TWI470712B - Probe device - Google Patents

Probe device Download PDF

Info

Publication number
TWI470712B
TWI470712B TW99100131A TW99100131A TWI470712B TW I470712 B TWI470712 B TW I470712B TW 99100131 A TW99100131 A TW 99100131A TW 99100131 A TW99100131 A TW 99100131A TW I470712 B TWI470712 B TW I470712B
Authority
TW
Taiwan
Prior art keywords
camera
unit
wafer
probe
moving
Prior art date
Application number
TW99100131A
Other languages
English (en)
Chinese (zh)
Other versions
TW201027651A (en
Inventor
Hiroshi Yamada
Kazuya Yano
Tomoya Endo
Kazumi Yamagata
Satoshi Nakaya
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201027651A publication Critical patent/TW201027651A/zh
Application granted granted Critical
Publication of TWI470712B publication Critical patent/TWI470712B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tests Of Electronic Circuits (AREA)
TW99100131A 2009-01-07 2010-01-06 Probe device TWI470712B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009001917A JP4725650B2 (ja) 2009-01-07 2009-01-07 プローブ装置

Publications (2)

Publication Number Publication Date
TW201027651A TW201027651A (en) 2010-07-16
TWI470712B true TWI470712B (zh) 2015-01-21

Family

ID=42502971

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99100131A TWI470712B (zh) 2009-01-07 2010-01-06 Probe device

Country Status (4)

Country Link
JP (1) JP4725650B2 (ja)
KR (1) KR101563013B1 (ja)
CN (1) CN101769987B (ja)
TW (1) TWI470712B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012204695A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd プローブカード検出装置、ウエハの位置合わせ装置及びウエハの位置合わせ方法
JP2013024829A (ja) * 2011-07-26 2013-02-04 Seiko Epson Corp 電子部品搬送装置及び電子部品搬送方法
CN103808987B (zh) * 2014-02-28 2016-08-17 浙江联宜电机股份有限公司 电机测试升降工作台
KR101904573B1 (ko) * 2014-06-10 2018-10-04 세메스 주식회사 디스플레이 셀들의 검사 장치
JP6630535B2 (ja) * 2015-10-22 2020-01-15 株式会社ミツトヨ 形状測定装置の制御方法
KR20180088030A (ko) * 2017-01-26 2018-08-03 주식회사 탑 엔지니어링 프로브 장치
KR101917161B1 (ko) * 2017-03-20 2019-01-25 양윤재 평판 디스플레이용 전기적 특성 시험 장치의 헤드부 프로브 카드 회전 및 이송 장치
CN109243995A (zh) * 2018-09-20 2019-01-18 深圳市矽电半导体设备有限公司 图像定位模组的安装驱动结构及全自动探针台
US11307246B2 (en) 2019-09-24 2022-04-19 Star Technologies, Inc. Probing apparatus and method of operating the same
JP7382888B2 (ja) * 2020-04-06 2023-11-17 東京エレクトロン株式会社 検査装置、及び、検査装置の制御方法
CN113640637A (zh) * 2020-04-27 2021-11-12 中国科学院大连化学物理研究所 一种辅助测量薄膜以及柔脆热电材料性能的夹具及其应用
CN113866601B (zh) * 2021-09-24 2024-06-21 深圳市华腾半导体设备有限公司 用于芯片的点测设备、点测***及其点测方法
JP2023097019A (ja) * 2021-12-27 2023-07-07 東京エレクトロン株式会社 検査装置及び検査方法
CN117554788B (zh) * 2024-01-11 2024-04-16 凯瑞电子(诸城)有限公司 一种芯片封装测试设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039752A (ja) * 2002-07-01 2004-02-05 Tokyo Seimitsu Co Ltd プローブ装置
TW200537103A (en) * 2004-03-16 2005-11-16 Tokyo Electron Ltd Vacuum probe apparatus and vacuum probing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3016961B2 (ja) * 1992-05-29 2000-03-06 東京エレクトロン株式会社 プローブ装置
JP4799880B2 (ja) * 2005-02-23 2011-10-26 オー・エイチ・ティー株式会社 検査装置及び検査方法並びに位置決め方法
JP5120017B2 (ja) * 2007-05-15 2013-01-16 東京エレクトロン株式会社 プローブ装置
JP4539685B2 (ja) * 2007-06-22 2010-09-08 セイコーエプソン株式会社 部品搬送装置及びｉｃハンドラ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039752A (ja) * 2002-07-01 2004-02-05 Tokyo Seimitsu Co Ltd プローブ装置
TW200537103A (en) * 2004-03-16 2005-11-16 Tokyo Electron Ltd Vacuum probe apparatus and vacuum probing method

Also Published As

Publication number Publication date
KR20100081935A (ko) 2010-07-15
CN101769987A (zh) 2010-07-07
TW201027651A (en) 2010-07-16
CN101769987B (zh) 2012-09-05
JP2010161171A (ja) 2010-07-22
KR101563013B1 (ko) 2015-10-23
JP4725650B2 (ja) 2011-07-13

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