TWI445963B - Floating devices and their application test equipment - Google Patents
Floating devices and their application test equipment Download PDFInfo
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- TWI445963B TWI445963B TW101110175A TW101110175A TWI445963B TW I445963 B TWI445963 B TW I445963B TW 101110175 A TW101110175 A TW 101110175A TW 101110175 A TW101110175 A TW 101110175A TW I445963 B TWI445963 B TW I445963B
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Description
本發明係提供一種結構簡易，並可提升浮動使用效能及降低元件損壞率而節省成本之浮動裝置。The present invention provides a floating device which is simple in structure and can improve floating use efficiency and reduce component damage rate and save cost.
請參閱第1圖，係為台灣新型第94210176號「浮動裝置之改良」專利案，該浮動裝置10係於一具進氣孔111之上蓋11與本體12間設有活塞13，並使活塞13與上蓋11間形成有氣室，活塞13係於外環面設有可防洩之O型環131，並於底面設有複數個錐槽132，一裝配於活塞13下方之保持器14，係於相對應活塞13之各錐槽132位置設有具彈簧142之回位組141及珠體143，並使珠體143嵌入於錐槽132，另於保持器14下方設有連結座15，以供裝配可壓抵電子元件之接合部件(圖未示出)，使接合部件作X-Y-Z-θ之浮動位移調整；該浮動裝置10可由上蓋11之進氣孔111注入氣體至氣室內，以頂推活塞13下移，活塞13再帶動保持器14及連結座15同步下移，使上蓋11與活塞13間具有緩衝浮動空間，於接合部件下壓電子元件時，電子元件會對接合部件產生反作用力，接合部件即可帶動連結座15、保持器14及活塞13作Z軸向向上浮動位移，以防壓損電子元件；惟，此一浮動裝置於使用上具有如下缺失：Please refer to FIG. 1 , which is a patent of the "Modified Floating Device" patent of Taiwan No. 94210176. The floating device 10 is connected to a gas inlet 111 and a piston 13 is disposed between the cover 11 and the body 12, and the piston 13 is provided. A gas chamber is formed between the upper cover 11 and the outer ring surface is provided with an O-ring 131 for preventing leakage, and a plurality of tapered grooves 132 are disposed on the bottom surface, and a retainer 14 is mounted on the bottom of the piston 13. A returning group 141 having a spring 142 and a bead body 143 are disposed at positions of the respective tapered grooves 132 of the corresponding piston 13, and the bead body 143 is embedded in the tapered groove 132, and a connecting seat 15 is disposed under the retainer 14 to For assembling an engaging member (not shown) that can be pressed against the electronic component, the engaging member is adjusted for floating displacement of XYZ-θ; the floating device 10 can inject gas into the air chamber from the air inlet hole 111 of the upper cover 11 to push The piston 13 moves downward, and the piston 13 drives the retainer 14 and the joint 15 to move downward synchronously, so that the upper cover 11 and the piston 13 have a buffer floating space. When the electronic component is pressed under the joint member, the electronic component reacts to the joint member. The joint member can drive the joint seat 15, the retainer 14 and the piston 13 Z axial float upwardly displaced, to prevent the pressure loss of the electronic component; However, this float has a deletion in use:
1.活塞之O型環係為防止氣室之氣體外洩，導致O型環與上蓋間具有較大之摩擦力，若電子元件產生之反作用力小於O型環之摩擦力，即會導致接合部件無法調整至所需θ角壓抵角度而平均施力壓抵電子元件，以致下壓力量集中於電子元件之一處，易造成電子元件損壞之缺失。1. The O-ring of the piston prevents the gas in the air chamber from leaking out, resulting in a large friction between the O-ring and the upper cover. If the reaction force generated by the electronic component is less than the friction of the O-ring, the joint will be caused. The component cannot be adjusted to the required angle of θ and the average force is applied to the electronic component, so that the amount of the lower pressure is concentrated on one of the electronic components, which is liable to cause the loss of the electronic component.
2.若使接合部件對電子元件施以較小之下壓力，雖可避免電子元件受損，但卻無法使電子元件產生較大之反作用力而克服O型環之摩擦力，造成接合部件無法緩衝浮動位移之缺失。2. If the joint member applies less pressure to the electronic component, although the electronic component can be prevented from being damaged, but the electronic component cannot generate a large reaction force to overcome the frictional force of the O-ring, and the joint component cannot be prevented. The lack of buffer floating displacement.
3.當接合部件因移動臂變形或電子元件膠體厚度不均而必須調整θ角壓抵角度時，由於O型環與上蓋間具有較大之摩擦力，若電子元件產生之反作用力小於O型環之摩擦力，即會導致接合部件無法調整至所需θ角壓抵角度而平均施力壓抵電子元件，造成電子元件受力不均而影響測試品質之缺失。3. When the joint component has to adjust the angle of the θ angle due to the deformation of the moving arm or the thickness of the colloid of the electronic component, the friction between the O-ring and the upper cover is greater, and if the reaction force generated by the electronic component is less than the O-type The frictional force of the ring causes the joint member to be unable to adjust to the required angle of θ and the average force applied to the electronic component, resulting in uneven force on the electronic component and affecting the lack of test quality.
4.當接合部件欲將電子元件準確置入測試座而作X-Y調整位移時，係會帶動活塞同步側移，導致活塞壓抵O型環，致使O型環易產生彈性疲乏而變形，不僅降低O型環之使用壽命，亦會影響O型環之防洩效能。4. When the joint component wants to accurately place the electronic component into the test seat for XY adjustment displacement, the piston will move the piston synchronously, causing the piston to press against the O-ring, causing the O-ring to be elastically fatigued and deformed, not only reducing The service life of the O-ring will also affect the anti-leakage performance of the O-ring.
再者，請參閱第2圖，係為申請人為改良具O型環之浮動裝置所使用之缺失，而申請之發明第96108830號「膜片式浮動裝置」專利案，該浮動裝置20係裝配於移動臂之下方，並於一具通氣口211之面板21與上蓋22間設有可彈性變形之膜片23，並使膜片23與面板21間形成氣室，一裝配於上蓋22下方之本體24，係於內部設有垂直向保持器25，一裝配於垂直向保持器25內側之作動塊26、連接塊27及底板28，並於作動塊26之底面設有複數個具錐槽262之回位柱261，一裝配有水平保持器30之連結座29，係位於底板28與作動塊26間，並於相對應作動塊26之錐槽262位置設有珠體291及彈簧292，且使珠體291嵌置於錐槽262，另於連結座29之下方裝配有可壓抵電子元件之接合部件31，使接合部件31可作Z軸向浮動位移及X-Y軸向調整位移；於使用時，可由面板21之通氣口211將氣體注入於氣室，使膜片23向下***而彈性變形，並頂推作動塊26下移，作動塊26即帶動連接塊27、底板28及連結座29等下移，使接合部件31具有緩衝浮動空間，當接合部件31移載之電子元件與測試座具有些微置入位差而必須作X-Y軸向調整位移時，接合部件31可受測試座之導引而傳動連結座29位移，連結座29即可利用珠體291沿作動塊26之錐槽262位移，使得接合部件31作X-Y軸向調整位移，於接合部件31下壓電子元件32時，電子元件32會對接合部件31產生反作用力，並頂推接合部件31作Z軸向位移，使連結座29傳動作動塊26上移，作動塊26即頂壓膜片23，使得接合部件31可作Z軸向緩衝浮動位移，而避免壓損電子元件32；惟，此一浮動裝置20雖毋需設置防洩之O型環，使接合部件31不用克服O型環之摩擦力，僅需以較小之下壓力壓抵電子元件32，即可易於作Z軸向浮動緩衝位移，以及浮動裝置20毋須以較大下壓力壓抵電子元件32，進而有效防止電子元件32因應力集中受損，由於浮動裝置20毋需設置O型環，接合部件31作X-Y軸向調整位移時，並不會壓抵元件變形，進而提升元件使用壽命，但該浮動裝置20之作動塊26、連接塊27及底板28之外環面係貼合於垂直向保持器25，導致連結座29無法帶動接合部件31作θ角傾斜調整壓抵角度，若遇電子元件32之膠體厚度不均或移動臂變形時，接合部件31即無法調整壓抵角度，以致電子元件32無法平均受力進行測試作業，實有待加以改善。In addition, please refer to FIG. 2, which is a patent for the invention of the invention of the invention of the invention of the invention of the invention of the invention of the invention of the patent application No. 96108830, the "flip-type floating device" patent. Below the moving arm, an elastically deformable diaphragm 23 is disposed between the panel 21 and the upper cover 22 of the vent 211, and a gas chamber is formed between the diaphragm 23 and the panel 21, and a body is assembled under the upper cover 22. 24, which is internally provided with a vertical retainer 25, an actuating block 26, a connecting block 27 and a bottom plate 28 which are mounted on the inner side of the vertical retainer 25, and a plurality of tapered grooves 262 are provided on the bottom surface of the actuating block 26. The return post 261, a joint seat 29 equipped with a horizontal retainer 30, is located between the bottom plate 28 and the actuating block 26, and is provided with a bead body 291 and a spring 292 at a position corresponding to the taper groove 262 of the actuating block 26, and the bead is provided The body 291 is embedded in the tapered groove 262, and the joint member 31 for pressing against the electronic component is mounted under the joint seat 29, so that the joint member 31 can be displaced in the Z-axis direction and the XY axial direction is adjusted. Gas can be injected into the air chamber by the vent 211 of the panel 21 to make the diaphragm 23 The lower bulge is elastically deformed, and the pushing actuating block 26 is moved downward, and the actuating block 26 drives the connecting block 27, the bottom plate 28 and the connecting seat 29 to move downward, so that the engaging member 31 has a buffer floating space, and when the engaging member 31 is transferred, When the electronic component and the test socket have slight misplacement and must be adjusted for XY axial displacement, the joint member 31 can be guided by the test seat and the drive joint 29 can be displaced, and the joint 29 can be moved along the bead 291. The taper groove 262 of 26 is displaced such that the joint member 31 is axially adjusted and displaced. When the electronic component 32 is pressed down by the joint member 31, the electronic component 32 generates a reaction force to the joint member 31, and pushes the joint member 31 to the Z-axis. The displacement causes the joint block 29 to move upwardly, and the actuating block 26, that is, the top diaphragm 23, allows the joint member 31 to perform a Z-axis buffer floating displacement while avoiding pressure loss of the electronic component 32; however, this float Although the device 20 needs to be provided with a leak-proof O-ring, the joint member 31 does not need to overcome the frictional force of the O-ring, and only needs to press the electronic component 32 with a small lower pressure, so that the Z-axis floating buffer displacement can be easily performed. And the floating device 20 does not have to be larger The pressure is pressed against the electronic component 32, thereby effectively preventing the electronic component 32 from being damaged due to stress concentration. Since the floating device 20 does not need to be provided with an O-ring, the joint member 31 is XY axially adjusted and displaced, and does not press against the component deformation. The life of the component is increased, but the outer surface of the actuating block 26, the connecting block 27 and the bottom plate 28 of the floating device 20 is attached to the vertical retainer 25, so that the connecting seat 29 cannot bring the joint member 31 to the θ angle tilt adjustment pressure. In the case of the contact angle, if the thickness of the colloid of the electronic component 32 is uneven or the moving arm is deformed, the engaging member 31 cannot adjust the pressing angle, so that the electronic component 32 cannot be subjected to an average force for the test operation, which needs to be improved.
因此，如何設計一種可提升浮動效能及降低元件損壞率之浮動裝置，即為業者研發之標的。Therefore, how to design a floating device that can improve the floating performance and reduce the component damage rate is the standard developed by the industry.
本發明之目的一，係提供一種浮動裝置，該浮動裝置係於本體與浮動器之作動部件間設有可彈性變形之膜片，並於膜片與本體間設有可容納流體之容室，使浮動器作Z軸向浮動位移，又浮動器係設有可裝配至少一接合部件之連結部件，另於作動部件與連結部件間設有水平調整機構，以使接合部件作X-Y軸向位移，其中，本體與浮動器間設有角度調整機構，角度調整機構係於本體與浮動器設有至少一組可相互配合之具錐度擋面的導移孔及具錐度頂抵面的導引部件；藉此，浮動裝置可作Z軸向浮動位移及X-Y軸向調整位移，於接合部件作Z軸向浮動位移時，導引部件之頂抵面係脫離導移孔之擋面，接合部件即可作θ角調整壓抵角度，達到提升浮動效能及防止元件受損之實用效益。A first object of the present invention is to provide a floating device which is provided with an elastically deformable diaphragm between the main body and the actuating member of the floater, and a chamber for accommodating fluid between the diaphragm and the body. The floating device is made to have a Z-axis floating displacement, and the floating device is provided with a connecting member capable of assembling at least one engaging member, and a horizontal adjusting mechanism is disposed between the actuating member and the connecting member, so that the engaging member is axially displaced by XY. Wherein, the angle adjusting mechanism is disposed between the body and the floater, and the angle adjusting mechanism is provided with at least one set of guiding holes with a tapered running surface and a guiding member with a tapered top abutting surface; Thereby, the floating device can be used for the Z-axis floating displacement and the XY axial adjustment displacement. When the joint member is subjected to the Z-axis floating displacement, the abutting surface of the guiding member is separated from the blocking surface of the guiding hole, and the engaging member can be Adjust the pressing angle of the θ angle to achieve the practical benefit of improving the floating efficiency and preventing component damage.
本發明之目的二，係提供一種浮動裝置，該角度調整機構係於浮動器之作動部件下方設有可與本體之導移孔相互配合的導引部件，因其結構上大幅簡化，以大幅縮小浮動器之體積而微型化，不僅可適用於微型化之電子元件，並可便利配置複數個浮動器以因應作業所需，達到提升使用效能之實用效益。A second object of the present invention is to provide a floating device which is provided with a guiding member which can cooperate with a guiding hole of the body under the actuating member of the floating device, and is greatly simplified in structure, thereby greatly reducing The size and miniaturization of the floater can be applied not only to miniaturized electronic components, but also to the convenience of configuring a plurality of floaters to meet the operational requirements and to achieve practical benefits of improved performance.
本發明之目的三，係提供一種浮動裝置，該浮動裝置可裝配於測試裝置與機台間，並於接合部件受測試裝置壓抵時可作Z軸向浮動位移及θ角調整承壓角度，使測試裝置可緩衝浮動，達到提升浮動效能及防止元件受損之實用效益。A third object of the present invention is to provide a floating device which can be installed between a test device and a machine table, and can adjust the bearing angle of the Z-axis floating displacement and the θ angle when the joint member is pressed by the test device. The test device can be buffered to achieve the practical benefit of improving the floating performance and preventing component damage.
本發明之目的四，係提供一種應用浮動裝置之測試設備，其係於機台上配置有供料裝置、收料裝置、測試裝置、輸送裝置、中央控制裝置及浮動裝置，該供料裝置係用以容納至少一待測之電子元件，該收料裝置係用以容納至少一完測之電子元件，該中央控制裝置係用以控制及整合各裝置作動，以執行自動化作業，該輸送裝置係設有至少一具壓取器及移動臂之移載單元，該浮動裝置係裝配於輸送裝置之移動臂處，並令接合部件於壓抵電子元件時作Z軸向浮動位移及θ角調整壓抵角度，使電子元件受力平均而執行測試作業，達到提升浮動效能及防止元件受損之實用效益。A fourth object of the present invention is to provide a testing device using a floating device, which is provided with a feeding device, a receiving device, a testing device, a conveying device, a central control device and a floating device, and the feeding device is For accommodating at least one electronic component to be tested, the receiving device is for accommodating at least one electronic component to be tested, and the central control device is used for controlling and integrating the operation of each device to perform an automated operation. Providing at least one shifting unit for the presser and the moving arm, the floating device is mounted on the moving arm of the conveying device, and the Z-axis floating displacement and the θ-angle adjusting pressure are made when the engaging member is pressed against the electronic component. The angle of contact makes the electronic components force the average to perform the test operation, achieving the practical benefit of improving the floating performance and preventing component damage.
為使 貴審查委員對本發明作更進一步之瞭解，茲舉一較佳實施例並配合圖式，詳述如后：請參閱第3、4圖，本發明浮動裝置40包含有本體41及浮動器42，並於本體41與浮動器42間設有可彈性變形之膜片43，膜片43與本體41間則設有可容納流體之容室，使浮動器42作Z軸向浮動位移，更進一步，容室之一側係連通可注入流體之流體注入口，流體注入口則連通可供流體流動之流道，流體可為空氣或液體，並視需求的浮動特性進行選擇，例如可於本體41或浮動器42設有可連通容室之流體注入口，於本實施例中，該流體係為氣體，於本體41設有可注入氣體之流體注入口411，流體注入口411則連通容室，又於本體41之上方裝配具流道之面板，面板可為獨立之板體，或為移動臂之連接板，使面板之流道連通流體注入口及流體供應源(圖未示出)，於本實施例中，面板44係為獨立之板體，並開設有連通流體供應源之流道441，面板44係裝配於本體41之頂面，使本體41之流體注入口411經面板44之流道441而連通流體供應源，該浮動器42係設有至少一可裝配膜片43之作動部件421，於容室注入氣體後，可使膜片43向下凸伸變形，並頂推浮動器42之作動部件421作Z軸向向下位移，本體41與作動部件421間即具有緩衝浮動空間，使作動部件421可作Z軸向浮動位移，又作動部件421之下方係設有至少一接合部件，若浮動裝置40裝配於一移載單元之移動臂與壓取器間，可令接合部件承受壓取器之壓抵而作浮動位移及θ角調整角度，使壓取器緩衝浮動，若浮動裝置40裝配於一測試裝置與機台間，可令接合部件承受測試裝置之壓抵而作浮動位移及θ角調整角度，使測試裝置緩衝浮動，於本實施例中，係於作動部件421之下方設有連結部件422，連結部件422之下方則裝配有至少一接合部件423，接合部件423可作為下壓治具，或裝配壓取器，於本實施例中，接合部件423係裝配可移載及下壓電子元件之壓取器；另浮動器42係於作動部件421與連結部件422間設有水平調整機構，以使接合部件423作X-Y軸向位移調整，於本實施例中，水平調整機構係於作動部件421與連結部件422間設有至少一組相互配合之錐槽及可彈性位移之頂抵件，並使頂抵件可沿錐槽位移，而帶動接合部件423作X-Y軸向調整位移，更進一步，作動部件421之底面係設有複數個錐槽，作動部件421可於底面直接開設有錐槽，亦或於底面裝配有複數個具錐槽之回位件，於本實施例中，係於作動部件421之底面裝配複數個具錐槽4241之回位件424，於連結部件422相對應各錐槽4241之位置設有可為珠體425之頂抵件，各珠體425之下方設有可為彈簧426之彈性元件，更進一步，係於珠體425之下方設有套置彈簧426之推抵件427，推抵件427可利用彈簧426之彈力而推頂珠體425嵌置於回位件424之錐槽4241中，使連結部件422可利用珠體425沿回位件424之錐槽4241位移，而帶動接合部件423作X-Y軸向調整位移；另於作動部件421與連結部件422間設有至少一水平保持器428，用以輔助接合部件423平穩作水平位移，於本實施例中，係於連結部件422之內部設有複數個具上、下板及鋼珠之水平保持器428，其上、下板係夾持複數個鋼珠，並使上板頂置於連結部件422，而下板則鎖固於作動部件421之底面，使連結部件422可利用上板帶動鋼珠沿下板作水平位移，而輔助接合部件423平穩水平位移；又浮動裝置40係於本體41與浮動器42間設有角度調整機構，角度調整機構係於本體41與浮動器42間設有至少一組可相互配合之具擋面的導移孔及具頂抵面的導引部件，更進一步，該導移孔係設有具錐度或圓弧之擋面，而導引部件係設有具錐度或圓弧且可頂抵於擋面之頂抵面，於本實施例中，角度調整機構係於本體41開設有複數個呈階級狀之導移孔412，各導移孔412之適當位置係設有具錐度之擋面4121，另於浮動器42之作動部件421相對應各導移孔412的位置設有導引部件429，各導引部件429係設有具錐度且可頂抵於擋面4121之頂抵面4291，於接合部件423帶動作動部件421及連結部件422作Z軸向浮動位移時，可令導引部件429之頂抵面4291脫離導移孔412之擋面4121，使得接合部件423作θ角調整壓抵角度。In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described in detail as follows: Referring to Figures 3 and 4, the floating device 40 of the present invention comprises a body 41 and a floater. 42. An elastically deformable diaphragm 43 is disposed between the body 41 and the floater 42. A chamber for accommodating the fluid is disposed between the diaphragm 43 and the body 41, so that the floater 42 is displaced in the Z-axis direction. Further, one side of the chamber is connected to the fluid injection port of the injectable fluid, and the fluid injection port is connected to the flow path for the fluid to flow. The fluid may be air or liquid, and is selected according to the required floating characteristics, for example, on the body. 41 or the floater 42 is provided with a fluid injection port that can communicate with the chamber. In the embodiment, the flow system is a gas, and the body 41 is provided with a fluid injection port 411 for injecting gas, and the fluid injection port 411 is connected to the chamber. And assembling a panel with a flow channel above the body 41. The panel may be a separate plate body or a connecting plate of the moving arm, so that the flow channel of the panel communicates with the fluid injection port and the fluid supply source (not shown). In this embodiment, the panel 44 is unique. The plate body is provided with a flow channel 441 connected to the fluid supply source. The panel 44 is mounted on the top surface of the body 41, so that the fluid injection port 411 of the body 41 communicates with the fluid supply source via the flow channel 441 of the panel 44. The device 42 is provided with at least one actuating member 421 for assembling the diaphragm 43. After the gas is injected into the chamber, the diaphragm 43 can be convexly deformed downward, and the actuating member 421 of the floater 42 is pushed to the Z-axis direction. The lower displacement, the body 41 and the actuating member 421 have a buffer floating space, so that the actuating member 421 can be displaced in the Z-axis, and at least one engaging member is disposed under the actuating member 421, if the floating device 40 is assembled Between the moving arm of the carrying unit and the presser, the engaging member can be pressed against the pressure of the presser to make a floating displacement and an angle θ adjustment angle, so that the crimper can be buffered and floated, if the floating device 40 is assembled on a test device and a machine In the inter-stage, the joint member can be subjected to the pressure of the test device and the floating displacement and the angle θ can be adjusted to make the test device buffer and float. In the embodiment, the joint member 422 is disposed under the actuating member 421, and the joint member is connected. Below 422 Equipped with at least one engaging member 423, which can be used as a pressing fixture or a fitting presser. In this embodiment, the engaging member 423 is equipped with a crimper for transferring and depressing electronic components; The device 42 is provided with a horizontal adjustment mechanism between the actuating member 421 and the connecting member 422 for adjusting the XY axial displacement of the engaging member 423. In the present embodiment, the horizontal adjusting mechanism is disposed between the actuating member 421 and the connecting member 422. There is at least one set of matching tapered groove and elastically displaceable abutting member, and the top abutting member is displaceable along the tapered groove, and the engaging member 423 is driven to perform XY axial adjustment displacement, and further, the bottom surface of the actuating member 421 is A plurality of tapered grooves are provided, and the actuating member 421 can be directly provided with a tapered groove on the bottom surface, or a plurality of returning members having a tapered groove can be mounted on the bottom surface. In this embodiment, the bottom surface of the actuating member 421 is assembled. The returning member 424 having the tapered groove 4241 is provided with an abutting member which can be a bead 425 at a position corresponding to each of the tapered grooves 4241 of the connecting member 422, and an elastic member which can be a spring 426 is disposed below each of the beads 425 Further, tied to the bead 4 A pushing member 427 of the sleeve spring 426 is disposed under the 25, and the pushing member 427 can be embedded in the tapered groove 4241 of the returning member 424 by the elastic force of the spring 426, so that the connecting member 422 can utilize the bead. The body 425 is displaced along the tapered groove 4241 of the returning member 424 to drive the engaging member 423 for XY axial adjustment displacement; and at least one horizontal retainer 428 is disposed between the actuating member 421 and the connecting member 422 for assisting the engaging member 423. In the present embodiment, a plurality of horizontal retainers 428 having upper and lower plates and steel balls are disposed inside the connecting member 422, and the upper and lower plates are clamped with a plurality of steel balls and are placed thereon. The top of the plate is placed on the connecting member 422, and the lower plate is locked on the bottom surface of the actuating member 421, so that the connecting member 422 can use the upper plate to drive the steel ball to horizontally displace along the lower plate, and the auxiliary engaging member 423 is smoothly horizontally displaced; 40 is provided with an angle adjusting mechanism between the body 41 and the floater 42. The angle adjusting mechanism is provided between the body 41 and the floater 42 with at least one set of guiding holes with matching surfaces and abutting surfaces. Guide member, further, the guide The guide member is provided with a taper or a circular arc, and the guide member is provided with a taper or an arc and can abut against the top surface of the stop surface. In this embodiment, the angle adjustment mechanism is provided on the body 41. There are a plurality of guide holes 412 which are in the form of a class. The guide holes 412 are respectively provided with a taper surface 4121, and the movable member 421 of the floater 42 is disposed corresponding to each of the guide holes 412. Each of the guiding members 429 is provided with a taper and abutting against the abutting surface 4291 of the blocking surface 4121. When the engaging member 423 is provided with the moving member 421 and the connecting member 422 for Z-axis floating displacement, The abutting surface 4291 of the guiding member 429 is disengaged from the blocking surface 4121 of the guiding hole 412, so that the engaging member 423 adjusts the pressing angle by the angle θ.
請參閱第4、5圖，浮動裝置40係裝配於移載單元之移動臂51與壓取器52間，並以面板44連結裝配於移動臂51之下方，而接合部件則連結裝配壓取器52，當移動臂51帶動浮動裝置40及壓取器52將待測之電子元件60置入測試座70時，若電子元件60與測試座70具有水平向之微小置入誤差，由於作動部件421與連結部件422間設有水平調整機構，而可於電子元件60受測試座70之頂推導引作微小偏移時，利用連結部件422上之珠體425沿作動部件421之錐槽4241位移，並使珠體425壓縮彈簧426，使得接合部件423可作X-Y軸向位移調整，並利用水平保持器428輔助平穩水平位移，以便利將電子元件60置入於測試座70，又由於導引部件429之頂抵面4291係頂抵貼合於導移孔412之擋面4121，使得作動部件421可利用導引部件429限位於導移孔412中而不會作水平位移，以防止作動部件421壓損相關元件，進而延長元件使用壽命及節省成本；請參閱第6、7圖，當壓取器52壓抵測試座70內之電子元件60執行測試作業時，電子元件60會對壓取器52產生反作用力，此一反作用力經壓取器52將頂推帶動連結部件422及作動部件421作Z軸向向上位移，由於作動部件421與本體41間具有緩衝浮動空間，使得作動部件421可壓抵膜片43而作Z軸向浮動位移，此時，作動部件421亦帶動各導引部件429上移，使各導引部件429之頂抵面4291脫離本體41之導移孔412的擋面4121，由於膜片43與本體41間係設有密閉之容室，並無設置防洩元件(如O型環)，不僅使作動部件421易於作Z軸向向上浮動位移，亦毋須增加下壓力，使得接合部件423可以使用較小之下壓力經壓取器52壓抵電子元件60，即可產生浮動緩衝作用，達到易於緩衝浮動及降低電子元件損壞率之效益；請參閱第8圖，若壓取器52因電子元件60之膠體厚度不一或移動臂51變形而無法使電子元件60平均受力時，由於角度調整機構之導引部件429的頂抵面4291已脫離本體41之導移孔412的擋面4121，而解除作動部件421限位，使得壓取器52壓抵電子元件60時，可隨電子元件60之角度而帶動作動部件421、連結部件422及接合部件423作θ角傾斜調整壓抵角度，令壓取器52貼合電子元件60，使各電子元件60受力平均而執行測試作業，達到提升測試品質之實用效益；請參閱第9、10圖所示，於測試完畢後，移動臂51係帶動壓取器52及電子元件60離開測試座70，由於作動部件421因無反作用力向上頂推，即可解除對膜片43之壓抵，使膜片43再次受容室內之氣體頂撐而彈性凸出，並頂推作動部件421及接合部件423等元件作Z軸向向下位移復位，此時，作動部件421即帶動各導引部件429下移，使各導引部件429之頂抵面4291貼合於導移孔412之擋面4121，而將作動部件421限位，接著接合部件423可利用水平調整機構之彈簧426頂推珠體425沿作動部件421之錐槽4241作X-Y軸向位移復位，達到使壓取器52自動復位之使用效益。Referring to Figures 4 and 5, the floating device 40 is mounted between the moving arm 51 of the transfer unit and the presser 52, and is coupled to the lower side of the moving arm 51 by the panel 44, and the engaging member is coupled to the assembly presser. 52, when the moving arm 51 drives the floating device 40 and the crimper 52 to place the electronic component 60 to be tested into the test socket 70, if the electronic component 60 and the test socket 70 have a small vertical insertion error, due to the actuating component 421 A horizontal adjustment mechanism is disposed between the connecting member 422 and the metal member 60 is displaced along the tapered groove 4241 of the operating member 421 by the bead body 425 on the connecting member 422 when the electronic component 60 is slightly deflected by the pushing guide of the testing seat 70. And the bead 425 compresses the spring 426 so that the engaging member 423 can be adjusted for XY axial displacement and assists the smooth horizontal displacement with the horizontal retainer 428 to facilitate placement of the electronic component 60 in the test socket 70, and The abutting surface 4291 of the member 429 is abutted against the blocking surface 4121 of the guiding hole 412, so that the actuating member 421 can be restricted by the guiding member 429 in the guiding hole 412 without horizontal displacement to prevent the actuating member. 421 pressure loss related components, and thus extended Component life and cost savings; please refer to Figures 6 and 7, when the presser 52 is pressed against the electronic component 60 in the test stand 70 to perform a test operation, the electronic component 60 will generate a reaction force to the presser 52, this one The reaction force is biased upward by the pusher 52 by the pusher 52, and the actuating member 421 and the body 41 have a buffer floating space, so that the actuating member 421 can be pressed against the diaphragm 43. The Z-axis floating displacement, at this time, the actuating member 421 also drives the guiding members 429 to move upward, so that the abutting surface 4291 of each guiding member 429 is disengaged from the blocking surface 4121 of the guiding hole 412 of the body 41, due to the diaphragm 43 There is a sealed chamber between the body 41 and no anti-leakage element (such as an O-ring), which not only makes the actuating member 421 easy to float upward in the Z-axis, but also increases the downforce, so that the engaging member 423 can Using a lower pressure to press the electronic component 60 through the presser 52, a floating buffer can be generated to achieve the benefit of easy buffering and reducing the damage rate of the electronic component; please refer to Fig. 8 if the presser 52 is electronically The thickness of the component 60 is not When the moving arm 51 is deformed and the electronic component 60 cannot be subjected to an average force, the abutting surface 4291 of the guiding member 429 of the angle adjusting mechanism has been disengaged from the blocking surface 4121 of the guiding hole 412 of the body 41, and the actuating member 421 is released. When the presser 52 is pressed against the electronic component 60, the actuating member 421, the connecting member 422, and the engaging member 423 can be rotated at an angle of the electronic component 60 to adjust the pressing angle of the θ angle, so that the crimper 52 is attached. The electronic component 60 is combined to perform the test operation by averaging the electronic components 60 to achieve the practical benefit of improving the test quality; as shown in FIGS. 9 and 10, after the test is completed, the moving arm 51 drives the presser 52. And the electronic component 60 leaves the test stand 70. Since the actuating component 421 is pushed up by the reaction force, the pressure on the diaphragm 43 can be released, and the diaphragm 43 can be elastically protruded by the gas struts in the chamber again. The components such as the pushing member 421 and the engaging member 423 are displaced downwardly in the Z-axis direction. At this time, the actuating member 421 drives the guiding members 429 downward to make the abutting surface 4291 of each guiding member 429 adhere to the guide. The hole 412 is facing the surface 4121, and The actuating member 421 is constrained. Then, the engaging member 423 can use the spring 426 of the horizontal adjusting mechanism to push the bead body 425 along the taper groove 4241 of the actuating member 421 for X-Y axial displacement reset, thereby achieving the utility of automatically resetting the crimper 52.
請參閱第11、12圖，係為應用上述浮動裝置之測試設備，該測試設備係為測試分類機，該測試分類機包含有機台80、供料裝置90、收料裝置100、測試裝置110、輸送裝置120、空匣裝置130、中央控制裝置及浮動裝置40、40A，更進一步，該供料裝置90係配置於機台80上，用以容納至少一待測之電子元件，於本實施例中，該供料裝置90係設有至少一料盤91，用以盛裝複數個待測之電子元件；該收料裝置100係配置於機台80上，用以容納至少一完測之電子元件，於本實施例中，該收料裝置100係設有至少一料盤101，用以盛裝複數個完測之電子元件；該測試裝置110係設有具至少一測試座1102之測試電路板1101，用以測試電子元件，並以測試器(圖未示出)將測試結果傳輸至中央控制裝置(圖未示出)，由中央控制裝置控制各裝置作動；該輸送裝置120係設有至少一具移動臂及壓取器之移載單元，並於移動臂及壓取器間裝配浮動裝置，更進一步，輸送裝置120係於測試裝置110之至少一方設有至少一可作X軸向位移之載台，用以載送電子元件，於本實施例中，係於測試裝置110之一方設有可作X軸向位移之第一入料載台1201及第一出料載台1202，用以分別載送待測/完測之電子元件，於測試裝置120之另一方設有可作X軸向位移之第二入料載台1203及第二出料載台1204，用以分別載送待測/完測之電子元件，另設有具第一移動臂12051與第一壓取器12052之第一移載單元1205，以及具第二移動臂12061與第二壓取器12062之第二移載單元1206，第一移載單元1205係於第一移動臂12051裝配可取放電子元件且作X-Y-Z軸向位移之第一壓取器12052，以於第一、二入料載台1201、1203及供料裝置90間移載待測之電子元件，第二移載單元1206係於第二移動臂12061裝配可取放電子元件且作X-Y-Z軸向位移之第二壓取器12062，以於第一、二出料載台1202、1204及收料裝置100間移載完測之電子元件，另輸送裝置120係於測試裝置110處設有具第三移動臂12073與第三壓取器12076之第三移載單元1207，以及具第四移動臂12083與第四壓取器12086之第四移載單元1208，第三移載單元1207係設有第三升降驅動源12071，第三升降驅動源12071經第三升降傳動組12072帶動一可呈T型或L型之第三移動臂12073作Z軸向位移，於本實施例中，第三移動臂12073係呈T型，並於下方設有第三壓取器12076，又第三移載單元1207係設有第三水平驅動源12074，第三水平驅動源12074經第三水平傳動組12075帶動第三移動臂12073及第三壓取器12076作Y軸向位移，以於第一入、出料載台1201、1202及測試座1102間移載及下壓電子元件，第四移載單元1208係設有第四升降驅動源12081，第四升降驅動源12081經第四升降傳動組12082帶動一可呈T型或L型之第四移動臂12083作Z軸向位移，於本實施例中，第四移動臂12083係呈T型，並於下方設有第四壓取器12086，又第四移載單元1208係設有第四水平驅動源12084，第四水平驅動源12084經第四水平傳動組12085帶動第四移動臂12083及第四壓取器12086作Y軸向位移，以於第二入、出料載台1203、1204及測試座1102間移載及下壓電子元件；至少一相同上述浮動裝置(請配合參閱第3、4圖)之浮動裝置40，係裝配於輸送裝置120之移動臂與壓取器間，浮動裝置40並使接合部件及壓取器作Z軸向浮動、X-Y軸向位移及θ角調整壓抵角度，於本實施例中，係於第三移載單元1207之第三移動臂12073及第三壓取器12076間裝配有相同上述浮動裝置之浮動裝置40，於第四移載單元1208之第四移動臂12083及第四壓取器12086間裝配有相同上述浮動裝置之另一浮動裝置40A，該空匣裝置130係用以收置供料裝置90之空料盤91，並將空料盤91補充於收料裝置100，用以盛裝完測之電子元件。Please refer to FIGS. 11 and 12 , which are test equipments for applying the above floating device, which is a test sorting machine, which comprises an organic table 80 , a feeding device 90 , a receiving device 100 , a testing device 110 , The conveying device 120, the open space device 130, the central control device and the floating device 40, 40A, and further, the feeding device 90 is disposed on the machine table 80 for accommodating at least one electronic component to be tested, in this embodiment The feeding device 90 is provided with at least one tray 91 for holding a plurality of electronic components to be tested; the receiving device 100 is disposed on the machine table 80 for accommodating at least one electronic component to be tested. In the embodiment, the receiving device 100 is provided with at least one tray 101 for holding a plurality of completed electronic components. The testing device 110 is provided with a test circuit board 1101 having at least one test socket 1102. For testing the electronic components, and transmitting the test results to a central control device (not shown) by a tester (not shown), wherein the central control device controls the actuation of the devices; the delivery device 120 is provided with at least one With moving arm and presser The transfer unit is equipped with a floating device between the moving arm and the presser. Further, the transport device 120 is provided with at least one stage capable of X-axis displacement on at least one side of the test device 110 for carrying the electrons. In this embodiment, a first loading stage 1201 and a first discharging stage 1202 capable of X-axis displacement are disposed on one side of the testing device 110 for respectively carrying the test/test The electronic component is provided on the other side of the testing device 120 with a second loading stage 1203 and a second discharging stage 1204 for X-axis displacement, respectively for carrying the electronic components to be tested/tested. a first transfer unit 1205 having a first moving arm 12051 and a first presser 12052, and a second transfer unit 1206 having a second moving arm 12061 and a second extractor 12062, the first transfer The unit 1205 is coupled to the first moving arm 12051 to assemble the first extractor 12052 for taking the electronic component and performing XYZ axial displacement, so as to be transferred between the first and second loading stations 1201 and 1203 and the feeding device 90. The electronic component is measured, and the second transfer unit 1206 is attached to the second movable arm 12061 for mounting electronic components. The second ejector 12062 of the axial displacement of the XYZ transfers the electronic components that have been tested between the first and second discharge stages 1202, 1204 and the receiving device 100, and the conveying device 120 is disposed at the testing device 110. a third transfer unit 1207 having a third moving arm 12073 and a third presser 12076, and a fourth transfer unit 1208 having a fourth moving arm 12083 and a fourth extractor 12086, and a third transfer unit 1207 The third lifting drive source 12071 is provided, and the third lifting drive source 12071 drives a third moving arm 12073 which can be T-shaped or L-shaped for Z-axis displacement via the third lifting and lowering drive group 12072. In this embodiment, The third moving arm 12073 is T-shaped, and is provided with a third presser 12076 underneath, and the third transfer unit 1207 is provided with a third horizontal driving source 12074, and the third horizontal driving source 12074 is driven by the third horizontal The group 12075 drives the third moving arm 12073 and the third pressure extractor 12076 to perform Y-axis displacement to transfer and depress electronic components between the first inlet and outlet loading stages 1201, 1202 and the test socket 1102, and the fourth shift The carrier unit 1208 is provided with a fourth lifting drive source 12081, and the fourth lifting drive source 12081 is driven by the fourth lifting drive. 12082 drives a fourth moving arm 12083 which can be T-shaped or L-shaped for Z-axis displacement. In this embodiment, the fourth moving arm 12083 is T-shaped, and a fourth pressure extractor 12086 is disposed below. The fourth transfer unit 1208 is further provided with a fourth horizontal driving source 12084, and the fourth horizontal driving source 12084 drives the fourth moving arm 12083 and the fourth pressing unit 12086 to perform Y-axis displacement via the fourth horizontal transmission group 12085. Transferring and depressing electronic components between the second inlet and outlet stages 1203, 1204 and the test socket 1102; at least one floating device 40 identical to the floating device (please refer to Figures 3 and 4) is assembled for transport Between the moving arm of the device 120 and the presser, the floating device 40 and the Z-axis floating, XY axial displacement and θ angle adjustment pressing angle of the engaging member and the presser are in the third embodiment. A floating device 40 of the same floating device is mounted between the third moving arm 12073 and the third extractor 12076 of the transfer unit 1207, between the fourth moving arm 12083 and the fourth extractor 12086 of the fourth transfer unit 1208. Another floating device 40A equipped with the same floating device as above, the empty device 130 is used Feed means accommodating empty tray 9190, the empty trays 91 and added to a rewinding device 100 for containing the finished test electronic components.
請參閱第13圖，於執行檢測作業時，第一移載單元1205係控制第一移動臂12051帶動第一壓取器12052作X-Y軸向位移至供料裝置90處，並使第一壓取器12052作Z軸向位移而於供料裝置90之料盤91中取出待測之電子元件140；請參閱第14圖，於取料後，第一移載單元1205之第一移動臂12051帶動第一壓取器12052作X-Y軸向位移至第一入料載台1201處，並使第一壓取器12052作Z軸向位移將待測之電子元件140置入於第一入料載台1201；請參閱第12、15圖(請配合參閱第16、17、18、19圖)，第一入料載台1201即作X軸向位移將待測之電子元件140載送至測試裝置110之一方，第三移載單元1207之第三水平驅動源12074經第三水平傳動組12075帶動第三移動臂12073及浮動裝置40作Y軸向位移至第一入料載台1201之上方，接著控制第三升降驅動源12071經第三升降傳動組12072而帶動第三移動臂12073及浮動裝置40作Z軸向位移，使第三壓取器12076於第一入料載台1201上取出待測之電子元件140，再帶動第三壓取器12076作Y-Z軸向位移將待測之電子元件140移載置入於測試座1102，若電子元件140與測試座1102具有水平向之微小置入誤差，可於電子元件140受測試座1102之頂推導引作微小偏移時，利用浮動裝置40之連結部件422上的珠體425沿作動部件421上之錐槽4241位移，並令珠體425壓縮彈簧426，使得接合部件423、第三壓取器12076及電子元件140可作X-Y軸向位移調整，並利用水平保持器428輔助平穩水平位移，以便利將電子元件140置入於測試座1102，當第三壓取器12076壓抵電子元件140執行測試作業時，電子元件140會對第三壓取器12076產生反作用力，此一反作用力經第三壓取器12076將頂推帶動接合部件423、連結部件422及作動部件421作Z軸向向上位移，由於作動部件421與本體41間具有緩衝浮動空間，使得作動部件421可壓抵膜片43作Z軸向浮動位移，使得接合部件423可以使用較小之下壓力經第三壓取器12076壓抵電子元件140，即可產生浮動緩衝作用，當第三壓取器12076因電子元件140之膠體厚度不一或第三移動臂12073變形而無法使電子元件140平均受力時，由於作動部件421作Z軸向浮動位移時會帶動各導引部件429上移，使各導引部件429之頂抵面4291脫離本體41之導移孔412的擋面4121，而解除作動部件421限位，使得第三壓取器12076壓抵電子元件140時，可隨電子元件140之角度而帶動接合部件423、連結部件422及作動部件421作θ角傾斜調整壓抵角度，令第三壓取器12076貼合下壓電子元件140，使各電子元件140受力平均而執行測試作業，之後，測試裝置110之測試電路板1101係將測試訊號傳輸至測試器，測試器再將測試結果傳輸至中央控制裝置；請參閱第12、20圖，於測試完畢後，第三移載單元1207之第三移動臂12073係帶動第三壓取器12076及浮動裝置40作Y-Z軸向位移，將測試座1102內完測之電子元件140移載置入於第一出料載台1202上，此時，第四移載單元1208之第四移動臂12083帶動第四壓取器12086及浮動裝置40A作Y-Z軸向位移，浮動裝置40A可使第四壓取器12086作Z軸向浮動、X-Y軸向位移及θ角調整壓抵角度，將下一待測之電子元件141置入於測試座1102內；請參閱第21圖，第一出料載台1202即載出完測之電子元件140，第二移載單元1206之第二移動臂12061帶動第二壓取器12062作X-Y-Z軸向位移，於第一出料載台1202上取出完測之電子元件140，並移載至收料裝置100處，依測試結果，將完測之電子元件140置入於收料裝置100之料盤101中，以完成分類收置作業。Referring to FIG. 13 , when performing the detecting operation, the first transfer unit 1205 controls the first moving arm 12051 to drive the first extractor 12052 to XY axial displacement to the feeding device 90, and makes the first pressing The device 12052 takes the Z-axis displacement and takes out the electronic component 140 to be tested in the tray 91 of the feeding device 90; referring to FIG. 14, after the reclaiming, the first moving arm 12051 of the first transfer unit 1205 drives The first presser 12052 is axially displaced to the first loading stage 1201, and the first pressurer 12052 is displaced in the Z-axis to place the electronic component 140 to be tested on the first loading stage. 1201; Please refer to Figures 12 and 15 (please refer to Figures 16, 17, 18, 19). The first loading stage 1201 is used for X-axis displacement to carry the electronic component 140 to be tested to the testing device 110. In one aspect, the third horizontal driving source 1274 of the third transfer unit 1207 drives the third moving arm 12073 and the floating device 40 to be axially displaced to the upper side of the first loading stage 1201 via the third horizontal transmission group 12075, and then Controlling the third lifting drive source 12071 via the third lifting gear set 12072 to drive the third moving arm 12073 and the floating device 40 as the Z axis Displacement, the third presser 12076 takes out the electronic component 140 to be tested on the first loading stage 1201, and then drives the third presser 12076 to perform YZ axial displacement to transfer the electronic component 140 to be tested. In the test socket 1102, if the electronic component 140 and the test socket 1102 have a slight inset error in the horizontal direction, the connecting component 422 of the floating device 40 can be utilized when the electronic component 140 is slightly deflected by the push of the test socket 1102. The upper bead body 425 is displaced along the tapered groove 4241 on the actuating member 421, and the bead body 425 compresses the spring 426, so that the engaging member 423, the third presser 12076 and the electronic component 140 can be adjusted for XY axial displacement and utilized. The horizontal holder 428 assists in smooth horizontal displacement to facilitate placement of the electronic component 140 in the test socket 1102. When the third crimper 12076 is pressed against the electronic component 140 to perform a test operation, the electronic component 140 will be placed on the third crimper 12076. A reaction force is generated, and the reaction force is displaced in the Z-axis direction by the third pusher 12076, and the movable member 421 and the body 41 have a buffer floating space. Make The actuating member 421 can be pressed against the diaphragm 43 for Z-axis floating displacement, so that the engaging member 423 can be pressed against the electronic component 140 by the third lower presser 12076 using a lower pressure, thereby generating a floating buffering effect, when the third When the pressure of the electronic component 140 is different or the third moving arm 12073 is deformed, the electronic component 140 cannot be subjected to an average force. When the actuating member 421 is displaced in the Z-axis direction, the guiding members 429 are driven. Shifting, the abutting surface 4291 of each guiding member 429 is disengaged from the blocking surface 4121 of the guiding hole 412 of the body 41, and the releasing member 421 is released, so that when the third crimper 12076 is pressed against the electronic component 140, The angle of the electronic component 140 drives the joint member 423, the joint member 422, and the actuating member 421 to adjust the pressing angle of the θ angle, so that the third presser 12076 is pressed against the electronic component 140, and the electronic components 140 are subjected to force average. After the test operation is performed, the test circuit board 1101 of the test device 110 transmits the test signal to the tester, and the tester transmits the test result to the central control device; see Figures 12 and 20, after the test is completed, The third moving arm 12073 of the three transfer unit 1207 drives the third presser 12076 and the floating device 40 to perform YZ axial displacement, and the electronic component 140 in the test socket 1102 is transferred and placed in the first discharge load. On the stage 1202, at this time, the fourth moving arm 12083 of the fourth transfer unit 1208 drives the fourth presser 12086 and the floating device 40A to perform YZ axial displacement, and the floating device 40A can make the fourth presser 12086 as the Z axis. Adjusting the pressing angle to the floating, XY axial displacement and θ angle, and placing the next electronic component 141 to be tested into the test socket 1102; referring to Fig. 21, the first discharging stage 1202 is loaded and tested. The electronic component 140, the second moving arm 12061 of the second transfer unit 1206 drives the second presser 12062 to perform XYZ axial displacement, and the measured electronic component 140 is taken out on the first discharge stage 1202 and transferred. To the receiving device 100, according to the test result, the completed electronic component 140 is placed in the tray 101 of the receiving device 100 to complete the sorting and collecting operation.
請參閱第22圖，係為本發明浮動裝置之另一實施例，該浮動裝置40B包含有本體41B及至少一浮動器42B，並於本體41B與浮動器42B間設有可彈性變形之膜片43B，膜片43B與本體41B間則設有可容納流體之容室，使浮動器42B作Z軸向浮動位移，更進一步，容室之一側係連通可注入流體之流體注入口，流體注入口則連通可供流體流動之流道，於本實施例中，該流體係為氣體，該浮動器42B包含有作動部件421B及接合部件423B，作動部件421B係位於本體41B內，並與本體41B間設有可彈性變形之膜片43B，膜片43B與本體41B間則設有可注入氣體之容室，該本體41B係設有可注入氣體之流體注入口411B，流體注入口411則連通容室，另於本體41B之上方裝配具流道之面板，面板可為獨立之板體，或為移動臂之連接板，使面板之流道連通流體注入口411B及流體供應源(圖未示出)，於本實施例中，面板44B係為獨立之板體，並開設有連通流體供應源之流道441B，面板44B係裝配於本體41B之頂面，使本體41B之流體注入口411B經面板44B之流道441B而連通流體供應源，又本體41B係於容室內相對膜片43B上方之適當位置設有具至少一氣孔4131B之限位件413B，用以限制浮動器42B之浮動位移量，於容室注入氣體後，可使膜片43B向下凸伸變形，並頂推浮動器42B之作動部件421B作Z軸向向下位移，另浮動裝置40B係於本體41B與浮動器42B間設有角度調整機構，角度調整機構係於本體41B設有具錐度擋面4121B的導移孔412B，導移孔412B可呈多邊形錐孔，例如四角錐孔，並於浮動器42B之作動部件421B下方設有可與導移孔412B之擋面4121B相互配合之具錐度頂抵面4291B的導引部件429B，導引部件429B可呈多邊形錐狀，例如四角錐柱，可與呈四角錐孔之導移孔412B相互配合，用以防止浮動器42B轉動，又浮動器40B之整體形狀簡易而可微型化，浮動器42B於導引部件429B之下方設有至少一接合部件423B，接合部件423B可作為下壓治具，或裝配壓取器，於本實施例中，係於本體41B設有至少一連通抽氣裝置(圖未示出)之抽氣管路414B，並於浮動器42B之接合部件423B內開設有至少一連通作動部件421B及導引部件429B之抽氣流道4231B，並於本體41B與作動部件421B底面間設有防洩元件，又可視作動部件421B之厚度，而設計抽氣流道4231B是否貫通至作動部件421B之頂面，由於導引部件429B係設於作動部件421B與接合部件423B間，並與導移孔412B相互配合，進而可大幅縮小體積，而為一微小型浮動器42B，於接合部件423B帶動作動部件421B作Z軸向浮動位移時，可使導引部件429B之頂抵面4291B脫離導移孔412B之擋面4121B，使得接合部件423B作θ角調整壓抵角度，以利電子元件受力平均而執行測試作業；再者，由於浮動器42B係微型化，浮動裝置40B可視使用所需，於膜片43B之下方配置有複數個浮動器42B，使複數個浮動器42B可頂壓膜片43B作Z軸向緩衝浮動，另於各浮動器42B與本體41B間分別設有角度調整機構，使各浮動器42B可作θ角調整壓抵角度。Referring to FIG. 22, it is another embodiment of the floating device of the present invention. The floating device 40B includes a body 41B and at least one floater 42B, and an elastically deformable diaphragm is disposed between the body 41B and the floater 42B. 43B, between the diaphragm 43B and the body 41B, there is a chamber for accommodating the fluid, so that the floater 42B is displaced in the Z-axis direction. Further, one side of the chamber is connected to the fluid injection port for injecting the fluid, and the fluid is injected. The inlet is connected to a flow passage for fluid flow. In the embodiment, the flow system is a gas. The floater 42B includes an actuating member 421B and a joint member 423B. The actuating member 421B is located in the body 41B and is coupled to the body 41B. An elastically deformable diaphragm 43B is disposed between the diaphragm 43B and the body 41B, and a gas injection chamber 411B is provided. The fluid injection port 411 is connected to the fluid inlet 411B. And a panel with a flow channel is arranged on the upper part of the body 41B. The panel can be a separate plate body or a connecting plate of the moving arm, so that the flow channel of the panel communicates with the fluid injection port 411B and the fluid supply source (not shown) ), in this embodiment, the surface The plate 44B is a separate plate body, and is provided with a flow passage 441B that communicates with a fluid supply source. The panel 44B is mounted on the top surface of the body 41B, so that the fluid injection port 411B of the body 41B communicates with the fluid through the flow passage 441B of the panel 44B. The supply source, and the body 41B is disposed at a position above the diaphragm 43B in the chamber, and is provided with a limiting member 413B having at least one air hole 4131B for limiting the floating displacement of the floating device 42B, after the gas is injected into the chamber. The diaphragm 43B is convexly deformed downward, and the actuating member 421B of the flip-flop 42B is pushed to be displaced downward in the Z-axis. The floating device 40B is provided with an angle adjusting mechanism between the body 41B and the floater 42B, and the angle adjusting mechanism is provided. The main body 41B is provided with a guiding hole 412B having a taper surface 4121B. The guiding hole 412B can be a polygonal taper hole, for example, a quadrangular pyramid hole, and a guiding hole 412B is disposed under the actuating member 421B of the floater 42B. The guiding surface 4121B is matched with the guiding member 429B of the tapered abutting surface 4291B. The guiding member 429B can have a polygonal pyramid shape, for example, a quadrangular pyramid column, and can cooperate with the guiding hole 412B of the quadrangular pyramid hole for mutual cooperation. Prevent the floater 42B from rotating and floating The overall shape of the device 40B is simple and miniaturized, and the floater 42B is provided with at least one engaging member 423B below the guiding member 429B. The engaging member 423B can be used as a pressing tool or a presser, in this embodiment. The body 41B is provided with at least one air suction line 414B that communicates with an air extracting device (not shown), and at least one of the communication actuating member 421B and the guiding member 429B is opened in the engaging member 423B of the floater 42B. The air flow path 4231B is provided with a deflation element between the main body 41B and the bottom surface of the actuating member 421B, and the thickness of the movable member 421B can be regarded as the thickness of the moving member 421B, and whether the suction air flow path 4231B is designed to penetrate to the top surface of the actuating member 421B, since the guiding member 429B is It is disposed between the actuating member 421B and the engaging member 423B, and is engaged with the guiding hole 412B, thereby further reducing the volume, and is a micro-small floater 42B. When the engaging member 423B is provided with the moving member 421B for the Z-axis floating displacement The abutting surface 4291B of the guiding member 429B can be disengaged from the blocking surface 4121B of the guiding hole 412B, so that the engaging member 423B adjusts the pressing angle by θ angle, so that the electronic component is subjected to the force average to perform the testing operation; Since the floater 42B is miniaturized, the floating device 40B can be used as needed, and a plurality of floaters 42B are disposed under the diaphragm 43B, so that the plurality of floaters 42B can press the diaphragm 43B for Z-axis buffer floating. Further, an angle adjusting mechanism is respectively disposed between each of the floaters 42B and the body 41B, so that each of the floaters 42B can adjust the pressing angle by the angle θ.
請參閱第23圖，浮動裝置40B之面板44B可裝配於移載單元之移動臂51A下方，並以接合部件423B吸附待測之電子元件60，當移動臂51A帶動浮動裝置40B位移，而使接合部件423B將待測之電子元件60置入壓抵於測試座70執行測試作業時，電子元件60會對接合部件423B產生反作用力，此一反作用力將頂推帶動作動部件421B作Z軸向向上位移，由於作動部件421B與本體41B間具有緩衝浮動空間，使得作動部件421B可壓抵膜片43B而作Z軸向浮動位移，並令導引部件429B同步上移，導引部件429B之頂抵面4291B即脫離本體41B之導移孔412B的擋面4121B，使得接合部件423B於下壓過程中，僅需較小之力矩即可產生浮動緩衝作用，若接合部件423B因電子元件60之膠體厚度不一或移動臂51A變形而無法使電子元件60平均受力時，由於角度調整機構之導引部件429B的頂抵面4291B已脫離本體41B之導移孔412B的擋面4121B，而解除作動部件421B限位，使得接合部件423B壓抵電子元件60時，可隨電子元件60之角度而帶動作動部件421B及導引部件429B作θ角傾斜調整壓抵角度，令接合部件423B貼合電子元件60，使各電子元件60受力平均而執行測試作業，達到提升測試品質之實用效益。Referring to Fig. 23, the panel 44B of the floating device 40B can be mounted under the moving arm 51A of the transfer unit, and the electronic component 60 to be tested is attracted by the engaging member 423B. When the moving arm 51A drives the floating device 40B to be displaced, the engaging member is engaged. When the component 423B puts the electronic component 60 to be tested into the test stand 70 to perform the test operation, the electronic component 60 generates a reaction force to the joint component 423B, and the reaction force pushes the push-action action component 421B to the Z-axis direction. The displacement has a buffering floating space between the actuating member 421B and the body 41B, so that the actuating member 421B can be pressed against the diaphragm 43B to perform a Z-axis floating displacement, and the guiding member 429B is synchronously moved upward, and the guiding member 429B is offset. The face 4291B is separated from the stop face 4121B of the guide hole 412B of the body 41B, so that the joint member 423B can generate a floating buffer effect only when a small torque is required during the pressing process, if the joint member 423B is due to the colloidal thickness of the electronic component 60. When the moving arm 51A is deformed and the electronic component 60 cannot be subjected to an average force, the abutting surface 41291B of the guiding member 429B of the angle adjusting mechanism has been separated from the blocking surface 41 of the guiding hole 412B of the body 41B. 21B, and the release actuating member 421B is restrained so that when the engaging member 423B is pressed against the electronic component 60, the actuating member 421B and the guiding member 429B can be brought to the θ-angle tilt adjustment pressing angle with the angle of the electronic component 60, so that the engaging member The 423B is attached to the electronic component 60, so that each electronic component 60 is subjected to a force average to perform a test operation, thereby achieving the practical benefit of improving the test quality.
10．．．浮動裝置10. . . Floating device
11．．．上蓋11. . . Upper cover
111．．．進氣孔111. . . Air intake
12．．．本體12. . . Ontology
13．．．活塞13. . . piston
131．．．O型環131. . . O-ring
132．．．錐槽132. . . Cone groove
14．．．保持器14. . . Holder
141．．．回位組141. . . Return group
142．．．彈簧142. . . spring
143．．．珠體143. . . Bead
15．．．連結座15. . . Link
20．．．浮動裝置20. . . Floating device
21．．．面板twenty one. . . panel
211．．．通氣口211. . . Vent
22．．．上蓋twenty two. . . Upper cover
23．．．膜片twenty three. . . Diaphragm
24．．．本體twenty four. . . Ontology
25．．．垂直向保持器25. . . Vertical retainer
26．．．作動塊26. . . Actuating block
261．．．回位柱261. . . Return column
262．．．錐槽262. . . Cone groove
27．．．連接塊27. . . Connector
28．．．底板28. . . Bottom plate
29．．．連結座29. . . Link
291．．．珠體291. . . Bead
292．．．彈簧292. . . spring
30．．．水平保持器30. . . Horizontal holder
31．．．接合部件31. . . Joint component
32．．．電子元件32. . . Electronic component
40、40A、40B．．．浮動裝置40, 40A, 40B. . . Floating device
41、41B．．．本體41, 41B. . . Ontology
411、411B．．．流體注入口411, 411B. . . Fluid injection port
412、412B．．．導移孔412, 412B. . . Guide hole
4121、4121B．．．擋面4121, 4121B. . . Face
413B．．．限位件413B. . . Limiter
4131B．．．氣孔4131B. . . Stomata
414B．．．抽氣管路414B. . . Suction line
42、42B．．．浮動器42, 42B. . . Floating device
421、421B．．．作動部件421, 421B. . . Actuating component
422．．．連結部件422. . . Connecting parts
423、423B．．．接合部件423, 423B. . . Joint component
4231B．．．抽氣流道4231B. . . Pumping airflow
424．．．回位件424. . . Return piece
4241．．．錐槽4241. . . Cone groove
425．．．珠體425. . . Bead
426．．．彈簧426. . . spring
427．．．推抵件427. . . Pushing piece
428．．．水平保持器428. . . Horizontal holder
429、429B．．．導引部件429, 429B. . . Guide member
4291、4291B．．．頂抵面4291, 4291B. . . Top surface
43、43B．．．膜片43, 43B. . . Diaphragm
44、44B．．．面板44, 44B. . . panel
441、441B．．．流道441, 441B. . . Runner
51、51A．．．移動臂51, 51A. . . Moving arm
52．．．壓取器52. . . Pressure extractor
60．．．電子元件60. . . Electronic component
70．．．測試座70. . . Test stand
80．．．機台80. . . Machine
90．．．供料裝置90. . . Feeding device
91．．．料盤91. . . Trays
100．．．收料裝置100. . . Receiving device
101．．．料盤101. . . Trays
110．．．測試裝置110. . . Test device
1101．．．測試電路板1101. . . Test board
1102．．．測試座1102. . . Test stand
120．．．輸送裝置120. . . Conveyor
1201．．．第一入料載台1201. . . First feeding stage
1202．．．第一出料載台1202. . . First discharge stage
1203．．．第二入料載台1203. . . Second feeding stage
1204．．．第二出料載台1204. . . Second discharge stage
1205．．．第一移載單元1205. . . First transfer unit
12051．．．第一移動臂12051. . . First moving arm
12052．．．第一壓取器12052. . . First press
1206．．．第二移載單元1206. . . Second transfer unit
12061．．．第二移動臂12061. . . Second moving arm
12062．．．第二壓取器12062. . . Second press
1207．．．第三移載單元1207. . . Third transfer unit
12071．．．第三升降驅動源12071. . . Third lifting drive source
12072．．．第三升降傳動組12072. . . Third lifting drive set
12073．．．第三移動臂12073. . . Third moving arm
12074．．．第三水平驅動源12074. . . Third horizontal drive source
12075．．．第三水平傳動組12075. . . Third horizontal drive set
12076．．．第三壓取器12076. . . Third pressure extractor
1208．．．第四移載單元1208. . . Fourth transfer unit
12081．．．第四升降驅動源12081. . . Fourth lifting drive source
12082．．．第四升降傳動組12082. . . Fourth lifting drive set
12083．．．第四移動臂12083. . . Fourth moving arm
12084．．．第四水平驅動源12084. . . Fourth horizontal drive source
12085．．．第四水平傳動組12085. . . Fourth horizontal drive set
12086．．．第四壓取器12086. . . Fourth presser
130．．．空匣裝置130. . . Open device
140、141．．．電子元件140, 141. . . Electronic component
第1圖：習知台灣第94210176號專利案之結構示意圖。Figure 1: Schematic diagram of the structure of the Japanese Patent No. 94210176.
第2圖：習知台灣第96108830號專利案之使用示意圖。Figure 2: Schematic diagram of the use of the patent No. 96108830 of Taiwan.
第3圖：本發明浮動裝置之示意圖(一)。Figure 3: Schematic diagram (1) of the floating device of the present invention.
第4圖：本發明浮動裝置之示意圖(二)。Figure 4: Schematic diagram (2) of the floating device of the present invention.
第5圖：本發明浮動裝置作X-Y位移調整之使用示意圖。Fig. 5 is a schematic view showing the use of the floating device of the present invention for X-Y displacement adjustment.
第6圖：本發明浮動裝置作Z軸向浮動位移之使用示意圖(一)。Figure 6: Schematic diagram of the use of the floating device of the present invention for Z-axis floating displacement (1).
第7圖：本發明浮動裝置作Z軸向浮動位移之使用示意圖(二)。Figure 7: Schematic diagram of the use of the floating device of the present invention for Z-axis floating displacement (2).
第8圖：本發明浮動裝置作θ角調整壓抵角度之使用示意圖。Fig. 8 is a schematic view showing the use of the floating device of the present invention for adjusting the angle of the θ angle.
第9圖：本發明浮動裝置各元件復位之使用示意圖(一)。Fig. 9 is a schematic view showing the use of the resetting of the components of the floating device of the present invention (1).
第10圖：本發明浮動裝置各元件復位之使用示意圖(二)。Figure 10: Schematic diagram of the use of the resetting of the components of the floating device of the present invention (2).
第11圖：本發明浮動裝置應用於測試分類機之示意圖。Figure 11: Schematic diagram of the floating device of the present invention applied to a test sorter.
第12圖：本發明第三、四移載單元及浮動裝置之示意圖。Figure 12 is a schematic view of the third and fourth transfer units and floating devices of the present invention.
第13圖：本發明測試分類機之使用示意圖(一)。Figure 13: Schematic diagram of the use of the test sorter of the present invention (1).
第14圖：本發明測試分類機之使用示意圖(二)。Figure 14: Schematic diagram of the use of the test sorter of the present invention (2).
第15圖：本發明測試分類機之使用示意圖(三)。Figure 15: Schematic diagram of the use of the test sorter of the present invention (3).
第16圖：係接合部件作X-Y位移調整之使用示意圖。Figure 16: Schematic diagram of the use of the X-Y displacement adjustment of the joint components.
第17圖：係接合部件作Z軸向浮動位移之使用示意圖。Figure 17: Schematic diagram of the use of the Z-axis floating displacement of the joint component.
第18圖：係接合部件作Z軸向浮動位移之使用示意圖。Figure 18: Schematic diagram of the use of the Z-axis floating displacement of the joint component.
第19圖：係接合部件作θ角調整壓抵角度之使用示意圖。Fig. 19 is a schematic view showing the use of the θ angle adjustment pressing angle of the joint member.
第20圖：本發明測試分類機之使用示意圖(四)。Figure 20: Schematic diagram of the use of the test sorter of the present invention (4).
第21圖：本發明測試分類機之使用示意圖(五)。Figure 21: Schematic diagram of the use of the test sorter of the present invention (5).
第22圖：本發明浮動裝置之另一實施例。Figure 22: Another embodiment of the floating device of the present invention.
第23圖：本發明浮動裝置另一實施例之使用示意圖。Figure 23 is a schematic view showing the use of another embodiment of the floating device of the present invention.
40．．．浮動裝置40. . . Floating device
41．．．本體41. . . Ontology
412．．．導移孔412. . . Guide hole
4121．．．擋面4121. . . Face
42．．．浮動器42. . . Floating device
421．．．作動部件421. . . Actuating component
422．．．連結部件422. . . Connecting parts
423．．．接合部件423. . . Joint component
428．．．水平保持器428. . . Horizontal holder
429．．．導引部件429. . . Guide member
4291．．．頂抵面4291. . . Top surface
44．．．面板44. . . panel
Claims (6)
Priority Applications (1)
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| TW101110175A TWI445963B (en) | 2012-03-23 | 2012-03-23 | Floating devices and their application test equipment |
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|---|---|---|---|
| TW101110175A TWI445963B (en) | 2012-03-23 | 2012-03-23 | Floating devices and their application test equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI609738B (en) * | 2016-06-24 | 2018-01-01 | Electronic component pressing mechanism with shaft angle adjusting mechanism and test classification device thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI575646B (en) * | 2014-10-24 | 2017-03-21 | Hon Tech Inc | The monitoring unit of the electronic component moving mechanism and the operating equipment for its application |
| TWI579567B (en) * | 2015-12-31 | 2017-04-21 | 鴻勁科技股份有限公司 | Test stand and its application test equipment |
| CN114325208A (en) * | 2020-09-30 | 2022-04-12 | 鸿劲精密股份有限公司 | Modularized testing device and testing equipment applied by same |
| TWI800331B (en) * | 2022-03-25 | 2023-04-21 | 鴻勁精密股份有限公司 | Pressing mechanism having pressure detecting unit and handler |
| CN117129715B (en) * | 2023-06-30 | 2024-05-10 | 盛吉盛智能装备(江苏)有限公司 | Floating device for chip test |
-
2012
- 2012-03-23 TW TW101110175A patent/TWI445963B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI609738B (en) * | 2016-06-24 | 2018-01-01 | Electronic component pressing mechanism with shaft angle adjusting mechanism and test classification device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201339588A (en) | 2013-10-01 |
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