TWI454196B - Routing method - Google Patents
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- TWI454196B TWI454196B TW099137376A TW99137376A TWI454196B TW I454196 B TWI454196 B TW I454196B TW 099137376 A TW099137376 A TW 099137376A TW 99137376 A TW99137376 A TW 99137376A TW I454196 B TWI454196 B TW I454196B
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Description
本發明涉及電路板製作領域，特別涉及一種電路板及其配件之成型方法。 The present invention relates to the field of circuit board manufacturing, and in particular to a method for forming a circuit board and its accessories.
隨著電子產業之飛速發展，作為電子產品基本構件之電路板之製作技術顯得越來越重要。電路板一般由覆銅基板經裁切、鑽孔、蝕刻、曝光、顯影、壓合、成型等一系列製程製作而成。具體可參閱C.H.Steer等人於Proceedings of the IEEE,Vol.39,No.2(2002年8月)中發表之“Dielectric characterization of printed circuit board substrates”一文。 With the rapid development of the electronics industry, the production technology of circuit boards, which are the basic components of electronic products, is becoming more and more important. The circuit board is generally fabricated by a series of processes such as cutting, drilling, etching, exposing, developing, pressing, and molding a copper-clad substrate. For details, see "Dielectric characterization of printed circuit board substrates" by C. H. Steer et al., Proceedings of the IEEE, Vol. 39, No. 2 (August 2002).
目前，於電路板之製作時，無論係配件還係電路板本身，一般為將多個具有相同結構和功能之單元排版於一個較大基板上。當電路板製作完成後，再將該多個單元從基板上切割分離，從而得到單個單元。將單元從單個單元從基板上進行分離時，一般係採用衝型工藝，隨著電子產品之日趨精細化，於單個單元之邊緣部分會有機構孔或係導通孔存在，而機構孔與導通孔距離外型之距離越來越小。即便係採用分次成型之方式，也會導致衝型過後孔邊距成型邊區域有裂紋，發白或者變形等不良產生。 At present, in the manufacture of a circuit board, whether the accessory is also the circuit board itself, a plurality of units having the same structure and function are generally typeset on a larger substrate. After the board is fabricated, the plurality of cells are cut and separated from the substrate to obtain a single unit. When the unit is separated from the substrate from the single unit, the punching process is generally adopted. As the electronic product becomes more and more refined, there are mechanism holes or through holes in the edge portion of the single unit, and the mechanism holes and the through holes are present. The distance from the exterior is getting smaller and smaller. Even if it adopts the method of split molding, it will cause cracks, whitening or deformation of the hole edge forming area after the punching.
有鑑於此，提供一種成型方法，以有效改善電路板或者其配件於 成型後成型邊附近區域之孔裂紋、發白或者變形實為必要。 In view of this, a molding method is provided to effectively improve the circuit board or its accessories. It is necessary to crack, blush or deform the hole in the vicinity of the formed side after molding.
一種成型方法，包括步驟：提供基板，所述基板具有產品區和非產品區，所述產品區和所述非產品區之邊界為成型邊，所述產品區具有至少一個產品單元，於所述產品區內具有多個產品孔，所述多個產品孔中之至少一個產品孔與所述成型邊相鄰；與所述成型邊相鄰之至少一個產品孔緊鄰之所述非產品區形成至少一個輔助孔。對所述基板沿所述成型邊成型作業，以形成產品單元。 A molding method comprising the steps of: providing a substrate having a product zone and a non-product zone, wherein the boundary between the product zone and the non-product zone is a forming edge, the product zone having at least one product unit, a product hole having a plurality of product holes, wherein at least one of the plurality of product holes is adjacent to the molding edge; and the non-product region adjacent to the at least one product hole adjacent to the molding edge forms at least An auxiliary hole. The substrate is formed along the forming edge to form a product unit.
相較先前技術，本技術方案提供之成型方法，於非產品區緊鄰產品區產品孔之區域鑽輔助孔，所述輔助孔直徑大於所述產品孔直徑。於成型時以輔助孔將所受力轉移至非產品區，以有效改善電路板或者其配件於成型後成型邊附近區域之孔裂紋、發白或者變形。 Compared with the prior art, the technical solution provides a molding method for drilling an auxiliary hole in a region of a non-product area adjacent to a product hole of a product area, the auxiliary hole diameter being larger than the product hole diameter. The auxiliary hole is used to transfer the force to the non-product area during molding to effectively improve the crack, whitening or deformation of the hole of the circuit board or its fitting in the vicinity of the molded side after molding.
10‧‧‧電路板基板 10‧‧‧Circuit board
100‧‧‧非產品區 100‧‧‧non-product area
101‧‧‧產品區 101‧‧‧Product Area
102‧‧‧成型邊 102‧‧‧ formed side
103，203‧‧‧產品孔 103,203‧‧‧Product hole
103a，203a‧‧‧第一產品孔 103a, 203a‧‧‧ first product hole
103b，203b‧‧‧第二產品孔 103b, 203b‧‧‧ second product hole
103c‧‧‧第三產品孔 103c‧‧‧ third product hole
104，204‧‧‧輔助孔 104,204‧‧‧Auxiliary hole
104a，204a‧‧‧第一輔助孔 104a, 204a‧‧‧ first auxiliary hole
104b，204b‧‧‧第二輔助孔 104b, 204b‧‧‧Second auxiliary hole
104c‧‧‧第三輔助孔 104c‧‧‧ third auxiliary hole
110‧‧‧電路板單元 110‧‧‧Circuit unit
111，211‧‧‧第一邊線 111,211‧‧‧First line
112，212‧‧‧第二邊線 112,212‧‧‧Second line
113，213‧‧‧第三邊線 113,213‧‧‧ third line
114，214‧‧‧第一突出邊線 114,214‧‧‧The first prominent edge
115，215‧‧‧第二突出邊線 115, 215‧‧‧ second prominent edge
116，216‧‧‧第三突出邊線 116,216‧‧‧ third prominent edge
117，217‧‧‧第四邊線 117,217‧‧‧ fourth sideline
20‧‧‧配件基板 20‧‧‧Accessory substrate
200‧‧‧第二非產品區 200‧‧‧Second non-product area
201‧‧‧第二產品區 201‧‧‧Second product area
202‧‧‧第二成型邊 202‧‧‧Second forming side
210‧‧‧配件單元 210‧‧‧Accessory unit
218‧‧‧弧形邊線 218‧‧‧ curved edges
220‧‧‧第二突出結構 220‧‧‧second protruding structure
230‧‧‧第三突出結構 230‧‧‧ third protruding structure
圖1係本技術方案實施例一提供之電路板基板之平面示意圖。 FIG. 1 is a schematic plan view of a circuit board substrate according to Embodiment 1 of the present technical solution.
圖2係圖1之提供之電路板經衝輔助孔後之平面示意圖。 2 is a plan view showing the circuit board provided in FIG. 1 after being punched through the auxiliary hole.
圖3係本技術方案實施例一提供之電路板基板經成型所形成之電路板單元。 FIG. 3 is a circuit board unit formed by molding a circuit board substrate according to Embodiment 1 of the present technical solution.
圖4係本技術方案實施例二提供之電路板配件之平面示意圖。 4 is a schematic plan view of a circuit board assembly provided in Embodiment 2 of the technical solution.
圖5係本技術方案實施例二提供之電路板配件成型後之配件單元上之平面示意圖。 FIG. 5 is a schematic plan view of the accessory unit after the circuit board assembly provided by the second embodiment of the technical solution is formed.
下面將結合附圖和實施例對本技術方案之成型方法作進一步詳細說明。 The molding method of the present technical solution will be further described in detail below with reference to the accompanying drawings and embodiments.
請一併參閱圖1及圖2，本技術方案實施例一提供之成型方法包括如下步驟： Referring to FIG. 1 and FIG. 2 together, the molding method provided in Embodiment 1 of the technical solution includes the following steps:
首先，提供已經過衝鑽之電路板基板10。 First, a circuit board substrate 10 that has been drilled is provided.
電路板基板10為已經過衝孔之電路板基板。電路板基板10分為產品區101及非產品區100。產品區101與非產品區100之邊界為成型邊102。成型邊102由第一邊線111、第二邊線112、第三邊線113、第四邊線117並首尾依次順序連接且成型邊102外觀大致呈矩形。其中，第一邊線111與第三邊線113平行且均與第二邊線112及第四邊線117分別垂直。本實施例中，於第三邊線113向非產品區100延伸形成一個矩形突出結構120。突出結構120具有第一突出邊線114、第二突出邊線115及第三突出邊線116。第二突出邊線115與第一邊線111平行且分別與第一突出邊線114、第三突出邊線116相互垂直。電路板基板10之產品區101包括多個相互獨立之電路板單元110。 The circuit board substrate 10 is a circuit board substrate that has been punched. The circuit board substrate 10 is divided into a product area 101 and a non-product area 100. The boundary between the product zone 101 and the non-product zone 100 is the profiled edge 102. The molding side 102 is sequentially connected by the first side line 111, the second side line 112, the third side line 113, and the fourth side line 117 in order, and the molding side 102 has a substantially rectangular appearance. The first side line 111 is parallel to the third side line 113 and is perpendicular to the second side line 112 and the fourth side line 117, respectively. In this embodiment, a rectangular protruding structure 120 is formed on the third side line 113 to the non-product area 100. The protruding structure 120 has a first protruding edge line 114, a second protruding edge line 115, and a third protruding edge line 116. The second protruding edge line 115 is parallel to the first edge line 111 and perpendicular to the first protruding edge line 114 and the third protruding edge line 116, respectively. The product area 101 of the circuit board substrate 10 includes a plurality of mutually independent circuit board units 110.
每個電路板單元110具有多個產品孔103。本實施例中，產品孔103包括第一產品孔103a、第二產品孔103b、第三產品孔103c。於本實施例中，突出結構120上具有一個第一產品孔103a並且第一產品孔103a中心到成型邊102中之至少一個邊之距離小於第一產品孔103a之直徑。於本實施例中，第一產品孔103a與第一突出邊線114、第二突出邊線115及第三突出邊線116相鄰，且第一產品孔103a之中心到第一突出邊線114、第二突出邊線115及第三突出邊線116之距離均小於第一產品孔103a之直徑。第二產品孔103b於緊鄰第一邊線111與第二邊線112之產品區101。第二產品孔103b中心到成型邊102至少一個距離小於第二產品孔103b之直 徑。於本實施例中，第二產品孔103b中心與第一邊線111、第二邊線112之距離均小於第二產品孔103b之直徑。第三產品孔103c與第四邊線117相鄰，並且第三產品孔103c之中心到第四邊線117之距離小於第三產品孔103c之直徑。每個電路板單元110之突出結構120之個數及形狀不定。需要依據具體之電路板之形狀而定，突出結構120可以為一個，兩個或者多個。突出結構120也可以為半圓體狀，正方體狀或為不規則狀。 Each circuit board unit 110 has a plurality of product apertures 103. In this embodiment, the product hole 103 includes a first product hole 103a, a second product hole 103b, and a third product hole 103c. In the present embodiment, the protruding structure 120 has a first product hole 103a and the distance from the center of the first product hole 103a to at least one of the forming edges 102 is smaller than the diameter of the first product hole 103a. In this embodiment, the first product hole 103a is adjacent to the first protruding edge 114, the second protruding edge 115, and the third protruding edge 116, and the center of the first product hole 103a to the first protruding edge 114, the second protrusion The distance between the edge 115 and the third protruding edge 116 is smaller than the diameter of the first product hole 103a. The second product hole 103b is adjacent to the product area 101 of the first edge 111 and the second edge 112. At least one distance from the center of the second product hole 103b to the forming edge 102 is smaller than the distance of the second product hole 103b path. In this embodiment, the distance between the center of the second product hole 103b and the first edge 111 and the second edge 112 is smaller than the diameter of the second product hole 103b. The third product hole 103c is adjacent to the fourth side line 117, and the distance from the center of the third product hole 103c to the fourth side line 117 is smaller than the diameter of the third product hole 103c. The number and shape of the protruding structures 120 of each of the circuit board units 110 are not fixed. Depending on the shape of the particular board, the protruding structures 120 can be one, two or more. The protruding structure 120 may also have a semicircular shape, a square shape or an irregular shape.
其次，於電路板基板10之非產品區100形成輔助孔104。 Next, an auxiliary hole 104 is formed in the non-product area 100 of the circuit board substrate 10.
將電路板基板10通過具有定位功能之產品孔103放置於衝孔機台工作臺面上，並於非產品區100緊鄰成型邊102處與對應之產品孔103相對應之位置形成輔助孔104。輔助孔104之孔圓週上之點到成型邊102之最小距離為成型時之偏位加工公差。以避免於成型工藝中，由衝型衝偏所導致之產品外形缺口之不良。輔助孔104之直徑大於或等於兩倍之與之相鄰之第一產品孔103a、第二產品孔103b或第三產品孔103c之直徑。 The circuit board substrate 10 is placed on the punching machine table surface through the product hole 103 having the positioning function, and the auxiliary hole 104 is formed at a position corresponding to the corresponding product hole 103 at the non-product area 100 adjacent to the molding side 102. The minimum distance from the point on the circumference of the hole of the auxiliary hole 104 to the forming edge 102 is the offset machining tolerance during molding. In order to avoid the defects in the shape of the product caused by the punching offset during the molding process. The diameter of the auxiliary hole 104 is greater than or equal to twice the diameter of the first product hole 103a, the second product hole 103b or the third product hole 103c adjacent thereto.
具體來講，於緊鄰第一突出邊線114、第二突出邊線115及第三突出邊線116之非產品區100形成第一產品孔103a相對應之三個第一輔助孔104a。每個第一輔助孔104a之中心與第一產品孔103a之中心之連線垂直於其相鄰之突出邊線。於緊鄰第一邊線111、第二邊線112之非產品區100形成第二產品孔103b之兩個第二輔助孔104b，每個第二輔助孔104b之中心與第二產品孔103b之中心之連線垂直於其相鄰之邊線。於緊鄰第四邊線117之非產品區100形成第三產品孔103c之第三輔助孔104c。優選地，第三輔助孔104c之中心與第三產品孔103c中心之連線垂直於第四邊線117。即每個 輔助孔圓心與其緊鄰之第一產品孔103a、第二產品孔103b、第三產品孔103c圓心所在直線垂直於對應之產品孔103與所述輔助孔之間之成型邊102。 Specifically, the non-product regions 100 adjacent to the first protruding edge line 114, the second protruding edge line 115, and the third protruding edge line 116 form three first auxiliary holes 104a corresponding to the first product holes 103a. The line connecting the center of each of the first auxiliary holes 104a and the center of the first product hole 103a is perpendicular to its adjacent protruding edge. Forming two second auxiliary holes 104b of the second product hole 103b in the non-product area 100 adjacent to the first side line 111 and the second side line 112, the center of each of the second auxiliary holes 104b and the center of the second product hole 103b The line is perpendicular to its adjacent edge. A third auxiliary hole 104c of the third product hole 103c is formed in the non-product area 100 adjacent to the fourth side line 117. Preferably, the line connecting the center of the third auxiliary hole 104c and the center of the third product hole 103c is perpendicular to the fourth side line 117. That is each The line of the center of the auxiliary hole and the first product hole 103a, the second product hole 103b, and the third product hole 103c adjacent thereto are perpendicular to the forming edge 102 between the corresponding product hole 103 and the auxiliary hole.
最後，請參閱圖3，沿成型邊102對電路板基板10進行成型，形成電路板單元110。 Finally, referring to FIG. 3, the circuit board substrate 10 is molded along the molding side 102 to form the circuit board unit 110.
於此製程過程中，成型時對第一產品孔103a、第二產品孔103b、第三產品孔103c所產生之力轉移到對應之輔助孔上，使得第一產品孔103a、第二產品孔103b、第三產品孔103c所受之力比無輔助孔104時大大減小，從而可以避免各產品孔成型後出現孔裂紋、發白或者變形等不良。 During the process, the force generated by the first product hole 103a, the second product hole 103b, and the third product hole 103c during molding is transferred to the corresponding auxiliary hole, so that the first product hole 103a and the second product hole 103b The force received by the third product hole 103c is greatly reduced compared to when the auxiliary hole 104 is not provided, so that defects such as hole cracking, whitishness or deformation after molding of each product hole can be avoided.
請參閱圖4及圖5，結合實施例二對本技術方案提供之成型方法做進一步說明。 Referring to FIG. 4 and FIG. 5 , the molding method provided by the technical solution is further described in conjunction with the second embodiment.
首先，提供待衝型之配件基板20。本實施例中，配件基板20為已經過衝孔之電路板配件基板，配件基板20分為第二產品區201及第二非產品區200，第二產品區201與第二非產品區200之邊界為第二成型邊202。第二成型邊202由第一邊線211、第二邊線212、第三邊線213、及第四邊線217首尾順次連接第二成型邊202外觀呈矩形狀。其中，第一邊線211與第三邊線213平行且均與第二邊線212及第四邊線217分別垂直。於本實施例中，於第二邊線212上向第二非產品區200延伸突出一個第二突出結構220。第二突出結構220具有第一突出邊線214，第二突出邊線215及第三突出邊線216。其中第二突出邊線215與第二邊線212平行且分別與第一突出邊線214與第三突出邊線216相互垂直。於第四邊線217上具有向第二非產品區200延伸突出之弧形邊線218並形成第三突出結 構230。配件基板20之第二產品區201包括多個相互獨立之配件單元210。 First, the accessory substrate 20 of the standby type is provided. In this embodiment, the accessory substrate 20 is a circuit board accessory substrate that has been punched. The accessory substrate 20 is divided into a second product area 201 and a second non-product area 200, and the second product area 201 and the second non-product area 200 The boundary is the second contoured edge 202. The second molding edge 202 is sequentially connected to the second molding edge 202 by the first side line 211, the second side line 212, the third side line 213, and the fourth side line 217, and has a rectangular shape. The first edge 211 is parallel to the third edge 213 and is perpendicular to the second edge 212 and the fourth edge 217, respectively. In the embodiment, a second protruding structure 220 is protruded from the second non-product area 200 on the second side line 212. The second protruding structure 220 has a first protruding edge 214, a second protruding edge 215 and a third protruding edge 216. The second protruding edge 215 is parallel to the second edge 212 and perpendicular to the first protruding edge 214 and the third protruding edge 216, respectively. On the fourth edge 217, there is a curved edge 218 extending toward the second non-product region 200 and forming a third protruding junction. Structure 230. The second product area 201 of the accessory substrate 20 includes a plurality of accessory units 210 that are independent of one another.
於第二產品區201形成產品孔203，於第二非產品區200緊鄰第二成型邊202處形成輔助孔204。產品孔203包括第一產品孔203a及第二產品孔203b。 A product hole 203 is formed in the second product area 201, and an auxiliary hole 204 is formed in the second non-product area 200 adjacent to the second forming side 202. The product hole 203 includes a first product hole 203a and a second product hole 203b.
第二突出結構220上具有第一產品孔203a。第一產品孔203a中心至少有一個到第二成型邊202之距離小於第一產品孔203a之直徑。於本實施例中，第一產品孔203a到第一突出邊線214，第二突出邊線215及第三突出邊線216距離均小於第一產品孔203a之直徑。於緊鄰第一產品孔203a之第二非產品區200形成三個第一輔助孔204a。每個第一輔助孔204a之中心與第一產品孔203a之中心之連線垂直與其相鄰之突出邊線。第三突出結構230呈半圓體狀，第三突出結構230上具有第二產品孔203b。第二產品孔203b中心與弧形邊線218一段距離小於第二產品孔203b之直徑。於緊鄰第二產品孔203b之第二非產品區200形成一個第二輔助孔204b。第二輔助孔204b之中心與第二產品孔203b之中心之連線垂直於其相鄰之弧形邊線218。輔助孔204直徑大於或等於兩倍與之相鄰之第一產品孔203a、第二產品孔203b且第一產品孔203a、第二產品孔203b之圓心與輔助孔204之圓心所於之直線垂直於產品孔203與第二輔助孔204兩者間之成型邊。輔助孔204孔圓周上之點離第二成型邊202最小距離為成型時之偏位加工公差。以避免於成型工藝中，由衝型衝偏所導致之產品外形缺口之不良。 The second protruding structure 220 has a first product hole 203a thereon. The center of the first product hole 203a has at least one distance from the second forming edge 202 that is smaller than the diameter of the first product hole 203a. In this embodiment, the distance from the first product hole 203a to the first protruding edge 214, the second protruding edge 215, and the third protruding edge 216 are both smaller than the diameter of the first product hole 203a. Three first auxiliary holes 204a are formed in the second non-product area 200 adjacent to the first product hole 203a. The line connecting the center of each of the first auxiliary holes 204a and the center of the first product hole 203a is perpendicular to the adjacent protruding line. The third protruding structure 230 has a semicircular shape, and the third protruding structure 230 has a second product hole 203b thereon. The center of the second product hole 203b is spaced apart from the curved edge 218 by a distance smaller than the diameter of the second product hole 203b. A second auxiliary hole 204b is formed in the second non-product area 200 adjacent to the second product hole 203b. The line connecting the center of the second auxiliary hole 204b and the center of the second product hole 203b is perpendicular to its adjacent curved side line 218. The diameter of the auxiliary hole 204 is greater than or equal to twice the first product hole 203a and the second product hole 203b adjacent thereto, and the center of the first product hole 203a and the second product hole 203b is perpendicular to the line of the center of the auxiliary hole 204. A molding edge between the product hole 203 and the second auxiliary hole 204. The minimum distance from the point on the circumference of the hole of the auxiliary hole 204 from the second forming edge 202 is the offset machining tolerance during molding. In order to avoid the defects in the shape of the product caused by the punching offset during the molding process.
於本實施例中，第二非產品區200之輔助孔204於緊鄰第一產品孔203a，第二產品孔203b形成，當然之，於產品孔203之孔邊距小 於產品孔203之直徑之時候，均可採用於與產品孔203緊鄰之第二非產品區200形成輔助孔204之方法。每個配件單元210之第二突出結構220，第三突出結構230之個數及形狀不定。需要依據具體情況形狀而定，可以為一個，兩個或者多個，也可以為半圓體狀，正方體狀或為不規則狀。 In this embodiment, the auxiliary hole 204 of the second non-product area 200 is formed adjacent to the first product hole 203a, and the second product hole 203b is formed. Of course, the hole margin of the product hole 203 is small. At the diameter of the product aperture 203, a method of forming the auxiliary aperture 204 in the second non-product region 200 adjacent the product aperture 203 can be employed. The number and shape of the second protruding structure 220 of each of the accessory units 210 are indefinite. It needs to be one, two or more depending on the shape of the specific situation. It can also be a semicircular shape, a square shape or an irregular shape.
其次，將上述步驟中形成之配件基板20沿第二成型邊202進行成型作業。即可得到單個配件單元210。 Next, the accessory substrate 20 formed in the above step is formed along the second molding side 202. A single accessory unit 210 is available.
進一步來講，於以上兩個實施例中，電路板基板10之產品孔103與輔助孔104係於不同衝孔工藝中形成之，產品孔103之形成早於輔助孔104。而電路板配件基板20之產品孔203與輔助孔204係於同一道工序中形成之。實際生產過程中，產品孔與輔助孔之形成並無限定之先後順序，可以先形成產品孔也可以先形成輔助孔，也可以係於同一道生產工序中形成，當然前提係滿足實際之工藝生產需要。尤其當基板為電路板之補強材時，於同一道工藝中形成孔及輔助孔104可減少生產工序。輔助孔之形狀也不僅限於圓孔狀，還可以係條孔狀，正方孔狀等等，滿足成型時將產品孔所受力轉移到輔助孔即可。 Further, in the above two embodiments, the product hole 103 and the auxiliary hole 104 of the circuit board substrate 10 are formed in different punching processes, and the product hole 103 is formed earlier than the auxiliary hole 104. The product hole 203 of the board accessory substrate 20 and the auxiliary hole 204 are formed in the same process. In the actual production process, the formation of product holes and auxiliary holes is not limited. The product holes may be formed first or the auxiliary holes may be formed first, or may be formed in the same production process. Of course, the premise is to satisfy the actual process production. need. Especially when the substrate is a reinforcing material for the circuit board, forming the holes and the auxiliary holes 104 in the same process can reduce the production process. The shape of the auxiliary hole is not limited to the shape of a circular hole, but may be a hole shape, a square hole shape, or the like, and it is sufficient to transfer the force of the product hole to the auxiliary hole during molding.
相較於先前技術，本技術方案提供之成型方法，於非產品區緊鄰產品區之產品孔之區域鑽輔助孔，所述輔助孔之直徑大於與所述輔助孔緊鄰產品孔之直徑。於成型時以輔助孔將所受力轉移至非產品區，以有效改善電路板或者其配件於成型後成型邊附近區域之孔裂紋、發白或者變形。 Compared with the prior art, the present technical solution provides a molding method for drilling an auxiliary hole in a region of a product hole adjacent to a product area in a non-product area, the auxiliary hole having a diameter larger than a diameter of the product hole adjacent to the auxiliary hole. The auxiliary hole is used to transfer the force to the non-product area during molding to effectively improve the crack, whitening or deformation of the hole of the circuit board or its fitting in the vicinity of the molded side after molding.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人 士，於爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will be familiar with the present invention. Equivalent modifications or variations of the present invention in accordance with the spirit of the present invention are intended to be included in the scope of the following claims.
104‧‧‧輔助孔 104‧‧‧Auxiliary hole
104a‧‧‧第一輔助孔 104a‧‧‧First auxiliary hole
104b‧‧‧第二輔助孔 104b‧‧‧Second auxiliary hole
104c‧‧‧第三輔助孔 104c‧‧‧ third auxiliary hole
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| TW575485B (en) * | 2000-10-11 | 2004-02-11 | Matsushita Electric Ind Co Ltd | Method of manufacturing circuit board and data for producing the same |
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| TW575485B (en) * | 2000-10-11 | 2004-02-11 | Matsushita Electric Ind Co Ltd | Method of manufacturing circuit board and data for producing the same |
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