CN103441087A - Method and device for manufacturing flexible substrate - Google Patents
Method and device for manufacturing flexible substrate Download PDFInfo
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- CN103441087A CN103441087A CN2013102442539A CN201310244253A CN103441087A CN 103441087 A CN103441087 A CN 103441087A CN 2013102442539 A CN2013102442539 A CN 2013102442539A CN 201310244253 A CN201310244253 A CN 201310244253A CN 103441087 A CN103441087 A CN 103441087A
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- base plate
- polymeric layer
- cover body
- hole
- bendable substrate
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laminated Bodies (AREA)
- Electroluminescent Light Sources (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A method and device for manufacturing a flexible substrate includes a base plate, an air blowing device and a first cover. The bottom plate is provided with a through hole, and the through hole is provided with two opposite first ports and a second port. The bottom plate is provided with a fitting area. The second port is located within the conformable region. The blowing device is provided with an air nozzle. The air jet is connected with the first port. The first cover body is arranged on the attaching area and surrounds the second port.
Description
Technical field
This case is about a kind of method and device thereof of making substrate, particularly a kind of method and device thereof of making bendable substrate.
Background technology
The characteristic of bendable substrate deflection, make display no longer be confined to the design on plane, and can have the exterior design of diversification.And bendable substrate is lightweight, thin thickness, be difficult for fragmentation and impact-resistant characteristic, is applicable in the portable products such as mobile phone, personal digital assistant (Personal Digital Assistant, PDA) or notebook computer.In addition, use bendable Substrate manufacture flexible display also to there is the advantage of manufacturing cost.Therefore replace with flexible base plate the new trend that glass substrate has become current flat-panel screens technical development.
In the middle of the process of making bendable substrate, usually bendable substrate need to be disposed on the base plate of a hard, more bendable substrate is carried out to all kinds of technique.For example, carry out film-forming process on bendable substrate, or manufacture thin-film transistor on bendable substrate.Generally speaking, this usually needs to use a temporary sticker, by bendable base plate bonding on the base plate of hard to be processed, then by physical method or chemical method, bendable substrate is peeled off from base plate.
For the mode of using physical method that bendable substrate is peeled off from base plate, if directly bendable substrate is peeled off from base plate, easily because the angle of peeling off is excessive, cause the fracture of circuit on substrate.If through between bendable substrate and base plate, the mode of rolling between bendable substrate and base plate by roller bearing is peeled off bendable substrate from base plate, may be by the surperficial scratch of bendable substrate by roller bearing.
On the other hand, also has a kind of method of bendable substrate being peeled off from base plate by high temperature laser or irradiation.This is that bendable substrate is attached on base plate by an adhesion coating, after completing following process, remove the viscosity of adhesion coating by the mode of the bond (debonding) between high temperature laser or irradiation removal adhesion coating and base plate, break away from from base plate so as to the bendable substrate by completing.This kind of method need to be used expensive laser or irradiation to remove bond equipment, and length consuming time and effect is limited.If the viscosity of adhesion coating is too strong, in the process that bendable substrate is taken off from base plate, also may damage the precision element on bendable substrate.
For the mode of using chemical method that bendable substrate is peeled off from base plate, need to consider the corrosion resistance of base material, this can increase again the complexity in the flexible base plate design, and has further increased the production cost of flexible base plate.On the other hand, the chemical agent used again may be to environment.
Therefore, how to design a kind of method and device thereof of making bendable substrate, to solve in prior art, bendable substrate is difficult for the problem of peeling off from base plate, the problem that need to solve with regard to becoming the designer.
Summary of the invention
In view of above problem, the invention relates to a kind of method and device thereof of making bendable substrate, be difficult for so as to solving bendable substrate in prior art the problem of peeling off from base plate.
For achieving the above object, the invention provides a kind of method of making bendable substrate, its step comprises: the base plate with a polymeric layer is provided, and wherein this base plate has a through hole, and this polymeric layer is positioned on this base plate and covers this through hole; Provide one first cover body to be covered on this polymeric layer; And a gas is provided, this gas flows between this polymeric layer and this base plate from this through hole, and then this polymeric layer is separated with this base plate.
For achieving the above object, the invention provides a kind of method of making bendable substrate, provide the step of this gas to comprise: one second cover body is disposed on this base plate, so that this base plate is between this polymeric layer and this second cover body, and make this through hole be positioned at the scope that this second cover body covers; And this gas is sent between this second cover body and this base plate.
For achieving the above object, the invention provides a kind of method of making bendable substrate, more comprise: provide before this first cover body is covered on this polymeric layer, form a line layer on this polymeric layer.
For achieving the above object, the invention provides a kind of method of making bendable substrate, more comprise: form this polymeric layer on this base plate after, run through the part this polymeric layer, make this through hole run through this base plate and this polymeric layer.
For achieving the above object, the invention provides a kind of method of making bendable substrate, more comprise: after running through this polymeric layer of part, provide a laminating layer to fit on this polymeric layer, and cover this through hole.
For achieving the above object, the invention provides a kind of method of making bendable substrate, form the step of this polymeric layer on this base plate in this, this polymeric layer of part is inserted this through hole.
For achieving the above object, the invention provides a kind of method of making bendable substrate, more comprise: before this gas is provided, provide a microscope carrier to be arranged under this base plate, this microscope carrier has a thimble; This thimble is stretched into to this through hole and withstands this polymeric layer, this polymeric layer is separated with this bottom parts; And remove this thimble.
For achieving the above object, the invention provides a kind of method of making bendable substrate, more be included in this polymeric layer of formation and seal this through hole before.
For achieving the above object, the invention provides a kind ofly for making the device of bendable substrate, it comprises: a base plate, there is a through hole, this through hole has two relative the first port and one second ports, and this base plate has a conformable region, and this second port is positioned at this conformable region; One blowning installation, have a puff prot, and this puff prot is connected with this first port; And one first cover body, be disposed on this conformable region, and this first cover body is around this second port.
For achieving the above object, the invention provides a kind ofly for making the device of bendable substrate, more comprise a microscope carrier and be arranged under this base plate, this microscope carrier has a thimble, and this thimble is to should through hole.
For achieving the above object, the invention provides and a kind ofly for making the device of bendable substrate, more comprise a movable mechanism, be positioned at a side of this base plate, this movable mechanism has a fixture.
Method and the device thereof of the bendable substrate of making provided according to the embodiment of the present invention, owing to being by passing into gas flow between polymeric layer and base plate, so that polymeric layer is separated with base plate.Therefore in the time of can avoiding polymeric layer to separate with base plate, the fracture of circuit or polymeric layer surface damage on polymeric layer.And the pressure versus flow of size, number and injection gas by adjusting the base plate through hole, can regulate and control the required disengaging time of polymeric layer and base plate.Therefore be able to more simply polymeric layer be separated from base plate, and solved bendable substrate in the prior art, be difficult for the problem of peeling off from base plate.
The explanation of the above explanation about content of the present invention and following execution mode is in order to demonstration and explain principle of the present invention, and provides patent claim of the present invention further to explain.
The accompanying drawing explanation
Figure 1A is the end view according to the device of the bendable substrate of the disclosed making of one embodiment of the invention;
Figure 1B is the end view according to the device of the bendable substrate of the disclosed making of another embodiment of the present invention;
Fig. 1 C is the end view according to the device of the bendable substrate of the disclosed making of another embodiment of the present invention;
Fig. 1 D is the end view according to the device of the bendable substrate of the disclosed making of another embodiment of the present invention;
Fig. 1 E is the end view according to the device of the bendable substrate of the disclosed making of one embodiment of the invention;
Fig. 2 is the flow chart according to the method for the bendable substrate of the disclosed making of one embodiment of the invention;
Fig. 3 A to Fig. 3 F is the structure side view of step S101 to S106 in difference corresponding diagram 2;
The vertical view that Fig. 3 G is Fig. 3 F;
The structure side view that Fig. 3 H is step S107 in corresponding diagram 2;
Fig. 3 I is the bendable substrate that completes according to the flow process of Fig. 2 and the structure side view of base plate thereof;
Fig. 4 is the flow chart according to the method for the bendable substrate of the disclosed making of another embodiment of the present invention;
Fig. 5 A to Fig. 5 D is the structure side view of step S201 to S204 in difference corresponding diagram 4;
The vertical view that Fig. 5 E is Fig. 5 D;
Fig. 5 F to Fig. 5 H is the structure side view of step S205 to S207 in difference corresponding diagram 4;
Fig. 5 I is the bendable substrate that completes according to the flow process of Fig. 4 and the structure side view of base plate thereof;
Fig. 6 A is the end view according to the device of the bendable substrate of the disclosed making of one embodiment of the invention;
Fig. 6 B is the end view according to the device of the bendable substrate of the disclosed making of another embodiment of the present invention;
Fig. 7 is the flow chart according to the method for the bendable substrate of the disclosed making of another embodiment of the present invention;
Fig. 8 A to Fig. 8 K is the structure side view of step S301 to S311 in difference corresponding diagram 7;
Fig. 8 L is the bendable substrate that completes according to the flow process of Fig. 7 and the structure side view of base plate thereof;
Fig. 9 A is the flow chart according to the method for the bendable substrate of the disclosed making of another embodiment of the present invention;
The structure side view that Fig. 9 B is step S402 in corresponding diagram 9A;
Fig. 9 C is the bendable substrate that completes according to the flow process of Fig. 9 A and the structure side view of base plate thereof.Wherein, Reference numeral:
10,10a～10d makes the device of bendable substrate
11 base plates 111,111a through hole
1111,1111a the first port 1112,1112a the second port
112 conformable region 12 blowning installations
121 puff prot 13 first cover bodies
131 first perforate 14 air extractors
141 bleeding point 15 second cover bodies
151 second perforate 16 movable mechanisms
161 fixture 20 polymeric layers
30 line layer 40 laminating layers
50 make device 51 base plates of bendable substrate
511 plate body 5,111 first openings
512 release layer 5,121 second openings
513 through hole 5,131 first ports
5132 second port 514 conformable regions
52 blowning installation 521 puff prots
53 first cover body 531 first perforates
54 air extractor 541 bleeding points
55 second cover body 551 second perforates
56 microscope carriers 561, the 561 ' first thimble
562, the 562 ' second thimble 60 polymeric layers
70 line layer 80 laminating layers
Embodiment
Below describe detailed features of the present invention and advantage in detail in execution mode, its content is enough to make any those skilled in the art understand technology contents of the present invention and implement according to this, and, according to the disclosed content of this specification, claim and accompanying drawing, any those skilled in the art can understand purpose and the advantage that the present invention is relevant easily.Following embodiment further describes viewpoint of the present invention, but non-to limit anyways category of the present invention.
In the following description, the first, second, third, etc. wording used is different elements, composition, the zone of distinguishing in accompanying drawing.These wordings are not in order to limiting element, composition, zone.That is to say, without departing from the spirit and scope of the present invention, the first element of narrating, the first composition, first area can be also that the second element, second forms, second area.
At first, refer to Figure 1A, Figure 1A is the end view according to the device of the bendable substrate of the disclosed making of one embodiment of the invention.Make the device 10 of bendable substrate, comprise base plate 11, blowning installation 12 and the first cover body 13.
The first cover body 13 is disposed at the conformable region 112 of base plate 11 in separable mode, and the first cover body 13 is around the second port one 112.That is to say, the second port one 112 of through hole 111 has been contained in the first cover body 13 orthographic projections in the zone of base plate 11.
Then refer to Figure 1B, Figure 1B is the end view according to the device of the bendable substrate of the disclosed making of another embodiment of the present invention.Because the embodiment of Figure 1B is similar to the embodiment of Figure 1A, wherein identical label is representing the same or similar element with the embodiment of Figure 1A, therefore only for difference, explains.
In the embodiment of Figure 1B, the device 10a that makes bendable substrate also comprises the first cover body 13, air extractor 14, the second cover body 15 and movable mechanism 16, the first cover bodies 13 and has the first perforate 131, and air extractor 14 has bleeding point 141.Specifically, air extractor 14 for example can comprise an aspiration pump, by bleeding point 141 being connected in to the first perforate 131 of the first cover body 13, gas between the first cover body 13 and base plate 11 can be drawn out of outside the first cover body 13 via the first perforate 131, make a side of base plate 11 tool the second port ones 112 produce negative pressure.
The second cover body 15 is disposed at the side of base plate 11 in contrast to the first cover body 13 in separable mode, and the second cover body 15 is around the first port 1111.That is to say, the first port 1111 of through hole 111 has been contained in the second cover body 15 orthographic projections in the zone of base plate 11.Wherein, the second cover body 15 has the second perforate 151.The puff prot 121 that connects blowning installation 12, can make the gas in blowning installation 12 flow between the second cover body 15 and base plate 11, makes a side of base plate 11 tool the first ports 1111 produce malleation, and then make the relative both sides of base plate 11 produce pressure differential.
It is noted that, air extractor 14, the second cover body 15 and movable mechanism 16 are non-in order to limit the present invention.Refer to Fig. 1 C to Fig. 1 E, Fig. 1 C to Fig. 1 E is respectively the end view according to the device of the bendable substrate of the disclosed making of other embodiments of the invention.In the embodiment of Fig. 1 C, the device 10b that makes bendable substrate can not comprise air extractor 14, and only by blowning installation 12, makes the both sides of base plate 11 produce pressure differential (as shown in Figure 1 C).In the embodiment of Fig. 1 D, the device 10c that makes bendable substrate can not comprise the second cover body 15, and makes the puff prot 121 of blowning installation 12 be directly connected in the first port 1111(as shown in Fig. 1 D).In the embodiment of Fig. 1 E, the device 10d that makes bendable substrate can not comprise movable mechanism 16(as shown in Fig. 1 E).
How then will to introduce with the device 10a of the bendable substrate of making of Figure 1B and make bendable substrate.Please consult Figure 1B, Fig. 2 and Fig. 3 A to Fig. 3 I simultaneously.Fig. 2 is the flow chart according to the method for the bendable substrate of the disclosed making of one embodiment of the invention, Fig. 3 A to Fig. 3 F is the structure side view of step S101 to S106 in difference corresponding diagram 2, the vertical view that Fig. 3 G is Fig. 3 F, the structure side view that Fig. 3 H is step S107 in corresponding diagram 2, Fig. 3 I is the bendable substrate that completes according to the flow process of Fig. 2 and the structure side view of base plate thereof.
At first, provide a base plate 11, and form a polymeric layer 20(S101 on base plate 11) (as shown in Figure 3A).Base plate 11 is such as but not limited to a glass baseplate, and polymeric layer 20 is in order to make a bendable substrate.Wherein, the material of polymeric layer 20 is for example Merlon (polycarbonate, PC), polyimides (polyimide, PI), polyether sulfone (polyether sulfone, PES), polyacrylate (poly acrylate, PAR), Polyethylene Naphthalate (polyethylene naphthalate, PEN), PETG (polyethylene terephthalate, PET), non-crystalline type TPO (amorphous polyolefine, APO), cyclic olefine copolymer (MetallocenebasedCyclicOlefinCopolymer, mCOC), polymethyl methacrylate (Polymethacrylate, PMMA) or organic/inorganic composite material.In the present embodiment, the thickness of base plate 11 is between 10～800 microns (micrometer, μ m).In other embodiment of part, the thickness of base plate 11 is between 50～500 microns.In other embodiment of part, the thickness of base plate 11 is between 100～250 microns.Wherein, polymeric layer 20 flexible is greater than the flexible of base plate 11.
In the present embodiment and other embodiment of part, be that the mode of for example utilizing rotary coating (spin coating), slot coated or scraper plate to smear (blade coating) forms the polymer of one deck liquid state at base plate 11, then make polymer cure be formed at the surface of base plate 11 by the mode of natural air drying or heated baking.In other embodiment of part, can directly a polymer be attached to base plate 11.Specifically, the mode that can fit or be coated with is after base plate 11 forms a release layer (not illustrating), again a polymer is attached to base plate 11 and forms polymeric layer 20, and make polymeric layer 20 be attached at base plate 11 by release layer, make polymeric layer 20 there is good release effect, and good release effect refers to when release layer with after another base material contacts, be difficult for sticking with another base material and there is good separating effect.Wherein, the material of release layer is for example a polymeric silicon (being for example siloxane polymer), an organic polymer (being for example polyethylene, polyvinyl chloride, polymethyl methacrylate, polyethylene terephthalate), a metal (being for example gold, silver, copper, chromium, alloy) or above-mentioned composite material, and release layer can be liquid or solid-state.Excessively strong for fear of the viscosity between base plate 11 and polymeric layer 20, and the difficulty that causes separating base plate 11 and polymeric layer 20 in subsequent treatment, after forming release layer, also can irradiate release layer with ultraviolet light or laser, so as to reducing the viscosity of release layer.Furthermore, the viscosity between release layer and base plate 11 is greater than the viscosity between release layer and polymeric layer 20.Thus, can make polymeric layer 20 be attached at base plate 11 and can not cause base plate 11 to be difficult to separate with polymeric layer 20.In addition, the size of polymeric layer 20 can affect polymeric layer 20 and separates the required time with base plate 11.Generally speaking, the area of polymeric layer 20 is larger needs the time of more growing to separate with base plate 11.
Then, form a through hole 111(S102 who runs through base plate 11 on base plate 11), wherein, through hole 111 does not run through polymeric layer 20(as shown in Figure 3 B).Through hole 111 has with respect to the first port 1111 of base plate 11 1 sides and with respect to the second port one 112 of polymeric layer 20 1 sides.In the present embodiment and other embodiment of part, be that the mode by abnormity cutting (Abnormity Cutting) gets out through hole 111 on base plate 11, yet the mode that forms through hole 111 is not in order to limit the present invention.Wherein, quantity and the position of above-mentioned through hole 111 all can be changed according to actual demand when implementing.For example, can offer respectively a through hole at the dual-side of base plate 11, or offer respectively a through hole in four corners of base plate 11.Generally speaking, the quantity of through hole 111 is more, and polymeric layer 20 separates the required time with base plate 11 shorter.
Then, in the present embodiment and other embodiment of part, also can on polymeric layer 20, form a line layer 30(S103) (as shown in Figure 3 C).Wherein, line layer 30 comprises a transparency electrode array, the circuit of usining as bendable substrate, and through hole 111 is positioned at outside the transparency electrode array.Form the technique of line layer 30 such as but not limited to a thin-film transistor technique (Thin Film Transistors, TFT).It is noted that, form line layer 30 not in order to limit the present invention on polymeric layer 20.
Then, one first cover body 13 is disposed to (S104) on polymeric layer 20.Wherein, the first cover body 13 have run through the first cover body 13 one first perforate 131(as shown in Figure 3 D).Whereby, polymeric layer 20 is clipped between the first cover body 13 and base plate 11, and the second port one 112 be positioned at 13 of the first cover bodies around scope.That is to say, the second port one 112 of through hole 111 has been contained in the first cover body 13 orthographic projections in the zone of base plate 11.By the first cover body 13 is disposed on polymeric layer 20, and make between polymeric layer 20 and the first cover body 13, define one first space S 1, the first space S 1 and be connected with through hole 111.
In the present embodiment and other embodiment of part, also one second cover body 15 can be disposed to (S105) on base plate 11.Wherein, the second cover body 15 have run through the second cover body 15 one second perforate 151(as shown in Fig. 3 E).Whereby, make base plate 11 between polymeric layer 20 and the second cover body 15, and the first port 1111 be positioned at 15 of the second cover bodies around scope.That is to say, the first port 1111 of through hole 111 has been contained in the second cover body 15 orthographic projections in the zone of base plate 11.And defining a second space S2 between base plate 11 and the second cover body 15, second space S2 is connected with through hole 111 and the second perforate 151.
It is noted that, in the present embodiment and other embodiment of part, be first the first cover body 13 to be disposed to polymeric layer 20, then the second cover body 15 is disposed to base plate 11.In other embodiment of part, also can first the second cover body 15 be disposed to base plate 11, then the first cover body 13 is disposed to polymeric layer 20.The first cover body 13 is disposed to polymeric layer 20 and the second cover body 15 is disposed to the sequencing of base plate 11 not in order to limit the present invention.In addition, if make bendable substrate with the device of the bendable substrate of making of Figure 1A, Fig. 1 D, can install the second cover body 15 and make bendable substrate.
Finally, from through hole 111 input one gases (S106) (as shown in Fig. 3 F).Wherein, between gas and base plate 11, polymeric layer 20, be difficult for being reacted, gas is for example air, nitrogen or argon gas, and the kind of gas is not in order to limit the present invention.Specifically, by for example 12 pairs of the second perforates 151 of a blowning installation, be blown into gas, gas is flowed along a path A.See also Fig. 3 G, due to the first cover body 13, can push down polymeric layer 20 gas is flowed along directions X for example, and be unlikely, make gas concentrate on the second port one 112 places, cause gas pressure excessive and cause polymeric layer 20 broken holes.On the other hand, because the second cover body 15 is disposed at base plate 11, and the second cover body 15 is around the first port 1111 of through hole 111, thereby the second cover body 15 can be avoided gas, and before entering through hole 111, via the gap between the second cover body 15 and base plate 11, loss goes out outside the second cover body 15.
Be blown into gas by 12 pairs of the second perforates 151 of blowning installation, after gas is flowed along path A, gas can enter second space S2 via the second perforate 151 along path A, and flow into through hole 111 via the first port 1111, then flow between polymeric layer 20 and base plate 11 via the second port one 112.Because 12 pairs of the second perforates 151 of blowning installation are blown into gas, make second space S2 produce malleation, make the relative both sides of polymeric layer 20 produce pressure differential, and then polymeric layer 20 and base plate 11 are separated.Specifically, the pressure differential that gas produces polymeric layer 20 both sides is larger, and polymeric layer 20 separates the required time with base plate 11 just shorter.
In order to improve the separative efficiency with base plate 11 by polymeric layer 20, in the present embodiment and other embodiment of part, also can make the first space S 1 form the space of a tool negative pressure.Specifically, can extract a gas out from the first perforate 131 by a for example air extractor 14, gas is pulled out from the first space S 1 along a path B.Because the first cover body 13 is disposed on polymeric layer 20, and the first cover body 13 is around the second port one 112 of through hole 111.Therefore, gas is mainly from the first space S 1, to be pulled out via the first perforate 131 along path B, and makes polymeric layer 20 produce negative pressure away from a side of base plate 11 (that is with respect to polymeric layer 20 side near base plates 11).Can increase again whereby the active force of an isolating polymer layer 20 and base plate 11, and then improve the separative efficiency with base plate 11 by polymeric layer 20.
In addition, because the first cover body 13 can be pushed down polymeric layer 20, thereby at gas when through hole 111 enters between polymeric layer 20 and base plate 11, enter polymeric layer 20 and base plate 11 gas uniform, but not only for example concentrate, via specific direction (direction X) and flow out between autohemagglutination compound layer 20 and base plate 11.If gas only concentrates the gap between autohemagglutination compound layer 20 and base plate 11 via specific direction to flow out, this can make between polymeric layer 20 and base plate 11 only has part to separate, that is the polymeric layer 20 of part still is attached on base plate 11, thereby separating effect is not good.In the present embodiment, due to gas uniform enter the gap between polymeric layer 20 and base plate 11, therefore, when gas leaves the gap between polymeric layer 20 and base plate 11, gas can separate polymeric layer 20 with base plate 11 equably fully.On the other hand, due to second port one 112 of the first cover body 13 around through hole 111, therefore between gas inflow polymeric layer 20 and base plate 11, while causing polymeric layer 20 to be heaved towards the first cover body 13, the first cover body 13 height that also but limit polymerization thing layer 20 is heaved, with the quality after guaranteeing polymeric layer 20 and base plate 11 separating.Furthermore, can be by shortening distance B 1(between the first cover body 13 and polymeric layer 20 as shown in Fig. 3 F) reduce the height that polymeric layer 20 is heaved.
In the present embodiment and other embodiment of part, can also polymeric layer 20 be separated with base plate 11 by movable mechanism 16.Specifically, first remove the first cover body 13, the second cover body 15, then make fixture 161 move to base plate 11 tops by movable mechanism 16, make fixture 161 clampings break away from the edge (S107) (as shown in Fig. 3 H) of the polymeric layer 20 on base plate 11 surfaces.Wherein, can control fixture 161 by movable mechanism 16 and move or make the speed of fixture 161 away from base plate 11 towards base plate 11, and then control fixture 161 and make polymeric layer separate the applied force amount with base plate 11, destroy polymeric layer 20 when avoiding polymeric layer 20 to separate with base plate 11 because the strength applied is excessive.By movable mechanism 16, the automated job of fixture 161 is clamped and break away from the edge of the polymeric layer 20 on base plate 11 surfaces, can improve again the separative efficiency with base plate 11 by polymeric layer 20, and then promote the efficiency of manufacturing bendable substrate.
In the present embodiment, polymeric layer 20 is separated to the required time to be less than 10 seconds with base plate 11, in part embodiment, separate the required time to be less than 5 seconds.And, pressure differential between the first cover body 13 and the second cover body 15 is that 0.01 holder (torr) is between 1000 holders, and the speed that passes into gas from blowning installation between 0.01 ml/min (mL/min) between 100 ml/min, and the required gas passed into is less than 10 milliliters.With the substrate of 65 inch, only need to use the gas that is less than 10 milliliters can in 10 seconds, make polymeric layer 20 separate with base plate 11.
Then, at polymeric layer 20 and base plate 11 after separatings, then make fixture 161 away from base plate 11 by movable mechanism 16, can complete prepare (as shown in Fig. 3 I) of bendable substrate.
Next refer to Figure 1B, Fig. 4 and Fig. 5 A to Fig. 5 I, Fig. 4 is the flow chart according to the method for the bendable substrate of the disclosed making of another embodiment of the present invention, Fig. 5 A to Fig. 5 D is the structure side view of step S201 to S204 in difference corresponding diagram 4, the vertical view that Fig. 5 E is Fig. 5 D, Fig. 5 F to Fig. 5 H is the structure side view of step S205 to S207 in corresponding diagram 4 respectively, the bendable substrate that Fig. 5 I completes for the flow process according to Fig. 4 and the structure side view of base plate thereof.Because the embodiment of Fig. 4 and Fig. 5 A to Fig. 5 I is similar to the embodiment of Fig. 2, Fig. 3 A to Fig. 3 H, wherein identical label is representing and the same or similar element of embodiment of Fig. 2, Fig. 3 A to Fig. 3 H, therefore only for different locating, explains.
At first, provide a base plate 11, and form a polymeric layer 20(S201 on base plate 11) (as shown in Figure 5A).Wherein, polymeric layer 20 flexible is greater than the flexible of base plate 11.
Then, form a through hole 111a(S202 who runs through base plate 11 on base plate 11).Wherein, through hole 111a runs through base plate 11 and polymeric layer 20.Through hole 111a has with respect to one first port 1111a of base plate 11 1 sides and with respect to one second port one 112a(of polymeric layer 20 1 sides as shown in Figure 5 B).It is noted that, through hole 111a should avoid the viewing area after polymeric layer 20 is made bendable substrate, and after avoiding that polymeric layer 20 is made to bendable substrate, the function of demonstration can't be carried out in the Zhong You subregion, viewing area of bendable substrate.
Then, a laminating layer 40 is disposed to (S203) on polymeric layer 20.Specifically, laminating layer 40 laminating and cover through hole 111a with respect to the second port one 112a(of polymeric layer 20 1 sides as shown in Figure 5 C).In the present embodiment and other embodiment of part, laminating layer 40 is an adhesive tape or a baffle plate, but is not limited to this.
Then, in the present embodiment and other embodiment of part, also can on polymeric layer 20, form a line layer 30(S204) (as shown in Figure 5 D).Wherein, line layer 30 comprises a transparency electrode array, the circuit of usining as bendable substrate, and through hole 111a is positioned at (as shown in Fig. 5 E) outside the transparency electrode array.Form the technique of line layer 30 such as but not limited to a thin-film transistor technique.It is noted that, form line layer 30 not in order to limit the present invention on polymeric layer 20.
Then, one first cover body 13 is disposed to polymeric layer 20(S205).Wherein, the first cover body 13 have run through the first cover body 13 one first perforate 131(as shown in Fig. 5 F).Whereby, polymeric layer 20 is clipped between the first cover body 13 and base plate 11, and the second port one 112a of the through hole 111a covered by laminating layer 40 be positioned at 13 of the first cover bodies around scope.That is to say, the second port one 112a of through hole 111a has been contained in the first cover body 13 orthographic projections in the zone of base plate 11.By the first cover body 13 is disposed on polymeric layer 20, and make between polymeric layer 20 and the first cover body 13, define one first space S the 1 ', the first space S 1 ' and be connected with the first perforate 131.
In the present embodiment and other embodiment of part, also one second cover body 15 can be disposed to base plate 11(S206).Wherein, the second cover body 15 have run through the second cover body 15 one second perforate 151(as shown in Fig. 5 G).Whereby, make base plate 11 between polymeric layer 20 and the second cover body 15, and the first port 1111a of through hole 111a be positioned at 15 of the second cover bodies around scope.That is to say, the first port 1111a of through hole 111a has been contained in the second cover body 15 orthographic projections in the zone of base plate 11.And defining a second space S2 ' between base plate 11 and the second cover body 15, second space S2 ' is connected with through hole 111a and the second perforate 151.
It is noted that, in the present embodiment and other embodiment of part, be first laminating layer 40 to be disposed to polymeric layer 20, then the first cover body 13 is disposed to polymeric layer 20, then the second cover body 15 is disposed to base plate 11.Yet, laminating layer 40 is disposed to polymeric layer 20, the second cover body 15 is disposed to the sequencing of base plate 11 and the first cover body 13 is disposed to polymeric layer 20, the second cover body 15 is disposed to the sequencing of base plate 11 not in order to limit the present invention.That is to say, in other embodiment of part, can first the second cover body 15 be disposed to base plate 11, then laminating layer 40 is disposed to polymeric layer 20, then the first cover body 13 is disposed to polymeric layer 20.
Finally, input a gas (S207) (as shown in Fig. 5 H) from the first port 1111a of through hole 111a.Specifically, can be blown into a gas by for example 12 pairs of the second perforates 151 of a blowning installation, gas is flowed along a path C.Because the second cover body 151 is disposed at base plate 11, and the second cover body 15 is around the first port 1111a of through hole 111a.Whereby, the second cover body 15 can avoid gas before entering through hole 111a via the gap between the second cover body 15 and base plate 11 outside different second cover body 15 that sheds.
Then, gas can enter second space S2 ' via the second perforate 151 along path C, and flows into through hole 111a via the first port 1111a, then flows between polymeric layer 20 and base plate 11 via the second port one 112a.Because laminating layer 40 covers the second port one 112a, so gas can not leave through hole 111a via the second port one 112a, thereby has good airtight effect.In addition, because the adhesion between laminating layer 40 and polymeric layer 20 is greater than the adhesion between polymeric layer 20 and base plate 11.Therefore, when gas is exerted pressure to base plate 11, this pressure can make base plate 11 and polymeric layer 20 be separated and the state of polymeric layer 20 and laminating layer 40 maintenance laminatings.It is noted that, laminating layer 40 also must have enough structural strengths, leaves through hole 111a to avoid gas to break through laminating layer 40.
In order to improve the separative efficiency with base plate 11 by polymeric layer 20, in the present embodiment and other embodiment of part, can apply a negative pressure to the first space S 1 ' again.Specifically, can extract a gas out from the first perforate 131 by a for example air extractor 14, gas is pulled out from the first space S 1 ' along a path D.Because the first cover body 13 is disposed on polymeric layer 20, and the second port one 112a of through hole 111a be positioned at 13 of the first cover bodies around scope.Therefore, gas is mainly from the first space S 1 ', to be pulled out via the first perforate 131 along path D, and makes polymeric layer 20 produce negative pressure compared to polymeric layer 20 near a side of base plates 11 away from a side of base plate 11.Can increase again whereby the active force of an isolating polymer layer 20 and base plate 11, and then improve the separative efficiency with base plate 11 by polymeric layer 20.
In the present embodiment, due to the second port one 112a of the first cover body 13 around through hole 111a, therefore between gas inflow polymeric layer 20 and base plate 11, while causing polymeric layer 20 to be heaved towards the first cover body 13, but the height that the first cover body 13 limit polymerization thing layers 20 are heaved, with the quality after guaranteeing polymeric layer 20 and base plate 11 separating.Furthermore, can be by shortening distance B 2(between the first cover body 13 and polymeric layer 20 as shown in Fig. 5 H) reduce the height that polymeric layer 20 is heaved.
Finally, the first cover body 13 and the second cover body 15 are removed, and the laminating layer on removing polymer layer 20 40, base plate 11 can be separated with polymeric layer 20 and complete prepare (as shown in Fig. 5 I) of bendable substrate.
Refer to Fig. 6 A, Fig. 6 B, Fig. 6 A is the end view according to the device of the bendable substrate of the disclosed making of one embodiment of the invention, and Fig. 6 B is the end view according to the device of the bendable substrate of the disclosed making of another embodiment of the present invention.Make the device 50 of bendable substrate, comprise a base plate 51, a blowning installation 52, one first cover body 53, an air extractor 54, one second cover body 55 and at least one microscope carrier 56.
The first cover body 53 is disposed at conformable region 514 in separable mode, and the first cover body 53 is around the second port 5132.That is to say, the second port 5132 of through hole 513 has been contained in the first cover body 53 orthographic projections in the zone of base plate 51.
The second cover body 55 is disposed at the side of base plate 51 with respect to the first cover body 53 in separable mode, and the second cover body 55 is around the first port 5131.That is to say, the first port 5131 of through hole 513 has been contained in the second cover body 55 orthographic projections in the zone of base plate 51.Wherein, the second cover body 55 has one second perforate 551 that runs through the second cover body 55.
Next refer to Fig. 6 A, Fig. 7, reach Fig. 8 A to Fig. 8 L, Fig. 7 is the flow chart according to the method for the bendable substrate of the disclosed making of another embodiment of the present invention, Fig. 8 A to Fig. 8 K is the structure side view of step S301 to S311 in corresponding diagram 7 respectively, the bendable substrate that Fig. 8 L completes for the flow process according to Fig. 7 and the structure side view of base plate thereof.Because the embodiment of Fig. 7 and Fig. 8 A to Fig. 8 L is similar to the embodiment of Fig. 2, Fig. 3 A to Fig. 3 I, wherein identical label is representing and the same or similar element of embodiment of Fig. 2, Fig. 3 A to Fig. 3 I, therefore only for difference, explains.
At first, provide a plate body 511(S301), the first opening 5111(that plate body 511 has a consistent threading body 511 is as shown in Figure 8 A).
In the present embodiment and other embodiment of part, a laminating layer 80(S302 can be set on plate body 511).Specifically, laminating layer 80 covers the side (as shown in Figure 8 B) of plate body 511 with respect to the first opening 5111, and laminating layer 80 is such as but not limited to an adhesive tape or a baffle plate.
Then, form a release layer 512(S303 on plate body 511) (as shown in Figure 8 C).
Then, remove laminating layer 80(S304), release layer 512 has one second opening 5121, the second openings 5121 and exposes the first opening 5111 and be connected with the first opening 5111 (as shown in Fig. 8 D).Wherein, plate body 511 is the base plate 51 of composition diagram 6A with release layer 512, and the first opening 5111 and the second opening 5121 are the through hole 513 of composition diagram 6A.The first opening 5111 is away from a side of release layer 512, and the first opening 5111 is the first port 5131 of Fig. 6 A.The second opening 5121 is away from a side of plate body 511, and the second opening 5121 is the second port 5132 of Fig. 6 A.
In the present embodiment and other embodiment of part, be to form release layers 512 in the mode of for example evaporation at plate body 511, and release layer 512 is with after another base material contact, difficult and another base material sticks and has a good separating effect.In the present embodiment, release layer 512 is as for example one removing bond layer (Debonding Layer, DBL).The material of release layer 512 is for example a polymeric silicon (being for example siloxane polymer), an organic polymer (being for example polyethylene, polyvinyl chloride, polymethyl methacrylate, polyethylene terephthalate), a metal (being for example gold, silver, copper, chromium, alloy) or above-mentioned composite material.
Then, base plate 51 is positioned on microscope carrier 56, and makes the first thimble 561 stretch into through hole 513(S305) (as shown in Fig. 8 E).
Then, form a polymeric layer 60(S306 on release layer 512) (as shown in Figure 8 F), the material of polymeric layer 60 is such as but not limited to polyimides.Because the first thimble 561 is matched with through hole 513, thereby the first thimble 561 can be sticked in base plate 51 and can avoid polymeric layer 60 to flow out outside base plate 51 from through hole 513.On the other hand, because not yet curing polymeric layer 60 is liquid, thereby the polymeric layer 60 of part can flow into through hole 513 and be attached to the sidewall of through hole 513.Thus, in follow-up technique, the polymeric layer 60 that flows into through hole 513 can be used as the protective layer of release layer 512, so as to avoiding base plate 51, suffers because of the contact chemical agent that in follow-up technique erosion is even destroyed.Whereby, after the preparation that completes bendable substrate, base plate 51 is also reusable.
Then, in the present embodiment and other embodiment of part, also can on polymeric layer 60, form a line layer 70(S307) (as shown in Fig. 8 G).Wherein, line layer 70 comprises a transparency electrode array, the circuit of usining as bendable substrate, and through hole 513 is positioned at outside the transparency electrode array.Form the technique of line layer 70 such as but not limited to a thin-film transistor technique (Thin Film Transistors, TFT).It is noted that, form line layer 70 not in order to limit the present invention on polymeric layer 60.
Then, after liquid polymer layer 60 solidifies, stretch out the first thimble 561, make the second thimble 562 of microscope carrier 56 stretch into through hole 513(S308), because the height of the second thimble 562 is greater than the height of the first thimble 561, therefore, the second thimble 562 can protrude the second port of through holes 513, and back down the polymeric layer 60 on the second port that is positioned at through hole 513, and make partial polymer layer 60 towards the protuberance of the direction away from base plate 51.Whereby, make polymeric layer 60 separate (as shown in Fig. 8 H) with base plate 51 parts.Thus, can increase again the speed that polymeric layer 60 is separated with base plate 51.In addition, if use the device of the bendable substrate of making of Fig. 6 B, because the cone rate of the second thimble 562 ' is greater than the cone rate of the first thimble 561 ', thereby second thimble 562 ' can stretch into the darker distance of through hole 513 compared to the first thimble 561 ', but therefore the second thimble 562 ' also jack-up flow into the partial polymer layer 60 of through hole 513, and make partial polymer layer 60 towards the protuberance of the direction away from base plate 51.
Then, from microscope carrier 56, take off base plate 51, and one first cover body 53 is disposed to (S309) on polymeric layer 60.Wherein, the first cover body 53 have run through the first cover body 53 one first perforate 531(as shown in Fig. 8 I).Whereby, polymeric layer 60 is clipped between the first cover body 53 and base plate 51, and the second port 5132 be positioned at 53 of the first cover bodies around scope.That is to say, the zone of the second port 5132 orthographic projections of through hole 513 at base plate 51 contained in the first cover body 53 orthographic projections in the zone of base plate 51.And define one first space S 1 between polymeric layer 60 and the first cover body 53 ", the first space S 1 " with through hole 513, be connected.
In the present embodiment and other embodiment of part, also one second cover body 55 can be disposed to (S310) on base plate 51.Wherein, the second cover body 55 have run through the second cover body 55 one second perforate 551(as shown in Fig. 8 J).Whereby, base plate 51 between polymeric layer 60 and the second cover body 55, and the first port 5131 be positioned at 55 of the second cover bodies around scope.That is to say, the zone of the first port 5131 orthographic projections of through hole 513 at base plate 51 contained in the second cover body 55 orthographic projections in the zone of base plate 51.And define a second space S2 between base plate 51 and the second cover body 55 ", second space S2 " with through hole 513 and the second perforate 551, be connected.It is noted that, the first cover body 53 is disposed to polymeric layer 60 and the second cover body 55 is disposed to the sequencing of base plate 51 not in order to limit the present invention.
Finally, from through hole 513 input one gases (S311) (as shown in Fig. 8 K).Wherein, gas is for example air, nitrogen or argon gas, and the kind of gas is not in order to limit the present invention.Specifically, by a for example blowning installation (not illustrating), the second perforate 551 is blown into to gas, gas is flowed along a path E.Because the second cover body 55 is disposed at base plate 51, and the second cover body 55 is around the first port 5131 of through hole 513, therefore but gas enters second space S2 along path E via the second perforate 551 ", and the second cover body 55 also can avoid gas in polymeric layer 60 and loss before base plate 51 separates.And gas can be via the first port 5131 from second space S2 " flow into through hole 513, then flow between polymeric layers 60 and base plate 51 via the first port 5131, the second port 5132.Malleation base plate 51 applied by gas, make the relative both sides of polymeric layer 60 produce pressure differential, and make polymeric layer 60 separate with base plate 51.
In order to improve the separative efficiency with base plate 51 by polymeric layer 60, in the present embodiment and other embodiment of part, also can be again to the first space S 1 " apply a negative pressure.Specifically, can extract a gas out by for example 54 pairs of the first perforates 531 of an air extractor, make gas along a path F and from the first space S 1 " be pulled out.Because the first cover body 53 is disposed on polymeric layer 60, and the second port 5132 of through hole 513 be positioned at 53 of the first cover bodies around scope.Therefore, gas be mainly along path F via the first perforate 531 from the first space S 1 " be pulled out, and make polymeric layer 60 produce negative pressure away from a side of base plate 51.Can increase again whereby the active force of an isolating polymer layer 60 and base plate 51, and then improve the separative efficiency with base plate 51 by polymeric layer 60.
In the present embodiment, due to second port 5132 of the first cover body 53 around through hole 513, therefore between gas inflow polymeric layer 60 and base plate 51, while causing polymeric layer 60 to be heaved towards the first cover body 53, the first cover body 53 height that also but limit polymerization thing layer 60 is heaved, with the quality after guaranteeing polymeric layer 60 and base plate 51 separating.Furthermore, can be by shortening distance B 3(between the first cover body 53 and polymeric layer 60 as shown in Fig. 8 J) reduce the height that polymeric layer 60 is heaved.
Then, the first cover body 53 and the second cover body 55 are removed, and polymeric layer 60 is carried out to the processing of for example trimming in the face of a side of base plate 51, make polymeric layer 60 comparatively smooth in the face of a side of base plate 51, thus, complete prepare (as shown in Fig. 8 L) of bendable substrate.
It is noted that, arrange on plate body after laminating layer and form again release layer 512 not in order to limit the present invention on plate body.Refer to Fig. 6, Fig. 9 A to Fig. 9 C, Fig. 9 A is the flow chart according to the method for the bendable substrate of the disclosed making of another embodiment of the present invention, the structure side view that Fig. 9 B is step S402 in corresponding diagram 9A, Fig. 9 C is the bendable substrate that completes according to the flow process of Fig. 9 A and the structure side view of base plate thereof.Because the present embodiment is similar to Fig. 7, Fig. 8 A to Fig. 8 L, therefore only for different locating, describe.
In the present embodiment, one plate body 511(S401 is being provided) afterwards, can directly plate body 511 be positioned on base station 56, make the first thimble 561 stretch into through hole 513, and form release layer 512(S402 on plate body 511), laminating layer (as shown in Fig. 9 B) in the present embodiment, can not must be set on through hole 513.Yet, in the present embodiment, due to the bond between release layer 512 and polymeric layer a little less than, cause the flaw of polymeric layer for fear of becoming flexible between release layer 512 and polymeric layer in follow-up technique, thereby need to be at release layer 512 corresponding to the regional irradiation of through hole 513 or irradiate laser (S403), so as to improving corresponding to the release layer 512 in the zone of through hole 513 and the bond ability between polymeric layer 60.In addition, step (S404) is similar to step (S310) to the step (S305) of Fig. 7 to step (S409), therefore repeat no more.The bendable substrate completed according to the flow process of Fig. 9 A and the structure side view of base plate thereof are as shown in Fig. 9 C.
Comprehensively above-mentioned, according to method and the device thereof of the bendable substrate of making that provides according to the embodiment of the present invention, owing to being by passing into gas flow between polymeric layer and base plate, so that polymeric layer is separated with base plate.Therefore in the time of can avoiding polymeric layer to separate with base plate, the fracture of circuit or polymeric layer surface damage on polymeric layer.And, by adjusting size, the number of through hole and the pressure of gas of polymeric layer, can regulate and control the required disengaging time of polymeric layer and base plate.Therefore be able to more simply polymeric layer be separated from base plate, and solved bendable substrate in the prior art, be difficult for the problem of peeling off from base plate.
In addition, in the embodiment of part, can be again thimble by microscope carrier polymeric layer is separated with bottom parts.Thus, can promote again the speed that polymeric layer is separated with base plate.
In addition, in the embodiment of part, due to a release layer also being set on base plate, and the release layer of part partly flows into through hole and is adhered to the sidewall of through hole.Thus, the release layer that flows into through hole can be used as the protective layer of base plate, so as to avoiding base plate, suffers that because of the contact chemical agent erosion is even destroyed.Whereby, after the preparation that completes bendable substrate, base plate is also reusable.
In addition, in the embodiment of part, because polymeric layer partly flows into the sidewall that through hole is adhered to through hole.Thus, the polymeric layer that flows into through hole can be used as the protective layer of base plate, so as to avoiding base plate, suffers that because of the contact chemical agent erosion is even destroyed.Whereby, after the preparation that completes bendable substrate, base plate is also reusable.
Although the present invention discloses as above with aforesaid preferred embodiment; so it is not in order to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore scope of patent protection of the present invention is as the criterion with claims.
Claims (11)
1. a method of making bendable substrate, is characterized in that, its step comprises:
A base plate with a polymeric layer is provided, and wherein this base plate has a through hole, and this polymeric layer is positioned on this base plate and covers this through hole;
Provide one first cover body to be covered on this polymeric layer; And
One gas is provided, and this gas flows between this polymeric layer and this base plate from this through hole, and then this polymeric layer is separated with this base plate.
2. the method for the bendable substrate of making as claimed in claim 1, is characterized in that, provides the step of this gas to comprise:
One second cover body is disposed on this base plate, so that this base plate is between this polymeric layer and this second cover body, and makes this through hole be positioned at the scope that this second cover body covers; And
This gas is sent between this second cover body and this base plate.
3. the method for the bendable substrate of making as claimed in claim 1, is characterized in that, more comprises:
Provide before this first cover body is covered on this polymeric layer, form a line layer on this polymeric layer.
4. the method for the bendable substrate of making as claimed in claim 1, is characterized in that, more comprises:
Form this polymeric layer on this base plate after, run through the part this polymeric layer, make this through hole run through this base plate and this polymeric layer.
5. the method for the bendable substrate of making as claimed in claim 4, is characterized in that, more comprises:
After running through this polymeric layer of part, provide a laminating layer to fit on this polymeric layer, and cover this through hole.
6. the method for the bendable substrate of making as claimed in claim 1, is characterized in that, in this, forms the step of this polymeric layer on this base plate, and this polymeric layer of part is inserted this through hole.
7. the method for the bendable substrate of making as claimed in claim 6, is characterized in that, more comprises:
Before this gas is provided, provide a microscope carrier to be arranged under this base plate, this microscope carrier has a thimble;
This thimble is stretched into to this through hole and withstands this polymeric layer, this polymeric layer is separated with this bottom parts; And
Remove this thimble.
8. the method for the bendable substrate of making as claimed in claim 7, is characterized in that, more is included in this polymeric layer of formation and seals this through hole before.
9. one kind for making the device of bendable substrate, it is characterized in that, it comprises:
One base plate, have a through hole, and this through hole has two relative the first port and one second ports, and this base plate has a conformable region, and this second port is positioned at this conformable region;
One blowning installation, have a puff prot, and this puff prot is connected with this first port; And
One first cover body, be disposed on this conformable region, and this first cover body is around this second port.
10. the device of the bendable substrate of making as claimed in claim 9, is characterized in that, more comprises a microscope carrier and be arranged under this base plate, and this microscope carrier has a thimble, and this thimble is to should through hole.
11. the device of the bendable substrate of making as claimed in claim 9, is characterized in that, more comprises a movable mechanism, is positioned at a side of this base plate, this movable mechanism has a fixture.
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| CN201610075960.3A CN105575857B (en) | 2013-03-22 | 2013-06-19 | Method and device for manufacturing flexible substrate |
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| TW102110343A TWI458406B (en) | 2013-03-22 | 2013-03-22 | Method and apparatus for manufacturing flexible substrate |
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| CN104793357A (en) * | 2014-01-17 | 2015-07-22 | 鸿富锦精密工业（深圳）有限公司 | Carrier, thin film transistor array substrate manufacturing method and liquid crystal display panel manufacturing method |
| CN106057707A (en) * | 2016-06-01 | 2016-10-26 | 上海天马微电子有限公司 | Method for separating substrate and bearing panel of electronic device and bearing panel |
| CN106154609A (en) * | 2015-04-09 | 2016-11-23 | 鸿富锦精密工业（深圳）有限公司 | Liquid crystal display panel preparation method |
| CN106379034A (en) * | 2016-10-31 | 2017-02-08 | 东莞市五株电子科技有限公司 | Device for stripping protective film layer of electromagnetic film |
| CN107742618A (en) * | 2017-10-24 | 2018-02-27 | 京东方科技集团股份有限公司 | Preparation method, flexible panel and the display device of flexible panel |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN105575857A (en) | 2016-05-11 |
| CN105575857B (en) | 2019-03-08 |
| CN103441087B (en) | 2016-09-07 |
| TW201438531A (en) | 2014-10-01 |
| TWI458406B (en) | 2014-10-21 |
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