TWI446848B - 彎折式印刷電路板之製造方法 - Google Patents

彎折式印刷電路板之製造方法 Download PDF

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Publication number
TWI446848B
TWI446848B TW101100326A TW101100326A TWI446848B TW I446848 B TWI446848 B TW I446848B TW 101100326 A TW101100326 A TW 101100326A TW 101100326 A TW101100326 A TW 101100326A TW I446848 B TWI446848 B TW I446848B
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TW
Taiwan
Prior art keywords
layer
adhesive layer
metal layer
metal
prepreg
Prior art date
Application number
TW101100326A
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English (en)
Chinese (zh)
Other versions
TW201318501A (zh
Inventor
Shengchieh Lin
Hanching Shih
Weihsiung Yang
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Tripod Technology Corp
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Publication of TW201318501A publication Critical patent/TW201318501A/zh
Application granted granted Critical
Publication of TWI446848B publication Critical patent/TWI446848B/zh

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW101100326A 2011-10-31 2012-01-04 彎折式印刷電路板之製造方法 TWI446848B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110338678.7A CN103096647B (zh) 2011-10-31 2011-10-31 弯折式印刷电路板的制造方法

Publications (2)

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TW201318501A TW201318501A (zh) 2013-05-01
TWI446848B true TWI446848B (zh) 2014-07-21

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TW101100326A TWI446848B (zh) 2011-10-31 2012-01-04 彎折式印刷電路板之製造方法

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JP (1) JP5480341B2 (ja)
CN (1) CN103096647B (ja)
TW (1) TWI446848B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014207822A1 (ja) * 2013-06-25 2014-12-31 株式会社メイコー プリント配線基板
US9326376B2 (en) 2014-01-14 2016-04-26 Meiko Electronics Co., Ltd. Printed wiring board
CN106163080B (zh) * 2015-04-14 2018-08-31 常熟精元电脑有限公司 软性电路板
CN106714453B (zh) * 2016-12-21 2019-04-02 江门崇达电路技术有限公司 一种假性刚挠结合板及其制备方法
CN108990320A (zh) * 2018-08-02 2018-12-11 瑞声光电科技（苏州）有限公司 柔性电路板及其制作方法
KR20200106342A (ko) * 2019-03-04 2020-09-14 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR102268389B1 (ko) * 2019-09-11 2021-06-23 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 안테나 모듈

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4003345C1 (ja) * 1990-02-05 1991-08-08 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4003344C1 (ja) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
JPH08125342A (ja) * 1994-10-21 1996-05-17 Nec Corp フレキシブル多層配線基板とその製造方法
JP3176858B2 (ja) * 1996-12-11 2001-06-18 日本メクトロン株式会社 両面銅張プリント配線板
JP2003031950A (ja) * 2001-07-12 2003-01-31 Sony Corp 多層配線基板及びその製造方法
JP2004031682A (ja) * 2002-06-26 2004-01-29 Sony Corp プリント配線基板の製造方法
KR100512688B1 (ko) * 2003-11-21 2005-09-07 대덕전자 주식회사 캐패시터 내장형 인쇄 회로 기판 제조 방법
CN101072468A (zh) * 2006-05-11 2007-11-14 冠品化学股份有限公司 软性印刷电路板基板
AT11664U1 (de) * 2007-02-16 2011-02-15 Austria Tech & System Tech Verfahren zum entfernen eines teilbereichs einer flächigen materialschicht sowie mehrlagige struktur und verwendung hiefür
AT10029U1 (de) * 2007-02-16 2008-07-15 Austria Tech & System Tech Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte
US20100155109A1 (en) * 2008-12-24 2010-06-24 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same

Also Published As

Publication number Publication date
JP2013098536A (ja) 2013-05-20
TW201318501A (zh) 2013-05-01
CN103096647B (zh) 2016-01-13
JP5480341B2 (ja) 2014-04-23
CN103096647A (zh) 2013-05-08

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