TWI456645B - 半導體裝置用膜以及半導體裝置 - Google Patents

半導體裝置用膜以及半導體裝置 Download PDF

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Publication number
TWI456645B
TWI456645B TW100131942A TW100131942A TWI456645B TW I456645 B TWI456645 B TW I456645B TW 100131942 A TW100131942 A TW 100131942A TW 100131942 A TW100131942 A TW 100131942A TW I456645 B TWI456645 B TW I456645B
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TW
Taiwan
Prior art keywords
film
semiconductor device
mpa
elastic modulus
storage elastic
Prior art date
Application number
TW100131942A
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English (en)
Other versions
TW201216343A (en
Inventor
Yasuhiro Amano
Yuta Kimura
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW201216343A publication Critical patent/TW201216343A/zh
Application granted granted Critical
Publication of TWI456645B publication Critical patent/TWI456645B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Laminated Bodies (AREA)

Claims (6)

  1. 一種半導體裝置用膜，其是在切晶膜上積層了黏著膜的附切晶片的黏著膜以特定間隔設置而積層於覆蓋膜上的半導體裝置用膜，其特徵在於：23℃的切晶膜的拉伸儲存彈性模量Ea、與23℃的覆蓋膜的拉伸儲存彈性模量Eb之比Ea/Eb為0.001~100的範圍內。
  2. 如申請專利範圍第1項所述之半導體裝置用膜，其中上述黏著膜的玻璃轉移溫度為0℃~100℃的範圍內，且硬化前23℃的拉伸儲存彈性模量為50MPa~5000MPa的範圍。
  3. 如申請專利範圍第1項所述之半導體裝置用膜，其中上述覆蓋膜的厚度為10μm~100μm。
  4. 如申請專利範圍第1項所述之半導體裝置用膜，其中上述切晶膜的厚度為25μm~180μm。
  5. 如申請專利範圍第1項所述之半導體裝置用膜，其中23℃的上述切晶膜的拉伸儲存彈性模量Ea為1MPa~500MPa。
  6. 如申請專利範圍第1項所述之半導體裝置用膜，其中23℃的上述覆蓋膜的拉伸儲存彈性模量Eb為1MPa~5000MPa。
TW100131942A 2010-09-06 2011-09-05 半導體裝置用膜以及半導體裝置 TWI456645B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010199027A JP4976532B2 (ja) 2010-09-06 2010-09-06 半導体装置用フィルム

Publications (2)

Publication Number Publication Date
TW201216343A TW201216343A (en) 2012-04-16
TWI456645B true TWI456645B (zh) 2014-10-11

Family

ID=45810560

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100131942A TWI456645B (zh) 2010-09-06 2011-09-05 半導體裝置用膜以及半導體裝置

Country Status (5)

Country Link
JP (1) JP4976532B2 (zh)
KR (1) KR101183730B1 (zh)
CN (1) CN103081069B (zh)
TW (1) TWI456645B (zh)
WO (1) WO2012032958A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5997506B2 (ja) * 2012-05-31 2016-09-28 リンテック株式会社 ダイシング・ダイボンディングシート
JP6101492B2 (ja) * 2013-01-10 2017-03-22 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
JP2015129226A (ja) * 2014-01-08 2015-07-16 日東電工株式会社 フィルム状接着剤、フィルム状接着剤付きダイシングテープ、半導体装置の製造方法、及び半導体装置
JP2015199814A (ja) * 2014-04-08 2015-11-12 住友ベークライト株式会社 樹脂組成物、接着フィルム、接着シート、ダイシングテープ一体型接着シート、バックグラインドテープ一体型接着シート、ダイシングテープ兼バックグラインドテープ一体型接着シート、および、電子装置
JP6406999B2 (ja) * 2014-12-04 2018-10-17 古河電気工業株式会社 ウェハ加工用テープ
JP6382088B2 (ja) * 2014-12-04 2018-08-29 古河電気工業株式会社 ウェハ加工用テープ
JP2016111158A (ja) * 2014-12-04 2016-06-20 古河電気工業株式会社 ウェハ加工用テープ
JP2016111156A (ja) * 2014-12-04 2016-06-20 古河電気工業株式会社 ウェハ加工用テープ
JP6445315B2 (ja) * 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6721398B2 (ja) * 2016-04-22 2020-07-15 日東電工株式会社 ダイシングダイボンディングフィルム、ダイシングダイボンディングテープおよび半導体装置の製造方法
JP6295304B1 (ja) * 2016-10-03 2018-03-14 日東電工株式会社 ダイシングテープ一体型接着シート
JP6961387B2 (ja) * 2017-05-19 2021-11-05 日東電工株式会社 ダイシングダイボンドフィルム
JP7046585B2 (ja) * 2017-12-14 2022-04-04 日東電工株式会社 接着フィルムおよびダイシングテープ付き接着フィルム
JP2018148218A (ja) * 2018-04-18 2018-09-20 日東電工株式会社 半導体装置用フィルム、及び、半導体装置の製造方法
US20220293555A1 (en) * 2019-08-26 2022-09-15 Lintec Corporation Method of manufacturing laminate
CN115315785A (zh) 2020-03-27 2022-11-08 琳得科株式会社 半导体装置制造用片

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW443964B (en) * 1998-03-30 2001-07-01 Minnesota Mining & Mfg Semiconductor wafer processing tapes and method of processing a semiconductor wafer
TW201030119A (en) * 2008-12-02 2010-08-16 Nitto Denko Corp Film for manufacturing semiconductor device and fabricating method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4393934B2 (ja) * 2004-06-23 2010-01-06 リンテック株式会社 半導体加工用粘着シート
JP5286085B2 (ja) * 2007-07-19 2013-09-11 積水化学工業株式会社 ダイシング−ダイボンディングテープ及び半導体チップの製造方法
JP5319993B2 (ja) 2008-09-10 2013-10-16 積水化学工業株式会社 ダイシング−ダイボンディングテープ及び半導体チップの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW443964B (en) * 1998-03-30 2001-07-01 Minnesota Mining & Mfg Semiconductor wafer processing tapes and method of processing a semiconductor wafer
TW201030119A (en) * 2008-12-02 2010-08-16 Nitto Denko Corp Film for manufacturing semiconductor device and fabricating method thereof

Also Published As

Publication number Publication date
KR101183730B1 (ko) 2012-09-17
JP2012059768A (ja) 2012-03-22
CN103081069A (zh) 2013-05-01
KR20120034620A (ko) 2012-04-12
JP4976532B2 (ja) 2012-07-18
TW201216343A (en) 2012-04-16
CN103081069B (zh) 2015-11-25
WO2012032958A1 (ja) 2012-03-15

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