TW202016549A

TW202016549A - Electronic component transfer device with positioning function, testing apparatus having the same and transfer method thereof

Info

Publication number: TW202016549A
Application number: TW107136133A
Authority: TW
Inventors: 何學威; 陳瑞雄; 鄭允睿
Original assignee: 致茂電子股份有限公司
Priority date: 2018-10-15
Filing date: 2018-10-15
Publication date: 2020-05-01
Also published as: TWI674411B

Abstract

The present invention relates to an electronic component transfer device with a positioning function, an inspection apparatus including the device, and a transfer method thereof. The device generally comprises a pick-and-place head and a positioning push block. The pick-and-place head comprises a suction section, which is used to pick up and place an electronic component. Further, the positioning push block is arranged on the pick-and-place head and located at one side of the suction section, wherein when the pick-and-place head sucks up an electronic component with the suction section, the positioning push block pushes against the electronic component for being positioned at a predetermined location on the pick-and-place head. In other words, the present invention includes a positioning push block arranged on the pick-and-place head and uses the positioning push block to push against an electronic component for positioning during a transfer process of the electronic component. Further, the electronic component is constantly kept at the specific position, whether in a transfer process or a testing process of the electronic component, so as to enhance the yield of inspection.

Description

具定位功能之電子元件移載裝置、具備該裝置之檢測設備及其移載方法 Electronic component transfer device with positioning function, detection equipment with the device and transfer method thereof

本發明係關於一種具定位功能之電子元件移載裝置、具備該裝置之檢測設備及其移載方法，尤指一種適用於移載待測或完測電子元件之移載裝置和移載方法，以及具備該裝置或使用該方法之檢測設備。 The invention relates to an electronic component transfer device with positioning function, a detection device equipped with the device, and a transfer method thereof, in particular to a transfer device and a transfer method suitable for transferring electronic components to be tested or tested, And detection equipment equipped with the device or using the method.

就現有的電子元件檢測設備而言，電子元件之取放(Pick and place)裝置扮演著不可或缺之角色，其負責將待測電子元件自料盤(tray)或移載梭(shuttle)上移載至測試裝置(socket)，且亦負責將完測電子元件自測試裝置移載至料盤或移載梭。 As far as the existing electronic component testing equipment is concerned, the pick and place device of electronic components plays an indispensable role. It is responsible for the electronic components to be tested from the tray or the shuttle Transfer to the test device (socket), and also responsible for transferring the tested electronic components from the test device to the tray or transfer shuttle.

再者，以目前現有技術而言，取放裝置只能單純進行移載、取放，且只能將電子元件置於晶片插槽之中央位置，無法對電子元件作特定位置之定位。然而，針對某些特定的測試裝置，其晶片插槽內之特定位置具有較佳的檢測良率，例如緊靠於晶片插槽之一側邊，故對於容置於晶片插槽內之電子元件的定位需求孕育而生。 In addition, with the current prior art, the pick-and-place device can only carry out transfer and pick-and-place, and can only place the electronic component in the central position of the chip socket, and cannot locate the electronic component at a specific position. However, for some specific test devices, the specific position in the chip socket has better detection yield, for example, close to one side of the chip socket, so for electronic components accommodated in the chip socket The positioning needs were born.

由此可知，一種構造簡單、可靠、且成本低廉，又可精準定位之電子元件移載裝置、具備該裝置之檢測設備及其移載方法，實為產業界之迫切需求。 It can be seen from this that an electronic component transfer device with simple structure, reliable, low cost, and accurate positioning, a detection device equipped with the device, and a transfer method thereof are really urgent demands of the industry.

本發明之主要目的係在提供一種具定位功能之電子元件移載裝置、具備該裝置之檢測設備及其移載方法，俾能在移載裝置上且在移載過程中對電子元件完成定位；而且，不論是在電子元件的移載過程或測試過程中，電子元件始終保持定位於特定位置，進而提高檢測良率。 The main purpose of the present invention is to provide an electronic component transfer device with a positioning function, a detection device equipped with the device, and a transfer method thereof, so that the electronic component can be positioned on the transfer device and during the transfer process; Moreover, no matter in the process of transferring or testing the electronic components, the electronic components always remain positioned at a specific position, thereby improving the detection yield.

為達成上述目的，本發明一種具定位功能之電子元件移載裝置，主要包括取放頭、以及定位推塊，而取放頭設有吸取部，該吸取部係用於取放電子元件；另外，定位推塊設置於取放頭上並位於吸取部之一側；其中，當取放頭以吸取部吸取電子元件時，定位推塊推抵電子元件使其定位於取放頭上之一預定位置。 In order to achieve the above object, the present invention provides an electronic component transfer device with a positioning function, which mainly includes a pick-and-place head and a positioning push block, and the pick-and-place head is provided with a suction portion, which is used to pick and place electronic components; The positioning push block is provided on the pick-and-place head and is located on one side of the suction part; wherein, when the pick-and-place head sucks the electronic component with the suction part, the positioning push block pushes against the electronic component to position it at a predetermined position on the pick-and-place head.

由此可知，本發明在取放頭上設置一定位推塊，並於電子元件的移載過程中，由定位推塊推抵電子元件，以讓其定位。據此，本發明構造相當簡單，且相當可靠，使用壽命長；更重要的是，此一定位功能不需額外作業時間，亦即完全不會因為具備定位功能而降低設備的檢測效率。 It can be seen that the present invention provides a positioning push block on the pick-and-place head, and during the transfer process of the electronic component, the positioning push block is pushed against the electronic component to allow it to be positioned. According to this, the present invention has a relatively simple structure, is quite reliable, and has a long service life; more importantly, this positioning function does not require additional work time, that is, it does not reduce the detection efficiency of the device because of the positioning function.

較佳的是，本發明具定位功能之電子元件移載裝置可更包括致動件，其用於驅使定位推塊推抵電子元件；另外，本發明之定位推塊可為一L型定位推塊，其可包括推抵端、施力端、及折角部，而折角部可樞接於取放頭，推抵端可鄰近於吸取部，且致動件可組設於施力端與取放頭之間。據此，本發明只要透過致動件來驅動施力端，即可造成推抵端推抵電子元件使之定位，抑或釋放電子元件。此外，致動件可為如壓縮彈簧之彈性構件、或其他可驅使定位推塊移動之等效構件。 Preferably, the electronic component transfer device with positioning function of the present invention may further include an actuator for driving the positioning push block to push against the electronic component; in addition, the positioning push block of the present invention may be an L-shaped positioning push Piece, It may include a pushing end, a forcing end, and a corner portion, and the corner portion may be pivotally connected to the pick-and-place head, the pushing end may be adjacent to the sucking portion, and the actuating member may be disposed between the forcing end and the pick-and-place head. According to this, as long as the force-applying end is driven by the actuating member, the pushing end can be pushed against the electronic component to position it, or the electronic component can be released. In addition, the actuating member may be an elastic member such as a compression spring, or other equivalent member that can drive the positioning push block to move.

為達成前述目的，本發明一種檢測設備，主要包括如前段所述具定位功能之電子元件移載裝置、承載裝置、及測試裝置；承載裝置係用於裝載待測或完測之電子元件，測試裝置係用於測試電子元件；其中，電子元件移載裝置係用於自承載裝置取出電子元件並置入測試裝置、以及自測試裝置取出電子元件並置入承載裝置中至少一者。 In order to achieve the foregoing objective, a testing device of the present invention mainly includes an electronic component transfer device with a positioning function, a carrying device, and a testing device as described in the preceding paragraph; the carrying device is used to load electronic components to be tested or tested, and test The device is used for testing electronic components; wherein, the electronic component transfer device is used for at least one of taking out electronic components from the carrying device and placing them in the testing device, and taking out electronic components from the testing device and placing them in the carrying device.

再者，在本發明之承載裝置可包括凸塊部；當電子元件移載裝置自承載裝置取得電子元件或將電子元件置入承載裝置時，凸塊部可推動電子元件移載裝置之定位推塊，以使電子元件得以定位，或得以放置電子元件於承載裝置。換言之，本發明利用移載裝置與承載裝置接觸時，由承載裝置之凸塊部去啟動該定位推塊，以讓電子元件定位或釋放電子元件，毫不影響測試或移載效率。 Furthermore, the carrier device of the present invention may include a bump portion; when the electronic component transfer device obtains an electronic component from the carrier device or places the electronic component into the carrier device, the bump portion may push the positioning push of the electronic component transfer device Block so that the electronic component can be positioned or placed on the carrier. In other words, in the present invention, when the transfer device is in contact with the carrier device, the positioning push block is activated by the convex portion of the carrier device to allow the electronic component to locate or release the electronic component without affecting the test or transfer efficiency.

此外，本發明之測試裝置可包括一容槽；而當電子元件移載裝置將電子元件置入測試裝置時，定位推塊位於容槽內。亦即，藉由容槽之設置，使測試裝置不致於啟動或阻礙該定位推塊，而使電子元件置入測試裝置時仍處於定位狀態。 In addition, the testing device of the present invention may include a container; when the electronic component transfer device places the electronic component into the testing device, the positioning push block is located in the container. That is to say, by setting the receiving slot, the test device will not start or block the positioning push block, and the electronic component is still in the positioning state when placed in the test device.

為達成前述目的，本發明一種電子元件移載方法，包括以下步驟：(A)取放頭之吸取部自承載裝置吸取電子元件；以及(B)定位推塊推抵吸取部所吸取之電子元件使其定位於取放頭上之預定位置；其中，定位推塊係設置於取放頭上並位於吸取部之一側。 To achieve the foregoing objective, an electronic component transfer method of the present invention includes the following steps: (A) the suction portion of the pick-and-place head sucks the electronic component from the carrying device; and (B) the positioning push block is pushed against the electronic component sucked by the suction portion It is positioned at a predetermined position on the pick-and-place head; wherein the positioning push block is arranged on the pick-and-place head and is located on one side of the suction part.

較佳的是，該步驟(A)可包括：(A1)吸取部自承載裝置吸取電子元件，且定位推塊之至少一部分可位於電子元件與取放頭之間；(A2)承載裝置之凸塊部推動定位推塊，而定位推塊之至少一部分可移出電子元件與取放頭之間；以及(A3)承載裝置之凸塊部釋放定位推塊，而定位推塊之至少一部分可抵接於電子元件之一側。 Preferably, this step (A) may include: (A1) the suction part sucks the electronic component from the carrier device, and at least a part of the positioning push block may be located between the electronic component and the pick-and-place head; (A2) the convexity of the carrier device The block pushes the positioning push block, and at least a part of the positioning push block can be moved out between the electronic component and the pick-and-place head; and (A3) the convex portion of the carrying device releases the positioning push block, and at least a part of the positioning push block can abut On one side of the electronic component.

此外，本發明電子元件移載方法中，於該步驟(B)之後更包括一步驟(C)，即取放頭可將電子元件置入測試裝置；其中，取放頭之吸取部可持續吸取電子元件，而定位推塊可容置於測試裝置之一容槽內。藉此，不論在電子元件置入測試裝置前或置入之後，定位推塊皆可持續對電子元件定位。 In addition, in the electronic component transfer method of the present invention, after this step (B), a step (C) is further included, that is, the pick-and-place head can place the electronic component into the test device; wherein, the pick-up portion of the pick-and-place head can continuously suck Electronic components, and the positioning push block can be accommodated in one of the receiving devices of the test device. In this way, the positioning push block can continue to position the electronic component whether before or after the electronic component is placed in the test device.

1‧‧‧電子元件移載裝置 1‧‧‧Electronic component transfer device

11‧‧‧安裝座 11‧‧‧Mount

12‧‧‧連接塊 12‧‧‧Connecting block

2‧‧‧取放頭 2‧‧‧ pick and place head

21‧‧‧吸取部 21‧‧‧Suction Department

210‧‧‧負壓通道 210‧‧‧Negative pressure channel

22‧‧‧支承銷 22‧‧‧support pin

3‧‧‧定位推塊 3‧‧‧Positioning push block

31‧‧‧推抵端 31‧‧‧ Push to the end

310‧‧‧頂塊 310‧‧‧Top block

32‧‧‧施力端 32‧‧‧Forcing end

33‧‧‧折角部 33‧‧‧Folded corner

4‧‧‧致動件 4‧‧‧actuator

C‧‧‧電子元件 C‧‧‧Electronic components

S‧‧‧測試裝置 S‧‧‧Test device

Sc‧‧‧容槽 Sc‧‧‧Capacity

T‧‧‧承載裝置 T‧‧‧ bearing device

Tb‧‧‧凸塊部 Tb‧‧‧Bump

Ft‧‧‧撐張力 Ft‧‧‧ Tension

Fp‧‧‧側向推力 Fp‧‧‧Lateral thrust

Li‧‧‧電子元件之中心線 Li‧‧‧Centerline of Electronic Components

Lc‧‧‧取放頭之中心線 Lc‧‧‧ Center line of pick and place head

St‧‧‧晶片容置槽 St‧‧‧chip receiving slot

圖1係本發明電子元件移載裝置一較佳實施例之分解圖。 FIG. 1 is an exploded view of a preferred embodiment of the electronic component transfer device of the present invention.

圖2係本發明電子元件移載裝置一較佳實施例之立體圖。 2 is a perspective view of a preferred embodiment of the electronic component transfer device of the present invention.

圖3係本發明電子元件移載裝置一較佳實施例之剖視圖。 3 is a cross-sectional view of a preferred embodiment of the electronic component transfer device of the present invention.

圖4A至圖4D係本發明檢測設備一較佳實施例之作動剖視圖。 4A to 4D are action cross-sectional views of a preferred embodiment of the detection device of the present invention.

圖5A係本發明電子元件移載裝置吸取電子元件後之仰視圖。 FIG. 5A is a bottom view of the electronic component transfer device of the present invention after absorbing electronic components.

圖5B係本發明電子元件移載裝置吸取電子元件後之剖視圖。 5B is a cross-sectional view of the electronic component transfer device of the present invention after absorbing electronic components.

圖6A係本發明電子元件移載裝置與測試裝置呈分離狀態之立體圖。 6A is a perspective view of the electronic device transfer device and the testing device of the present invention in a separated state.

圖6B係本發明電子元件移載裝置與測試裝置呈結合狀態之剖視圖。 6B is a cross-sectional view of the electronic device transfer device and the test device of the present invention in a combined state.

本發明具定位功能之電子元件移載裝置、具備該裝置之檢測設備及其移載方法在本實施例中被詳細描述之前，要特別注意的是，以下的說明中，類似的元件將以相同的元件符號來表示。再者，本發明之圖式僅作為示意說明，其未必按比例繪製，且所有細節也未必全部呈現於圖式中。 Before the electronic device transfer device with positioning function, the detection device provided with the device, and the transfer method thereof are described in detail in this embodiment, it should be particularly noted that in the following description, similar elements will be the same The symbol of the component. Furthermore, the drawings of the present invention are only for illustrative purposes, they are not necessarily drawn to scale, and all the details are not necessarily presented in the drawings.

請同時參閱圖1、圖2、及圖3，圖1係本發明電子元件移載裝置一較佳實施例之分解圖，圖2係本發明電子元件移載裝置一較佳實施例之立體圖，圖3係本發明電子元件移載裝置一較佳實施例之剖視圖。如圖中所示，本實施例之電子元件移載裝置1主要包括取放頭2、定位推塊3、安裝座11、以及連接塊12。 Please refer to FIGS. 1, 2 and 3 at the same time. FIG. 1 is an exploded view of a preferred embodiment of the electronic component transfer device of the present invention, and FIG. 2 is a perspective view of a preferred embodiment of the electronic component transfer device of the present invention. 3 is a cross-sectional view of a preferred embodiment of the electronic component transfer device of the present invention. As shown in the figure, the electronic component transfer device 1 of this embodiment mainly includes a pick-and-place head 2, a positioning push block 3, a mounting base 11, and a connecting block 12.

其中，安裝座11係組設於取放臂(圖中未示)，其可進行三軸向的位移，而取放頭2透過連接塊12 組設於該安裝座11上。據此，取放臂可帶動取放頭2進行平面位移及升降位移。再者，取放頭2的下端面設有一吸取部21，例如吸嘴，且取放頭2的內部包括一負壓通道210，其係連通至一負壓源(圖中未示)，而吸取部21係連通負壓通道210。據此，吸取部21可透過負壓通道210連通至負壓源而形成負壓，以取放電子元件C。 Among them, the mounting base 11 is set on the pick and place arm (not shown in the figure), which can be displaced in three axes, and the pick and place head 2 passes through the connecting block 12 Set on the mounting base 11. According to this, the pick-and-place arm can drive the pick-and-place head 2 to perform plane displacement and lifting displacement. Furthermore, the lower end surface of the pick-and-place head 2 is provided with a suction portion 21, such as a suction nozzle, and the inside of the pick-and-place head 2 includes a negative pressure channel 210, which is connected to a negative pressure source (not shown), and The suction portion 21 communicates with the negative pressure channel 210. According to this, the suction part 21 can communicate with the negative pressure source through the negative pressure channel 210 to form a negative pressure, so as to pick up and release the electronic component C.

另外，圖中另示有一定位推塊3，其設置於取放頭2上並位於吸取部21之一側。然而，本實施例之定位推塊3為一L型定位推塊，其包括一推抵端31、一施力端32、及一折角部33，折角部33透過一支承銷22而樞接於取放頭2，而推抵端31係鄰近於吸取部21，且推抵端31之側端緣一體凸出有一頂塊310。又，在定位推塊3之施力端32與取放頭2之間配置有致動件4，本實施例係採用壓縮彈簧作為致動件4。由此可知，當施力端32受到一外部物件推壓時，將連動推抵端31使其擺動，其原理如同蹺蹺板。 In addition, another positioning push block 3 is shown in the figure, which is disposed on the pick-and-place head 2 and is located on one side of the suction portion 21. However, the positioning push block 3 of this embodiment is an L-shaped positioning push block, which includes a pushing end 31, a force applying end 32, and a corner portion 33, and the corner portion 33 is pivotally connected to the pick-and-place through a support pin 22 In the head 2, the pushing end 31 is adjacent to the sucking portion 21, and a side block of the pushing end 31 integrally protrudes from a top block 310. In addition, an actuator 4 is disposed between the urging end 32 of the positioning push block 3 and the pick-and-place head 2. In this embodiment, a compression spring is used as the actuator 4. It can be seen from this that when the urging end 32 is pushed by an external object, it will be pushed against the end 31 to make it swing, the principle is like a seesaw.

以下說明本實施例之運作方式，請先同時參閱圖4A至圖4D；圖4A至圖4D係本發明檢測設備一較佳實施例之作動剖視圖，其係呈現電子元件移載裝置1至承載裝置T吸取待測之電子元件C的動作分解示意圖，其中本實施例之承載裝置T為一承載梭(shuttle)。 The following describes the operation mode of this embodiment. Please refer to FIGS. 4A to 4D at the same time; FIGS. 4A to 4D are actuation cross-sectional views of a preferred embodiment of the detection device of the present invention, which presents the electronic component transfer device 1 to the carrier device T is an exploded schematic diagram of the operation of absorbing the electronic component C to be tested, wherein the carrying device T of this embodiment is a carrying shuttle.

首先，圖4A顯示取放頭2尚未完全下降時，而圖4B顯示取放頭2開始下降，而吸取部21已吸取電子元件C，但定位推塊3尚未被啟動，故定位推塊3之頂塊310係位於電子元件C與取放頭2之間，此時電子元件C略呈傾斜狀態。接著，取放頭2持續下降，而承載裝置T之凸塊部Tb接觸並推動定位推塊3之施力端32，使定位推塊3之頂塊310移出電子元件C與取放頭2之間，此時電子裝置已大致呈現水平狀態，即如圖4C所示。 First, FIG. 4A shows that the pick-and-place head 2 has not been completely lowered, and FIG. 4B shows that the pick-and-place head 2 starts to descend, and the suction part 21 has sucked the electronic component C, but the positioning push block 3 has not been activated, so the positioning push block 3 is The top block 310 is located between the electronic component C and the pick-and-place head 2 The element C is slightly inclined. Then, the pick-and-place head 2 keeps descending, and the bump portion Tb of the carrying device T contacts and pushes the urging end 32 of the positioning push block 3, so that the top block 310 of the positioning push block 3 moves out between the electronic component C and the pick-and-place head 2, At this time, the electronic device has been approximately horizontal, as shown in FIG. 4C.

最後，如圖4D所示，當取放頭2開始上升，而定位推塊3之施力端32不再受承載裝置T之凸塊部Tb所推壓時，此時因為致動件4之撐張力Ft轉化為一側向推力Fp，其施加於推抵端31，而讓頂塊310去推動電子元件C，使之朝定位推塊3之對向側靠攏而完成定位。 Finally, as shown in FIG. 4D, when the pick-and-place head 2 starts to rise, and the urging end 32 of the positioning push block 3 is no longer pushed by the convex portion Tb of the bearing device T, at this time, because of the tension of the actuator 4 Ft is converted into a lateral thrust force Fp, which is applied to the pushing end 31, and the top block 310 is used to push the electronic component C so as to move toward the opposite side of the positioning push block 3 to complete positioning.

請同時參閱圖5A、及圖5B，圖5A係本發明電子元件移載裝置吸取電子元件後之仰視圖，圖5B係本發明電子元件移載裝置吸取電子元件後之剖視圖；其中，圖5B特別翻轉180度，使之與圖5A相對應。需先說明的是，電子元件C在尚未定位之前，電子元件C之中心線Li與取放頭2之中心線Lc應呈重疊；然而，完成定位之後，即如圖中所示，電子元件C之中心線Li與取放頭2之中心線Lc已明顯錯位，主要是因為定位推塊3已經推抵電子元件C，使其朝定位推塊3之對向側靠攏，故電子元件C已達成定位。 Please refer to FIG. 5A and FIG. 5B at the same time. FIG. 5A is a bottom view of the electronic component transfer device of the present invention after absorbing electronic components. FIG. 5B is a cross-sectional view of the electronic component transfer device of the present invention after absorbing electronic components; Flip 180 degrees to correspond to Figure 5A. It should be noted that before the electronic component C is positioned, the center line Li of the electronic component C and the center line Lc of the pick and place head 2 should overlap; however, after the positioning is completed, as shown in the figure, the electronic component C The center line Li of the pick-and-place head 2 and the center line Lc of the pick-and-place head 2 have been clearly misaligned, mainly because the positioning push block 3 has pushed against the electronic component C, bringing it closer to the opposite side of the positioning push block 3, so the electronic component C has been reached Positioning.

請一併參閱圖6A、及圖6B，圖6A係本發明電子元件移載裝置與測試裝置呈分離狀態之立體圖，圖6B係本發明電子元件移載裝置與測試裝置呈結合狀態之剖視圖。以下說明，將電子元件置入測試裝置S之過程。 Please refer to FIG. 6A and FIG. 6B together. FIG. 6A is a perspective view of the electronic device transfer device and the test device of the present invention in a separated state, and FIG. 6B is a cross-sectional view of the electronic device transfer device and the test device of the present invention in a combined state. The following describes the process of inserting electronic components into the testing device S.

如圖6A中所示，使取放頭2所吸取之電子元件C對準測試裝置S之晶片容置槽St後，開始下降，而本實施例之測試裝置S的表面挖設有容槽Sc，故當取放頭2與測試裝置S結合時，即如圖6B所示，定位推塊3則可容置於測試裝置S之容槽Sc內，而使電子元件C始終處於被定位之狀態。 As shown in FIG. 6A, after aligning the electronic component C sucked by the pick-and-place head 2 with the wafer accommodating slot St of the testing device S, the descent begins, and the surface of the testing device S of this embodiment is provided with a recess Sc Therefore, when the pick-and-place head 2 is combined with the testing device S, as shown in FIG. 6B, the positioning push block 3 can be accommodated in the receiving slot Sc of the testing device S, so that the electronic component C is always in a state of being positioned .

換言之，即便當電子元件C完整地被放入晶片容置槽St內時，定位推塊3將不會受到測試裝置S之推壓或干涉，始終保持於被定位之狀態。而且，在測試進行的過程中，取放頭2將持續地壓抵電子元件C，讓電子元件C之接點或接腳可完整地接觸測試裝置S之探針或接點(圖中未示)，且定位推塊3也持續地推抵電子元件，使其定位於預定位置上。 In other words, even when the electronic component C is completely placed in the wafer accommodating groove St, the positioning pushing block 3 will not be pushed or interfered by the testing device S, and will always remain in the positioned state. Moreover, during the test, the pick-and-place head 2 will continue to press against the electronic component C, so that the contacts or pins of the electronic component C can completely contact the probes or contacts of the test device S (not shown in the figure) ), and the positioning pushing block 3 also continuously pushes against the electronic component to position it at a predetermined position.

除此之外，雖然上述實施例僅係揭露由單一定位推塊3來達成單向(X方向)定位功能，不過本發明並不以為限，本發明亦可在取放頭2上不同方位處皆設置有定位推塊3，例如雙軸向(X、Y軸向)，來達成多向定位。 In addition, although the above embodiment only discloses that the single positioning push block 3 achieves the unidirectional (X direction) positioning function, the present invention is not limited thereto, and the present invention can also be placed at different positions on the pick and place head 2 All are provided with positioning push blocks 3, such as biaxial (X, Y axial), to achieve multi-directional positioning.

由上可知，本發明至少具備以下優勢：(1).結構相當簡單，成本低廉，且功效相當顯著；而且除定位功能外，亦可提升取放頭固持電子元件的效果，因除了吸取部之吸附力外，又增加了定位推塊推擠電子元件之夾持力；(2).於取放頭吸取電子元件之過程中即完成定位，且整個移載過程和整個測試過程中，電子元件都是處於定位狀態； (3).不需額外的定位作業時間，亦即完全不會因為具備定位功能而降低設備的檢測效率；以及(4).可藉由在取放頭上不同方位處增設定位推塊，即可達成多向定位。 It can be seen from the above that the present invention has at least the following advantages: (1). The structure is quite simple, the cost is low, and the effect is quite remarkable; and in addition to the positioning function, the effect of holding the electronic component by the pick-and-place head can also be improved, because in addition to the suction part In addition to the adsorption force, the clamping force of the positioning push block to push the electronic component is increased; (2). The positioning is completed during the process of the electronic component being picked by the pick-and-place head, and the electronic component is moved during the entire transfer process and the entire test process. Are in a state of positioning; (3). No additional positioning operation time is needed, that is, the detection efficiency of the device will not be reduced because of the positioning function; and (4). By adding setting push blocks at different positions on the pick and place head, Achieve multi-directional positioning.

上述實施例僅係為了方便說明而舉例而已，本發明所主張之權利範圍自應以申請專利範圍所述為準，而非僅限於上述實施例。 The above embodiments are only examples for the convenience of description, and the scope of rights claimed by the present invention should be subject to the scope of the patent application, and not limited to the above embodiments.

11‧‧‧安裝座 11‧‧‧Mount

12‧‧‧連接塊 12‧‧‧Connecting block

2‧‧‧取放頭 2‧‧‧ pick and place head

21‧‧‧吸取部 21‧‧‧Suction Department

210‧‧‧負壓通道 210‧‧‧Negative pressure channel

22‧‧‧支承銷 22‧‧‧support pin

3‧‧‧定位推塊 3‧‧‧Positioning push block

31‧‧‧推抵端 31‧‧‧ Push to the end

310‧‧‧頂塊 310‧‧‧Top block

32‧‧‧施力端 32‧‧‧Forcing end

33‧‧‧折角部 33‧‧‧Folded corner

4‧‧‧致動件 4‧‧‧actuator

Claims

一種具定位功能之電子元件移載裝置，包括：一取放頭，其設有一吸取部，該吸取部係用於取放一電子元件；以及一定位推塊，其設置於該取放頭上並位於該吸取部之一側；其中，當該取放頭以該吸取部吸取該電子元件時，該定位推塊推抵該電子元件使其定位於該取放頭上之一預定位置。 An electronic component transfer device with positioning function, including: a pick-and-place head with a suction part for picking and placing an electronic component; and a positioning push block, which is arranged on the pick-and-place head and It is located on one side of the suction part; wherein, when the pick-and-place head sucks the electronic component with the suction part, the positioning pusher pushes against the electronic component to position it at a predetermined position on the pick-and-place head.

如請求項1之具定位功能之電子元件移載裝置，其更包括一致動件，其係用於驅使該定位推塊推抵該電子元件；該定位推塊為一L型定位推塊，其包括一推抵端、一施力端、及一折角部，該折角部樞接於該取放頭，該推抵端係鄰近於該吸取部，該致動件係組設於該施力端與該取放頭之間。 As claimed in claim 1, the electronic component transfer device with positioning function further includes an actuator, which is used to drive the positioning push block to push against the electronic component; the positioning push block is an L-shaped positioning push block, which It includes a pushing end, a urging end, and a corner portion, the corner portion is pivotally connected to the pick-and-place head, the pushing end is adjacent to the sucking portion, and the actuating member is set on the urging end and the taking end Put it between.

如請求項1之具定位功能之電子元件移載裝置，其中，該致動件為一壓縮彈簧。 The electronic component transfer device with a positioning function according to claim 1, wherein the actuating member is a compression spring.

一種檢測設備，包括：如前述請求項1至3中任一項之具定位功能之電子元件移載裝置；一承載裝置，其係用於裝載待測或完測之該電子元件；以及一測試裝置，其係用於測試該電子元件；其中，該電子元件移載裝置係用於自該承載裝置取出該電子元件並置入該測試裝置、以及自該測試裝置取出該電子元件並置入該承載裝置中至少一者。 An inspection device, including: an electronic component transfer device with a positioning function as described in any one of the foregoing request items 1 to 3; a carrier device for loading the electronic component to be tested or completed; and a test A device for testing the electronic component; wherein the electronic component transfer device is for removing the electronic component from the carrying device and placing it in the testing device, and taking the electronic component from the testing device and placing it in the At least one of the carrying devices.

如請求項4之檢測設備，其中，該承載裝置包括一凸塊部；當該電子元件移載裝置自該承載裝置取得該電子元件或將該電子元件置入該承載裝置時，該凸塊部推動該電子元件移載裝置之該定位推塊，以使該電子元件得以定位，或得以放置該電子元件於該承載裝置。 The inspection device according to claim 4, wherein the carrier device includes a bump portion; when the electronic component transfer device obtains the electronic component from the carrier device or places the electronic component into the carrier device, the bump portion Pushing the positioning push block of the electronic component transfer device, so that the electronic component can be positioned, or the electronic component can be placed on the carrying device.

如請求項4之檢測設備，其中，該測試裝置包括一容槽；當該電子元件移載裝置將該電子元件置入該測試裝置時，該定位推塊位於該容槽內。 The testing device according to claim 4, wherein the testing device includes a receiving slot; when the electronic component transfer device places the electronic component into the testing device, the positioning push block is located in the receiving slot.

一種電子元件移載方法，包括以下步驟：(A)一取放頭之一吸取部自一承載裝置吸取一電子元件；以及(B)一定位推塊推抵該吸取部所吸取之該電子元件使其定位於該取放頭上之一預定位置；其中，定位推塊係設置於該取放頭上並位於該吸取部之一側。 An electronic component transfer method includes the following steps: (A) a suction part of a pick-and-place head sucks an electronic component from a carrier device; and (B) a positioning push block pushes the electronic component sucked by the suction part It is positioned at a predetermined position on the pick-and-place head; wherein the positioning push block is provided on the pick-and-place head and is located on one side of the suction part.

如請求項7之電子元件移載方法，其中，該步驟(A)包括：(A1)該吸取部自該承載裝置吸取該電子元件；(A2)該承載裝置之一凸塊部推動該定位推塊；以及(A3)該承載裝置之該凸塊部釋放該定位推塊。 The electronic component transfer method according to claim 7, wherein the step (A) includes: (A1) the suction part sucks the electronic component from the carrier device; (A2) a bump portion of the carrier device pushes the positioning push Block; and (A3) the bump portion of the carrying device releases the positioning push block.

如請求項8之電子元件移載方法，其中，於該步驟(A1)中，該定位推塊之至少一部分係位於該電子元件與該取放頭之間；於該步驟(A2)中，該定位推塊之至少一部分係移出該電子元件與該取放頭之間；於該步驟(A3) 中，該定位推塊之至少一部分係抵接於該電子元件之一側。 The electronic component transfer method according to claim 8, wherein in the step (A1), at least a part of the positioning push block is located between the electronic component and the pick-and-place head; in the step (A2), the At least a part of the positioning push block is moved out between the electronic component and the pick-and-place head; at this step (A3) At least a part of the positioning push block abuts on one side of the electronic component.

如請求項7之電子元件移載方法，其中，於該步驟(B)之後更包括一步驟(C)；(C)該取放頭係將該電子元件置入一測試裝置；其中，該取放頭之該吸取部係持續吸取該電子元件，而該定位推塊係容置於該測試裝置之一容槽內。 The electronic component transfer method according to claim 7, wherein after the step (B), a step (C) is further included; (C) the pick-and-place head places the electronic component into a test device; wherein, the The suction part of the head is continuously sucking the electronic component, and the positioning push block is accommodated in a receiving groove of the testing device.