TWI485936B - Chip card locking structure - Google Patents
Chip card locking structure Download PDFInfo
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- TWI485936B TWI485936B TW097138096A TW97138096A TWI485936B TW I485936 B TWI485936 B TW I485936B TW 097138096 A TW097138096 A TW 097138096A TW 97138096 A TW97138096 A TW 97138096A TW I485936 B TWI485936 B TW I485936B
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Description
本發明係關於一種晶片卡固持結構，尤其關於一種用於攜帶式電子裝置上之晶片卡固持結構。 The present invention relates to a wafer card holding structure, and more particularly to a wafer card holding structure for use on a portable electronic device.
隨著通訊事業迅速發展，移動電話、個人數位助理(personal digital assistant,PDA)等各種攜帶式電子裝置之使用越來越普及。隨著這些攜帶式電子裝置產品功能日益多元化，應用於這些攜帶式裝置上之用於存儲記憶之晶片卡也越來越多，例如SD卡(Secure Digital Memory Card)、CF卡(Compact Flash Card)、SIM卡(Subscriber Identification Module Card，用戶識別卡)等。其中，SIM卡係一種裝有IC晶片之塑膠卡片，其具有記錄個人用戶號碼及通訊錄等功能，藉由更換SIM卡，其可供複數用戶使用。 With the rapid development of the communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular. As these portable electronic device products become more and more diversified, more and more wafer cards for storage and memory are applied to these portable devices, such as an SD card (Secure Digital Memory Card) and a CF card (Compact Flash Card). ), SIM card (Subscriber Identification Module Card), etc. The SIM card is a plastic card equipped with an IC chip, which has the functions of recording a personal user number and an address book, and can be used by a plurality of users by replacing the SIM card.
傳統之晶片卡一般容置於攜帶式電子裝置之一卡槽內。當該晶片卡容置於該卡槽內時，該晶片卡上積體電路藉由一連接器與該攜帶式電子裝置之電路板連接。當需要更換該晶片卡時，使用者使用手指直接按住該晶片卡暴露之部分，並向該卡槽外拖動，藉由使用者手指與該晶片卡之間之摩擦力使該晶片卡隨使用者手指運動，直至晶片卡由該卡槽內滑出。 Conventional wafer cards are generally housed in a card slot of a portable electronic device. When the chip card is received in the card slot, the integrated circuit on the chip card is connected to the circuit board of the portable electronic device by a connector. When the wafer card needs to be replaced, the user directly presses the exposed portion of the wafer card with a finger and drags the card card outside, and the wafer card is driven by the friction between the user's finger and the wafer card. The user's finger moves until the wafer card slides out of the card slot.
因晶片卡暴露於卡槽外之部分一般較小，直接按壓外露部分操作 較為困難；有些型號之晶片卡甚至全部容置於卡槽內。對於此類晶片卡，使用者難以藉由上述方法直接從卡槽將其取出，不便於更換晶片卡。 Since the portion of the wafer card exposed to the card slot is generally small, the direct exposure operation is performed. It is more difficult; some models of wafer cards are even placed in the card slot. For such a wafer card, it is difficult for the user to take it out directly from the card slot by the above method, which is inconvenient to replace the wafer card.
有鑒於此，有必要提供一種易於更換晶片卡之晶片卡固持結構。 In view of the above, it is necessary to provide a wafer card holding structure that is easy to replace a wafer card.
一種晶片卡固持結構，用於卡固電子裝置之晶片卡，該晶片卡固持結構包括一本體、一設置於該本體之容置部，該晶片卡固持結構包括一卡座及一鎖持組件，該卡座用以承放該晶片卡，且可滑動地容置於該容置部內；該鎖持組件裝設於該本體上，該鎖持組件包括一按壓體、一第一彈性體及一第三彈性體，該第一彈性體抵持於該本體與按壓體之間，該按壓體與卡座於第一彈性體作用下可釋放卡合，該第三彈性體抵持於該本體與卡座之間，以提供一將該卡座推出該容置部之彈性力。 A wafer card holding structure for securing a chip card of an electronic device, the chip card holding structure comprising a body and a receiving portion disposed on the body, the chip card holding structure comprising a card holder and a locking component The card holder is configured to receive the wafer card and is slidably received in the accommodating portion; the locking assembly is mounted on the body, the locking assembly includes a pressing body, a first elastic body and a a third elastic body, the first elastic body is abutted between the main body and the pressing body, and the pressing body and the card seat are released from engagement by the first elastic body, and the third elastic body is abutted against the main body Between the decks to provide an elastic force for pushing the deck out of the receptacle.
該晶片卡固持結構藉由鎖持元件與卡座相卡合，可穩固地將該晶片卡定位於容置部。且於需取出晶片卡時，鎖持組件可將該卡座推出該容置部，使得該晶片卡一端露出容置部，從而可輕鬆地取出該晶片卡。 The wafer card holding structure is engaged with the card holder by the locking member, and the wafer card can be stably positioned on the receiving portion. When the chip card needs to be taken out, the locking component can push the card holder out of the receiving portion, so that one end of the chip card is exposed to the receiving portion, so that the wafer card can be easily taken out.
100‧‧‧晶片卡固持結構 100‧‧‧ wafer card holding structure
10‧‧‧本體 10‧‧‧ Ontology
11‧‧‧第一凹槽 11‧‧‧First groove
111‧‧‧第一底壁 111‧‧‧ first bottom wall
112‧‧‧第一側壁 112‧‧‧First side wall
1121‧‧‧長邊 1121‧‧‧ long side
1122‧‧‧短邊 1122‧‧‧ Short side
113‧‧‧第二側壁 113‧‧‧ second side wall
12‧‧‧第二凹槽 12‧‧‧second groove
121‧‧‧第二底壁 121‧‧‧ second bottom wall
122‧‧‧第三側壁 122‧‧‧ third side wall
13‧‧‧滑軌 13‧‧‧Slide rails
14‧‧‧容置部 14‧‧‧ 容 部
141‧‧‧開口端 141‧‧‧Open end
142‧‧‧通孔 142‧‧‧through hole
15‧‧‧第一安裝部 15‧‧‧First Installation Department
151‧‧‧第三凹槽 151‧‧‧ third groove
152‧‧‧支撐柱 152‧‧‧Support column
153‧‧‧第一定位柱 153‧‧‧First positioning column
16‧‧‧第二安裝部 16‧‧‧Second Installation Department
161‧‧‧第四凹槽 161‧‧‧fourth groove
162‧‧‧第二定位柱 162‧‧‧Second positioning column
20‧‧‧鎖持組件 20‧‧‧Lock components
21‧‧‧按壓體 21‧‧‧ Pressing body
211‧‧‧按鈕 211‧‧‧ button
212‧‧‧卡持臂 212‧‧‧ card holding arm
2121‧‧‧臂體 2121‧‧‧Body
2122‧‧‧第一定位孔 2122‧‧‧First positioning hole
2123‧‧‧卡扣部 2123‧‧‧Bucking Department
22‧‧‧第一彈性體 22‧‧‧First Elastomer
23‧‧‧第二彈性體 23‧‧‧Second elastomer
24‧‧‧第三彈性體 24‧‧‧ Third Elastomer
30‧‧‧卡座 30‧‧‧ deck
31‧‧‧承載部 31‧‧‧ Carrying Department
311‧‧‧基片 311‧‧‧Substrate
3111‧‧‧第一表面 3111‧‧‧ first surface
3112‧‧‧第二表面 3112‧‧‧ second surface
312‧‧‧翼片 312‧‧‧ wing
3121‧‧‧導向片 3121‧‧‧Leading piece
3122‧‧‧定位片 3122‧‧‧ Positioning piece
313‧‧‧開口 313‧‧‧ openings
314‧‧‧卡合部 314‧‧‧Care Department
32‧‧‧夾持部 32‧‧‧Clamping Department
321‧‧‧片體 321‧‧‧Piece
322‧‧‧彎折部 322‧‧‧Bend
323‧‧‧抵持部 323‧‧‧Responsible Department
324‧‧‧彈片 324‧‧‧Shrap
40‧‧‧蓋體 40‧‧‧ cover
41‧‧‧板體 41‧‧‧ board
42‧‧‧第二定位孔 42‧‧‧Second positioning hole
43‧‧‧蓋合部 43‧‧‧ Covering Department
200‧‧‧晶片卡 200‧‧‧wafer card
圖1係本發明較佳實施例晶片卡固持結構和晶片卡之立體分解示意圖；圖2係本發明較佳實施例晶片卡固持結構中一組成元件之放大示意圖；圖3係本發明較佳實施例晶片卡固持結構中另一組成元件之示意 圖；圖4係圖3中本發明較佳實施例晶片卡固持結構中另一組成元件之另一視角之示意圖；圖5係本發明晶片卡固持結構較佳實施例之組裝後之示意圖；圖6係圖5沿VI線之局部剖視圖；圖7係圖5之本發明晶片卡固持結構之晶片卡推出後之局部剖視圖。 1 is a perspective exploded view of a wafer card holding structure and a wafer card according to a preferred embodiment of the present invention; FIG. 2 is an enlarged schematic view showing a component of the wafer card holding structure of the preferred embodiment of the present invention; FIG. 3 is a preferred embodiment of the present invention. Example of another component in the wafer card holding structure Figure 4 is a schematic view of another component of the wafer card holding structure of the preferred embodiment of the present invention; Figure 5 is a schematic view of the preferred embodiment of the wafer card holding structure of the present invention; 6 is a partial cross-sectional view along line VI of FIG. 5; FIG. 7 is a partial cross-sectional view showing the wafer card of the wafer card holding structure of the present invention in FIG.
本發明之較佳實施例公開一種晶片卡固持結構，其適用於行動電話、個人數位助理(personal digital assistant,PDA)等攜帶式電子裝置。於本實施例中，以應用於一行動電話(圖未示)為例說明此晶片卡固持結構。 The preferred embodiment of the present invention discloses a wafer card holding structure suitable for a portable electronic device such as a mobile phone or a personal digital assistant (PDA). In this embodiment, the wafer card holding structure is described by taking a mobile phone (not shown) as an example.
請參閱圖1，本發明較佳實施例晶片卡固持結構100包括一本體10、一鎖持組件20、一卡座30及一蓋體40。 Referring to FIG. 1 , a wafer card holding structure 100 includes a body 10 , a locking component 20 , a card holder 30 , and a cover 40 .
該本體10為行動電話之機體之一部分，其為一矩形殼體，該本體10上設有一第一凹槽11、一第二凹槽12、一容置部14、一第一安裝部15及一第二安裝部16。 The body 10 is a part of the body of the mobile phone, and is a rectangular casing. The body 10 is provided with a first recess 11 , a second recess 12 , a receiving portion 14 , a first mounting portion 15 , and A second mounting portion 16.
該第一凹槽11設置於本體10表面中央位置，其大致呈“凸”字型。該第一凹槽11包括一第一底壁111、二第一側壁112及一第二側壁113。該二第一側壁112相對地平行設置，每一該第一側壁112大致呈“L”型，包括垂直連接之一長邊1121及一短邊1122。該第二側壁113大致呈“ㄇ”型，其與該二第一側壁112於短邊1122 末端垂直連接，形成該“凸”字型。 The first groove 11 is disposed at a central position of the surface of the body 10, and is substantially in a "convex" shape. The first recess 11 includes a first bottom wall 111 , two first sidewalls 112 , and a second sidewall 113 . The first sidewalls 112 are relatively parallel, and each of the first sidewalls 112 is substantially "L" shaped, including one of the long sides 1121 and one short side 1122. The second side wall 113 is substantially "ㄇ"-shaped, and the two first side walls 112 are on the short side 1122 The ends are connected vertically to form the "convex" shape.
該第二凹槽12進一步開設於該第一凹槽11之第一底壁111上。該第二凹槽12大致為一矩形，其包括一第二底壁121及二第三側壁122。該第三側壁122之長度與第一側壁112之長邊1121相當，且與長邊1121及第一底壁111之一部分形成二相互平行之階梯狀之滑軌13。 The second groove 12 is further formed on the first bottom wall 111 of the first groove 11 . The second recess 12 is substantially rectangular and includes a second bottom wall 121 and two third side walls 122. The length of the third side wall 122 is equivalent to the long side 1121 of the first side wall 112, and forms a stepped rail 13 parallel to the first side of the long side 1121 and the first bottom wall 111.
容置部14由該二滑軌13與該第二底壁121共同圍設形成，用以容置該卡座30及晶片卡200。該容置部14包括一開口端141及一矩形通孔142，該開口端141可供該卡座30及晶片卡200滑入或者彈出該容置部14。該通孔142用以使容置於該容置空間14之晶片卡200可藉由其與電子裝置上所設之電路板(圖未示)電性連接。 The accommodating portion 14 is formed by the two sliding rails 13 and the second bottom wall 121 for receiving the card holder 30 and the wafer card 200. The accommodating portion 14 includes an open end 141 and a rectangular through hole 142. The open end 141 can slide the card holder 30 and the wafer card 200 into or out of the accommodating portion 14. The through hole 142 is configured to electrically connect the wafer card 200 received in the accommodating space 14 to a circuit board (not shown) provided on the electronic device.
該第一安裝部15及第二安裝部16用以裝設該鎖持組件20。該第一安裝部15設置於第二側壁113鄰近一第一側壁1122之一側。該第一安裝部15包括一開設於第一底壁111之第三凹槽151、一支撐柱152及一第一定位柱153。該支撐柱152為一圓柱體，該第一定位柱153大致為一圓臺。該支撐柱152及第一定位柱153均由該第三凹槽151之底部一部分垂直凸出並延伸而成，且該支撐柱152及第一定位柱153之高度與該第三凹槽151之深度相當。另外，該第三凹槽151與第二凹槽12之深度相當，並且一端與該第二凹槽12相連通。 The first mounting portion 15 and the second mounting portion 16 are used to mount the locking assembly 20 . The first mounting portion 15 is disposed on a side of the second sidewall 113 adjacent to a first sidewall 1122. The first mounting portion 15 includes a third recess 151 formed in the first bottom wall 111 , a support post 152 and a first positioning post 153 . The support post 152 is a cylinder, and the first positioning post 153 is substantially a circular table. The support post 152 and the first positioning post 153 are vertically protruded and extended from a bottom portion of the third recess 151, and the height of the support post 152 and the first positioning post 153 and the third recess 151 The depth is quite. In addition, the third groove 151 is equivalent to the depth of the second groove 12, and one end is in communication with the second groove 12.
該第二安裝部16包括一開設於第一底壁111之第四凹槽161及一第二定位柱162。該第四凹槽161之橫截面大致為一半圓形，其一端沿水平方向凸設有該第二定位柱162，另一端與該第二凹槽12相連通。 The second mounting portion 16 includes a fourth recess 161 formed in the first bottom wall 111 and a second positioning post 162 . The fourth groove 161 has a substantially semi-circular cross section, and one end of the second groove 161 protrudes from the second positioning post 162 in the horizontal direction, and the other end communicates with the second groove 12.
請一併參閱圖2，該鎖持組件20包括一按壓體21、一第一彈性體22、一第二彈性體23及一第三彈性體24。該按壓體21包括一按鈕211及一卡持臂212。該按鈕211大致為具一端開口之中空之圓台，其可套設於第一定位柱153。該卡持臂212由該按鈕211之開口端之垂直側壁延伸而成，該卡持臂包括一臂體2121及一設置於該臂體末端之一卡扣部2123。該臂體2121之大致中部位置開設一第一定位孔2122，該第一定位孔2122與支撐柱152相對應，且其直徑略大於該支撐柱152，可使該支撐柱152由其中穿過。該卡扣部2123為一卡鉤，其設置於該臂體2121遠離按鈕211之一端。該第一彈性體22、第二彈性體23及第三彈性體24均為壓縮彈簧，其中，該第一彈性體22套設於該支撐柱152上；該第二彈性體23套設於該第一定位柱153上；從而使該第一彈性體22及該第二彈性體23抵持於按壓體21與本體10之間，以提供一彈性力。另，該第三彈性體24套設於該第二定位柱162上。 Referring to FIG. 2 , the locking assembly 20 includes a pressing body 21 , a first elastic body 22 , a second elastic body 23 , and a third elastic body 24 . The pressing body 21 includes a button 211 and a holding arm 212. The button 211 is substantially a hollow circular table with one end open, which can be sleeved on the first positioning post 153. The latching arm 212 extends from a vertical side wall of the open end of the button 211. The latching arm includes an arm body 2121 and a latching portion 2123 disposed at one end of the arm body. A first positioning hole 2122 is defined in a substantially central position of the arm body 2121. The first positioning hole 2122 corresponds to the support post 152 and has a diameter slightly larger than the support post 152, so that the support post 152 can pass therethrough. The latching portion 2123 is a hook disposed at one end of the arm body 2121 away from the button 211. The first elastic body 22, the second elastic body 23 and the third elastic body 24 are both compression springs, wherein the first elastic body 22 is sleeved on the support column 152; the second elastic body 23 is sleeved on the The first positioning body 153 is disposed on the first positioning post 153; thereby the first elastic body 22 and the second elastic body 23 are abutted between the pressing body 21 and the body 10 to provide an elastic force. In addition, the third elastic body 24 is sleeved on the second positioning post 162.
請一併參閱圖3及圖4，該卡座30由一片狀體加工而成，其用以承載及固定該晶片卡200。該卡座30包括一承載部31及一設置於該承載部31之夾持部32。該承載部31用以承放該晶片卡200，其包括一基片311及二沿該基片311垂直延伸而成之翼片312。該基片311大致為一矩形框體，其包括一第一表面3111及一與該第一表面3111相對之第二表面3112。該基片311開設一貫穿第一表面3111及第二表面3112的開口313，且於該開口處的內側邊緣形成一卡合部314。該卡合部314可與卡扣部2123卡合，從而將卡座30及晶片卡200固定於容置部14內。該翼片312大致呈L型，其包括一導向片3121及一與導向片3121垂直之定位片3122。其中，該導向片3121垂直於該基片311延伸設置，該定位片3122與該基片311 大致平行。該翼片312之輪廓與滑軌13之外緣吻合，從而能夠可滑動地設置於滑軌13上。 Referring to FIG. 3 and FIG. 4 together, the card holder 30 is processed from a sheet body for carrying and fixing the wafer card 200. The card holder 30 includes a carrying portion 31 and a clamping portion 32 disposed on the carrying portion 31. The carrying portion 31 is configured to receive the wafer card 200, and includes a substrate 311 and two fins 312 extending perpendicularly along the substrate 311. The substrate 311 is substantially a rectangular frame and includes a first surface 3111 and a second surface 3112 opposite to the first surface 3111. The substrate 311 defines an opening 313 extending through the first surface 3111 and the second surface 3112, and an engaging portion 314 is formed at an inner edge of the opening. The engaging portion 314 can be engaged with the locking portion 2123 to fix the cartridge 30 and the wafer card 200 in the receiving portion 14 . The flap 312 is substantially L-shaped and includes a guiding piece 3121 and a positioning piece 3122 perpendicular to the guiding piece 3121. The guiding piece 3121 extends perpendicularly to the substrate 311, and the positioning piece 3122 and the substrate 311 Roughly parallel. The contour of the flap 312 coincides with the outer edge of the slide rail 13 so as to be slidably disposed on the slide rail 13.
該夾持部32用以固定承放於該承載部31上之晶片卡200，以避免其滑動。該夾持部32包括一片體321、一彎折部322、一抵持部323及二彈片324。該片體321大致為一矩形薄片。該彎折部322由該片體321之一端沿垂直第一表面3111之方向略加彎折形成，以便於承放於承載部31之晶片卡200之取出。該抵持部323由該片體321之另一端沿垂直於第二表面3112方向彎折形成且於基片311的外側邊緣垂直相連，該抵持部323與該第三彈性體24之一端抵持，使該第三彈性體24蓄積一彈性力。該彈片324為一條狀片體，其由該本體321之中間位置向第二表面3112凹陷形成，其可固定晶片卡200以避免其滑動。 The clamping portion 32 is configured to fix the wafer card 200 placed on the carrying portion 31 to prevent it from sliding. The clamping portion 32 includes a body 321 , a bending portion 322 , a resisting portion 323 , and two elastic pieces 324 . The sheet 321 is substantially a rectangular sheet. The bent portion 322 is formed by slightly bending one end of the sheet body 321 in the direction perpendicular to the first surface 3111 to facilitate the removal of the wafer card 200 placed on the carrying portion 31. The resisting portion 323 is formed by bending the other end of the sheet body 321 in a direction perpendicular to the second surface 3112 and perpendicularly connected to the outer edge of the substrate 311. The resisting portion 323 is opposite to one end of the third elastic body 24. Hold, the third elastic body 24 accumulates an elastic force. The elastic piece 324 is a strip-like piece formed by the intermediate position of the body 321 to the second surface 3112, which can fix the wafer card 200 to prevent it from sliding.
該蓋體40由一板狀體加工形成，其包括一板體41、一第二定位孔42及一蓋合部43，該板體41與第一凹槽11之形狀大致相當。第二定位孔42開設於該板體41一端靠近邊緣處，該第二定位孔42與第一定位柱153相對應。該蓋合部43大致為一呈L型之片狀體，其由板體41外側靠近第二定位孔43之位置處垂直延伸形成，其可與本體10之第一安裝部15之第三凹槽151配合，從而蓋合於本體10上。 The cover 40 is formed by a plate body, and includes a plate body 41, a second positioning hole 42 and a cover portion 43 which is substantially equivalent to the shape of the first groove 11. The second positioning hole 42 is defined at one end of the plate body 41 near the edge, and the second positioning hole 42 corresponds to the first positioning post 153. The cover portion 43 is substantially an L-shaped sheet-like body which is formed by a vertical extension of the outer side of the plate body 41 adjacent to the second positioning hole 43 and is connectable to the third recess of the first mounting portion 15 of the body 10. The groove 151 is fitted to cover the body 10.
請一併參閱圖5及圖6，組裝該晶片卡固持結構100時，先將該第一彈性體22、第二彈性體23及第三彈性體24分別對應套設於該支撐柱152、第一定位柱153及第二定位柱162上；接著，將按壓體21裝設於該第一安裝部15，使該支撐柱152由該第一定位孔2122露出，套設於其上之第一彈性體22位於本體10與卡持臂212之間 ，同時，套設有第二彈性體23之第一定位柱153一併容置於該按鈕211內；然後，將卡座30設置於容置部14內，使其二翼片312與該滑軌13貼合；最後，將蓋體40蓋合於本體10上，並藉由超音波焊接等方式與其固定，同時，使按鈕211由第二定位孔42露出。 Referring to FIG. 5 and FIG. 6 , when the wafer card holding structure 100 is assembled, the first elastic body 22 , the second elastic body 23 and the third elastic body 24 are respectively sleeved on the supporting column 152 and the first a positioning post 153 and a second positioning post 162; then, the pressing body 21 is mounted on the first mounting portion 15, so that the supporting post 152 is exposed by the first positioning hole 2122, and the first one is sleeved thereon. The elastic body 22 is located between the body 10 and the holding arm 212 At the same time, the first positioning post 153 of the second elastic body 23 is accommodated in the button 211; then, the card holder 30 is disposed in the accommodating portion 14 to make the two flaps 312 and the sliding portion The rail 13 is attached; finally, the cover 40 is covered on the body 10, and fixed by ultrasonic welding or the like, and the button 211 is exposed by the second positioning hole 42.
需要裝設晶片卡200時，將晶片卡200由開口端141推入卡座30，並使該晶片卡200固定於承載部31及夾持部32之片體321之間，繼續推動晶片卡200使該晶片卡200完全容置於卡座30內，然後，推動該卡座30，直至卡座30之卡合部323與卡扣部2123卡合固定，此時，卡扣部2123與該第三彈性體24之一端相抵持，使其蓄積一彈性力。 When the wafer card 200 is to be mounted, the wafer card 200 is pushed into the card holder 30 from the open end 141, and the wafer card 200 is fixed between the carrier portion 31 and the sheet 321 of the clamping portion 32 to continue to push the wafer card 200. The wafer card 200 is completely accommodated in the card holder 30, and then the card holder 30 is pushed until the engaging portion 323 of the card holder 30 is engaged with the locking portion 2123. At this time, the locking portion 2123 and the first portion One end of the three elastomers 24 is abutted to accumulate an elastic force.
請一併參閱圖7，需要取出晶片卡200時，則向下按壓按鈕211，使卡扣部2123所於平面低於卡合部323，從而解除卡合部323對卡扣部2123之擋止，同時，與其相抵持之第三彈性體24提供一彈性力，將卡座30沿滑軌13推出，其上所承載之晶片卡200一端便露出容置部14，即可取出晶片卡200。 Referring to FIG. 7 together, when the wafer card 200 needs to be taken out, the button 211 is pressed downwards so that the plane of the latching portion 2123 is lower than the engaging portion 323, thereby releasing the blocking portion 323 from the latching portion 2123. At the same time, the third elastic body 24 is provided with an elastic force to push the card holder 30 along the slide rail 13, and one end of the wafer card 200 carried thereon is exposed to the receiving portion 14, so that the wafer card 200 can be taken out.
可以理解，該第一彈性體22、第二彈性體23及第三彈性體24也可為一直接裝設於該支撐柱152、第一定位柱153及第二定位柱162上之海綿、彈性塑膠體、板簧等。 It can be understood that the first elastic body 22, the second elastic body 23 and the third elastic body 24 can also be a sponge, elastic which is directly mounted on the support column 152, the first positioning post 153 and the second positioning post 162. Plastic body, leaf spring, etc.
可以理解，該支撐柱152及第一定位孔2122可省略，該卡持臂212直接與卡座30卡合即可。 It can be understood that the support post 152 and the first positioning hole 2122 can be omitted, and the holding arm 212 can directly engage with the card holder 30.
可以理解，該第一定位柱153及第二定位柱162可省略，該第二彈性體23抵持在於按壓體21與本體10之間，該第三彈性體24直接抵持於卡座30及本體10之間即可。 It can be understood that the first positioning post 153 and the second positioning post 162 can be omitted, and the second elastic body 23 is resisted between the pressing body 21 and the body 10, and the third elastic body 24 directly abuts against the card holder 30 and It can be between the bodies 10.
可以理解，該第一彈性體22及第二彈性體23二者可省略其一，只需第一彈性體22或者第二彈性體23抵持於按壓體21與本體10之間，並提供一彈性力即可。 It can be understood that the first elastic body 22 and the second elastic body 23 can be omitted, and only the first elastic body 22 or the second elastic body 23 is required to be abutted between the pressing body 21 and the body 10, and a Elastic force can be.
可以理解，該晶片卡固持結構100不僅局限於應用於行動電話中，也可應用於其他具有晶片卡之電子裝置中，例如可應用於數碼相機中，用於取放存儲卡、記憶棒等。 It can be understood that the chip card holding structure 100 is not limited to being applied to a mobile phone, and can be applied to other electronic devices having a chip card, for example, can be applied to a digital camera for picking up and placing a memory card, a memory stick, and the like.
100‧‧‧晶片卡固持結構 100‧‧‧ wafer card holding structure
10‧‧‧本體 10‧‧‧ Ontology
11‧‧‧第一凹槽 11‧‧‧First groove
111‧‧‧第一底壁 111‧‧‧ first bottom wall
112‧‧‧第一側壁 112‧‧‧First side wall
1121‧‧‧長邊 1121‧‧‧ long side
1122‧‧‧短邊 1122‧‧‧ Short side
113‧‧‧第二側壁 113‧‧‧ second side wall
12‧‧‧第二凹槽 12‧‧‧second groove
121‧‧‧第二底壁 121‧‧‧ second bottom wall
122‧‧‧第三側壁 122‧‧‧ third side wall
13‧‧‧滑軌 13‧‧‧Slide rails
14‧‧‧容置部 14‧‧‧ 容 部
141‧‧‧開口端 141‧‧‧Open end
142‧‧‧通孔 142‧‧‧through hole
15‧‧‧第一安裝部 15‧‧‧First Installation Department
151‧‧‧第三凹槽 151‧‧‧ third groove
152‧‧‧支撐柱 152‧‧‧Support column
153‧‧‧第一定位柱 153‧‧‧First positioning column
16‧‧‧第二安裝部 16‧‧‧Second Installation Department
161‧‧‧第四凹槽 161‧‧‧fourth groove
162‧‧‧第二定位柱 162‧‧‧Second positioning column
20‧‧‧鎖持組件 20‧‧‧Lock components
21‧‧‧按壓體 21‧‧‧ Pressing body
22‧‧‧第一彈性體 22‧‧‧First Elastomer
23‧‧‧第二彈性體 23‧‧‧Second elastomer
24‧‧‧第三彈性體 24‧‧‧ Third Elastomer
30‧‧‧卡座 30‧‧‧ deck
31‧‧‧承載部 31‧‧‧ Carrying Department
311‧‧‧基片 311‧‧‧Substrate
312‧‧‧翼片 312‧‧‧ wing
32‧‧‧夾持部 32‧‧‧Clamping Department
40‧‧‧蓋體 40‧‧‧ cover
41‧‧‧板體 41‧‧‧ board
42‧‧‧第二定位孔 42‧‧‧Second positioning hole
43‧‧‧蓋合部 43‧‧‧ Covering Department
200‧‧‧晶片卡 200‧‧‧wafer card
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097138096A TWI485936B (en) | 2008-10-03 | 2008-10-03 | Chip card locking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097138096A TWI485936B (en) | 2008-10-03 | 2008-10-03 | Chip card locking structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201015799A TW201015799A (en) | 2010-04-16 |
| TWI485936B true TWI485936B (en) | 2015-05-21 |
Family
ID=44830179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097138096A TWI485936B (en) | 2008-10-03 | 2008-10-03 | Chip card locking structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI485936B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200709642A (en) * | 2005-08-16 | 2007-03-01 | Asustek Comp Inc | A mobile phone with the function for the second SIM card storage |
| TW200715196A (en) * | 2005-10-14 | 2007-04-16 | Sutech Trading Ltd | Chip card locking structure and portable electronic device therewith |
-
2008
- 2008-10-03 TW TW097138096A patent/TWI485936B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200709642A (en) * | 2005-08-16 | 2007-03-01 | Asustek Comp Inc | A mobile phone with the function for the second SIM card storage |
| TW200715196A (en) * | 2005-10-14 | 2007-04-16 | Sutech Trading Ltd | Chip card locking structure and portable electronic device therewith |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201015799A (en) | 2010-04-16 |
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