TWI450851B - Testing and classifying machine for electronic elements - Google Patents
Testing and classifying machine for electronic elements Download PDFInfo
- Publication number
- TWI450851B TWI450851B TW099103562A TW99103562A TWI450851B TW I450851 B TWI450851 B TW I450851B TW 099103562 A TW099103562 A TW 099103562A TW 99103562 A TW99103562 A TW 99103562A TW I450851 B TWI450851 B TW I450851B
- Authority
- TW
- Taiwan
- Prior art keywords
- axis
- carrier
- test
- electronic component
- pick
- Prior art date
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
本發明係提供一種可利用變距式載具搭配不同移料臂，而有效簡化移料臂之機構設計，使移料臂易於製作組裝，且利於增設取放器之電子元件測試分類機。The invention provides a electronic component test sorting machine which can utilize the variable distance carrier with different moving arms to effectively simplify the mechanism design of the moving arm, make the moving arm easy to assemble and assemble, and facilitate the addition of the pick and place device.
按，請參閱第1圖，係為坊間電子元件測試分類機之示意圖，其係於機台之前方設有供料裝置10，該供料裝置10係設有至少一具容置槽之料盤11，用以盛裝複數個待測之電子元件，於機台之後方則設有收料裝置20，該收料裝置20係設有複數個具容置槽之料盤21，用以盛裝不同等級完測之電子元件，另於機台上設有測試裝置30及輸送裝置40，該測試裝置30係設有具複數個測試座32之測試電路板31，用以測試電子元件，該輸送裝置40係於測試裝置30之前、後方分別設有可作X軸向位移之第一載具41及第二載具42，第一、二載具41、42各具有複數個定位槽411、421，用以承置待測/完測電子元件，並於供、收料裝置10、20及第一、二載具41、42間設有第一移料臂43，該第一移料臂43係具有複數個取放器431，用以於供料裝置10之料盤11處取出待測之電子元件，並移載至第一載具41之定位槽411上，亦可於第二載具42之定位槽421上取出完測之電子元件，並移載至收料裝置20之料盤21處收置，另該輸送裝置40係於測試裝置30之上方設有第二移料臂44及第三移料臂45，該第二移料臂44係具有複數個取放器441，用以於第一載具41之定位槽411處取出待測之電子元件，並移載至測試裝置30之測試座32中，而執行測試作業，該第三移料臂45亦具有複數個取放器451，用以於測試裝置30之各測試座32處取出完測之電子元件，並移載至第二載具42之定位槽421，以便輸出分類收置。According to FIG. 1 , it is a schematic diagram of an electronic component test sorting machine, which is provided with a feeding device 10 in front of the machine table, and the feeding device 10 is provided with at least one receiving tray. 11. A plurality of electronic components to be tested are mounted, and a receiving device 20 is disposed behind the machine. The receiving device 20 is provided with a plurality of trays 21 having accommodating grooves for different grades. The electronic component is completed, and the test device 30 and the transport device 40 are disposed on the machine. The test device 30 is provided with a test circuit board 31 having a plurality of test sockets 32 for testing electronic components. The transport device 40 The first carrier 41 and the second carrier 42 are respectively disposed before and behind the testing device 30, and the first and second carriers 41 and 42 each have a plurality of positioning grooves 411 and 421. The first moving arm 43 is provided between the feeding and receiving device 10, 20 and the first and second carriers 41, 42 for holding the electronic component to be tested/tested, and the first moving arm 43 has a plurality of pick-and-place devices 431 for taking out the electronic components to be tested at the tray 11 of the feeding device 10 and transferring them to the first carrier 41 On the positioning slot 411, the measured electronic component can be taken out on the positioning slot 421 of the second carrier 42 and transferred to the tray 21 of the receiving device 20, and the conveying device 40 is attached to the testing device. The second transfer arm 44 and the third transfer arm 45 are disposed above the 30, and the second transfer arm 44 has a plurality of pickers 441 for taking out at the positioning groove 411 of the first carrier 41. The electronic component is measured and transferred to the test socket 32 of the test device 30 to perform a test operation. The third transfer arm 45 also has a plurality of pick and placeers 451 for testing the test sockets 32 of the device 30. The measured electronic components are taken out and transferred to the positioning groove 421 of the second carrier 42 for output sorting.
然由於各類型電子元件之尺寸不同，使得盛裝用料盤之各容置槽間距不同，以及測試用之各測試座間距不同，當測試分類機欲測試不同電子元件時，即必須使第一、二、三移料臂43、44、45之各取放器431、441、451可調整間距，以便對應不同料盤的容置槽間距及各測試座之間距，方可於料盤及測試座處取放待測/完測之電子元件；因此，請參閱第2、3圖，以變距式第一移料臂43為例，其係於機架432上設有複數組Z軸向驅動源433，用以分別驅動一具X軸向滑槽4341之傳動板434作Z軸向位移，各傳動板434之X軸向滑槽4341則供一取放器431之滾輪4311滑置，而各取放器431之背面係設有Z軸向滑軌4312，並使其滑置於一滑動板435之Z軸向滑座4351上，各滑動板435則以X軸向滑座4352滑置於機架432之X軸向滑軌4321上，且分別連結於機架432後方之X軸向驅動源436，於調整各取放器431之X軸向間距時，係可控制X軸向驅動源436帶動各滑動板435作X軸向位移，各滑動板435則利用Z軸向滑座4351及Z軸向滑軌4312帶動取放器431作X軸向位移，各取放器431即以滾輪4311沿X軸向滑槽4341作X軸向位移而調整間距，於調整各取放器431之X軸向間距完畢後，即可控制Z軸向驅動源433驅動傳動板434作Z軸向位移，使傳動板434以X軸向滑槽4341頂推取放器431之滾輪4311，而帶動取放器431作Z軸向位移以取放元件；惟，該變距式移料臂之整體機構設計，其各元件之配置及連動關係相當複雜，不僅製作、組裝不易，且體積大而佔用空間，但測試分類機為因應不同料盤之容置槽間距及各測試座之間距，而必須於供、收料裝置10、20及第一、二載具41、42間設有變距式第一移料臂43，並於測試裝置30及第一、二載具41、42間設有變距式第一、二移料臂44、45，造成大幅增加設備成本，且不利於機台空間配置之缺失，再者，當業者欲增設複數列Y軸向平行排列之取放器431、441、451(例如8個取放器)，以提升取放元件作業產能時，即必須使第一、二、三移料臂43、44、45之各列取放器431、441、451可作X-Y軸向間距之調整，但在第一、二、三移料臂43、44、45之整體機構設計已相當複雜的情況下，若再增設複數列取放器，以及使複數列取放器可作X-Y-Z軸向位移，不僅複數列取放器增設不易，勢必使得整體機構設計更不易製作、組裝，而大幅增加成本。However, due to the different sizes of the various types of electronic components, the spacing of the receiving slots of the loading tray is different, and the spacing of the test sockets for testing is different. When the testing sorter is to test different electronic components, the first, The pick-and-place 431, 441, 451 of the second and third transfer arms 43, 44, 45 can adjust the spacing so as to correspond to the spacing of the receiving slots of different trays and the distance between the test seats, in order to the tray and the test seat. The electronic component to be tested/completed is taken; therefore, please refer to FIGS. 2 and 3, taking the variable-distance first transfer arm 43 as an example, which is provided with a complex array Z-axis drive on the frame 432. The source 433 is configured to drive a driving plate 434 of the X-axis sliding slot 4341 for Z-axis displacement, and the X-axis sliding groove 4341 of each driving plate 434 is disposed for the roller 4311 of the pick-and-placer 431 to slide. The back side of each pick-and-place 431 is provided with a Z-axis slide rail 4312, and is slidably placed on a Z-axis slide 4351 of a slide plate 435, and each slide plate 435 is slid by the X-axis slide 4352. On the X-axis slide rails 4321 of the frame 432, and respectively connected to the X-axis drive source 436 behind the frame 432, the X-axis of each pick-and-placer 431 is adjusted. In the case of the spacing, the X-axis driving source 436 can be controlled to drive the sliding plates 435 to perform X-axis displacement, and each of the sliding plates 435 uses the Z-axis sliding seat 4351 and the Z-axis sliding rail 4312 to drive the pick-and-place 431 as the X-axis. For the displacement, the pick-and-placer 431 adjusts the pitch by the X-axis displacement of the roller 4311 along the X-axis sliding groove 4341. After adjusting the X-axis spacing of each pick-and-placer 431, the Z-axis drive can be controlled. The source 433 drives the driving plate 434 to perform Z-axis displacement, so that the driving plate 434 pushes the roller 4311 of the pick-and-place 431 with the X-axis sliding slot 4341, and drives the pick-and-placer 431 to perform Z-axis displacement to take the component; The overall mechanism design of the variable-distance shifting arm, the configuration and linkage relationship of each component is quite complicated, not only is not easy to manufacture and assemble, but also has a large volume and takes up space, but the test sorting machine is adapted to the receiving groove of different trays. The pitch and the distance between the test blocks, and the variable distance first transfer arm 43 must be provided between the supply and receiving devices 10, 20 and the first and second carriers 41, 42 and in the test device 30 and the first The second carrier 41 and 42 are provided with the variable-distance first and second transfer arms 44 and 45, which greatly increases the equipment cost and is disadvantageous. In the absence of the space configuration of the machine, in addition, the operator wants to add a plurality of pick-and-place 431, 441, 451 (for example, 8 pick-and-placers) arranged in parallel with the Y-axis in order to improve the working capacity of the pick-and-place components, that is, The first row, the second and the third transfer arms 43 , 44 , 451 can adjust the XY axial spacing, but in the first, second and third transfer arms 43 , 44 , 45 When the overall mechanism design is quite complicated, if the multi-column pick and place device is added, and the multi-column pick and place device can be used for XYZ axial displacement, not only the addition of the multi-column pick and place device is difficult, but the overall mechanism design is bound to be more It is not easy to make and assemble, and it greatly increases the cost.
本發明之目的一，係提供一種電子元件測試分類機，包含供料裝置、收料裝置、測試裝置及輸送裝置，該供料裝置係容納複數個待測之電子元件，收料裝置係容納複數個不同等級完測之電子元件，測試裝置係設有具複數個測試座之測試電路板，用以測試電子元件，該輸送裝置係設有至少二具複數個取放器之移料臂及至少一變距式載具，各移料臂之複數個取放器係用以移載待測/完測之電子元件，該載具則設有至少二承座，並設有變距機構用以調整二承座之至少一軸向間距，以供二移料臂之複數個取放器可於載具之二承座上準確取放待測/完測之電子元件；藉此，可利用變距式載具搭配不同移料臂，以有效簡化移料臂之機構設計，而易於製作、組裝，並可縮小體積，達到大幅節省成本及利於空間配置之實用效益。An object of the present invention is to provide an electronic component test sorting machine, comprising a feeding device, a receiving device, a testing device and a conveying device, the feeding device is for accommodating a plurality of electronic components to be tested, and the receiving device is for receiving a plurality of electronic components. a test device with a plurality of test sockets for testing electronic components, the transport device is provided with at least two transfer arms of a plurality of pick and place devices and at least A variable-distance carrier, wherein a plurality of pick-and-place devices of each moving arm are used for transferring electronic components to be tested/finished, and the carrier is provided with at least two sockets, and is provided with a variable-distance mechanism for Adjusting at least one axial spacing of the two sockets for a plurality of pick-and-placers of the second transfer arm to accurately pick up the electronic components to be tested/completed on the second carrier of the carrier; The distance carrier is equipped with different moving arms to simplify the mechanism design of the moving arm, and it is easy to manufacture, assemble, and reduce the volume, achieving substantial cost savings and practical benefits for space configuration.
本發明之目的二，係提供一種電子元件測試分類機，該輸送裝置之變距式載具係可使各承座作至少一軸向變距，用以搭配不同移料臂之複數個取放器，而便利輸送電子元件，毋須配置機構複雜之變距式移料臂，而可易於移料臂上直接增設複數排取放器，以增加移載效能及縮短作業時間，達到提升使用效能之實用效益。A second object of the present invention is to provide an electronic component test sorting machine, wherein the variable distance carrier of the conveying device can make at least one axial variable pitch of each bearing seat for matching multiple pick and place of different moving arms. Conveniently transporting electronic components, no need to configure a complex variable-distance shifting arm, and it is easy to add multiple rows of pick-and-placers directly on the moving arm to increase the transfer efficiency and shorten the working time, thereby improving the performance. Practical benefits.
為使 貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如后：請參閱第4、5、6圖，本發明電子元件測試分類機係於機台之前方設有供料裝置50，用以盛裝待測之電子元件，於機台之後方則設有收料裝置60，用以盛裝完測之電子元件，另於機台上設有測試裝置70，用以測試電子元件，以及輸送裝置80，用以輸送待測/完測之電子元件，其中，該供料裝置50係設有至少一料盤501，該料盤501係具有複數個容置槽502供承置待測之電子元件，該收料裝置60係設有至少一料盤601，該料盤601係具有複數個容置槽602供承置完測之電子元件，該測試裝置70係設有具測試座72之測試電路板71，該測試座72可為常開型測試座或常閉型測試座，於本實施例中，該測試電路板71係配置有4個常開型測試座72，用以同步執行4個電子元件之測試作業，並使測試器(圖未示出)將測試結果傳輸至中央控制單元(圖未示出)，由中央控制單元控制各裝置作動，該輸送裝置80係設有至少一具複數個承座之變距式載具，以及至少二具複數個取放器之移料臂，用以於供料裝置50、收料裝置60及測試裝置70間輸送待測/完測之電子元件，於本實施例中，該輸送裝置80係於測試裝置70之前方設有第一載具81，第一載具81係具有至少二承座，以及可使二承座作至少一軸向變距調整之變距機構，又於測試裝置70之後方則設有第二載具82，第二載具82亦具有至少二承座，以及可使二承座作至少一軸向變距調整之變距機構，該第一、二載具81、82可為固定或活動之變距式載具，於本實施例中，該第一、二載具81、82均為活動之變距式載具，並分別由第一、二載送驅動源83、84驅動作X軸向位移，用以移載待測/完測之電子元件，以第一載具81為例，該第一載具81係於第一載送驅動源83上設有承架811，並於承架811上設有複數個承座812A、812B、812C、812D及變距機構，而變距機構係設有複數支Y軸向桿件813A、813B、813C、813D，各Y軸向桿件813A、813B、813C、813D可分別作活動式之X軸向相對位移，亦或使一Y軸向桿件813B作為固定基準件，並使其他Y軸向桿件813A、813C、813D相對於Y軸向桿件813B作X軸向位移，於本實施例中，係於承架811上設有一固定式Y軸向桿件813B，並設有至少一X軸向驅動源，用以驅動Y軸向桿件813A、813C、813D作X軸向位移，於本實施例中，該X軸向驅動源係設有馬達814，用以驅動二X軸向皮帶輪組815A、815B，其一X軸向皮帶輪組815A之上層皮帶可供裝配Y軸向桿件813A，並於下層皮帶裝配有Y軸向桿件813C，另一X軸向皮帶輪組815B之下層皮帶則供裝配Y軸向桿件813D，使得二X軸向皮帶輪組815A、815B可帶動各Y軸向桿件813A、813C、813D相對於Y軸向桿件813B作X軸向位移，進而可將承座812A、812B、812C、812D分別裝配於Y軸向桿件813A、813B、813C、813D上，另該輸送裝置80係於供、收料裝置50、60及第一、二載具81、82間設有一可作X-Y-Z軸向位移之第一移料臂85，並於第一移料臂85上固設有複數個取放器851，於本實施例中，係於第一移料臂85上固設有4個取放器851，各取放器851之X軸向間距係相對於料盤501、601之各容置槽502、602的X軸向間距，用以移載待測/完測之電子元件，又於第一載具81與測試裝置70間設有一可作X-Y-Z軸向位移之第二移料臂86，並於第二移料臂86上固設有複數個取放器861，於本實施例中，係於第二移料臂86上固設有4個取放器861，各取放器861之X軸向間距係相對於測試裝置70之各測試座72的X軸向間距，用以移載待測之電子元件，另於第二載具82與測試裝置70間設有一可作X-Y-Z軸向位移之第三移料臂87，並於第三移料臂87上固設有複數個取放器871，於本實施例中，係於第三移料臂87上固設有4個取放器871，各取放器871之X軸向間距係相對於測試裝置70之各測試座72的X軸向間距，用以移載完測之電子元件。In order to make the reviewer further understand the present invention, a preferred embodiment will be described in conjunction with the drawings, which will be described in detail later. Referring to Figures 4, 5 and 6, the electronic component test sorting machine of the present invention is attached to the machine. A feeding device 50 is provided in front of the table for holding the electronic components to be tested, and a receiving device 60 is provided behind the machine for holding the electronic components to be tested, and a testing device is arranged on the machine. 70, for testing electronic components, and a transport device 80 for transporting electronic components to be tested/tested, wherein the feeding device 50 is provided with at least one tray 501 having a plurality of volumes The receiving device 60 is provided with at least one tray 601, and the tray 601 has a plurality of receiving slots 602 for receiving the tested electronic components. The testing device is provided. The test system 72 has a test circuit board 71 with a test stand 72. The test stand 72 can be a normally open test stand or a normally closed test stand. In this embodiment, the test circuit board 71 is configured with four normally open. Type test stand 72 for simultaneously performing test operations of four electronic components and enabling the tester ( The figure is not shown) the test result is transmitted to a central control unit (not shown), and the central control unit controls the operation of each device. The conveying device 80 is provided with at least one variable distance carrier with a plurality of seats. And at least two moving arms of the plurality of pickers for transporting the electronic components to be tested/tested between the feeding device 50, the receiving device 60 and the testing device 70. In the embodiment, the conveying device The first carrier 81 is provided with a first carrier 81, and the first carrier 81 has at least two sockets, and a variable distance mechanism for adjusting the two sockets for at least one axial variable distance, and testing A second carrier 82 is disposed behind the device 70. The second carrier 82 also has at least two sockets, and a variable pitch mechanism for adjusting the two sockets by at least one axial variable distance. In the present embodiment, the first and second carriers 81 and 82 are active variable-distance carriers, and are respectively provided by the first and second loads. The driving source 83, 84 is driven to be X-axis displacement for transferring the electronic component to be tested/finished, taking the first carrier 81 as an example. A carrier 81 is provided with a carrier 811 on the first carrier driving source 83, and a plurality of sockets 812A, 812B, 812C, 812D and a variable pitch mechanism are disposed on the carrier 811, and the variable pitch mechanism is provided. There are a plurality of Y-axis members 813A, 813B, 813C, and 813D, and each of the Y-axis members 813A, 813B, 813C, and 813D can be respectively moved in the X-axis relative displacement of the movable type, or a Y-axis member. 813B is used as a fixed reference member, and the other Y-axis members 813A, 813C, and 813D are X-axially displaced with respect to the Y-axis member 813B. In this embodiment, a fixed type Y is provided on the carrier 811. The axial rod member 813B is provided with at least one X-axis driving source for driving the Y-axis rod members 813A, 813C, and 813D for X-axis displacement. In this embodiment, the X-axis driving source is provided. There is a motor 814 for driving the two X-axis pulley sets 815A, 815B, an upper belt of the X-axis pulley set 815A is available for assembling the Y-axis rod member 813A, and the lower belt is equipped with the Y-axis rod member 813C. The lower belt of the other X-axis pulley set 815B is used to assemble the Y-axis rod member 813D, so that the two X-axis pulley sets 815A, 815B can drive the Y-axis rod members 813A. 813C, 813D are X-axis displaced relative to the Y-axis member 813B, and the sockets 812A, 812B, 812C, and 812D can be respectively assembled on the Y-axis members 813A, 813B, 813C, and 813D, and the conveying device The 80 series is provided with a first transfer arm 85 capable of XYZ axial displacement between the supply and receiving devices 50, 60 and the first and second carriers 81, 82, and is fixed on the first transfer arm 85. In the embodiment, a plurality of pick-and-placers 851 are fixed on the first transfer arm 85, and the X-axis spacing of each pick-up 851 is relative to the trays 501 and 601. The X-axis spacing of each of the accommodating slots 502, 602 is used to transfer the electronic component to be tested/tested, and a second XYZ axial displacement is provided between the first carrier 81 and the testing device 70. A plurality of pickers 861 are fixed on the second transfer arm 86. In the embodiment, four pickers 861 are fixed on the second transfer arm 86. The X-axis spacing of the pick-and-place 861 is relative to the X-axis spacing of the test sockets 72 of the testing device 70 for transferring the electronic components to be tested, and between the second carrier 82 and the testing device 70. Can be used as XYZ axial The third transfer arm 87 is moved, and a plurality of pick-and-place devices 871 are fixed on the third transfer arm 87. In this embodiment, four pick-and-place devices are fixed on the third transfer arm 87. The X-axis spacing of each of the pickers 871 is relative to the X-axis spacing of the test sockets 72 of the test apparatus 70 for transferring the completed electronic components.
請參閱第7圖，於調整放大各承座812A、812B、812C、812D之X軸向間距時，該第一載具81係控制馬達814驅動二X軸向皮帶輪組815A、815B，使X軸向皮帶輪組815A帶動Y軸向桿件813A及813C相對於Y軸向桿件813B作X軸向向外位移，並使另一X軸向皮帶輪組815B帶動Y軸向桿件813D相對於Y軸向桿件813B作X軸向向外位移，使各Y軸向桿件813A、813C、813D帶動承座812A、812C、812D作X軸向間距調整；反之，請參閱第8圖，於調整縮小各承座812A、812B、812C、812D之X軸向間距時，該第一載具81則控制馬達814驅動二X軸向皮帶輪組815A、815B反向轉動，使X軸向皮帶輪組815A帶動Y軸向桿件813A及813C相對於Y軸向桿件813B作X軸向向內位移，並使另一X軸向皮帶輪組815B帶動Y軸向桿件813D相對於Y軸向桿件813B作X軸向向內位移，使各Y軸向桿件813A、813C、813D帶動承座812A、812C、812D作X軸向間距調整。Referring to FIG. 7, when the X-axis spacing of each of the sockets 812A, 812B, 812C, and 812D is adjusted and enlarged, the first carrier 81 controls the motor 814 to drive the two X-axis pulley sets 815A, 815B to make the X-axis. Driving the Y-axis rod members 813A and 813C to the X-axis outward displacement of the Y-axis rod member 813B to the pulley set 815A, and driving the other X-axis pulley group 815B to drive the Y-axis rod member 813D relative to the Y-axis The X-axis is outwardly displaced to the rod member 813B, so that the Y-axis members 813A, 813C, and 813D drive the sockets 812A, 812C, and 812D to adjust the X-axis spacing; otherwise, refer to FIG. When the X-axis spacing of each of the sockets 812A, 812B, 812C, and 812D is, the first carrier 81 controls the motor 814 to drive the two X-axis pulley sets 815A, 815B to rotate in the opposite direction, so that the X-axis pulley set 815A drives Y. The axial rods 813A and 813C are axially displaced inward with respect to the Y-axis rod member 813B, and the other X-axis pulley group 815B is driven by the Y-axis rod member 813D with respect to the Y-axis member 813B. The axially inward displacement causes each Y-axis member 813A, 813C, 813D to drive the sockets 812A, 812C, 812D for X-axis spacing adjustment.
請參閱第9、10、11圖，係本發明變距式載具之另一實施例，該第一載具81係於承架811上設有第一列承座812A、812B、812C、812D與第二列承座812E、812F、812G、812H，以及變距機構，該變距機構係設有複數支Y軸向桿件813A、813B、813C、813D，以及複數支X軸向桿件816A、816B，且使各Y軸向桿件813A、813B、813C、813D與二X軸向桿件816A、816B具有高度位差，進而於承架811上設有一固定式Y軸向桿件813B，並設有馬達814，用以驅動二X軸向皮帶輪組815A、815B，其一X軸向皮帶輪組815A之上、下層皮帶可分別裝配Y軸向桿件813A、813C，另一X軸向皮帶輪組815B之下層皮帶則供裝配Y軸向桿件813D，使得二X軸向皮帶輪組815A、815B可帶動各Y軸向桿件813A、813C、813D相對於Y軸向桿件813B作X軸向位移，進而可於Y軸向桿件813A上裝配承座812A、812E，於Y軸向桿件813B上裝配承座812B、812F，於Y軸向桿件813C上裝配承座812C、812G，於Y軸向桿件813D上裝配承座812D、812H，使Y軸向桿件813A、813C、813D可帶動第一列之承座812A、812C、812D及第二列之承座812E、812G、812H作X軸向間距調整，另於承架811上設有Y軸向驅動源，該Y軸向驅動源係設有馬達817，用以驅動一Y軸向皮帶輪組818，並於Y軸向皮帶輪組818之上、下層皮帶分別裝配有X軸向桿件816A、816B，而可帶動X軸向桿件816A、816B作Y軸向相對位移，再於X軸向桿件816A上裝配第一列之承座812A、812B、812C、812D，於X軸向桿件816B上則裝配第二列之承座812E、812F、812G、812H，使二X軸向桿件816A、816B可分別帶動第一列之承座812A、812B、812C、812D及第二列之承座812E、812F、812G、812H作Y軸向間距調整。Referring to Figures 9, 10 and 11, another embodiment of the variable pitch carrier of the present invention, the first carrier 81 is provided with a first row of sockets 812A, 812B, 812C, 812D on the carrier 811. And the second row of sockets 812E, 812F, 812G, 812H, and the variable pitch mechanism, the variable pitch mechanism is provided with a plurality of Y axial rods 813A, 813B, 813C, 813D, and a plurality of X axial rods 816A 816B, and each Y-axis member 813A, 813B, 813C, 813D and the two X-axis members 816A, 816B have a height difference, and further a fixed Y-axis member 813B is disposed on the bracket 811, And a motor 814 is provided for driving the two X-axis pulley sets 815A, 815B, one of the X-axis pulley sets 815A, and the lower layer of the belts can be respectively equipped with Y-axis rods 813A, 813C, and another X-axis pulley The lower belt of the group 815B is used to assemble the Y-axis member 813D, so that the two X-axis pulley sets 815A, 815B can drive the Y-axis members 813A, 813C, and 813D to the X-axis with respect to the Y-axis member 813B. Displacement, and further, the sockets 812A, 812E can be assembled on the Y-axis rod member 813A, the sockets 812B, 812F are assembled on the Y-axis rod member 813B, and assembled on the Y-axis rod member 813C. Seat 812C, 812G, the sockets 812D, 812H are assembled on the Y-axis rod 813D, so that the Y-axis rods 813A, 813C, 813D can drive the sockets 812A, 812C, 812D and the second column of the first row. The seats 812E, 812G, and 812H are adjusted in the X-axis spacing, and the Y-axis driving source is disposed on the frame 811. The Y-axis driving source is provided with a motor 817 for driving a Y-axis pulley set 818. And on the Y-axis pulley set 818, the lower belt is respectively equipped with X-axis rods 816A, 816B, and can drive the X-axis rods 816A, 816B for Y-axis relative displacement, and then the X-axis rods The first row of seats 812A, 812B, 812C, and 812D are assembled on the 816A, and the second row of seats 812E, 812F, 812G, and 812H are assembled on the X-axis member 816B to make the two X-axis members 816A, The 816B can respectively drive the sockets 812A, 812B, 812C, and 812D of the first row and the sockets 812E, 812F, 812G, and 812H of the second row for the Y-axis spacing adjustment.
請參閱第12圖，於使用時，該輸送裝置80係以第一移料臂85帶動複數個取放器851位移至供料裝置50處，由於各取放器851之X-Y軸向間距已固定相對於料盤501之各容置槽502的X-Y軸向間距，使得第一移料臂85可帶動複數個取放器851作Z軸向位移，而直接於料盤501之各容置槽502中取出待測之電子元件100；請參閱第13、14圖，於第一移料臂85之複數個取放器851取出待測之電子元件100後，係移載至第一載具81處，該第一載具81係控制馬達814驅動二X軸向皮帶輪組815A、815B，使二X軸向皮帶輪組815A、815B帶動各Y軸向桿件813A、813C、813D相對於Y軸向桿件813B作X軸向位移，使各Y軸向桿件813A、813C、813D帶動第一列之承座812A、812C、812D及第二列之承座812E、812G、812H分別沿X軸向桿件816A、816B作X軸向間距調整，接著再控制馬達817驅動X軸向皮帶輪組818，使X軸向皮帶輪組818帶動X軸向桿件816A、816B作Y軸向相對位移，使X軸向桿件816A、816B帶動第一列之承座812A、812B、812C、812D及第二列之承座812E、812F、812G、812H分別沿各Y軸向桿件813A、813B、813C、813D作Y軸向間距調整，進而使第一列之承座812A、812B、812C、812D及第二列之承座812E、812F、812G、812H的X-Y軸向間距對應於第一移動臂85之各取放器851的X-Y軸向間距，以供第一移動臂85之各取放器851可準確將待測之電子元件100放置於第一載具81之第一列之承座812A、812B、812C、812D及第二列之承座812E、812F、812G、812H上；請參閱第15、16圖，由於第一、二移動臂85、86之各取放器851、861的X-Y軸向間距不同，於第一載送驅動源83帶動第一載具81位移至測試裝置70之前方時，該第一載具81即再次控制馬達814驅動二X軸向皮帶輪組815A、815B帶動各Y軸向桿件813A、813C、813D相對於Y軸向桿件813B作X軸向位移，使各Y軸向桿件813A、813C、813D帶動第一列之承座812A、812C、812D及第二列之承座812E、812G、812H作X軸向間距調整，並控制馬達817驅動X軸向皮帶輪組818帶動X軸向桿件816A、816B作Y軸向相對位移，使X軸向桿件816A、816B帶動第一列之承座812A、812B、812C、812D及第二列之承座812E、812F、812G、812H作Y軸向間距調整，進而使第一列之承座812A、812B、812C、812D及第二列之承座812E、812F、812G、812H的X-Y軸向間距對應於第二移動臂86之各取放器861的X-Y軸向間距，以供第二移動臂86之各取放器861可準確取出待測之電子元件100；請參閱第17圖，由於第二移動臂86之各取放器861的X-Y軸向間距係對應於測試裝置70之各測試座72的X-Y軸向間距，而可使第二移動臂86之各取放器861將待測之電子元件100移載置入於各測試座72中，各測試座72即執行測試作業，並使測試電路板71將測試訊號傳輸至測試器，測試器再將測試結果傳輸至中央控制單元；請參閱第18圖，於測試座72之測試作業完畢後，由於第三移動臂87之各取放器871的X-Y軸向間距係對應於測試裝置70之各測試座72的X-Y軸向間距，而可使第三移動臂87之各取放器871於各測試座72中取出完測之電子元件100；請參閱第19、20圖，於第三移動臂87之各取放器871取出完測之電子元件100後，第二載送驅動源84係帶動第二載具82位移至測試裝置70之後方，第二載具82亦以變距機構帶動第一列之承座822A、822B、822C、822D及第二列之承座822E、822F、822G、822H作X-Y軸向間距調整，而可對應於第三移動臂87之各取放器871，以供第三移動臂87之各取放器871可準確將完測之電子元件100放置於第一列之承座822A、822B、822C、822D及第二列之承座822E、822F、822G、822H上；請參閱第21、22圖，於第二載具82承載完測之電子元件100後，由於第一、三移動臂85、87之各取放器851、871的X-Y軸向間距不同，於第二載送驅動源84載出第二載具82時，第二載具82再次以變距機構帶動第一列之承座822A、822B、822C、822D及第二列之承座822E、822F、822G、822H作X-Y軸向間距調整，以對應於第一移動臂85之各取放器851，而供第一移動臂85之各取放器851可準確取出完測之電子元件100；請參閱第23圖，第一移動臂85之各取放器851則將完測之電子元件100移載至收料裝置60處，由於第一移動臂85之各取放器851的X-Y軸向間距已相對於料盤601之各容置槽602的X-Y軸向間距，使得第一移料臂85可帶動複數個取放器851作Z軸向位移，並依測試結果(如良品電子元件、不良品電子元件或次級品電子元件)，而直接將完測之電子元件100置入於料盤601之各容置槽602中，以完成分類收置作業。Referring to FIG. 12, in use, the conveying device 80 drives the plurality of pickers 851 to the feeding device 50 by the first moving arm 85, because the XY axial spacing of each picker 851 is fixed. The first shifting arm 85 can drive the plurality of pick and placers 851 for Z-axis displacement, and directly to the receiving slots 502 of the tray 501, with respect to the XY axial spacing of the receiving slots 502 of the tray 501. The electronic component 100 to be tested is taken out; referring to FIGS. 13 and 14, after the plurality of pick-and-place devices 851 of the first transfer arm 85 take out the electronic component 100 to be tested, the device is transferred to the first carrier 81. The first carrier 81 controls the motor 814 to drive the two X-axis pulley sets 815A, 815B, so that the two X-axis pulley sets 815A, 815B drive the Y-axis rods 813A, 813C, 813D relative to the Y-axis rod. The piece 813B is X-axis displaced so that each Y-axis member 813A, 813C, 813D drives the sockets 812A, 812C, 812D of the first row and the sockets 812E, 812G, 812H of the second row respectively along the X-axis rod The pieces 816A, 816B are adjusted for the X-axis spacing, and then the motor 817 is controlled to drive the X-axis pulley set 818, so that the X-axis pulley set 818 drives the X-axis rod member 816A, 816B is the Y-axis relative displacement, so that the X-axis rods 816A, 816B drive the sockets 812A, 812B, 812C, 812D of the first row and the sockets 812E, 812F, 812G, 812H of the second row along the Y-axis respectively The Y-axis spacing is adjusted to the rods 813A, 813B, 813C, and 813D, and the XY axes of the sockets 812A, 812B, 812C, and 812D of the first row and the sockets 812E, 812F, 812G, and 812H of the second row are further The spacing corresponds to the XY axial spacing of the pick-and-place 851 of the first moving arm 85, so that the pick-and-place 851 of the first moving arm 85 can accurately place the electronic component 100 to be tested on the first carrier 81. The first row of seats 812A, 812B, 812C, 812D and the second row of seats 812E, 812F, 812G, 812H; please refer to Figures 15, 16 because of the first and second moving arms 85, 86 The XY axial distances of the occupants 851 and 861 are different. When the first carrier driving source 83 drives the first carrier 81 to move to the front of the testing device 70, the first carrier 81 controls the motor 814 to drive the two X axes again. Each of the Y-axis members 813A, 813C, and 813D is axially displaced relative to the Y-axis member 813B to the pulley sets 815A, 815B, so that each Y-axis member 813A, 813C, 813 D drives the sockets 812A, 812C, 812D of the first row and the sockets 812E, 812G, 812H of the second row to adjust the X-axis spacing, and controls the motor 817 to drive the X-axis pulley set 818 to drive the X-axis rod 816A. 816B is the Y-axis relative displacement, so that the X-axis rods 816A, 816B drive the sockets 812A, 812B, 812C, 812D of the first row and the sockets 812E, 812F, 812G, 812H of the second row for the Y-axis The pitch adjustment further causes the XY axial spacing of the sockets 812A, 812B, 812C, 812D of the first row and the sockets 812E, 812F, 812G, 812H of the second row to correspond to the pick and placeers 861 of the second moving arm 86. The XY axial spacing is such that the pick-and-place 861 of the second moving arm 86 can accurately take out the electronic component 100 to be tested; please refer to FIG. 17, due to the XY axis of each pick-and-place 861 of the second moving arm 86 The pitch spacing corresponds to the XY axial spacing of the test sockets 72 of the test device 70, and the pick and placeers 861 of the second moving arm 86 can transfer the electronic components 100 to be tested into the test sockets 72. Each test stand 72 performs a test operation, and causes the test circuit board 71 to transmit the test signal to the tester, and the tester transmits the test result. The central control unit; referring to Fig. 18, after the test operation of the test socket 72 is completed, the XY axial spacing of each of the pick-and-placers 871 of the third moving arm 87 corresponds to the XY of each test socket 72 of the test device 70. The axial spacing is such that each of the pick-and-place 871 of the third moving arm 87 can take out the tested electronic component 100 in each test socket 72; please refer to FIGS. 19 and 20 for picking and placing in the third moving arm 87. After the device 871 takes out the measured electronic component 100, the second carrier driving source 84 drives the second carrier 82 to be displaced to the test device 70, and the second carrier 82 also drives the first column of the socket with the variable pitch mechanism. The 822A, 822B, 822C, 822D and the second row of seats 822E, 822F, 822G, 822H are adjusted for XY axial spacing, and may correspond to the respective pickers 871 of the third moving arm 87 for the third moving arm Each pick-and-place 871 of 87 can accurately place the completed electronic component 100 on the sockets 822A, 822B, 822C, 822D of the first row and the sockets 822E, 822F, 822G, 822H of the second row; 21, 22, after the second carrier 82 carries the tested electronic component 100, due to the first and third moving arms 85, 87 of the pick and place 85 1. The XY axial spacing of the 871 is different. When the second carrier driving source 84 carries the second carrier 82, the second carrier 82 drives the sockets 822A, 822B, and 822C of the first row again by the variable pitch mechanism. The 822D and the second row of seats 822E, 822F, 822G, and 822H are adjusted in XY axial spacing to correspond to the respective pickers 851 of the first moving arm 85, and the pick and placeers 851 of the first moving arm 85 are provided. The electronic component 100 can be accurately taken out; referring to FIG. 23, the pick-and-place 851 of the first moving arm 85 transfers the completed electronic component 100 to the receiving device 60, because the first moving arm 85 The XY axial spacing of each of the pickers 851 has been spaced relative to the XY axial spacing of the receiving slots 602 of the tray 601, such that the first moving arm 85 can drive the plurality of pick and placeers 851 for Z-axis displacement. And according to the test result (such as good electronic components, defective electronic components or secondary electronic components), the completed electronic components 100 are directly placed in the receiving slots 602 of the tray 601 to complete the classification and storage. operation.
據此，本發明電子元件測試分類機可有效簡化機構設計而易於製作組裝，並易於增設取放器，進而節省成本及提升使用效能，實為一深具實用性及進步性之設計，然未見有相同之產品及刊物公開，從而允符發明專利申請要件，爰依法提出申請。Accordingly, the electronic component test sorting machine of the present invention can simplify the design of the mechanism, is easy to manufacture and assemble, and is easy to add a pick and place device, thereby saving cost and improving the use efficiency, and is actually a practical and progressive design. See the same products and publications open to allow for the invention patent application requirements, and apply in accordance with the law.
10．．．供料裝置10. . . Feeding device
11．．．料盤11. . . Trays
20．．．收料裝置20. . . Receiving device
21．．．料盤twenty one. . . Trays
30．．．測試裝置30. . . Test device
31．．．測試電路板31. . . Test board
32．．．測試座32. . . Test stand
40．．．輸送裝置40. . . Conveyor
41．．．第一載具41. . . First vehicle
411．．．定位槽411. . . Positioning slot
42．．．第二載具42. . . Second vehicle
421．．．定位槽421. . . Positioning slot
43．．．第一移料臂43. . . First transfer arm
431．．．取放器431. . . Pick and place
4311．．．滾輪4311. . . Wheel
4312．．．Z軸向滑軌4312. . . Z axial slide
432．．．機架432. . . frame
4321．．．X軸向滑軌4321. . . X axial slide
433．．．Z軸向驅動源433. . . Z axial drive source
434．．．傳動板434. . . Drive plate
4341．．．X軸向滑槽4341. . . X axial chute
435．．．滑動板435. . . Sliding plate
4351．．．Z軸向滑座4351. . . Z axial slide
4352．．．X軸向滑座4352. . . X axial slide
436．．．X軸向驅動源436. . . X-axis drive source
44．．．第二移料臂44. . . Second transfer arm
441．．．取放器441. . . Pick and place
45．．．第三移料臂45. . . Third transfer arm
451．．．取放器451. . . Pick and place
50．．．供料裝置50. . . Feeding device
501．．．料盤501. . . Trays
502．．．容置槽502. . . Locating slot
60．．．收料裝置60. . . Receiving device
601．．．料盤601. . . Trays
602．．．容置槽602. . . Locating slot
70．．．測試裝置70. . . Test device
71．．．測試電路板71. . . Test board
72．．．測試座72. . . Test stand
80．．．輸送裝置80. . . Conveyor
81．．．第一載具81. . . First vehicle
811．．．承架811. . . Shelf
812A、812B、812C、812D、812E、812F、812G、812H．．．承座812A, 812B, 812C, 812D, 812E, 812F, 812G, 812H. . . Seat
813A、813B、813C、813D．．．Y軸向桿件813A, 813B, 813C, 813D. . . Y axial rod
814．．．馬達814. . . motor
815A、815B．．．X軸向皮帶輪組815A, 815B. . . X-axis pulley set
816A、816B．．．X軸向桿件816A, 816B. . . X axial rod
817．．．馬達817. . . motor
818．．．Y軸向皮帶輪組818. . . Y axial pulley set
82．．．第二載具82. . . Second vehicle
822A、822B、822C、822D、822E、822F、822G、822H．．．承座822A, 822B, 822C, 822D, 822E, 822F, 822G, 822H. . . Seat
83．．．第一載送驅動源83. . . First carrier drive source
84．．．第二載送驅動源84. . . Second carrier drive source
85．．．第一移料臂85. . . First transfer arm
851．．．取放器851. . . Pick and place
86．．．第二移料臂86. . . Second transfer arm
861．．．取放器861. . . Pick and place
87．．．第三移料臂87. . . Third transfer arm
871．．．取放器871. . . Pick and place
100．．．電子元件100. . . Electronic component
第1圖：習式測試分類機之各裝置配置圖。Figure 1: Configuration diagram of each device of the test test sorter.
第2圖：習式移料臂之前視圖。Figure 2: Front view of the conventional transfer arm.
第3圖：習式移料臂之側視圖。Figure 3: Side view of the conventional transfer arm.
第4圖：本發明測試分類機之各裝置配置圖。Figure 4: Configuration diagram of each device of the test sorting machine of the present invention.
第5圖：本發明載具之俯視圖。Figure 5: Top view of the carrier of the present invention.
第6圖：本發明載具之前視圖。Figure 6: Front view of the vehicle of the present invention.
第7圖：本發明載具調整各承座間距之使用示意圖(一)。Figure 7: Schematic diagram of the use of the carrier of the present invention to adjust the spacing of the sockets (1).
第8圖：本發明載具調整各承座間距之使用示意圖(二)。Figure 8: Schematic diagram of the use of the carrier of the present invention to adjust the spacing of the sockets (2).
第9圖：本發明載具另一實施例之俯視圖。Figure 9 is a plan view of another embodiment of the carrier of the present invention.
第10圖：本發明載具另一實施例之前視圖。Figure 10: Front view of another embodiment of the carrier of the present invention.
第11圖：本發明載具另一實施例之側視圖。Figure 11 is a side elevational view of another embodiment of the carrier of the present invention.
第12圖：本發明測試分類機另一實施例之使用示意圖(一)。Fig. 12 is a schematic view showing the use of another embodiment of the test sorting machine of the present invention (1).
第13圖：本發明測試分類機另一實施例之使用示意圖(二)。Figure 13 is a schematic view showing the use of another embodiment of the test sorter of the present invention (2).
第14圖：本發明載具調整各承座間距之使用示意圖。Figure 14: Schematic diagram of the use of the carrier of the present invention to adjust the spacing of the sockets.
第15圖：本發明測試分類機另一實施例之使用示意圖(三)。Figure 15 is a schematic view showing the use of another embodiment of the test sorting machine of the present invention (3).
第16圖：本發明載具調整各承座間距之使用示意圖。Figure 16: Schematic diagram of the use of the carrier of the present invention to adjust the spacing of the sockets.
第17圖：本發明測試分類機另一實施例之使用示意圖(四)。Figure 17: Schematic diagram of the use of another embodiment of the test sorter of the present invention (4).
第18圖：本發明測試分類機另一實施例之使用示意圖(五)。Figure 18: Schematic diagram of the use of another embodiment of the test sorter of the present invention (5).
第19圖：本發明測試分類機另一實施例之使用示意圖(六)。Figure 19: Schematic diagram of the use of another embodiment of the test sorter of the present invention (vi).
第20圖：本發明載具調整各承座間距之使用示意圖。Figure 20: Schematic diagram of the use of the carrier of the present invention to adjust the spacing of the sockets.
第21圖：本發明測試分類機另一實施例之使用示意圖(七)。Figure 21: Schematic diagram of the use of another embodiment of the test sorter of the present invention (7).
第22圖：本發明載具調整各承座間距之使用示意圖。Figure 22: Schematic diagram of the use of the carrier of the present invention to adjust the spacing of the sockets.
第23圖：本發明測試分類機另一實施例之使用示意圖(八)。Figure 23: Schematic diagram of the use of another embodiment of the test sorter of the present invention (VIII).
50．．．供料裝置50. . . Feeding device
501．．．料盤501. . . Trays
502．．．容置槽502. . . Locating slot
60．．．收料裝置60. . . Receiving device
601．．．料盤601. . . Trays
602．．．容置槽602. . . Locating slot
70．．．測試裝置70. . . Test device
71．．．測試電路板71. . . Test board
72．．．測試座72. . . Test stand
80．．．輸送裝置80. . . Conveyor
81．．．第一載具81. . . First vehicle
82．．．第二載具82. . . Second vehicle
83．．．第一載送驅動源83. . . First carrier drive source
84．．．第二載送驅動源84. . . Second carrier drive source
85．．．第一移料臂85. . . First transfer arm
851．．．取放器851. . . Pick and place
86．．．第二移料臂86. . . Second transfer arm
861．．．取放器861. . . Pick and place
87．．．第三移料臂87. . . Third transfer arm
871．．．取放器871. . . Pick and place
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099103562A TWI450851B (en) | 2010-02-05 | 2010-02-05 | Testing and classifying machine for electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW099103562A TWI450851B (en) | 2010-02-05 | 2010-02-05 | Testing and classifying machine for electronic elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201127726A TW201127726A (en) | 2011-08-16 |
| TWI450851B true TWI450851B (en) | 2014-09-01 |
Family
ID=45024941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099103562A TWI450851B (en) | 2010-02-05 | 2010-02-05 | Testing and classifying machine for electronic elements |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI450851B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104891224A (en) * | 2015-04-22 | 2015-09-09 | 杭州长川科技股份有限公司 | Automatic getting and placing device of integrated circuits |
| CN105251700A (en) * | 2015-09-28 | 2016-01-20 | 杭州长川科技股份有限公司 | Equal-distance adjusting mechanism for automatic separation equipment |
| CN105883393A (en) * | 2016-05-06 | 2016-08-24 | 杭州长川科技股份有限公司 | Double row equidistance adjusting device of sorting machine |
| TWI570420B (en) * | 2015-05-15 | 2017-02-11 | Hon Tech Inc | Electronic components sorting machine |
| CN107499926A (en) * | 2017-08-04 | 2017-12-22 | 杭州长川科技股份有限公司 | Position rotating mechanical hand |
| CN107697637A (en) * | 2017-09-06 | 2018-02-16 | 杭州长川科技股份有限公司 | Fingerprint module tests conveying device |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103318646B (en) * | 2013-06-20 | 2016-01-20 | 四川长虹电器股份有限公司 | A kind of Module turnover transfer machine |
| CN103738732B (en) * | 2013-10-17 | 2016-01-20 | 杭州长川科技股份有限公司 | Deng distance regulating mechanism |
| CN103743975B (en) * | 2013-12-30 | 2017-04-12 | 苏州高新区世纪福科技有限公司 | Flexible printed circuit board automatic testing equipment and flexible printed circuit board automatic testing method |
| CN105836354B (en) * | 2016-04-20 | 2018-08-17 | 北京信息科技大学 | Medicine-feeding conveying device |
| TWI632101B (en) * | 2017-12-01 | 2018-08-11 | 鴻勁精密股份有限公司 | Electronic component variable pitch carrier and test equipment for its application |
| CN108163263A (en) * | 2017-12-10 | 2018-06-15 | 杭州长川科技股份有限公司 | Integrated circuit braid fetching device and pick and place method |
| CN115231300A (en) * | 2022-08-24 | 2022-10-25 | 深圳市深科达半导体科技有限公司 | Multi-station pitch-changing mechanism |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI296049B (en) * | 2006-03-21 | 2008-04-21 | Hon Tech Inc | Ic testing machine capable of simultaneously testing a plurality of integrated circuits |
| TW200948693A (en) * | 2008-05-23 | 2009-12-01 | Hon Tech Inc | Vertical moving mechanism of a picker for a carrying device |
-
2010
- 2010-02-05 TW TW099103562A patent/TWI450851B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI296049B (en) * | 2006-03-21 | 2008-04-21 | Hon Tech Inc | Ic testing machine capable of simultaneously testing a plurality of integrated circuits |
| TW200948693A (en) * | 2008-05-23 | 2009-12-01 | Hon Tech Inc | Vertical moving mechanism of a picker for a carrying device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104891224A (en) * | 2015-04-22 | 2015-09-09 | 杭州长川科技股份有限公司 | Automatic getting and placing device of integrated circuits |
| TWI570420B (en) * | 2015-05-15 | 2017-02-11 | Hon Tech Inc | Electronic components sorting machine |
| CN105251700A (en) * | 2015-09-28 | 2016-01-20 | 杭州长川科技股份有限公司 | Equal-distance adjusting mechanism for automatic separation equipment |
| CN105251700B (en) * | 2015-09-28 | 2017-07-18 | 杭州长川科技股份有限公司 | The grade distance regulating mechanism of automatic separation equipment |
| CN105883393A (en) * | 2016-05-06 | 2016-08-24 | 杭州长川科技股份有限公司 | Double row equidistance adjusting device of sorting machine |
| CN105883393B (en) * | 2016-05-06 | 2018-03-23 | 杭州长川科技股份有限公司 | The double equidistant adjusting means of separator |
| CN107499926A (en) * | 2017-08-04 | 2017-12-22 | 杭州长川科技股份有限公司 | Position rotating mechanical hand |
| CN107697637A (en) * | 2017-09-06 | 2018-02-16 | 杭州长川科技股份有限公司 | Fingerprint module tests conveying device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201127726A (en) | 2011-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI450851B (en) | Testing and classifying machine for electronic elements | |
| TWI579573B (en) | Electronic component transfer device and its application test classification equipment | |
| TWI601965B (en) | Component Processor | |
| TWI399543B (en) | Testing and classifying machine for electronic elements | |
| US9069010B2 (en) | Pitch changing apparatus, electronic device handling apparatus, and electronic device testing apparatus | |
| KR20160048628A (en) | Sorting Apparatus for Semiconductor Device | |
| TWI677685B (en) | Electronic component test equipment | |
| CN111556412A (en) | Earphone and coil body assembling equipment and method thereof | |
| KR100401014B1 (en) | Test Handler | |
| KR101973687B1 (en) | Device inspection apparatus | |
| TWI465741B (en) | Multi - layer electronic component testing and classification machine | |
| TWI454415B (en) | Testing machine for electronic elements | |
| KR101042652B1 (en) | Electronic Component Testing Apparatus | |
| TWI569356B (en) | Electronic component moving unit and its application equipment | |
| TWI394172B (en) | Automatic test sorting machine | |
| TWI669260B (en) | Electronic component variable distance device and operation classification device thereof | |
| TWI534442B (en) | Electronic components operating equipment and its application of the test classification equipment | |
| TWI454715B (en) | Electronic components composite receiving unit and its application of the test equipment | |
| TWI632101B (en) | Electronic component variable pitch carrier and test equipment for its application | |
| JP2013018604A (en) | Article sorting apparatus | |
| TWI824560B (en) | Processing device having tray mechanism and processing machine | |
| TW202106592A (en) | Operating device for electronic component achieving the practical benefits of improving the production efficiency and lowering the cost | |
| TWI659494B (en) | Electronic component transfer mechanism and operation classification equipment for application thereof | |
| KR100893141B1 (en) | Test handler | |
| KR20140119243A (en) | Semiconductor device inspection apparatus |