TWI455153B - Electrical wire assembly - Google Patents
Electrical wire assembly Download PDFInfo
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- TWI455153B TWI455153B TW101135486A TW101135486A TWI455153B TW I455153 B TWI455153 B TW I455153B TW 101135486 A TW101135486 A TW 101135486A TW 101135486 A TW101135486 A TW 101135486A TW I455153 B TWI455153 B TW I455153B
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Description
本發明係有關於一種電線組件，特別係一種用於抑制電磁干擾(EMI)及防治靜電之電線組件。The present invention relates to a wire assembly, and more particularly to a wire assembly for suppressing electromagnetic interference (EMI) and preventing static electricity.
目前的電子裝置均需通過電磁干擾(EMI)以及靜電測試(ESD)，以保護使用者的安全及符合法規標準。Current electronic devices are required to pass electromagnetic interference (EMI) and electrostatic testing (ESD) to protect the user's safety and compliance with regulatory standards.
一般而言，當電線***電子裝置並作動時，EMI便會藉由電線發散至外界。為了解決此問題，目前常見電線的周圍會使用例如導電布來包覆，然而導電布在製作過程中可能會發生纏繞不完全的問題，因而無法提供較完全之電磁防護效果。此外，當電子裝置在使用時，外界静電亦會經由電線導入電子裝置內造成電路損壞，因此，如何做好電子裝置的電磁防護，實值得相關人員所深思。In general, when a wire is inserted into an electronic device and actuated, EMI is dissipated to the outside by wires. In order to solve this problem, the current common electric wire is covered with a conductive cloth, for example, but the conductive cloth may have a problem of incomplete winding during the manufacturing process, and thus it is impossible to provide a more complete electromagnetic protection effect. In addition, when the electronic device is in use, the external static electricity will also be introduced into the electronic device through the electric wire to cause damage to the circuit. Therefore, how to do the electromagnetic protection of the electronic device is worthy of consideration by relevant personnel.
本發明提供一種電線組件，可用於抑制電磁干擾(EMI)及防治靜電。The invention provides a wire assembly for suppressing electromagnetic interference (EMI) and preventing static electricity.
本發明之一實施例中提供一種電線組件，用以連接一電子裝置並包括一電線，具有一訊號部及一接地部，其中接地部包覆於訊號部；一導電緊縮結構，包覆前述電線且具有一導電包覆層，其中導電包覆層具有熱塑性材質，並與前述接地部電性連接；以及一靜電保護層，包覆前述導電緊縮結構以及前述電線，且該靜電保護層電性連接電子裝置之接地機殼。An embodiment of the present invention provides an electric wire assembly for connecting an electronic device and including a wire having a signal portion and a ground portion, wherein the ground portion is covered by the signal portion; and a conductive compact structure covering the wire And having a conductive coating layer, wherein the conductive coating layer has a thermoplastic material and is electrically connected to the grounding portion; and an electrostatic protection layer covering the conductive and compact structure and the wire, and the electrostatic protection layer is electrically connected The grounding case of the electronic device.
於一實施例中，前述導電緊縮結構更具有一導熱層及 一絕熱層，其中絕熱層係設置於前述導電包覆層與導熱層之間。。In an embodiment, the conductive shrink structure has a heat conducting layer and An insulating layer, wherein the heat insulating layer is disposed between the conductive coating layer and the heat conductive layer. .
於一實施例中，前述靜電保護層具有複數個通孔，且前述導熱層經由該些通孔暴露於外界。In one embodiment, the electrostatic protection layer has a plurality of through holes, and the heat conductive layer is exposed to the outside through the through holes.
於一實施例中，前述導電緊縮結構更具有一導電部，穿過前述導熱層與絕熱層並且電性連接前述導電包覆層以及前述靜電保護層。In one embodiment, the conductive shrink structure further has a conductive portion that passes through the heat conductive layer and the heat insulating layer and is electrically connected to the conductive coating layer and the electrostatic protection layer.
於一實施例中，前述導電包覆層係由一初始厚度受熱變形至一第一厚度，且該第一厚度係介於該初始厚度的20%到40%之間。In one embodiment, the conductive coating layer is thermally deformed to a first thickness by an initial thickness, and the first thickness is between 20% and 40% of the initial thickness.
於一實施例中，前述導電包覆層包括一第一變形部及一第二變形部，第一變形部係由一初始厚度受熱變形至一第一厚度，且第二變形部係由該初始厚度受熱變形至一第二厚度，其中第二厚度小於第一厚度。In one embodiment, the conductive coating layer includes a first deformation portion and a second deformation portion. The first deformation portion is thermally deformed to a first thickness by an initial thickness, and the second deformation portion is formed by the initial deformation portion. The thickness is thermally deformed to a second thickness, wherein the second thickness is less than the first thickness.
於一實施例中，前述第一厚度與該第二厚度係介於該初始厚度的20%到40%之間。In one embodiment, the first thickness and the second thickness are between 20% and 40% of the initial thickness.
於一實施例中，前述導電包覆層之材料為導電布、導電泡棉、鋁箔或聚氯乙烯。In one embodiment, the material of the conductive coating layer is conductive cloth, conductive foam, aluminum foil or polyvinyl chloride.
於一實施例中，前述導電包覆層上形成朝向前述靜電保護層之一第一尖端，且前述靜電保護層上形成朝向前述導電包覆層之一第二尖端，其中該第一尖端與該第二尖端相互對應且相隔一距離。In one embodiment, the conductive coating layer is formed with a first tip toward the first electrostatic protection layer, and the electrostatic protection layer is formed with a second tip toward the conductive coating layer, wherein the first tip and the first tip The second tips correspond to each other and are separated by a distance.
為使本發明之上述目的、特徵、和優點能更明顯易懂，下文特舉較佳實施例並配合所附圖式做詳細說明。The above described objects, features, and advantages of the invention will be apparent from the description and appended claims
第1圖表示本發明一實施例之電線組件與電子裝置之連接示意圖，其中，電線組件10與電子裝置20中之電路形成電性連接。第2圖表示本發明一實施例之電線組件10剖視圖，應了解的是，圖式之範圍僅包含電線組件10之一部分，並且由於電線組件10之結構為上下對稱，故在此僅繪出上半部結構作為示意。其中，電線組件10主要包含一電線100，且電線100包括一訊號部101以及包覆於訊號部10外側的接地部102；此外，前述電線組件10更包括一導電緊縮結構200，設置於電線100之外側且形成包覆。1 is a view showing the connection of an electric wire assembly and an electronic device according to an embodiment of the present invention, wherein the electric wire assembly 10 is electrically connected to a circuit in the electronic device 20. 2 is a cross-sectional view showing a wire assembly 10 according to an embodiment of the present invention. It should be understood that the scope of the drawings includes only a portion of the wire assembly 10, and since the structure of the wire assembly 10 is vertically symmetrical, only the upper portion is drawn here. The half structure is shown as an illustration. The wire assembly 10 mainly includes a wire 100, and the wire 100 includes a signal portion 101 and a ground portion 102 that is wrapped around the signal portion 10. The wire assembly 10 further includes a conductive compact structure 200 disposed on the wire 100. The outside is formed and coated.
需要特別強調的是，導電緊縮結構200具有一導電包覆層201，以對包覆於該電線100之表面形狀進行塑型，且導電緊縮結構200係由熱塑性材質所構成並且與接地部102形成電性連接。在此實施例中，導電包覆層201之材料為例如導電布、導電泡棉、鋁箔或聚氯乙烯等能夠導電之熱塑性材質。另外，電線組件10更包括一靜電保護層300，包覆於前述電線100以及導電緊縮結構200之外側。其中當電線組件10***電子裝置20之電性連接埠時(如第1圖所示)，靜電保護層300與電子裝置20之接地機殼相互電性連接。It is particularly emphasized that the conductive compact structure 200 has a conductive coating layer 201 for shaping the surface shape of the electric wire 100, and the conductive compact structure 200 is composed of a thermoplastic material and is formed with the ground portion 102. Electrical connection. In this embodiment, the material of the conductive coating layer 201 is a conductive material such as conductive cloth, conductive foam, aluminum foil or polyvinyl chloride. In addition, the wire assembly 10 further includes an electrostatic protection layer 300 covering the outer side of the wire 100 and the conductive compact structure 200. When the electric wire assembly 10 is inserted into the electrical connection of the electronic device 20 (as shown in FIG. 1 ), the electrostatic protection layer 300 and the grounding case of the electronic device 20 are electrically connected to each other.
請繼續參閱第2圖，前述導電緊縮結構200更包括一導熱層202，其作用為傳導熱能至導電包覆層201。應了解的是，由於導電包覆層201係由熱塑性材質所構成，因此，當其外側提供有一熱源時，導電包覆層201會因為受熱而變形，並朝其內側之方向(電線100之位置)產生收縮，進而可緊密包覆整條電線100，藉此可改善傳統導電布容易 因鬆脫並使得電子裝置發生短路之缺點。如第2圖中所示，導熱層202外側之靜電保護層300亦可設有複數個通孔301，且位於靜電保護層300內側之導熱層202可經由該些通孔301暴露於外界。此外，導電包覆層201與導熱層202之間還設置有一絕熱層203，能夠避免過大的熱能造成電線組件10產生結構損壞。Continuing to refer to FIG. 2 , the conductive shrink structure 200 further includes a heat conductive layer 202 that functions to conduct thermal energy to the conductive cladding layer 201 . It should be understood that since the conductive coating layer 201 is made of a thermoplastic material, when a heat source is provided on the outer side thereof, the conductive coating layer 201 is deformed by heat and is directed toward the inner side thereof (the position of the electric wire 100). Producing shrinkage, which in turn can tightly coat the entire wire 100, thereby improving the conventional conductive cloth The disadvantage of being short-circuited by the electronic device. As shown in FIG. 2 , the electrostatic protection layer 300 on the outer side of the thermal conductive layer 202 may also be provided with a plurality of through holes 301 , and the thermal conductive layer 202 located inside the electrostatic protection layer 300 may be exposed to the outside through the through holes 301 . In addition, a heat insulating layer 203 is disposed between the conductive coating layer 201 and the heat conductive layer 202 to prevent excessive thermal energy from causing structural damage to the wire assembly 10.
需要特別說明的是，導電包覆層201與接地部102之間係形成電性連接，其中導電包覆層201可在受熱後由一初始厚度收縮變形至一第一厚度。前述第一厚度係介於初始厚度的20%到40%之間(例如30%)，此為導電包覆層201對電線100塑型時所能達到最佳導電率之條件，據此導電包覆層201能夠有效抑制電線100所產生之電磁波，並可經由接地部102釋放干擾雜訊。It should be particularly noted that the conductive coating layer 201 is electrically connected to the grounding portion 102, wherein the conductive coating layer 201 can be deformed by an initial thickness to a first thickness after being heated. The foregoing first thickness is between 20% and 40% (for example, 30%) of the initial thickness, which is a condition that the conductive coating layer 201 can achieve the optimum conductivity when molding the electric wire 100, and accordingly, the conductive package The cladding layer 201 can effectively suppress electromagnetic waves generated by the electric wire 100 and can release interference noise via the ground portion 102.
再者，如第2圖所示，本實施例中之導電緊縮結構200更包括一導電部204，穿過導熱層202與絕熱層203，藉以電性連接導電包覆層201以及靜電保護層300。如此一來，外界之靜電便可經由接地部102導引至導電包覆層201，再經由導電部204傳導至靜電保護層300，最後透過電子裝置20的接地機殼釋放，以達到防治靜電之效果。Furthermore, as shown in FIG. 2, the conductive compact structure 200 of the present embodiment further includes a conductive portion 204 passing through the heat conductive layer 202 and the heat insulating layer 203 to electrically connect the conductive cladding layer 201 and the electrostatic protection layer 300. . In this way, the external static electricity can be guided to the conductive coating layer 201 via the grounding portion 102, then transmitted to the electrostatic protection layer 300 via the conductive portion 204, and finally released through the grounded casing of the electronic device 20 to achieve static electricity prevention. effect.
第3圖表示本發明另一實施例之電線組件10剖視圖，其中此實施例與第2圖表示之實施例的不同在於，此實施例中的導電包覆層201由初始厚度受熱變形後形成具有不同厚度之第一變形部P1、第二變形部P2及第三變形部P3，前述第一及第三變形部P1、P3於受熱變形後具有一第一厚度(例如係初始厚度的30%)，而第二變形部P2於受熱後具 有一小於第一厚度之第二厚度(例如係初始厚度的20%)，據此可使得導電包覆層201之第二變形部P2與其對應連接之接地部102中之受電部P4間具有較佳的導電率，進而能夠促進導電包覆層201與接地部102之間的電流傳導。3 is a cross-sectional view showing a wire assembly 10 according to another embodiment of the present invention, wherein this embodiment differs from the embodiment shown in FIG. 2 in that the conductive coating layer 201 in this embodiment is formed by thermal deformation of an initial thickness. The first deformation portion P1, the second deformation portion P2, and the third deformation portion P3 having different thicknesses, the first and third deformation portions P1, P3 have a first thickness after heat deformation (for example, 30% of the initial thickness) And the second deformation portion P2 is heated There is a second thickness smaller than the first thickness (for example, 20% of the initial thickness), so that the second deformation portion P2 of the conductive coating layer 201 and the power receiving portion P4 of the correspondingly connected ground portion 102 are preferably better. The conductivity can further promote current conduction between the conductive clad layer 201 and the ground portion 102.
接著請參閱第4圖，其中導電包覆層201上形成有朝向靜電保護層300之一第一尖端T1，而靜電保護層300上則形成有朝向導電包覆層201之一第二尖端T2，該第一尖端T1與該第二尖端T2係相互對應且相隔一距離。藉此結構特徵可使得來自電線100之靜電經由第一尖端T1及第二尖端T2以跳電的方式傳導至靜電保護層300，並可透過電子裝置20的接地機殼釋放靜電。相反地，由電子裝置20本身發出之微量漏電流，則可由接地部102直接釋放而不會透過第一及第二尖端T1、T2傳導至靜電保護層300，藉此可解決傳統上使用者觸摸機殼會感到些微觸電之問題。Referring to FIG. 4, the conductive cap layer 201 is formed with a first tip T1 facing the electrostatic protection layer 300, and the electrostatic protection layer 300 is formed with a second tip T2 facing the conductive cap layer 201. The first tip T1 and the second tip T2 correspond to each other and are separated by a distance. The structural feature can cause static electricity from the electric wire 100 to be electrically transferred to the electrostatic protection layer 300 via the first tip T1 and the second tip T2, and can discharge static electricity through the grounded casing of the electronic device 20. Conversely, a small amount of leakage current emitted by the electronic device 20 itself can be directly released from the ground portion 102 without being transmitted to the electrostatic protection layer 300 through the first and second tips T1 and T2, thereby solving the conventional user touch. The case will feel a slight electric shock.
綜上所述，本發明提供一種連接一電子裝置之電線組件，包括一電線、一導電緊縮結構及一靜電保護層，其中該電線具有一訊號部及一接地部，且接地部係包覆於訊號部之外側；該導電緊縮結構包覆該電線且具有一導電包覆層，其中該導電包覆層具有熱塑性材質並且與接地部電性連接；該靜電保護層包覆該導電緊縮結構及該電線，並且電性連接該電子裝置之接地機殼。透過上述之設計特徵，本發明之電線組件可改善原先以導電布包覆電線之方法並提供更好之電磁防治效果，亦可進一步解決發生於電子裝置中靜電以及漏電流等問題。In summary, the present invention provides a wire assembly for connecting an electronic device, comprising a wire, a conductive compact structure and an electrostatic protection layer, wherein the wire has a signal portion and a ground portion, and the ground portion is covered by The electrically conductive shrink layer covers the electric wire and has a conductive coating layer, wherein the conductive coating layer has a thermoplastic material and is electrically connected to the ground portion; the electrostatic protection layer covers the conductive compact structure and the The electric wire is electrically connected to the grounded casing of the electronic device. Through the above design features, the wire assembly of the present invention can improve the method of previously covering the wire with the conductive cloth and provide better electromagnetic control effects, and can further solve the problems of static electricity and leakage current occurring in the electronic device.
雖然本發明以前述之實施例揭露如上，然其並非用以 限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可做些許之更動與潤飾。因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to be used The invention is defined. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
10‧‧‧電線組件10‧‧‧Wire assembly
20‧‧‧電子裝置20‧‧‧Electronic devices
100‧‧‧電線100‧‧‧Wire
101‧‧‧訊號部101‧‧‧Signal Department
102‧‧‧接地部102‧‧‧ Grounding Department
200‧‧‧導電緊縮結構200‧‧‧Conductive compact structure
201‧‧‧導電包覆層201‧‧‧ Conductive coating
202‧‧‧導熱層202‧‧‧thermal layer
203‧‧‧絕熱層203‧‧‧Insulation layer
204‧‧‧導電部204‧‧‧Electrical Department
300‧‧‧靜電保護層300‧‧‧Electrostatic protective layer
301‧‧‧通孔301‧‧‧through hole
P1‧‧‧第一變形部P1‧‧‧First Deformation
P2‧‧‧第二變形部P2‧‧‧Second Deformation
P3‧‧‧第三變形部P3‧‧‧ Third Deformation
P4‧‧‧受電部P4‧‧‧Power Management Department
T1‧‧‧第一尖端T1‧‧‧ first tip
T2‧‧‧第二尖端T2‧‧‧ second tip
第1圖表示本發明一實施例之電線組件與電子裝置之連接示意圖；第2圖表示本發明一實施例之電線組件剖視圖；第3圖表示本發明一實施例之電線組件包括不同受熱變形程度之第一、第二及第三變形部剖視圖；以及第4圖表示本發明一實施例之電線組件具有第一及第二尖端結構之剖視圖。1 is a view showing the connection of an electric wire assembly and an electronic device according to an embodiment of the present invention; FIG. 2 is a cross-sectional view showing a wire assembly according to an embodiment of the present invention; and FIG. 3 is a view showing a wire assembly including a different degree of thermal deformation according to an embodiment of the present invention; A cross-sectional view of the first, second, and third deformed portions; and a fourth cross-sectional view showing the electric wire assembly of the embodiment of the present invention having the first and second tip structures.
10‧‧‧電線組件10‧‧‧Wire assembly
100‧‧‧電線100‧‧‧Wire
101‧‧‧訊號部101‧‧‧Signal Department
102‧‧‧接地部102‧‧‧ Grounding Department
200‧‧‧導電緊縮結構200‧‧‧Conductive compact structure
201‧‧‧導電包覆層201‧‧‧ Conductive coating
202‧‧‧導熱層202‧‧‧thermal layer
203‧‧‧絕熱層203‧‧‧Insulation layer
204‧‧‧導電部204‧‧‧Electrical Department
300‧‧‧靜電保護層300‧‧‧Electrostatic protective layer
301‧‧‧通孔301‧‧‧through hole
Claims (9)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101135486A TWI455153B (en) | 2012-09-27 | 2012-09-27 | Electrical wire assembly |
| CN201210385045.6A CN103700431B (en) | 2012-09-27 | 2012-10-11 | Electric wire assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101135486A TWI455153B (en) | 2012-09-27 | 2012-09-27 | Electrical wire assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201413755A TW201413755A (en) | 2014-04-01 |
| TWI455153B true TWI455153B (en) | 2014-10-01 |
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| CN (1) | CN103700431B (en) |
| TW (1) | TWI455153B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM347650U (en) * | 2008-07-14 | 2008-12-21 | Hua Eng Wire & Amp Cable Co Ltd | Structure of cross-linked polyethylene (XLPE) power cable for ultra-high voltage 400KV |
| TWM420761U (en) * | 2011-07-20 | 2012-01-11 | Nas Technologies Corps | Sensing substrate with electrostatic protection and touch panel using the same |
| TW201212049A (en) * | 2010-05-06 | 2012-03-16 | Furukawa Electric Co Ltd | Insulated wire, electrical equipment, and method of producing an insulated wire |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1221983C (en) * | 2000-04-17 | 2005-10-05 | 韦吾泽罗公司 | Electromagnetic interference shielding of electrical cables and connectors |
| JP4377736B2 (en) * | 2004-04-07 | 2009-12-02 | 株式会社オートネットワーク技術研究所 | Shielded wire connector and connection method with shielded wire |
| CN2831508Y (en) * | 2005-06-02 | 2006-10-25 | 泛特电子企业有限公司 | Socket of high frequency pluger |
| EP2394337B1 (en) * | 2009-02-05 | 2017-04-05 | 3M Innovative Properties Company | Splice assembly with shield sock |
| JP5622307B2 (en) * | 2010-07-05 | 2014-11-12 | 矢崎総業株式会社 | Shield connector |
-
2012
- 2012-09-27 TW TW101135486A patent/TWI455153B/en active
- 2012-10-11 CN CN201210385045.6A patent/CN103700431B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM347650U (en) * | 2008-07-14 | 2008-12-21 | Hua Eng Wire & Amp Cable Co Ltd | Structure of cross-linked polyethylene (XLPE) power cable for ultra-high voltage 400KV |
| TW201212049A (en) * | 2010-05-06 | 2012-03-16 | Furukawa Electric Co Ltd | Insulated wire, electrical equipment, and method of producing an insulated wire |
| TWM420761U (en) * | 2011-07-20 | 2012-01-11 | Nas Technologies Corps | Sensing substrate with electrostatic protection and touch panel using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103700431B (en) | 2016-08-24 |
| TW201413755A (en) | 2014-04-01 |
| CN103700431A (en) | 2014-04-02 |
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