TWI447781B

TWI447781B - A method of making a microstructure embossing die

Info

Publication number: TWI447781B
Application number: TW096138049A
Authority: TW
Original assignee: Univ Nat Cheng Kung
Priority date: 2007-10-11
Filing date: 2007-10-11
Publication date: 2014-08-01
Also published as: TW200917333A

Description

製作具微結構壓印模具之方法Method for making a microstructured imprinting mold

本發明是有關於一種製作具微結構壓印模具之方法，尤指一種可製作出具微米級圖案之金屬壓印模具者。The invention relates to a method for manufacturing a microstructured imprinting mold, in particular to a metal imprinting mold capable of producing a micron-scale pattern.

按，一般金屬模具之製作方法係於一基材上，以黃光微影製程製作非導電之光阻圖形，藉以定義出所需模具之圖形，再利用電子束蒸鍍在光阻圖形及基材上蒸鍍一金屬薄膜，之後進行電鑄脫模離形而得到金屬模具。According to the method for manufacturing a general metal mold, a non-conductive photoresist pattern is formed by a yellow light lithography process, thereby defining a pattern of a desired mold, and then evaporating electron beam on the resist pattern and the substrate. A metal film is vapor-deposited, and then electroformed and demolded to obtain a metal mold.

雖然上述習用金屬模具之製作方法可得到金屬模具，但是其製程設備之成本較高，且此製作方法之缺點係於進行蒸鍍製程時，該薄膜在光阻側壁之被覆性不佳，造成部分區塊無法形成連續狀之導電薄膜，導致電鑄後無法得到完整之金屬模具。Although the above-mentioned conventional metal mold manufacturing method can obtain a metal mold, the cost of the process equipment is high, and the disadvantage of the manufacturing method is that when the vapor deposition process is performed, the film has poor coverage on the photoresist sidewall, resulting in a part. The block cannot form a continuous conductive film, resulting in a failure to obtain a complete metal mold after electroforming.

本發明之主要目的係在於，可達到降低製程設備之成本、製程簡單、製程時間短、及晶種層被覆性較佳之功效。The main object of the present invention is to achieve the effects of reducing the cost of the process equipment, simple process, short process time, and better coverage of the seed layer.

為達上述之目的，本發明係一種製作具微結構壓印模具之方法，係於一基板之一面上塗佈有光阻層；利用一光源配合具有所需模具圖形之光罩於光阻層上進行曝光及顯影，使光阻層於基板上形成與模具圖形相反之光阻圖案層；再於光阻圖案層及基板上電鍍沉積一導電薄膜層；之後於導電薄膜層上進行電鑄，使該導電薄膜層上形成有所需厚度之電鑄層；最後以化學溶液浸泡將殘留之光阻圖案層移除，使該電鑄層與基材剝離，藉以使電鑄層形成一具微結構之金屬模具。For the above purposes, the present invention is a method for fabricating a microstructured imprinting mold by coating a photoresist layer on one side of a substrate; using a light source to match the photomask having the desired mold pattern to the photoresist layer Exposing and developing the photoresist layer on the substrate to form a photoresist pattern layer opposite to the mold pattern; depositing a conductive film layer on the photoresist pattern layer and the substrate; and then electroforming on the conductive film layer. Forming an electroformed layer of a desired thickness on the conductive film layer; finally, removing the remaining photoresist pattern layer by chemical solution so as to peel off the electroformed layer from the substrate, thereby forming the electroformed layer into a microscopic layer Metal mold of the structure.

請參閱『第1~6圖』所示，係分別為本發明步驟一之示意圖、本發明步驟二之示意圖、本發明步驟三之示意圖、本發明步驟四之示意圖及本發明步驟五之示意圖。如圖所示：本發明係一種製作具微結構壓印模具之方法，其至少包含有下列步驟。Please refer to FIG. 1 to FIG. 6 for a schematic diagram of Step 1 of the present invention, a schematic diagram of Step 2 of the present invention, a schematic diagram of Step 3 of the present invention, a schematic diagram of Step 4 of the present invention, and a schematic diagram of Step 5 of the present invention. As shown, the present invention is a method of making a microstructured imprint mold comprising at least the following steps.

步驟一：提供一基板10，並於該基板10之一面上塗佈一光阻層20，其中該基板10係可為矽晶片或為玻璃基板，且該光阻層20係可為正型光阻或為負型光阻。Step 1: provide a substrate 10, and apply a photoresist layer 20 on one surface of the substrate 10. The substrate 10 may be a germanium wafer or a glass substrate, and the photoresist layer 20 may be a positive light. The resistance is either a negative photoresist.

步驟二：利用一UV光源30配合具有所需模具圖形41之光罩40於光阻層20上進行曝光(如第3圖所示)及顯影(如第4圖所示)，使光阻層20於基板10上形成與模具圖形相反之光阻圖案層21。Step 2: using a UV light source 30 to cooperate with the photomask 40 having the desired mold pattern 41 on the photoresist layer 20 for exposure (as shown in FIG. 3) and development (as shown in FIG. 4) to form the photoresist layer. A photoresist pattern layer 21 opposite to the mold pattern is formed on the substrate 10.

步驟三：於上述光阻圖案層21及基板10上利用無電極電鍍法電鍍沉積一導電薄膜層50。Step 3: depositing a conductive thin film layer 50 on the photoresist pattern layer 21 and the substrate 10 by electroless plating.

步驟四：之後於導電薄膜層50上進行電鑄，使該導電薄膜層50上形成有所需厚度之電鑄層60。Step 4: Electroforming is performed on the conductive film layer 50 to form an electroformed layer 60 of a desired thickness on the conductive film layer 50.

步驟五：最後以化學溶液70浸泡將殘留之光阻圖案層21移除，使該電鑄層60與基材10剝離，藉以使電鑄層60形成一具微結構之金屬模具。Step 5: Finally, the residual photoresist pattern layer 21 is removed by immersing in the chemical solution 70, and the electroformed layer 60 is peeled off from the substrate 10, so that the electroformed layer 60 forms a microstructured metal mold.

藉由上述之步驟可使本發明以無電極電鍍法於具有光阻層20之基材10表面沉積一導電薄膜層50，作為電鑄之電鑄晶種層，隨後進行電鑄製作出具微米級圖案之金屬壓印模具，且可同時達到下列之優點：1．節省沉積電鑄晶種層之設備成本。By the above steps, the present invention can deposit an electroconductive thin film layer 50 on the surface of the substrate 10 having the photoresist layer 20 by electrodeless electroplating as an electroformed seed layer of electroforming, followed by electroforming to produce a micron-scale layer. The metal stamping mold of the pattern can simultaneously achieve the following advantages: 1. Save on equipment costs for depositing electroformed seed layers.

2．節省沉積電鑄晶種層之時間。2. Save time in depositing electroformed seed layers.

3．改善蒸鍍製程於母模側壁無法沉積晶種層之缺點。3. The disadvantage of improving the evaporation process on the sidewall of the master mold is that the seed layer cannot be deposited.

本發明在壓印製程中為了延長模具的使用壽命，嘗試利用電鑄法製作金屬模具取代矽基模具，以製程快速且設備成本低之無電極電鍍的方式，取代傳統的電子束蒸鍍金屬薄膜製程來製作電鑄晶種層，可在非導體及導體基材上同時沉積導電晶種層，且薄膜被覆性佳。配合電鑄製程可用來製作具微結構之金屬模具，由於製程具備成本低及可大面積生產之優勢，使得此改良製程有著極大的發展優勢。In order to prolong the service life of the mold in the embossing process, the present invention attempts to replace the ruthenium-based mold by using the electroforming method to replace the ruthenium-based mold, and replace the conventional electron beam vapor-deposited metal film by the electrodeless electroplating method with fast process and low equipment cost. The process is to make an electroformed seed layer, and a conductive seed layer can be simultaneously deposited on the non-conductor and the conductor substrate, and the film has good coating properties. The electroforming process can be used to make metal molds with microstructures. This process has great development advantages due to the low cost and large-area production process.

綜上所述，本發明製作具微結構壓印模具之方法可有效改善習用之種種缺點，達到可降低製程設備之成本、製程簡單、製程時間短、以及晶種層被覆性較佳之功效，進而使本發明之產生能更進步、更實用、更符合消費者使用之所須，確已符合發明專利申請之要件，爰依法提出專利申請。In summary, the method for fabricating a micro-embossing mold of the present invention can effectively improve various disadvantages of the conventional use, and can reduce the cost of the process equipment, the process is simple, the process time is short, and the coating of the seed layer is better. To make the invention more progressive, more practical, and more in line with the needs of consumers, it has indeed met the requirements of the invention patent application, and filed a patent application according to law.

惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍；故，凡依本發明申請專利範圍及發明說明書內容所作之簡單的等效變化與修飾，皆應仍屬本發明專利涵蓋之範圍內。However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto; therefore, the simple equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the invention are modified. All should remain within the scope of the invention patent.

基板．．．10Substrate. . . 10

光阻層．．．20Photoresist layer. . . 20

UV光源．．．30UV light source. . . 30

光罩．．．40Photomask. . . 40

圖形．．．41Graphics. . . 41

導電薄膜層．．．50Conductive film layer. . . 50

電鑄層．．．60Electroformed layer. . . 60

化學溶液．．．70Chemical solution. . . 70

第1圖，係本發明步驟一之示意圖。Figure 1 is a schematic view of the first step of the present invention.

第2圖，係本發明步驟二之示意圖。Figure 2 is a schematic diagram of the second step of the present invention.

第3圖，係本發明步驟二之示意圖。Figure 3 is a schematic diagram of the second step of the present invention.

第4圖，係本發明步驟三之示意圖。Figure 4 is a schematic view of the third step of the present invention.

第5圖，係本發明步驟四之示意圖。Figure 5 is a schematic view of the fourth step of the present invention.

第6圖，係本發明步驟五之示意圖。Figure 6 is a schematic diagram of the fifth step of the present invention.

基板．．．10Substrate. . . 10

光阻層．．．20Photoresist layer. . . 20

Claims

一種製作具微結構壓印模具之方法，其包括下列步驟：步驟一：提供一基板，並於該基板之一面上塗佈一光阻層；步驟二：利用一光源配合具有所需模具圖形之光罩於光阻層上進行曝光及顯影，使光阻層於基板上形成與模具圖形相反之光阻圖案層；步驟三：於上述光阻圖案層及基板上以無電極電鍍法沉積一導電薄膜層；步驟四：之後於導電薄膜層上進行電鑄，使該導電薄膜層上形成有所需厚度之電鑄層；以及步驟五：最後以化學溶液浸泡將殘留之光阻圖案層移除，使該電鑄層與基材剝離，藉以使電鑄層形成一具微結構之金屬模具。 A method for fabricating a microstructured imprinting mold, comprising the following steps: Step 1: providing a substrate and coating a photoresist layer on one side of the substrate; Step 2: using a light source to match the desired mold pattern The photomask is exposed and developed on the photoresist layer, so that the photoresist layer forms a photoresist pattern layer opposite to the mold pattern on the substrate; Step 3: depositing a conductive layer on the photoresist pattern layer and the substrate by electroless plating a film layer; step 4: electroforming on the conductive film layer to form an electroformed layer of a desired thickness on the conductive film layer; and step 5: finally removing the remaining photoresist pattern layer by chemical solution immersion The electroformed layer is peeled off from the substrate, so that the electroformed layer forms a microstructured metal mold.

依申請專利範圍第1項所述之製作具微結構壓印模具之方法，其中，該基板係可為矽晶片。 A method of fabricating a microstructured imprinting mold as described in claim 1 wherein the substrate is a tantalum wafer.

依申請專利範圍第1項所述之製作具微結構壓印模具之方法，其中，該基板係可為玻璃基板。 A method of fabricating a microstructured imprinting mold according to the first aspect of the patent application, wherein the substrate is a glass substrate.

依申請專利範圍第1項所述之製作具微結構壓印模具之方法，其中，該光阻層係可為正型光阻。 A method of fabricating a microstructured imprinting mold according to the first aspect of the patent application, wherein the photoresist layer is a positive photoresist.

依申請專利範圍第1項所述之製作具微結構壓印模具之方法，其中，該光阻層係可為負型光阻。 A method of fabricating a microstructured imprinting mold according to the first aspect of the patent application, wherein the photoresist layer is a negative photoresist.

依申請專利範圍第1項所述之製作具微結構壓印模具之方法，其中，該光源係可為一UV光。 A method of fabricating a microstructured imprinting mold according to the first aspect of the patent application, wherein the light source is a UV light.