TWI455369B - Light emitting diode - Google Patents
Light emitting diode Download PDFInfo
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- TWI455369B TWI455369B TW100145712A TW100145712A TWI455369B TW I455369 B TWI455369 B TW I455369B TW 100145712 A TW100145712 A TW 100145712A TW 100145712 A TW100145712 A TW 100145712A TW I455369 B TWI455369 B TW I455369B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Description
本發明涉及一種發光器件，尤其是一種發光二極體。 The invention relates to a light emitting device, in particular to a light emitting diode.
LED(發光二極體，Light-emitting diode)產業是近幾年最受矚目的產業之一，發展至今，LED產品已具有節能、省電、高效率、反應時間快、壽命週期時間長、且不含汞、具有環保效益等優點，因此被認為是新世代綠色節能照明的最佳光源。LED在封裝時，一般會利用光學透鏡改變其出光光場以達到應用效果。然而，通常的方法是通過注塑或黏合的過程方式將透鏡固接在基板或反射杯上。在遇到不同光場需求的時候，必須重新製造不同的透鏡，使得LED下游產商的投入加大。 The LED (Light-emitting Diode) industry is one of the most watched industries in recent years. Since its development, LED products have been energy-saving, energy-saving, high-efficiency, fast response time, long life cycle, and It is mercury-free and environmentally friendly, so it is considered to be the best source of energy for new generations of green energy-saving lighting. When the LED is packaged, the optical lens is generally used to change its light field to achieve the application effect. However, the usual method is to attach the lens to the substrate or the reflective cup by means of an injection molding or bonding process. When encountering different light field requirements, different lenses must be remanufactured, resulting in increased investment from downstream LED manufacturers.
有鑒於此，有必要提供一種有效降低成本的發光二極體。 In view of this, it is necessary to provide a light-emitting diode that effectively reduces the cost.
一種發光二極體，其包括基板、電極組、反射杯、晶片、透鏡，該電極組貼設於基板上，該反射杯搭載於基板上並形成凹杯，晶片搭載於該凹杯內並與該電極組達成電性連接，該反射杯上具有沿遠離晶片方向設置的多個用於固定所述透鏡的固定槽，所述透鏡能夠固定於所述多個固定槽中的任意一個固定槽上，該反射杯具有一內表面，該固定槽由該內表面向遠離凹杯的方向凹陷，該透鏡包括凸部與固定部，該凸部對晶片發出的光線進行調整，該 固定部用於將透鏡卡榫於固定槽中，所述固定部的自由端側面與固定槽底面相互間隔形成間隙。 A light-emitting diode includes a substrate, an electrode group, a reflector cup, a wafer, and a lens. The electrode group is attached to the substrate, and the reflective cup is mounted on the substrate and forms a concave cup. The wafer is mounted in the concave cup and The electrode group is electrically connected, and the reflective cup has a plurality of fixing grooves disposed in the direction away from the wafer for fixing the lens, and the lens can be fixed on any one of the plurality of fixing grooves The reflective cup has an inner surface, and the fixing groove is recessed from the inner surface away from the concave cup. The lens includes a convex portion and a fixing portion, and the convex portion adjusts the light emitted by the wafer. The fixing portion is configured to clamp the lens into the fixing groove, and the free end side of the fixing portion and the bottom surface of the fixing groove are spaced apart from each other to form a gap.
由於發光二極體的反射杯上具有距離晶片不等的固定結構，故透鏡可通過卡榫於不同固定結構內以實現透鏡與晶片的距離不等進而改變發光二極體的出光光場，有效降低封裝成本。 Since the reflective cup of the light-emitting diode has a fixed structure different from the wafer, the lens can be changed in the different fixed structures to realize the distance between the lens and the wafer to change the light-emitting field of the light-emitting diode, which is effective. Reduce packaging costs.
100‧‧‧發光二極體 100‧‧‧Lighting diode
10‧‧‧基板 10‧‧‧Substrate
20‧‧‧電極組 20‧‧‧electrode group
21‧‧‧第一電極 21‧‧‧First electrode
22‧‧‧第二電極 22‧‧‧second electrode
30‧‧‧反射杯 30‧‧‧Reflection Cup
301‧‧‧凹杯 301‧‧‧ concave cup
302‧‧‧內表面 302‧‧‧ inner surface
31‧‧‧第一固定槽 31‧‧‧First fixed slot
32‧‧‧第二固定槽 32‧‧‧Second fixing slot
33‧‧‧固定槽 33‧‧‧fixed slot
40‧‧‧晶片 40‧‧‧ wafer
50‧‧‧導線 50‧‧‧ wire
60‧‧‧透鏡 60‧‧‧ lens
61‧‧‧凸部 61‧‧‧ convex
62‧‧‧固定部 62‧‧‧ Fixed Department
70‧‧‧封裝膠 70‧‧‧Package
D、D1、D2‧‧‧孔徑 D, D1, D2‧‧‧ aperture
D3‧‧‧直徑 D3‧‧‧diameter
1‧‧‧第一出光曲線 1‧‧‧First light curve
2‧‧‧第二出光曲線 2‧‧‧second light curve
圖1是本發明發光二極體的部分分解圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a partially exploded view of a light-emitting diode of the present invention.
圖2是本發明發光二極體的第一狀態組裝圖。 Fig. 2 is a first state assembly diagram of a light-emitting diode of the present invention.
圖3是本發明發光二極體的第二狀態組裝圖。 Fig. 3 is a second state assembly diagram of the light-emitting diode of the present invention.
圖4是圖2與圖3的兩種狀態組裝的發光二極體的出光光場對比圖。 4 is a comparison diagram of light exiting light field of the light-emitting diode assembled in the two states of FIGS. 2 and 3.
請參閱圖1，示出了本發明的發光二極體100的部分分解圖。發光二極體100包含一基板10、一電極組20、一反射杯30、一晶片40、若干導線50以及一透鏡60。該基板10由陶瓷、塑膠或其他的絕緣材料製成用以承載電極組20、反射杯30以及晶片40。該電極組20貼設於基板10上，其由導電材料製成，並由一間隙分隔為彼此絕緣的第一電極21與第二電極22作為發光二極體100的兩電極。 Referring to Figure 1, a partially exploded view of a light emitting diode 100 of the present invention is shown. The light emitting diode 100 includes a substrate 10, an electrode group 20, a reflective cup 30, a wafer 40, a plurality of wires 50, and a lens 60. The substrate 10 is made of ceramic, plastic or other insulating material for carrying the electrode assembly 20, the reflective cup 30, and the wafer 40. The electrode group 20 is attached to the substrate 10, and is made of a conductive material, and the first electrode 21 and the second electrode 22, which are separated from each other by a gap, serve as two electrodes of the light-emitting diode 100.
反射杯30搭載於電極組20上並形成一凹杯301，凹杯301中同時暴露出第一電極21與第二電極22。反射杯30具有一內表面302，內表面302上鍍有高反射率材料。晶片40為一固態半導體發光晶片40，其搭載於凹杯301裏，並由導線50連通該第一電極21與該第二電極22。可以理解地，該晶片40也可通過覆晶或共晶的方式與 該第一電極21、第二電極22達成電性連接。當第一電極21與第二電極22接上異性電源時，晶片40對外發光。當晶片40發光時，光線可通過反射杯30反射出去。反射杯30上開有固定槽33。在本實施例中，反射杯30開設有第一固定槽31以及第二固定槽32，分別用以承載透鏡60。該第一固定槽31與第二固定槽32均由反射杯30的內表面302向遠離凹杯301的方向凹陷但並未穿透反射杯30。由於反射杯30的內表面302略微傾斜延伸，且凹杯302呈向基板10略微漸縮的形狀，因此凹杯302在與基板10相距不同的高度上有不同孔徑D。在本實施例中，該第一固定槽31比第二固定槽32處於距離基板10更遠的位置處，並且與基板10之間的距離均高於晶片40的高度。該第一固定槽31與第二固定槽32的開槽方向均與基板10平行，且兩固定槽31、32的槽內寬度相等。對應第一固定槽31高度處的凹杯301的孔徑D比對應第二固定槽32高度處的凹杯301的孔徑D略大。定義位於距離基板10最遠的固定槽31所對應凹杯301的孔徑D為孔徑D1，其中一固定槽31或32所對應的凹杯301的孔徑D與其開槽深度的總和的最小者為孔徑D2。在本實施例中，第一固定槽31所對應的凹杯301的孔徑D為孔徑D1，該第二固定槽32應該所對應的凹杯301的孔徑D與其開槽深度的總和為孔徑D2。透鏡60由透明材料製成，並對晶片40所產生的光線進行折射以透射出需要的光場。透鏡60包括一凸部61，該凸部61形成一凸透鏡，對晶片40發出的光線進行調整。凸部61周邊凸伸出一固定部62，該固定部62的厚度等於或略小於第一固定槽31與第二固定槽32的開槽寬度。透鏡60的最大直徑D3與凹杯301以及第一固定槽31與第二固定槽32匹配，也即是組裝透鏡60於凹杯301中時，固定部62能伸入到第一固定槽31或第二固定槽32中。由於第一固定槽 31與第二固定槽32相應高度的凹杯301的孔徑D不相等，故該第一固定槽31與該第二固定槽32的開槽深度不一定相同。為了使透鏡60在第一固定槽31及第二固定槽32內均能固定，從發光二極體100的豎直方向上，該第一固定槽31與第二固定槽32須有重複的部分，而該透鏡60的直徑D3則控制在D1-D2之間。透鏡60的凸部61的直徑D3則可根據光場的需要調整在不大於D1的範圍內。 The reflector cup 30 is mounted on the electrode group 20 and forms a concave cup 301 in which the first electrode 21 and the second electrode 22 are simultaneously exposed. Reflector cup 30 has an inner surface 302 on which is coated with a high reflectivity material. The wafer 40 is a solid-state semiconductor light-emitting chip 40 that is mounted in the concave cup 301 and communicates with the first electrode 21 and the second electrode 22 by a wire 50. It can be understood that the wafer 40 can also be flip-chip or eutectic. The first electrode 21 and the second electrode 22 are electrically connected. When the first electrode 21 and the second electrode 22 are connected to the opposite power source, the wafer 40 emits light externally. When the wafer 40 is illuminated, light can be reflected off the reflective cup 30. A fixing groove 33 is opened in the reflecting cup 30. In the embodiment, the reflective cup 30 is provided with a first fixing groove 31 and a second fixing groove 32 for respectively carrying the lens 60. The first fixing groove 31 and the second fixing groove 32 are both recessed from the inner surface 302 of the reflecting cup 30 in a direction away from the concave cup 301 but do not penetrate the reflecting cup 30. Since the inner surface 302 of the reflective cup 30 extends slightly obliquely and the concave cup 302 has a shape that is slightly tapered toward the substrate 10, the concave cups 302 have different apertures D at different heights from the substrate 10. In the present embodiment, the first fixing groove 31 is located farther from the substrate 10 than the second fixing groove 32, and the distance from the substrate 10 is higher than the height of the wafer 40. The groove direction of the first fixing groove 31 and the second fixing groove 32 are both parallel to the substrate 10, and the widths of the grooves of the two fixing grooves 31 and 32 are equal. The aperture D of the concave cup 301 corresponding to the height of the first fixing groove 31 is slightly larger than the diameter D of the concave cup 301 at the height corresponding to the second fixing groove 32. The aperture D of the concave cup 301 corresponding to the fixing groove 31 located farthest from the substrate 10 is defined as the aperture D1, and the smallest of the sum of the aperture D of the concave cup 301 corresponding to a fixing groove 31 or 32 and the groove depth is the aperture D2. In the present embodiment, the aperture D of the concave cup 301 corresponding to the first fixing groove 31 is the aperture D1, and the sum of the aperture D of the corresponding concave cup 301 and the grooved depth of the second fixing groove 32 is the aperture D2. Lens 60 is made of a transparent material and refracts light generated by wafer 40 to transmit the desired light field. The lens 60 includes a convex portion 61 which forms a convex lens for adjusting the light emitted from the wafer 40. A fixing portion 62 is protruded from the periphery of the convex portion 61. The thickness of the fixing portion 62 is equal to or slightly smaller than the groove width of the first fixing groove 31 and the second fixing groove 32. The maximum diameter D3 of the lens 60 matches the concave cup 301 and the first fixing groove 31 and the second fixing groove 32, that is, when the lens 60 is assembled in the concave cup 301, the fixing portion 62 can protrude into the first fixing groove 31 or In the second fixing groove 32. Due to the first fixing groove The diameter D of the concave cup 301 corresponding to the height of the second fixing groove 32 is not equal, so the groove depth of the first fixing groove 31 and the second fixing groove 32 is not necessarily the same. In order to fix the lens 60 in the first fixing slot 31 and the second fixing slot 32, the first fixing slot 31 and the second fixing slot 32 must have a repeating portion from the vertical direction of the LED body 100. The diameter D3 of the lens 60 is controlled between D1 and D2. The diameter D3 of the convex portion 61 of the lens 60 can be adjusted within a range not greater than D1 depending on the needs of the light field.
請同時參閱圖2-4，示出了本發明發光二極體100的兩種狀態的組裝圖以及該兩種狀態組裝下的出光光場分佈對比圖。圖2中為發光二極體100的一種狀態圖。透鏡60通過其凸伸的固定部62將其卡榫於反射杯30的第一固定槽31內，以將晶片40與導線50包覆於凹杯301內。透鏡60與基板10、反射杯30之間形成的空腔內可包含封裝膠70，封裝膠70內還可包含螢光粉。透鏡60卡榫於第一固定槽31內時，發光二極體100的出光曲線如圖4中的第一出光曲線1所示。圖3中為發光二極體100的另一種狀態圖。透鏡60通過其凸伸的固定部62將其卡榫於反射杯30的第二固定槽32內，以將晶片40與導線50包覆於凹杯301內。透鏡60與基板10、反射杯30之間形成的空腔內可包含封裝膠70，封裝膠70內還可包含螢光粉。由於第二固定槽32較第一固定槽31更靠近基板10，故當透鏡60卡榫於第二固定槽32時，光線從晶片40中出射後將更靠發光二極體100出光面的中央偏轉。透鏡60卡榫於第二固定槽32內時，發光二極體100的出光曲線如圖4中的第二出光曲線2所示。從圖4中的比較可知，由於該第一固定槽31、第二固定槽32具有高度差，故當透鏡60卡榫與不同固定槽31或32時，透鏡60與晶片40之間的距離也不同，則導致發光二極體100的出光曲線不同。該透鏡60為可拆卸式透鏡60，也即是可在制程中根據需求選擇第一固定槽31 或第二固定槽32。 Referring to FIG. 2-4 at the same time, an assembly diagram of two states of the light-emitting diode 100 of the present invention and a comparison diagram of the light-emitting field distribution under the two state assembly are shown. FIG. 2 is a state diagram of the light emitting diode 100. The lens 60 is clamped into the first fixing groove 31 of the reflective cup 30 by its protruding fixing portion 62 to cover the wafer 40 and the wire 50 in the concave cup 301. The encapsulant 70 may be included in the cavity formed between the lens 60 and the substrate 10 and the reflective cup 30. The encapsulant 70 may further contain phosphor powder. When the lens 60 is locked in the first fixing groove 31, the light-emitting diode 100 has a light-emitting curve as shown by the first light-emitting curve 1 in FIG. FIG. 3 is another state diagram of the light emitting diode 100. The lens 60 is clamped into the second fixing groove 32 of the reflective cup 30 by its protruding fixing portion 62 to wrap the wafer 40 and the wire 50 in the concave cup 301. The encapsulant 70 may be included in the cavity formed between the lens 60 and the substrate 10 and the reflective cup 30. The encapsulant 70 may further contain phosphor powder. Since the second fixing groove 32 is closer to the substrate 10 than the first fixing groove 31, when the lens 60 is locked to the second fixing groove 32, the light will be emitted from the wafer 40 and will be closer to the center of the light emitting surface of the LED body 100. deflection. When the lens 60 is locked in the second fixing groove 32, the light-emitting diode 100 has a light-emitting curve as shown by the second light-emitting curve 2 in FIG. As can be seen from the comparison in FIG. 4, since the first fixing groove 31 and the second fixing groove 32 have a height difference, when the lens 60 is locked with the different fixing grooves 31 or 32, the distance between the lens 60 and the wafer 40 is also Differently, the light-emitting diode 100 has a different light-emitting curve. The lens 60 is a detachable lens 60, that is, the first fixing groove 31 can be selected according to requirements during the manufacturing process. Or the second fixing groove 32.
由於發光二極體100的反射杯30上具有距離基板10不等，也即是距離晶片40不等的第一固定槽31與第二固定槽32，故透鏡60可通過卡榫於不同固定槽31或32內以實現透鏡60距離晶片40的距離不等，進而改變發光二極體100出光光場。當遇到不同光場需求的時候，LED下游產商可通過選擇將透鏡60卡榫於不同固定槽31或32中，用同一制程即可實現，有效降低封裝成本。 Since the reflective cup 30 of the light-emitting diode 100 has a distance from the substrate 10, that is, the first fixing groove 31 and the second fixing groove 32 which are different from the wafer 40, the lens 60 can be locked in different fixing grooves. In 31 or 32, the distance between the lens 60 and the wafer 40 is varied, thereby changing the light field of the light-emitting diode 100. When encountering different light field requirements, the downstream LED manufacturer can select the lens 60 to be clamped in different fixed slots 31 or 32, which can be realized by the same process, thereby effectively reducing the packaging cost.
可以理解地，反射杯30不僅限於包含兩個固定槽31和32，還可以包含三個或更多固定槽33，並且該多個固定槽33與基板10的距離不等。並且每一固定槽33的從發光二極體100的豎直方向上須有重複的部分，而透鏡60的孔徑D3則在該多個固定槽33的D1與D2之間。則透鏡60可通過卡榫與不同固定槽33中以得到不同的出光曲線。固定槽33也不限於呈開槽方向與基板10平行的情況。若固定槽33設置成與基板10成一角度傾斜，則透鏡60的固定部62也隨之呈一傾斜狀。若固定槽33呈弧形，則固定部62也呈弧形延伸。反射杯30的內表面302也不限於傾斜延伸，其凹杯301的孔徑也可以保持相等。 It can be understood that the reflective cup 30 is not limited to including two fixing grooves 31 and 32, and may also include three or more fixing grooves 33, and the distance between the plurality of fixing grooves 33 and the substrate 10 is not equal. And each of the fixing grooves 33 has a repeating portion from the vertical direction of the light emitting diode 100, and the aperture D3 of the lens 60 is between D1 and D2 of the plurality of fixing grooves 33. Then, the lens 60 can be folded into different fixing grooves 33 to obtain different light outgoing curves. The fixing groove 33 is not limited to the case where the groove direction is parallel to the substrate 10. If the fixing groove 33 is disposed at an angle to the substrate 10, the fixing portion 62 of the lens 60 is also inclined. If the fixing groove 33 is curved, the fixing portion 62 also extends in an arc shape. The inner surface 302 of the reflector cup 30 is also not limited to being inclined, and the aperture of the concave cup 301 may remain equal.
還可以理解地，固定槽33與固定部62的形態還可互換，即反射杯30內部形成多個固定部62，而透鏡60周緣形成一固定槽33；或者是反射杯30內部形成一個固定部62，而透鏡60周緣形成多個固定槽33，同樣可起到更換出光的目的。 It is also understood that the shape of the fixing groove 33 and the fixing portion 62 are also interchangeable, that is, a plurality of fixing portions 62 are formed inside the reflecting cup 30, and a fixing groove 33 is formed on the periphery of the lens 60; or a fixing portion is formed inside the reflecting cup 30. 62, and a plurality of fixing grooves 33 are formed on the periphery of the lens 60, so as to replace the light.
100‧‧‧發光二極體 100‧‧‧Lighting diode
10‧‧‧基板 10‧‧‧Substrate
20‧‧‧電極組 20‧‧‧electrode group
21‧‧‧第一電極 21‧‧‧First electrode
22‧‧‧第二電極 22‧‧‧second electrode
30‧‧‧反射杯 30‧‧‧Reflection Cup
301‧‧‧凹杯 301‧‧‧ concave cup
302‧‧‧內表面 302‧‧‧ inner surface
31‧‧‧第一固定槽 31‧‧‧First fixed slot
32‧‧‧第二固定槽 32‧‧‧Second fixing slot
33‧‧‧固定槽 33‧‧‧fixed slot
40‧‧‧晶片 40‧‧‧ wafer
50‧‧‧導線 50‧‧‧ wire
60‧‧‧透鏡 60‧‧‧ lens
61‧‧‧凸部 61‧‧‧ convex
62‧‧‧固定部 62‧‧‧ Fixed Department
D1、D2‧‧‧孔徑 D1, D2‧‧‧ aperture
D3‧‧‧直徑 D3‧‧‧diameter
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110388870.7A CN103137826B (en) | 2011-11-30 | 2011-11-30 | Light-emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201322499A TW201322499A (en) | 2013-06-01 |
| TWI455369B true TWI455369B (en) | 2014-10-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100145712A TWI455369B (en) | 2011-11-30 | 2011-12-12 | Light emitting diode |
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| Country | Link |
|---|---|
| CN (1) | CN103137826B (en) |
| TW (1) | TWI455369B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI773884B (en) * | 2018-03-06 | 2022-08-11 | 立碁電子工業股份有限公司 | Uv led package structure |
| CN109509827B (en) * | 2018-11-29 | 2020-06-05 | 鸿利智汇集团股份有限公司 | Deep ultraviolet semiconductor light emitting diode device and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1471730A1 (en) * | 2003-03-31 | 2004-10-27 | Dialog Semiconductor GmbH | Miniature camera module |
| TW200849671A (en) * | 2007-02-13 | 2008-12-16 | 3M Innovative Properties Co | LED devices having lenses and methods of making same |
| CN201273479Y (en) * | 2008-09-26 | 2009-07-15 | 华能光电科技股份有限公司 | Customized combination type luminous module used for generating vertical electric connection |
| US20100118157A1 (en) * | 2008-11-07 | 2010-05-13 | Akira Ushijima | Method of manufacturing camera module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9944031B2 (en) * | 2007-02-13 | 2018-04-17 | 3M Innovative Properties Company | Molded optical articles and methods of making same |
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2011
- 2011-11-30 CN CN201110388870.7A patent/CN103137826B/en active Active
- 2011-12-12 TW TW100145712A patent/TWI455369B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1471730A1 (en) * | 2003-03-31 | 2004-10-27 | Dialog Semiconductor GmbH | Miniature camera module |
| TW200849671A (en) * | 2007-02-13 | 2008-12-16 | 3M Innovative Properties Co | LED devices having lenses and methods of making same |
| CN201273479Y (en) * | 2008-09-26 | 2009-07-15 | 华能光电科技股份有限公司 | Customized combination type luminous module used for generating vertical electric connection |
| US20100118157A1 (en) * | 2008-11-07 | 2010-05-13 | Akira Ushijima | Method of manufacturing camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103137826B (en) | 2016-03-23 |
| CN103137826A (en) | 2013-06-05 |
| TW201322499A (en) | 2013-06-01 |
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