TWI457573B - Probe unit - Google Patents
Probe unit Download PDFInfo
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- TWI457573B TWI457573B TW100141984A TW100141984A TWI457573B TW I457573 B TWI457573 B TW I457573B TW 100141984 A TW100141984 A TW 100141984A TW 100141984 A TW100141984 A TW 100141984A TW I457573 B TWI457573 B TW I457573B
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- probe
- end portion
- plunger
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
本發明係關於一種用以收容導電性探針之探針單元，該導電性探針係在半導體積體電路等之電氣特性檢查進行信號之輸出輸入。The present invention relates to a probe unit for accommodating a conductive probe which is an input and output of a signal for electrical characteristic inspection of a semiconductor integrated circuit or the like.
在IC晶片等半導體積體電路之電氣特性檢查中，係採用對應於該半導體積體電路所具有之外部電極的設置圖案而將複數個導電性探針收容在預定位置之探針單元。探針單元係具備設置有複數個供接觸探針插通之孔部的探針保持具，藉由使該探針保持具所保持之導電性探針之兩端部分別與半導體積體電路及輸出檢查用信號之電路基板之電極接觸，而將半導體積體電路與電路基板之間予以電性連接(參照例如專利文獻1)。In the electrical characteristic inspection of a semiconductor integrated circuit such as an IC chip, a probe unit that accommodates a plurality of conductive probes at predetermined positions in accordance with an arrangement pattern of external electrodes included in the semiconductor integrated circuit is used. The probe unit includes a probe holder provided with a plurality of holes for inserting the contact probes, and the two ends of the conductive probe held by the probe holder are respectively connected to the semiconductor integrated circuit and The electrode of the circuit board on which the signal for inspection is output is in contact with each other, and the semiconductor integrated circuit and the circuit board are electrically connected to each other (see, for example, Patent Document 1).
專利文獻1：日本特開2002-107377號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-107377
然而，近年來在進行汽車之控制系統用半導體等之檢查的情形等中，要求一種可使電流值為10至20A左右之大電流流通的探針。為了因應上述要求，只要使探針之直徑變粗即可。然而，當半導體之電極的最大直徑或間距在1mm以下時，反而會有必須將探針之直徑變細，結果造成容許電容變小之問題。再者，如4端子測定般在1個端子需要有2個探針之檢查時，亦需要細直徑之探針，而不得不減小容許電流。However, in recent years, in the case of performing inspections of semiconductors and the like for control systems for automobiles, a probe that allows a large current having a current value of about 10 to 20 A to flow is required. In order to meet the above requirements, it is only necessary to make the diameter of the probe thick. However, when the maximum diameter or pitch of the electrodes of the semiconductor is 1 mm or less, the diameter of the probe must be made thinner, and as a result, the allowable capacitance becomes small. In addition, when two probes are required for one terminal as in the case of 4-terminal measurement, a probe having a small diameter is required, and the allowable current has to be reduced.
本發明係鑑於上述課題而研創者，其目的在於提供一種可抑制因探針之細直徑化所造成之容許電流之降低的探針單元。The present invention has been made in view of the above problems, and an object of the invention is to provide a probe unit capable of suppressing a decrease in allowable current due to a reduction in diameter of a probe.
為了要解決上述課題，並達成上述目的，本發明之探針單元係具備：複數個大徑探針，其具有第1柱塞、第2柱塞、及線圈狀之彈簧構件，且沿著長度方向伸縮自如，其中，第1柱塞係各自利用導電性材料而形成，且在同軸上具有呈大致針狀之第1前端部及與該第1前端部連接之第1基端部，第2柱塞係在同軸上具有前端指向與前述第1柱塞之前端相反之方向的第2前端部、及前述軸方向之長度比前述第1基端部長之第2基端部，彈簧構件係長度方向之一端部包住前述第1基端部且另一端部包住前述第2基端部，安裝在前述第1及第2柱塞且具有在前述第1柱塞側密捲繞之密捲繞部、及以預定間距在前述第2柱塞側捲繞之疏捲繞部，並且沿著該長度方向伸縮自如；複數個小徑探針，各自利用導電性材料而形成，且具有比前述大徑探針之直徑小的直徑；大徑探針保持具，其具有個別地保持前述複數個大徑探針之複數個大孔部、及直徑比前述大孔部小且與前述複數個大孔部之任一者連通，並且在與前述第2前端部接觸之狀態下收容前述小徑探針之端部的複數個收容孔部，彼此連通之前述大孔部及前述收容孔部之組係在厚度方向貫通；以及小徑探針保持具，在厚度方向貫通設置有在防止脫落之狀態下個別地保持前述複數個小徑探針之複數個小孔部，且該小徑探針保持具係以各小孔部與前述複數個收容孔部之任一者連通之方式積層在前述大徑探針保持具；彼此連通之前述大孔部及前述小孔部之長度方向的中心軸係為不同，在前述複數個小孔部，包含有鄰接之二個小孔部的中心軸間距離比分別對應該二個小孔部之二個大孔部的中心軸間距離小者，前述第2基端部係至少在檢查時之負載施加於小徑探針時，進入前述密捲繞部之內部，再者，本發明之探針單元係在前述發明中，前述第2柱塞之前端係形成與前述大徑探針之長度方向大致正交之平面。In order to solve the above problems and achieve the above object, the probe unit of the present invention includes a plurality of large diameter probes having a first plunger, a second plunger, and a coil-shaped spring member, and along the length The first plunger system is formed of a conductive material, and has a first needle end portion having a substantially needle shape and a first base end portion connected to the first tip end portion coaxially, and second The plunger has a second distal end portion whose distal end is directed in a direction opposite to the front end of the first plunger, and a length of the axial direction that is longer than a second proximal end portion of the first proximal end, and a length of the spring member. One end of the direction encloses the first base end portion and the other end portion encloses the second base end portion, and is attached to the first and second plungers and has a dense roll wound on the first plunger side a winding portion and a sparsely wound portion wound on the second plunger side at a predetermined pitch, and being expandable and contractible along the longitudinal direction; a plurality of small-diameter probes each formed of a conductive material and having a ratio Large diameter probe with a small diameter; large diameter probe holder, a plurality of large hole portions of the plurality of large diameter probes and a diameter smaller than the large hole portion and communicating with any of the plurality of large hole portions, and being in contact with the second front end portion a plurality of accommodating hole portions for accommodating the end portions of the small-diameter probes, and the group of the large-hole portions and the accommodating hole portions that communicate with each other are penetrated in the thickness direction; and the small-diameter probe holder is penetrated in the thickness direction Providing a plurality of small hole portions for individually holding the plurality of small-diameter probes in a state of preventing falling off, and the small-diameter probe holding device is configured by any one of the small hole portions and the plurality of the plurality of receiving hole portions The large-diameter probe holder is laminated in a communication manner; the large-hole portion and the small-hole portion that communicate with each other have different central axes in the longitudinal direction, and the plurality of small holes include two adjacent small The distance between the central axes of the holes is smaller than the distance between the central axes of the two large holes corresponding to the two small holes, and the second base is applied to the small diameter probe at least during the inspection. , into the aforementioned dense winding section , Further, the probe unit of the present invention based on the aforementioned invention, the front end of the train of the second plunger forms a plane substantially perpendicular to the longitudinal direction of the large diameter of the probe.
再者，本發明之探針單元係在前述發明中，前述大徑探針保持具係具備：第1基板，使前述第1柱塞之前端部顯露出地對前述第一柱塞予以保持；以及第2基板，積層在前述第1基板，並且積層在前述小徑探針保持具，以收容前述小徑探針保持具所保持之前述小徑探針之端部。Further, in the probe unit of the present invention, the large-diameter probe holder includes: a first substrate that holds the first plunger before exposing the end portion of the first plunger; And the second substrate is laminated on the first substrate, and is laminated on the small-diameter probe holder to accommodate an end portion of the small-diameter probe held by the small-diameter probe holder.
再者，本發明之探針單元係在前述發明中，前述小徑探針保持具係積層有分別使前述小徑探針之任一方端部顯露出並予以保持的二個基板所構成者。Further, in the probe unit of the present invention, in the above-described small-diameter probe holder, the two layers of the substrate are formed by exposing and holding one end of each of the small-diameter probes.
再者，本發明之探針單元係在前述發明中，前述大徑探針保持具及前述小徑探針保持具係至少與前述大徑探針及/或前述小徑探針接觸之部分具有絕緣性。Furthermore, in the probe unit of the present invention, the large-diameter probe holder and the small-diameter probe holder have at least a portion in contact with the large-diameter probe and/or the small-diameter probe. Insulation.
根據本發明之探針單元，由於藉由在使彼此之軸線偏離之狀態下組合大徑探針與小徑探針而構成一組探針，因此即使在對應於檢查對象之間距窄小化的情形下，亦無須使探針之兩方端部細徑化。因此，可抑制因探針之細徑化所造成之容許電流的降低。According to the probe unit of the present invention, since the large-diameter probe and the small-diameter probe are combined to form a group of probes in a state in which the axes of the axes are shifted from each other, even if the distance between the objects to be inspected is narrowed, In this case, it is not necessary to reduce the diameter of both ends of the probe. Therefore, it is possible to suppress a decrease in the allowable current due to the diameter reduction of the probe.
以下，參照附圖詳細說明用以實施本發明之形態。此外，並非由以下之實施形態來限定本發明者。此外，在以下之說明中參照之各圖係僅為以可理解本發明內容之程度概略性顯示形狀、大小及位置關係。亦即，本發明並非僅限定在各圖中例示之形狀、大小及位置關係。Hereinafter, embodiments for carrying out the invention will be described in detail with reference to the accompanying drawings. Further, the inventors are not limited by the following embodiments. Moreover, each of the drawings referred to in the following description schematically shows the shape, size, and positional relationship only to the extent that the present invention can be understood. That is, the present invention is not limited to the shapes, sizes, and positional relationships exemplified in the respective drawings.
第1圖係顯示本發明之一實施形態之探針單元之主要部分構成的局部剖面圖。第1圖所示之探針單元1係使用在進行作為檢查對象之半導體積體電路之電性特性檢查時的裝置，且將半導體積體電路與將檢查用信號輸出至半導體積體電路之電路基板之間予以電性連接的裝置。探針單元1係具備：複數個大徑探針2，其各自之一端與設置在電路基板之電極接觸；複數個小徑探針3，其各自之一端 與大徑探針2接觸，且另一端與半導體積體電路之電極接觸，並且具有比大徑探針2之直徑小之直徑；大徑探針保持具4，以防止脫落之狀態保持複數個大徑探針2；以及小徑探針保持具5，以防止脫落之狀態保持複數個小徑探針3。Fig. 1 is a partial cross-sectional view showing the configuration of a main part of a probe unit according to an embodiment of the present invention. The probe unit 1 shown in Fig. 1 is a device for performing electrical characteristic inspection of a semiconductor integrated circuit to be inspected, and a semiconductor integrated circuit and a circuit for outputting an inspection signal to a semiconductor integrated circuit. A device for electrically connecting the substrates. The probe unit 1 is provided with: a plurality of large-diameter probes 2, one of which is in contact with an electrode disposed on a circuit board; and a plurality of small-diameter probes 3, one of which is a respective end It is in contact with the large-diameter probe 2, and the other end is in contact with the electrode of the semiconductor integrated circuit, and has a diameter smaller than the diameter of the large-diameter probe 2; the large-diameter probe holder 4 prevents the falling state from being maintained in plural The large diameter probe 2; and the small diameter probe holder 5 hold a plurality of small diameter probes 3 in a state of preventing falling off.
大徑探針2係具備：第1柱塞21，利用導電性材料而形成，且形成大致針狀；屬於彈性構件之彈簧構件22，一端安裝在第1柱塞21，且朝長度方向伸縮自如；及第2柱塞23，安裝彈簧構件22之另一端，且前端指向與第1柱塞21之前端相反之方向。在第1圖所示之狀態下，第1柱塞21、彈簧構件22、及第2柱塞23之長度方向的中心軸係為一致。The large diameter probe 2 includes a first plunger 21 which is formed of a conductive material and has a substantially needle shape, and a spring member 22 which is an elastic member is attached to the first plunger 21 at one end and is expandable and contractible in the longitudinal direction. And the second plunger 23 is attached to the other end of the spring member 22, and the distal end is directed in a direction opposite to the front end of the first plunger 21. In the state shown in Fig. 1, the central axes of the first plunger 21, the spring member 22, and the second plunger 23 in the longitudinal direction are aligned.
第1柱塞21係具備：前端部21a(第1前端部)，具有尖銳端；凸緣部21b，具有比前端部21a之直徑大的直徑；凸柱(boss)部21c，隔著凸緣部21b朝與前端部21a相反之方向突出，形成具有比凸緣部21b之直徑小且比彈簧構件22之內徑略大之直徑的圓柱狀，供彈簧構件22之端部壓入；及呈圓柱狀之基端部21d(第1基端部)，有比凸柱部21c之直徑小且比彈簧構件22之內徑略小之直徑，且進入彈簧構件22之內部。The first plunger 21 includes a distal end portion 21a (first distal end portion) having a sharp end, a flange portion 21b having a diameter larger than a diameter of the distal end portion 21a, and a boss portion 21c interposed by a flange. The portion 21b protrudes in a direction opposite to the front end portion 21a, and has a columnar shape having a diameter smaller than the diameter of the flange portion 21b and slightly larger than the inner diameter of the spring member 22, for pressing the end portion of the spring member 22; The cylindrical base end portion 21d (first base end portion) has a diameter smaller than the diameter of the boss portion 21c and slightly smaller than the inner diameter of the spring member 22, and enters the inside of the spring member 22.
彈簧構件22係具備：疏捲繞部22b，其端部壓入於第2柱塞23之凸柱部23b；及密捲繞部22a，以比疏捲繞部更密接之狀態下捲繞構成彈簧構件22之線材，且其端部被壓入第1柱塞21之凸柱部21c。疏捲繞部22b與密捲繞部 22a係相連接，且彼此之直徑相等。The spring member 22 includes a sparsely wound portion 22b whose end portion is press-fitted into the boss portion 23b of the second plunger 23, and a tightly wound portion 22a that is wound in a state of being closer to the wound portion than the sparsely wound portion. The wire of the spring member 22 is bent into the boss portion 21c of the first plunger 21. Unwinding portion 22b and dense winding portion The 22a series are connected and are equal in diameter to each other.
第2柱塞23係具備：呈圓柱狀之前端部23a(第2前端部)；凸柱部23b，形成具有比前端部23a之直徑小且比彈簧構件22之內徑略大之直徑的圓柱狀，供疏捲繞部22b之端部壓入；及基端部23c(第2基端部)，具有比凸柱部23b之直徑小且比彈簧構件22之內徑略小之直徑，且進入彈簧構件22之內部。前端部23a之外徑係比彈簧構件22之外徑略大。The second plunger 23 includes a cylindrical front end portion 23a (second front end portion), and the boss portion 23b is formed with a cylinder having a diameter smaller than the diameter of the front end portion 23a and slightly larger than the inner diameter of the spring member 22. a shape in which the end portion of the unwinding portion 22b is press-fitted, and a base end portion 23c (second base end portion) having a diameter smaller than the diameter of the stud portion 23b and slightly smaller than the inner diameter of the spring member 22, and Entering the interior of the spring member 22. The outer diameter of the front end portion 23a is slightly larger than the outer diameter of the spring member 22.
此外，在本實施形態中，基端部23c之長度係比基端部21d之長度長，且即使大徑探針2為最大行程，只要在未與第1柱塞21接觸之範圍內，即可任意地設定。此外，在第1圖中形成第2柱塞23之上表面的前端部23a之前端面係為與大徑探針2之長度方向正交之平面，在該平面接觸有小徑探針3。Further, in the present embodiment, the length of the proximal end portion 23c is longer than the length of the proximal end portion 21d, and even if the large diameter probe 2 is at the maximum stroke, as long as it is not in contact with the first plunger 21, Can be set arbitrarily. Further, in the first drawing, the front end portion 23a of the upper surface of the second plunger 23 is formed to have a plane orthogonal to the longitudinal direction of the large-diameter probe 2, and the small-diameter probe 3 is in contact with the plane.
小徑探針3係具備分別具有尖銳端之前端部31及基端部32；以及設置在前端部31及基端部32之間，且直徑比前端部31及基端部32大之凸緣部33。前端部31之直徑與基端部32之直徑係為大致相等，該等之直徑係比大徑探針2之外徑小。基端部32之前端係如上所述，與大徑探針2之第2柱塞23的前端部23a接觸。小徑探針3係以使其中心軸與大徑探針2之中心軸平行且相異之方式，配置在相對於大徑探針2偏置之位置。The small diameter probe 3 includes a front end portion 31 and a base end portion 32 each having a sharp end, and a flange provided between the front end portion 31 and the base end portion 32 and having a larger diameter than the front end portion 31 and the base end portion 32. Part 33. The diameter of the front end portion 31 is substantially equal to the diameter of the base end portion 32, and the diameters are smaller than the outer diameter of the large diameter probe 2. The front end of the proximal end portion 32 is in contact with the distal end portion 23a of the second plunger 23 of the large diameter probe 2 as described above. The small-diameter probe 3 is disposed at a position offset from the large-diameter probe 2 such that its central axis is parallel to and different from the central axis of the large-diameter probe 2.
大徑探針保持具4係在厚度方向(第1圖之上下方向)積層有利用樹脂、可機械加工陶瓷、矽等絕緣性材料分別 形成之第1基板41及第2基板42而構成。大徑探針保持具4係具有複數個大孔部4a，個別地保持複數個大徑探針2；及複數個收容孔部4b，直徑比大孔部4a小，且與複數個大孔部4a之任一者連通，在與大徑探針2接觸之狀態下收容小徑探針3之基端部32。彼此連通之大孔部4a及收容孔部4b之組係朝厚度方向貫通大徑探針保持具4。而且，彼此連通之大孔部4a及收容孔部4b之長度方向的中心軸係為平行且相異。大孔部4a之中心軸與收容孔部4b之中心軸的距離d係設定為比形成前端部23a之前端面之圓的半徑小。藉由以上述方式設定距離d，可確實地使分別插通於彼此連通之大孔部4a及收容孔部4b之大徑探針2及小徑探針3相接觸。The large-diameter probe holder 4 is laminated in the thickness direction (the lower direction in the first drawing) by insulating materials such as resin, machinable ceramics, and tantalum. The first substrate 41 and the second substrate 42 are formed to be formed. The large diameter probe holder 4 has a plurality of large hole portions 4a, and a plurality of large diameter probes 2 are individually held; and a plurality of receiving hole portions 4b having a diameter smaller than the large hole portion 4a and a plurality of large hole portions Any one of 4a is connected, and the base end portion 32 of the small-diameter probe 3 is housed in contact with the large-diameter probe 2. The large hole portion 4a and the receiving hole portion 4b that communicate with each other penetrate the large diameter probe holder 4 in the thickness direction. Further, the central axes in the longitudinal direction of the large hole portion 4a and the receiving hole portion 4b that communicate with each other are parallel and different. The distance d between the central axis of the large hole portion 4a and the central axis of the receiving hole portion 4b is set to be smaller than the radius of the circle forming the end surface of the front end portion 23a. By setting the distance d in the above manner, the large diameter probe 2 and the small diameter probe 3 that are respectively inserted into the large hole portion 4a and the receiving hole portion 4b that communicate with each other can be surely brought into contact with each other.
在第1基板41設置有複數個形成大孔部4a之一部分的第1孔部41a。第1孔部41a係具有可供第1柱塞21之前端部21a插通之圓筒狀的小徑孔411a、及直徑比小徑孔411a大且與小徑孔411a形成同軸之圓筒狀的大徑孔412a。小徑孔411a之直徑係比第1柱塞21之凸緣部21b的直徑小。小徑孔411a係在使第1柱塞21之前端部21a顯露出之狀態下防止第1柱塞21之脫落。此外，大徑孔412a之最大徑係比大徑探針2之最大徑大。The first substrate 41 is provided with a plurality of first hole portions 41a forming a part of the large hole portion 4a. The first hole portion 41a has a cylindrical small diameter hole 411a through which the front end portion 21a of the first plunger 21 is inserted, and a cylindrical shape having a larger diameter than the small diameter hole 411a and coaxial with the small diameter hole 411a. Large diameter hole 412a. The diameter of the small diameter hole 411a is smaller than the diameter of the flange portion 21b of the first plunger 21. The small diameter hole 411a prevents the first plunger 21 from coming off in a state where the front end portion 21a of the first plunger 21 is exposed. Further, the maximum diameter of the large diameter hole 412a is larger than the maximum diameter of the large diameter probe 2.
在第2基板42設置有：複數個收容孔部4b；及複數個第2孔部42a，形成大孔部4a之一部分，且與對應之收容孔部4b連通，而於厚度方向貫通第2基板42。第2孔部42a之直徑係與大徑孔412a之直徑相等。複數個第2孔部42a之各者係在與收容孔部4b連通之端部不同的端部與複數個大徑孔412a之任一者同軸地連通。The second substrate 42 is provided with a plurality of accommodating hole portions 4b and a plurality of second hole portions 42a, and one of the large hole portions 4a is formed, and is connected to the corresponding accommodating hole portion 4b, and penetrates the second substrate in the thickness direction. 42. The diameter of the second hole portion 42a is equal to the diameter of the large diameter hole 412a. Each of the plurality of second hole portions 42a is coaxially communicated with any of the plurality of large diameter holes 412a at an end portion different from the end portion that communicates with the accommodation hole portion 4b.
小徑探針保持具5係在厚度方向(第1圖之上下方向)積層有利用與大徑探針保持具4同樣之絕緣性材料分別形成之第3基板51及第4基板52而構成者。在小徑探針保持具5設置有以防止脫落之狀態個別地保持複數個小徑探針3且朝厚度方向貫通之複數個小孔部5a。小徑探針保持具5係以複數個小孔部5a之各者與複數個收容孔部4b之任一者同軸地連通之方式積層在大徑探針保持具4。The small-diameter probe holder 5 is formed by laminating the third substrate 51 and the fourth substrate 52 which are formed of the same insulating material as the large-diameter probe holder 4 in the thickness direction (the lower direction in the first drawing). . The small-diameter probe holder 5 is provided with a plurality of small-pore portions 5a that individually hold the plurality of small-diameter probes 3 and penetrate the thickness direction in a state of preventing the falling off. The small-diameter probe holder 5 is laminated on the large-diameter probe holder 4 such that each of the plurality of small hole portions 5a and the plurality of the plurality of receiving hole portions 4b are coaxially communicated with each other.
在第3基板51設置有複數個形成小孔部5a之一部分的第3孔部51a。第3孔部51a係具備：可供小徑探針3之前端部31插通之具圓形剖面之圓筒狀的小徑孔511a；及直徑比小徑孔511a大且與小徑孔511a形成同軸之圓筒狀的大徑孔512a。小徑孔511a之直徑係比小徑探針3之凸緣部33的直徑小。而且，大徑孔512a之直徑係為可收容小徑探針3之凸緣部33之大小，且具有與凸緣部33相同程度的大小。第3基板51係在使小徑探針3之前端部31顯露出之狀態下防止小徑探針3之脫落。The third substrate 51 is provided with a plurality of third hole portions 51a forming a part of the small hole portions 5a. The third hole portion 51a includes a cylindrical small-diameter hole 511a having a circular cross section through which the small-end probe 3 is inserted into the front end portion 31, and a diameter larger than the small-diameter hole 511a and the small-diameter hole 511a. A large-diameter hole 512a having a coaxial cylindrical shape is formed. The diameter of the small diameter hole 511a is smaller than the diameter of the flange portion 33 of the small diameter probe 3. Further, the diameter of the large diameter hole 512a is such that it can accommodate the flange portion 33 of the small diameter probe 3, and has the same size as the flange portion 33. The third substrate 51 prevents the small-diameter probe 3 from coming off in a state where the end portion 31 of the small-diameter probe 3 is exposed.
在第4基板52設置有與對應之第3孔部51a連通而構成小孔部5a之複數個第4孔部52a。第4孔部52a係具有可供小徑探針3之基端部32插通之圓筒狀的小徑孔521a、及直徑比小徑孔521a大且與小徑孔521a形成同軸之圓筒狀的大徑孔522a。小徑孔521a係與收容孔部4b連通。小徑孔521a之直徑係與收容孔部4b的直徑相等。而且，大徑孔522a之直徑係與大徑孔512a之直徑相等。複數個大徑孔522a之各者係與複數個大徑孔512a之任一者同軸地連通。第4基板52係在使小徑探針3之基端部32顯露出之狀態下防止小徑探針3之脫落。The fourth substrate 52 is provided with a plurality of fourth hole portions 52a that communicate with the corresponding third hole portions 51a to form the small hole portions 5a. The fourth hole portion 52a has a cylindrical small diameter hole 521a through which the base end portion 32 of the small diameter probe 3 is inserted, and a cylinder having a larger diameter than the small diameter hole 521a and coaxial with the small diameter hole 521a. Large diameter hole 522a. The small diameter hole 521a is in communication with the receiving hole portion 4b. The diameter of the small diameter hole 521a is equal to the diameter of the receiving hole portion 4b. Further, the diameter of the large diameter hole 522a is equal to the diameter of the large diameter hole 512a. Each of the plurality of large diameter holes 522a is coaxially communicated with any of the plurality of large diameter holes 512a. The fourth substrate 52 prevents the small-diameter probe 3 from falling off while the base end portion 32 of the small-diameter probe 3 is exposed.
大孔部4a、收容孔部4b及小孔部5a係藉由進行鑽孔加工、蝕刻、衝壓成形，或進行利用雷射、電子束、離子束、線放電等之加工而形成。The large hole portion 4a, the receiving hole portion 4b, and the small hole portion 5a are formed by drilling, etching, press forming, or processing by laser, electron beam, ion beam, wire discharge, or the like.
此外，大徑探針保持具4及小徑探針保持具5亦可為以下構成：藉由絕緣性材料被覆由導電性材料所構成之基板之表面(亦包含對應大孔部4a、收容孔部4b及小孔部5a之側面的部分)。Further, the large-diameter probe holder 4 and the small-diameter probe holder 5 may have a configuration in which a surface of a substrate made of a conductive material is covered with an insulating material (including a corresponding large hole portion 4a and a receiving hole). The portion 4b and the side surface of the small hole portion 5a).
第2圖係示意性顯示大孔部4a與小孔部5a之位置關係圖。更具體而言，係顯示大徑孔412a與小徑孔511a之位置關係圖。大徑孔412a之中心軸間距離H係比小徑孔511a之中心軸間距離h大。此外，在連通之大孔部4a與小孔部5a中，大徑孔412a之中心軸與小徑孔511a之中心軸的距離係與大孔部4a之中心軸與小孔部5a之中心軸的距離d相等。如此，藉由設定大孔部4a與小孔部5a之位置関係，可使與檢查對象接觸之小徑探針3側的間距比大徑探針2側的間距更窄小化。Fig. 2 is a view schematically showing the positional relationship between the large hole portion 4a and the small hole portion 5a. More specifically, a positional relationship diagram between the large diameter hole 412a and the small diameter hole 511a is shown. The distance H between the central axes of the large diameter holes 412a is larger than the distance h between the central axes of the small diameter holes 511a. Further, in the large hole portion 4a and the small hole portion 5a which are connected, the distance between the central axis of the large diameter hole 412a and the central axis of the small diameter hole 511a is the central axis of the large hole portion 4a and the central axis of the small hole portion 5a. The distance d is equal. By setting the positional relationship between the large hole portion 4a and the small hole portion 5a, the pitch of the small diameter probe 3 side in contact with the inspection object can be made narrower than the pitch of the large diameter probe 2 side.
第3圖係顯示探針單元1之組裝的概要圖。在組裝探針單元1之際，以使大徑探針保持具4之第2基板42與小徑探針保持具5之第4基板52相對向之方式組合2個探針保持具後，利用螺絲等加以固定。此外，在大徑探針保持具4及小徑探針保持具5分別先設置定位用之開口部，再藉由將定位插銷***大徑探針保持具4之開口部及對應該開口部之小徑探針保持具5之開口部而進行兩者之定位的話，即可更容易且迅速地進行探針單元1之組裝。Fig. 3 is a schematic view showing the assembly of the probe unit 1. When the probe unit 1 is assembled, the two probe holders are combined so that the second substrate 42 of the large-diameter probe holder 4 and the fourth substrate 52 of the small-diameter probe holder 5 are opposed to each other. Screws, etc. are fixed. Further, the large-diameter probe holder 4 and the small-diameter probe holder 5 are respectively provided with opening portions for positioning, and the positioning pins are inserted into the opening portions of the large-diameter probe holder 4 and the corresponding opening portions. When the small-diameter probe holder 5 is positioned to perform positioning of both, the assembly of the probe unit 1 can be performed more easily and quickly.
第4圖係顯示探針單元1之整體構成及使用探針單元1之半導體積體電路之電氣特性檢查之概要的斜視圖。在探針單元1中，在大徑探針保持具4及小徑探針保持具5之外周設置有抑制檢查時產生半導體積體電路100之位置偏離的保持具構件6。在保持具構件6之底面側，安裝有具備用以輸出檢查用信號之電路的電路基板200。Fig. 4 is a perspective view showing an outline of the overall configuration of the probe unit 1 and the electrical characteristic inspection of the semiconductor integrated circuit using the probe unit 1. In the probe unit 1, on the outer circumference of the large-diameter probe holder 4 and the small-diameter probe holder 5, a holder member 6 that suppresses a positional deviation of the semiconductor integrated circuit 100 during inspection is provided. A circuit board 200 having a circuit for outputting an inspection signal is attached to the bottom surface side of the holder member 6.
第5圖係顯示半導體積體電路100之檢查時之探針單元1之主要部分構成的局部剖面圖。在第5圖所示之狀態下，大徑探針2係藉由與電路基板200之電極201接觸而於圖中承受向上之力。另一方面，小徑探針3係藉由與半導體積體電路100之電極101接觸而於圖中承受向下之力。因此，大徑探針2之彈簧構件22係比小徑探針3未與半導體積體電路100之電極101接觸的狀態更沿著長度方向收縮。Fig. 5 is a partial cross-sectional view showing the configuration of a main part of the probe unit 1 at the time of inspection of the semiconductor integrated circuit 100. In the state shown in Fig. 5, the large-diameter probe 2 is subjected to an upward force in the drawing by being in contact with the electrode 201 of the circuit board 200. On the other hand, the small-diameter probe 3 is subjected to a downward force in the drawing by being in contact with the electrode 101 of the semiconductor integrated circuit 100. Therefore, the spring member 22 of the large-diameter probe 2 is contracted more in the longitudinal direction than the state in which the small-diameter probe 3 is not in contact with the electrode 101 of the semiconductor integrated circuit 100.
在半導體積體電路100之檢查時產生的檢查用信號係透過電路基板200之電極201而經由大徑探針2之第1柱塞21、密捲繞部22a、第2柱塞23後，經由小徑探針3到達半導體積體電路100之電極101。如此，在大徑探針2中，由於第1柱塞21與第2柱塞23經由密捲繞部22a而導通，因此可將電氣信號之導通路徑設為最小。因此，防止檢查時信號流入疏捲繞部22b，而可謀求電感及電阻之減低及穩定化。The inspection signal generated during the inspection of the semiconductor integrated circuit 100 passes through the electrode 201 of the circuit board 200 and passes through the first plunger 21, the dense winding portion 22a, and the second plunger 23 of the large diameter probe 2, and then The small diameter probe 3 reaches the electrode 101 of the semiconductor integrated circuit 100. As described above, in the large diameter probe 2, since the first plunger 21 and the second plunger 23 are electrically connected via the dense winding portion 22a, the conduction path of the electrical signal can be minimized. Therefore, it is possible to prevent the signal from flowing into the unwinding portion 22b during the inspection, and it is possible to reduce and stabilize the inductance and the resistance.
當探針單元1反覆進行檢查時，小徑探針3係於每次檢查會反覆進行與電極101之接觸/分離，因此會有因長期之使用造成前端部31磨耗或小徑探針3破損之情形。此種情形時，在本實施形態中，由於可從大徑探針保持具4拆下小徑探針保持具5，因此可簡單地僅更換小徑探針3。When the probe unit 1 is repeatedly inspected, the small-diameter probe 3 is repeatedly brought into contact with and separated from the electrode 101 every time, so that the front end portion 31 is worn or the small-diameter probe 3 is damaged due to long-term use. The situation. In this case, in the present embodiment, since the small-diameter probe holder 5 can be removed from the large-diameter probe holder 4, only the small-diameter probe 3 can be easily replaced.
依據以上說明之本發明之一實施形態，由於藉由在使彼此之軸線偏離之狀態下組合大徑探針與小徑探針而構成一組探針，因此即使在對應檢查對象之間距的窄小化時，不使探針之兩方端部細徑化亦可。因此，可抑制起因於探針之細徑化所造成的容許電流之降低。According to an embodiment of the present invention described above, since a large-diameter probe and a small-diameter probe are combined in a state in which the axes of the two are offset from each other, a set of probes is formed, so that the distance between the objects to be inspected is narrow. When the size is small, the diameter of both ends of the probe may not be reduced. Therefore, the decrease in the allowable current due to the reduction in the diameter of the probe can be suppressed.
此外，依據本實施形態，可將歷時性劣化顯著而為接觸電阻值之增加之最大要因的小徑探針於大徑探針之外獨立地更換，因此可簡單地進行維護。此外，由於僅更換小徑探針，因此大徑探針保持具側若無特別問題，則可継續使用。因此，可節省大徑探針，而具經濟性。Further, according to the present embodiment, the small-diameter probe which is distinguished by the deterioration of the chronological resistance and which is the largest factor of the increase in the contact resistance value can be independently replaced outside the large-diameter probe, so that the maintenance can be easily performed. In addition, since only the small-diameter probe is replaced, the large-diameter probe holder side can be used continuously without any particular problem. Therefore, the large diameter probe can be saved and it is economical.
再者，依據本實施形態，由於個別地加工大徑探針之第2柱塞及小徑探針，因此與將大徑探針與小徑探針予以偏置(offset)而一體成形之情形相比較更容易加工。Further, according to the present embodiment, since the second plunger and the small-diameter probe of the large-diameter probe are individually processed, the large-diameter probe and the small-diameter probe are offset and integrally formed. It is easier to process than it is.
將大徑探針與小徑探針予以偏置而一體成形時，探針並未形成軸對稱之形狀。因此，在將一體成形之探針收容於探針保持具時，必須留意供對應於小徑探針之部分插通之孔部的位置來進行定位，而有探針之收容費工夫的問題。相對於此，在本實施形態中，由於將大徑探針與小徑探針予以分離，而使各探針形成軸對稱之形狀，因此可容易地將各探針收容在探針保持具。When the large diameter probe and the small diameter probe are biased and integrally formed, the probe does not form an axisymmetric shape. Therefore, when the integrally formed probe is housed in the probe holder, it is necessary to pay attention to the position of the hole portion corresponding to the portion through which the small-diameter probe is inserted, and there is a problem in that the probe is charged. On the other hand, in the present embodiment, since the large-diameter probe and the small-diameter probe are separated, the probes are formed in an axisymmetric shape, so that the probes can be easily accommodated in the probe holder.
再者，依據本實施形態，藉由使第2柱塞之第2基端部比第1柱塞之第1基端部更長，即可抑制施加有負載時之繞著與第2柱塞的長度方向正交之軸的旋轉。因此，第2柱塞之凸緣部或第2基端部不會卡住探針保持具或彈簧構件，而可使第2柱塞順暢地上下移動。Further, according to the present embodiment, by making the second proximal end portion of the second plunger longer than the first proximal end portion of the first plunger, it is possible to suppress the winding around the second plunger when a load is applied The rotation of the axis orthogonal to the length direction. Therefore, the flange portion or the second base end portion of the second plunger does not catch the probe holder or the spring member, and the second plunger can be smoothly moved up and down.
再者，依據本實施形態，施加於彈簧構件之密捲繞部之橫負載(起因於大徑探針及小徑探針之軸線偏離造成第2柱塞之傾斜所產生之旋轉負載)，係由於第2柱塞之基端部較長而減少，並維持行程時之密捲繞部的密捲繞。因此，發揮密捲繞部22a之電阻值穩定的效果。Further, according to the present embodiment, the lateral load applied to the densely wound portion of the spring member (the rotational load caused by the inclination of the second plunger due to the deviation of the axis of the large-diameter probe and the small-diameter probe) is Since the base end portion of the second plunger is long, it is reduced, and the tight winding of the densely wound portion at the time of the stroke is maintained. Therefore, the effect of stabilizing the resistance value of the densely wound portion 22a is exhibited.
由以上說明得知，本發明係可包含在此未記載之各式各樣之實施形態等者，在不脫離由申請專利範圍所特定之技術思想的範圍內可施行各種設計變更。It is to be understood that the present invention may be embodied in various embodiments and the various embodiments of the present invention, and various modifications may be made without departing from the scope of the invention.
如上所述，本發明之探針單元係適用於IC晶片等半導體積體電路之電氣特性檢查。As described above, the probe unit of the present invention is suitable for electrical property inspection of a semiconductor integrated circuit such as an IC chip.
1．．．探針單元1. . . Probe unit
2．．．大徑探針2. . . Large diameter probe
3．．．小徑探針3. . . Trail probe
4．．．大徑探針保持具4. . . Large diameter probe holder
4a．．．大孔部4a. . . Large hole
4b．．．收容孔部4b. . . Containing hole
5．．．小徑探針保持具5. . . Trailer probe holder
5a．．．小孔部5a. . . Small hole
6．．．保持具構件6. . . Hold member
21．．．第1柱塞twenty one. . . First plunger
21a、23a、31．．．前端部21a, 23a, 31. . . Front end
21b、33．．．凸緣部21b, 33. . . Flange
21c、23b．．．凸柱部21c, 23b. . . Bump
21d、23c、32．．．基端部21d, 23c, 32. . . Base end
22．．．彈簧構件twenty two. . . Spring member
22a．．．密捲繞部22a. . . Dense winding
22b．．．疏捲繞部22b. . . Unwinding department
23．．．第2柱塞twenty three. . . Second plunger
41．．．第1基板41. . . First substrate
41a．．．第1孔部41a. . . First hole
42．．．第2基板42. . . Second substrate
42a．．．第2孔部42a. . . Second hole
51．．．第3基板51. . . Third substrate
51a．．．第3孔部51a. . . Third hole
52．．．第4基板52. . . Fourth substrate
52a．．．第4孔部52a. . . 4th hole
100．．．半導體積體電路100. . . Semiconductor integrated circuit
101、201．．．電極101, 201. . . electrode
200．．．電路基板200. . . Circuit substrate
411a、511a、521a．．．小徑孔411a, 511a, 521a. . . Small diameter hole
412a、512a、522a．．．大徑孔412a, 512a, 522a. . . Large diameter hole
第1圖係顯示本發明之一實施形態之探針單元之主要部分的構成圖。Fig. 1 is a view showing the configuration of a main part of a probe unit according to an embodiment of the present invention.
第2圖係示意性顯示大孔部與小孔部之位置關係的圖。Fig. 2 is a view schematically showing the positional relationship between the large hole portion and the small hole portion.
第3圖係顯示本發明之一實施形態之探針單元之組裝的概要圖。Fig. 3 is a schematic view showing the assembly of a probe unit according to an embodiment of the present invention.
第4圖係示意性顯示本發明之一實施形態之探針單元之整體構成的斜視圖。Fig. 4 is a perspective view schematically showing the overall configuration of a probe unit according to an embodiment of the present invention.
第5圖係顯示本發明之一實施形態之探針單元之檢查時狀態圖。Fig. 5 is a view showing a state at the time of inspection of the probe unit according to an embodiment of the present invention.
1．．．探針單元1. . . Probe unit
2．．．大徑探針2. . . Large diameter probe
3．．．小徑探針3. . . Trail probe
4．．．大徑探針保持具4. . . Large diameter probe holder
4a．．．大孔部4a. . . Large hole
4b．．．收容孔部4b. . . Containing hole
5．．．小徑探針保持具5. . . Trailer probe holder
5a．．．小孔部5a. . . Small hole
21．．．第1柱塞twenty one. . . First plunger
21a、23a、31．．．前端部21a, 23a, 31. . . Front end
21b、33．．．凸緣部21b, 33. . . Flange
21c、23b．．．凸柱部21c, 23b. . . Bump
21d、23c、32．．．基端部21d, 23c, 32. . . Base end
22．．．彈簧構件twenty two. . . Spring member
22a．．．密捲繞部22a. . . Dense winding
22b．．．疏捲繞部22b. . . Unwinding department
23．．．第2柱塞twenty three. . . Second plunger
41．．．第1基板41. . . First substrate
41a．．．第1孔部41a. . . First hole
42．．．第2基板42. . . Second substrate
42a．．．第2孔部42a. . . Second hole
51．．．第3基板51. . . Third substrate
51a．．．第3孔部51a. . . Third hole
52．．．第4基板52. . . Fourth substrate
52a．．．第4孔部52a. . . 4th hole
411a、511a、521a．．．小徑孔411a, 511a, 521a. . . Small diameter hole
412a、512a、522a．．．大徑孔412a, 512a, 522a. . . Large diameter hole
Claims (9)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010257232 | 2010-11-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201234017A TW201234017A (en) | 2012-08-16 |
| TWI457573B true TWI457573B (en) | 2014-10-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100141984A TWI457573B (en) | 2010-11-17 | 2011-11-17 | Probe unit |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2012067125A1 (en) |
| TW (1) | TWI457573B (en) |
| WO (1) | WO2012067125A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6567954B2 (en) | 2015-10-28 | 2019-08-28 | 株式会社エンプラス | Socket for electrical parts |
| JP7136362B2 (en) * | 2019-10-04 | 2022-09-13 | 株式会社村田製作所 | probe |
| CN113552393A (en) * | 2020-04-23 | 2021-10-26 | 跃澐科技股份有限公司 | Test probe seat structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002107377A (en) * | 2000-09-28 | 2002-04-10 | Nhk Spring Co Ltd | Conductive contactor with movable guide plate |
| US20050035775A1 (en) * | 2003-08-13 | 2005-02-17 | Yu Zhou | Probe contact system using flexible printed circuit board |
| US20070145991A1 (en) * | 2005-12-27 | 2007-06-28 | Yokowo Co., Ltd. | Inspection unit |
| WO2009096318A1 (en) * | 2008-02-01 | 2009-08-06 | Nhk Spring Co., Ltd. | Probe unit |
| TW200942826A (en) * | 2008-02-14 | 2009-10-16 | Nhk Spring Co Ltd | Probe unit |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002062312A (en) * | 2000-08-22 | 2002-02-28 | Toyo Denshi Giken Kk | Contact device |
| JP4939879B2 (en) * | 2006-09-13 | 2012-05-30 | 株式会社エンプラス | Electrical contact and socket for electrical parts |
| WO2009102029A1 (en) * | 2008-02-14 | 2009-08-20 | Nhk Spring Co., Ltd. | Contact probe and probe unit |
-
2011
- 2011-11-15 WO PCT/JP2011/076334 patent/WO2012067125A1/en active Application Filing
- 2011-11-15 JP JP2012544267A patent/JPWO2012067125A1/en active Pending
- 2011-11-17 TW TW100141984A patent/TWI457573B/en not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002107377A (en) * | 2000-09-28 | 2002-04-10 | Nhk Spring Co Ltd | Conductive contactor with movable guide plate |
| US20050035775A1 (en) * | 2003-08-13 | 2005-02-17 | Yu Zhou | Probe contact system using flexible printed circuit board |
| US20070145991A1 (en) * | 2005-12-27 | 2007-06-28 | Yokowo Co., Ltd. | Inspection unit |
| WO2009096318A1 (en) * | 2008-02-01 | 2009-08-06 | Nhk Spring Co., Ltd. | Probe unit |
| TW200938847A (en) * | 2008-02-01 | 2009-09-16 | Nhk Spring Co Ltd | Probe unit |
| TW200942826A (en) * | 2008-02-14 | 2009-10-16 | Nhk Spring Co Ltd | Probe unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2012067125A1 (en) | 2014-05-12 |
| TW201234017A (en) | 2012-08-16 |
| WO2012067125A1 (en) | 2012-05-24 |
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