily limited to the above embodiments. For example, the caster 19 and the adjuster 18 on the bottom surface of the frame shown in the embodiment may be removed to directly place the frame 1 on the installation surface R.
而且，移動平台亦可為僅在一個方向上移動之X平台，以代替X-Y平台。Moreover, the mobile platform can also be an X platform that moves in only one direction instead of the X-Y platform.
而且，在實施例中，於柱框1a之最上部設置了上部橫框1c，但若於由上部支持板20支持之雷射光照射部17之下端與工作台15之間有足夠之間隔，則亦可於柱框1a之最上部稍微向下之位置上將上部橫框1c水平連結，並在其上支持上部支持板20。此外，本發明中，於達成其目的並且不脫離所申請之範圍內可進行適當修正、變更。Further, in the embodiment, the upper horizontal frame 1c is provided at the uppermost portion of the column frame 1a, but if there is a sufficient space between the lower end of the laser light irradiation portion 17 supported by the upper support plate 20 and the table 15, The upper horizontal frame 1c may be horizontally joined at a position slightly downward from the uppermost portion of the column frame 1a, and the upper support plate 20 may be supported thereon. In addition, the present invention can be appropriately modified or changed without departing from the scope of the application.
本發明可應用於用以在玻璃基板、半導體基板、藍寶石基板等脆性材料基板中形成劃線溝槽之雷射劃線裝置。The present invention is applicable to a laser scribing apparatus for forming scribe grooves in a brittle material substrate such as a glass substrate, a semiconductor substrate, or a sapphire substrate.
1‧‧‧框架1‧‧‧Frame
1a‧‧‧柱框1a‧‧‧ column frame
1b‧‧‧下部橫框1b‧‧‧lower horizontal frame
1c‧‧‧上部橫框1c‧‧‧ upper horizontal frame
1d‧‧‧中部橫框1d‧‧‧Central frame
1e‧‧‧下部橫截橫框1e‧‧‧lower transverse frame
2‧‧‧底部支持板2‧‧‧Bottom support board
3‧‧‧石定盤3‧‧‧ stone plate
4‧‧‧安裝片4‧‧‧Installation
5‧‧‧螺栓5‧‧‧ bolt
6‧‧‧按壓片6‧‧‧Pressing tablets
7‧‧‧軌道7‧‧‧ Track
8‧‧‧驅動軸8‧‧‧Drive shaft
9‧‧‧X平台9‧‧‧X platform
10‧‧‧軌道10‧‧‧ Track
11‧‧‧驅動軸11‧‧‧Drive shaft
12‧‧‧Y平台12‧‧‧Y platform
13‧‧‧X-Y平台(移動平台)13‧‧‧X-Y platform (mobile platform)
14‧‧‧旋轉機構14‧‧‧Rotating mechanism
15‧‧‧工作台15‧‧‧Workbench
16‧‧‧雷射光源16‧‧‧Laser light source
17‧‧‧雷射光照射部17‧‧‧Laser Light Irradiation Department
18‧‧‧調節器18‧‧‧Regulator
19‧‧‧腳輪19‧‧‧ casters
20‧‧‧上部支持板20‧‧‧ upper support board
21‧‧‧開口部21‧‧‧ openings
31‧‧‧下部框架31‧‧‧ Lower frame
32‧‧‧連結部32‧‧‧Connecting Department
33‧‧‧石定盤33‧‧‧ stone plate
34‧‧‧上部框架34‧‧‧ upper frame
35‧‧‧軌道35‧‧‧ Track
36‧‧‧X平台36‧‧‧X platform
37‧‧‧軌道37‧‧‧ Track
38‧‧‧Y平台38‧‧‧Y platform
39‧‧‧X-Y平台39‧‧‧X-Y platform
40‧‧‧旋轉機構40‧‧‧Rotating mechanism
41‧‧‧工作台41‧‧‧Workbench
42‧‧‧雷射光源42‧‧‧Laser light source
43‧‧‧雷射光照射部43‧‧‧Laser Light Irradiation Department
L1 ‧‧‧間隔L 1 ‧‧‧ interval
L2 ‧‧‧石定盤載置高度L 2 ‧‧‧stone mounting height
R‧‧‧設置面R‧‧‧Setting surface
W‧‧‧脆性材料基板W‧‧‧Battery material substrate
圖1係表示本發明之劃線裝置之框架部分之立體圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a frame portion of a scribing apparatus of the present invention.
圖2係本發明之劃線裝置之局部剖面前視圖。Figure 2 is a partial cross-sectional front elevational view of the scribing device of the present invention.
圖3係表示上述劃線裝置之X-Y平台部分之概略俯視圖。Fig. 3 is a schematic plan view showing an X-Y platform portion of the scribing device.
圖4係先前之劃線裝置之前視圖。Figure 4 is a front view of a prior scribing device.
1‧‧‧框架1‧‧‧Frame
1a‧‧‧柱框1a‧‧‧ column frame
1b‧‧‧下部橫框1b‧‧‧lower horizontal frame
1c‧‧‧上部橫框1c‧‧‧ upper horizontal frame
1d‧‧‧中部橫框1d‧‧‧Central frame
1e‧‧‧下部橫截橫框1e‧‧‧lower transverse frame
2‧‧‧底部支持板2‧‧‧Bottom support board
3‧‧‧石定盤3‧‧‧ stone plate
4‧‧‧安裝片4‧‧‧Installation
5‧‧‧螺栓5‧‧‧ bolt
6‧‧‧按壓片6‧‧‧Pressing tablets
7‧‧‧軌道7‧‧‧ Track
8‧‧‧驅動軸8‧‧‧Drive shaft
9‧‧‧X平台9‧‧‧X platform
10‧‧‧軌道10‧‧‧ Track
11‧‧‧驅動軸11‧‧‧Drive shaft
12‧‧‧Y平台12‧‧‧Y platform
13‧‧‧X-Y平台(移動平台)13‧‧‧X-Y platform (mobile platform)
14‧‧‧旋轉機構14‧‧‧Rotating mechanism
15‧‧‧工作台15‧‧‧Workbench
16‧‧‧雷射光源16‧‧‧Laser light source
17‧‧‧雷射光照射部17‧‧‧Laser Light Irradiation Department
18‧‧‧調節器18‧‧‧Regulator
19‧‧‧腳輪19‧‧‧ casters
20‧‧‧上部支持板20‧‧‧ upper support board
L2 ‧‧‧石定盤載置高度L 2 ‧‧‧stone mounting height
R‧‧‧設置面R‧‧‧Setting surface
W‧‧‧脆性材料基板W‧‧‧Battery material substrate
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011158883A JP5271393B2 (en) | 2011-07-20 | 2011-07-20 | Laser scribing equipment |
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| TW201304896A TW201304896A (en) | 2013-02-01 |
| TWI474888B true TWI474888B (en) | 2015-03-01 |
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| TW101113523A TWI474888B (en) | 2011-07-20 | 2012-04-16 | Lightning scribing device |
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| KR (1) | KR101350012B1 (en) |
| CN (1) | CN102886830B (en) |
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| CN108463928B (en) * | 2016-01-30 | 2020-07-14 | 伊雷克托科学工业股份有限公司 | System isolation and optical compartment sealing |
| CN107478168B (en) * | 2017-07-17 | 2019-06-21 | 浙江大学 | The stamping end socket plastic deformation system for measuring quantity of austenitic stainless steel and method |
| CN108176930A (en) * | 2018-03-02 | 2018-06-19 | 沈阳飞机工业（集团）有限公司 | A kind of laser marking machine operation console |
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| TW200950913A (en) * | 2008-04-14 | 2009-12-16 | Mitsuboshi Diamond Ind Co Ltd | Method for processing fragile material substrate |
| JP2009291815A (en) * | 2008-06-05 | 2009-12-17 | Kyushu Mitoyo Kk | Laser beam machining apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5271393B2 (en) | 2013-08-21 |
| TW201304896A (en) | 2013-02-01 |
| JP2013022611A (en) | 2013-02-04 |
| CN102886830B (en) | 2015-04-01 |
| CN102886830A (en) | 2013-01-23 |
| KR20130011911A (en) | 2013-01-30 |
| KR101350012B1 (en) | 2014-01-14 |
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