TWI448136B - Chip card holding device - Google Patents
Chip card holding device Download PDFInfo
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- TWI448136B TWI448136B TW097133173A TW97133173A TWI448136B TW I448136 B TWI448136 B TW I448136B TW 097133173 A TW097133173 A TW 097133173A TW 97133173 A TW97133173 A TW 97133173A TW I448136 B TWI448136 B TW I448136B
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- wafer card
- holding member
- holding device
- wafer
- slider
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本發明涉及一種晶片卡固持裝置，尤其涉及一種應用於可攜式電子裝置之晶片卡固持裝置。 The present invention relates to a wafer card holding device, and more particularly to a chip card holding device applied to a portable electronic device.
近年來，具有積體電路(Integrate Circuit,IC)之表面晶片卡廣泛應用於電子裝置中以提高或增加電子裝置之性能，如安裝於行動電話中之用戶識別卡(Subscriber Identification Module Card，以下通稱SIM卡)係一種裝有IC晶片之塑膠卡片，其內儲存有操作行動電話之必要資訊，而且記載有用戶號碼及通訊錄等個人資訊。藉由更換SIM卡，一支行動電話可以供多個用戶使用。 In recent years, surface chip cards with integrated circuits (ICs) have been widely used in electronic devices to improve or increase the performance of electronic devices, such as a Subscriber Identification Module Card installed in a mobile phone. A SIM card is a plastic card containing an IC chip in which necessary information for operating a mobile phone is stored, and personal information such as a user number and an address book are recorded. By replacing the SIM card, a mobile phone can be used by multiple users.
習知之SIM卡一般容置於行動電話之一卡槽內。當該SIM卡容置於該卡槽內時，該SIM卡上之積體電路藉由一連接器與該行動電話之電路板連接。當需要更換該SIM卡時，使用者使用手指直接按住該SIM卡暴露之部分，並向該卡槽外拖動，藉由使用者手指與該SIM卡之間之摩擦力使該SIM卡隨使用者手指運動，直至SIM卡由該卡槽內滑出。 The SIM card of the conventional one is generally placed in one of the slots of the mobile phone. When the SIM card is received in the card slot, the integrated circuit on the SIM card is connected to the circuit board of the mobile phone by a connector. When the SIM card needs to be replaced, the user directly presses the exposed portion of the SIM card with a finger and drags it outside the card slot, so that the SIM card is followed by the friction between the user's finger and the SIM card. The user's finger moves until the SIM card slides out of the card slot.
但，於實際使用中，由於SIM卡暴露於卡槽外之部分一般較小，直接按壓外露部分操作較為困難；有些型號之SIM卡甚至全部容置於卡槽內。故，使用者難以藉由直接按壓該等SIM卡之方式帶動該SIM卡由卡槽滑出。 However, in actual use, since the portion of the SIM card exposed to the card slot is generally small, it is difficult to directly press the exposed portion; some models of the SIM card are even housed in the card slot. Therefore, it is difficult for the user to drive the SIM card to slide out of the card slot by directly pressing the SIM cards.
有鑒於此，有必要提供一種便於取出晶片卡之晶片卡固持裝置。 In view of the above, it is necessary to provide a wafer card holding device that facilitates the removal of a wafer card.
一種晶片卡固持裝置，其包括一殼體及一形成於所述殼體上之容置腔，該容置腔用以容置一晶片卡於其內，其底部開設有通孔。該晶片卡固持裝置還包括一設于該容置腔之固持件及一藉由所述通孔與該固持件相配合之滑鈕，所述固持件與該滑鈕分別位於該殼體相對之兩側，該固持件用以放置並固持該晶片卡，所述滑鈕帶動該固持件滑動，使該晶片卡移出容置腔。 A wafer card holding device includes a casing and a receiving cavity formed on the casing. The receiving cavity is for receiving a wafer and is inserted therein, and a through hole is formed in a bottom portion thereof. The wafer card holding device further includes a holding member disposed in the receiving cavity and a sliding button matched with the holding member by the through hole, wherein the holding member and the sliding button are respectively located on the housing On both sides, the holding member is used for placing and holding the wafer card, and the sliding button drives the holding member to slide to move the wafer card out of the accommodating cavity.
相較于習知技術，所述晶片卡固持裝置於***晶片卡時，藉由固持件之彈性抵持及容置腔之摩擦力，可穩固地固定該晶片卡。當取出晶片卡時，只需推動滑鈕，由滑鈕帶動固持件一起滑動，使得該晶片卡一端露出容置腔，從而可以輕鬆地取出該晶片卡。 Compared with the prior art, when the wafer card holder is inserted into the wafer card, the wafer card can be firmly fixed by the elastic force of the holding member and the friction of the accommodating cavity. When the wafer card is taken out, it is only necessary to push the slider, and the slider drives the holder to slide together, so that one end of the wafer card is exposed to the accommodating cavity, so that the wafer card can be easily taken out.
100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder
10‧‧‧殼體 10‧‧‧shell
111‧‧‧容置腔 111‧‧‧容容
112、113‧‧‧側壁 112, 113‧‧‧ side wall
114‧‧‧底壁 114‧‧‧ bottom wall
1121、1131‧‧‧導引槽 1121, 1131‧‧‧ guiding slot
1141‧‧‧通孔 1141‧‧‧through hole
1143‧‧‧開槽 1143‧‧‧ slotting
12‧‧‧表面 12‧‧‧ surface
20‧‧‧固持件 20‧‧‧ holding parts
21‧‧‧本體 21‧‧‧ body
22、23‧‧‧開孔 22, 23‧‧‧ openings
221、231‧‧‧凸起 221, 231‧‧ ‧ raised
24‧‧‧彎折部 24‧‧‧Bending
241‧‧‧連接部 241‧‧‧Connecting Department
242‧‧‧抵擋部 242‧‧‧Resistance Department
243‧‧‧容置空間 243‧‧‧ accommodating space
30‧‧‧滑鈕 30‧‧‧ slider
31‧‧‧按壓部 31‧‧‧ Pressing Department
32、33‧‧‧導引柱 32, 33‧‧‧ Guide column
34‧‧‧操作部 34‧‧‧Operation Department
40‧‧‧晶片卡 40‧‧‧wafer card
圖1係本發明較佳實施例之晶片卡固持裝置和晶片卡之立體分解示意圖。 1 is a perspective exploded view of a wafer card holding device and a wafer card in accordance with a preferred embodiment of the present invention.
圖2係圖1所示晶片卡固持裝置和晶片卡另一視角之立體分解示意圖。 2 is a perspective exploded view of the wafer card holding device and the wafer card shown in FIG.
圖3係本發明較佳實施例晶片卡部分裝配於晶片卡固持裝置之狀態圖；圖4係圖3所示晶片卡全部裝配於晶片卡固持裝置之狀態圖。 3 is a view showing a state in which a wafer card portion is mounted on a wafer card holding device according to a preferred embodiment of the present invention; and FIG. 4 is a view showing a state in which the wafer card shown in FIG. 3 is all mounted on the wafer card holding device.
圖5係圖3沿V線之剖視圖。 Figure 5 is a cross-sectional view taken along line V of Figure 3.
圖6係圖4沿VI線之剖視圖。 Figure 6 is a cross-sectional view taken along line VI of Figure 4.
請參閱圖1及圖2，本發明之較佳實施例公開一種晶片卡固持裝置100，其適用於行動電話等可擕式電子裝置(圖未示)。該晶片卡固持裝置100包括一殼體10、一固持件20及一設置於該殼體10上之滑鈕30。一晶片卡40(比如SIM卡、存儲卡)經由該固持件20固定於該殼體10上。 Referring to FIG. 1 and FIG. 2, a preferred embodiment of the present invention discloses a wafer card holding device 100, which is suitable for a portable electronic device (not shown) such as a mobile phone. The wafer card holding device 100 includes a housing 10 , a holding member 20 , and a slider 30 disposed on the housing 10 . A wafer card 40 (such as a SIM card, a memory card) is fixed to the housing 10 via the holder 20.
所述殼體10為所述可擕式電子裝置之機殼，其大致為長方體狀。該殼體10包括開設於中部之一長方形容置腔11及一與該容置腔11相背之表面12。該容置腔11用來容納所述晶片卡40於其內，其包括一擋壁111、沿與該擋壁111垂直方向延伸之二側壁112、113及一垂直於所述擋壁111及二側壁112、113之底壁114。所述二側壁112、113鄰接於底壁114處各開設有一導引槽1121、1131，所述導引槽1121、1131之間距與該晶片卡40之寬度大致相等，所述晶片卡40可沿該二導引槽1121、1131***容置腔11。所述底壁114中央開設一開槽1143，所述開槽1143底部開設有一矩形通孔1141。所述矩形通孔1141貫穿於所述殼體10，該開槽1143大致呈圓角矩形，且其長度和寬度均大於矩形通孔1141之長度和寬度。 The casing 10 is a casing of the portable electronic device, and has a substantially rectangular parallelepiped shape. The housing 10 includes a rectangular receiving cavity 11 formed in the middle portion and a surface 12 opposite to the receiving cavity 11. The accommodating cavity 11 is configured to receive the wafer card 40 therein, and includes a barrier wall 111, two sidewalls 112, 113 extending perpendicularly to the barrier wall 111, and a vertical wall 111 and The bottom wall 114 of the side walls 112, 113. A guiding groove 1121, 1131 is defined in each of the two side walls 112, 113 adjacent to the bottom wall 114. The distance between the guiding grooves 1121 and 1131 is substantially equal to the width of the wafer card 40, and the wafer card 40 can be along The two guiding slots 1121, 1131 are inserted into the accommodating cavity 11. A slot 1143 is defined in the center of the bottom wall 114. A rectangular through hole 1141 is defined in the bottom of the slot 1143. The rectangular through hole 1141 extends through the casing 10, and the groove 1143 is substantially rounded and has a length and a width greater than a length and a width of the rectangular through hole 1141.
請一併參閱圖5、圖6及圖7，所述固持件20由具有彈性之材料製成，其包括一本體21、設置於本體21一端之兩開孔22、23及一設置於本體21另一端之彎折部24。所述本體21大致為長方形片狀，其置於所述底壁114上用於承載所述晶片卡40，該本體21朝向底壁114之表面延伸有二圓筒狀凸起221、231，該二圓筒狀凸起221、231之高度與所述開槽1143之深度大致相等，並可於該開槽1143內滑動。該晶片卡40長度大於所述本體21之長度，且其與本體21之厚度之和與導引槽1121、1131之寬度大致相等。所述開孔 22、23與所述二圓筒狀凸起221、231相對應。所述彎折部24大致為“L”形，其包括一連接部241及一與該連接部241垂直連接之抵擋部242。所述連接部241垂直設於本體21遠離兩開孔22、23之一端，所述抵擋部242與本體21平行，且該抵擋部242與本體21之間之距離略小於所述晶片卡40之厚度。該彎折部24與本體21圍成一容置空間243，該容置空間243用以容置所述晶片卡40之一端。當所述晶片卡40之一端***該容置空間243時，該晶片卡40因受到抵擋部242和本體21之抵持而固定于該容置空間243。 Referring to FIG. 5 , FIG. 6 and FIG. 7 , the holding member 20 is made of a material having elasticity, and includes a body 21 , two openings 22 , 23 disposed at one end of the body 21 , and a body 21 . The bent portion 24 at the other end. The body 21 is substantially in the shape of a rectangular plate, and is disposed on the bottom wall 114 for carrying the wafer card 40. The body 21 extends toward the surface of the bottom wall 114 with two cylindrical protrusions 221, 231. The height of the two cylindrical protrusions 221, 231 is substantially equal to the depth of the slot 1143 and is slidable within the slot 1143. The length of the wafer card 40 is greater than the length of the body 21, and the sum of the thicknesses of the wafer card 40 and the body 21 is substantially equal to the width of the guiding grooves 1121, 1131. The opening 22, 23 correspond to the two cylindrical protrusions 221, 231. The bent portion 24 is substantially "L" shaped and includes a connecting portion 241 and a resisting portion 242 perpendicularly connected to the connecting portion 241. The connecting portion 241 is vertically disposed at one end of the body 21 away from the two openings 22, 23. The resisting portion 242 is parallel to the body 21, and the distance between the resisting portion 242 and the body 21 is slightly smaller than that of the wafer card 40. thickness. The bending portion 24 and the body 21 define an accommodating space 243 for accommodating one end of the wafer card 40. When one end of the wafer card 40 is inserted into the accommodating space 243, the wafer card 40 is fixed to the accommodating space 243 by being resisted by the resisting portion 242 and the body 21.
所述滑鈕30包括一按壓部31、設置於該按壓部31一側之二導引柱32、33及設置於按壓部31另一側之操作部34。所述按壓部31大致為圓角矩形體狀，其與所述矩形通孔1141相對應。所述二導引柱32、33與所述固持件20之開孔22、23相對應，可穿過通孔1141及二圓筒狀凸起221、231而容置於開孔22、23中。該二導引柱32、33之間距小於所述矩形通孔1141之長度，當二導引柱32、33穿過矩形通孔1141置於開孔22、23中時，可沿矩形通孔1141之較長之邊滑動。所述操作部34由複數凸棱組成，其上表面大致為波浪狀，用於推動按壓部31時增加摩擦力。 The slider 30 includes a pressing portion 31, two guiding columns 32 and 33 provided on the pressing portion 31 side, and an operation portion 34 provided on the other side of the pressing portion 31. The pressing portion 31 is substantially in the shape of a rounded rectangular shape corresponding to the rectangular through hole 1141. The two guiding posts 32, 33 correspond to the openings 22, 23 of the holding member 20, and can be received in the openings 22, 23 through the through hole 1141 and the two cylindrical protrusions 221, 231. . The distance between the two guiding pillars 32 and 33 is smaller than the length of the rectangular through hole 1141. When the two guiding pillars 32 and 33 are inserted into the opening 22 and 23 through the rectangular through hole 1141, the rectangular through hole 1141 can be along the rectangular through hole 1141. The longer side slides. The operation portion 34 is composed of a plurality of ribs, and its upper surface is substantially wavy, and is used to push the pressing portion 31 to increase the frictional force.
請一併參閱圖3及圖4，組裝該晶片卡固持裝置100時，首先，將固持件20置於容置腔11之底壁114上，令二開孔22、23與通孔1141相對應，二圓筒狀凸起221、231置於開槽1143內。然後，將滑鈕30之二導引柱32、33穿過通孔1141固定於所述二圓筒狀凸起221、231及二開孔22、23內，從而將滑鈕30與固持件20緊固連接。之後，將晶片卡40之一端***所述導引槽1121、1131內，推動晶片卡40之另一端，使該晶片卡40於導引槽1121、1131內和底壁 114上按箭頭X所示之方向滑動。接著，該晶片卡40滑動至固持件20之本體21上，繼續推動該晶片卡40，直至該晶片卡40之一端***固持件20之容置空間243內。此時，由於晶片卡40受到彎折部24和本體21之彈性抵持及晶片卡40與二導引槽1121、1131之間之摩擦阻力，該晶片卡40即可固定於所述固持件20上，如此便完成了該晶片卡固持裝置100之組裝。 Referring to FIG. 3 and FIG. 4 together, when the wafer card holding device 100 is assembled, first, the holding member 20 is placed on the bottom wall 114 of the accommodating cavity 11 so that the two openings 22 and 23 correspond to the through holes 1141. The two cylindrical protrusions 221, 231 are placed in the slot 1143. Then, the two guide posts 32, 33 of the slider 30 are fixed in the two cylindrical protrusions 221, 231 and the two openings 22, 23 through the through hole 1141, thereby sliding the slider 30 and the holding member 20. Fasten the connection. Thereafter, one end of the wafer card 40 is inserted into the guiding slots 1121, 1131, and the other end of the wafer card 40 is pushed to make the wafer card 40 in the guiding slots 1121, 1131 and the bottom wall. 114 slides in the direction indicated by the arrow X. Then, the wafer card 40 is slid onto the body 21 of the holder 20, and the wafer card 40 is continuously pushed until one end of the wafer card 40 is inserted into the accommodating space 243 of the holder 20. At this time, since the wafer card 40 is elastically resisted by the bent portion 24 and the body 21 and the frictional resistance between the wafer card 40 and the two guiding grooves 1121, 1131, the wafer card 40 can be fixed to the holding member 20 Thus, the assembly of the wafer card holding device 100 is completed.
需要取出該晶片卡40時，首先，沿箭頭X之反方向推動滑鈕30上之操作部34，如此，該滑鈕30帶動固持件20及晶片卡40一起沿箭頭X之反方向運動。此時，二圓筒狀凸起221、231於開槽1143內滑動，二導引柱32、33於矩形通孔1141內沿其長邊滑動。然後，當滑鈕30上之導引柱32被矩形通孔1141之一側阻擋時，滑鈕30、固持件20及晶片卡40即停止運動，此時，該晶片卡40之一端露出容置腔11，這使得該晶片卡40可輕鬆地沿二導引槽1121、1131內滑出，即可取出該晶片卡40。 When the wafer card 40 needs to be taken out, first, the operation portion 34 on the slider 30 is pushed in the opposite direction of the arrow X. Thus, the slider 30 drives the holder 20 and the wafer card 40 to move together in the opposite direction of the arrow X. At this time, the two cylindrical protrusions 221 and 231 slide in the slot 1143, and the two guide posts 32 and 33 slide along the long sides in the rectangular through hole 1141. Then, when the guide post 32 on the slider 30 is blocked by one side of the rectangular through hole 1141, the slider 30, the holder 20 and the wafer card 40 stop moving. At this time, one end of the wafer card 40 is exposed. The cavity 11, which allows the wafer card 40 to be easily slid out along the two guiding grooves 1121, 1131, can be taken out.
可以理解，所述通孔1141及開槽1143不限於矩形，亦可為橢圓形、菱形或其他形狀。 It can be understood that the through hole 1141 and the slot 1143 are not limited to a rectangle, and may also be an ellipse, a diamond, or other shapes.
可以理解，所述滑鈕30之二導引柱32、33不限於兩個，可以為一個、三個或其他數量，且所述固持件20上之開孔之數量與導引柱之數量相配合，只要該導引柱可以無阻礙地於所述通孔1141內往復滑動即可。 It can be understood that the two guiding posts 32, 33 of the slider 30 are not limited to two, and may be one, three or other numbers, and the number of openings in the holding member 20 is opposite to the number of guiding columns. For the cooperation, as long as the guide post can slide back and forth in the through hole 1141 without any hindrance.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，本發明之範圍並不以上述實施例為限，舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application.
100‧‧‧晶片卡固持裝置 100‧‧‧ wafer card holder
10‧‧‧殼體 10‧‧‧shell
111‧‧‧容置腔 111‧‧‧容容
112、113‧‧‧側壁 112, 113‧‧‧ side wall
114‧‧‧底壁 114‧‧‧ bottom wall
1121、1131‧‧‧導引槽 1121, 1131‧‧‧ guiding slot
1141‧‧‧通孔 1141‧‧‧through hole
1143‧‧‧開槽 1143‧‧‧ slotting
20‧‧‧固持件 20‧‧‧ holding parts
21‧‧‧本體 21‧‧‧ body
22、23‧‧‧開孔 22, 23‧‧‧ openings
24‧‧‧彎折部 24‧‧‧Bending
241‧‧‧連接部 241‧‧‧Connecting Department
242‧‧‧抵擋部 242‧‧‧Resistance Department
243‧‧‧容置空間 243‧‧‧ accommodating space
30‧‧‧滑鈕 30‧‧‧ slider
31‧‧‧按壓部 31‧‧‧ Pressing Department
32、33‧‧‧導引柱 32, 33‧‧‧ Guide column
40‧‧‧晶片卡 40‧‧‧wafer card
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097133173A TWI448136B (en) | 2008-08-29 | 2008-08-29 | Chip card holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097133173A TWI448136B (en) | 2008-08-29 | 2008-08-29 | Chip card holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201010383A TW201010383A (en) | 2010-03-01 |
| TWI448136B true TWI448136B (en) | 2014-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097133173A TWI448136B (en) | 2008-08-29 | 2008-08-29 | Chip card holding device |
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| Country | Link |
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| TW (1) | TWI448136B (en) |
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| US7255605B2 (en) * | 2005-07-01 | 2007-08-14 | Shenzhen Futaihong Precision Industrial Co., Ltd. | Surface contact card holder |
| US7267147B2 (en) * | 2004-04-08 | 2007-09-11 | Acm Enterprises, Inc. | High-capacity card holder and ejector |
| US20080064239A1 (en) * | 2006-09-08 | 2008-03-13 | Jin-Fei Li | Ejection device for a connector |
| US7344401B2 (en) * | 2005-12-27 | 2008-03-18 | Shenzhen Futaihong Precision Industry Co., Ltd. | Surface contact card holder |
| US20080124965A1 (en) * | 2006-05-16 | 2008-05-29 | Chao Chen | Integrated circuit card holder |
-
2008
- 2008-08-29 TW TW097133173A patent/TWI448136B/en not_active IP Right Cessation
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| US7093764B1 (en) * | 2001-04-20 | 2006-08-22 | Palm, Inc. | Integrated SIM holder with backcase and rotating door |
| US7149307B2 (en) * | 2001-07-02 | 2006-12-12 | Flextronics Odm Luxembourg Sa, Luxembourg, Zweigniederlassung Schweiz | Locking arrangement for a subscriber terminal device |
| US7267147B2 (en) * | 2004-04-08 | 2007-09-11 | Acm Enterprises, Inc. | High-capacity card holder and ejector |
| US20060286847A1 (en) * | 2005-06-03 | 2006-12-21 | Fih Co.,Ltd | Sim card holder |
| US7255605B2 (en) * | 2005-07-01 | 2007-08-14 | Shenzhen Futaihong Precision Industrial Co., Ltd. | Surface contact card holder |
| US7131871B1 (en) * | 2005-09-16 | 2006-11-07 | Fih Co., Ltd. | Chip card retaining mechanism |
| US7344401B2 (en) * | 2005-12-27 | 2008-03-18 | Shenzhen Futaihong Precision Industry Co., Ltd. | Surface contact card holder |
| US20080124965A1 (en) * | 2006-05-16 | 2008-05-29 | Chao Chen | Integrated circuit card holder |
| US20080064239A1 (en) * | 2006-09-08 | 2008-03-13 | Jin-Fei Li | Ejection device for a connector |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201010383A (en) | 2010-03-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |