TWI773884B

TWI773884B - Uv led package structure

Info

Publication number: TWI773884B
Application number: TW108107577A
Authority: TW
Inventors: 陳義文; 李孝文; 童義興
Original assignee: 立碁電子工業股份有限公司
Priority date: 2018-03-06
Filing date: 2019-03-05
Publication date: 2022-08-11
Also published as: TW201939770A

Abstract

本發明之紫外光發光二極體封裝結構，係由一基板、至少一紫外光發光二極體晶片、一蓋體以及一可拆式光學透鏡組構而成，其中，紫外光發光二極體晶片係電性組設於基板之安裝面上，且該蓋體位於該基板上並覆蓋於紫外光發光二極體晶片，又，該可拆式光學透鏡係組設於該蓋體上，本發明利用一金屬材料作為各元件之間的黏合劑，藉此，改善習知發光二極體使用有機膠材作為黏合劑，長期照射造成膠材變質之問題。 The ultraviolet light emitting diode package structure of the present invention is composed of a substrate, at least one ultraviolet light emitting diode chip, a cover and a detachable optical lens, wherein the ultraviolet light emitting diode The chip is electrically assembled on the mounting surface of the substrate, and the cover is located on the substrate and covers the ultraviolet light emitting diode chip, and the detachable optical lens is assembled on the cover. The invention utilizes a metal material as the adhesive between the components, thereby improving the problem that the conventional light-emitting diode uses an organic adhesive as the adhesive, and the adhesive is deteriorated due to long-term irradiation.

Description

紫外光發光二極體封裝結構 UV light emitting diode packaging structure

本發明是有關於一種發光二極體封裝結構，尤指一種用於紫外光固化裝置的紫外光發光二極體封裝結構。 The present invention relates to a light-emitting diode packaging structure, in particular to an ultraviolet light-emitting diode packaging structure for an ultraviolet light curing device.

發光二極體(LED,Light Emitting Diode)已經逐漸被應用作為各種光源，包括可見光發光二極體供一般照明、以及不可見光發光二極體供特殊照明，例如紫外光發光二極體在抗生(antibiosis)、防塵、純化、殺菌、固化、乾燥、接著等方面具優越效能，且紫外光發光二極體具有體積小、使用壽命長、耗電量低等優點，然，紫外光發光二極體的使用壽命與許多因素有關，諸如紫外光發光二極體的發光波長、操作環境的溫度、濕度或其他原因，都會影響紫外光發光二極體的使用是否能夠維持長時間而不劣化，且習知發光二極體封裝常見的有機材料在長期照射紫外線(波長450nm以下)後會發生變質，造成穿透率下降，同時還會失去附著力，故在產品中後期的出光效益與品質都會有疑慮，且面臨到產品使用壽命不長的問題，而無法提供紫外光發光二極體長期的良好封裝效果，此外，目前固化機或上光機，大多採用通過紫外線照射而進行固化油墨，但因需要對較寬的矩形形狀的照射區域進行高照射強度紫外線的照射，所以大多採用高壓汞燈或大量發光二極體，並相對照射區域設置的光照射裝置，這種採用大量發光二極體的光照射裝置，會出現因發光元件發熱而溫度上升，從而導致發光元件的發光效率明顯降低的問題，為能改善上述光型及散熱狀況，現行市面產品大多使用石英玻璃作為發光二極體之透鏡材料，透過其在短波長下仍可維持高穿透率的特性，維持產品穩定的出光效益，例如中華民國發明專利公告號第M313317號「具有模造玻璃透鏡之發光二極體組件」、中華民國發明專利公告號第M530478號「紫外光發光二極體的封裝結構」、中華民國發明專利公告號第M474884號「光源模組」、中華民國發明專利公告號第I565108號「發光二極體裝置」、中華民國發明專利公開號第TW201721907號「紫外光發光二極體的封裝結構」、中國發明專利公開號第CN106299042A號「一種紫外led光源無機封裝方法」，惟，上述專利存在下列之問題：(1)習知紫外光LED結構仍存有有機材料(例如各元件之間採用有機膠材黏合)，有機材料在長期照射紫外線後會發生變質失去附著力；(2)習知紫外光LED的玻璃透鏡並無法調整光型，倘若欲使紫外光LED產生特定光型，則會大幅提升該玻璃透鏡的製造成本與加工不易問題；(3)習知紫外光LED的玻璃透鏡無法符合組裝方便、快速、與可拆卸更換的需求；(4)目前用於固化裝置的紫外光之光源，當內部LED晶片損壞進而使整體亮度下降，使用者無法立即性的對單一個LED晶片進行維修，而只能更換新的一組UV LED模組作為使用，因此，所需成本對於使用者來說也是一個負擔，緣是，上述現有方式仍有諸多缺失，實非一良善之設計，而亟待加以改良。 Light Emitting Diode (LED, Light Emitting Diode) has been gradually used as a variety of light sources, including visible light emitting diodes for general lighting, and invisible light emitting diodes for special lighting, such as ultraviolet light emitting diodes in antibiotics ( Antibiosis), dust prevention, purification, sterilization, curing, drying, and then have superior performance, and UV light-emitting diodes have the advantages of small size, long service life, low power consumption, etc., of course, UV light-emitting diodes The service life is related to many factors, such as the light-emitting wavelength of the ultraviolet light-emitting diode, the temperature, humidity of the operating environment, or other reasons, which will affect whether the use of the ultraviolet light-emitting diode can be maintained for a long time without deterioration. It is known that the common organic materials in LED packaging will deteriorate after long-term exposure to ultraviolet light (wavelength below 450nm), resulting in a decrease in transmittance and loss of adhesion, so there will be doubts about the efficiency and quality of light in the middle and later stages of the product. , and faced with the problem of short product service life, which cannot provide long-term good encapsulation effect of UV light-emitting diodes. In addition, most of the current curing machines or glazing machines use ultraviolet irradiation to cure ink, but due to the need High-intensity ultraviolet rays are irradiated to a wide rectangular irradiation area, so high-pressure mercury lamps are often used. Or a large number of light-emitting diodes, and a light irradiation device set opposite the irradiation area, such a light irradiation device using a large number of light-emitting diodes, the temperature of the light-emitting element will rise due to heat, resulting in a significant reduction in the luminous efficiency of the light-emitting element. The problem is, in order to improve the above-mentioned light type and heat dissipation, most of the current products on the market use quartz glass as the lens material of the light-emitting diode, through which it can still maintain high transmittance at short wavelengths, and maintain the stable light-emitting efficiency of the product. For example, the Republic of China Invention Patent Bulletin No. M313317 "Light Emitting Diode Assembly with Molded Glass Lens", the Republic of China Invention Patent Bulletin No. M530478 "The Package Structure of Ultraviolet Light Emitting Diodes", the Republic of China Invention Patent Bulletin No. M474884 "Light Source Module", Republic of China Invention Patent Publication No. I565108 "Light Emitting Diode Device", Republic of China Invention Patent Publication No. TW201721907 "Packaging Structure of Ultraviolet Light Emitting Diode", Chinese Invention Patent Publication No. CN106299042A "An Inorganic Encapsulation Method for Ultraviolet LED Light Source", however, the above-mentioned patent has the following problems: (1) The conventional ultraviolet LED structure still has organic materials (for example, the components are bonded by organic glue) ), organic materials will deteriorate and lose their adhesion after long-term exposure to ultraviolet light; (2) the conventional glass lens of ultraviolet LEDs cannot adjust the light type. The manufacturing cost and processing of the lens are not easy; (3) the glass lens of the conventional UV LED cannot meet the requirements of easy assembly, rapidity, and disassembly and replacement; (4) the current UV light source used in the curing device, when the internal The LED chip is damaged and the overall brightness is reduced. The user cannot repair a single LED chip immediately, but can only replace a new set of UV LED modules for use. Therefore, the required cost is also one for the user. The burden is that the above-mentioned existing methods still have many shortcomings, which are not a good design and need to be improved urgently.

有鑑於上述的問題，本發明人係依據多年來從事發光二極體相關產品研發的經驗，針對發光二極體封裝結構及紫外光固化裝置及進行研究分析，期能設計出符合上述需求的實體產品；緣此，本發明提供一種以金屬作為黏合材料，使其達到無機封裝的紫外光發光二極體封裝結構。 In view of the above problems, the inventors have conducted research and analysis on LED packaging structures and UV curing devices based on years of experience in the research and development of light-emitting diode-related products, hoping to design an entity that meets the above requirements. product; for this reason, the present invention provides an ultraviolet light emitting diode packaging structure that uses metal as an adhesive material to achieve inorganic packaging.

本發明之另一實施例提供一種藉由拆換或組裝光學透鏡方式，使其紫外光發光二極體所發出之光線透過不同弧面設計之光學透鏡，進而形成不同光形表現及出光角度的紫外光發光二極體封裝結構。 Another embodiment of the present invention provides a method of disassembling or assembling the optical lens, so that the light emitted by the ultraviolet light emitting diode can pass through the optical lens with different arc surface designs, thereby forming different light shape performance and light exit angle. UV light emitting diode package structure.

本發明之另一實施例係於線路層中直接長出一微結構的導電柱，透過高低位差之設計，藉此改善打線不良的紫外光發光二極體封裝結構。 Another embodiment of the present invention is to directly grow a micro-structured conductive column in the circuit layer, and through the design of the high and low level difference, thereby improving the UV light emitting diode packaging structure with poor wire bonding.

為達上述目的，本發明之紫外光發光二極體封裝結構，其包括一基板、至少一紫外光發光二極體晶片以及一蓋體，其中，基板具有一安裝面，紫外光發光二極體晶片係電性組設於基板之安裝面上，且該蓋體位於基板上並覆蓋於紫外光發光二極體晶片，其特徵在於：該蓋體具有一接合面，且該接合面成型有一金屬化層，如此，接合面即可透過共晶焊接等方式固設於基板上，達到發光區域無任何有機材料之目的，此外，本發明更包括一成型有一第一組設部的可拆式光學透鏡，該第一組設部係卡設於蓋體上，藉此使可拆式光學透鏡之入光面緊密貼合於蓋體表面，進而利用可拆式光學透鏡的快速拆裝進而調整紫外光發光二極體晶片所產生之光線，如此，使用者可依照使用需求的不同而調整光型。 In order to achieve the above object, the UV light emitting diode packaging structure of the present invention includes a substrate, at least one UV light emitting diode chip and a cover, wherein the substrate has a mounting surface, and the UV light emitting diode The chip is electrically assembled on the mounting surface of the substrate, and the cover is located on the substrate and covers the ultraviolet light emitting diode chip. It is characterized in that the cover has a joint surface, and the joint surface is formed with a gold In this way, the joint surface can be fixed on the substrate through eutectic welding, etc., so that the light-emitting area is free of any organic material. In addition, the present invention further includes a detachable type with a first set of parts formed thereon. The optical lens, the first set part is clamped on the cover body, so that the light incident surface of the detachable optical lens is closely attached to the surface of the cover body, and then the detachable optical lens is quickly disassembled and adjusted for adjustment The light generated by the ultraviolet light emitting diode chip can be adjusted by the user according to different needs.

進一步地，該蓋體為無機材料。 Further, the cover body is an inorganic material.

進一步地，該紫外光發光二極體封裝結構更包括一圍牆，該圍牆係設置於基板與蓋體之間，且該圍牆的高度高於該紫外光發光二極體晶片。 Further, the ultraviolet light emitting diode packaging structure further includes a wall, the wall is disposed between the substrate and the cover, and the height of the wall is higher than the ultraviolet light emitting diode chip.

進一步地，圍牆可為一具光反射性的材料構成，例如金、鋁、銀、銅等材料。 Further, the enclosure wall can be made of a material with light reflectivity, such as gold, aluminum, silver, copper and other materials.

進一步地，該紫外光發光二極體封裝結構更包括一金屬基板及一散熱模組，該基板係組設於該金屬基板之表面，該散熱模組則組設於該金屬基板表面之另一面，藉此增加均勻散熱之效果。 Further, the ultraviolet light emitting diode package structure further includes a metal substrate and a heat dissipation module, the substrate is assembled on the surface of the metal substrate, and the heat dissipation module is assembled on the other side of the surface of the metal substrate , thereby increasing the effect of uniform heat dissipation.

進一步地，該可拆式光學透鏡具有一第二組設部且該金屬基板具有一第三組設部，當紫外光發光二極體晶片、圍牆、蓋體及可拆式光學透鏡依序組設完成於基板上後，且基板固設於金屬基板上時，第二組設部可進一步對應組設於金屬基板之第三組設部上。 Further, the detachable optical lens has a second assembly part and the metal substrate has a third assembly part, when the ultraviolet light emitting diode chip, the wall, the cover and the detachable optical lens are assembled in sequence. After the setting is completed on the substrate, and the substrate is fixed on the metal substrate, the second set portion can be further correspondingly set on the third set of the metal substrate On the set.

該紫外光發光二極體晶片的波長範圍介於10至400奈米之間。 The wavelength range of the ultraviolet light emitting diode chip is between 10 and 400 nanometers.

進一步地，該紫外光發光二極體晶片用於產生波長365、385、395或405奈米之紫外光。 Further, the ultraviolet light emitting diode chip is used to generate ultraviolet light with a wavelength of 365, 385, 395 or 405 nm.

進一步地，該紫外光發光二極體晶片之發光區域無任何有機材料。 Further, the light emitting area of the ultraviolet light emitting diode chip is free of any organic material.

為使貴審查委員得以清楚了解本發明之目的、技術特徵及其實施後之功效，茲以下列說明搭配圖示進行說明，敬請參閱。 In order to enable your examiners to clearly understand the purpose, technical features and effects of the present invention, the following descriptions are combined with the diagrams for illustration, please refer to.

10:紫外線發光二極體封裝結構 10: UV light-emitting diode packaging structure

101:基板 101: Substrate

102:紫外光發光二極體晶片 102: Ultraviolet light emitting diode chip

1011:安裝面 1011: Mounting Surface

1021:光軸 1021: Optical axis

1012:溝槽 1012: Groove

103:蓋體 103: Cover

104:可拆式光學透鏡 104: Detachable optical lens

1031:表面 1031: Surface

1041:平面 1041: Plane

1032:接合面 1032: Joint Surface

1042:入光面 1042: light incident surface

1033:凹槽 1033: Groove

1043:出光面 1043: light-emitting surface

1034:金屬化層 1034: Metallization

1044:第一組設部 1044: The first group set up

20:紫外線發光二極體封裝結構 20: UV light-emitting diode packaging structure

201:基板 201: Substrate

202:紫外光發光二極體晶片 202: Ultraviolet Light Emitting Diode Wafers

2011:安裝面 2011: Mounting Surface

2012:溝槽 2012: Trench

203:蓋體 203: Cover

204:可拆式光學透鏡 204: Detachable optical lens

2032:接合面 2032: Joint Surface

205:圍牆 205: Fence

2052:金屬化層 2052: Metallization

30:紫外線發光二極體封裝結構 30: UV light-emitting diode packaging structure

301:基板 301: Substrate

302:紫外光發光二極體晶片 302: Ultraviolet Light Emitting Diode Chip

3011:安裝面 3011: Mounting Surface

303:蓋體 303: Cover

304:可拆式光學透鏡 304: Detachable optical lens

3031:表面 3031: Surface

3042:入光面 3042: light incident surface

305:圍牆 305: Wall

3043:出光面 3043: light-emitting surface

306:扣合端 306: Buckle end

3044:第一組設部 3044: The first group set up

40:紫外線發光二極體封裝結構 40: UV light-emitting diode packaging structure

401:基板 401: Substrate

402:紫外光發光二極體晶片 402: Ultraviolet Light Emitting Diode Chip

4011:安裝面 4011: Mounting Surface

4013:金屬線路層 4013: Metal circuit layer

4014:導電柱 4014: Conductive Post

4015:焊線 4015: Soldering Wire

4016:限位柱 4016: Limit post

403:蓋體 403: Cover

404:可拆式光學透鏡 404: Detachable optical lens

405:圍牆 405: Fence

4051:透孔 4051: Through hole

50:紫外線發光二極體封裝結構 50: UV light-emitting diode packaging structure

501:陶瓷基板 501: Ceramic substrate

502:紫外光發光二極體晶片 502: Ultraviolet Light Emitting Diode Chip

503:蓋體 503: Cover

504:可拆式光學透鏡 504: Detachable optical lens

505:圍牆 505: Wall

5041:平面 5041: Plane

5042:出光面 5042: light-emitting surface

5043:入光面 5043: light incident surface

5044:第一組設部 5044: The first set of department

5045:第二組設部 5045: The second group set up

5046:凸環 5046: convex ring

506:金屬基板 506: Metal substrate

507:散熱模組 507: Cooling module

5061:第三組設部 5061: The third group set up department

5071:均溫板 5071: Vapor Chamber

5072:散熱鰭片 5072: cooling fins

5073:散熱風扇 5073: Cooling Fan

M:金屬材料 M: metal material

D1:寬度 D1: width

第1圖，為本發明之第一實施例的分解圖。 FIG. 1 is an exploded view of the first embodiment of the present invention.

第2圖，為本發明之第一實施例的立體圖。 FIG. 2 is a perspective view of the first embodiment of the present invention.

第3圖，為本發明之第一實施例的剖視圖。 FIG. 3 is a cross-sectional view of the first embodiment of the present invention.

第4圖，為本發明之第二實施例的分解圖 Fig. 4 is an exploded view of the second embodiment of the present invention

第5圖，為本發明之第二實施例的剖視圖。 FIG. 5 is a cross-sectional view of a second embodiment of the present invention.

第6圖，為本發明之第三實施例的剖視圖。 FIG. 6 is a cross-sectional view of a third embodiment of the present invention.

第7圖，為本發明之第四實施例的示意圖(一)。 FIG. 7 is a schematic diagram (1) of a fourth embodiment of the present invention.

第8圖，為本發明之第四實施例的示意圖(二)。 FIG. 8 is a schematic diagram (2) of the fourth embodiment of the present invention.

第9圖，為本發明之第五實施例的示意圖(一)。 FIG. 9 is a schematic diagram (1) of a fifth embodiment of the present invention.

第10圖，為本發明之第五實施例的示意圖(二)。 FIG. 10 is a schematic diagram (2) of the fifth embodiment of the present invention.

第11圖，為本發明之第五實施例的示意圖(三)。 FIG. 11 is a schematic diagram (3) of the fifth embodiment of the present invention.

請參閱「第1~2圖」所示，紫外光發光二極體封裝結構10包括一基板101、至少一紫外光發光二極體晶片102、一蓋體103以及一可拆式光學透鏡104，其中，基板101具有一安裝面1011，該安裝面1011上佈設有一電子電路(未繪製)，且該安裝面1011成型有一溝槽1012，該溝槽1012具有快速定位之功效，紫外光發光二極體晶片102具有一光軸1021，該紫外光發光二極體晶片102組設於該安裝面1011上，且與電子電路呈電性連接，又，紫外光發光二極體晶片102位於溝槽1012迴圈內，且不碰觸到該溝槽1012，所述之基板101為一高導熱基板，例如：金屬基板、陶瓷基板、或玻纖基板(如FR-4、FR-5、G-10、G-11等)，但本發明並不局限於此，其中金屬基板的材料可選自銅、銅合金、鋁、鋁合金、鎂合金、鋁矽碳化物、及碳合成物的其中之一，陶瓷基板的材質可選自氧化鋁、氮化鋁、氧化鋯、氧化鈹、碳化矽、氧化鈦、六方氮化硼、及氟化鈣的其中之一，以具有較佳之結構特性，例如：較佳之機械強度、較低之曲翹度、熱膨脹係數接近矽晶圓等，又，蓋體103具有一表面1031且相對於表面1031之另一面成型有一接合面1032，該接合面成型有一凹槽1033，且蓋體103組設於基板101溝槽1012內並覆蓋於紫外光發光二極體晶片102，其中，紫外光發光二極體晶片102的波長範圍介於10nm至400nm之間，較佳地，波長範圍介於315nm至400nm、280nm至315nm或100nm至280nm之間，而蓋體103的材料可以是玻璃材料、石英材料、氧化鋁、氧化鎂、氧化鈹、氧化釔、氧化釔-二氧化鋯等多種氧化物系列透明陶瓷或非氧化物透明陶瓷材料，如砷化鎵(GaAs)、硫化鋅(ZnS)、硒化鋅(ZnSe)、氟化鎂(MgF2)、氟化鈣(CaF2)等材料所製作而成，再者，可拆式光學透鏡104組設於該蓋體103，該可拆式光學透鏡104可用以調整紫外光發光二極體封裝結構10之發光角度，具體而言，當蓋體103進行封裝時，可使得紫外光發光二極體晶片102所發出的紫外光能夠在較大的取光角度的範圍內穿過蓋體103，再經由可拆式光學透鏡104之出光面1043折射將該紫外光的光線朝光軸1021方向集中。 Please refer to FIGS. 1-2 , the UV light emitting diode package structure 10 includes a substrate 101 , at least one UV light emitting diode chip 102 , a cover 103 and a detachable optical lens 104 . Wherein, the substrate 101 has a mounting surface 1011 on which an electronic circuit (not shown) is arranged, and a groove 1012 is formed on the mounting surface 1011, and the groove 1012 has the effect of fast positioning, and the ultraviolet light emitting diode The bulk chip 102 has an optical axis 1021 , the ultraviolet light emitting diode chip 102 is assembled on the mounting surface 1011 and is electrically connected to the electronic circuit, and the ultraviolet light emitting diode chip 102 is located in the groove 1012 inside the circle, And without touching the groove 1012, the substrate 101 is a high thermal conductivity substrate, such as a metal substrate, a ceramic substrate, or a glass fiber substrate (such as FR-4, FR-5, G-10, G-11 etc.), but the present invention is not limited thereto, wherein the material of the metal substrate can be selected from one of copper, copper alloy, aluminum, aluminum alloy, magnesium alloy, aluminum silicon carbide, and carbon composite, and the material of the ceramic substrate The material can be selected from aluminum oxide, aluminum nitride, zirconium oxide, beryllium oxide, silicon carbide, titanium oxide, hexagonal boron nitride, and calcium fluoride, so as to have better structural properties, such as: better mechanical strength , a lower warpage degree, a thermal expansion coefficient close to that of a silicon wafer, etc., and the cover body 103 has a surface 1031 and a joint surface 1032 is formed on the other side relative to the surface 1031, the joint surface is formed with a groove 1033, and the cover The body 103 is set in the groove 1012 of the substrate 101 and covers the ultraviolet light emitting diode chip 102, wherein the wavelength range of the ultraviolet light emitting diode chip 102 is between 10 nm and 400 nm, preferably, the wavelength range between 315nm to 400nm, 280nm to 315nm or 100nm to 280nm, and the material of the cover body 103 can be glass material, quartz material, aluminum oxide, magnesium oxide, beryllium oxide, yttrium oxide, yttrium oxide-zirconium dioxide, etc. Oxide series transparent ceramics or non-oxide transparent ceramic materials, such as gallium arsenide (GaAs), zinc sulfide (ZnS), zinc selenide (ZnSe), magnesium fluoride (MgF2), calcium fluoride (CaF2) and other materials In addition, a detachable optical lens 104 is assembled on the cover body 103, and the detachable optical lens 104 can be used to adjust the light-emitting angle of the ultraviolet light emitting diode package structure 10. Specifically, when the cover When the body 103 is encapsulated, the ultraviolet light emitted by the ultraviolet light emitting diode chip 102 can pass through the cover body 103 within the range of a large light extraction angle, and then pass through the light emitting surface 1043 of the detachable optical lens 104 Refraction concentrates the light of the ultraviolet light toward the direction of the optical axis 1021 .

請參閱「第3圖」，圖中所示為本發明之第一實施例的剖視圖，承上所述，該凹槽1033高度需大於紫外光發光二極體晶片102之高度，於較佳實施中該凹槽1033高度大於紫外光發光二極體晶片102高度約0.1~2mm，當紫外光發光二極體晶片102設置於基板101上時，紫外光發光二極體晶片102會位於凹槽1033空間內(即凹槽1033罩設紫外光發光二極體晶片102)，又，接合面1032成型有一金屬化層1034，當接合面1032組設於溝槽1012內時，可再透過以錫、銀、金、銅及銦等金屬做為黏合材料，並以共晶鎔合方式使蓋體103與基板101結合，再者，該可拆式光學透鏡104具有一平面1041，且該平面1041成型有一凸狀之出光面1043，又，相對於平面1041的另一面則成型有一入光面1042及一第一組設部1044，該入光面1042為一平坦面，而該出光面1043可為非球面、弧形面、拋物面、雙曲面或自由曲面，第一組設部1044可直接將可拆式光學透鏡104組設於該蓋體103上，具體而言，可利用干涉、扣合等方式，但不以此為限，使該可拆式光學透鏡104卡設於蓋體103上，並使可拆式光學透鏡104的入光面1042與蓋體103表面1031之間相互對應並呈緊密貼合，此時該紫外光發光二極體晶片102之光線則依序經由蓋體103表面1031以及可拆式光學透鏡104的入光面1042最後由該可拆式光學透鏡104的出光面1043射出並朝光軸1021集中，再者，本發明之可拆式光學透鏡104可依所需設計成不同之弧面，令紫外光發光二極體晶片102所發出之光線可形成不同之光形表現與出光角度，又，可拆式光學透鏡104材料例如為不含二氧化鈦(TiO2)的環氧模壓樹脂(Epoxy Molding Compound,EMC)、矽膠模壓樹脂(Silicon Molding Compound,SMC)、或為一般氟樹脂、矽膠(silicone)、環氧樹脂、透明的陶瓷、無定型氟樹脂(Cyclopolymerization of perfluoro,CYTOP)、聚甲基丙烯酸甲酯(Poly(methyl methacrylate),PMMA)、聚碳酸酯(Polycarbonate,PC)或石英玻璃等，但不以此為限，又，蓋體103的凹槽1033空間內可呈真空狀態或填充氣體(未繪示)藉此改變折射率，其氣體亦可是惰性氣體，使凹槽1033空間內成為非反應性(inactive)的環境，由此，可保護紫外光發光二極體晶片102使其壽命延長，此外，雖本實施例僅繪示一個紫外光發光二極體晶片102，但根據光輸出功率的設計需要，也可以在基板101上設置多個紫外光發光二極體晶片102，以提升光輸出功率。 Please refer to "FIG. 3", which is a cross-sectional view of the first embodiment of the present invention. Based on the above, the height of the groove 1033 needs to be greater than the height of the UV LED chip 102, in a preferred implementation The height of the groove 1033 is greater than the height of the UV LED chip 102 by about 0.1-2 mm. When the UV LED chip 102 is disposed on the substrate 101, the UV LED chip 102 will be located in the groove 1033 In the space (that is, the groove 1033 covers the ultraviolet light emitting diode chip 102), and the bonding surface 1032 is formed with a metallization layer 1034. When the bonding surface 1032 is assembled in the groove 1012, it can transmit tin, Metals such as silver, gold, copper, and indium are used as adhesive materials, and the cover body 103 is combined with the substrate 101 by eutectic fusion. Furthermore, the detachable optical lens 104 has a flat surface 1041, and the flat surface 1041 is formed There is a convex light emitting surface 1043, and a light incident surface 1042 and a first set portion 1044 are formed on the other side opposite to the plane 1041. The light incident surface 1042 is a flat surface, and the light emitting surface 1043 can be Aspheric surface, arc surface, paraboloid, hyperboloid or free-form surface, the first assembly part 1044 can directly set the detachable optical lens 104 on the cover body 103, specifically, interference, buckle, etc. can be used. but not limited thereto, the detachable optical lens 104 is clamped on the cover body 103, and the light incident surface 1042 of the detachable optical lens 104 and the surface 1031 of the cover body 103 correspond to each other and form a Closely attached, at this time, the light of the ultraviolet light emitting diode chip 102 sequentially passes through the surface 1031 of the cover body 103 and the light incident surface 1042 of the detachable optical lens 104 and finally passes through the detachable optical lens 104 The light exit surface 1043 is emitted and concentrated toward the optical axis 1021. Furthermore, the detachable optical lens 104 of the present invention can be designed into different arcs as required, so that the light emitted by the ultraviolet light emitting diode chip 102 can form different lights shape performance and light exit angle, and the material of the detachable optical lens 104 For example, TiO2-free epoxy molding compound (EMC), silicone molding compound (SMC), or general fluororesin, silicone, epoxy resin, and transparent ceramics , amorphous fluororesin (Cyclopolymerization of perfluoro, CYTOP), poly(methyl methacrylate, PMMA), polycarbonate (Polycarbonate, PC) or quartz glass, etc., but not limited to this, and , the space of the groove 1033 of the cover body 103 can be in a vacuum state or filled with gas (not shown) to change the refractive index, and the gas can also be an inert gas, so that the space of the groove 1033 becomes an inactive environment Therefore, the ultraviolet light emitting diode chip 102 can be protected to prolong its life. In addition, although only one ultraviolet light emitting diode chip 102 is shown in this embodiment, according to the design requirements of the light output power, it can also be used in A plurality of ultraviolet light emitting diode chips 102 are disposed on the substrate 101 to increase the light output power.

請參閱「第4~5圖」，圖中所示為本發明之第二實施例，如圖所示，紫外光發光二極體封裝結構20包括一基板201、至少一紫外光發光二極體晶片202、一蓋體203、一可拆式光學透鏡204以及一圍牆205，其中，紫外光發光二極體晶片202係電性組設於基板201之安裝面2011上，且紫外光發光二極體晶片202係採用直接封裝(Chip On Board，COB)方式裝設於基板201上，又，基板201具有一溝槽2012，圍牆205固設於該基板201之溝槽2012內，該蓋體203位於該基板201上方並組設於該圍牆205上，又，該可拆式光學透鏡204 係組設於該蓋體203上，本實施例與第一實施例的不同之處在於：蓋體203係呈板片狀且圍牆205具有用以包圍住紫外光發光二極體晶片202，於較佳實施例中，圍牆205是呈封閉迴圈狀，但不接觸紫外光發光二極體晶片202，又，圍牆205的高度大於紫外光發光二極體晶片202的高度，且不高過於3mm，較佳地，超出之高度介於0.1~3mm，當蓋體203蓋設於圍牆205上時，蓋體203與圍牆205之間可形成一容置空間供以容置紫外光發光二極體晶片202，且蓋體203與圍牆205相互切齊，如此，透過上述設計可簡化蓋體203的形狀複雜度，降低製造成本，具體而言，圍牆205可為不透光性材料製成，其可使紫外光發光二極體晶片202發射之光線無法穿透，較佳地，圍牆205可由具有光反射性的材料構成，例如金屬或合金材質(例如：金、鋁、銀、鎳、鉻等)，藉此將紫外光發光二極體晶片202所發射之光線進行反射，此外，另一較佳實施例為當圍牆205為透光性材料或非具有光反射性的材料(例如：玻璃)製成時，可將圍牆205之表面形成或塗佈一厚度小於0.1mm之金屬化層2052，具體而言，係使用物理氣相沉積(PVD)製程(例如包括濺鍍(sputtering)製程或蒸鍍(evaporation)製程)、化學氣相沉積(CVD)製程、電鍍製程、旋塗製程、其他可應用製程、或前述之組合而沉積，如此，可利用一金屬材料M做為黏合材料(例如：錫、銀、金、銅及銦)，以共晶鎔合等方式(圖中未繪製)分別依序將圍牆205固設於基板201之溝槽2012內後，再將已金屬化之接合面2032組設於圍牆205上，藉此加強彼此之間的牢固效果，避免圍牆205與基板201之間或圍牆205與蓋體203之間脫落的問題，以改善習知利用有機矽系、環氧系的黏合劑黏合的方式，再請參閱圖中所示，本發明之較佳實施例是利用該溝槽2012可使圍牆205快速定位於基板201上，即圍牆205組設於溝槽2012內後，再利用金屬材料M(例如錫膏)將已塗佈金屬化層2052之圍牆205外表面與基板201相互黏合，如圖所示，如此，可確保阻擋錫膏助焊劑(Flux)溢流至蓋體203與圍牆205之間的容置空間(即發光區域)，以降低產品製程的不良率，進而達到紫外光發光二極體晶片202之發光區域無任何有機材料之目的；請接續參閱「第6圖」，圖中所示為本發明之第三實施例，本實施例相較於第二實施例其不同之處在於：當蓋體303蓋設於圍牆305上時，蓋體303兩側端緣超出圍牆305兩側外圍形成一扣合端306，如圖所示，當第一組設部3044成型為一倒鉤狀時，第一組設部3044可直接卡扣於該扣合端306，使可拆式光學透鏡304與蓋體303無法輕易分離，進而使可拆式光學透鏡304的入光面3042與蓋體303表面3031之間相互對應並呈緊密貼合，不易造成滑動，並達到可以快速組設及拆卸上之目的。 Please refer to "FIGS. 4-5", which shows the second embodiment of the present invention. As shown in the figures, the UV light emitting diode package structure 20 includes a substrate 201 and at least one UV light emitting diode. The chip 202, a cover 203, a detachable optical lens 204 and a wall 205, wherein the ultraviolet light emitting diode chip 202 is electrically assembled on the mounting surface 2011 of the substrate 201, and the ultraviolet light emitting diode The bulk chip 202 is mounted on the substrate 201 by means of Chip On Board (COB), and the substrate 201 has a groove 2012. The wall 205 is fixed in the groove 2012 of the substrate 201. The cover 203 Located above the substrate 201 and assembled on the enclosure wall 205, and the detachable optical lens 204 The cover body 203 is assembled on the cover body 203 . The difference between this embodiment and the first embodiment is that the cover body 203 is in the shape of a plate and the surrounding wall 205 is provided to surround the ultraviolet light emitting diode chip 202 . In a preferred embodiment, the enclosure wall 205 is in the shape of a closed loop, but does not contact the ultraviolet light emitting diode chip 202, and the height of the enclosure wall 205 is greater than the height of the ultraviolet light emitting diode chip 202, and is not higher than 3mm. , preferably, the exceeding height is between 0.1~3mm. When the cover body 203 is covered on the enclosure wall 205, a accommodating space can be formed between the cover body 203 and the enclosure wall 205 for accommodating the ultraviolet light emitting diodes chip 202, and the cover body 203 and the wall 205 are cut flush with each other, so that the shape complexity of the cover body 203 can be simplified through the above design, and the manufacturing cost can be reduced. The light emitted by the UV LED chip 202 can be made impermeable. Preferably, the wall 205 can be made of a material with light reflectivity, such as metal or alloy material (eg: gold, aluminum, silver, nickel, chromium, etc. ), thereby reflecting the light emitted by the ultraviolet light emitting diode chip 202. In addition, another preferred embodiment is when the wall 205 is made of a light-transmitting material or a non-light-reflective material (eg, glass) When fabricated, a metallization layer 2052 with a thickness of less than 0.1 mm can be formed or coated on the surface of the enclosure wall 205. Specifically, a physical vapor deposition (PVD) process (such as a sputtering process or an evaporation process is used) Plating (evaporation) process), chemical vapor deposition (CVD) process, electroplating process, spin coating process, other applicable processes, or a combination of the foregoing deposition, so that a metal material M can be used as an adhesive material (for example: tin, silver, gold, copper, and indium), the walls 205 are sequentially fixed in the grooves 2012 of the substrate 201 by means of eutectic alloying (not drawn in the figure), and then the metallized joint surfaces are 2032 is set on the wall 205, thereby enhancing the firm effect between each other, avoiding the gap between the wall 205 and the substrate 201 or between the wall 205 and the The problem of falling off between the lids 203 is to improve the conventional bonding method using silicone-based and epoxy-based adhesives. Please refer to the figure again. In the preferred embodiment of the present invention, the groove 2012 can be used to The wall 205 is quickly positioned on the substrate 201 , that is, after the wall 205 is assembled in the groove 2012 , the outer surface of the wall 205 coated with the metallization layer 2052 and the substrate 201 are bonded to each other by using a metal material M (such as solder paste). , as shown in the figure, in this way, it can be ensured that the solder paste flux (Flux) can be prevented from overflowing to the accommodating space (ie, the light-emitting area) between the cover body 203 and the wall 205, so as to reduce the defect rate of the product process, and then achieve the ultraviolet The light-emitting region of the light-emitting diode chip 202 does not have any organic material purpose; please refer to "FIG. 6", which shows the third embodiment of the present invention. Compared with the second embodiment, the The difference is: when the cover body 303 is covered on the enclosure wall 305, the end edges on both sides of the cover body 303 extend beyond the periphery of the enclosure wall 305 to form a snap-fit end 306. As shown in the figure, when the first assembly portion 3044 is formed When it is in the shape of a barb, the first set portion 3044 can be directly buckled on the buckling end 306 , so that the detachable optical lens 304 and the cover 303 cannot be easily separated, thereby allowing the detachable optical lens 304 to enter light The surface 3042 and the surface 3031 of the cover body 303 correspond to each other and are in close contact with each other, which is not easy to cause sliding, and achieves the purpose of being able to be assembled and disassembled quickly.

請參閱「第7~8圖」，圖中所示為本發明之第四實施例的示意圖(一)~(二)，如圖所示，紫外光發光二極體封裝結構40具有一基板401、複數個紫外光發光二極體晶片402、一蓋體403、一可拆式光學透鏡404以及一圍牆405，本實施例相較於前述實施例不同之處在於：圍牆405係直接於基板401之安裝面4011上長出，且圍牆405呈一封閉迴圈狀，圍牆405內佈設有一金屬線路層4013，該金屬線路層4013的其中一側成型有至少一導電柱4014，導電柱4014的截面可以是矩形、圓弧形、多邊形等任意的幾何形狀，且該導電柱4014的面積比例範圍占金屬線路層4013的面積的面積約5~30%，較佳為10~20%，該導電柱4014之寬度D1需大於或等於0.1mm，且與金屬線路層4013具有一大於或等於0.1mm以上的高低位差，較佳地，位差高度不超過2mm，又，複數個紫外光發光二極體晶片402設置於金屬線路層4013上，且係以大於或等於0.5mm間隔矩形排列，並透過至少一焊線4015電性連接於該導電柱4014上，當導電柱4014為複數個時，各導電柱4014呈直線排列(如第7圖所示)，且各導電柱4014之間的間隔距離大於或等於0.1mm以上，如此，在打線接合製程中，複數條焊線4015可分別電性連接於各導電柱4014，藉此避免錫膏助焊劑(Flux)溢流至紫外光發光二極體晶片402周圍，造成打線不良的問題，再者，圍牆405至少有一側成型有一透孔4051，當蓋體403組設於圍牆405上時，紫外光發光二極體晶片402所產生之熱能，可藉由該透孔4051加速氣體對流作用，達到散熱效果，此外，在本實施例中，導電柱4014亦可形成為一U字型(如第8圖所示)，並圍繞成型於金屬線路層4013的側邊，而相對於導電柱4014之其中一側則設有一限位柱4016，其中，該限位柱4016係防止紫外光發光二極體晶片402在設置於金屬線路層4013上時過度位移，且透過U型設計可使錫膏從限位柱4016方向流動，避免打線區域汙染，又，可拆式光學透鏡404係組設於該蓋體403上，其組設方式與第二實施例相同，故不再此贅述。 Please refer to “FIGS. 7-8”, which are schematic diagrams (1)-(2) of the fourth embodiment of the present invention. As shown in the figures, the UV light emitting diode package structure 40 has a substrate 401 , a plurality of ultraviolet light emitting diode chips 402 , a cover 403 , a detachable optical lens 404 and a wall 405 . The difference between this embodiment and the previous embodiment is that the wall 405 is directly connected to the substrate 401 The mounting surface 4011 grows out, and the surrounding wall 405 is a A closed loop shape, a metal circuit layer 4013 is arranged in the wall 405, one side of the metal circuit layer 4013 is formed with at least one conductive column 4014, and the cross-section of the conductive column 4014 can be any geometry such as rectangle, arc, polygon, etc. shape, and the area ratio of the conductive column 4014 accounts for about 5-30% of the area of the metal circuit layer 4013, preferably 10-20%, the width D1 of the conductive column 4014 needs to be greater than or equal to 0.1mm, and the same as The metal circuit layer 4013 has a height difference greater than or equal to 0.1mm or more, preferably, the height of the height difference is not more than 2mm, and a plurality of ultraviolet light emitting diode chips 402 are arranged on the metal circuit layer 4013, and are They are arranged in a rectangle with an interval greater than or equal to 0.5mm, and are electrically connected to the conductive pillars 4014 through at least one bonding wire 4015. When there are plural conductive pillars 4014, the conductive pillars 4014 are arranged in a straight line (as shown in FIG. 7 ). ), and the distance between the conductive pillars 4014 is greater than or equal to 0.1 mm or more, so that in the wire bonding process, a plurality of bonding wires 4015 can be electrically connected to the conductive pillars 4014 respectively, thereby avoiding solder paste flux (Flux) overflows around the ultraviolet light emitting diode chip 402, causing the problem of poor wire bonding. Furthermore, at least one side of the enclosure wall 405 is formed with a through hole 4051. When the cover 403 is assembled on the enclosure wall 405, the ultraviolet light The heat energy generated by the light-emitting diode chip 402 can accelerate the gas convection through the through hole 4051 to achieve the effect of heat dissipation. In addition, in this embodiment, the conductive column 4014 can also be formed into a U-shaped (such as the eighth As shown in the figure), and is formed around the side of the metal circuit layer 4013, and one side of the conductive column 4014 is provided with a limiting column 4016, wherein the limiting column 4016 is to prevent ultraviolet light emitting diodes When the chip 402 is placed on the metal circuit layer 4013, the displacement is excessive, and through the U-shaped design, the solder paste can flow from the direction of the limit post 4016 to avoid the contamination of the wire-bonding area. In addition, the detachable optical lens 404 is assembled on the cover. On body 403, The configuration method is the same as that of the second embodiment, so it is not repeated here.

請再參閱「第9~11圖」，圖中所示為本發明之第五實施例的示意圖(一)~(三)，紫外光發光二極體封裝結構50更包括有一金屬基板506，其中，可拆式光學透鏡504成型有第一組設部5044及至少一第二組設部5045，又，金屬基板506具有一第三組設部5061，其中，可拆式光學透鏡504具有一平面5041，該平面5041成型有一凸狀之出光面5042，且相對於該出光面5042的另一面則成型有一入光面5043及一第一組設部5044，又，平面5041之至少一側成型有至少一第二組設部5045，於本實施例中，該至少一第二組設部5045係對應於金屬基板506之第三組設部5061成型，且當該至少一第二組設部5045為複數個時，該等第二組設部5045係平均成型於平面5041四周或呈圓形、矩陣狀排列，且第一組設部5044係位於複數個第二組設部5045之間，如此，可使可拆式光學透鏡504具有良好的平均受力，如圖所示，當複數個紫外光發光二極體晶片502、圍牆505、蓋體503及可拆式光學透鏡504依序組設完成於陶瓷基板501上後，陶瓷基板501將固設於金屬基板506上，其中，可拆式光學透鏡504之第一組設部5044係卡設於蓋體503表面5031，又，第二組設部5045可進一步對應組設於金屬基板506之第三組設部5061上，其中，第二組設部5045可為一定位柱而第三組設部5061為一定位孔，該定位柱為一彈性材質且一端徑向凸出形成圓形的凸環5046，又，定位柱的長度至少大於為定位孔深度，且定位柱和定位孔之間以機械公差的方式緊密配合，例如，過盈配合，再者，當第二組設部5045與第三組設部5061相互組設時，該凸環5046將穿設定位孔後，藉由彈力復歸之特性，進而使凸環5046抵擋至金屬基板506上，藉此達到快速拆換之功效；或者第二組設部5045及第三組設部5061皆為定位孔，並透過一固定件(圖中未繪製)將兩者相互組設固定，但不以此為限，再者，該金屬基板506的材料可選自銅、銅合金、鋁、鋁合金、鎂合金、鋁矽碳化物、及碳合成物的其中之一，但不以此為限，此外，本發明可再與一散熱模組507結合進而組設為一發光裝置5，該散熱模組507依序由一均溫板5071、至少一散熱鰭片5072以及一散熱風扇5073組成，其中，均溫板5071之其中一表面貼附於金屬基板506上，而散熱鰭片5072藉由壓鑄、鋁擠或沖壓形成並貼附於均溫板5071之另一表面上，最後，散熱風扇5073再與均溫板5071相互組設並蓋設該散熱鰭片5072，即如圖所示，如此，當陶瓷基板501貼合於金屬基板506上時，紫外光發光二極體晶片502的熱能傳導路徑將經由陶瓷基板501導熱至金屬基板506後，再利用均溫板5071快速均溫導熱並進一步傳至散熱鰭片5072上，最後經由散熱風扇加快氣流與紫外光發光二極體封裝結構的熱交換，以達到降低熱阻與保障性能的穩定，請再參閱圖中所示，該等紫外光發光二極體晶片502係呈一預定間隔排列並排列成一預定形狀，例如：圓形、矩形、多邊形等，較佳地，該等紫外光發光二極體晶片502形成一二維式陣列呈陣列排列(如1*N的矩陣形態)，又，所述的預定間隔大於0.1mm，較佳地，介於0.5至5mm之間，但不以此為限，藉由上述的等距排列及出光面5042之搭配，可達到匯聚光線之效果以及勻光、降低光斑或是避免殘留光源形狀之殘影等功效，此外，本發明經實驗測試後，散熱模組507確實可達到約450W的散熱功效，即散熱模組507最佳實施可同時對15組紫外光發光二極體封裝結構50進行散熱，再者，本實施例藉由可拆式光學透鏡504之出光面5043確實可使紫外光發光二極體封裝結構50通過X軸向的發光角度從原先約112度調整為80至100度，通過Y軸向的發光角度從原先約112度調整為15至45度，較佳地，X軸向的發光角度可調整為90至100度，Y軸向的發光角度可調整為20至30度，但不以此為限。 Please refer to FIGS. 9 to 11 again, which are schematic diagrams (1) to (3) of the fifth embodiment of the present invention. The ultraviolet light emitting diode package structure 50 further includes a metal substrate 506 , wherein The detachable optical lens 504 is formed with a first set part 5044 and at least one second set part 5045, and the metal substrate 506 has a third set part 5061, wherein the detachable optical lens 504 has a flat surface 5041, the plane 5041 is formed with a convex light-emitting surface 5042, and the other side of the light-emitting surface 5042 is formed with a light-incident surface 5043 and a first set portion 5044, and at least one side of the plane 5041 is formed with a At least one second assembly portion 5045, in this embodiment, the at least one second assembly portion 5045 is formed corresponding to the third assembly portion 5061 of the metal substrate 506, and when the at least one second assembly portion 5045 is formed When there are plural numbers, the second set parts 5045 are evenly formed around the plane 5041 or arranged in a circle or matrix, and the first set parts 5044 are located between the plurality of second set parts 5045, so , so that the detachable optical lens 504 has a good average force. As shown in the figure, when a plurality of ultraviolet light emitting diode chips 502, a wall 505, a cover 503 and a detachable optical lens 504 are assembled in sequence After the ceramic substrate 501 is completed, the ceramic substrate 501 will be fixed on the metal substrate 506, wherein the first set portion 5044 of the detachable optical lens 504 is clamped on the surface 5031 of the cover body 503, and the second set The setting portion 5045 can be further correspondingly assembled on the third setting portion 5061 of the metal substrate 506, wherein the second setting portion 5045 can be a positioning column and the third setting portion 5061 is a positioning hole, and the positioning column is A convex ring 5046 made of elastic material with one end radially protruding to form a circular shape, and the length of the positioning post is at least greater than the depth of the positioning hole, and the positioning post It is closely fitted with the positioning hole by mechanical tolerance, for example, interference fit. Furthermore, when the second assembly portion 5045 and the third assembly portion 5061 are assembled with each other, the protruding ring 5046 will pass through the positioning hole Afterwards, with the characteristic of elastic return, the protruding ring 5046 can be held against the metal substrate 506, thereby achieving the effect of quick replacement; or both the second set portion 5045 and the third set portion 5061 are positioning holes, and The two are assembled and fixed to each other through a fixing member (not drawn in the figure), but not limited to this. Furthermore, the material of the metal substrate 506 can be selected from copper, copper alloy, aluminum, aluminum alloy, magnesium alloy, One of aluminum silicon carbide and carbon composite, but not limited to this, in addition, the present invention can be combined with a heat dissipation module 507 to form a light-emitting device 5, and the heat dissipation module 507 is in sequence It is composed of a vapor chamber 5071, at least one cooling fin 5072 and a cooling fan 5073, wherein one surface of the vapor chamber 5071 is attached to the metal substrate 506, and the cooling fin 5072 is made of die-casting, aluminum extrusion or It is stamped and attached to the other surface of the vapor chamber 5071. Finally, the cooling fan 5073 and the vapor chamber 5071 are assembled with each other and covered with the cooling fins 5072, as shown in the figure. In this way, when the ceramic substrate is When the 501 is attached to the metal substrate 506, the heat conduction path of the ultraviolet light emitting diode chip 502 will conduct heat to the metal substrate 506 through the ceramic substrate 501, and then use the temperature equalizing plate 5071 to quickly heat and conduct heat and further transmit it to the heat dissipation fins. On the chip 5072, the heat exchange between the airflow and the UV light emitting diode package structure is accelerated by a cooling fan, so as to reduce thermal resistance and ensure stable performance. Please refer to the figure again, these UV light emitting diodes The chips 502 are arranged at a predetermined interval and arranged in a predetermined shape, such as: circle, rectangle, polygon, etc. Preferably, the ultraviolet light emitting diode chips 502 form a two-dimensional array and are arranged in an array (eg, 1 *N matrix form), and, the predetermined interval is greater than 0.1mm, more Preferably, it is between 0.5 mm and 5 mm, but not limited to this. With the above-mentioned equidistant arrangement and the matching of the light-emitting surface 5042, the effect of converging light, uniform light, reducing light spot or avoiding residual light source shape can be achieved. In addition, after the experimental test of the present invention, the heat dissipation module 507 can indeed achieve a heat dissipation effect of about 450W, that is, the optimal implementation of the heat dissipation module 507 can simultaneously dissipate 15 sets of ultraviolet light emitting diode packaging structures 50 In addition, in this embodiment, the light-emitting surface 5043 of the detachable optical lens 504 can indeed adjust the light-emitting angle of the ultraviolet light-emitting diode package structure 50 through the X-axis from about 112 degrees to 80 to 100 degrees. The light-emitting angle of the Y-axis is adjusted from about 112 degrees to 15 to 45 degrees. Preferably, the light-emitting angle of the X-axis can be adjusted to 90 to 100 degrees, and the light-emitting angle of the Y-axis can be adjusted to 20 to 45 degrees. 30 degrees, but not limited to this.

由上所述可知，本發明之紫外光發光二極體封裝結構增益之功效在於：其一，圍牆直接長出成型或設置於基板上，再透過將蓋體接合面形成一金屬化層後，利用錫、銀、金及銦等金屬做為黏合材料，以達到紫外光發光二極體晶片之發光區域無任何有機材料之目的，其二，透過金屬基板以及散熱模組提升紫外光發光二極體封裝結構之散熱效率；其三，透過第一組設部卡設於蓋體上以及第二組設部與第三組設部互相對應組設之方式，使可拆式光學透鏡精準的設置於蓋體上，藉此避免透鏡偏移，影響出光亮度與角度；其四，藉由導電柱之設計，可避免錫膏助焊劑溢流，進而影響紫外光發光二極體晶片之打線品質；其五，透過限位部之設計可避免紫外光發光二極體晶片在攝製過程中過度位移，而影響整體發光效果；其六，本發明透過上述組設方式，可改善習知玻璃透鏡無法調整光型與拆換之問題，進而提升光學設計的自由度與降低玻璃光學透鏡開模成本。 As can be seen from the above, the benefits of the UV light emitting diode package structure of the present invention are: first, the enclosure wall is directly formed or disposed on the substrate, and then a metallization layer is formed on the joint surface of the cover body, Metals such as tin, silver, gold and indium are used as adhesive materials to achieve the purpose of freeing the light-emitting area of the UV LED chip without any organic materials. The heat dissipation efficiency of the body packaging structure; thirdly, the detachable optical lens can be accurately arranged through the way that the first set part is clamped on the cover body and the second set part and the third set part are correspondingly assembled with each other. It is placed on the cover to prevent the lens from shifting, which affects the brightness and angle of the light. Fourth, through the design of the conductive column, it can avoid the overflow of the solder paste flux, thereby affecting the quality of the UV light emitting diode chip. Fifth, the design of the limiter can avoid excessive displacement of the UV LED chip during the filming process, and Sixthly, the present invention can improve the problem that the conventional glass lens cannot adjust the light shape and can not be replaced, thereby improving the freedom of optical design and reducing the cost of mold opening of the glass optical lens.

是以，本發明據以實施後，確實可達到提供一種藉由拆換或組裝光學透鏡方式，使其紫外光發光二極體所發出之光線透過不同弧面設計之光學透鏡，進而形成不同光形表現的紫外光發光二極體封裝結構。 Therefore, after the present invention is implemented, it is possible to provide a method of disassembling or assembling optical lenses, so that the light emitted by the ultraviolet light emitting diodes can pass through the optical lenses with different arc surface designs, thereby forming different lights. Shaped UV light emitting diode packaging structure.

唯，以上所述者，僅為本發明之較佳之實施例而已，並非用以限定本發明實施之範圍；任何熟習此技藝者，在不脫離本發明之精神與範圍下所作之均等變化與修飾，皆應涵蓋於本發明之專利範圍內。 However, the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention; anyone familiar with the art can make equal changes and modifications without departing from the spirit and scope of the present invention. , all should be covered within the patent scope of the present invention.

綜上所述，本發明之功效，係具有發明之「產業可利用性」、「新穎性」與「進步性」等專利要件；申請人爰依專利法之規定，向鈞局提起發明專利之申請。 To sum up, the effect of the present invention is that it has the patent requirements of "industrial applicability", "novelty" and "progressiveness" of the invention; the applicant should file an invention patent with the Jun Bureau in accordance with the provisions of the Patent Law Application.

10:紫外光發光二極體封裝結構 10: UV light emitting diode packaging structure

101:基板 101: Substrate

1011:安裝面 1011: Mounting Surface

1012:溝槽 1012: Groove

102:紫外光發光二極體晶片 102: Ultraviolet light emitting diode chip

103:蓋體 103: Cover

1033:凹槽 1033: Groove

104:可拆式光學透鏡 104: Detachable optical lens

Claims

一種紫外光發光二極體封裝結構，其包括：一基板，直接成型有一封閉迴圈狀的圍牆；一金屬線路層，佈設於該圍牆內，該金屬線路層其中一側成型有至少一導電柱，且相對於該導電柱之另一側設置一限位柱；至少一紫外光發光二極體晶片，設於該圍牆內並與該金屬線路層電性連接，且該至少一紫外光發光二極體晶片具有一光軸；一蓋體，成型有一表面，該表面相對成型有一接合面，該接合面組設於該圍牆後，該蓋體與該圍牆之間形成有一容置空間；一可拆式光學透鏡，該可拆式光學透鏡，具有一平面，該平面成型有一凸狀之出光面，相對於該平面之另一面成型有一入光面及一第一組設部，且該第一組設部組設於該蓋體上，當該第一組設部組設於該蓋體時，該入光面與該表面緊密貼合；以及當該至少一紫外光發光二極體晶片藉由複數條焊線電性連接於該至少一導電柱後即產生一光源，且該光源經由該出光面折射後朝該光軸方向集中投射。 An ultraviolet light emitting diode packaging structure, comprising: a substrate directly formed with a closed loop-shaped enclosure; a metal circuit layer arranged in the enclosure, and one side of the metal circuit layer is formed with at least one conductive column , and a limiting column is arranged on the other side of the conductive column; at least one ultraviolet light emitting diode chip is arranged in the enclosure and is electrically connected with the metal circuit layer, and the at least one ultraviolet light emitting diode The polar body chip has an optical axis; a cover body is formed with a surface, and the surface is oppositely formed with a joint surface. After the joint surface is assembled on the surrounding wall, an accommodating space is formed between the cover body and the surrounding wall; A detachable optical lens, the detachable optical lens has a flat surface, a convex light-emitting surface is formed on the flat surface, a light-incident surface and a first set portion are formed on the other surface of the flat surface, and the first The assembling part is assembled on the cover body, when the first assembling part is assembled on the cover body, the light incident surface is closely attached to the surface; and when the at least one ultraviolet light emitting diode chip uses After a plurality of bonding wires are electrically connected to the at least one conductive column, a light source is generated, and the light source is refracted through the light-emitting surface and then projected toward the optical axis direction in a concentrated manner.

如申請專利範圍第1項所述之紫外光發光二極體封裝結構，其中，該圍牆的高度相較該紫外光發光二極體晶片高度高出至少0.1mm以上。 The ultraviolet light emitting diode package structure as described in claim 1, wherein the height of the enclosure wall is higher than the height of the ultraviolet light emitting diode chip less than 0.1mm.

如申請專利範圍第2項所述之紫外光發光二極體封裝結構，其中，複數個導電柱呈直線排列，且各該導電柱之間的間隔距離大於或等於0.1mm。 The ultraviolet light emitting diode package structure as described in item 2 of the claimed scope, wherein the plurality of conductive pillars are arranged in a straight line, and the spacing distance between the conductive pillars is greater than or equal to 0.1 mm.

如申請專利範圍第1項所述之紫外光發光二極體封裝結構，其中，該至少一導電柱為U型。 The ultraviolet light emitting diode package structure as described in claim 1, wherein the at least one conductive column is U-shaped.

如申請專利範圍第3項或第4項所述之紫外光發光二極體封裝結構，其中該導電柱的寬度大於或等於0.1mm。 The ultraviolet light emitting diode package structure according to item 3 or item 4 of the claimed scope, wherein the width of the conductive column is greater than or equal to 0.1 mm.

如申請專利範圍第1項所述之紫外光發光二極體封裝結構，其中，該至少一導電柱的面積比例範圍占該金屬線路層的面積為5%以上。 The ultraviolet light emitting diode package structure as described in item 1 of the claimed scope, wherein the area ratio of the at least one conductive column accounts for more than 5% of the area of the metal circuit layer.

如申請專利範圍第2項所述之紫外光發光二極體封裝結構，其中，複數個紫外光發光二極體晶片呈陣列排列，且各該紫外光發光二極體晶片以一大於或等於0.5mm間隔距離排列。 The ultraviolet light emitting diode package structure according to item 2 of the claimed scope, wherein a plurality of ultraviolet light emitting diode chips are arranged in an array, and each of the ultraviolet light emitting diode chips has a value greater than or equal to 0.5 Arranged at mm spacing.

如申請專利範圍第1項所述之紫外光發光二極體封裝結構，其中，該蓋體兩側端緣超出該圍牆外圍形成一扣合端，且該第一組設部卡扣於該扣合端。 The ultraviolet light emitting diode package structure as described in claim 1, wherein the two end edges of the cover extend beyond the periphery of the enclosure to form a snap end, and the first set portion is snapped on the snap end.

如申請專利範圍第1項所述之紫外光發光二極體封裝結構，其中，該接合面成型有一金屬化層，並透過一金屬材料以共晶鎔合方式，與該圍牆相互組設黏合。 The ultraviolet light emitting diode package structure of claim 1, wherein a metallization layer is formed on the joint surface, and is assembled and bonded with the enclosure wall through a metal material by eutectic fusion.

如申請專利範圍第1項所述之紫外光發光二極體封裝結構，其中，該可拆式光學透鏡更包括一第二組設部，該第二組設部成型於該平面之其中一側。 The ultraviolet light emitting diode package structure as claimed in claim 1, wherein the detachable optical lens further comprises a second assembly portion, and the second assembly portion is formed on one side of the plane .

如申請專利範圍第10項所述之紫外光發光二極體封裝結構，其中，該紫外光發光二極體封裝結構更包括一金屬基板，該金屬基板具有一第三組設部，且當該基板組設於該金屬基板上，該第二組設部相對應組設於該第三組設部。 The ultraviolet light emitting diode package structure according to claim 10, wherein the ultraviolet light emitting diode package structure further comprises a metal substrate, the metal substrate has a third assembly portion, and when the The base plate is assembled on the metal base plate, and the second assembly part is correspondingly assembled on the third assembly part.

如申請專利範圍第11項所述之紫外光發光二極體封裝結構，其中，當該第二組設部為複數個時，該等第二組設部平均分佈成型於該平面四周並環繞該第一組設部。 The ultraviolet light emitting diode package structure as described in item 11 of the claimed scope, wherein when the second set of parts is plural, the second set of parts are evenly distributed around the plane and surround the plane The first group set up the department.

如申請專利範圍第12項所述之紫外光發光二極體封裝結構，其中，該紫外光發光二極體封裝結構更包含一散熱模組，且該散熱模組由一均溫板、至少一散熱鰭片以及一散熱風扇組成。 The ultraviolet light emitting diode package structure according to item 12 of the claimed scope, wherein the ultraviolet light emitting diode package structure further comprises a heat dissipation module, and the heat dissipation module is composed of a uniform temperature plate, at least one The cooling fin and a cooling fan are composed.