JP2006329895A - Substrate measuring apparatus - Google Patents

Substrate measuring apparatus Download PDF

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Publication number
JP2006329895A
JP2006329895A JP2005156507A JP2005156507A JP2006329895A JP 2006329895 A JP2006329895 A JP 2006329895A JP 2005156507 A JP2005156507 A JP 2005156507A JP 2005156507 A JP2005156507 A JP 2005156507A JP 2006329895 A JP2006329895 A JP 2006329895A
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Prior art keywords
substrate
stage
base
disposed
measuring apparatus
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Abandoned
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JP2005156507A
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Japanese (ja)
Inventor
Hiroshi Yamashita
浩 山下
Noriyoshi Yamashita
典良 山下
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Dainippon Screen Manufacturing Co Ltd
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Dainippon Screen Manufacturing Co Ltd
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Priority to JP2005156507A priority Critical patent/JP2006329895A/en
Priority to TW095112661A priority patent/TWI285728B/en
Priority to CNB2006100772445A priority patent/CN100535590C/en
Priority to KR1020060039305A priority patent/KR100730450B1/en
Publication of JP2006329895A publication Critical patent/JP2006329895A/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate measuring apparatus capable of accurately measuring a substrate even when the substrate is enlarged. <P>SOLUTION: A length measuring machine comprises a base section 10, a stage section 14 to be supported by the base section 10 without receiving stress from the base section 10 in a state in which the surface tilts by a micro angle with respect to the vertical direction, a guide roller 42 and lifting roller 43 for supporting the lower end of the substrate 100 to be measured, a pedestal 15 laterally movable along the surface of the stage section 14 by being guided by guide rails 45 disposed in upper part and lower part of the stage section, and a photographing section 18 vertically movable along the pedestal 15 by being guided by a guide rail 53 disposed in the pedestal 15. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、プリント基板を作成するためのマスク基板や液晶表示パネル用のガラス基板等の基板を測定する基板測定装置に関する。   The present invention relates to a substrate measuring apparatus for measuring a substrate such as a mask substrate for producing a printed circuit board or a glass substrate for a liquid crystal display panel.

このような基板測定装置の一種として、基板表面における２点間の距離を測定するための測長機が使用されている（特許文献１参照）。このような測長機においては基板を載置したステージの表面に沿って、Ｘ、Ｙ方向に移動可能な撮像部を設け、この撮像部により基板表面における２点を撮像するときの撮像部の移動量により、この２点間の距離を測定する構成が採用されている。   As one type of such a substrate measuring apparatus, a length measuring machine for measuring the distance between two points on the substrate surface is used (see Patent Document 1). In such a length measuring machine, an imaging unit that can move in the X and Y directions is provided along the surface of the stage on which the substrate is placed, and the imaging unit is configured to capture two points on the substrate surface by the imaging unit. A configuration is adopted in which the distance between the two points is measured according to the amount of movement.

ところで、近年の基板の大型化に伴い、上述した測長機においては、ステージ上に載置された基板がステージとともに撓み、正確な測長作業が行えないという問題が生じる。また、このような基板を利用して作成されたプリント基板やガラス基板は、通常は鉛直方向を向いた状態で使用されることから、基板を水平方向に載置した場合と鉛直方向を向けた場合とでは、基板に対する歪みの生じ方が異なることになる。   By the way, with the recent increase in the size of the substrate, the above-described length measuring machine has a problem that the substrate placed on the stage bends together with the stage, and accurate length measurement work cannot be performed. Also, since printed boards and glass boards created using such boards are usually used in a state of facing the vertical direction, the case where the board is placed in the horizontal direction and the vertical direction are directed. Depending on the case, the distortion of the substrate is different.

一方、特許文献２には、液晶表示装置を垂直方向を向けた状態で検査する検査装置が開示されている。
特開２００５−３０８７９号公報 特開２００４−２９４２７１号公報 On the other hand, Patent Document 2 discloses an inspection device that inspects a liquid crystal display device in a state in which the liquid crystal display device is oriented in the vertical direction.
JP 2005-30879 A JP 2004-294271 A

特許文献２に記載された検査装置においては、液晶表示装置を支持するテーブルと撮像手段とが別々に配置されている。このような検査装置においては、液晶表示装置（基板）が比較的小型の場合には問題は生じないが、液晶表示装置が大サイズ化した場合には液晶表示装置やテーブルに歪みが生じ、撮像手段の相対位置を調整しなければならないという問題がある。特に、基板を載置したステージの表面に沿ってＸ、Ｙ方向に移動可能な撮像部を有する基板測定装置においては、テーブルの歪みと撮像部の位置との関係を考慮する必要がある。   In the inspection apparatus described in Patent Document 2, a table that supports a liquid crystal display device and an imaging unit are separately arranged. In such an inspection apparatus, there is no problem when the liquid crystal display device (substrate) is relatively small, but when the liquid crystal display device is increased in size, the liquid crystal display device and the table are distorted, and imaging is performed. There is a problem that the relative position of the means must be adjusted. In particular, in a substrate measuring apparatus having an imaging unit that can move in the X and Y directions along the surface of the stage on which the substrate is placed, it is necessary to consider the relationship between the distortion of the table and the position of the imaging unit.

この発明は上記課題を解決するためになされたものであり、基板が大型化した場合においても基板を正確に測定することができる基板測定装置を提供することを目的とする。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a substrate measuring apparatus that can accurately measure a substrate even when the substrate is enlarged.

請求項１に記載の発明は、基部と、前記基部から応力を受けることなく、その表面が鉛直方向に対して微小角度傾斜した状態で、前記基部に支持されるステージ部と、測定を行うべき基板の下端部を支持するための前記ステージ部の下方に配設された基板支持部材と、前記ステージ部の上部と下部とに設けられた案内部材に案内されることにより、前記ステージ部の表面に沿って左右方向に移動可能な架台と、前記架台に設けられた案内部材に案内されることにより、前記架台に沿って上下方向に移動可能な撮像部とを備えたことを特徴とする。   According to the first aspect of the present invention, measurement should be performed with the base portion, the stage portion supported by the base portion with the surface inclined at a slight angle with respect to the vertical direction without receiving stress from the base portion. The surface of the stage portion is guided by a substrate support member disposed below the stage portion for supporting the lower end portion of the substrate and guide members provided at the upper and lower portions of the stage portion. And an imaging unit that is movable in the vertical direction along the frame by being guided by a guide member provided on the frame.

請求項２に記載の発明は、請求項１に記載の発明において、前記ステージ部の表面をＸ、Ｙ方向とする３軸の座標系を設定したときに、前記基部は、前記基部に対して前記ステージ部のＸ、Ｙ、Ｚ方向の移動を規制した状態で前記ステージ部を支持する第１支持部と、前記基部に対して前記ステージ部のＹ、Ｚ方向の移動を規制した状態で前記ステージ部を支持する第２支持部と、前記基部に対して前記ステージ部のＺ方向の移動を規制した状態で前記ステージ部を支持する第３支持部とを備える。   According to a second aspect of the present invention, in the first aspect of the invention, when a three-axis coordinate system in which the surface of the stage portion is set in the X and Y directions is set, the base portion is relative to the base portion. A first support portion that supports the stage portion in a state in which movement of the stage portion in the X, Y, and Z directions is restricted; and a state in which movement of the stage portion in the Y and Z directions is restricted with respect to the base portion. A second support unit that supports the stage unit; and a third support unit that supports the stage unit in a state where movement of the stage unit in the Z direction is restricted with respect to the base unit.

請求項３に記載の発明は、請求項１または請求項２に記載の発明において、前記ステージ部に配設され、前記架台の位置を測定するリニアスケールと、前記架台に配設され、前記撮像部の位置を測定するリニアスケールとを備える。   According to a third aspect of the present invention, in the first or second aspect of the present invention, a linear scale that is disposed on the stage unit and measures a position of the gantry, and is disposed on the gantry, the imaging And a linear scale for measuring the position of the part.

請求項１および請求項２に記載の発明によれば、応力を受けることなく支持されたステージ部に設けられた案内部材に架台が案内され、この架台に沿って撮像部が移動することから、基板が大型化した場合においても、基板を正確に測定することが可能となる。   According to the first and second aspects of the invention, the gantry is guided by the guide member provided on the stage portion supported without receiving stress, and the imaging unit moves along the gantry. Even when the substrate is enlarged, the substrate can be accurately measured.

請求項３に記載の発明によれば、撮像部の移動量を正確に測定することが可能となる。   According to the third aspect of the present invention, it is possible to accurately measure the movement amount of the imaging unit.

以下、この発明の実施の形態を図面に基づいて説明する。図１はこの発明に係る基板測定装置としての測長機の正面図であり、図２はその側面図、図３はその平面図である。なお、図３においては、第１支持部材１１およびステージ部１５の要部のみを示し、その他の部材を省略している。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a length measuring machine as a substrate measuring apparatus according to the present invention, FIG. 2 is a side view thereof, and FIG. 3 is a plan view thereof. In FIG. 3, only the main parts of the first support member 11 and the stage unit 15 are shown, and other members are omitted.

この測長機は、第１支持部材１１、第２支持部材１２およびベース部材１３よりなる基部１０と、この基部１０に支持されたステージ部１４と、ステージ部１４の表面に沿って左右方向に移動可能な架台１５と、互いに連結した撮像ユニット１６および移動部材１７からなり、架台１５に沿って上下方向に移動可能な撮像部１８とを備える。   The length measuring machine includes a base 10 composed of a first support member 11, a second support member 12 and a base member 13, a stage portion 14 supported by the base 10, and a horizontal direction along the surface of the stage portion 14. The movable base 15 includes an imaging unit 16 and a moving member 17 connected to each other, and an imaging unit 18 that is movable in the vertical direction along the base 15.

なお、この明細書においては、図１乃至図３に示すように、ステージ部１４の表面をＸ、Ｙ方向とする３軸の座標系を設定し、ステージ部１４の表面に沿う左右方向をＸ方向、ステージ部１４の表面に沿う上下方向をＹ方向、ステージ部１４の表面に垂直な方向をＺ方向とする。そして、この明細書では、必要に応じ、Ｘ方向を左右方向、また、Ｙ方向を上下方向とも呼称する。   In this specification, as shown in FIGS. 1 to 3, a three-axis coordinate system is set in which the surface of the stage unit 14 is in the X and Y directions, and the horizontal direction along the surface of the stage unit 14 is X. The vertical direction along the surface of the stage portion 14 is defined as the Y direction, and the direction perpendicular to the surface of the stage portion 14 is defined as the Z direction. In this specification, the X direction is also referred to as the left-right direction and the Y direction is also referred to as the up-down direction as necessary.

上記基部１０は、基部１０に対してステージ部１４のＸ、Ｙ、Ｚ方向の移動を規制した状態でステージ部１４を支持する第１支持部９１と、基部１０に対してステージ部１４のＹ、Ｚ方向の移動を規制した状態でステージ部１４を支持する第２支持部９２と、基部１０に対してステージ部１４のＺ方向の移動を規制した状態でステージ部１４を支持する第３支持部９３とを備える。ステージ部１４は、基部１０により、その表面が鉛直方向に対して微小角度傾斜した状態で支持される。   The base portion 10 includes a first support portion 91 that supports the stage portion 14 in a state where movement of the stage portion 14 in the X, Y, and Z directions is restricted with respect to the base portion 10, and , A second support portion 92 that supports the stage portion 14 in a state where movement in the Z direction is restricted, and a third support that supports the stage portion 14 in a state where movement in the Z direction of the stage portion 14 is restricted relative to the base portion 10. Part 93. The stage portion 14 is supported by the base portion 10 in a state where the surface thereof is inclined by a minute angle with respect to the vertical direction.

図４は、第１支持部９１、第２支持部９２および第３支持部９３を示す説明図である。   FIG. 4 is an explanatory diagram showing the first support portion 91, the second support portion 92, and the third support portion 93.

図１および図４（ａ）を参照して、基部１０における第２支持部材１２の右側上部には当接金具２１が配設されている。この当接金具２１には、その断面がＶ字状となる円錐状の凹部２４が形成されている。また、ステージ部１４の右側下部には、当接金具２２が配設されている。この当接金具２２にも、その断面がＶ字状となる円錐状の凹部２５が形成されている。そして、これらの凹部２４、２５の間には、鋼球２３が配設されている。このため、自重により基部１０上に載置されたステージ部１４は、この支持部９１により、基部１０に対してステージ部１４のＸ、Ｙ、Ｚ方向の移動を規制した状態で支持されることになる。   With reference to FIG. 1 and FIG. 4A, a contact fitting 21 is disposed on the right upper portion of the second support member 12 in the base portion 10. The contact fitting 21 is formed with a conical recess 24 having a V-shaped cross section. A contact fitting 22 is disposed at the lower right side of the stage portion 14. The contact fitting 22 is also formed with a conical recess 25 having a V-shaped cross section. And between these recessed parts 24 and 25, the steel ball 23 is arrange | positioned. For this reason, the stage unit 14 placed on the base 10 by its own weight is supported by the support unit 91 in a state in which the movement of the stage unit 14 in the X, Y, and Z directions is restricted with respect to the base 10. become.

図１および図４（ｂ）を参照して、基部１０における第２支持部材１２の左側上部には当接金具２６が配設されている。この当接金具２６には、その断面がＶ字状となる円錐状の凹部２９が形成されている。また、ステージ部１４の左側下部には、当接金具２７が配設されている。この当接金具２７には、その断面が略コの字状となる略半円柱状の凹部３１が形成されている。そして、これらの凹部２９、３１の間には、鋼球２８が配設されている。このため、自重により基部１０上に載置されたステージ部１４は、この支持部９２により、基部１０に対してステージ部１４のＸ方向には移動可能であるが、Ｙ、Ｚ方向の移動を規制した状態で支持されることになる。   With reference to FIG. 1 and FIG. 4 (b), a contact fitting 26 is disposed on the upper left side of the second support member 12 in the base 10. The contact fitting 26 is formed with a conical recess 29 having a V-shaped cross section. A contact fitting 27 is disposed on the lower left side of the stage portion 14. The contact fitting 27 is formed with a substantially semi-cylindrical recess 31 having a substantially U-shaped cross section. A steel ball 28 is disposed between the recesses 29 and 31. For this reason, the stage unit 14 placed on the base 10 by its own weight can move in the X direction of the stage unit 14 with respect to the base 10 by the support unit 92, but it can move in the Y and Z directions. It will be supported in a regulated state.

図２、図３および図４（ｃ）を参照して、基部１０における第１支持部材１１の中央上部には当接金具３２が配設されている。この当接金具３２におけるステージ部１４側の表面は、平坦面となっている。また、ステージ部１４の裏面側中央上部には、その断面がＶ字状となる円錐状の凹部３４が形成されている。そして、当接金具３２の平坦面と凹部３４の間には、鋼球３３が配設されている。このため、自重により第１支持部材１１側にもたれかけたステージ部１４は、この支持部９３により、基部１０に対してステージ部１４のＸ、Ｙ方向には移動可能であるが、Ｚ方向の移動を規制した状態で支持されることになる。   With reference to FIGS. 2, 3, and 4 (c), a contact fitting 32 is disposed at the center upper portion of the first support member 11 in the base 10. The surface on the stage portion 14 side of the contact fitting 32 is a flat surface. Further, a conical recess 34 having a V-shaped cross section is formed at the upper center of the back surface side of the stage portion 14. A steel ball 33 is disposed between the flat surface of the contact fitting 32 and the recess 34. Therefore, the stage portion 14 leaning against the first support member 11 side by its own weight can move in the X and Y directions of the stage portion 14 with respect to the base portion 10 by the support portion 93, but in the Z direction. It will be supported in a state where movement is restricted.

なお、図３に示すように、ステージ部１４の上部には、何らかの理由でステージ部１４が手前側に倒れることを防止するための転倒防止ボルト４７が配設されている。また、同様にステージ部１４が第１支持部９１および第２支持部９２から外れないように落下防止ボルト（図示しない）も配設されている。   As shown in FIG. 3, a fall prevention bolt 47 for preventing the stage unit 14 from falling to the near side for some reason is disposed on the upper part of the stage unit 14. Similarly, a fall prevention bolt (not shown) is also provided so that the stage portion 14 does not come off from the first support portion 91 and the second support portion 92.

このような構成を有する第１支持部９１、第２支持部９２および第３支持部９３によりステージ部１４が支持されることにより、ステージ部１４は、基部１０から応力を受けることなく、その表面が鉛直方向に対して微小角度傾斜した状態で基部１０に支持される。ここで、「基部から応力を受けることなく」とは、上述したような構成により、例えば温度変化による伸縮率の相違などにより、基部１０またはステージ部１４に歪みを生じた場合であっても、ステージ部１４が基部１０から歪みに基づく応力を受けないことをいう。   By supporting the stage portion 14 by the first support portion 91, the second support portion 92, and the third support portion 93 having such a configuration, the stage portion 14 has its surface without receiving stress from the base portion 10. Is supported by the base 10 in a state inclined at a minute angle with respect to the vertical direction. Here, “without receiving stress from the base” means that even when the base 10 or the stage portion 14 is distorted due to, for example, a difference in expansion / contraction rate due to a temperature change due to the above-described configuration, It means that the stage part 14 does not receive stress based on distortion from the base part 10.

再度、図１乃至図３を参照して、ステージ部１４の表面には、基板１００の裏面と当接して基板１００を案内する７個のガイドローラ４１と、基板１００の下端部と当接して基板１００を案内する多数のガイドローラ４２とが配設されている。   Referring again to FIGS. 1 to 3, the front surface of the stage unit 14 is in contact with the back surface of the substrate 100 and seven guide rollers 41 that guide the substrate 100, and the lower end portion of the substrate 100. A large number of guide rollers 42 for guiding the substrate 100 are provided.

図５は、基板１００とガイドローラ４１、４２との関係を示す説明図である。   FIG. 5 is an explanatory diagram showing the relationship between the substrate 100 and the guide rollers 41 and 42.

ガイドローラ４１は、その外周面がステージ部１４の表面から一部だけ突出する位置に配置されている。また、ガイドローラ４２は、基板１００の下端部を支持可能な位置に配設されている。ガイドローラ４２には、基板１００の下端部を確実に支持するための凹部４４が形成されている。これらのガイドローラ４１は、図示しない駆動手段により図５において実線で示す基板１００の案内位置と、図５において仮想線で示す退避位置との間を移動可能となっている。
、再度、図１を参照して、ステージ部１４の表面には、基板１００の下端部と当接して基板１００を昇降する４個の昇降ローラ４３が配設されている。この昇降ローラ４３は、その上端がガイドローラ４２の上端より下方に配置される待機位置と、その上端がガイドローラ４２の上端より上方に配置される支持位置との間を昇降する構成となっている。また、ステージ部１４の表面には、図示しない多数の吸着孔が形成されている。 The guide roller 41 is disposed at a position where the outer peripheral surface thereof partially protrudes from the surface of the stage portion 14. The guide roller 42 is disposed at a position where the lower end portion of the substrate 100 can be supported. The guide roller 42 is formed with a recess 44 for reliably supporting the lower end of the substrate 100. These guide rollers 41 can be moved between a guide position of the substrate 100 indicated by a solid line in FIG. 5 and a retracted position indicated by a virtual line in FIG.
Referring again to FIG. 1, on the surface of the stage unit 14, four elevating rollers 43 that raise and lower the substrate 100 in contact with the lower end portion of the substrate 100 are disposed. The elevating roller 43 is configured to move up and down between a standby position where the upper end is disposed below the upper end of the guide roller 42 and a support position where the upper end is disposed above the upper end of the guide roller 42. Yes. A number of suction holes (not shown) are formed on the surface of the stage unit 14.

ステージ部１４に基板１００を載置する場合には、昇降ローラ４３を待機位置に配置した状態で、ガイドローラ４１、４２を図５において実線で示す基板１００の案内位置に配置して、基板１００をこれらのガイドローラ４１、４２により案内する。次に、昇降ローラ４３を支持位置まで上昇させる。これにより、ガイドローラ４２により支持されていた基板１００は、昇降ローラ４３により支持されることになる。この状態において、ガイドローラ４１を図５において仮想線で示す基板１００の案内位置に配置するとともに、ステージ部１４の表面に形成された吸着孔より吸気を行う。これにより、基板１００は、その下端部を昇降ローラ４３に支持された状態で、ステージ部１４に吸着保持される。   When the substrate 100 is placed on the stage unit 14, the guide rollers 41 and 42 are disposed at the guide position of the substrate 100 indicated by the solid line in FIG. Is guided by these guide rollers 41 and 42. Next, the elevating roller 43 is raised to the support position. As a result, the substrate 100 supported by the guide roller 42 is supported by the elevating roller 43. In this state, the guide roller 41 is disposed at the guide position of the substrate 100 indicated by the phantom line in FIG. 5 and air is sucked from the suction holes formed on the surface of the stage portion 14. As a result, the substrate 100 is sucked and held on the stage portion 14 with the lower end portion supported by the elevating roller 43.

上記ガイドローラ４２および昇降ローラ４３は、基板１００の下端部を支持するための、本願発明における基板支持部材を構成する。   The guide roller 42 and the lifting roller 43 constitute a substrate support member in the present invention for supporting the lower end portion of the substrate 100.

ステージ部１４の表面には、Ｘ方向に延びる一対のガイドレール４５が配設されている。架台１５は、このガイドレール４５に案内されてＸ方向に往復移動可能となっている。また、ステージ部１４の表面には、一対のガイドレール４５と平行に、一対のリニアスケール４６が配設されている。架台１５のＸ方向の位置は、一対のリニアスケール４６により測定される。なお、リニアスケール４６を一対配設しているのは、架台１５のヨーイングを補正するためである。   A pair of guide rails 45 extending in the X direction are disposed on the surface of the stage unit 14. The gantry 15 is guided by the guide rail 45 and can reciprocate in the X direction. A pair of linear scales 46 is disposed on the surface of the stage unit 14 in parallel with the pair of guide rails 45. The position of the gantry 15 in the X direction is measured by a pair of linear scales 46. The pair of linear scales 46 is provided to correct yawing of the gantry 15.

図１および図２に示すように、ステージ部１４の上下両端部には、リニアモータの固定子５１が配設されている。また、図２に示すように、架台１５の裏面には、一対の可動子５２が配設されている。架台１５は、これらの固定子５１および可動子５２からなるリニアモータの駆動を受け、Ｘ方向に往復移動する構成となっている。   As shown in FIGS. 1 and 2, linear motor stators 51 are disposed at both upper and lower ends of the stage portion 14. As shown in FIG. 2, a pair of movers 52 are disposed on the back surface of the gantry 15. The gantry 15 is configured to reciprocate in the X direction under the driving of a linear motor including the stator 51 and the movable element 52.

図１に示すように、架台１５の表面には、Ｙ方向に延びる一対のガイドレール５３が配設されている。撮像部１８における移動部材１７は、撮像ユニット１６とともに、このガイドレール５３に案内されてＹ方向に往復移動可能となっている。また、架台１５には、一対のガイドレール５３と平行に、図示を省略したリニアスケールが配設されている。撮像部１８のＹ方向の位置は、このリニアスケールにより測定される。   As shown in FIG. 1, a pair of guide rails 53 extending in the Y direction are disposed on the surface of the gantry 15. The moving member 17 in the image capturing unit 18 is guided by the guide rail 53 together with the image capturing unit 16 and can reciprocate in the Y direction. The gantry 15 is provided with a linear scale (not shown) in parallel with the pair of guide rails 53. The position of the imaging unit 18 in the Y direction is measured by this linear scale.

架台１５の表面には、リニアモータの固定子５４が配設されている。また、撮像部１８における移動部材１７の裏面には、可動子が配設されている。撮像部１８は、これらの固定子５４および可動子からなるリニアモータの駆動を受け、Ｙ方向に往復移動する構成となっている。   A linear motor stator 54 is disposed on the surface of the gantry 15. A mover is disposed on the back surface of the moving member 17 in the imaging unit 18. The imaging unit 18 is configured to reciprocate in the Y direction under the drive of a linear motor including the stator 54 and the mover.

図６は、撮像ユニット１６の概要図である。   FIG. 6 is a schematic diagram of the imaging unit 16.

この撮像ユニット１６は、同軸落射照明により照射した基板１００の画像を、高倍率用のＣＣＤカメラ６１または低倍率用のＣＣＤカメラ６２により撮影する構成となっている。   The imaging unit 16 is configured to take an image of the substrate 100 irradiated by coaxial epi-illumination with a CCD camera 61 for high magnification or a CCD camera 62 for low magnification.

すなわち、光源６３から出射された光は、一対のレンズ６４を通過し、ハーフミラー６５で反射された後、対物レンズ６６を介してステージ部１４の表面に吸着保持された基板１００に照射される。そして、基板１００の表面で反射した光は、対物レンズ６６およびハーフミラー６５を通過した後、ミラー６７で反射され、ハーフミラー６８に入射する。ハーフミラー６８に入射した光のうちの半分は、ハーフミラー６８を通過し、拡大光学系６９を通過した後、ＣＣＤカメラ６１に入射する。一方、ハーフミラー６８に入射した光のうちの残り半分は、ハーフミラー６８で反射され、ミラー７１でさらに反射された後、ＣＣＤカメラ６２に入射する。   That is, the light emitted from the light source 63 passes through the pair of lenses 64, is reflected by the half mirror 65, and then is irradiated onto the substrate 100 held by suction on the surface of the stage unit 14 via the objective lens 66. . The light reflected by the surface of the substrate 100 passes through the objective lens 66 and the half mirror 65, is reflected by the mirror 67, and enters the half mirror 68. Half of the light incident on the half mirror 68 passes through the half mirror 68, passes through the magnifying optical system 69, and then enters the CCD camera 61. On the other hand, the remaining half of the light incident on the half mirror 68 is reflected by the half mirror 68, further reflected by the mirror 71, and then incident on the CCD camera 62.

以上のような構成を有する測長機により、基板１００におけるパターンの測長を行う場合においては、基板１００をステージ部１４に吸着保持させた状態で、撮像ユニット１６により基板１００上の２点を撮影する。そして、撮像部１８のＸ方向の移動量をリニアスケール４６により、また、撮像部１８のＹ方向の移動量を架台１５に設けたリニアスケールにより測定することで、２点間の距離を演算する。   When measuring the pattern on the substrate 100 with the length measuring machine having the above-described configuration, the imaging unit 16 holds two points on the substrate 100 while the substrate 100 is held by suction on the stage unit 14. Take a picture. Then, the distance between the two points is calculated by measuring the amount of movement of the imaging unit 18 in the X direction with the linear scale 46 and the amount of movement of the imaging unit 18 in the Y direction with the linear scale provided on the gantry 15. .

このとき、ステージ部１４は、基部１０から応力を受けることなく、その表面が鉛直方向に対して微小角度傾斜した状態で基部１０に支持されており、架台１５が応力を受けないステージ部１４により左右方向に案内され、さらに、撮像部１６か架台１５上を上下方向に移動することから、基板１００が大型化した場合においても、装置のフットスペースを小さくしながら、基板１００の測定を正確に実行することが可能となる。   At this time, the stage part 14 is supported by the base part 10 in a state in which the surface thereof is inclined at a slight angle with respect to the vertical direction without receiving stress from the base part 10, and the stage 15 is not subjected to stress by the stage part 14. Since it is guided in the left-right direction and further moves in the vertical direction on the imaging unit 16 or the gantry 15, even when the substrate 100 is enlarged, the measurement of the substrate 100 can be performed accurately while reducing the foot space of the apparatus. It becomes possible to execute.

なお、上述した実施形態においては、基板１００を撮像ユニット１６の光源６３により照明して、基板１００の表面での反射光を撮像する構成を採用している。しかしながら、ステージ部１４を透過性の材料で構成し、あるいは、ステージ部１４の中央に開口部を形成することにより、基板１００を透過した光を撮像する構成を採用してもよい。   In the above-described embodiment, a configuration is adopted in which the substrate 100 is illuminated by the light source 63 of the imaging unit 16 and the reflected light on the surface of the substrate 100 is imaged. However, a configuration may be adopted in which the stage portion 14 is made of a transmissive material or an image of light transmitted through the substrate 100 is formed by forming an opening in the center of the stage portion 14.

さらに上述した実施形態においては、基板１００における２点間の距離等を測定する測長機にこの発明を適用しているが、基板の検査装置等の、その他の基板測定装置にこの発明を適用してもよい。   Further, in the above-described embodiment, the present invention is applied to a length measuring machine that measures the distance between two points on the substrate 100, but the present invention is applied to other substrate measuring devices such as a substrate inspection device. May be.

この発明に係る基板測定装置としての測長機の正面図である。It is a front view of a length measuring machine as a substrate measuring device concerning this invention. この発明に係る基板測定装置としての測長機の側面図である。It is a side view of a length measuring machine as a substrate measuring device according to the present invention. この発明に係る基板測定装置としての測長機の平面図である。It is a top view of the length measuring machine as a board | substrate measuring apparatus based on this invention. 第１支持部９１、第２支持部９２および第３支持部９３を示す説明図である。It is explanatory drawing which shows the 1st support part 91, the 2nd support part 92, and the 3rd support part 93. FIG. 基板１００とガイドローラ４１、４２との関係を示す説明図である。It is explanatory drawing which shows the relationship between the board | substrate 100 and the guide rollers 41 and 42. FIG. 撮像ユニット１６の概要図である。2 is a schematic diagram of an imaging unit 16.

符号の説明Explanation of symbols

１０ 基部
１１ 第１支持部材
１２ 第２支持部材
１３ ベース部材
１４ ステージ部
１５ 架台
１６ 撮像ユニット
１７ 移動部材
１８ 撮像部
２１ 当接金具
２２ 当接金具
２３ 鋼球
２４ 凹部
２５ 凹部
２６ 当接金具
２７ 当接金具
２８ 鋼球
２９ 凹部
３１ 凹部
３２ 当接金具
３３ 鋼球
３４ 凹部
４１ ガイドローラ
４２ ガイドローラ
４３ 昇降ローラ
４５ ガイドレール
４６ リニアスケール
４７ 転倒防止ベルト
５１ 固定子
５２ 可動子
５３ ガイドレール
５４ 可動子
６１ ＣＣＤカメラ
６２ ＣＣＤカメラ
６６ 対物レンズ
９１ 第１支持部
９２ 第２支持部
９３ 第３支持部
１００ 基板
DESCRIPTION OF SYMBOLS 10 Base part 11 1st support member 12 2nd support member 13 Base member 14 Stage part 15 Stand 16 Imaging unit 17 Moving member 18 Imaging part 21 Contact metal fitting 22 Contact metal fitting 23 Steel ball 24 Recess 25 Recess 26 Contact metal fitting 27 Metal fitting 28 Steel ball 29 Concave part 31 Concave part 32 Contact metal part 33 Steel ball 34 Concave part 41 Guide roller 42 Guide roller 43 Lifting roller 45 Guide rail 46 Linear scale 47 Fall prevention belt 51 Stator 52 Movable element 53 Guide rail 54 Movable element 61 CCD camera 62 CCD camera 66 Objective lens 91 First support part 92 Second support part 93 Third support part 100 Substrate

Claims (3)

基部と、
前記基部から応力を受けることなく、その表面が鉛直方向に対して微小角度傾斜した状態で、前記基部に支持されるステージ部と、
測定を行うべき基板の下端部を支持するための前記ステージ部の下方に配設された基板支持部材と、
前記ステージ部の上部と下部とに設けられた案内部材に案内されることにより、前記ステージ部の表面に沿って左右方向に移動可能な架台と、
前記架台に設けられた案内部材に案内されることにより、前記架台に沿って上下方向に移動可能な撮像部と、
を備えたことを特徴とする基板測定装置。 The base,
Without receiving stress from the base, in a state where the surface is inclined by a small angle with respect to the vertical direction, a stage portion supported by the base,
A substrate support member disposed below the stage portion for supporting the lower end of the substrate to be measured;
A platform that is movable in the left-right direction along the surface of the stage part by being guided by guide members provided on the upper part and the lower part of the stage part,
By being guided by a guide member provided on the gantry, an imaging unit capable of moving in the vertical direction along the gantry,
A substrate measuring apparatus comprising: 請求項１に記載の基板測定装置において、
前記ステージ部の表面をＸ、Ｙ方向とする３軸の座標系を設定したときに、
前記基部は、
前記基部に対して前記ステージ部のＸ、Ｙ、Ｚ方向の移動を規制した状態で前記ステージ部を支持する第１支持部と、
前記基部に対して前記ステージ部のＹ、Ｚ方向の移動を規制した状態で前記ステージ部を支持する第２支持部と、
前記基部に対して前記ステージ部のＺ方向の移動を規制した状態で前記ステージ部を支持する第３支持部と、
を備える基板測定装置。 In the board | substrate measuring apparatus of Claim 1,
When setting a three-axis coordinate system in which the surface of the stage portion is in the X and Y directions,
The base is
A first support part that supports the stage part in a state in which movement of the stage part in the X, Y, and Z directions is restricted with respect to the base part;
A second support part for supporting the stage part in a state where movement of the stage part in the Y and Z directions is restricted with respect to the base part;
A third support part for supporting the stage part in a state where movement of the stage part in the Z direction is restricted with respect to the base part;
A substrate measuring apparatus comprising: 請求項１または請求項２に記載の基板測定装置において、
前記ステージ部に配設され、前記架台の位置を測定するリニアスケールと、
前記架台に配設され、前記撮像部の位置を測定するリニアスケールと、
を備える基板測定装置。
In the board | substrate measuring apparatus of Claim 1 or Claim 2,
A linear scale disposed on the stage unit for measuring the position of the gantry;
A linear scale that is disposed on the mount and measures the position of the imaging unit;
A substrate measuring apparatus comprising:
JP2005156507A 2005-05-30 2005-05-30 Substrate measuring apparatus Abandoned JP2006329895A (en)

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CNB2006100772445A CN100535590C (en) 2005-05-30 2006-04-28 Basal lamina determination device
KR1020060039305A KR100730450B1 (en) 2005-05-30 2006-05-01 Substrate measuring apparatus

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CN1873373A (en) 2006-12-06
CN100535590C (en) 2009-09-02

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