CN103205697A - Vapor deposition mask plate and method for producing same - Google Patents
Vapor deposition mask plate and method for producing same Download PDFInfo
- Publication number
- CN103205697A CN103205697A CN201210010757XA CN201210010757A CN103205697A CN 103205697 A CN103205697 A CN 103205697A CN 201210010757X A CN201210010757X A CN 201210010757XA CN 201210010757 A CN201210010757 A CN 201210010757A CN 103205697 A CN103205697 A CN 103205697A
- Authority
- CN
- China
- Prior art keywords
- mask plate
- electroformed layer
- exposure
- manufacture method
- electroforming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The present invention relates to a method for producing a vapor deposition mask plate, and the method comprises steps of pre-treatment of a core mold, film amounting, exposure, development, electroforming, after-treatment, a second film mounting, exposure, development, a second electroforming, film stripping, washing with water, drying, stripping, etc. in sequence. The invention also relates to a vapor deposition mask plate which is characterized by comprising a first electroformed layer and a second electroformed layer; wherein small openings of the first electroformed layer are smaller than large openings of the second electroformed layer. According to the mask plate produced by the method provided by the present invention, the electroformed mask plate can be ensured not to deform during the vapor deposition process, and welding properties can be improved; and an additional layer is added on a conventional mask plate, which does not affect the effect of particle deposition in the vapor deposition, while plays the role of reinforcement, thus improving location accuracy.
Description
Technical field
The present invention relates to a kind of mask plate and manufacture method thereof, relate in particular to deposition mask plate and manufacture method thereof.
Background technology
Along with development of science and technology, the utilization of organic light emitting display (OLED) is more and more wider, because it not only possesses the frivolous of the few and LCD display of brightness height, the consumes energy of CRT monitor, also have the environmental limit of not being subjected to, do not need the outstanding advantage of backlight.Even if also can easily see pattern clearly under the sunlight again and the function of convolution is arranged.The manufacturing key link of OLED is, luminous organic material is applied to the ITO surface, and its quality directly determines the quality of OLED, needs to use two kinds of mask plates in the making, and wherein a kind of is metal mask plate, as deposition mask evaporation metal strip negative electrode on device; This template generally adopts CRT shadow mask fine etching technique to make metal mask plate, and its method has following steps: pre-treatment, pad pasting, development, etching, demoulding, cleaning, drying.The defective of this method is: need carry out at certain thickness metal sheet, make mask thickness at least more than 0.05mm, there is sideetching, and etching is based on chemical dissolution, the open surface that forms is crude, hole wall is not too smooth, is unfavorable for that organic granular transfers to the ITO surface fully, and ratio of precision is lower etc.
Make evaporation with the mode of electroforming at present and use with mask plate is existing, but there is inborn deficiency in this kind of electroforming mask plate: if electroformed layer is blocked up, then can have occlusion effect, influence the effect of evaporation; If electroformed layer is done thin, can reduce the generation of occlusion effect, satisfy the evaporation requirement, but thin mask plate is yielding in making and welding process, causes product rejection, and stability is very poor, wayward, and in evaporate process, cause the positional precision deviation owing to thermal expansion.
Summary of the invention
The invention provides a kind of manufacture method of deposition mask plate and the manufacture method of organic light emitting display, can guarantee in the electroforming mask plate evaporate process indeformable, and the problem of position deviation in the solution evaporate process, can also solve the technical problem that is difficult for welding in the not high and electroforming mask plate assembling process of the two-layer bonding force of electroforming.
At above problem, the present invention proposes following scheme:
A kind of manufacture method of deposition mask plate is characterized in that, at twice this kind of electroforming mask plate.
Preferably, the concrete steps of described manufacture method are followed successively by: core pre-treatment, pad pasting, exposure, development, electroforming, aftertreatment, secondary pad pasting, exposure, development, secondary electroforming, take off film, washing, drying, peel off.
In the described core Cast Strip that powers on first electroformed layer in little opening figure zone is arranged.
Control the described first electroformed layer thickness range in 20～50um.
Described aftertreatment is handled for carrying out surface sand-blasting.
Secondary pad pasting, exposure on described first electroformed layer, the graphics field of described step of exposure exposure is big opening, namely only the expose little opening figure zone of described first electroformed layer, the do not expose non-graphics field of described first electroformed layer, the big opening of described exposure is greater than the little opening of described first electroformed layer.
Control the described second electroformed layer thickness range in 30～50um.
A kind of deposition mask plate is characterized in that, is formed by above-mentioned manufacture method manufacturing.
Preferably, the deposition mask plate comprises first electroformed layer and second electroformed layer, and the little opening of described first electroformed layer is less than the big opening of described second electroformed layer.
The opening of described the first layer is made up of a lot of elongate strip openings.
Mask plate by manufacturing of the present invention can guarantee in the electroforming mask plate evaporate process indeformable, and can improve welding property; Thicken one deck at the traditional masks plate, neither influence particle deposition effect in the evaporation, play reinforcement effect simultaneously again, improve positional precision.
Description of drawings
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail.
Fig. 1 is individual layer deposition mask plate;
Fig. 2 is double-deck deposition mask plate;
Fig. 3 is double-deck deposition mask plate opening figure zone partial enlarged drawing.
1 is big opening among the figure, and 2 is little opening, and 3 is the elongate strip opening.
Embodiment
Embodiment
According to deposition mask plate through the secondary electroforming shown in Figure 2, the concrete steps of manufacturing are followed successively by: core pre-treatment → pad pasting → exposure → development → electroforming → aftertreatment → secondary pad pasting → exposure → development → secondary electroforming → take off film → washing → drying → peel off.
With the 1.8mm core through oil removing, washing, sandblast, washing, air-dry pretreatment procedure after, stick dry film, expose required opening figure zone by exposure machine, after put into electrotyping bath electroforming the first layer coating; By control the electroforming time, parameters such as electroforming solution concentration, with the first electroformed layer gauge control in 20～50um scope; After electroforming is for the first time finished, the plate face is carried out sandblasting, to strengthen the bonding force between the electroformed layer.
Secondary pad pasting, exposure on first electroformed layer again, the graphics field of second electroformed layer are big opening, do not cover the graphics field of the first layer, only cover no graphics field.
By the control electroforming time, parameters such as electroforming solution concentration, the electroformed layer gauge control is in 30～50um scope for the second time.So just can produce having the deposition mask plate of thickening effect, can not influence the opening effect of electroformed layer simultaneously.
Shown in Fig. 2-3, a kind of deposition mask plate, deposition mask plate comprise first electroformed layer and second electroformed layer, and the little opening 2 of described first electroformed layer is less than the big opening 1 of described second electroformed layer.The little opening 2 of described first electroformed layer is made up of a lot of elongate strip openings 3.
Above embodiment purpose is to illustrate the present invention, and unrestricted protection scope of the present invention, all fall within the scope of protection of the present invention in the simple transformation of making under the condition of spiritual principles of the present invention.
Claims (10)
1. the manufacture method of a deposition mask plate is characterized in that, at twice this kind of electroforming mask plate.
2. manufacture method according to claim 1 is characterized in that, concrete steps are followed successively by: core pre-treatment, pad pasting, exposure, development, electroforming, aftertreatment, secondary pad pasting, exposure, development, secondary electroforming, take off film, washing, drying, peel off.
3. manufacture method according to claim 2 is characterized in that, in the described core Cast Strip that powers on first electroformed layer in little opening figure zone is arranged.
4. manufacture method according to claim 3 is characterized in that, controls the described first electroformed layer thickness range in 20～50um.
5. manufacture method according to claim 2 is characterized in that, described aftertreatment is handled for carrying out surface sand-blasting.
6. manufacture method according to claim 5, it is characterized in that, secondary pad pasting, exposure on described first electroformed layer, the graphics field of described step of exposure exposure is big opening, namely only the expose little opening figure zone of described first electroformed layer, the do not expose non-graphics field of described first electroformed layer, the big opening of described exposure is greater than the little opening of described first electroformed layer.
7. manufacture method according to claim 6 is characterized in that, controls the described second electroformed layer thickness range in 30～50um.
8. a deposition mask plate is characterized in that, is formed by each described manufacture method manufacturing of claim 1-8.
9. deposition mask plate according to claim 8 is characterized in that, comprises first electroformed layer and second electroformed layer, and the little opening of described first electroformed layer is less than the big opening of described second electroformed layer.
10. deposition mask plate according to claim 9 is characterized in that, the opening of described the first layer is made up of a lot of elongate strip openings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010757.XA CN103205697B (en) | 2012-01-16 | 2012-01-16 | Vapor deposition mask plate and manufacture method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010757.XA CN103205697B (en) | 2012-01-16 | 2012-01-16 | Vapor deposition mask plate and manufacture method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103205697A true CN103205697A (en) | 2013-07-17 |
| CN103205697B CN103205697B (en) | 2016-03-02 |
Family
ID=48753099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010757.XA Expired - Fee Related CN103205697B (en) | 2012-01-16 | 2012-01-16 | Vapor deposition mask plate and manufacture method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103205697B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103589994A (en) * | 2013-10-09 | 2014-02-19 | 昆山允升吉光电科技有限公司 | Preparation method of evaporation mask plate |
| CN104451537A (en) * | 2014-12-19 | 2015-03-25 | 昆山工研院新型平板显示技术中心有限公司 | Manufacturing method and structure of mask plate for evaporation process |
| CN107208251A (en) * | 2015-02-10 | 2017-09-26 | 大日本印刷株式会社 | The manufacture method and deposition mask of deposition mask |
| CN108486616A (en) * | 2018-03-13 | 2018-09-04 | 阿德文泰克全球有限公司 | Metal shadow mask and preparation method thereof |
| WO2019014947A1 (en) * | 2017-07-21 | 2019-01-24 | 深圳市柔宇科技有限公司 | Mask manufacturing method and mask |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002266094A (en) * | 2001-03-08 | 2002-09-18 | Ricoh Co Ltd | Plating or electroforming method, and method for forming test specimen as well as method for improving adhesion property of plating formed by the plating or electroforming method |
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| CN101230472A (en) * | 2007-01-26 | 2008-07-30 | 富准精密工业(深圳)有限公司 | Method for manufacturing airtight cavity structure |
| CN202530147U (en) * | 2012-01-16 | 2012-11-14 | 昆山允升吉光电科技有限公司 | Mask plate for vapor deposition |
-
2012
- 2012-01-16 CN CN201210010757.XA patent/CN103205697B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002266094A (en) * | 2001-03-08 | 2002-09-18 | Ricoh Co Ltd | Plating or electroforming method, and method for forming test specimen as well as method for improving adhesion property of plating formed by the plating or electroforming method |
| CN1804138A (en) * | 2005-11-14 | 2006-07-19 | 深圳市允升吉电子有限公司 | Mask electro-forming method for vaporization coating of organic light-emitting display |
| CN101230472A (en) * | 2007-01-26 | 2008-07-30 | 富准精密工业(深圳)有限公司 | Method for manufacturing airtight cavity structure |
| CN202530147U (en) * | 2012-01-16 | 2012-11-14 | 昆山允升吉光电科技有限公司 | Mask plate for vapor deposition |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103589994A (en) * | 2013-10-09 | 2014-02-19 | 昆山允升吉光电科技有限公司 | Preparation method of evaporation mask plate |
| CN104451537A (en) * | 2014-12-19 | 2015-03-25 | 昆山工研院新型平板显示技术中心有限公司 | Manufacturing method and structure of mask plate for evaporation process |
| CN107208251A (en) * | 2015-02-10 | 2017-09-26 | 大日本印刷株式会社 | The manufacture method and deposition mask of deposition mask |
| WO2019014947A1 (en) * | 2017-07-21 | 2019-01-24 | 深圳市柔宇科技有限公司 | Mask manufacturing method and mask |
| CN108486616A (en) * | 2018-03-13 | 2018-09-04 | 阿德文泰克全球有限公司 | Metal shadow mask and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103205697B (en) | 2016-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101911416B1 (en) | Mixed fabricating technique for high precision metal mask plate | |
| CN100590232C (en) | Mask electro-forming method for vaporization coating of organic light-emitting display | |
| CN103205697B (en) | Vapor deposition mask plate and manufacture method thereof | |
| CN202786401U (en) | Mask plate for OLED evaporation | |
| CN105177496B (en) | The production method of mask plate | |
| CN103556111A (en) | Mask plate and production method thereof | |
| CN103981485B (en) | Mask plate and manufacture method thereof | |
| CN103058126B (en) | A kind of processing method of three-dimensional quartz micro mechanical structure surface electrode | |
| CN103589995A (en) | Production method for mask plate | |
| TWI447781B (en) | A method of making a microstructure embossing die | |
| KR20120085042A (en) | Method for manufacturing shadow mask for forming a thin layer | |
| CN206289294U (en) | A kind of high accuracy evaporation metal mask structure being | |
| CN104538496A (en) | Efficient silicon heterojunction solar cell electroplating electrode preparing method | |
| CN108486616B (en) | Metal shadow mask and method for manufacturing the same | |
| CN103589997A (en) | Evaporation mask plate | |
| CN104465337A (en) | Method for manufacturing metal nanometer slit through PMMA/NEB double-layer glue | |
| CN202530147U (en) | Mask plate for vapor deposition | |
| CN103556112A (en) | Mask plate and production method thereof | |
| CN103205672B (en) | A kind of preparation technology of the evaporation mask plate for being easy to welding | |
| CN103205692A (en) | A machining process and a rework process for a mask plate for vapor deposition | |
| CN103589993A (en) | Manufacturing method of evaporation mask plate | |
| CN203569176U (en) | Mask plate and mask component for evaporation plating | |
| CN103556150A (en) | Method for producing high-precision mask plate | |
| CN103203952B (en) | A kind of processing technology of stepped formwork | |
| CN103589996A (en) | Mask plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20190808 Granted publication date: 20160302 |
|
| PD01 | Discharge of preservation of patent | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20220808 Granted publication date: 20160302 |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160302 Termination date: 20200116 |