JP5394264B2 - Probe unit - Google Patents

Probe unit Download PDF

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Publication number
JP5394264B2
JP5394264B2 JP2009553467A JP2009553467A JP5394264B2 JP 5394264 B2 JP5394264 B2 JP 5394264B2 JP 2009553467 A JP2009553467 A JP 2009553467A JP 2009553467 A JP2009553467 A JP 2009553467A JP 5394264 B2 JP5394264 B2 JP 5394264B2
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Japan
Prior art keywords
plunger
coil spring
substrate
contact
probe
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JPWO2009102030A1 (en
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俊男 風間
浩平 広中
重樹 石川
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NHK Spring Co Ltd
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NHK Spring Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Description

本発明は、半導体集積回路等の検査対象物の電気特性検査を行うプローブユニットに関する。   The present invention relates to a probe unit for inspecting electrical characteristics of an inspection object such as a semiconductor integrated circuit.

ＩＣチップなどの半導体集積回路の電気特性検査においては、その半導体集積回路が有する外部接続用電極の設置パターンに対応して、複数の導電性コンタクトプローブを所定の位置に収容したプローブユニットが用いられる。プローブユニットは、コンタクトプローブを挿通する孔部が設けられたプローブホルダを備えており、このプローブホルダが保持するコンタクトプローブの両端部が、半導体集積回路の球状電極と検査用信号を出力する回路基板の電極とにそれぞれ接触することにより、半導体集積回路と回路基板との間を電気的に接続する（例えば、特許文献１を参照）。   In the inspection of electrical characteristics of a semiconductor integrated circuit such as an IC chip, a probe unit in which a plurality of conductive contact probes are accommodated at predetermined positions corresponding to the external connection electrode installation pattern of the semiconductor integrated circuit is used. . The probe unit includes a probe holder provided with a hole through which the contact probe is inserted, and both ends of the contact probe held by the probe holder output a spherical electrode of the semiconductor integrated circuit and a test signal. By making contact with each of the electrodes, the semiconductor integrated circuit and the circuit board are electrically connected (see, for example, Patent Document 1).

特開２００２−１０７３７７号公報JP 2002-107377 A

プローブユニットでは、電気特性検査の検査回数が増加してくると、コンタクトプローブの先端に半導体集積回路の球状電極の半田が転写され、接触抵抗が増加し、正常な電気特性検査ができなくなる場合がある。このような事態を回避するため、従来のプローブユニットでは、所定の回数だけ検査するごとに、紙ヤスリなどを用いることによってコンタクトプローブの先端に付着した半田を削り落とす作業を定期的に行っていた。   In the probe unit, when the number of inspections for electrical characteristic inspection increases, the solder of the spherical electrode of the semiconductor integrated circuit is transferred to the tip of the contact probe, the contact resistance increases, and normal electrical characteristic inspection may not be possible. is there. In order to avoid such a situation, in the conventional probe unit, every time the inspection is performed a predetermined number of times, the work of scraping off the solder adhered to the tip of the contact probe by using a paper file or the like is periodically performed. .

上述した削り作業を繰り返すと、接触抵抗を小さくするために設けられたＡｕ，Ｐｄ，Ｒｈ，Ｎｉなどの表面メッキが削り取られ、コンタクトプローブの先端は徐々に磨耗していき、いずれはコンタクトプローブを交換しなければならない。しかしながら、従来のプローブユニットでは、コンタクトプローブの交換作業は容易なものではなく、検査用のラインを停止したり、プローブホルダをハンドラーから外して分解したりしなければならないこともあった。このため、コンタクトプローブの交換作業に多くの時間と手間が費やされていた。また、交換が必要なコンタクトプローブの先端部以外も一括して交換しなければならないため、メインテナンス費用がかさむという問題もあった。   When the above-described shaving operation is repeated, the surface plating of Au, Pd, Rh, Ni, etc. provided to reduce the contact resistance is scraped off, and the tip of the contact probe gradually wears. Must be replaced. However, in the conventional probe unit, it is not easy to replace the contact probe, and it may be necessary to stop the inspection line or to disassemble the probe holder by removing it from the handler. For this reason, much time and labor have been spent on the replacement work of the contact probe. In addition, since other than the tip of the contact probe that needs to be replaced must be replaced at a time, there is also a problem that maintenance costs increase.

本発明は、上記に鑑みてなされたものであって、メインテナンスを容易にかつ低コストで行うことができるプローブユニットを提供することを目的とする。   The present invention has been made in view of the above, and an object thereof is to provide a probe unit capable of performing maintenance easily and at low cost.

上述した課題を解決し、目的を達成するために、本発明に係るプローブユニットは、略針状をなす第１プランジャ、一端が前記第１プランジャに取り付けられ、前記第１プランジャの軸線方向に沿って伸縮自在なコイルばね、および一部が前記コイルばねの他端から当該コイルばねの内周部へ挿抜自在であり、前記第１プランジャよりも長手方向の長さが長い第２プランジャをそれぞれ有し、各々が長手方向の両端で互いに異なる二つの被接触体と接触し、前記二つの被接触体の間を電気的に接続する複数の導電性のコンタクトプローブと、各コンタクトプローブが有する前記第１プランジャおよび前記コイルばねの組を個別に収容し、少なくとも前記第１プランジャの先端を表出させつつ抜け止めした状態で保持する保持基板と、各コンタクトプローブが有する前記第２プランジャを個別に収容し、前記第２プランジャの両端部を表出させつつ抜け止めした状態で保持するとともに、各コンタクトプローブが有する前記第１プランジャ、前記コイルばねおよび前記第２プランジャの長手方向の軸線が一致した状態で前記保持基板に対して着脱自在に取り付けられるカートリッジ基板と、を備え、前記コイルばねは、線材が密着して巻かれた密着巻き部と、前記密着巻き部に連続し、自然長における長手方向の長さが前記密着巻き部の長手方向の長さよりも長く、前記線材が前記密着巻き部よりも粗く巻かれた粗巻き部とを有し、前記第２プランジャは、前記カートリッジ基板を前記保持基板に取り付けた状態で、当該第２プランジャと長手方向の軸線が一致する前記コイルばねが有する前記密着巻き部に接触可能であることを特徴とする。   In order to solve the above-described problems and achieve the object, a probe unit according to the present invention includes a first plunger having a substantially needle shape, one end attached to the first plunger, and along the axial direction of the first plunger. And a coil spring that can be expanded and contracted, and a second plunger that is partly insertable / removable from the other end of the coil spring into the inner peripheral portion of the coil spring and that is longer in the longitudinal direction than the first plunger. A plurality of conductive contact probes that are in contact with two different contacted members at both ends in the longitudinal direction and electrically connect the two contacted members, and the first contact probe has A holding substrate for individually storing a set of one plunger and the coil spring and holding at least the tip of the first plunger in a state where it is prevented from coming off, and each contour The second plunger included in each probe is individually accommodated and held in a state where both end portions of the second plunger are exposed and prevented from coming off, and each of the contact probes includes the first plunger, the coil spring, and the first A cartridge substrate that is detachably attached to the holding substrate in a state where the longitudinal axes of the plungers coincide with each other, and the coil spring includes a tightly wound portion in which a wire is tightly wound, and the close contact The winding portion is continuous, the length in the longitudinal direction in the natural length is longer than the length in the longitudinal direction of the tightly wound portion, and the wire rod has a coarsely wound portion wound more coarsely than the tightly wound portion, The second plunger has the coil spring whose longitudinal axis coincides with the second plunger in a state where the cartridge substrate is attached to the holding substrate. Characterized in that it is a possible contact with the tightly wound portion that.

また、本発明に係るプローブユニットは、上記発明において、前記第１プランジャは検査用信号を生成して出力する回路基板と接触する一方、前記第２プランジャは前記回路基板が出力した前記検査用信号を受信する検査対象物と接触することを特徴とする。   In the probe unit according to the present invention, in the above invention, the first plunger contacts a circuit board that generates and outputs an inspection signal, while the second plunger outputs the inspection signal output by the circuit board. It contacts with the test object which receives this.

本発明によれば、コンタクトプローブの一方のプランジャ（第２プランジャ）をコイルばねに対して挿抜自在な構成とし、この第２プランジャを、コンタクトプローブの他の部分を保持する保持基板に対して着脱自在に取り付けられるカートリッジ基板によって保持する構成としたため、メインテナンスを行う際に第２プランジャだけを交換することができる。したがって、メインテナンスを容易にかつ低コストで行うことが可能となる。   According to the present invention, one plunger (second plunger) of the contact probe is configured to be insertable / removable with respect to the coil spring, and the second plunger is attached to and detached from the holding substrate that holds the other part of the contact probe. Since it is configured to be held by a freely mounted cartridge substrate, only the second plunger can be exchanged when performing maintenance. Therefore, maintenance can be performed easily and at low cost.

図１は、本発明の一実施の形態に係るプローブユニットの全体構成を模式的に示す斜視図である。FIG. 1 is a perspective view schematically showing an overall configuration of a probe unit according to an embodiment of the present invention. 図２は、本発明の一実施の形態に係るプローブユニットの要部の構成を示す図である。FIG. 2 is a diagram illustrating a configuration of a main part of the probe unit according to the embodiment of the present invention. 図３は、本発明の一実施の形態に係るプローブユニットの組み立ての概要を示す図である。FIG. 3 is a diagram showing an outline of assembly of the probe unit according to the embodiment of the present invention. 図４は、本発明の一実施の形態に係るプローブユニットに対して検査対象物である半導体集積回路を下降させる状態を示す図である。FIG. 4 is a diagram showing a state in which the semiconductor integrated circuit as the inspection target is lowered with respect to the probe unit according to the embodiment of the present invention. 図５は、本発明の一実施の形態に係るプローブユニットの検査時の状態を示す図である。FIG. 5 is a diagram showing a state at the time of inspection of the probe unit according to the embodiment of the present invention.

符号の説明Explanation of symbols

１ プローブユニット
２ コンタクトプローブ
３ プローブホルダ
４ ホルダ部材
５ 保持基板
６ カートリッジ基板
２１ 第１プランジャ
２１ａ、２２ａ 先端部
２１ｂ、２２ｂ フランジ部
２１ｃ ボス部
２１ｄ、２２ｄ 基端部
２２ 第２プランジャ
２２ｃ 当接部
２３ コイルばね
２３ａ 密着巻き部
２３ｂ 粗巻き部
５１ 第１基板
５２ 第２基板
６１ 第３基板
６２ 第４基板
１００ 半導体集積回路
１０１、２０１ 電極
２００ 回路基板
５１１、５２１、６１１、６２１ 孔部
５１２、５２２、６１２、６２２ 小径孔
５１３、５２３、６１３、６２３ 大径孔DESCRIPTION OF SYMBOLS 1 Probe unit 2 Contact probe 3 Probe holder 4 Holder member 5 Holding substrate 6 Cartridge substrate 21 1st plunger 21a, 22a Tip part 21b, 22b Flange part 21c Boss part 21d, 22d Base end part 22 2nd plunger 22c Contact part 23 Coil spring 23a Close winding part 23b Coarse winding part 51 1st board | substrate 52 2nd board | substrate 61 3rd board | substrate 62 4th board | substrate 100 Semiconductor integrated circuit 101, 201 Electrode 200 Circuit board 511, 521, 611, 621 Hole part 512, 522, 612, 622 Small hole 513, 523, 613, 623 Large hole

以下、添付図面を参照して本発明を実施するための最良の形態（以後、「実施の形態」と称する）を説明する。なお、図面は模式的なものであって、各部分の厚みと幅との関係、それぞれの部分の厚みの比率などは現実のものとは異なる場合もあることに留意すべきであり、図面の相互間においても互いの寸法の関係や比率が異なる部分が含まれる場合があることは勿論である。   The best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described below with reference to the accompanying drawings. It should be noted that the drawings are schematic, and the relationship between the thickness and width of each part, the ratio of the thickness of each part, and the like may be different from the actual ones. Of course, there may be included portions having different dimensional relationships and ratios.

図１は、本発明の一実施の形態に係るプローブユニットの構成を示す斜視図である。また、図２は、本実施の形態に係るプローブユニットの要部の構成を示す部分断面図である。これらの図に示すプローブユニット１は、検査対象物である半導体集積回路１００の電気特性検査を行う際に使用する装置であって、半導体集積回路１００と半導体集積回路１００へ検査用信号を出力する回路基板２００との間を電気的に接続する装置である。   FIG. 1 is a perspective view showing a configuration of a probe unit according to an embodiment of the present invention. FIG. 2 is a partial cross-sectional view showing a configuration of a main part of the probe unit according to the present embodiment. The probe unit 1 shown in these drawings is a device used when performing an electrical characteristic test on the semiconductor integrated circuit 100 that is an inspection target, and outputs a test signal to the semiconductor integrated circuit 100 and the semiconductor integrated circuit 100. This is an apparatus for electrically connecting the circuit board 200.

プローブユニット１は、長手方向の両端で互いに異なる二つの被接触体である半導体集積回路１００および回路基板２００に接触する導電性のコンタクトプローブ２（以下、単に「プローブ２」という）と、複数のプローブ２を所定のパターンにしたがって収容して保持するプローブホルダ３と、プローブホルダ３の周囲に設けられ、検査の際に複数のプローブ２と接触する半導体集積回路１００の位置ずれが生じるのを抑制するホルダ部材４と、を備える。   The probe unit 1 includes a conductive contact probe 2 (hereinafter simply referred to as “probe 2”) that contacts two different objects to be contacted at both ends in the longitudinal direction, and a semiconductor substrate 100 and a circuit board 200. The probe holder 3 that accommodates and holds the probe 2 according to a predetermined pattern, and the semiconductor integrated circuit 100 that is provided around the probe holder 3 and contacts the plurality of probes 2 during inspection are prevented from being displaced. A holder member 4.

プローブ２は導電性材料を用いて形成され、先端が回路基板２００と接触する第１プランジャ２１と、第１プランジャ２１よりも長手方向の長さが長く、半導体集積回路１００と接触する第２プランジャ２２と、第１プランジャ２１と第２プランジャ２２との間に設けられるコイルばね２３とを有する。   The probe 2 is formed using a conductive material, and a first plunger 21 whose tip is in contact with the circuit board 200 and a second plunger that is longer in the longitudinal direction than the first plunger 21 and is in contact with the semiconductor integrated circuit 100. 22 and a coil spring 23 provided between the first plunger 21 and the second plunger 22.

第１プランジャ２１は、先端が針状をなす先端部２１ａと、先端部２１ａの径よりも大きい径を有するフランジ部２１ｂと、フランジ部２１ｂを介して先端部２１ａと反対方向に突出し、フランジ部２１ｂの径よりも小さくかつコイルばね２３の内径よりも若干大きい径を有する円柱状をなし、コイルばね２３の端部が圧入されるボス部２１ｃと、ボス部２１ｃよりも径が小さくかつコイルばね２３の内径よりも小さい径を有する円柱状をなす基端部２１ｄとを備える。   The first plunger 21 protrudes in a direction opposite to the distal end portion 21a via the flange portion 21b, a distal end portion 21a having a needle-like distal end, a flange portion 21b having a diameter larger than the diameter of the distal end portion 21a, and a flange portion. A cylindrical shape having a diameter smaller than the diameter of 21b and slightly larger than the inner diameter of the coil spring 23, a boss part 21c into which the end of the coil spring 23 is press-fitted, and a diameter smaller than the boss part 21c and the coil spring And a base end portion 21 d having a columnar shape having a diameter smaller than the inner diameter of 23.

第２プランジャ２２は、先端がクラウン形状をなす先端部２２ａと、先端部２２ａの径よりも大きい径を有するフランジ部２２ｂと、フランジ部２２ｂを介して先端部２２ａと反対方向に突出し、フランジ部２２ｂの径よりも小さい径を有する円柱状をなし、コイルばね２３の端部に当接可能な当接部２２ｃと、当接部２２ｃより径が小さくかつコイルばね２３の内径よりも小さい径を有し、コイルばね２３の内周部に挿入可能な円柱状の基端部２２ｄとを備える。なお、先端部２２ａの形状はあくまでも一例に過ぎず、他の形状であってもよい。   The second plunger 22 protrudes in a direction opposite to the distal end portion 22a through the flange portion 22b, a distal end portion 22a having a crown-shaped distal end, a flange portion 22b having a diameter larger than the diameter of the distal end portion 22a, and a flange portion. A cylindrical shape having a diameter smaller than the diameter of 22b, a contact portion 22c capable of contacting the end of the coil spring 23, and a diameter smaller than the contact portion 22c and smaller than the inner diameter of the coil spring 23. And a cylindrical base end portion 22 d that can be inserted into the inner peripheral portion of the coil spring 23. In addition, the shape of the front-end | tip part 22a is only an example to the last, Other shapes may be sufficient.

コイルばね２３は、線材が密着して巻かれている密着巻き部２３ａと、密着巻き部２３ａよりも長手方向の長さが長く、密着巻き部２３ａよりも粗く巻かれている粗巻き部２３ｂとを備え、長手方向に沿って均一な径を有する。密着巻き部２３ａの端部は第１プランジャ２１のボス部２１ｃに圧入されている。このため、コイルばね２３は、第１プランジャ２１の軸線方向に沿って伸縮自在である。これに対して、粗巻き部２３ｂの端部では、第２プランジャ２２の基端部２２ｄが粗巻き部２３ｂの内周部へ挿抜自在に嵌合される。   The coil spring 23 includes a tightly wound portion 23a in which a wire is tightly wound, and a coarsely wound portion 23b that is longer in the longitudinal direction than the tightly wound portion 23a and is wound more coarsely than the tightly wound portion 23a. And has a uniform diameter along the longitudinal direction. The end of the tightly wound portion 23 a is press-fitted into the boss portion 21 c of the first plunger 21. For this reason, the coil spring 23 can be expanded and contracted along the axial direction of the first plunger 21. On the other hand, at the end portion of the rough winding portion 23b, the base end portion 22d of the second plunger 22 is fitted to the inner peripheral portion of the rough winding portion 23b so as to be freely inserted and removed.

図２に示す状態で、第２プランジャ２２の基端部２２ｄはコイルばね２３の密着巻き部２３ａの内周まで進入して密着巻き部２３ａと面接触可能である。換言すれば、基端部２２ｄの長手方向の長さとコイルばね２３の粗巻き部２３ｂの長さとは、カートリッジ基板６を保持基板５に装着した状態で基端部２２ｄが密着巻き部２３ａの内周に達して面接触可能となるように設定される。また、第２プランジャ２２の基端部２２ｄがコイルばね２３の密着巻き部２３ａによってガイドされ、第２プランジャ２２とコイルばね２３（および第１プランジャ２１）との軸線がぶれにくくなる。したがって、第２プランジャの基端部２２ｄをコイルばね２３に挿入したときの第２プランジャ２２の直進性が向上する。   In the state shown in FIG. 2, the base end portion 22 d of the second plunger 22 enters the inner circumference of the tightly wound portion 23 a of the coil spring 23 and can come into surface contact with the tightly wound portion 23 a. In other words, the length of the base end portion 22d in the longitudinal direction and the length of the coarsely wound portion 23b of the coil spring 23 are such that the base end portion 22d is within the tightly wound portion 23a with the cartridge substrate 6 mounted on the holding substrate 5. It is set so that the surface can be contacted by reaching the circumference. Further, the base end portion 22d of the second plunger 22 is guided by the tightly wound portion 23a of the coil spring 23, and the axis of the second plunger 22 and the coil spring 23 (and the first plunger 21) is less likely to shake. Therefore, the straight advanceability of the second plunger 22 when the base end portion 22d of the second plunger is inserted into the coil spring 23 is improved.

プローブホルダ３は、プローブ２を挿通するために板厚方向に貫通された複数の孔部を有する保持基板５と、保持基板５の一方の表面に着脱自在に装着され、プローブ２の第２プランジャ２２を収容して保持するカートリッジ基板６とを有する。   The probe holder 3 is detachably attached to one surface of the holding substrate 5 and a holding substrate 5 having a plurality of holes penetrated in the plate thickness direction for inserting the probe 2, and the second plunger of the probe 2. And a cartridge substrate 6 that accommodates and holds 22.

保持基板５は、樹脂、マシナブルセラミック、シリコンなどの絶縁性材料を用いてそれぞれ形成された第１基板５１および第２基板５２を厚さ方向（図２の上下方向）に積層した状態で固着して成る。   The holding substrate 5 is fixed in a state where a first substrate 51 and a second substrate 52 formed using an insulating material such as resin, machinable ceramic, and silicon are laminated in the thickness direction (vertical direction in FIG. 2). It consists of

第１基板５１には、板厚方向に貫通された複数の孔部５１１が設けられている。孔部５１１は、第１プランジャ２１の先端部２１ａを挿通可能な円筒状の小径孔５１２と、小径孔５１２よりも径が大きく、かつ小径孔５１２と同軸をなす円筒状の大径孔５１３とを有する。大径孔５１３の径はコイルばね２３の外径よりも大きく、コイルばね２３が圧縮されたときに湾曲することができる隙間を有している。小径孔５１２の径は、第１プランジャ２１のフランジ部２１ｂの径よりも小さく、第１プランジャ２１の先端部２１ａを表出させた状態で第１プランジャ２１を抜け止めしている。   The first substrate 51 is provided with a plurality of holes 511 penetrating in the thickness direction. The hole 511 includes a cylindrical small-diameter hole 512 that can be inserted through the distal end portion 21 a of the first plunger 21, and a cylindrical large-diameter hole 513 that is larger in diameter than the small-diameter hole 512 and coaxial with the small-diameter hole 512. Have The diameter of the large-diameter hole 513 is larger than the outer diameter of the coil spring 23 and has a gap that can be bent when the coil spring 23 is compressed. The diameter of the small diameter hole 512 is smaller than the diameter of the flange portion 21b of the first plunger 21, and the first plunger 21 is prevented from coming off while the tip end portion 21a of the first plunger 21 is exposed.

第２基板５２には、第１基板５１が有する複数の孔部５１１に対応する複数の孔部５２１が設けられている。孔部５２１は、第１基板５１に設けられた複数の孔部５１１のいずれかと同軸的に連通している。孔部５２１は、第２プランジャ２２の当接部２２ｃおよび基端部２２ｄを挿通可能であるとともにコイルばね２３の外径よりも小さい径を有し、コイルばね２３を抜け止めする円筒状の小径孔５２２と、小径孔５２２よりも径が大きく、かつ小径孔５２２と同軸をなす円筒状の大径孔５２３とを有する。大径孔５２３の径は、孔部５１１の大径孔５１３の径と等しく、コイルばね２３の外径よりも大きい。   The second substrate 52 is provided with a plurality of hole portions 521 corresponding to the plurality of hole portions 511 of the first substrate 51. The hole 521 communicates coaxially with any of the plurality of holes 511 provided in the first substrate 51. The hole 521 can be inserted through the contact portion 22c and the base end portion 22d of the second plunger 22, has a diameter smaller than the outer diameter of the coil spring 23, and has a small cylindrical diameter that prevents the coil spring 23 from coming off. A hole 522 and a cylindrical large-diameter hole 523 having a diameter larger than that of the small-diameter hole 522 and coaxial with the small-diameter hole 522 are provided. The diameter of the large diameter hole 523 is equal to the diameter of the large diameter hole 513 of the hole portion 511 and is larger than the outer diameter of the coil spring 23.

カートリッジ基板６は、保持基板５と同様の絶縁性材料を用いてそれぞれ形成された第３基板６１および第４基板６２を厚さ方向（図２の上下方向）に積層した状態で固着して成る。   The cartridge substrate 6 is formed by adhering a third substrate 61 and a fourth substrate 62 formed using the same insulating material as the holding substrate 5 in a state where they are stacked in the thickness direction (vertical direction in FIG. 2). .

第３基板６１には、第２プランジャ２２を収容するための複数の孔部６１１が設けられている。孔部６１１は、第２プランジャ２２の先端部２２ａを挿通可能な円筒状の小径孔６１２と、小径孔６１２よりも径が大きく、かつ小径孔６１２と同軸をなす円筒状の大径孔６１３とを有する。小径孔６１２の径は第２プランジャ２２のフランジ部２２ｂの径よりも小さく、第２プランジャ２２の先端部２２ａを表出させた状態で第２プランジャ２２を抜け止めしている。また、大径孔６１３は、第２プランジャ２２のフランジ部２２ｂを収容可能な大きさであってフランジ部２２ｂと同程度の径を有している。   The third substrate 61 is provided with a plurality of holes 611 for accommodating the second plunger 22. The hole 611 includes a cylindrical small-diameter hole 612 that can be inserted through the distal end portion 22 a of the second plunger 22, and a cylindrical large-diameter hole 613 that is larger in diameter than the small-diameter hole 612 and coaxial with the small-diameter hole 612. Have The diameter of the small diameter hole 612 is smaller than the diameter of the flange portion 22b of the second plunger 22, and the second plunger 22 is prevented from coming off while the front end portion 22a of the second plunger 22 is exposed. The large-diameter hole 613 has a size that can accommodate the flange portion 22b of the second plunger 22 and has the same diameter as the flange portion 22b.

第４基板６２には、第３基板６１の複数の孔部６１１のいずれかと対応して連通する複数の孔部６２１が設けられている。孔部６２１は、第２プランジャ２２の当接部２２ｃおよび基端部２２ｄを挿通可能な円筒状の小径孔６２２と、小径孔６２２よりも径が大きく、かつ小径孔６２２と同軸をなす円筒状の大径孔６２３とを有する。小径孔６２２は保持基板５の第２基板５２の小径孔５２２と連通しており、第２基板５２の小径孔５２２と等しい径を有する。小径孔６２２は、第２プランジャ２２の当接部２２ｃおよび基端部２２ｄを表出させた状態で第２プランジャ２２を抜け止めしている。また、大径孔６２３は大径孔６１３と連通しており、大径孔６２３の径は大径孔６１３の径と等しい。   The fourth substrate 62 is provided with a plurality of hole portions 621 that communicate with one of the plurality of hole portions 611 of the third substrate 61. The hole portion 621 has a cylindrical small diameter hole 622 that can be inserted through the contact portion 22c and the base end portion 22d of the second plunger 22, and a cylindrical shape that is larger in diameter than the small diameter hole 622 and coaxial with the small diameter hole 622. Large-diameter hole 623. The small diameter hole 622 communicates with the small diameter hole 522 of the second substrate 52 of the holding substrate 5 and has the same diameter as the small diameter hole 522 of the second substrate 52. The small diameter hole 622 prevents the second plunger 22 from coming off while the contact portion 22c and the base end portion 22d of the second plunger 22 are exposed. The large diameter hole 623 communicates with the large diameter hole 613, and the diameter of the large diameter hole 623 is equal to the diameter of the large diameter hole 613.

孔部５１１、５２１、６１１、６２１は、ドリル加工、エッチング、打抜き成形を行うか、あるいはレーザ、電子ビーム、イオンビーム、ワイヤ放電等を用いた加工を行うことによって形成される。   The holes 511, 521, 611, and 621 are formed by performing drilling, etching, punching, or processing using a laser, an electron beam, an ion beam, wire discharge, or the like.

なお、第１基板５１、第２基板５２、第３基板６１および第４基板６２は、導電性材料から成る基板の表面（孔部５１１、５２１、６１１、６２１の側面に対応する部分も含む）を絶縁性材料によって被覆した構成とすることも可能である。   The first substrate 51, the second substrate 52, the third substrate 61, and the fourth substrate 62 are the surfaces of the substrate made of a conductive material (including portions corresponding to the side surfaces of the holes 511, 521, 611, and 621). It is also possible to have a configuration in which is covered with an insulating material.

図３は、プローブユニット１の組み立ての概要を示す図である。プローブユニット１を組み立てる際には、第２プランジャ２２を保持するカートリッジ基板６を、第４基板６２を底面側として保持基板５へ向けて下降させていきながら位置決めを行い、図２に示す状態まででカートリッジ基板６を下降させた後、保持基板５とカートリッジ基板６とをネジ等によって固着する。なお、保持基板５およびカートリッジ基板６に位置決め用の開口部をそれぞれ設けておき、互いに対応する開口部同士に位置決めピンを挿入することによって両基板の位置決めを行うようにすれば、プローブユニット１の組み立てを一段と容易にかつ迅速に行うことができる。   FIG. 3 is a diagram showing an outline of assembly of the probe unit 1. When assembling the probe unit 1, the cartridge substrate 6 holding the second plunger 22 is positioned while being lowered toward the holding substrate 5 with the fourth substrate 62 as the bottom surface side, until the state shown in FIG. After the cartridge substrate 6 is lowered, the holding substrate 5 and the cartridge substrate 6 are fixed with screws or the like. If the holding substrate 5 and the cartridge substrate 6 are respectively provided with positioning openings and the positioning pins are inserted into the openings corresponding to each other, the both substrates are positioned. Assembly can be performed more easily and quickly.

図４および図５は、以上の構成を有するプローブユニット１を用いた検査の概要を示す図である。半導体集積回路１００の検査時には、半導体集積回路１００からの接触荷重が加わる。接触荷重が加わった結果、コイルばね２３は長手方向に沿って圧縮された状態となる。コイルばね２３が圧縮されると、コイルばね２３は保持基板５の互いに連通する大径孔５１３、５２３の中で湾曲することにより、密着巻き部２３ａが第２プランジャ２２の基端部２２ｄと接触する。これにより確実な電気導通が得られる。この際には、第２プランジャ２２の基端部２２ｄが密着巻き部２３ａの下方まで進入しているため、第２プランジャ２２の軸線が大きくぶれることはない。   4 and 5 are diagrams showing an outline of the inspection using the probe unit 1 having the above configuration. When the semiconductor integrated circuit 100 is inspected, a contact load from the semiconductor integrated circuit 100 is applied. As a result of the contact load being applied, the coil spring 23 is compressed along the longitudinal direction. When the coil spring 23 is compressed, the coil spring 23 is bent in the large-diameter holes 513 and 523 of the holding substrate 5 that are in communication with each other, so that the tightly wound portion 23 a contacts the proximal end portion 22 d of the second plunger 22. To do. Thereby, reliable electrical conduction is obtained. At this time, since the base end portion 22d of the second plunger 22 has entered the lower part of the tightly wound portion 23a, the axis of the second plunger 22 is not greatly shaken.

検査時に回路基板２００から半導体集積回路１００に供給される検査用信号は、回路基板２００の電極２０１からプローブ２の第１プランジャ２１、密着巻き部２３ａ、第２プランジャ２２を経由して半導体集積回路１００の電極１０１へ到達する。このように、プローブ２では、第１プランジャ２１と第２プランジャ２２が密着巻き部２３ａを介して導通するため、電気信号の導通経路を最小にすることができる。したがって、検査時に粗巻き部２３ｂに信号が流れるのを防止し、インダクタンスおよび抵抗の低減および安定化を図ることができる。   A test signal supplied from the circuit board 200 to the semiconductor integrated circuit 100 at the time of inspection is transmitted from the electrode 201 of the circuit board 200 to the semiconductor integrated circuit via the first plunger 21, the tightly wound portion 23 a, and the second plunger 22 of the probe 2. 100 electrodes 101 are reached. Thus, in the probe 2, since the first plunger 21 and the second plunger 22 are conducted through the tightly wound portion 23a, the conduction path of the electric signal can be minimized. Therefore, it is possible to prevent a signal from flowing through the rough winding portion 23b during inspection, and to reduce and stabilize the inductance and resistance.

プローブユニット１が複数の半導体集積回路１００に対して検査を繰り返し行った結果、第２プランジャ２２が劣化して交換しなければならなくなった場合には、カートリッジ基板６を保持基板５から取り外して交換すればよい。このため、従来の一体型のプローブのように、交換する必要がない箇所まで交換しなくて済む。また、保持基板５をハンドラーに取り付けたままの状態でカートリッジ基板６のみを交換すれば検査を続行することができるので、交換のために検査を停止する時間を最小限に抑え、カートリッジ基板２３の交換に伴う検査を遅延を最小限に抑えることができる。   When the probe unit 1 repeatedly inspects the plurality of semiconductor integrated circuits 100 and the second plunger 22 deteriorates and must be replaced, the cartridge substrate 6 is removed from the holding substrate 5 and replaced. do it. For this reason, it is not necessary to replace parts that do not need to be replaced as in a conventional integrated probe. Further, since the inspection can be continued if only the cartridge substrate 6 is replaced with the holding substrate 5 attached to the handler, the time for stopping the inspection for replacement can be minimized, and the cartridge substrate 23 Inspections associated with replacement can be minimized.

以上説明した本発明の一実施の形態によれば、コンタクトプローブの一方のプランジャ（第２プランジャ）をコイルばねに対して挿抜自在な構成とし、この第２プランジャを、コンタクトプローブの他の部分を保持する保持基板に対して着脱自在に取り付けられるカートリッジ基板によって保持する構成としたため、メインテナンスを行う際に第２プランジャだけを交換することができる。したがって、メインテナンスを容易にかつ低コストで行うことが可能となる。   According to the embodiment of the present invention described above, one plunger (second plunger) of the contact probe can be inserted into and removed from the coil spring, and the other part of the contact probe is connected to the other part of the contact probe. Since it is configured to be held by a cartridge substrate that is detachably attached to the holding substrate to be held, only the second plunger can be exchanged when performing maintenance. Therefore, maintenance can be performed easily and at low cost.

また、本実施の形態によれば、第２プランジャの長手方向の長さが第１プランジャの長手方向の長さより長く、かつ第２プランジャがコイルばねの密着巻き部まで挿入可能な構成としているため、プローブユニットの組立時や半導体集積回路の検査時にコンタクトプローブが軸線方向からぶれるのを抑制することができる。また、圧縮によってコイルばねが保持基板の内部で湾曲することにより、そのコイルばねの密着巻き部が第２プランジャの基端部と接触するため、確実な電気導通が得られる。したがって、プローブユニットの組立性を大きく向上させることができるとともに、検査時の安定した導通を確保することができる。   In addition, according to the present embodiment, the length of the second plunger in the longitudinal direction is longer than the length of the first plunger in the longitudinal direction, and the second plunger can be inserted up to the tightly wound portion of the coil spring. Further, it is possible to suppress the contact probe from being shaken from the axial direction when assembling the probe unit or inspecting the semiconductor integrated circuit. Further, since the coil spring is bent inside the holding substrate by the compression, the tightly wound portion of the coil spring comes into contact with the proximal end portion of the second plunger, so that reliable electrical conduction is obtained. Therefore, the assemblability of the probe unit can be greatly improved, and stable conduction at the time of inspection can be ensured.

また、本実施の形態によれば、カートリッジ基板を交換する際に別のカートリッジ基板を保持基板に取り付けて検査を続行することができるため、カートリッジ基板の交換に伴う検査の遅延を最小限に抑えることができる。   Further, according to the present embodiment, when the cartridge substrate is replaced, another cartridge substrate can be attached to the holding substrate and the inspection can be continued, so that the inspection delay accompanying the replacement of the cartridge substrate is minimized. be able to.

また、本実施の形態によれば、第２プランジャはコイルばねに固着されるわけではないため、第１プランジャのボス部とコイルばねの内径に要求される寸法精度よりも低い精度で加工することが可能となる。したがって、コンタクトプローブの生産性を向上させることができる。   In addition, according to the present embodiment, the second plunger is not fixed to the coil spring, so that the processing is performed with an accuracy lower than the dimensional accuracy required for the boss portion of the first plunger and the inner diameter of the coil spring. Is possible. Therefore, the productivity of the contact probe can be improved.

ここまで、本発明を実施するための最良の形態を説明してきたが、本発明は上述した一実施の形態によって限定されるべきものではない。すなわち、本発明は、ここでは記載していない様々な実施の形態等を含みうるものであり、特許請求の範囲により特定される技術的思想を逸脱しない範囲内において種々の設計変更等を施すことが可能である。   The best mode for carrying out the present invention has been described so far, but the present invention should not be limited by the above-described embodiment. That is, the present invention can include various embodiments and the like not described herein, and various design changes and the like can be made without departing from the technical idea specified by the claims. Is possible.

以上のように、本発明は、半導体集積回路等の検査対象物の電気特性検査を行う際に有用である。   As described above, the present invention is useful when performing an electrical property test on an inspection target such as a semiconductor integrated circuit.

Claims (2)

略針状をなす第１プランジャ、一端が前記第１プランジャに取り付けられ、前記第１プランジャの軸線方向に沿って伸縮自在なコイルばね、および一部が前記コイルばねの他端から当該コイルばねの内周部へ挿抜自在であり、前記第１プランジャよりも長手方向の長さが長い第２プランジャをそれぞれ有し、各々が長手方向の両端で互いに異なる二つの被接触体と接触し、前記二つの被接触体の間を電気的に接続する複数の導電性のコンタクトプローブと、
各コンタクトプローブが有する前記第１プランジャおよび前記コイルばねの組を個別に収容し、少なくとも前記第１プランジャの先端を表出させつつ抜け止めした状態で保持する保持基板と、
各コンタクトプローブが有する前記第２プランジャを個別に収容し、前記第２プランジャの両端部を表出させつつ抜け止めした状態で保持するとともに、各コンタクトプローブが有する前記第１プランジャ、前記コイルばねおよび前記第２プランジャの長手方向の軸線が一致した状態で前記保持基板に対して前記第１プランジャが表出する側と反対側から着脱自在に取り付けられるカートリッジ基板と、
を備え、
前記コイルばねは、線材が密着して巻かれた密着巻き部と、前記密着巻き部に連続し、自然長における長手方向の長さが前記密着巻き部の長手方向の長さよりも長く、前記線材が前記密着巻き部よりも粗く巻かれてなり、前記密着巻き部よりも前記カートリッジ基板が取り付けられる側の近くに位置する粗巻き部とを有し、
前記第２プランジャの一部は、前記カートリッジ基板を前記保持基板に取り付けた状態で、当該第２プランジャと長手方向の軸線が一致する前記コイルばねが有する前記密着巻き部の内周まで進入して該密着巻き部に面接触可能であることを特徴とするプローブユニット。 A first plunger having a substantially needle shape, one end attached to the first plunger, a coil spring that can expand and contract along the axial direction of the first plunger, and a part of the coil spring from the other end of the coil spring Each of the second plungers has a length in the longitudinal direction longer than that of the first plunger, and each of the second plungers is in contact with two different objects to be contacted at both ends in the longitudinal direction. A plurality of conductive contact probes that electrically connect two contacted objects;
A holding substrate that individually accommodates a set of the first plunger and the coil spring included in each contact probe, and holds at least a tip of the first plunger in a state of being prevented from coming off;
The second plunger included in each contact probe is individually accommodated and held in a state where both ends of the second plunger are exposed and prevented from coming off, and the first plunger included in each contact probe, the coil spring, and A cartridge substrate that is detachably attached to the holding substrate from the side opposite to the side on which the first plunger is exposed with the longitudinal axis of the second plunger aligned.
With
The coil spring is continuous to the tightly wound portion around which the wire is wound in close contact with the tightly wound portion, and the length in the longitudinal direction of the natural length is longer than the length in the longitudinal direction of the tightly wound portion. Has a coarsely wound portion positioned closer to the side on which the cartridge substrate is attached than the tightly wound portion .
The second part of the plunger, the cartridge substrate while attached to the holding substrate, enters to the inner circumference of the closely wound portion in which the coil spring axis line of the second plunger and the longitudinal direction coincides has A probe unit capable of surface contact with the tightly wound portion . 前記第２プランジャは、その全長に渡って前記コイルばねの内径よりも小さい径を有する基端部を備え、前記コイルばねの他端側において前記コイルばね内部には前記基端部のみが挿入されることを特徴とする請求項１に記載のプローブユニット。 The second plunger includes a base end portion having a diameter smaller than the inner diameter of the coil spring over the entire length thereof, and only the base end portion is inserted into the coil spring at the other end side of the coil spring. probe unit according to claim 1, characterized in that that.
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JP6556612B2 (en) * 2015-12-04 2019-08-07 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor device
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