TWI464865B - 固態攝像裝置之製造方法 - Google Patents
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Description
本發明係關於固態攝像裝置及其製造方法,尤其是關於兼用濾色片及透鏡構件之固態攝像裝置及其製造方法。
近年來,使用CCD(電荷耦合型元件)或CMOS(互補性金氧半導體元件)等之固態攝像元件的數位相機或攝像機,雖已得到普及,但使用CSP(Chip Size Package;晶片尺寸封裝)方式而將此固態攝像元件作成更為小型之技術,正在開發之中。此種之小型固態攝像元件,最適合內建於行動電話等之期盼小型、輕量、薄型化的電子機器中。
固態攝像元件之每一畫素的受光面係為凹凸狀,所以,通常形成透明之平坦化層以求表面之平坦化。即如第1圖所示,在以二維方式配置有複數個CCD等之光電轉換元件12的固態攝像元件11上形成第1平坦化層13,並於其之上形成含有複數顏色之著色層的濾色片14,再於其之上形成第2平坦化層15,並於其之上形成聚光用之凸透鏡16(例如,參照日本特開2006-41467號公報)。
在此種構造之固態攝像裝置之製造中,需要依序形成第1平坦化層13、濾色片14、第2平坦化層15及凸透鏡16,而有步驟數多,且製造良率差,製造成本高的問題。
另外,在受光面與凸透鏡16之間,有第1平坦化層13、濾色片14及第2平坦化層15之多介質,而使得兩者被分開,所以聚光效率差,而有迄至光線到達光電轉換元件12為止容易引起光線衰減的問題。
本發明之目的在於,提供一種高感光度、且具有良好之色特性的固態攝像裝置。
本發明之另一目的在於,提供一種可削減步驟數,提高良率以及達成成本之削減的固態攝像裝置之製造方法。
根據本發明之第1態樣,提供一種固態攝像裝置,係具備:基板,二維地配置有複數個光電轉換元件,且表面具有對應於複數個光電轉換元件之矩形受光面;平坦化層,係設於此基板上,且具有形成於與該受光面對應之位置的大致矩形之複數個凹曲面;及濾色片,係含有被埋入此平坦化層之該凹曲面內,並具有比該平坦化層還大的折射率之複數顏色之著色層,該著色層係具有凸透鏡之功能。
根據本發明之第2態樣,提供-、種固態攝像裝置之製造方法,係具備以下之步驟:在二維地配置有複數個光電轉換元件、且表面具有對應於複數個光電轉換元件之矩形受光面的基板上形成透明膜之步驟;於該透明膜上,形成在對應於該受光面之位置具有線軸狀或其變形形狀之開口的光阻圖案之步驟;以該光阻圖案作為遮罩而蝕刻該透明膜,形成具有大致矩形之複數個凹曲面的平坦化層,其形成於與該受光面對應之位置之步驟;及在該大致矩形之凹曲面形成包含有比該平坦化層還大的折射率之複數顏色之著色層且具凸透鏡之功能的濾色片之步驟。
以下,說明本發明之實施形態。
第2圖為顯示本發明之一實施形態的固態攝像裝置的剖視圖。在第2圖中,在半導體基板1之表面附近,以二維方式配置有CCD或CMOS感測器等之複數個光電轉換元件2。半導體基板1之對應於光電轉換元件2的面,係為矩形凹部狀之受光面,並形成有覆被此等之受光面的平坦化層3。平坦化層3係由透明材料所構成,例如,由二氧化矽或丙烯酸系樹脂所構成。
在平坦化層3之表面,且在對應於受光面的位置上形成有平面形狀大致矩形之複數個凹曲面。具有此種大致矩形之凹曲面的平坦化層3,係形成如下。
首先,在半導體基板1之表面形成由透明材料所構成之膜。在二氧化矽之情況,可藉由CVD或蒸鍍形成,而在丙烯酸系樹脂之情況可藉由塗佈法形成。接著,在此透明膜上形成光阻圖案。光阻圖案係具有線軸狀或其變形形狀之開口部。第3A~3D圖顯示此種開口部10之形狀。又,包圍開口部10之矩形係表示受光面。第3A圖顯示線軸狀之開口部10,第3B~3D圖顯示具有其變形形狀之開口部10。即,第3B圖所示之開口10,係設有從圓形之開口中央部朝四方呈銳角突出之部分者,第3C圖所示之開口10,係在第3B圖所示之開口中,設有朝上下左右呈鈍角突出之部分者,第3D圖所示之開口10,係在第3C圖所示之開口中,設有朝上下左右各呈鈍角後退之部分者。
其次,使用此種之光阻圖案作為遮罩,對形成於半導體基板1之表面的透明膜進行乾式蝕刻。又,在蝕刻由二氧化矽所構成之透明膜的情況,例如,光阻係可使用正型酚醛樹脂光阻,而蝕刻氣體係可使用CF4
或C2
F6
。另外,在蝕刻由丙烯系樹脂所構成之透明膜的情況,光阻同樣可使用正型酚醛樹脂光阻,而蝕刻氣體例如係可使用O2
+Ar。
乾式蝕刻係可使用例如ECR、平行平板磁控管、DRM、ICP或2頻類型之RIE等。
第4圖顯示此種乾式蝕刻之行進曲線。從第4圖可知,當初雖根據遮罩之開口部形狀進行蝕刻,但蝕刻不限於縱向,亦可於橫向行進。藉此,蝕刻亦行進至藉由透明膜之光阻圖案所覆被的部分而使凹部擴大,其結果形成有如第5圖所示之大致矩形的複數個凹曲面直接相鄰之平坦化層3。
其後,將顏料被分散之樹脂塗佈於平坦化層3上,藉由光微影技術進行圖案處理,依每一顏色反複地進行此等之步驟,以埋設平坦化層3表面之凹曲面的方式,形成例如含有紅(R)、綠(G)、藍(B)之3色的著色層之濾色片4。
在此情況時,各著色層之表面,係以其等之間不介入平坦化層3而直接相鄰接之情形,光的利用效率高,故而較佳。另外,濾色片4之表面係以平坦為較佳。
作為獲得平坦之濾色片4表面用的方法,可列舉在藉由光微影技術形成各濾色片4之後,藉由微研磨法來研磨表面的方法。
構成濾色片4之著色層材料的折射率,係比構成平坦化層3之材料的折射率還高,例如,在構成平坦化層3之材料係丙烯酸系樹脂的情況,其折射率為1.5,相對於此,構成濾色片4之著色層材料的折射率,在顏料被分散之丙烯酸系樹脂的情況,係1.6~1.8。
如上述,根據本實施形態,藉由使用具有線軸狀或其變形形狀之開口的光阻圖案來乾式蝕刻透明膜,以形成具有大致矩形的複數個凹曲面直接相鄰之表面形狀的平坦化層3,並於此等之凹曲面內,以表面成為平坦之方式埋入由紅(R)、綠(G)、藍(B)之3色的顏料分散樹脂所構成之著色層,藉此,可獲得形成有亦一併具有透鏡功能之濾色片4的固態攝像元件。
在如上述方式獲得之固態攝像裝置中,不需要在濾色片與透鏡之間介入平坦化層而分別形成,因此可削減步驟數,可達成良率之提高及成本削減。
另外,藉由使凸透鏡(濾色片4)與受光面接近,可提高聚光性,獲得高感光度,因介入其之間的層數少,所以,入射光之衰減少,可獲得良好之色特性。
根據本發明之第1態樣,提供一種固態攝像裝置,係在平坦化層表面之大致矩形之凹曲面內埋入由具有凸透鏡功能之複數顏色的著色層所構成的濾色片,所以,凸透鏡(濾色片)與受光面接近,可提高聚光性,而具有高感光度,並因介入其之間的層數少,所以,可具有良好之色特性。
又,根據本發明之第2態樣,藉由使用具有線軸狀或其變形之開口形狀的光阻圖案來蝕刻透明膜,以形成具有大致矩形的複數個凹曲面直接相鄰之表面形狀的平坦化層,並於此等之凹曲面內埋入由顏料分散樹脂所構成之著色層,以形成亦一併具有透鏡功能之濾色片,藉此可削減步驟數,可達成良率之提高及成本削減。
1...半導體基板
2...光電轉換元件
3...平坦化層
4...濾色片
10...開口部
11...固態攝像元件
12...光電轉換元件
13...第1平坦化層
14...濾色片
15...第2平坦化層
16...凸透鏡
第1圖為顯示習知之固態攝像裝置的剖視圖。
第2圖為顯示本發明之一實施形態的固態攝像裝置的剖視圖。
第3A圖為使用於第2圖所示之固態攝像裝置之製造的光阻圖案之開口部形狀的示意圖。
第3B圖為使用於第2圖所示之固態攝像裝置之製造的光阻圖案之開口部形狀的示意圖。
第3C圖為使用於第2圖所示之固態攝像裝置之製造的光阻圖案之開口部形狀的示意圖。
第3D圖為使用於第2圖所示之固態攝像裝置之製造的光阻圖案之開口部形狀的示意圖。
第4圖為乾式蝕刻之行進曲線的示意圖。
第5圖為顯示由乾式蝕刻所獲得之平坦化層的表面形狀之剖視圖。
1...半導體基板
2...光電轉換元件
3...平坦化層
4...濾色片
Claims (4)
- 一種固態攝像裝置之製造方法,係具備以下之步驟:在二維地配置有複數個光電轉換元件、且表面具有對應於複數個光電轉換元件之矩形受光面的基板上,形成透明膜之步驟;於該透明膜上,形成在對應於該受光面之位置具有線軸狀或其變形形狀之開口的光阻圖案之步驟;以該光阻圖案作為遮罩而蝕刻該透明膜,形成具有大致矩形之複數個凹曲面,該凹曲面形成於與該受光面對應之位置之步驟;及在該大致矩形之凹曲面形成包含有比該透明膜還大的折射率之複數顏色之著色層且具凸透鏡之功能的濾色片之步驟,該光阻圖案的開口具有設置從開口中央部朝四方呈銳角突出之部分的形狀,該透明膜係按照該光阻圖案之開口的形狀進行乾式蝕刻,該蝕刻不只在縱向上進行,也在橫向上進行,亦進行至由光阻圖案所覆蓋的透明膜的部分而擴大,直接相鄰地形成大致矩形的複數個凹曲面。
- 如申請專利範圍第1項之固態攝像裝置之製造方法,其中該透明膜係由二氧化矽或丙烯酸系樹脂所構成。
- 如申請專利範圍第1項之固態攝像裝置之製造方法,其中該著色層係具有1.6~1.8之折射率。
- 如申請專利範圍第1項之固態攝像裝置之製造方法,其中該複數顏色之著色層係在複數個凹曲面的表面中直接相鄰地形成。
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JP2006320370A JP5098310B2 (ja) | 2006-11-28 | 2006-11-28 | 固体撮像装置の製造方法 |
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JP (1) | JP5098310B2 (zh) |
KR (1) | KR20090085635A (zh) |
CN (1) | CN101558495B (zh) |
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US9078953B2 (en) * | 2007-12-17 | 2015-07-14 | DePuy Synthes Products, Inc. | Crosslinked hydrogels |
JP2010239076A (ja) * | 2009-03-31 | 2010-10-21 | Sony Corp | 固体撮像装置とその製造方法、及び電子機器 |
JP2011124522A (ja) * | 2009-12-14 | 2011-06-23 | Canon Inc | 光電変換装置 |
JP5736253B2 (ja) * | 2011-06-30 | 2015-06-17 | セイコーインスツル株式会社 | 光センサ装置 |
JP6003316B2 (ja) * | 2012-07-12 | 2016-10-05 | ソニー株式会社 | 固体撮像装置、電子機器 |
JP2016149417A (ja) * | 2015-02-10 | 2016-08-18 | キヤノン株式会社 | 固体撮像装置、固体撮像装置の製造方法及び撮像システム |
TW201740141A (zh) * | 2016-05-13 | 2017-11-16 | 原相科技股份有限公司 | 彩色濾光陣列與應用其之影像感測裝置 |
CN108565274A (zh) * | 2018-05-07 | 2018-09-21 | 德淮半导体有限公司 | 图像传感器及其形成方法 |
CN109817653A (zh) * | 2019-02-14 | 2019-05-28 | 德淮半导体有限公司 | 图像传感器及其形成方法 |
CN111641762B (zh) * | 2020-05-28 | 2021-11-02 | 维沃移动通信有限公司 | 摄像模组及电子设备 |
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JPH0945885A (ja) * | 1995-07-26 | 1997-02-14 | Lg Semicon Co Ltd | Ccd固体撮像素子及びその製造方法 |
US6255640B1 (en) * | 1998-03-27 | 2001-07-03 | Sony Corporation | Solid-state image sensing device and method for manufacturing solid-state image sensing device |
CN1681131A (zh) * | 2004-04-08 | 2005-10-12 | 佳能株式会社 | 固体摄像元件及其设计支持方法及摄像装置 |
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JPH0442966A (ja) * | 1990-06-06 | 1992-02-13 | Mitsubishi Electric Corp | カラー固体撮像素子 |
JPH0555536A (ja) * | 1991-08-29 | 1993-03-05 | Fuji Xerox Co Ltd | イメージセンサ |
JPH0927608A (ja) * | 1995-05-11 | 1997-01-28 | Sony Corp | 固体撮像装置とその製造方法 |
JP2000066016A (ja) * | 1998-08-19 | 2000-03-03 | Sony Corp | 固体撮像素子用カラーフィルタの製造方法及びカラー固体撮像素子の製造方法 |
JP2002110953A (ja) * | 2000-10-04 | 2002-04-12 | Toshiba Corp | 固体撮像装置 |
JP4830306B2 (ja) | 2004-06-23 | 2011-12-07 | 凸版印刷株式会社 | 固体撮像素子の製造方法 |
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JP2007109801A (ja) * | 2005-10-12 | 2007-04-26 | Sumitomo Electric Ind Ltd | 固体撮像装置とその製造方法 |
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- 2007-11-22 KR KR1020097010833A patent/KR20090085635A/ko not_active Application Discontinuation
- 2007-11-26 TW TW096144682A patent/TWI464865B/zh not_active IP Right Cessation
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JPH0945885A (ja) * | 1995-07-26 | 1997-02-14 | Lg Semicon Co Ltd | Ccd固体撮像素子及びその製造方法 |
US6255640B1 (en) * | 1998-03-27 | 2001-07-03 | Sony Corporation | Solid-state image sensing device and method for manufacturing solid-state image sensing device |
CN1681131A (zh) * | 2004-04-08 | 2005-10-12 | 佳能株式会社 | 固体摄像元件及其设计支持方法及摄像装置 |
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US8030115B2 (en) | 2011-10-04 |
CN101558495A (zh) | 2009-10-14 |
WO2008065963A1 (fr) | 2008-06-05 |
CN101558495B (zh) | 2012-05-23 |
US20090230492A1 (en) | 2009-09-17 |
JP2008135551A (ja) | 2008-06-12 |
JP5098310B2 (ja) | 2012-12-12 |
TW200834905A (en) | 2008-08-16 |
KR20090085635A (ko) | 2009-08-07 |
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