TWI458406B - Method and apparatus for manufacturing flexible substrate - Google Patents
Method and apparatus for manufacturing flexible substrate Download PDFInfo
- Publication number
- TWI458406B TWI458406B TW102110343A TW102110343A TWI458406B TW I458406 B TWI458406 B TW I458406B TW 102110343 A TW102110343 A TW 102110343A TW 102110343 A TW102110343 A TW 102110343A TW I458406 B TWI458406 B TW I458406B
- Authority
- TW
- Taiwan
- Prior art keywords
- bottom plate
- polymer layer
- cover
- flexible substrate
- hole
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Electroluminescent Light Sources (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本案係關於一種製作基板的方法及其裝置，特別是一種製作可撓式基板的方法及其裝置。The present invention relates to a method and apparatus for fabricating a substrate, and more particularly to a method and apparatus for fabricating a flexible substrate.
可撓式基板可撓曲的特性，使得顯示器不再侷限於平面的設計，而可具有多元化的外型設計。而可撓式基板重量輕、厚度薄、不易破碎以及耐衝擊的特性，則適用於行動電話、個人數位助理(Personal Digital Assistant，PDA)或筆記型電腦等可攜式產品中。除此之外，使用可撓式基板製造軟性顯示器還具有製造成本的優勢。因此以可撓性基板取代玻璃基板已成為目前平面顯示器技術發展的新趨勢。The flexible nature of the flexible substrate makes the display no longer limited to a flat design, but can have a variety of exterior designs. The flexible substrate is lightweight, thin, non-breakable and impact resistant, and is suitable for use in portable products such as mobile phones, personal digital assistants (PDAs) or notebook computers. In addition, the use of a flexible substrate to manufacture a flexible display also has the advantage of manufacturing cost. Therefore, replacing the glass substrate with a flexible substrate has become a new trend in the development of flat panel display technology.
在製作可撓式基板的過程當中，通常需要將可撓式基板配置於一硬質之底板上，再對可撓式基板進行各類製程。例如，在可撓式基板上進行成膜製程，或者是在可撓式基板上製造薄膜電晶體。一般而言，這通常需要使用一暫時性的黏著劑，將可撓式基板黏合於硬質之底板上以進行加工，再藉由物理方法或化學方法將可撓式基板自底板剝離。In the process of fabricating a flexible substrate, it is usually required to arrange the flexible substrate on a rigid substrate, and then perform various processes on the flexible substrate. For example, a film forming process is performed on a flexible substrate, or a thin film transistor is fabricated on a flexible substrate. In general, this typically requires the use of a temporary adhesive to bond the flexible substrate to a rigid substrate for processing, and physically or chemically strip the flexible substrate from the substrate.
對於使用物理方法將可撓式基板自底板剝離之方式而言，若是直接將可撓式基板自底板剝離，則容易因為剝離的角度過大而導致基板上線路的斷裂。若是將滾軸穿過可撓式基板及底板之間，藉由滾軸在可撓式基板與底板之間滾動之方式將可撓式基板自底板剝離，則可能將可撓式 基板的表面刮傷。In the method of physically peeling the flexible substrate from the substrate, if the flexible substrate is directly peeled off from the substrate, it is easy to cause breakage of the wiring on the substrate because the angle of peeling is too large. If the roller is passed between the flexible substrate and the bottom plate, and the flexible substrate is peeled off from the bottom plate by rolling the roller between the flexible substrate and the bottom plate, the flexible type may be The surface of the substrate is scratched.
另一方面，還有一種藉由高溫雷射或者照光將可撓式基板自底板剝離的方法。這是將可撓式基板藉由一黏著層貼附於底板上，在完成後續加工之後，藉由高溫雷射或者照光去除黏著層與底板之間的鍵結(debonding)之方式去除黏著層的黏性，藉以將製作完成的可撓式基板自底板脫離。此種方法需要使用昂貴的雷射或照光去鍵結設備，並且耗時長而效果有限。若是黏著層的黏性太強，在將可撓式基板自底板取下的過程中，也可能會損害可撓式基板上的精密元件。On the other hand, there is a method of peeling a flexible substrate from a substrate by high-temperature laser or illumination. This is to attach the flexible substrate to the bottom plate by an adhesive layer, and after removing the adhesive layer, the adhesive layer is removed by high temperature laser or illumination to remove the bond between the adhesive layer and the bottom plate. Viscosity, whereby the finished flexible substrate is detached from the bottom plate. This method requires expensive laser or illumination to bond the device, and it takes a long time and has limited effect. If the adhesive layer is too viscous, the precision components on the flexible substrate may be damaged during the removal of the flexible substrate from the substrate.
對於使用化學方法將可撓式基板自底板剝離之方式而言，則需要考慮基材的耐蝕性，這又會增加可撓性基板設計上的複雜度，並且進一步增加了可撓性基板的生產成本。另一方面，所使用的化學藥劑又可能對環境造成污染。For the method of chemically peeling the flexible substrate from the substrate, it is necessary to consider the corrosion resistance of the substrate, which in turn increases the complexity of the design of the flexible substrate and further increases the production of the flexible substrate. cost. On the other hand, the chemicals used may in turn pollute the environment.
因此，如何設計一種製作可撓式基板的方法及其裝置，以解決先前技術中，可撓式基板不易自底板剝離之問題，就成為設計人員需要解決的問題。Therefore, how to design a method for manufacturing a flexible substrate and a device thereof to solve the problem that the flexible substrate is not easily peeled off from the bottom plate in the prior art has become a problem that the designer needs to solve.
鑒於以上的問題，本發明是關於一種製作可撓式基板的方法及其裝置，藉以解決先前技術中可撓式基板不易自底板剝離之問題。In view of the above problems, the present invention relates to a method of fabricating a flexible substrate and an apparatus thereof for solving the problem that the flexible substrate is not easily peeled off from the substrate in the prior art.
根據上述本發明一實施例所揭露的製作可撓式基板的方法，包括以下步驟。提供具有一聚合物層之一底板，其中底板具有一貫穿孔，聚合物層位於底板上並覆蓋貫穿孔。提供一第一罩體覆蓋於聚合物層上。提供一氣體，氣體自貫穿孔流入於聚合物層與底板之間，進而使聚合 物層與底板分離。The method for fabricating a flexible substrate according to an embodiment of the invention described above includes the following steps. A bottom plate having a polymer layer is provided, wherein the bottom plate has a consistent perforation and the polymer layer is on the bottom plate and covers the through holes. A first cover is provided overlying the polymer layer. Providing a gas that flows from the through hole between the polymer layer and the bottom plate to further polymerize The layer is separated from the bottom plate.
根據上述本發明一實施例所揭露的製作可撓式基板的裝置，包括底板、吹氣裝置以及第一罩體。底板具有一貫穿孔，貫穿孔具有兩相對之第一端口以及第二端口。底板具有一貼合區。第二端口位於貼合區內。吹氣裝置具有一噴氣口。噴氣口與第一端口連接。第一罩體配置於貼合區上，並且第一罩體圍繞第二端口。An apparatus for manufacturing a flexible substrate according to an embodiment of the invention includes a bottom plate, an air blowing device, and a first cover. The bottom plate has a consistent perforation, and the through hole has two opposite first ports and a second port. The bottom plate has a fitting area. The second port is located in the bonding area. The air blowing device has a jet port. The air vent is connected to the first port. The first cover is disposed on the bonding area, and the first cover surrounds the second port.
根據本發明實施例所提供之製作可撓式基板的方法及其裝置，由於是藉由通入氣體流經聚合物層與底板之間，以將聚合物層與底板分離。因此可避免聚合物層與底板分離時，聚合物層上線路的斷裂或者聚合物層表面損傷。並且，藉由調整底板貫穿孔的大小、數目、以及貫入氣體的壓力與流量，可以調控聚合物層與底板所需的分離時間。因此得以較簡單地將聚合物層自底板分離，而解決了先前技術中可撓式基板不易自底板剝離之問題。A method and apparatus for fabricating a flexible substrate according to an embodiment of the present invention, wherein the polymer layer is separated from the bottom plate by flowing a gas between the polymer layer and the bottom plate. Therefore, it is possible to avoid breakage of the wiring on the polymer layer or surface damage of the polymer layer when the polymer layer is separated from the substrate. Moreover, by adjusting the size and number of the through-holes of the bottom plate, and the pressure and flow rate of the penetration gas, the separation time required for the polymer layer and the bottom plate can be adjusted. Therefore, it is relatively simple to separate the polymer layer from the bottom plate, thereby solving the problem that the flexible substrate is not easily peeled off from the bottom plate in the prior art.
以上之關於本發明內容之說明及以下之實施方式之說明係用以示範與解釋本發明之原理，並且提供本發明之專利申請範圍更進一步之解釋。The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.
10、10a~10d‧‧‧製作可撓式基板的裝置10, 10a~10d‧‧‧ Devices for making flexible substrates
11‧‧‧底板11‧‧‧floor
111、111a‧‧‧貫穿孔111, 111a‧‧‧through holes
1111、1111a‧‧‧第一端口1111, 1111a‧‧‧ first port
1112、1112a‧‧‧第二端口1112, 1112a‧‧‧ second port
112‧‧‧貼合區112‧‧‧Fitting area
12‧‧‧吹氣裝置12‧‧‧Blowing device
121‧‧‧噴氣口121‧‧‧Air Jet
13‧‧‧第一罩體13‧‧‧First cover
131‧‧‧第一開孔131‧‧‧First opening
14‧‧‧抽氣裝置14‧‧‧Exhaust device
141‧‧‧抽氣口141‧‧‧Exhaust port
15‧‧‧第二罩體15‧‧‧Second cover
151‧‧‧第二開孔151‧‧‧Second opening
16‧‧‧可移動機構16‧‧‧Removable institutions
161‧‧‧夾具161‧‧‧ fixture
20‧‧‧聚合物層20‧‧‧ polymer layer
30‧‧‧線路層30‧‧‧Line layer
40‧‧‧貼合層40‧‧‧Fitting layer
50‧‧‧製作可撓式基板的裝置50‧‧‧Device for making flexible substrates
51‧‧‧底板51‧‧‧floor
511‧‧‧板體511‧‧‧ board
5111‧‧‧第一開口5111‧‧‧ first opening
512‧‧‧離型層512‧‧‧ release layer
5121‧‧‧第二開口5121‧‧‧ second opening
513‧‧‧貫穿孔513‧‧‧through holes
5131‧‧‧第一端口5131‧‧‧ first port
5132‧‧‧第二端口5132‧‧‧second port
514‧‧‧貼合區514‧‧‧ compliant area
52‧‧‧吹氣裝置52‧‧‧Blowing device
521‧‧‧噴氣口521‧‧ ‧Hay
53‧‧‧第一罩體53‧‧‧First cover
531‧‧‧第一開孔531‧‧‧First opening
54‧‧‧抽氣裝置54‧‧‧Exhaust device
541‧‧‧抽氣口541‧‧‧Exhaust port
55‧‧‧第二罩體55‧‧‧Second cover
551‧‧‧第二開孔551‧‧‧Second opening
56‧‧‧載台56‧‧‧stage
561、561’‧‧‧第一頂針561, 561'‧‧‧ first thimble
562、562’‧‧‧第二頂針562, 562' ‧ ‧ second thimble
60‧‧‧聚合物層60‧‧‧ polymer layer
70‧‧‧線路層70‧‧‧Line layer
80‧‧‧貼合層80‧‧‧Fitting layer
「第1A圖」為根據本發明一實施例所揭露的製作可撓式基板的裝置之側視圖。FIG. 1A is a side view of an apparatus for fabricating a flexible substrate according to an embodiment of the invention.
「第1B圖」為根據本發明另一實施例所揭露的製作可撓式基板的裝置之側視圖。FIG. 1B is a side view of an apparatus for fabricating a flexible substrate according to another embodiment of the present invention.
「第1C圖」為根據本發明另一實施例所揭露的製作可撓式基板的裝置之側視圖。1C is a side view of an apparatus for making a flexible substrate according to another embodiment of the present invention.
「第1D圖」為根據本發明另一實施例所揭露的製作可撓式基板的裝置之側視圖。FIG. 1D is a side view of an apparatus for fabricating a flexible substrate according to another embodiment of the present invention.
「第1E圖」為根據本發明一實施例所揭露的製作可撓式基板的裝置之側視圖。FIG. 1E is a side view of an apparatus for fabricating a flexible substrate according to an embodiment of the invention.
「第2圖」為根據本發明一實施例所揭露的製作可撓式基板的方法之流程圖。FIG. 2 is a flow chart of a method of fabricating a flexible substrate according to an embodiment of the invention.
「第3A圖」至「第3F圖」為分別對應「第2圖」中步驟S101至S106之結構側視圖。"3A" to "3F" are side views corresponding to the steps S101 to S106 in "2nd drawing", respectively.
「第3G圖」為「第3F圖」之上視圖。"3G" is the top view of "3F".
「第3H圖」為對應「第2圖」中步驟S107之結構側視圖。The "3Hth diagram" is a side view of the structure corresponding to step S107 in "2nd figure".
「第3I圖」為根據「第2圖」之流程製作完成之可撓式基板及其底板之結構側視圖。"3I" is a side view showing the structure of the flexible substrate and its bottom plate which are completed according to the flow of "Fig. 2".
「第4圖」為根據本發明另一實施例所揭露的製作可撓式基板的方法之流程圖。FIG. 4 is a flow chart of a method of fabricating a flexible substrate according to another embodiment of the present invention.
「第5A圖」至「第5D圖」為分別對應「第4圖」中步驟S201至S204之結構側視圖。"5A" to "5D" are side views corresponding to the steps S201 to S204 in "4th drawing", respectively.
「第5E圖」為「第5D圖」之上視圖。"5E" is a top view of "5D".
「第5F圖」至「第5H圖」為分別對應「第4圖」中步驟S205至S207之結構側視圖。"5F to 5H" are side views corresponding to the steps S205 to S207 in "4th drawing", respectively.
「第5I圖」為根據「第4圖」之流程製作完成之可撓式基板及其底板之結 構側視圖。"Picture 5I" is the knot of the flexible substrate and its bottom plate which is completed according to the process of "Fig. 4" Side view.
「第6A圖」為根據本發明一實施例所揭露的製作可撓式基板的裝置之側視圖。FIG. 6A is a side view of an apparatus for fabricating a flexible substrate according to an embodiment of the invention.
「第6B圖」為根據本發明另一實施例所揭露的製作可撓式基板的裝置之側視圖。FIG. 6B is a side view of an apparatus for fabricating a flexible substrate according to another embodiment of the present invention.
「第7圖」為根據本發明另一實施例所揭露的製作可撓式基板的方法之流程圖。FIG. 7 is a flow chart of a method of fabricating a flexible substrate according to another embodiment of the present invention.
「第8A圖」至「第8K圖」為分別對應「第7圖」中步驟S301至S311之結構側視圖。"8A" to "8K" are side views corresponding to the steps S301 to S311 in "Fig. 7", respectively.
「第8L圖」為根據「第7圖」之流程製作完成之可撓式基板及其底板之結構側視圖。"8L" is a side view showing the structure of the flexible substrate and its bottom plate which are completed according to the flow of "Fig. 7".
「第9A圖」為根據本發明另一實施例所揭露的製作可撓式基板的方法之流程圖。FIG. 9A is a flow chart of a method of fabricating a flexible substrate according to another embodiment of the present invention.
「第9B圖」為對應「第9A圖」中步驟S402之結構側視圖。"9B" is a side view of the structure corresponding to step S402 in "FIG. 9A".
「第9C圖」為根據「第9A圖」之流程製作完成之可撓式基板及其底板之結構側視圖。"9C" is a side view showing the structure of the flexible substrate and its bottom plate which are completed according to the "Fig. 9A" process.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點，其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施，且根據本說明書所揭露之內容、申請專利範圍及圖式，任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點，但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.
在以下說明中，所使用之第一、第二、第三等字眼是用以區分圖式中之不同元件、組成、區域。這些字眼並非用以限制元件、組成、區域。也就是說，在不脫離本發明的精神和範圍內，所敘述之第一元件、第一組成、第一區域也可以是第二元件、第二組成、第二區域。In the following description, the first, second, third, etc. words used are used to distinguish different elements, components, and regions in the drawings. These words are not intended to limit elements, components, or regions. That is, the first element, the first component, and the first region described may also be the second component, the second component, and the second region, without departing from the spirit and scope of the invention.
首先，請參閱「第1A圖」，「第1A圖」為根據本發明一實施例所揭露的製作可撓式基板的裝置之側視圖。製作可撓式基板的裝置10，包括底板11、吹氣裝置12以及第一罩體13。First, please refer to "FIG. 1A", and FIG. 1A is a side view of an apparatus for manufacturing a flexible substrate according to an embodiment of the present invention. The apparatus 10 for manufacturing a flexible substrate includes a bottom plate 11, an air blowing device 12, and a first cover 13.
底板11具有貫穿底板11的一貫穿孔111。貫穿孔111具有相對之第一端口1111以及第二端口1112，分別位於貫穿孔111的相對兩側。底板11具有一貼合區112。第二端口1112係位於貼合區112內，而第一端口1111係位於底板11相反於貼合區112的一側。The bottom plate 11 has a consistent perforation 111 through the bottom plate 11. The through hole 111 has opposite first ports 1111 and second ports 1112 respectively on opposite sides of the through hole 111. The bottom plate 11 has a fitting area 112. The second port 1112 is located in the bonding area 112, and the first port 1111 is located on the side of the bottom plate 11 opposite to the bonding area 112.
吹氣裝置12具有一噴氣口121，對應於第一端口1111。詳細來說，吹氣裝置12可包含例如充有氣體之一鋼瓶的一供氣裝置。藉由將噴氣口121連接於第一端口1111，可使吹氣裝置12內的氣體依序通過噴氣口121、第一端口1111以及第二端口1112流入第一罩體13與底板11之間。The air blowing device 12 has a gas injection port 121 corresponding to the first port 1111. In detail, the air blowing device 12 may include a gas supply device such as one of the cylinders filled with gas. By connecting the air outlet 121 to the first port 1111, the gas in the air blowing device 12 can be sequentially flowed between the first cover 13 and the bottom plate 11 through the air outlet 121, the first port 1111, and the second port 1112.
第一罩體13以可分離的方式配置於底板11的貼合區112，並且第一罩體13圍繞第二端口1112。也就是說，第一罩體13正投影在底板11的區域涵蓋了貫穿孔111的第二端口1112。The first cover 13 is detachably disposed in the bonding area 112 of the bottom plate 11 , and the first cover 13 surrounds the second port 1112 . That is, the area in which the first cover 13 is projected in the bottom plate 11 covers the second port 1112 of the through hole 111.
接著請參閱「第1B圖」，「第1B圖」為根據本發明另一實施例所揭露的製作可撓式基板的裝置之側視圖。由於「第1B圖」之實施例與「第1A圖」的實施例相似，其中相同的標號代表著與「第1A圖」的實施例相同或類似的元件，因此只針對不同之處作說明。Next, please refer to "FIG. 1B", which is a side view of an apparatus for fabricating a flexible substrate according to another embodiment of the present invention. Since the embodiment of "Fig. 1B" is similar to the embodiment of Fig. 1A, the same reference numerals denote the same or similar elements as the embodiment of Fig. 1A, and therefore only the differences will be described.
在「第1B圖」之實施例中，製作可撓式基板的裝置10a還包含第一罩體13、抽氣裝置14、第二罩體15以及可移動機構16，第一罩體13具有第一開孔131，抽氣裝置14具有抽氣口141。詳細來說，抽氣裝置14例如可包含一抽氣幫浦，藉由將抽氣口141連接於第一罩體13的第一開孔131，可將第一罩體13與底板11之間的氣體經由第一開孔131而被抽出第一罩體13之外，使底板11具第二端口1112的一側產生負壓。In the embodiment of FIG. 1B, the apparatus 10a for manufacturing a flexible substrate further includes a first cover 13, an air extracting device 14, a second cover 15, and a movable mechanism 16, and the first cover 13 has a first An opening 131, the air extracting device 14 has a suction port 141. In detail, the air extracting device 14 can include, for example, an air pumping pump, and the first air hole 13 can be connected to the first opening 13 of the first cover body 13 to connect the first cover body 13 and the bottom plate 11. The gas is drawn out of the first cover 13 via the first opening 131, and a negative pressure is generated on the side of the bottom plate 11 having the second port 1112.
第二罩體15以可分離的方式配置於底板11相反於第一罩體13的一側，並且第二罩體15圍繞第一端口1111。也就是說，第二罩體15正投影在底板11的區域涵蓋了貫穿孔111的第一端口1111。其中，第二罩體15具有第二開孔151。連接吹氣裝置12的噴氣口121，可使吹氣裝置12內的氣體流入第二罩體15與底板11之間，使底板11具第一端口1111的一側產生正壓，進而使底板11的相對兩側產生壓力差。The second cover 15 is detachably disposed on a side of the bottom plate 11 opposite to the first cover 13 and the second cover 15 surrounds the first port 1111. That is, the area in which the second cover 15 is projected in the bottom plate 11 covers the first port 1111 of the through hole 111. The second cover 15 has a second opening 151. The gas injection port 121 of the air blowing device 12 is connected to allow the gas in the air blowing device 12 to flow between the second cover 15 and the bottom plate 11, so that the bottom plate 11 has a positive pressure on one side of the first port 1111, thereby causing the bottom plate 11 to be A pressure difference is generated on opposite sides.
可移動機構16設置於底板11的一側。詳細來說，可移動機構16係設置於底板11靠近第二端口1112的一側，並且可移動機構16具有一夾具161。可移動機構16可使夾具161朝底板11移動或者是使夾具161遠離底板11。其中，可移動機構16例如可包含一機械手臂。The movable mechanism 16 is disposed on one side of the bottom plate 11. In detail, the movable mechanism 16 is disposed on a side of the bottom plate 11 close to the second port 1112, and the movable mechanism 16 has a jig 161. The movable mechanism 16 can move the clamp 161 toward the bottom plate 11 or move the clamp 161 away from the bottom plate 11. The movable mechanism 16 can include, for example, a robotic arm.
須注意的是，抽氣裝置14、第二罩體15以及可移動機構16非用以限定本發明。請參閱「第1C圖」至「第1E圖」，「第1C圖」至「第1E圖」分別為根據本發明其他實施例所揭露的製作可撓式基板的裝置之側視圖。在「第1C圖」之實施例中，製作可撓式基板的裝置10b可以不包含抽氣裝置14，而只藉由吹氣裝置12使底板11的兩側產生壓力差(如「第1C圖」所示)。在「第1D圖」之實施例中，製作可撓式基板的裝置10c可 以不包含第二罩體15，而使吹氣裝置12的噴氣口121直接連接於第一端口1111(如「第1D圖」所示)。在「第1E圖」之實施例中，製作可撓式基板的裝置10d可以不包含可移動機構16(如「第1E圖」所示)。It should be noted that the air extracting device 14, the second cover 15, and the movable mechanism 16 are not intended to limit the present invention. Please refer to "1C" to "1E", and "1C" to "1E" are side views of an apparatus for manufacturing a flexible substrate according to another embodiment of the present invention. In the embodiment of "1C", the device 10b for fabricating the flexible substrate may not include the air extracting device 14, but only the air blowing device 12 may cause a pressure difference between the two sides of the bottom plate 11 (for example, "1C" Shown). In the embodiment of "1D", the device 10c for manufacturing a flexible substrate can be The air outlet 121 of the air blowing device 12 is directly connected to the first port 1111 (as shown in "FIG. 1D") without including the second cover 15. In the embodiment of "Embodiment 1E", the device 10d for manufacturing the flexible substrate may not include the movable mechanism 16 (as shown in "Fig. 1E").
接著將介紹如何使用「第1B圖」之製作可撓式基板的裝置10a來製作可撓式基板。請同時參閱「第1B圖」、「第2圖」以及「第3A圖」至「第3I圖」。「第2圖」為根據本發明一實施例所揭露的製作可撓式基板的方法之流程圖，「第3A圖」至「第3F圖」為分別對應「第2圖」中步驟S101至S106之結構側視圖，「第3G圖」為「第3F圖」之上視圖，「第3H圖」為對應「第2圖」中步驟S107之結構側視圖，「第3I圖」為根據「第2圖」之流程製作完成之可撓式基板及其底板之結構側視圖。Next, how to fabricate a flexible substrate using the apparatus 10a for manufacturing a flexible substrate in "Fig. 1B" will be described. Please also refer to "1B", "2" and "3A" to "3I". FIG. 2 is a flowchart of a method for fabricating a flexible substrate according to an embodiment of the present invention, and FIGS. 3A to 3F correspond to steps S101 to S106 in FIG. 2, respectively. In the side view of the structure, "3G" is the top view of "3F", "3H" is the side view corresponding to step S107 in "2nd picture", and "3I" is based on "2nd" A schematic side view of the structure of the flexible substrate and its bottom plate.
首先，提供一底板11，並且在底板11上形成一聚合物層20(S101)(如「第3A圖」所示)。底板11例如但不限於一玻璃基材，而聚合物層20係用以製成一可撓式基板。其中，聚合物層20的材質例如為聚碳酸酯(polycarbonate，PC)、聚醯亞胺(polyimide，PI)、聚醚碸(polyether sulfone，PES)、聚丙烯酸酯(poly acrylate，PAR)、聚萘二甲酸乙二酯(polyethylene naphthalate，PEN)、聚對苯二甲酸乙二醇酯(polyethylene terephthalate，PET)、非結晶型聚烯烴類(amorphous polyolefine，APO)、環烯烴共聚物(MetallocenebasedCyclicOlefinCopolymer，mCOC)、聚甲基丙烯酸甲酯(Polymethacrylate，PMMA)或有機無機複合材料。在本實施例中，底板11之厚度介於10~800微米(micrometer，μm)。在部分其他實施例中，底板11之厚度介於50~500微米。在部分其他實施例中，底板11之厚度介於100~250微米。其中，聚合物層20的撓性係大於底板11的撓性。First, a bottom plate 11 is provided, and a polymer layer 20 (S101) is formed on the bottom plate 11 (as shown in "Fig. 3A"). The bottom plate 11 is, for example but not limited to, a glass substrate, and the polymer layer 20 is used to form a flexible substrate. The material of the polymer layer 20 is, for example, polycarbonate (PC), polyimide (PI), polyether sulfone (PES), poly acrylate (PAR), poly Polyethylene naphthalate (PEN), polyethylene terephthalate (PET), amorphous polyolefin (APO), cyclic olefin copolymer (Metallocene based Cyclic Olefin Copolymer, mCOC) ), polymethacrylate (PMMA) or organic-inorganic composite. In this embodiment, the thickness of the bottom plate 11 is between 10 and 800 micrometers (μm). In some other embodiments, the thickness of the bottom plate 11 is between 50 and 500 microns. In some other embodiments, the thickness of the bottom plate 11 is between 100 and 250 microns. Among them, the flexibility of the polymer layer 20 is greater than the flexibility of the bottom plate 11.
在本實施例及部分其他實施例中，是以例如利用旋轉塗佈(spin coating)、狹縫塗佈或刮板塗抹(blade coating)之方式在底板11形成一層液態的聚合物，再藉由自然風乾或者加熱烘烤之方式使聚合物固化而形成於底板11之表面。在部分其他實施例中，可直接將一聚合物貼附於底板11。詳細來說，可以貼合或塗佈之方式在底板11形成一離型層(未繪示)後，再將一聚合物貼附於底板11形成聚合物層20，且藉由離型層而使聚合物層20貼附於底板11，使聚合物層20具有良好的離型效果，而良好的離型效果是指當離型層與另一基材接觸後，不易與另一基材沾黏而具有良好之分離效果。其中，離型層的材質例如為一矽高分子(例如為矽氧烷聚合物)、一有機高分子(例如為聚乙烯、聚氯乙烯、聚甲基丙烯酸甲酯、聚乙烯對苯二甲酸酯)、一金屬(例如為金、銀、銅、鉻、合金)或是上述之複合材料，並且離型層可以是液態或者是固態。為了避免底板11與聚合物層20之間的黏性過強，而導致在後續處理中分離底板11與聚合物層20之困難，在形成離型層後，還可使用紫外光或者是雷射來照射離型層，藉以降低離型層的黏度。進一步來說，離型層與底板11之間的黏度係大於離型層與聚合物層20之間的黏度。如此一來，可使聚合物層20貼附於底板11並且不會導致底板11與聚合物層20難以分離。此外，聚合物層20之面積大小會影響聚合物層20與底板11分離所需的時間。一般而言，聚合物層20之面積越大則需要越長的時間以與底板11分離。In this embodiment and some other embodiments, a liquid polymer is formed on the bottom plate 11 by, for example, spin coating, slit coating or blade coating. The polymer is solidified to form a surface of the bottom plate 11 by air drying or heat baking. In some other embodiments, a polymer can be attached directly to the substrate 11. In detail, after forming a release layer (not shown) on the bottom plate 11 by lamination or coating, a polymer is attached to the bottom plate 11 to form the polymer layer 20, and by the release layer. The polymer layer 20 is attached to the bottom plate 11, so that the polymer layer 20 has a good release effect, and the good release effect means that when the release layer is in contact with another substrate, it is difficult to adhere to another substrate. Sticky and have a good separation effect. The material of the release layer is, for example, a polymer (for example, a siloxane polymer) and an organic polymer (for example, polyethylene, polyvinyl chloride, polymethyl methacrylate, polyethylene terephthalic acid). An acid ester), a metal (for example, gold, silver, copper, chromium, an alloy) or a composite material as described above, and the release layer may be in a liquid state or in a solid state. In order to avoid the excessive adhesion between the bottom plate 11 and the polymer layer 20, which may cause difficulty in separating the bottom plate 11 from the polymer layer 20 in a subsequent process, after forming the release layer, ultraviolet light or laser may be used. The release layer is irradiated to reduce the viscosity of the release layer. Further, the viscosity between the release layer and the bottom plate 11 is greater than the viscosity between the release layer and the polymer layer 20. As a result, the polymer layer 20 can be attached to the bottom plate 11 without causing the bottom plate 11 and the polymer layer 20 to be difficult to separate. In addition, the size of the area of the polymer layer 20 affects the time required for the polymer layer 20 to separate from the bottom plate 11. In general, the larger the area of the polymer layer 20, the longer it takes to separate from the bottom plate 11.
接著，在底板11上形成貫穿底板11的一貫穿孔111(S102)，其中，貫穿孔111並未貫穿聚合物層20(如「第3B圖」所示)。貫穿孔111具有相對於底板11一側的第一端口1111以及相對於聚合物層20一側的第 二端口1112。在本實施例及部分其他實施例中，是藉由異形切割(Abnormity Cutting)之方式在底板11上鑽出貫穿孔111，然而形成貫穿孔111之方式並非用以限定本發明。其中，上述之貫穿孔111的數量及位置，均可於實施時依照實際需求作更改。例如，可在底板11的兩側邊分別開設一貫穿孔，或者在底板11的四個角落分別開設一貫穿孔。一般而言，貫穿孔111的數量越多，聚合物層20與底板11分離所需的時間越短。Next, a uniform through hole 111 penetrating through the bottom plate 11 is formed on the bottom plate 11 (S102), wherein the through hole 111 does not penetrate the polymer layer 20 (as shown in "Fig. 3B"). The through hole 111 has a first port 1111 on the side of the bottom plate 11 and a side opposite to the side of the polymer layer 20 Two ports 1112. In this embodiment and some other embodiments, the through hole 111 is drilled in the bottom plate 11 by means of Abnormity Cutting. However, the manner of forming the through hole 111 is not intended to limit the present invention. The number and position of the through holes 111 described above can be changed according to actual needs during implementation. For example, the permanent perforations may be respectively formed on both sides of the bottom plate 11, or the respective perforations may be respectively formed at the four corners of the bottom plate 11. In general, the greater the number of through holes 111, the shorter the time required for the polymer layer 20 to separate from the bottom plate 11.
接著，在本實施例及部分其他實施例中，還可在聚合物層20上形成一線路層30(S103)(如「第3C圖」所示)。其中，線路層30包括一透明電極陣列，以作為可撓式基板之電路，而貫穿孔111係位於透明電極陣列之外。形成線路層30的製程例如但不限於一薄膜電晶體製程(Thin Film Transistors，TFT)。須注意的是，在聚合物層20上形成線路層30並非用以限定本發明。Next, in this embodiment and some other embodiments, a wiring layer 30 (S103) may be formed on the polymer layer 20 (as shown in "3C"). The circuit layer 30 includes a transparent electrode array as a circuit of the flexible substrate, and the through hole 111 is located outside the transparent electrode array. The process of forming the wiring layer 30 is, for example but not limited to, a Thin Film Transistors (TFT). It should be noted that the formation of the wiring layer 30 on the polymer layer 20 is not intended to limit the invention.
然後，將一第一罩體13配置於聚合物層20上(S104)。其中，第一罩體13具有貫穿第一罩體13的一第一開孔131(如「第3D圖」所示)。藉此，使聚合物層20夾在第一罩體13以及底板11之間，並且第二端口1112係位於第一罩體13所圍繞的範圍內。也就是說，第一罩體13正投影在底板11的區域涵蓋了貫穿孔111的第二端口1112。藉由將第一罩體13配置於聚合物層20上，而使得聚合物層20與第一罩體13之間定義出一第一空間S1，第一空間S1與貫穿孔111相連通。Then, a first cover 13 is placed on the polymer layer 20 (S104). The first cover 13 has a first opening 131 extending through the first cover 13 (as shown in FIG. 3D). Thereby, the polymer layer 20 is sandwiched between the first cover 13 and the bottom plate 11, and the second port 1112 is located within the range surrounded by the first cover 13. That is, the area in which the first cover 13 is projected in the bottom plate 11 covers the second port 1112 of the through hole 111. By disposing the first cover 13 on the polymer layer 20, a first space S1 is defined between the polymer layer 20 and the first cover 13, and the first space S1 is in communication with the through hole 111.
在本實施例及部分其他實施例中，還可將一第二罩體15配置於底板11上(S105)。其中，第二罩體15具有貫穿第二罩體15的一第二開孔151(如「第3E圖」所示)。藉此，使底板11介於聚合物層20以及第 二罩體15之間，並且第一端口1111係位於第二罩體15所圍繞的範圍內。也就是說，第二罩體15正投影在底板11的區域涵蓋了貫穿孔111的第一端口1111。而底板11與第二罩體15之間定義出一第二空間S2，第二空間S2與貫穿孔111以及第二開孔151相連通。In this embodiment and some other embodiments, a second cover 15 may be disposed on the bottom plate 11 (S105). The second cover 15 has a second opening 151 extending through the second cover 15 (as shown in FIG. 3E). Thereby, the bottom plate 11 is interposed between the polymer layer 20 and the first Between the two covers 15, and the first port 1111 is located within the range surrounded by the second cover 15. That is, the area in which the second cover 15 is projected in the bottom plate 11 covers the first port 1111 of the through hole 111. A second space S2 is defined between the bottom plate 11 and the second cover 15, and the second space S2 is in communication with the through hole 111 and the second opening 151.
須注意的是，在本實施例及部分其他實施例中，是先將第一罩體13配置於聚合物層20，再將第二罩體15配置於底板11。在部分其他實施例中，也可以先將第二罩體15配置於底板11，再將第一罩體13配置於聚合物層20。將第一罩體13配置於聚合物層20以及將第二罩體15配置於底板11的先後順序並非用以限定本發明。此外，若是使用「第1A圖」、「第1D圖」之製作可撓式基板的裝置來製作可撓式基板，則可不必裝設第二罩體15來製作可撓式基板。It should be noted that in the present embodiment and some other embodiments, the first cover 13 is disposed on the polymer layer 20, and the second cover 15 is disposed on the bottom plate 11. In some other embodiments, the second cover 15 may be placed on the bottom plate 11 and the first cover 13 may be placed on the polymer layer 20. The order in which the first cover 13 is disposed on the polymer layer 20 and the second cover 15 is disposed on the bottom plate 11 is not intended to limit the present invention. Further, if a flexible substrate is produced by using the apparatus for manufacturing a flexible substrate in "1A" and "1D", it is not necessary to mount the second cover 15 to produce a flexible substrate.
最後，自貫穿孔111輸入一氣體(S106)(如「第3F圖」所示)。其中，氣體與底板11、聚合物層20之間不易進行反應，氣體例如為空氣、氮氣或者是氬氣，氣體的種類並非用以限定本發明。詳細來說，係藉由例如一吹氣裝置12對第二開孔151吹入氣體，使氣體沿著一路徑A流動。請一併參閱「第3G圖」，由於第一罩體13可壓住聚合物層20而使氣體沿著例如X方向流動，而不致於使氣體集中於第二端口1112處，導致氣體壓力過大而造成聚合物層20破洞。另一方面，由於第二罩體15配置於底板11，並且第二罩體15圍繞貫穿孔111的第一端口1111，因而第二罩體15可避免氣體在進入貫穿孔111前即經由第二罩體15與底板11之間的間隙而逸散出第二罩體15之外。Finally, a gas (S106) is input from the through hole 111 (as shown in "Fig. 3F"). Among them, the gas is less likely to react with the bottom plate 11 and the polymer layer 20, and the gas is, for example, air, nitrogen or argon. The type of the gas is not intended to limit the present invention. In detail, the gas is blown into the second opening 151 by, for example, a blowing device 12, and the gas flows along a path A. Referring to "3G", the first cover 13 can press the polymer layer 20 to cause the gas to flow in, for example, the X direction, so that the gas is not concentrated at the second port 1112, resulting in excessive gas pressure. The polymer layer 20 is caused to break. On the other hand, since the second cover 15 is disposed on the bottom plate 11 and the second cover 15 surrounds the first port 1111 of the through hole 111, the second cover 15 can prevent the gas from passing through the second before entering the through hole 111. The gap between the cover 15 and the bottom plate 11 escapes outside the second cover 15.
在藉由吹氣裝置12對第二開孔151吹入氣體，使氣體沿著 路徑A流動後，氣體可沿著路徑A經由第二開孔151進入第二空間S2，並且經由第一端口1111流入貫穿孔111，再經由第二端口1112而流入聚合物層20以及底板11之間。由於吹氣裝置12對第二開孔151吹入氣體而使第二空間S2產生正壓，使聚合物層20的相對兩側產生壓力差，進而使聚合物層20與底板11相分離。詳細來說，氣體使聚合物層20兩側產生的壓力差越大，聚合物層20與底板11分離所需的時間就越短。The gas is blown into the second opening 151 by the air blowing device 12, so that the gas is along After the path A flows, the gas can enter the second space S2 along the path A via the second opening 151, and flows into the through hole 111 via the first port 1111, and flows into the polymer layer 20 and the bottom plate 11 via the second port 1112. between. Since the air blowing device 12 blows the gas into the second opening 151 to generate a positive pressure in the second space S2, a pressure difference is generated on the opposite sides of the polymer layer 20, thereby separating the polymer layer 20 from the bottom plate 11. In detail, the greater the pressure difference created by the gas on both sides of the polymer layer 20, the shorter the time required for the polymer layer 20 to separate from the bottom plate 11.
為了提高將聚合物層20與底板11的分離效率，在本實施例及部分其他實施例中，還可使第一空間S1形成一具負壓之空間。詳細來說，可藉由例如一抽氣裝置14自第一開孔131抽出一氣體，使氣體沿著一路徑B而自第一空間S1被抽離。由於第一罩體13配置於聚合物層20上，並且第一罩體13圍繞貫穿孔111的第二端口1112。因此，氣體主要是沿著路徑B經由第一開孔131而自第一空間S1被抽離，而使聚合物層20遠離底板11的一側(亦即相對於聚合物層20靠近底板11的一側)產生負壓。藉此可再增加一分離聚合物層20與底板11的作用力，進而提高將聚合物層20與底板11的分離效率。In order to improve the separation efficiency of the polymer layer 20 and the bottom plate 11, in the embodiment and some other embodiments, the first space S1 may also form a space with a negative pressure. In detail, a gas can be withdrawn from the first opening 131 by, for example, an air extracting device 14, so that the gas is evacuated from the first space S1 along a path B. Since the first cover 13 is disposed on the polymer layer 20, and the first cover 13 surrounds the second port 1112 of the through hole 111. Therefore, the gas is mainly extracted from the first space S1 along the path B via the first opening 131, and the polymer layer 20 is away from the side of the bottom plate 11 (that is, the polymer layer 20 is close to the bottom plate 11). One side) produces a negative pressure. Thereby, the force of separating the polymer layer 20 and the bottom plate 11 can be further increased, thereby improving the separation efficiency of the polymer layer 20 and the bottom plate 11.
此外，由於第一罩體13可壓住聚合物層20，因而在氣體自貫穿孔111進入聚合物層20以及底板11之間時，氣體係均勻地進入聚合物層20以及底板11，而非僅集中經由特定之方向(例如方向X)而自聚合物層20以及底板11之間流出。若是氣體僅集中經由特定之方向而自聚合物層20以及底板11之間的間隙流出，這會使得聚合物層20與底板11之間僅有部分分離，亦即部分的聚合物層20仍附著於底板11上，因而分離效果不佳。在本實施例中，由於氣體係均勻地進入聚合物層20以及底板11之間的間 隙，因此當氣體離開聚合物層20以及底板11之間的間隙時，氣體可均勻地將聚合物層20與底板11完全分離。另一方面，由於第一罩體13圍繞貫穿孔111的第二端口1112，因此當氣體流入聚合物層20及底板11之間，導致聚合物層20朝第一罩體13鼓起時，第一罩體13還可限制聚合物層20鼓起的高度，以確保聚合物層20與底板11分離後的品質。進一步而言，可藉由縮短第一罩體13以及聚合物層20之間的距離D1(如「第3F圖」所示)而降低聚合物層20鼓起的高度。In addition, since the first cover 13 can press the polymer layer 20, when the gas enters between the polymer layer 20 and the bottom plate 11 from the through hole 111, the gas system uniformly enters the polymer layer 20 and the bottom plate 11, instead of Only concentrated out from between the polymer layer 20 and the bottom plate 11 via a specific direction (for example, direction X). If the gas only concentrates out of the gap between the polymer layer 20 and the bottom plate 11 via a specific direction, this will cause only partial separation between the polymer layer 20 and the bottom plate 11, that is, part of the polymer layer 20 remains attached. On the bottom plate 11, the separation effect is not good. In the present embodiment, since the gas system uniformly enters between the polymer layer 20 and the bottom plate 11, The gap, therefore, when the gas leaves the gap between the polymer layer 20 and the bottom plate 11, the gas can completely separate the polymer layer 20 from the bottom plate 11 uniformly. On the other hand, since the first cover 13 surrounds the second port 1112 of the through hole 111, when the gas flows between the polymer layer 20 and the bottom plate 11, causing the polymer layer 20 to bulge toward the first cover 13, A cover 13 can also limit the height of the polymer layer 20 to bulge to ensure quality after separation of the polymer layer 20 from the bottom plate 11. Further, the height of the polymer layer 20 can be lowered by shortening the distance D1 between the first cover 13 and the polymer layer 20 (as shown in "3F").
在本實施例及部分其他實施例中，還可以藉由可移動機構16來將聚合物層20與底板11分離。詳細來說，係先移除第一罩體13、第二罩體15，再藉由可移動機構16而使夾具161移動至底板11上方，使夾具161夾持已脫離底板11表面之聚合物層20的邊緣(S107)(如「第3H圖」所示)。其中，可藉由可移動機構16來控制夾具161朝底板11移動或者是使夾具161遠離底板11的速度，進而控制夾具161使聚合物層與底板11分離所施加的力量，以避免聚合物層20與底板11分離時因為施加的力量過大而破壞聚合物層20。藉由可移動機構16使夾具161之自動化作業來夾持已脫離底板11表面之聚合物層20的邊緣，可再提高將聚合物層20與底板11的分離效率，進而提升製造可撓式基板的效率。In this embodiment and some other embodiments, the polymer layer 20 can also be separated from the bottom plate 11 by the movable mechanism 16. Specifically, the first cover 13 and the second cover 15 are removed first, and then the clamp 161 is moved over the bottom plate 11 by the movable mechanism 16, so that the clamp 161 clamps the polymer that has detached from the surface of the bottom plate 11. The edge of layer 20 (S107) (as shown in "3H"). Wherein, the movable mechanism 16 can be used to control the speed at which the clamp 161 moves toward the bottom plate 11 or the clamp 161 is away from the bottom plate 11, thereby controlling the force applied by the clamp 161 to separate the polymer layer from the bottom plate 11 to avoid the polymer layer. When separated from the bottom plate 11, the polymer layer 20 is broken because the applied force is too large. By the automatic operation of the clamp 161 by the movable mechanism 16 to clamp the edge of the polymer layer 20 that has been separated from the surface of the bottom plate 11, the separation efficiency of the polymer layer 20 and the bottom plate 11 can be further improved, thereby improving the manufacture of the flexible substrate. s efficiency.
在本實施例中，將聚合物層20與底板11分離所需的時間小於10秒，在部分實施例中，分離所需的時間小於5秒。並且，第一罩體13與第二罩體15之間的壓力差為0.01托(torr)至1000托之間，而自吹氣裝置通入氣體之速率介於0.01毫升/分(mL/min)至100毫升/分之間，並且所需通入的氣體小於10毫升。以65吋的基板而言，僅需使用少於10毫升之 氣體即可在10秒內使聚合物層20與底板11分離。In the present embodiment, the time required to separate the polymer layer 20 from the bottom plate 11 is less than 10 seconds, and in some embodiments, the time required for separation is less than 5 seconds. Moreover, the pressure difference between the first cover 13 and the second cover 15 is between 0.01 Torr and 1000 Torr, and the rate of gas passing through the air blowing device is 0.01 mL/min (mL/min). ) to between 100 ml / min, and the required gas is less than 10 ml. For a 65-inch substrate, use less than 10 ml. The gas can separate the polymer layer 20 from the bottom plate 11 in 10 seconds.
接著，在聚合物層20與底板11分離之後，再藉由可移動機構16使夾具161遠離底板11，即可完成可撓式基板之備製(如「第3I圖」所示)。Then, after the polymer layer 20 is separated from the bottom plate 11, the jig 161 is moved away from the bottom plate 11 by the movable mechanism 16, thereby completing the preparation of the flexible substrate (as shown in "FIG. 3I").
接下來請參閱「第1B圖」、「第4圖」及「第5A圖」至「第5I圖」，「第4圖」為根據本發明另一實施例所揭露的製作可撓式基板的方法之流程圖，「第5A圖」至「第5D圖」為分別對應「第4圖」中步驟S201至S204之結構側視圖，「第5E圖」為「第5D圖」之上視圖，「第5F圖」至「第5H圖」為分別對應「第4圖」中步驟S205至S207之結構側視圖，「第5I圖」為根據「第4圖」之流程製作完成之可撓式基板及其底板之結構側視圖。由於「第4圖」及「第5A圖」至「第5I圖」之實施例與「第2圖」、「第3A圖」至「第3H圖」的實施例相似，其中相同的標號代表著與「第2圖」、「第3A圖」至「第3H圖」的實施例相同或類似的元件，因此只針對不同之處作說明。Please refer to "1B", "4" and "5A" to "5I", and "4" is a flexible substrate fabricated according to another embodiment of the present invention. The flow chart of the method, "5A" to "5D" is a side view corresponding to the steps S201 to S204 in "4th drawing", and "5E" is a top view of "5D", " 5F to 5H are respectively a side view corresponding to the steps S205 to S207 in "4th drawing", and "5I" is a flexible substrate which is completed according to the process of "4th drawing" and Side view of the structure of the bottom plate. The embodiments of "Fig. 4" and "5A" to "5I" are similar to the embodiments of "Fig. 2", "3A" to "3H", wherein the same reference numerals are used. The same or similar elements as in the embodiments of "Fig. 2", "3A" to "3H", and therefore only the differences will be explained.
首先，提供一底板11，並且在底板11上形成一聚合物層20(S201)(如「第5A圖」所示)。其中，聚合物層20的撓性係大於底板11的撓性。First, a bottom plate 11 is provided, and a polymer layer 20 (S201) is formed on the bottom plate 11 (as shown in "Fig. 5A"). Among them, the flexibility of the polymer layer 20 is greater than the flexibility of the bottom plate 11.
然後，在底板11上形成貫穿底板11的一貫穿孔111a(S202)。其中，貫穿孔111a貫穿底板11與聚合物層20。貫穿孔111a具有相對於底板11一側的一第一端口1111a以及相對於聚合物層20一側的一第二端口1112a(如「第5B圖」所示)。須注意的是，貫穿孔111a應避開聚合物層20製成可撓式基板後之顯示區，以避免將聚合物層20製成可撓式基 板後，可撓式基板的顯示區中有部分區域無法執行顯示之功能。Then, a uniform through hole 111a penetrating the bottom plate 11 is formed on the bottom plate 11 (S202). The through hole 111a penetrates the bottom plate 11 and the polymer layer 20. The through hole 111a has a first port 1111a on the side of the bottom plate 11 and a second port 1112a on the side of the polymer layer 20 (as shown in "Fig. 5B"). It should be noted that the through hole 111a should avoid the display area after the polymer layer 20 is made into a flexible substrate to avoid making the polymer layer 20 into a flexible base. After the board, some areas in the display area of the flexible substrate cannot perform the display function.
接著，將一貼合層40配置於聚合物層20上(S203)。詳細來說，貼合層40係貼合而覆蓋住貫穿孔111a相對於聚合物層20一側的第二端口1112a(如「第5C圖」所示)。本實施例及部分其他實施例中，貼合層40是一膠帶或一擋板，但並不限於此。Next, a bonding layer 40 is placed on the polymer layer 20 (S203). Specifically, the bonding layer 40 is bonded to cover the second port 1112a of the through hole 111a with respect to the polymer layer 20 side (as shown in FIG. 5C). In this embodiment and some other embodiments, the bonding layer 40 is a tape or a baffle, but is not limited thereto.
接著，在本實施例及部分其他實施例中，還可在聚合物層20上形成一線路層30(S204)(如「第5D圖」所示)。其中，線路層30包括一透明電極陣列，以作為可撓式基板之電路，而貫穿孔111a係位於透明電極陣列之外(如「第5E圖」所示)。形成線路層30的製程例如但不限於一薄膜電晶體製程。須注意的是，在聚合物層20上形成線路層30並非用以限定本發明。Next, in this embodiment and some other embodiments, a wiring layer 30 (S204) may be formed on the polymer layer 20 (as shown in FIG. 5D). The circuit layer 30 includes a transparent electrode array as a circuit of the flexible substrate, and the through hole 111a is located outside the transparent electrode array (as shown in FIG. 5E). The process of forming the wiring layer 30 is, for example but not limited to, a thin film transistor process. It should be noted that the formation of the wiring layer 30 on the polymer layer 20 is not intended to limit the invention.
然後，將一第一罩體13配置於聚合物層20(S205)。其中，第一罩體13具有貫穿第一罩體13的一第一開孔131(如「第5F圖」所示)。藉此，將聚合物層20夾在第一罩體13以及底板11之間，並且被貼合層40覆蓋的貫穿孔111a的第二端口1112a係位於第一罩體13所圍繞的範圍內。也就是說，第一罩體13正投影在底板11的區域涵蓋了貫穿孔111a的第二端口1112a。藉由將第一罩體13配置於聚合物層20上，而使得聚合物層20與第一罩體13之間定義出一第一空間S1’，第一空間S1’與第一開孔131相連通。Then, a first cover 13 is placed on the polymer layer 20 (S205). The first cover 13 has a first opening 131 extending through the first cover 13 (as shown in FIG. 5F). Thereby, the polymer layer 20 is sandwiched between the first cover 13 and the bottom plate 11, and the second port 1112a of the through hole 111a covered by the bonding layer 40 is located within the range surrounded by the first cover 13. That is, the area in which the first cover 13 is projected in the bottom plate 11 covers the second port 1112a of the through hole 111a. A first space S1 ′, a first space S1 ′ and a first opening 131 are defined between the polymer layer 20 and the first cover 13 by disposing the first cover 13 on the polymer layer 20 . Connected.
在本實施例及部分其他實施例中，還可將一第二罩體15配置於底板11(S206)。其中，第二罩體15具有貫穿第二罩體15的一第二開孔151(如「第5G圖」所示)。藉此，使底板11介於聚合物層20以及第二 罩體15之間，並且貫穿孔111a的第一端口1111a係位於第二罩體15所圍繞的範圍內。也就是說，第二罩體15正投影在底板11的區域涵蓋了貫穿孔111a的第一端口1111a。而底板11與第二罩體15之間定義出一第二空間S2’，第二空間S2’與貫穿孔111a以及第二開孔151相連通。In this embodiment and some other embodiments, a second cover 15 may be disposed on the bottom plate 11 (S206). The second cover 15 has a second opening 151 extending through the second cover 15 (as shown in FIG. 5G). Thereby, the bottom plate 11 is interposed between the polymer layer 20 and the second Between the covers 15, and the first port 1111a of the through hole 111a is located within the range surrounded by the second cover 15. That is, the area in which the second cover 15 is projected in the bottom plate 11 covers the first port 1111a of the through hole 111a. A second space S2' is defined between the bottom plate 11 and the second cover 15, and the second space S2' communicates with the through hole 111a and the second opening 151.
須注意的是，在本實施例及部分其他實施例中，是先將貼合層40配置於聚合物層20，再將第一罩體13配置於聚合物層20，再將第二罩體15配置於底板11。然而，將貼合層40配置於聚合物層20、將第二罩體15配置於底板11的先後順序以及將第一罩體13配置於聚合物層20、將第二罩體15配置於底板11的先後順序並非用以限定本發明。也就是說，在部分其他實施例中，可以先將第二罩體15配置於底板11，再將貼合層40配置於聚合物層20，再將第一罩體13配置於聚合物層20。It should be noted that in this embodiment and some other embodiments, the bonding layer 40 is first disposed on the polymer layer 20, and then the first cover 13 is disposed on the polymer layer 20, and then the second cover is disposed. 15 is disposed on the bottom plate 11. However, the bonding layer 40 is disposed on the polymer layer 20, the second cover 15 is disposed on the bottom plate 11, and the first cover 13 is disposed on the polymer layer 20, and the second cover 15 is disposed on the bottom plate. The order of 11 is not intended to limit the invention. That is, in some other embodiments, the second cover 15 may be disposed on the bottom plate 11 , the bonding layer 40 may be disposed on the polymer layer 20 , and the first cover 13 may be disposed on the polymer layer 20 . .
最後，自貫穿孔111a的第一端口1111a輸入一氣體(S207)(如「第5H圖」所示)。詳細來說，可藉由例如一吹氣裝置12對第二開孔151吹入一氣體，使氣體沿著一路徑C流動。由於第二罩體151配置於底板11，並且第二罩體15圍繞貫穿孔111a的第一端口1111a。藉此，第二罩體15可避免氣體在進入貫穿孔111a前即經由第二罩體15與底板11之間的間隙而異散出第二罩體15之外。Finally, a gas (S207) is input from the first port 1111a of the through hole 111a (as shown in "Fig. 5H"). In detail, a gas may be blown into the second opening 151 by, for example, an air blowing device 12 to cause the gas to flow along a path C. Since the second cover 151 is disposed on the bottom plate 11, and the second cover 15 surrounds the first port 1111a of the through hole 111a. Thereby, the second cover 15 can prevent the gas from being dissipated outside the second cover 15 via the gap between the second cover 15 and the bottom plate 11 before entering the through hole 111a.
接著，氣體可沿著路徑C經由第二開孔151而進入第二空間S2’，並且經由第一端口1111a流入貫穿孔111a，再經由第二端口1112a而流入聚合物層20以及底板11之間。由於貼合層40覆蓋住第二端口1112a，因此氣體不會經由第二端口1112a而離開貫穿孔111a，因而具有良好的氣密效果。此外，由於貼合層40與聚合物層20之間的結合力大於聚合 物層20與底板11之間的結合力。因此，當氣體對底板11施加壓力時，此壓力可使底板11與聚合物層20相分離而聚合物層20及貼合層40保持貼合之狀態。須注意的是，貼合層40亦須具有足夠的結構強度，以避免氣體衝破貼合層40而離開貫穿孔111a。Then, the gas can enter the second space S2 ′ along the path C via the second opening 151 , and flow into the through hole 111 a via the first port 1111 a , and then flow between the polymer layer 20 and the bottom plate 11 via the second port 1112 a . . Since the bonding layer 40 covers the second port 1112a, the gas does not leave the through hole 111a via the second port 1112a, and thus has a good airtight effect. In addition, since the bonding force between the bonding layer 40 and the polymer layer 20 is greater than the polymerization The bonding force between the object layer 20 and the bottom plate 11. Therefore, when the gas applies pressure to the bottom plate 11, the pressure can separate the bottom plate 11 from the polymer layer 20 and the polymer layer 20 and the bonding layer 40 remain in a bonded state. It should be noted that the bonding layer 40 must also have sufficient structural strength to prevent the gas from breaking through the bonding layer 40 and leaving the through hole 111a.
為了提高將聚合物層20與底板11的分離效率，在本實施例及部分其他實施例中，可再對第一空間S1’施加一負壓。詳細來說，可藉由例如一抽氣裝置14自第一開孔131抽出一氣體，使氣體沿著一路徑D而自第一空間S1’被抽離。由於第一罩體13配置於聚合物層20上，並且貫穿孔111a的第二端口1112a係位於第一罩體13所圍繞的範圍內。因此，氣體主要是沿著路徑D經由第一開孔131而自第一空間S1’被抽離，而使聚合物層20遠離底板11的一側相較於聚合物層20靠近底板11的一側產生負壓。藉此可再增加一分離聚合物層20與底板11的作用力，進而提高將聚合物層20與底板11的分離效率。In order to improve the separation efficiency of the polymer layer 20 from the bottom plate 11, in this embodiment and some other embodiments, a negative pressure may be applied to the first space S1'. In detail, a gas can be withdrawn from the first opening 131 by, for example, an air extracting means 14, so that the gas is evacuated from the first space S1' along a path D. Since the first cover 13 is disposed on the polymer layer 20, and the second port 1112a of the through hole 111a is located within the range surrounded by the first cover 13. Therefore, the gas is mainly extracted from the first space S1 ′ along the path D via the first opening 131 , and the side of the polymer layer 20 away from the bottom plate 11 is closer to the bottom plate 11 than the polymer layer 20 . A negative pressure is generated on the side. Thereby, the force of separating the polymer layer 20 and the bottom plate 11 can be further increased, thereby improving the separation efficiency of the polymer layer 20 and the bottom plate 11.
在本實施例中，由於第一罩體13圍繞貫穿孔111a的第二端口1112a，因此當氣體流入聚合物層20及底板11之間，導致聚合物層20朝第一罩體13鼓起時，第一罩體13可限制聚合物層20鼓起的高度，以確保聚合物層20與底板11分離後的品質。進一步而言，可藉由縮短第一罩體13以及聚合物層20之間的距離D2(如「第5H圖」所示)而降低聚合物層20鼓起的高度。In the present embodiment, since the first cover 13 surrounds the second port 1112a of the through hole 111a, when the gas flows between the polymer layer 20 and the bottom plate 11, causing the polymer layer 20 to bulge toward the first cover 13, The first cover 13 can limit the height of the polymer layer 20 to bulge to ensure the quality of the polymer layer 20 after separation from the bottom plate 11. Further, the height of the polymer layer 20 can be lowered by shortening the distance D2 between the first cover 13 and the polymer layer 20 (as shown in "5H").
最後，將第一罩體13以及第二罩體15移除，並移除聚合物層20上的貼合層40，即可將底板11與聚合物層20分離而完成可撓式基板之備製(如「第5I圖」所示)。Finally, the first cover 13 and the second cover 15 are removed, and the bonding layer 40 on the polymer layer 20 is removed, thereby separating the bottom plate 11 from the polymer layer 20 to complete the preparation of the flexible substrate. System (as shown in Figure 5I).
請參閱「第6A圖」、「第6B圖」，「第6A圖」為根據本發明一實施例所揭露的製作可撓式基板的裝置之側視圖，「第6B圖」為根據本發明另一實施例所揭露的製作可撓式基板的裝置之側視圖。製作可撓式基板的裝置50，包括一底板51、一吹氣裝置52、一第一罩體53、一抽氣裝置54、一第二罩體55以及至少一載台56。Please refer to "FIG. 6A" and "FIG. 6B". FIG. 6A is a side view of a device for manufacturing a flexible substrate according to an embodiment of the present invention, and FIG. 6B is a view according to the present invention. A side view of an apparatus for making a flexible substrate as disclosed in an embodiment. The device 50 for manufacturing a flexible substrate includes a bottom plate 51, an air blowing device 52, a first cover body 53, an air extracting device 54, a second cover body 55, and at least one loading table 56.
底板51具有貫穿底板51的一貫穿孔513。貫穿孔513具有相對之一第一端口5131以及一第二端口5132，分別位於貫穿孔513的相對兩側。底板51具有一貼合區514。第二端口5132係位於貼合區514內，而第一端口5131係位於底板51相對於貼合區514的一側。The bottom plate 51 has a uniform through hole 513 penetrating the bottom plate 51. The through hole 513 has a first port 5131 and a second port 5132 opposite to each other on opposite sides of the through hole 513. The bottom plate 51 has a fitting area 514. The second port 5132 is located in the bonding area 514, and the first port 5131 is located on the side of the bottom plate 51 with respect to the bonding area 514.
吹氣裝置52具有一噴氣口521，對應於第一端口5131。詳細來說，吹氣裝置52可包含例如充有氣體之一鋼瓶的一供氣裝置。藉由將噴氣口521連接於第一端口5131，可使供氣裝置內的氣體依序通過噴氣口521、第一端口5131以及第二端口5132流入第一罩體53與底板51之間，使底板51於第一端口5131的一側相對於底板51於第二端口5132的一側產生正壓，而使底板51的相對兩側產生壓力差。The air blowing device 52 has a gas jet port 521 corresponding to the first port 5131. In detail, the air blowing means 52 may comprise, for example, a gas supply means of one of the cylinders filled with gas. By connecting the air outlet 521 to the first port 5131, the gas in the air supply device can be sequentially flowed between the first cover 53 and the bottom plate 51 through the air outlet 521, the first port 5131, and the second port 5132. The bottom plate 51 generates a positive pressure on one side of the first port 5131 with respect to the bottom plate 51 on one side of the second port 5132, and a pressure difference is generated on the opposite sides of the bottom plate 51.
第一罩體53以可分離的方式配置於貼合區514，並且第一罩體53圍繞第二端口5132。也就是說，第一罩體53正投影在底板51的區域涵蓋了貫穿孔513的第二端口5132。The first cover 53 is detachably disposed in the bonding area 514, and the first cover 53 surrounds the second port 5132. That is, the area in which the first cover 53 is projected in the bottom plate 51 covers the second port 5132 of the through hole 513.
抽氣裝置54具有一抽氣口541，對應於第二端口5132。詳細來說，抽氣裝置54例如可包含一抽氣幫浦。藉由將抽氣口541連接於第二端口5132，可將第一罩體53與底板51之間的氣體經由抽氣口541而被抽出第一罩體53之外，使底板51具第二端口5132的一側產生負壓，進而 使底板51的相對兩側產生壓力差。The air extracting device 54 has a suction port 541 corresponding to the second port 5132. In detail, the air extracting device 54 may include, for example, an air pump. By connecting the air suction port 541 to the second port 5132, the gas between the first cover 53 and the bottom plate 51 can be extracted out of the first cover 53 via the air suction port 541, and the bottom plate 51 has the second port 5132. a negative pressure on one side A pressure difference is generated on opposite sides of the bottom plate 51.
第二罩體55以可分離的方式配置於底板51相對於第一罩體53的一側，並且第二罩體55圍繞第一端口5131。也就是說，第二罩體55正投影在底板51的區域涵蓋了貫穿孔513的第一端口5131。其中，第二罩體55具有貫穿第二罩體55的一第二開孔551。The second cover 55 is detachably disposed on one side of the bottom plate 51 with respect to the first cover 53 , and the second cover 55 surrounds the first port 5131 . That is, the area in which the second cover 55 is projected in the bottom plate 51 covers the first port 5131 of the through hole 513. The second cover 55 has a second opening 551 extending through the second cover 55 .
載台56設置於底板51下，並且載台56具有一第一頂針561以及一第二頂針562，分別對應於貫穿孔513。詳細來說，可以是同一載台上具有第一頂針561與第二頂針562，或者是二載台分別具有第一頂針561與第二頂針562。第一頂針561與第二頂針562分別為自底板51凸起之錐體。使用者可分別將第一頂針561或第二頂針562自第一端口5131伸入貫穿孔513以進行使用。在本實施例與部分其他實施例中，第一頂針561之高度小於第二頂針562之高度(如「第6A」圖所示)。在部分其他實施例中，第一頂針561’與第二頂針562’也可具有相同或相近的高度，而第一頂針561’之錐率小於第二頂針562’之錐率(如「第6B」圖所示)。也就是說，第一頂針561’自接近載台一側至遠離載台一側之變化比第二頂針562’自接近載台一側至遠離載台一側的變化大。The stage 56 is disposed under the bottom plate 51, and the stage 56 has a first ejector pin 561 and a second ejector pin 562 corresponding to the through holes 513, respectively. In detail, the first ejector 561 and the second ejector pin 562 may be provided on the same stage, or the two pedestals may have a first ejector pin 561 and a second ejector pin 562, respectively. The first ejector pin 561 and the second ejector pin 562 are respectively cones protruding from the bottom plate 51. The user can respectively extend the first ejector pin 561 or the second ejector pin 562 from the first port 5131 into the through hole 513 for use. In this embodiment and some other embodiments, the height of the first ejector pin 561 is smaller than the height of the second ejector pin 562 (as shown in FIG. 6A). In some other embodiments, the first ejector pin 561' and the second ejector pin 562' may also have the same or similar height, and the taper rate of the first ejector pin 561' is smaller than the taper rate of the second ejector pin 562' (eg, "6B" "Figure shows). That is, the change of the first ejector pin 561' from the side close to the stage to the side away from the stage is larger than the change of the second ejector pin 562' from the side closer to the stage to the side away from the stage.
接下來請參閱「第6A圖」、「第7圖」、及「第8A圖」至「第8L圖」，「第7圖」為根據本發明另一實施例所揭露的製作可撓式基板的方法之流程圖，「第8A圖」至「第8K圖」為分別對應「第7圖」中步驟S301至S311之結構側視圖，「第8L圖」為根據「第7圖」之流程製作完成之可撓式基板及其底板之結構側視圖。由於「第7圖」及「第8A圖」至「第8L圖」之實施例與「第2圖」、「第3A圖」至「第3I圖」的實施例相似，其 中相同的標號代表著與「第2圖」、「第3A圖」至「第3I圖」的實施例相同或類似的元件，因此只針對不同之處作說明。Please refer to "6A", "7th", and "8A" to "8L", and "7th" is a flexible substrate according to another embodiment of the present invention. The flowchart of the method, "8A" to "8K" corresponds to the side view of the steps S301 to S311 in "Fig. 7", and the "8L" is made according to the flow of "Fig. 7". A side view of the structure of the completed flexible substrate and its bottom plate. The embodiments of "Fig. 7" and "8A" to "8L" are similar to the embodiments of "Fig. 2", "3A" to "3I", The same reference numerals are used for the same or similar elements as the embodiments of "Fig. 2", "3A" to "3I", and therefore only the differences will be described.
首先，提供一板體511(S301)，板體511具有一貫穿板體511之第一開口5111(如「第8A圖」所示)。First, a plate body 511 (S301) is provided. The plate body 511 has a first opening 5111 extending through the plate body 511 (as shown in Fig. 8A).
在本實施例及部分其他實施例中，可在板體511上設置一貼合層80(S302)。詳細來說，貼合層80係覆蓋住板體511相對於第一開口5111的一側(如「第8B圖」所示)，貼合層80例如但不限於一膠帶或一擋板。In this embodiment and some other embodiments, a bonding layer 80 may be disposed on the board 511 (S302). In detail, the bonding layer 80 covers one side of the board body 511 with respect to the first opening 5111 (as shown in FIG. 8B), and the bonding layer 80 is, for example but not limited to, a tape or a baffle.
然後，在板體511上形成一離型層512(S303)(如「第8C圖」所示)。Then, a release layer 512 is formed on the plate body 511 (S303) (as shown in "Fig. 8C").
接著，移除貼合層80(S304)，離型層512具有一第二開口5121，第二開口5121暴露第一開口5111並且與第一開口5111相連通(如「第8D圖」所示)。其中，板體511與離型層512即組成「第6A圖」之底板51，而第一開口5111與第二開口5121即組成「第6A圖」之貫穿孔513。第一開口5111係遠離離型層512的一側，而第一開口5111即為「第6A圖」之第一端口5131。第二開口5121係遠離板體511的一側，而第二開口5121即為「第6A圖」之第二端口5132。Next, the bonding layer 80 is removed (S304). The release layer 512 has a second opening 5121. The second opening 5121 exposes the first opening 5111 and communicates with the first opening 5111 (as shown in FIG. 8D). . The plate body 511 and the release layer 512 constitute the bottom plate 51 of the "FIG. 6A", and the first opening 5111 and the second opening 5121 constitute the through hole 513 of "FIG. 6A". The first opening 5111 is away from the side of the release layer 512, and the first opening 5111 is the first port 5131 of the "FIG. 6A". The second opening 5121 is away from the side of the plate 511, and the second opening 5121 is the second port 5132 of "FIG. 6A".
在本實施例及部分其他實施例中，是以例如蒸鍍之方式在板體511形成離型層512，而離型層512與另一基材接觸後，不易與另一基材沾黏而具有良好之分離效果。在本實施例中，離型層512係作為例如一去鍵結層(Debonding Layer，DBL)。離型層512的材質例如為一矽高分子(例如為矽氧烷聚合物)、一有機高分子(例如為聚乙烯、聚氯乙烯、聚甲基丙 烯酸甲酯、聚乙烯對苯二甲酸酯)、一金屬(例如為金、銀、銅、鉻、合金)或是上述之複合材料。In this embodiment and some other embodiments, the release layer 512 is formed on the plate body 511 by, for example, vapor deposition, and the release layer 512 is not easily adhered to another substrate after being in contact with another substrate. Has a good separation effect. In the present embodiment, the release layer 512 is used as, for example, a Debonding Layer (DBL). The material of the release layer 512 is, for example, a polymer (for example, a siloxane polymer) and an organic polymer (for example, polyethylene, polyvinyl chloride, polymethyl propylene). Methyl enoate, polyethylene terephthalate), a metal (for example, gold, silver, copper, chromium, alloy) or a composite material as described above.
接著，將底板51放置於載台56上，並且使第一頂針561伸入貫穿孔513(S305)(如「第8E圖」所示)。Next, the bottom plate 51 is placed on the stage 56, and the first ejector pin 561 is inserted into the through hole 513 (S305) (as shown in Fig. 8E).
然後，在離型層512上形成一聚合物層60(S306)(如「第8F圖」所示)，聚合物層60之材料例如但不限於聚醯亞胺。由於第一頂針561係匹配於貫穿孔513，因而第一頂針561可卡合於底板51而可避免聚合物層60自貫穿孔513流出底板51之外。另一方面，由於尚未固化的聚合物層60為液態，因而部分的聚合物層60可流入貫穿孔513而黏著於貫穿孔513的側壁。如此一來，在後續的製程中，流入貫穿孔513的聚合物層60可作為離型層512的保護層，藉以避免底板51在後續的製程中因為接觸化學藥劑而遭到侵蝕甚至被破壞。藉此，在完成可撓式基板的製備後，底板51還可重複使用。Then, a polymer layer 60 (S306) is formed on the release layer 512 (as shown in FIG. 8F), and the material of the polymer layer 60 is, for example but not limited to, polyimine. Since the first ejector pin 561 is matched to the through hole 513, the first ejector pin 561 can be engaged with the bottom plate 51 to prevent the polymer layer 60 from flowing out of the bottom plate 51 from the through hole 513. On the other hand, since the uncured polymer layer 60 is in a liquid state, a part of the polymer layer 60 can flow into the through hole 513 and adhere to the side wall of the through hole 513. In this way, in the subsequent process, the polymer layer 60 flowing into the through hole 513 can serve as a protective layer of the release layer 512, so as to prevent the bottom plate 51 from being eroded or even destroyed due to contact with the chemical agent in the subsequent process. Thereby, the bottom plate 51 can be reused after the preparation of the flexible substrate is completed.
接著，在本實施例及部分其他實施例中，還可在聚合物層60上形成一線路層70(S307)(如「第8G圖」所示)。其中，線路層70包括一透明電極陣列，以作為可撓式基板之電路，而貫穿孔513係位於透明電極陣列之外。形成線路層70的製程例如但不限於一薄膜電晶體製程(Thin Film Transistors，TFT)。須注意的是，在聚合物層60上形成線路層70並非用以限定本發明。Next, in this embodiment and some other embodiments, a wiring layer 70 (S307) may be formed on the polymer layer 60 (as shown in "8G"). The circuit layer 70 includes a transparent electrode array as a circuit of the flexible substrate, and the through holes 513 are located outside the transparent electrode array. The process of forming the wiring layer 70 is, for example but not limited to, a Thin Film Transistors (TFT). It should be noted that the formation of the wiring layer 70 on the polymer layer 60 is not intended to limit the invention.
然後，待液態聚合物層60固化後，伸出第一頂針561，使載台56的第二頂針562伸入貫穿孔513(S308)，由於第二頂針562的高度大於第一頂針561的高度，因此，第二頂針562會凸出貫穿孔513的第二端 口，而頂開位於貫穿孔513的第二端口上的聚合物層60，而使得部分聚合物層60朝遠離底板51的方向***。藉此，使聚合物層60與底板51部分分離(如「第8H圖」所示)。如此一來，可再增加將聚合物層60與底板51分離之速度。此外，若是使用「第6B圖」之製作可撓式基板的裝置，由於第二頂針562’的錐率大於第一頂針561’的錐率，因而第二頂針562’相較於第一頂針561’可伸入貫穿孔513較深之距離，因此第二頂針562’亦可頂起流入貫穿孔513的部分聚合物層60，而使得部分聚合物層60朝遠離底板51的方向***。Then, after the liquid polymer layer 60 is cured, the first ejector pin 561 is extended, and the second ejector pin 562 of the stage 56 is inserted into the through hole 513 (S308), since the height of the second ejector pin 562 is greater than the height of the first ejector pin 561. Therefore, the second ejector pin 562 may protrude from the second end of the through hole 513 The opening, while opening the polymer layer 60 on the second port of the through hole 513, causes the portion of the polymer layer 60 to bulge away from the bottom plate 51. Thereby, the polymer layer 60 is partially separated from the bottom plate 51 (as shown in "8H"). As a result, the speed at which the polymer layer 60 is separated from the bottom plate 51 can be increased. In addition, if the apparatus for fabricating the flexible substrate is used in the "Fig. 6B", since the taper ratio of the second ejector pin 562' is larger than the taper rate of the first ejector pin 561', the second ejector pin 562' is compared with the first ejector pin 561. The depth of the through hole 513 can be extended, so that the second ejector pin 562' can also lift up part of the polymer layer 60 flowing into the through hole 513, so that part of the polymer layer 60 is swelled away from the bottom plate 51.
然後，自載台56取下底板51，並且將一第一罩體53配置於聚合物層60上(S309)。其中，第一罩體53具有貫穿第一罩體53的一第一開孔531(如「第8I圖」所示)。藉此，使聚合物層60夾在第一罩體53以及底板51之間，並且第二端口5132係位於第一罩體53所圍繞的範圍內。也就是說，第一罩體53正投影在底板51的區域涵蓋了貫穿孔513的第二端口5132正投影在底板51的區域。而聚合物層60與第一罩體53之間定義出一第一空間S1”，第一空間S1”與貫穿孔513相連通。Then, the bottom plate 51 is removed from the stage 56, and a first cover 53 is placed on the polymer layer 60 (S309). The first cover 53 has a first opening 531 extending through the first cover 53 (as shown in FIG. 8I). Thereby, the polymer layer 60 is sandwiched between the first cover 53 and the bottom plate 51, and the second port 5132 is located within the range surrounded by the first cover 53. That is, the area in which the first cover 53 is projected on the bottom plate 51 covers the area in which the second port 5132 of the through hole 513 is projected on the bottom plate 51. A first space S1 ′′ is defined between the polymer layer 60 and the first cover 53 , and the first space S1 ′′ communicates with the through hole 513 .
在本實施例及部分其他實施例中，還可將一第二罩體55配置於底板51上(S310)。其中，第二罩體55具有貫穿第二罩體55的一第二開孔551(如「第8J圖」所示)。藉此，底板51介於聚合物層60以及第二罩體55之間，並且第一端口5131係位於第二罩體55所圍繞的範圍內。也就是說，第二罩體55正投影在底板51的區域涵蓋了貫穿孔513的第一端口5131正投影在底板51的區域。而底板51與第二罩體55之間定義出一第二空間S2”，第二空間S2”與貫穿孔513以及第二開孔551相連通。須注意 的是，將第一罩體53配置於聚合物層60以及將第二罩體55配置於底板51的先後順序並非用以限定本發明。In this embodiment and some other embodiments, a second cover 55 may be disposed on the bottom plate 51 (S310). The second cover 55 has a second opening 551 extending through the second cover 55 (as shown in FIG. 8J). Thereby, the bottom plate 51 is interposed between the polymer layer 60 and the second cover 55, and the first port 5131 is located within the range surrounded by the second cover 55. That is, the area in which the second cover 55 is projected on the bottom plate 51 covers the area where the first port 5131 of the through hole 513 is projected on the bottom plate 51. A second space S2 ′′ is defined between the bottom plate 51 and the second cover 55 , and the second space S2 ′′ communicates with the through hole 513 and the second opening 551 . Must pay attention The order in which the first cover 53 is disposed on the polymer layer 60 and the second cover 55 is disposed on the bottom plate 51 is not intended to limit the present invention.
最後，自貫穿孔513輸入一氣體(S311)(如「第8K圖」所示)。其中，氣體例如為空氣、氮氣或者是氬氣，氣體的種類並非用以限定本發明。詳細來說，係藉由例如一吹氣裝置(未繪示)對第二開孔551吹入氣體，使氣體沿著一路徑E流動。由於第二罩體55配置於底板51，並且第二罩體55圍繞貫穿孔513的第一端口5131，因此氣體沿著可路徑E經由第二開孔551進入第二空間S2”，而第二罩體55還可避免氣體在聚合物層60與底板51分離前逸散。並且氣體可經由第一端口5131自第二空間S2”流入貫穿孔513，再經由第一端口5131、第二端口5132流入聚合物層60以及底板51之間。藉由氣體對底板51所施加的正壓，使聚合物層60的相對兩側產生壓力差，而使得聚合物層60與底板51分離。Finally, a gas (S311) is input from the through hole 513 (as shown in "Fig. 8K"). Here, the gas is, for example, air, nitrogen or argon, and the kind of the gas is not intended to limit the present invention. In detail, the gas is blown into the second opening 551 by, for example, an air blowing means (not shown) to cause the gas to flow along a path E. Since the second cover 55 is disposed on the bottom plate 51, and the second cover 55 surrounds the first port 5131 of the through hole 513, the gas enters the second space S2" along the path E through the second opening 551, and the second The cover 55 can also prevent gas from escaping before the polymer layer 60 is separated from the bottom plate 51. The gas can flow into the through hole 513 from the second space S2" via the first port 5131, and then through the first port 5131 and the second port 5132. It flows between the polymer layer 60 and the bottom plate 51. The positive pressure applied to the bottom plate 51 by the gas causes a pressure difference between the opposite sides of the polymer layer 60 to separate the polymer layer 60 from the bottom plate 51.
為了提高將聚合物層60與底板51的分離效率，在本實施例及部分其他實施例中，還可再對第一空間S1”施加一負壓。詳細來說，可藉由例如一抽氣裝置54對第一開孔531抽出一氣體，使氣體沿著一路徑F而自第一空間S1”被抽離。由於第一罩體53配置於聚合物層60上，並且貫穿孔513的第二端口5132係位於第一罩體53所圍繞的範圍內。因此，氣體主要是沿著路徑F經由第一開孔531而自第一空間S1”被抽離，而使聚合物層60遠離底板51的一側產生負壓。藉此可再增加一分離聚合物層60與底板51的作用力，進而提高將聚合物層60與底板51的分離效率。In order to improve the separation efficiency between the polymer layer 60 and the bottom plate 51, in this embodiment and some other embodiments, a negative pressure may be applied to the first space S1". In detail, for example, a pumping can be performed. The device 54 draws a gas to the first opening 531 to draw the gas away from the first space S1" along a path F. Since the first cover 53 is disposed on the polymer layer 60, and the second port 5132 of the through hole 513 is located within a range surrounded by the first cover 53. Therefore, the gas is mainly extracted from the first space S1" along the path F via the first opening 531, and a negative pressure is generated on the side of the polymer layer 60 away from the bottom plate 51. Thereby, a separate polymerization can be added. The force of the layer 60 and the bottom plate 51 further increases the separation efficiency of the polymer layer 60 from the bottom plate 51.
在本實施例中，由於第一罩體53圍繞貫穿孔513的第二端口5132，因此當氣體流入聚合物層60及底板51之間，導致聚合物層60朝 第一罩體53鼓起時，第一罩體53還可限制聚合物層60鼓起的高度，以確保聚合物層60與底板51分離後的品質。進一步而言，可藉由縮短第一罩體53以及聚合物層60之間的距離D3(如「第8J圖」所示)而降低聚合物層60鼓起的高度。In the present embodiment, since the first cover 53 surrounds the second port 5132 of the through hole 513, when the gas flows between the polymer layer 60 and the bottom plate 51, the polymer layer 60 is caused to face. When the first cover 53 is bulged, the first cover 53 can also limit the height at which the polymer layer 60 bulges to ensure the quality of the polymer layer 60 after being separated from the bottom plate 51. Further, the height of the polymer layer 60 can be lowered by shortening the distance D3 between the first cover 53 and the polymer layer 60 (as shown in "8J").
接著，將第一罩體53以及第二罩體55移除，並且對聚合物層60面對底板51之一側進行例如切邊之處理，使聚合物層60面對底板51之一側較為平整，如此一來，即完成可撓式基板之備製(如「第8L圖」所示)。Next, the first cover 53 and the second cover 55 are removed, and one side of the polymer layer 60 facing the bottom plate 51 is subjected to, for example, trimming, so that the polymer layer 60 faces one side of the bottom plate 51. Flattening, in this way, the preparation of the flexible substrate is completed (as shown in "8L").
須注意的是，在板體上設置貼合層後再於板體上形成離型層512並非用以限定本發明。請參閱「第6圖」、「第9A圖」至「第9C圖」，「第9A圖」為根據本發明另一實施例所揭露的製作可撓式基板的方法之流程圖，「第9B圖」為對應「第9A圖」中步驟S402之結構側視圖，「第9C圖」為根據「第9A圖」之流程製作完成之可撓式基板及其底板之結構側視圖。由於本實施例與「第7圖」、「第8A圖」至「第8L圖」相似，因此僅針對相異之處進行說明。It should be noted that the formation of the release layer on the plate and the formation of the release layer 512 on the plate are not intended to limit the invention. Please refer to "FIG. 6", "9A" to "9C", and "9A" is a flow chart of a method for fabricating a flexible substrate according to another embodiment of the present invention, "9B The figure is a side view corresponding to the structure of the step S402 in the "Fig. 9A", and the "Fig. 9C" is a side view of the structure of the flexible substrate and the bottom plate which are completed according to the flow of the "Fig. 9A". Since this embodiment is similar to "FIG. 7", "8A" to "8L", only the differences will be described.
在本實施例中，在提供一板體511(S401)之後，可直接將板體511放置於基台56上，使第一頂針561伸入貫穿孔513，並且在板體511上形成離型層512(S402)，在本實施例中，可不須在貫穿孔513上設置貼合層(如「第9B圖」所示)。然而，在本實施例中，由於離型層512與聚合物層之間的鍵結較弱，為了避免在後續的製程中離型層512與聚合物層之間鬆動而造成聚合物層之瑕疵，因而需要在離型層512對應於貫穿孔513之區域照光或者照射雷射(S403)，藉以提高對應於貫穿孔513之區域 的離型層512與聚合物層60之間的鍵結能力。此外，步驟(S404)至步驟(S409)與「第7圖」之步驟(S305)至步驟(S310)相似，故不再贅述。根據「第9A圖」之流程製作完成之可撓式基板及其底板之結構側視圖如「第9C圖」所示。In this embodiment, after a plate body 511 (S401) is provided, the plate body 511 can be directly placed on the base 56, the first ejector pin 561 can be inserted into the through hole 513, and the plate body 511 can be formed on the plate body 511. In the layer 512 (S402), in the present embodiment, it is not necessary to provide a bonding layer on the through hole 513 (as shown in Fig. 9B). However, in the present embodiment, since the bonding between the release layer 512 and the polymer layer is weak, in order to avoid looseness between the release layer 512 and the polymer layer in the subsequent process, the polymer layer is caused to collapse. Therefore, it is necessary to illuminate or illuminate the laser at a region corresponding to the through hole 513 of the release layer 512 (S403), thereby increasing the area corresponding to the through hole 513. The bonding ability between the release layer 512 and the polymer layer 60. Further, the steps (S404) to (S409) are similar to the steps (S305) to (S310) of the "FIG. 7", and therefore will not be described again. A side view of the structure of the flexible substrate and its bottom plate which is completed according to the process of "Fig. 9A" is shown in Fig. 9C.
綜合上述，依根據本發明實施例所提供之製作可撓式基板的方法及其裝置，由於是藉由通入氣體流經聚合物層與底板之間，以將聚合物層與底板分離。因此可避免聚合物層與底板分離時，聚合物層上線路的斷裂或者聚合物層表面損傷。並且，藉由調整聚合物層的大小、貫穿孔的數目以及氣體的壓力，可以調控聚合物層與底板所需的分離時間。因此得以較簡單地將聚合物層自底板分離，而解決了先前技術中可撓式基板不易自底板剝離之問題。In summary, the method and apparatus for fabricating a flexible substrate according to an embodiment of the present invention are separated from the bottom plate by flowing a gas between the polymer layer and the bottom plate. Therefore, it is possible to avoid breakage of the wiring on the polymer layer or surface damage of the polymer layer when the polymer layer is separated from the substrate. Moreover, by adjusting the size of the polymer layer, the number of through holes, and the pressure of the gas, the separation time required for the polymer layer and the substrate can be adjusted. Therefore, it is relatively simple to separate the polymer layer from the bottom plate, thereby solving the problem that the flexible substrate is not easily peeled off from the bottom plate in the prior art.
此外，在部分的實施例中，可再藉由載台的頂針來使聚合物層與底板部分分離。如此一來，可再提升將聚合物層與底板分離之速率。Moreover, in some embodiments, the polymer layer can be separated from the bottom plate portion by the ejector pins of the stage. In this way, the rate at which the polymer layer is separated from the substrate can be increased.
此外，在部分的實施例中，由於還在底板上設置一離型層，並且部分的離型層部分流入貫穿孔而黏著於貫穿孔的側壁。如此一來，流入貫穿孔的離型層可作為底板的保護層，藉以避免底板因為接觸化學藥劑而遭到侵蝕甚至被破壞。藉此，在完成可撓式基板的製備後，底板還可重複使用。Further, in some embodiments, since a release layer is also provided on the bottom plate, and part of the release layer portion flows into the through hole to adhere to the side wall of the through hole. In this way, the release layer flowing into the through hole can serve as a protective layer for the bottom plate, so as to avoid erosion or even destruction of the bottom plate due to contact with chemicals. Thereby, the bottom plate can be reused after the preparation of the flexible substrate is completed.
此外，在部分的實施例中，由於部分的聚合物層流入貫穿孔而黏著於貫穿孔的側壁。如此一來，流入貫穿孔的聚合物層可作為底板的保護層，藉以避免底板因為接觸化學藥劑而遭到侵蝕甚至被破壞。藉此，在完成可撓式基板的製備後，底板還可重複使用。Further, in some embodiments, a portion of the polymer layer flows into the through hole to adhere to the side wall of the through hole. In this way, the polymer layer flowing into the through hole can serve as a protective layer for the bottom plate, so as to avoid erosion or even destruction of the bottom plate due to contact with chemicals. Thereby, the bottom plate can be reused after the preparation of the flexible substrate is completed.
雖然本發明以前述之較佳實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The patent protection scope of the invention is subject to the definition of the scope of the patent application attached to the specification.
Claims (11)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102110343A TWI458406B (en) | 2013-03-22 | 2013-03-22 | Method and apparatus for manufacturing flexible substrate |
| CN201310244253.9A CN103441087B (en) | 2013-03-22 | 2013-06-19 | method for manufacturing flexible substrate |
| CN201610075960.3A CN105575857B (en) | 2013-03-22 | 2013-06-19 | Method and device for manufacturing flexible substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102110343A TWI458406B (en) | 2013-03-22 | 2013-03-22 | Method and apparatus for manufacturing flexible substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201438531A TW201438531A (en) | 2014-10-01 |
| TWI458406B true TWI458406B (en) | 2014-10-21 |
Family
ID=49694775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102110343A TWI458406B (en) | 2013-03-22 | 2013-03-22 | Method and apparatus for manufacturing flexible substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN103441087B (en) |
| TW (1) | TWI458406B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104793357A (en) * | 2014-01-17 | 2015-07-22 | 鸿富锦精密工业（深圳）有限公司 | Carrier, thin film transistor array substrate manufacturing method and liquid crystal display panel manufacturing method |
| CN106154609A (en) * | 2015-04-09 | 2016-11-23 | 鸿富锦精密工业（深圳）有限公司 | Liquid crystal display panel preparation method |
| CN106057707A (en) * | 2016-06-01 | 2016-10-26 | 上海天马微电子有限公司 | Method for separating substrate and bearing panel of electronic device and bearing panel |
| CN106379034B (en) * | 2016-10-31 | 2018-11-20 | 东莞市五株电子科技有限公司 | A kind of device of protective film layer that removing electromagnetic membrane |
| CN107742618B (en) * | 2017-10-24 | 2020-07-03 | 京东方科技集团股份有限公司 | Preparation method of flexible panel, flexible panel and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI230570B (en) * | 2001-07-16 | 2005-04-01 | Au Optronics Corp | Assembly method of flat panel display |
| TWI298992B (en) * | 2005-10-12 | 2008-07-11 | Nippon Mektron Kk | |
| TWM420151U (en) * | 2011-09-05 | 2012-01-01 | Young Fast Optoelectronics Co | Structure improvement of panel laminating device |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62128139A (en) * | 1985-11-29 | 1987-06-10 | Toshiba Corp | Peeling device |
| JP4440005B2 (en) * | 2004-06-15 | 2010-03-24 | 信越ポリマー株式会社 | Parts holder |
| US7823619B2 (en) * | 2004-07-02 | 2010-11-02 | Sharp Kabushiki Kaisha | Film stripping method and apparatus |
| JP2006319150A (en) * | 2005-05-13 | 2006-11-24 | Nec Corp | Semiconductor chip pick-up device and method therefor |
| JP2008053260A (en) * | 2006-08-22 | 2008-03-06 | Nidec Tosok Corp | Pick-up device |
| CN101609786B (en) * | 2008-06-17 | 2011-01-05 | 旺硅科技股份有限公司 | Crystal grain access system and ejecting pin device |
| CN101752204B (en) * | 2008-12-19 | 2011-06-29 | 均豪精密工业股份有限公司 | Method for separating chip and rubber film and chip removal method |
| JP4979732B2 (en) * | 2009-05-01 | 2012-07-18 | 信越化学工業株式会社 | Manufacturing method of bonded wafer |
| JP2011054648A (en) * | 2009-08-31 | 2011-03-17 | Elpida Memory Inc | Method of manufacturing semiconductor device |
| CN102194829B (en) * | 2010-03-11 | 2013-07-10 | 财团法人工业技术研究院 | Substrate structure and manufacturing method thereof |
| TWI539414B (en) * | 2011-09-21 | 2016-06-21 | 友達光電股份有限公司 | Fabricating method of flexible display |
| CN202384307U (en) * | 2011-11-11 | 2012-08-15 | 苏州均华精密机械有限公司 | Dyestripping apparatus |
| CN102636898B (en) * | 2012-03-14 | 2014-03-12 | 京东方科技集团股份有限公司 | Manufacturing method of flexible display devices |
| TWI492373B (en) * | 2012-08-09 | 2015-07-11 | Au Optronics Corp | Method for fabricating flexible display module |
-
2013
- 2013-03-22 TW TW102110343A patent/TWI458406B/en active
- 2013-06-19 CN CN201310244253.9A patent/CN103441087B/en active Active
- 2013-06-19 CN CN201610075960.3A patent/CN105575857B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI230570B (en) * | 2001-07-16 | 2005-04-01 | Au Optronics Corp | Assembly method of flat panel display |
| TWI298992B (en) * | 2005-10-12 | 2008-07-11 | Nippon Mektron Kk | |
| TWM420151U (en) * | 2011-09-05 | 2012-01-01 | Young Fast Optoelectronics Co | Structure improvement of panel laminating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105575857A (en) | 2016-05-11 |
| CN103441087B (en) | 2016-09-07 |
| CN103441087A (en) | 2013-12-11 |
| CN105575857B (en) | 2019-03-08 |
| TW201438531A (en) | 2014-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI458406B (en) | Method and apparatus for manufacturing flexible substrate | |
| US11263928B2 (en) | Manufacturing method of flexible display panel, flexible display panel and display device | |
| US9673014B2 (en) | Method of manufacturing display panel | |
| CN108188590B (en) | Cutting method of flexible medium | |
| TWI428243B (en) | Method for debonding a flexible device | |
| US10249527B2 (en) | Method of manufacturing flexible display device | |
| KR20140113247A (en) | An electronic device and fabricating method thereof | |
| JP5718342B2 (en) | Apparatus and method for applying a film to a semiconductor wafer and method for processing a semiconductor wafer | |
| TW201535182A (en) | Flexible device and method for manufacturing the same | |
| JP5750980B2 (en) | Elongated body with pattern structure layer and method for bonding pattern structure layer | |
| US9304338B2 (en) | Methods for assembling display structures | |
| JP7381346B2 (en) | Flexible panel manufacturing method and manufacturing equipment | |
| TWI486109B (en) | Method for manufacturing element substrate | |
| KR101279231B1 (en) | Transfer film liquid crystal display device fabricated using the same and fabricating method for the liquid crystal display device | |
| JP6662723B2 (en) | Laminate for touch panel and peeling method | |
| US9655244B1 (en) | Flexible electronic device and method for manufacturing the same | |
| TW201530269A (en) | Pellicle | |
| KR101536709B1 (en) | Method and apparatus for processing panel | |
| JP7508626B2 (en) | Auxiliary Film | |
| KR20200017018A (en) | Cutting apparatus and manufacturing method for display device using the same | |
| US20230152860A1 (en) | Display apparatus | |
| JP2023158635A (en) | auxiliary film | |
| US10335981B2 (en) | Display apparatus and method of manufacturing the same | |
| TWI495568B (en) | Electronic component devices with pre-debonding function and method for peeling thin film on electronic component | |
| KR20190068641A (en) | Delayed via formation in electronic devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |