CN106154609A - Liquid crystal display panel preparation method - Google Patents
Liquid crystal display panel preparation method Download PDFInfo
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- CN106154609A CN106154609A CN201510165241.6A CN201510165241A CN106154609A CN 106154609 A CN106154609 A CN 106154609A CN 201510165241 A CN201510165241 A CN 201510165241A CN 106154609 A CN106154609 A CN 106154609A
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Abstract
A kind of liquid crystal display panel preparation method, including: form multiple sept and framework on the first surface reprinting plate and the second reprinting plate respectively；In vacuum cavity, reprint plate by first and first substrate is adsorbed as being integrally formed first substrate group, reprint plate by second and second substrate is adsorbed as being integrally formed second substrate group；Form thin film transistor (TFT) array on the first substrate, second substrate is formed chromatic filter layer；Make tft array staggered relatively with chromatic filter layer the reversion of first substrate group, and frame glue and filling liquid crystal are set between first substrate group and second substrate group and the two is fitted into one；Utilize cut the first framework so that the first reprinting plate is separated with first substrate, cut the second framework and the first reprinting plate is separated with second substrate, remove the first reprinting plate and second and reprint plate.
Description
Technical field
The present invention relates to a kind of liquid crystal display panel preparation method.
Background technology
In the manufacture process of available liquid crystal display floater, pour into liquid crystal molecule to form display panels by being formed on the glass substrate of tft array and having between the glass substrate of chromatic filter layer.But, in order to meet user to the more lightening demand of product, how to make one of more lightening important topic remaining current industry research of liquid crystal display.
In prior art, Fluohydric acid. (HF) and glass is utilized to produce the chemical reaction thickness with reduction glass substrate, to realize glass substrate thinning.Owing to Fluohydric acid. is irritant liquid, easily environment is impacted.Meanwhile, processing procedure cannot ensure the planarization of glass baseplate surface, reduce the yield of product and relatively costly.
Summary of the invention
In view of this, it is necessary to provide a kind of and reduce processing procedure complexity and the most lightening liquid crystal display panel preparation method.
A kind of liquid crystal display panel preparation method, it includes step:
A) the first surface reprinting plate forms multiple first sept and first framework, and forms multiple second sept and second framework on the second surface reprinting plate；
B) in vacuum cavity, reprint plate by first and first substrate is mutually adsorbed as integrally to form first substrate group, in vacuum cavity, reprint plate by second and second substrate is mutually adsorbed as one to form second substrate group；
C) form thin film transistor (TFT) array at first substrate away from the first side reprinting plate, form chromatic filter layer at second substrate away from the second side reprinting plate；
D) make tft array and chromatic filter layer staggered relatively the first substrate group reversion forming tft array, and frame glue and filling liquid crystal are set between first substrate group and second substrate group and the two is fitted into one；
E) utilize cut the first framework so that the first reprinting plate is separated with first substrate, utilize cut the second framework so that the first reprinting plate is separated with second substrate, remove the first reprinting plate and second and reprint plate to form display panels.
Compared with prior art, first substrate and second substrate that the application directly uses thickness to be 0.2mm manufacture display panels, by at first turn of carrier for bearing first substrate second turn of carrier for bearing second substrate to strengthen first substrate and the intensity of second substrate, avoid first substrate and second substrate the most damaged, it is ensured that first substrate and the profile pattern of second substrate also reduce the complexity of manufacturing process.
Accompanying drawing explanation
Fig. 1 is the LCD board manufacturing method of the first embodiment and his like Cheng Tu.
Fig. 2 to Fig. 4 is the schematic diagram of each step counter structure in Fig. 1.
Fig. 5 be in Fig. 4 first substrate group and second substrate group along the cut-away view in V-V direction.
Fig. 6 is the schematic diagram of the spacer structures of the second embodiment in Fig. 2.
Fig. 7 is the schematic diagram of the spacer structures of the 3rd embodiment in Fig. 2.
Fig. 8 is the LCD board manufacturing method of the second embodiment and his like Cheng Tu.
Fig. 9 to Figure 11 is the schematic diagram of each step counter structure in Fig. 8.
Figure 12 be in Figure 11 first substrate group and second substrate group along the cut-away view in XI-XI direction.
Main element symbol description
| Liquid crystal display panel preparation method | S11 ~ S15, S81-S87 |
| Display panels | 10,70 |
| First reprints plate | 11,71 |
| First sept | 12,52,62,72 |
| First framework | 13,73 |
| Second reprints plate | 21,81 |
| Second sept | 22,82 |
| Second framework | 23,83 |
| First substrate | 14,74 |
| Second substrate | 24,84 |
| First substrate group | 16,76 |
| Second substrate group | 26,86 |
| Thin film transistor (TFT) array | 17,77 |
| Chromatic filter layer | 27,87 |
| First bonding frame | 78 |
| Second bonding frame | 88 |
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Seeing also Fig. 1 to Fig. 5, it is the flow chart of display panels 10 manufacture method of a kind of better embodiment.Fig. 2-Fig. 4 is the structural representation that each process step shown in Fig. 1 is corresponding, Fig. 5 be in Fig. 4 first substrate group 16 and second substrate group 26 along the cut-away view in V-V direction.In the present embodiment, display panels 10 is thin film transistor (TFT) (TFT-LCD) panel.In other alternative embodiments, display panels 10 is alternatively active-matrix Organic Light Emitting Diode (AMOLED) panel.
Step S11, forms multiple first sept 12 and first framework 13, and forms multiple second sept 22 and second framework 23 on the second surface reprinting plate 21 on the first surface reprinting plate 11.Multiple first septs 12 are positioned at the first framework 13, and arranged in arrays；Multiple second septs 22 are positioned at the second framework 23, and arranged in arrays.Wherein, the first sept 12 and the first framework 13 utilize mask to carry out photoetching (photolithography) and one-body molded；Second sept 22 and the second framework 23 utilize mask to carry out photoetching (photolithography) and one-body molded.First framework 13 is smooth and smooth surface away from the first surface reprinting plate 11, and the second framework 23 is smooth and smooth surface away from the second surface reprinting plate 21.First sept 12 and the second sept 22 are the most substantially in rectangular-shaped solid construction.First framework 13 is identical with the second framework 23 structure, and the first sept 12 is identical with the second sept 22 structure.In the present embodiment, the first reprinting plate 11 and the second reprinting plate 21 are transparency glass plate.In other alternative embodiments, the shape of the first sept 12 and the second sept 22 can be different；First sept 12 and the second sept 22 can arrange in non-matrix formula.
Step S12, reprints plate 11 by first in vacuum cavity and first substrate 14 is mutually adsorbed as integrally to form first substrate group 16, reprints plate 21 by second and second substrate 24 is mutually adsorbed as one to form second substrate group 26 in vacuum cavity.Preferably, the thickness of first substrate 14 and second substrate 24 is 0.1 ~ 0.3mm.In the present embodiment, the thickness of first substrate 14 and second substrate 24 is 0.2mm.
Specifically, plate 11 and first substrate 14 para-position is reprinted by first in cavity, cavity is evacuated so that the first reprinting plate 11 and first substrate 14 are mutually adsorbed as one to form first substrate group 16, and reprint plate 21 and second substrate 24 para-position by second in cavity, cavity is evacuated so that the second reprinting plate 21 and second substrate 24 are mutually adsorbed as one to form second substrate group 26.Wherein, the first framework 13 coordinates formation vacuum in first substrate group 16 for reprinting plate 11 and first substrate 14 with first；First sept 12 provides even support power for reprinting when plate 11 is adsorbed as one with first substrate 14 first to first substrate 14.Second framework 23 coordinates formation vacuum in second substrate group 26 for reprinting plate 21 and second substrate 24 with second.Second sept 22 provides even support power for reprinting when plate 21 is adsorbed as one with second substrate 24 second to second substrate 24.Air pressure outside first substrate group 16 is more than the air pressure within first substrate group 16, so that the first reprinting plate 11 and first substrate 14 are adsorbed as one；Air pressure outside second substrate group 26 is more than the atmospheric pressure within second substrate group 26, so that the second reprinting plate 21 and second substrate 24 are adsorbed as one.In the present embodiment, complete para-position in the cavity that first substrate group 16 is different at two respectively with second substrate group 26 to combine.In other alternative embodiments, first substrate group 16 can complete para-position in identical cavity and combine with second substrate group 26.
Step S13, thin film transistor (TFT) (thin film transistor is formed away from the first side reprinting plate 11 at first substrate 14, TFT) array 17, form colorized optical filtering (color filter, CF) layer 27 at second substrate 24 away from the second side reprinting plate 21.
Step S14, make tft array 17 staggered relatively with the chromatic filter layer 27 on second substrate 24 the first substrate 14 groups reversion forming tft array 17, and between first substrate group 16 and second substrate group 26, arrange frame glue and filling liquid crystal and the two fits into one, thus obtain reprinting the display panels 10 between plate 21 at this first reprinting plate 11 and second.
Step S15, so that the first reprinting plate 11 is separated with first substrate 14 in utilizing cut the first framework 13 to make air enter first substrate group 16, so that the first reprinting plate 11 is separated with second substrate 24 in utilizing cut the second framework 23 to make air enter second substrate group 26, remove the first reprinting plate 11 and second and reprint plate 21 to obtain this display panels 10.In the present embodiment, the position that between two the first septs 12 of cut the first framework 13 and arbitrary neighborhood, space is relative is utilized；Utilize the position that between two the second septs 22 of cut the second framework 23 and arbitrary neighborhood, space is relative.
As shown in Figure 6, it is the first sept 52 structure of the second embodiment.Wherein, the first sept 52 is circular solids structure.
As it is shown in fig. 7, the first sept 62 structure that it is the 3rd embodiment.Wherein, the first sept 62 is the circular ring structure of hollow.
Seeing also Fig. 8 to Figure 12, it is the flow chart of manufacture method of display panels 70 of the second embodiment.Fig. 9-Figure 11 is the structural representation that each process step shown in Fig. 8 is corresponding, Figure 12 be in Figure 11 first substrate group 76 and second substrate group 86 along the cut-away view in XI-XI direction.In the present embodiment, display panels 70 is thin film transistor (TFT) (TFT-LCD) panel.In other alternative embodiments, display panels 70 is alternatively active-matrix Organic Light Emitting Diode (AMOLED) panel.
Step S81, forms multiple first sept 72 and first framework 73, and forms multiple second sept 82 and second framework 83 on the second surface reprinting plate 81 on the first surface reprinting plate 71.Multiple first septs 72 are positioned at the first framework 73, and arranged in arrays；Multiple second septs 82 are positioned at the second framework 83, and arranged in arrays.Wherein, the first sept 72 and the first framework 73 utilize mask to carry out photoetching (photolithography) and one-body molded；Second sept 82 and the second framework 83 utilize mask to carry out photoetching (photolithography) and one-body molded.First framework 73 is smooth and smooth surface away from the first surface reprinting plate 71, and the second framework 83 is smooth and smooth surface away from the second surface reprinting plate 81.First sept 72 and the second sept 82 are the most substantially in rectangular-shaped solid construction.In the present embodiment, the first reprinting plate 71 and the second reprinting plate 81 are transparency glass plate.In other alternative embodiments, the shape of the first sept 12 and the second sept 22 can be different；First sept 12 and the second sept 22 can arrange in non-matrix formula.
Step S82, forms the first bonding frame 78 around the first framework 73, forms the second bonding frame 88 around the second framework 83.In the present embodiment, the first bonding frame 78 and the second bonding frame 88 are high temperature resistant viscose glue, and it can solidify under high temperature or ultraviolet light.
Step S83, reprints plate 71 by first in vacuum cavity and first substrate 74 is mutually adsorbed as integrally to form first substrate group 76, reprints plate 81 by second and second substrate 84 is mutually adsorbed as one to form second substrate group 86 in vacuum cavity.Preferably, the thickness of first substrate 14 and second substrate 24 is 0.1 ~ 0.3mm.In the present embodiment, the thickness of first substrate 74 and second substrate 84 is 0.2mm.
Specifically, in cavity, reprint plate 71 by first and first substrate 74 para-position combines, cavity is evacuated so that the first reprinting plate 71 and first substrate 74 are mutually adsorbed as one to form first substrate group 76, and in cavity, plate 81 and second substrate 84 para-position combination is reprinted by second, cavity is evacuated so that the second reprinting plate 81 and second substrate 84 are mutually adsorbed as one to form second substrate group 86.Wherein, the first framework 73 coordinates formation vacuum in first substrate group 76 for reprinting plate 71 and first substrate 74 with first.First sept 72 provides even support power for reprinting when plate 71 is adsorbed as one with first substrate 74 first to first substrate 74.Second framework 83 coordinates formation vacuum in second substrate group 86 for reprinting plate 81 and second substrate 84 with second.Second sept 82 provides even support power for reprinting when plate 81 is adsorbed as one with second substrate 84 second to second substrate 84.After cavity is carried out evacuation, air pressure outside first substrate group 76 is more than the atmospheric pressure within first substrate group 76, so that the first reprinting plate 71 and first substrate 74 are adsorbed as one, air pressure outside second substrate group 86 is more than the air pressure within second substrate group 86 simultaneously, so that the second reprinting plate 81 and second substrate 84 are adsorbed as one.Then, first substrate group 76 and second substrate group 86 are irradiated by high temperature or ultraviolet light so that the first bonding frame 78 solidifies to improve the attaching compactness between the first reprinting plate 71 and first substrate 74；Second bonding frame 88 solidifies to improve the attaching compactness between the second reprinting plate 81 and second substrate 84.In present embodiment, complete para-position in the cavity that first substrate group 76 is different at two respectively with second substrate group 86 and combine.In other alternative embodiments, first substrate group 76 can complete para-position in identical cavity and combine with second substrate group 86.
Step S84, thin film transistor (TFT) (thin film transistor is formed away from the first side reprinting plate 71 at first substrate 74, TFT) array 77, form colorized optical filtering (color filter, CF) layer 87 at second substrate 84 away from the second side reprinting plate 81.
Step S85, make tft array 77 staggered relatively with the chromatic filter layer 87 in second substrate group 86 first substrate group 76 reversion forming tft array 77, frame glue and filling liquid crystal are set between first substrate group 76 and second substrate group 86 and the two is fitted into one.
Step S86, so that the first reprinting plate 71 is separated with first substrate 74 in utilizing cut the first framework 73 to make air entrance first substrate group 76, so that the second reprinting plate 81 is separated with second substrate 84 in utilizing cut the second framework 83 to make air enter second substrate group 86.In the present embodiment, the position that between two the first septs 72 of cut the first framework 73 arbitrary neighborhood, space is relative is utilized；Utilize the position that between two the second septs 82 of cut the second framework 83 and arbitrary neighborhood, space is relative.
Step S87, utilizes the bonding frame of cut first 78 and the second bonding frame 88, removes the first reprinting plate 71 and second and reprints plate 81 to form display panels 70.In other alternative embodiments, available laser removes whole first bonding frame 78 and the second bonding frame 88.
The LCD panel manufacturing method utilizing the present invention to provide directly uses the first substrate 14,74 and second substrate 24,84 that thickness is 0.2mm, and reprint plate 11 by first, 71 carrying first substrates 14,74 and the second are reprinted plate 21,81 and are carried second substrate 24,84 to strengthen first substrate 14,74 and second substrate 24,84 bearing capacity, it is to avoid first substrate 14,74 and the profile pattern of second substrate 24,84 reduce the complexity of manufacturing process.
Those skilled in the art will be appreciated that; above embodiment is intended merely to the present invention is described; and it is not used as limitation of the invention; as long as within the spirit of the present invention, that is made above example suitably changes and changes all to fall within the scope of protection of present invention.
Claims (11)
1. a liquid crystal display panel preparation method, it includes step:
A) the first surface reprinting plate forms multiple first sept and first framework, and forms multiple second sept and second framework on the second surface reprinting plate；
B) in vacuum cavity, reprint plate by first and first substrate is mutually adsorbed as integrally to form first substrate group, in vacuum cavity, reprint plate by second and second substrate is mutually adsorbed as one to form second substrate group；
C) form thin film transistor (TFT) array at first substrate away from the first side reprinting plate, form chromatic filter layer at second substrate away from the second side reprinting plate；
d)
Make tft array staggered relatively with chromatic filter layer the first substrate group reversion forming tft array, and frame glue and filling liquid crystal are set between first substrate group and second substrate group and the two is fitted into one；
E) utilize cut the first framework so that the first reprinting plate is separated with first substrate, utilize cut the second framework so that the first reprinting plate is separated with second substrate, remove the first reprinting plate and second and reprint plate to form display panels.
2. liquid crystal display panel preparation method as claimed in claim 1, it is characterised in that: this first framework is for cooperatively forming confined space with the first reprinting plate and first substrate；This second framework is for cooperatively forming confined space with the second reprinting plate and second substrate.
3. liquid crystal display panel preparation method as claimed in claim 1, it is characterised in that: this first sept provides even support power for reprinting when plate is adsorbed as one with first substrate first to first substrate；This second sept provides even support power for reprinting when plate is adsorbed as one with second substrate second to second substrate.
4. liquid crystal display panel preparation method as claimed in claim 1, it is characterised in that: this rectangular-shaped solid construction of the first sept.
5. liquid crystal display panel preparation method as claimed in claim 1, it is characterised in that: this first sept is circular solids structure.
6. liquid crystal display panel preparation method as claimed in claim 1, it is characterised in that: this first sept is the circular ring structure of hollow.
7. liquid crystal display panel preparation method as claimed in claim 1, it is characterised in that: this first sept and the first framework utilize mask to carry out photoetching and one-body molded；This second sept and the second framework utilize mask to carry out photoetching and one-body molded.
8. liquid crystal display panel preparation method as claimed in claim 1, it is characterised in that: also included before step b):
Form the first bonding frame around the first framework, form the second bonding frame around the first framework.
9. liquid crystal display panel preparation method as claimed in claim 8, it is characterised in that: this first bonding frame and the second bonding frame are high temperature resistant viscose glue, and it can solidify under high temperature or ultraviolet light.
10. liquid crystal display panel preparation method as claimed in claim 8, it is characterised in that: step e) also includes:
Utilize the bonding frame of cut first and the second bonding frame.
11. liquid crystal display panel preparation methods as claimed in claim 1, it is characterised in that: the thickness range of this first substrate and second substrate is 0.1 ~ 0.3mm.
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| CN201510165241.6A CN106154609A (en) | 2015-04-09 | 2015-04-09 | Liquid crystal display panel preparation method |
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