TWI395375B - Portable electronic device - Google Patents
Portable electronic device Download PDFInfo
- Publication number
- TWI395375B TWI395375B TW97144100A TW97144100A TWI395375B TW I395375 B TWI395375 B TW I395375B TW 97144100 A TW97144100 A TW 97144100A TW 97144100 A TW97144100 A TW 97144100A TW I395375 B TWI395375 B TW I395375B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic device
- portable electronic
- locking member
- positioning
- receiving cavity
- Prior art date
Links
Landscapes
- Telephone Set Structure (AREA)
Description
本發明涉及一種電子裝置，尤其涉及一種具晶片卡固定結構之攜帶式電子裝置。 The present invention relates to an electronic device, and more particularly to a portable electronic device having a wafer card fixing structure.
隨著行動通訊事業之迅速發展，行動電話、個人數位助理(personal digital assistant,PDA)等各種攜帶式電子裝置之使用已經非常普及。隨著該等攜帶式電子裝置之功能日益多元化，應用於該等攜帶式電子裝置上之用於存儲記憶之晶片卡亦越來越多，例如SD卡(Secure Digital Memory Card)、CF卡(Compact Flash Card)、SIM卡(Subscriber Identification Module Card，用戶識別卡)等。為了方便晶片卡之安裝和拆卸，上述攜帶式電子裝置一般都具晶片卡固定結構。 With the rapid development of the mobile communication industry, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become very popular. As the functions of the portable electronic devices become more and more diversified, more and more wafer cards for storing memories are applied to the portable electronic devices, such as an SD card (Secure Digital Memory Card) and a CF card ( Compact Flash Card), SIM card (Subscriber Identification Module Card), etc. In order to facilitate the installation and removal of the wafer card, the portable electronic device generally has a wafer card fixing structure.
請參閱圖1，一種具晶片卡固定結構之行動電話包括基座82及閉鎖組件84。基座82上開設有安裝口821，安裝口821內設置有連接器80，安裝口821與晶片卡(圖未示)尺寸相當，用於容納晶片卡。閉鎖元件84設置於基座82上且鄰近安裝口821，其可如圖所示箭頭方向往復移動。 Referring to FIG. 1, a mobile phone with a wafer card securing structure includes a base 82 and a latch assembly 84. A mounting port 821 is defined in the base 82. The mounting port 821 is provided with a connector 80. The mounting port 821 is sized to accommodate a wafer card (not shown). The latching element 84 is disposed on the base 82 adjacent the mounting opening 821 and is reciprocally movable in the direction of the arrow as shown.
安裝晶片卡時，撥動閉鎖組件84，使閉鎖組件84朝遠離安裝口821之方向移動，然後將晶片卡裝於安裝口821中，並反方向撥動閉鎖組件84至安裝口821上方，以將晶片卡扣於安裝口821內。同樣藉由撥動閉鎖元件84亦可取出已裝於安裝口821內之晶片卡。 When the wafer card is mounted, the latch assembly 84 is toggled to move the latch assembly 84 away from the mounting port 821, and then the wafer is snapped into the mounting port 821 and the latch assembly 84 is flipped over the mounting port 821 in the opposite direction to The wafer is snapped into the mounting opening 821. The wafer card that has been mounted in the mounting opening 821 can also be removed by dialing the latching member 84.
惟，上述行動電話中，閉鎖元件84與晶片卡相接觸之面積較小，且僅能對晶片卡之一側之邊緣施加扣合力，故當行動電話不慎落地時，外力之衝擊會使閉鎖組件84極易從安裝口821上方退開，如是將會使晶片卡無法有效地與連接器80電連接，甚至使晶片卡自安裝口821中脫出，進而嚴重影響行動電話之使用性。 However, in the above mobile phone, the area in which the latching member 84 is in contact with the wafer card is small, and only the engaging force can be applied to the edge of one side of the wafer card, so that when the mobile phone accidentally falls, the impact of the external force causes the latching. The assembly 84 is easily retracted from above the mounting opening 821. As a result, the wafer card cannot be effectively electrically connected to the connector 80, and even the wafer card can be detached from the mounting opening 821, thereby seriously affecting the usability of the mobile phone.
鑒於上述狀況，有必要提供一種對晶片卡之固定效果較好之攜帶式電子裝置。 In view of the above situation, it is necessary to provide a portable electronic device having a better fixing effect on a wafer card.
一種攜帶式電子裝置，其包括主體和固定晶片卡之閉鎖件。主體上開設有收容晶片卡之收容腔。該主體上鄰近該收容腔相對兩側之部位設有兩個固定板，該兩個固定板與該主體配合分別形成滑槽，該閉鎖件兩端分別設有滑塊，該兩個滑塊分別可滑動地容納於該兩個滑槽內。該鎖閉件和該固定板其中之一上設有定位凸起，另一個上設有可容納該定位凸起之定位凹坑。該閉鎖件可從收容腔一側滑動至收容腔上方時該定位凸起容納於該定位凹坑中，此時該鎖閉件與該兩固定板相卡合，且該鎖閉件抵持晶片卡之相對兩端。 A portable electronic device includes a main body and a latch for fixing a wafer card. The main body is provided with a receiving cavity for accommodating the wafer card. Two fixing plates are disposed on the main body adjacent to opposite sides of the receiving cavity, and the two fixing plates cooperate with the main body to form a sliding slot respectively, and the two ends of the locking member are respectively provided with a slider, and the two sliders respectively Slidably received in the two chutes. One of the locking member and the fixing plate is provided with a positioning protrusion, and the other is provided with a positioning recess for receiving the positioning protrusion. The positioning protrusion is received in the positioning recess when the locking member is slidable from the side of the receiving cavity to the receiving cavity. At this time, the locking member is engaged with the two fixing plates, and the locking member abuts the chip. The opposite ends of the card.
由於該閉鎖件之兩端分別與主體上鄰近收容腔相對兩側之部位活動相連，當該閉鎖件滑動至收容腔上方後，可對晶片卡之相對兩端一併施力，是以該攜帶式電子裝置對晶片卡之固定效果較好。 Since the two ends of the locking member are respectively movably connected to the opposite sides of the main body on the opposite sides of the receiving cavity, when the locking member slides over the receiving cavity, the opposite ends of the wafer card can be applied together, so that the carrying The electronic device has a better fixing effect on the wafer card.
100‧‧‧攜帶式電子裝置 100‧‧‧Portable electronic device
11‧‧‧鉸鏈 11‧‧‧ Hinges
21‧‧‧容置槽 21‧‧‧ accommodating slots
23‧‧‧凹槽 23‧‧‧ Groove
233‧‧‧電極端子 233‧‧‧electrode terminal
40‧‧‧電池蓋 40‧‧‧Battery cover
50‧‧‧晶片卡 50‧‧‧wafer card
61‧‧‧限位部 61‧‧‧Limited
62‧‧‧連接部 62‧‧‧Connecting Department
70‧‧‧閉鎖件 70‧‧‧Locking parts
72‧‧‧定位部 72‧‧‧ Positioning Department
73‧‧‧施力部 73‧‧‧ Force Department
10‧‧‧第一主體 10‧‧‧ first subject
20‧‧‧第二主體 20‧‧‧Second subject
22‧‧‧卡槽 22‧‧‧ card slot
231‧‧‧收容腔 231‧‧‧ containment chamber
30‧‧‧電池 30‧‧‧Battery
41‧‧‧卡扣 41‧‧‧ buckle
60‧‧‧固定板 60‧‧‧ fixed plate
611‧‧‧滑槽 611‧‧ ‧ chute
621‧‧‧定位凹坑 621‧‧‧Positioning pit
71‧‧‧滑塊 71‧‧‧ Slider
721‧‧‧定位凸起 721‧‧‧Positioning bulges
圖1係一種攜帶式電子裝置之結構示意圖。 FIG. 1 is a schematic structural view of a portable electronic device.
圖2係本發明實施方式之攜帶式電子裝置之立體圖。 2 is a perspective view of a portable electronic device according to an embodiment of the present invention.
圖3係圖2所示攜帶式電子裝置之立體分解圖。 3 is an exploded perspective view of the portable electronic device shown in FIG. 2.
圖4係圖3所示晶片卡固定結構之剖視圖。 Figure 4 is a cross-sectional view showing the wafer card fixing structure shown in Figure 3.
圖5係圖3所示晶片卡固定結構之分解圖。 Figure 5 is an exploded view of the wafer card fixing structure shown in Figure 3.
圖6係圖3所示晶片卡固定結構之另一狀態示意圖。 FIG. 6 is a schematic view showing another state of the wafer card fixing structure shown in FIG.
下面將結合附圖及實施方式對本發明之攜帶式電子裝置作進一步之詳細說明。 The portable electronic device of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
請一併參見圖2和圖3，本發明實施方式之攜帶式電子裝置100包括第一主體10、第二主體20和設於第二主體20上之電池30、電池蓋40、晶片卡50、二固定板60和閉鎖件70。其中，第二主體20、電池30、二固定板60和二閉鎖件70共同形成一晶片卡固定結構(圖未標)。於本實施方式中，攜帶式電子裝置100為行動電話。 Referring to FIG. 2 and FIG. 3 , the portable electronic device 100 of the embodiment of the present invention includes a first body 10 , a second body 20 , and a battery 30 , a battery cover 40 , and a chip card 50 disposed on the second body 20 . Two fixing plates 60 and a locking member 70. The second body 20, the battery 30, the two fixing plates 60 and the two latching members 70 together form a wafer card fixing structure (not shown). In the present embodiment, the portable electronic device 100 is a mobile phone.
第一主體10與第二主體20均為長方體。第一主體10具鉸鏈11，第一主體10與第二主體20藉由鉸鏈11相連。本實施方式中，攜帶式電子裝置100為可折疊式行動電話。可理解，若攜帶式電子裝置100設計為直板式行動電話，第一主體10亦可省卻。 The first body 10 and the second body 20 are both rectangular parallelepipeds. The first body 10 has a hinge 11, and the first body 10 and the second body 20 are connected by a hinge 11. In the present embodiment, the portable electronic device 100 is a foldable mobile phone. It can be understood that if the portable electronic device 100 is designed as a bar-type mobile phone, the first body 10 can also be omitted.
請參閱圖4和圖5，第二主體20之頂面上開有容置電池30之容置槽21。第二主體20上鄰近容置槽21之一側面上還開有複數卡槽22。容置槽21底面開設有容納固定板60和閉鎖件70之凹槽23。凹槽23底面開設有收容晶片卡50之收容腔231。收容腔231之形狀與晶片卡50大致相同，深度與晶片卡50之厚度大致相等，其底面一側之邊緣與凹槽23之底面相鄰處形成有圓弧形之安裝口232，以便於晶片卡50之取放。收容腔231底部設有可與晶片卡50電連接之電極端子233。電極端子233為彈性金屬片。 Referring to FIG. 4 and FIG. 5 , the top surface of the second body 20 is provided with a receiving groove 21 for accommodating the battery 30 . A plurality of card slots 22 are also formed on a side of the second body 20 adjacent to one of the receiving slots 21. The bottom surface of the accommodating groove 21 is provided with a recess 23 for receiving the fixing plate 60 and the latching member 70. A receiving cavity 231 for receiving the wafer card 50 is opened on the bottom surface of the recess 23 . The receiving cavity 231 has substantially the same shape as the wafer card 50, and has a depth substantially equal to the thickness of the wafer card 50. The edge of the bottom surface side is adjacent to the bottom surface of the groove 23 to form a circular arc-shaped mounting opening 232 for facilitating the wafer. The card 50 is taken. An electrode terminal 233 electrically connected to the wafer card 50 is disposed at the bottom of the receiving cavity 231. The electrode terminal 233 is an elastic metal piece.
電池蓋40為薄片狀，其一側面上設有與第二主體20之卡槽22相配合之複數 卡扣41。電池蓋40之主要作用係與第二主體20相配合將電池30固定於容置槽21內。 The battery cover 40 has a sheet shape, and one side of the battery cover 40 is provided with a plurality of slots 22 of the second body 20. Buckle 41. The main function of the battery cover 40 is to cooperate with the second body 20 to fix the battery 30 in the accommodating groove 21.
本實施方式中，晶片卡50為SIM卡。 In the present embodiment, the wafer card 50 is a SIM card.
固定板60大致為L型長方體狀，其包括限位部61及從限位部61一端垂直延伸形成之連接部62。限位部61之底部呈台階狀，其與凹槽23底面之間配合形成滑槽611。連接部62上設有定位凹坑621。 The fixing plate 60 is substantially L-shaped rectangular parallelepiped shape, and includes a limiting portion 61 and a connecting portion 62 extending perpendicularly from one end of the limiting portion 61. The bottom of the limiting portion 61 is stepped, and cooperates with the bottom surface of the recess 23 to form a sliding slot 611. A positioning recess 621 is provided in the connecting portion 62.
閉鎖件70大致為長方體狀，其兩端分別延伸有二滑塊71。滑塊71之厚度約等於滑槽611之高度。閉鎖件70上鄰近滑塊71之部位垂直延伸形成定位部72。定位部72底面設有定位凸起721。閉鎖件70頂面還設有用以增大摩擦以便於手指施力之施力部73。本實施方式中，施力部73為並排之複數細長凸肋。可理解，施力部73亦可為其他形狀，如複數凸點。 The latching member 70 is substantially rectangular parallelepiped, and has two sliders 71 extending at two ends thereof. The thickness of the slider 71 is approximately equal to the height of the chute 611. A portion of the latching member 70 adjacent to the slider 71 extends vertically to form a positioning portion 72. A positioning protrusion 721 is disposed on a bottom surface of the positioning portion 72. The top surface of the latching member 70 is further provided with a biasing portion 73 for increasing friction to facilitate the application of a finger. In the present embodiment, the urging portion 73 is a plurality of elongated ribs that are arranged side by side. It can be understood that the urging portion 73 can also have other shapes, such as a plurality of bumps.
當需將固定板60和閉鎖件70安裝至第二主體20上時，首先將閉鎖件70置於凹槽23內；然後將二固定板60固定安裝至凹槽23內，使其分別置於收容腔231之相對兩側，並使閉鎖件70之滑塊71容置於固定板60之限位部61與凹槽23底面形成之滑槽611內。滑塊71是以可於滑槽611內往復滑動。 When the fixing plate 60 and the locking member 70 need to be mounted to the second body 20, the locking member 70 is first placed in the recess 23; then the two fixing plates 60 are fixedly mounted into the recess 23, and placed respectively. The opposite sides of the receiving cavity 231 are disposed, and the slider 71 of the latching member 70 is received in the sliding slot 611 formed by the limiting portion 61 of the fixing plate 60 and the bottom surface of the recess 23. The slider 71 is slidable in the chute 611.
裝配晶片卡50之前，首先使閉鎖件70保持於如圖3所示收容腔231一側之位置；然後晶片卡50從安裝口232進入收容腔231內；再對閉鎖件70之施力部73沿圖6所示箭頭方向施力，推動閉鎖件70向收容腔231上方滑動；當定位凸起721容納於定位凹坑621時，閉鎖件70位於收容腔231上方並與晶片卡50之頂面連同相對兩端相抵持。於電極端子233向上之彈力和閉鎖件70向下之壓力之作用下，晶片卡50被穩定地固定於收容腔231內。 Before the wafer card 50 is assembled, the latching member 70 is first held at the position of the receiving cavity 231 as shown in FIG. 3; then the wafer card 50 enters the receiving cavity 231 from the mounting opening 232; and the biasing portion 73 of the latching member 70 is further Applying a force in the direction of the arrow shown in FIG. 6 pushes the latching member 70 to slide over the receiving cavity 231. When the positioning protrusion 721 is received in the positioning recess 621, the latching member 70 is located above the receiving cavity 231 and is adjacent to the top surface of the wafer card 50. Together with the opposite ends. The wafer card 50 is stably fixed in the receiving cavity 231 under the action of the upward elastic force of the electrode terminal 233 and the downward pressure of the latching member 70.
另，因定位凸起721容納於定位凹坑621中，閉鎖件70相對固定板60處於一相對穩定之鎖定狀態，受外力之衝擊時不易分離。拆卸晶片卡50時，僅需 反向推動閉鎖件70至收容腔231之一側，電極端子233會自動將晶片卡50彈起，如是可輕鬆將晶片卡50取出。 In addition, since the positioning protrusion 721 is received in the positioning recess 621, the locking member 70 is in a relatively stable locking state with respect to the fixing plate 60, and is not easily separated by the impact of an external force. When removing the chip card 50, only need Pushing the latching member 70 to one side of the receiving cavity 231, the electrode terminal 233 automatically bounces the wafer card 50, and the wafer card 50 can be easily taken out.
可理解，若固定板60上設有容納閉鎖件70之滑塊71之滑槽，固定板60之限位部61亦可不為台階狀而與第二主體20之凹槽23緊密接觸。 It can be understood that if the fixing plate 60 is provided with a sliding groove for accommodating the slider 71 of the locking member 70, the limiting portion 61 of the fixing plate 60 may not be in a stepped shape and is in close contact with the groove 23 of the second body 20.
若第二主體20上鄰近收容腔231兩側之部位開設有二滑槽，閉鎖件70可藉由兩端之滑塊71與該滑槽活動連接，此時固定板60亦可省卻。 If two sliding slots are formed on the two sides of the second body 20 adjacent to the two sides of the receiving cavity 231, the locking member 70 can be movably connected to the sliding slot by the sliders 71 at both ends, and the fixing plate 60 can be omitted.
定位凸起721亦可設於固定板60上，此時定位凹坑621對應設於閉鎖件70上。 The positioning protrusion 721 can also be disposed on the fixing plate 60. At this time, the positioning recess 621 is correspondingly disposed on the locking member 70.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之如申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and those skilled in the art will be in accordance with the present invention. Equivalent modifications or variations made by the spirit shall be covered by the following patents.
23‧‧‧凹槽 23‧‧‧ Groove
233‧‧‧電極端子 233‧‧‧electrode terminal
60‧‧‧固定板 60‧‧‧ fixed plate
62‧‧‧連接部 62‧‧‧Connecting Department
70‧‧‧閉鎖件 70‧‧‧Locking parts
72‧‧‧定位部 72‧‧‧ Positioning Department
73‧‧‧施力部 73‧‧‧ Force Department
231‧‧‧收容腔 231‧‧‧ containment chamber
50‧‧‧晶片卡 50‧‧‧wafer card
61‧‧‧限位部 61‧‧‧Limited
621‧‧‧定位凹坑 621‧‧‧Positioning pit
71‧‧‧滑塊 71‧‧‧ Slider
721‧‧‧定位凸起 721‧‧‧Positioning bulges
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97144100A TWI395375B (en) | 2008-11-14 | 2008-11-14 | Portable electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97144100A TWI395375B (en) | 2008-11-14 | 2008-11-14 | Portable electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201019547A TW201019547A (en) | 2010-05-16 |
| TWI395375B true TWI395375B (en) | 2013-05-01 |
Family
ID=44831783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97144100A TWI395375B (en) | 2008-11-14 | 2008-11-14 | Portable electronic device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI395375B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6461193B1 (en) * | 1998-10-19 | 2002-10-08 | Nokia Mobile Phones Limited | Data card connector |
| US20040132493A1 (en) * | 2002-12-27 | 2004-07-08 | Yi Yen Lin | Mobile phone with SIM card holder |
| TW200723616A (en) * | 2005-12-02 | 2007-06-16 | Fih Co Ltd | Chip card retaining structure |
-
2008
- 2008-11-14 TW TW97144100A patent/TWI395375B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6461193B1 (en) * | 1998-10-19 | 2002-10-08 | Nokia Mobile Phones Limited | Data card connector |
| US20040132493A1 (en) * | 2002-12-27 | 2004-07-08 | Yi Yen Lin | Mobile phone with SIM card holder |
| TW200723616A (en) * | 2005-12-02 | 2007-06-16 | Fih Co Ltd | Chip card retaining structure |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201019547A (en) | 2010-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7520766B2 (en) | Fixing device for subscriber identification module card | |
| CN101425146B (en) | Chip card holding structure and mobile telephone applying the chip card holding structure | |
| US7303414B2 (en) | Surface contact card holder | |
| US7583514B2 (en) | SIM card holder | |
| US7344401B2 (en) | Surface contact card holder | |
| US7354290B2 (en) | Surface contact card holder | |
| US20070060198A1 (en) | Structure for housing a SIM card and a flash memory card | |
| US20130309885A1 (en) | Holder for surface contact card for electronic device | |
| US7244135B2 (en) | Surface contact card latching assembly | |
| US7780464B2 (en) | Surface contact card holder and portable electronic device using the same | |
| US7192292B1 (en) | Card connector having improved supporting structure for ejecting mechanism | |
| US8968030B2 (en) | Chip card holder for electronic device | |
| US8199480B2 (en) | Chip card holder and portable electronic device using the same | |
| TWI345344B (en) | Sim card holding structure | |
| US20060194466A1 (en) | Surface contact card holder | |
| TWI395375B (en) | Portable electronic device | |
| US8077451B2 (en) | Surface contact card retention assembly | |
| TW201403487A (en) | Card connector | |
| US7762850B2 (en) | Surface contact card retention assembly | |
| TWI345439B (en) | Chip card locking structure | |
| TWI345345B (en) | Chip card holding structure | |
| TWI358037B (en) | Chip card locking structure and portable electroni | |
| TWI365033B (en) | Chip card latching device | |
| TWI446779B (en) | Chip card holding structure | |
| TWI362208B (en) | Chip card holding structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |