TW202016549A - Electronic component transfer device with positioning function, testing apparatus having the same and transfer method thereof - Google Patents
Electronic component transfer device with positioning function, testing apparatus having the same and transfer method thereof Download PDFInfo
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- TW202016549A TW202016549A TW107136133A TW107136133A TW202016549A TW 202016549 A TW202016549 A TW 202016549A TW 107136133 A TW107136133 A TW 107136133A TW 107136133 A TW107136133 A TW 107136133A TW 202016549 A TW202016549 A TW 202016549A
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Abstract
Description
本發明係關於一種具定位功能之電子元件移載裝置、具備該裝置之檢測設備及其移載方法,尤指一種適用於移載待測或完測電子元件之移載裝置和移載方法,以及具備該裝置或使用該方法之檢測設備。 The invention relates to an electronic component transfer device with positioning function, a detection device equipped with the device, and a transfer method thereof, in particular to a transfer device and a transfer method suitable for transferring electronic components to be tested or tested, And detection equipment equipped with the device or using the method.
就現有的電子元件檢測設備而言,電子元件之取放(Pick and place)裝置扮演著不可或缺之角色,其負責將待測電子元件自料盤(tray)或移載梭(shuttle)上移載至測試裝置(socket),且亦負責將完測電子元件自測試裝置移載至料盤或移載梭。 As far as the existing electronic component testing equipment is concerned, the pick and place device of electronic components plays an indispensable role. It is responsible for the electronic components to be tested from the tray or the shuttle Transfer to the test device (socket), and also responsible for transferring the tested electronic components from the test device to the tray or transfer shuttle.
再者,以目前現有技術而言,取放裝置只能單純進行移載、取放,且只能將電子元件置於晶片插槽之中央位置,無法對電子元件作特定位置之定位。然而,針對某些特定的測試裝置,其晶片插槽內之特定位置具有較佳的檢測良率,例如緊靠於晶片插槽之一側邊,故對於容置於晶片插槽內之電子元件的定位需求孕育而生。 In addition, with the current prior art, the pick-and-place device can only carry out transfer and pick-and-place, and can only place the electronic component in the central position of the chip socket, and cannot locate the electronic component at a specific position. However, for some specific test devices, the specific position in the chip socket has better detection yield, for example, close to one side of the chip socket, so for electronic components accommodated in the chip socket The positioning needs were born.
由此可知,一種構造簡單、可靠、且成本低廉,又可精準定位之電子元件移載裝置、具備該裝置之檢測設備及其移載方法,實為產業界之迫切需求。 It can be seen from this that an electronic component transfer device with simple structure, reliable, low cost, and accurate positioning, a detection device equipped with the device, and a transfer method thereof are really urgent demands of the industry.
本發明之主要目的係在提供一種具定位功能之電子元件移載裝置、具備該裝置之檢測設備及其移載方法,俾能在移載裝置上且在移載過程中對電子元件完成定位;而且,不論是在電子元件的移載過程或測試過程中,電子元件始終保持定位於特定位置,進而提高檢測良率。 The main purpose of the present invention is to provide an electronic component transfer device with a positioning function, a detection device equipped with the device, and a transfer method thereof, so that the electronic component can be positioned on the transfer device and during the transfer process; Moreover, no matter in the process of transferring or testing the electronic components, the electronic components always remain positioned at a specific position, thereby improving the detection yield.
為達成上述目的,本發明一種具定位功能之電子元件移載裝置,主要包括取放頭、以及定位推塊,而取放頭設有吸取部,該吸取部係用於取放電子元件;另外,定位推塊設置於取放頭上並位於吸取部之一側;其中,當取放頭以吸取部吸取電子元件時,定位推塊推抵電子元件使其定位於取放頭上之一預定位置。 In order to achieve the above object, the present invention provides an electronic component transfer device with a positioning function, which mainly includes a pick-and-place head and a positioning push block, and the pick-and-place head is provided with a suction portion, which is used to pick and place electronic components; The positioning push block is provided on the pick-and-place head and is located on one side of the suction part; wherein, when the pick-and-place head sucks the electronic component with the suction part, the positioning push block pushes against the electronic component to position it at a predetermined position on the pick-and-place head.
由此可知,本發明在取放頭上設置一定位推塊,並於電子元件的移載過程中,由定位推塊推抵電子元件,以讓其定位。據此,本發明構造相當簡單,且相當可靠,使用壽命長;更重要的是,此一定位功能不需額外作業時間,亦即完全不會因為具備定位功能而降低設備的檢測效率。 It can be seen that the present invention provides a positioning push block on the pick-and-place head, and during the transfer process of the electronic component, the positioning push block is pushed against the electronic component to allow it to be positioned. According to this, the present invention has a relatively simple structure, is quite reliable, and has a long service life; more importantly, this positioning function does not require additional work time, that is, it does not reduce the detection efficiency of the device because of the positioning function.
較佳的是,本發明具定位功能之電子元件移載裝置可更包括致動件,其用於驅使定位推塊推抵電子元件;另外,本發明之定位推塊可為一L型定位推塊, 其可包括推抵端、施力端、及折角部,而折角部可樞接於取放頭,推抵端可鄰近於吸取部,且致動件可組設於施力端與取放頭之間。據此,本發明只要透過致動件來驅動施力端,即可造成推抵端推抵電子元件使之定位,抑或釋放電子元件。此外,致動件可為如壓縮彈簧之彈性構件、或其他可驅使定位推塊移動之等效構件。 Preferably, the electronic component transfer device with positioning function of the present invention may further include an actuator for driving the positioning push block to push against the electronic component; in addition, the positioning push block of the present invention may be an L-shaped positioning push Piece, It may include a pushing end, a forcing end, and a corner portion, and the corner portion may be pivotally connected to the pick-and-place head, the pushing end may be adjacent to the sucking portion, and the actuating member may be disposed between the forcing end and the pick-and-place head. According to this, as long as the force-applying end is driven by the actuating member, the pushing end can be pushed against the electronic component to position it, or the electronic component can be released. In addition, the actuating member may be an elastic member such as a compression spring, or other equivalent member that can drive the positioning push block to move.
為達成前述目的,本發明一種檢測設備,主要包括如前段所述具定位功能之電子元件移載裝置、承載裝置、及測試裝置;承載裝置係用於裝載待測或完測之電子元件,測試裝置係用於測試電子元件;其中,電子元件移載裝置係用於自承載裝置取出電子元件並置入測試裝置、以及自測試裝置取出電子元件並置入承載裝置中至少一者。 In order to achieve the foregoing objective, a testing device of the present invention mainly includes an electronic component transfer device with a positioning function, a carrying device, and a testing device as described in the preceding paragraph; the carrying device is used to load electronic components to be tested or tested, and test The device is used for testing electronic components; wherein, the electronic component transfer device is used for at least one of taking out electronic components from the carrying device and placing them in the testing device, and taking out electronic components from the testing device and placing them in the carrying device.
再者,在本發明之承載裝置可包括凸塊部;當電子元件移載裝置自承載裝置取得電子元件或將電子元件置入承載裝置時,凸塊部可推動電子元件移載裝置之定位推塊,以使電子元件得以定位,或得以放置電子元件於承載裝置。換言之,本發明利用移載裝置與承載裝置接觸時,由承載裝置之凸塊部去啟動該定位推塊,以讓電子元件定位或釋放電子元件,毫不影響測試或移載效率。 Furthermore, the carrier device of the present invention may include a bump portion; when the electronic component transfer device obtains an electronic component from the carrier device or places the electronic component into the carrier device, the bump portion may push the positioning push of the electronic component transfer device Block so that the electronic component can be positioned or placed on the carrier. In other words, in the present invention, when the transfer device is in contact with the carrier device, the positioning push block is activated by the convex portion of the carrier device to allow the electronic component to locate or release the electronic component without affecting the test or transfer efficiency.
此外,本發明之測試裝置可包括一容槽;而當電子元件移載裝置將電子元件置入測試裝置時,定位推塊位於容槽內。亦即,藉由容槽之設置,使測試裝置不致於啟動或阻礙該定位推塊,而使電子元件置入測試裝置時仍處於定位狀態。 In addition, the testing device of the present invention may include a container; when the electronic component transfer device places the electronic component into the testing device, the positioning push block is located in the container. That is to say, by setting the receiving slot, the test device will not start or block the positioning push block, and the electronic component is still in the positioning state when placed in the test device.
為達成前述目的,本發明一種電子元件移載方法,包括以下步驟:(A)取放頭之吸取部自承載裝置吸取電子元件;以及(B)定位推塊推抵吸取部所吸取之電子元件使其定位於取放頭上之預定位置;其中,定位推塊係設置於取放頭上並位於吸取部之一側。 To achieve the foregoing objective, an electronic component transfer method of the present invention includes the following steps: (A) the suction portion of the pick-and-place head sucks the electronic component from the carrying device; and (B) the positioning push block is pushed against the electronic component sucked by the suction portion It is positioned at a predetermined position on the pick-and-place head; wherein the positioning push block is arranged on the pick-and-place head and is located on one side of the suction part.
較佳的是,該步驟(A)可包括:(A1)吸取部自承載裝置吸取電子元件,且定位推塊之至少一部分可位於電子元件與取放頭之間;(A2)承載裝置之凸塊部推動定位推塊,而定位推塊之至少一部分可移出電子元件與取放頭之間;以及(A3)承載裝置之凸塊部釋放定位推塊,而定位推塊之至少一部分可抵接於電子元件之一側。 Preferably, this step (A) may include: (A1) the suction part sucks the electronic component from the carrier device, and at least a part of the positioning push block may be located between the electronic component and the pick-and-place head; (A2) the convexity of the carrier device The block pushes the positioning push block, and at least a part of the positioning push block can be moved out between the electronic component and the pick-and-place head; and (A3) the convex portion of the carrying device releases the positioning push block, and at least a part of the positioning push block can abut On one side of the electronic component.
此外,本發明電子元件移載方法中,於該步驟(B)之後更包括一步驟(C),即取放頭可將電子元件置入測試裝置;其中,取放頭之吸取部可持續吸取電子元件,而定位推塊可容置於測試裝置之一容槽內。藉此,不論在電子元件置入測試裝置前或置入之後,定位推塊皆可持續對電子元件定位。 In addition, in the electronic component transfer method of the present invention, after this step (B), a step (C) is further included, that is, the pick-and-place head can place the electronic component into the test device; wherein, the pick-up portion of the pick-and-place head can continuously suck Electronic components, and the positioning push block can be accommodated in one of the receiving devices of the test device. In this way, the positioning push block can continue to position the electronic component whether before or after the electronic component is placed in the test device.
1‧‧‧電子元件移載裝置 1‧‧‧Electronic component transfer device
11‧‧‧安裝座 11‧‧‧Mount
12‧‧‧連接塊 12‧‧‧Connecting block
2‧‧‧取放頭 2‧‧‧ pick and place head
21‧‧‧吸取部 21‧‧‧Suction Department
210‧‧‧負壓通道 210‧‧‧Negative pressure channel
22‧‧‧支承銷 22‧‧‧support pin
3‧‧‧定位推塊 3‧‧‧Positioning push block
31‧‧‧推抵端 31‧‧‧ Push to the end
310‧‧‧頂塊 310‧‧‧Top block
32‧‧‧施力端 32‧‧‧Forcing end
33‧‧‧折角部 33‧‧‧Folded corner
4‧‧‧致動件 4‧‧‧actuator
C‧‧‧電子元件 C‧‧‧Electronic components
S‧‧‧測試裝置 S‧‧‧Test device
Sc‧‧‧容槽 Sc‧‧‧Capacity
T‧‧‧承載裝置 T‧‧‧ bearing device
Tb‧‧‧凸塊部 Tb‧‧‧Bump
Ft‧‧‧撐張力 Ft‧‧‧ Tension
Fp‧‧‧側向推力 Fp‧‧‧Lateral thrust
Li‧‧‧電子元件之中心線 Li‧‧‧Centerline of Electronic Components
Lc‧‧‧取放頭之中心線 Lc‧‧‧ Center line of pick and place head
St‧‧‧晶片容置槽 St‧‧‧chip receiving slot
圖1係本發明電子元件移載裝置一較佳實施例之分解圖。 FIG. 1 is an exploded view of a preferred embodiment of the electronic component transfer device of the present invention.
圖2係本發明電子元件移載裝置一較佳實施例之立體圖。 2 is a perspective view of a preferred embodiment of the electronic component transfer device of the present invention.
圖3係本發明電子元件移載裝置一較佳實施例之剖視圖。 3 is a cross-sectional view of a preferred embodiment of the electronic component transfer device of the present invention.
圖4A至圖4D係本發明檢測設備一較佳實施例之作動剖視圖。 4A to 4D are action cross-sectional views of a preferred embodiment of the detection device of the present invention.
圖5A係本發明電子元件移載裝置吸取電子元件後之仰視圖。 FIG. 5A is a bottom view of the electronic component transfer device of the present invention after absorbing electronic components.
圖5B係本發明電子元件移載裝置吸取電子元件後之剖視圖。 5B is a cross-sectional view of the electronic component transfer device of the present invention after absorbing electronic components.
圖6A係本發明電子元件移載裝置與測試裝置呈分離狀態之立體圖。 6A is a perspective view of the electronic device transfer device and the testing device of the present invention in a separated state.
圖6B係本發明電子元件移載裝置與測試裝置呈結合狀態之剖視圖。 6B is a cross-sectional view of the electronic device transfer device and the test device of the present invention in a combined state.
本發明具定位功能之電子元件移載裝置、具備該裝置之檢測設備及其移載方法在本實施例中被詳細描述之前,要特別注意的是,以下的說明中,類似的元件將以相同的元件符號來表示。再者,本發明之圖式僅作為示意說明,其未必按比例繪製,且所有細節也未必全部呈現於圖式中。 Before the electronic device transfer device with positioning function, the detection device provided with the device, and the transfer method thereof are described in detail in this embodiment, it should be particularly noted that in the following description, similar elements will be the same The symbol of the component. Furthermore, the drawings of the present invention are only for illustrative purposes, they are not necessarily drawn to scale, and all the details are not necessarily presented in the drawings.
請同時參閱圖1、圖2、及圖3,圖1係本發明電子元件移載裝置一較佳實施例之分解圖,圖2係本發明電子元件移載裝置一較佳實施例之立體圖,圖3係本發明電子元件移載裝置一較佳實施例之剖視圖。如圖中所示,本實施例之電子元件移載裝置1主要包括取放頭2、定位推塊3、安裝座11、以及連接塊12。
Please refer to FIGS. 1, 2 and 3 at the same time. FIG. 1 is an exploded view of a preferred embodiment of the electronic component transfer device of the present invention, and FIG. 2 is a perspective view of a preferred embodiment of the electronic component transfer device of the present invention. 3 is a cross-sectional view of a preferred embodiment of the electronic component transfer device of the present invention. As shown in the figure, the electronic
其中,安裝座11係組設於取放臂(圖中未示),其可進行三軸向的位移,而取放頭2透過連接塊12
組設於該安裝座11上。據此,取放臂可帶動取放頭2進行平面位移及升降位移。再者,取放頭2的下端面設有一吸取部21,例如吸嘴,且取放頭2的內部包括一負壓通道210,其係連通至一負壓源(圖中未示),而吸取部21係連通負壓通道210。據此,吸取部21可透過負壓通道210連通至負壓源而形成負壓,以取放電子元件C。
Among them, the
另外,圖中另示有一定位推塊3,其設置於取放頭2上並位於吸取部21之一側。然而,本實施例之定位推塊3為一L型定位推塊,其包括一推抵端31、一施力端32、及一折角部33,折角部33透過一支承銷22而樞接於取放頭2,而推抵端31係鄰近於吸取部21,且推抵端31之側端緣一體凸出有一頂塊310。又,在定位推塊3之施力端32與取放頭2之間配置有致動件4,本實施例係採用壓縮彈簧作為致動件4。由此可知,當施力端32受到一外部物件推壓時,將連動推抵端31使其擺動,其原理如同蹺蹺板。
In addition, another
以下說明本實施例之運作方式,請先同時參閱圖4A至圖4D;圖4A至圖4D係本發明檢測設備一較佳實施例之作動剖視圖,其係呈現電子元件移載裝置1至承載裝置T吸取待測之電子元件C的動作分解示意圖,其中本實施例之承載裝置T為一承載梭(shuttle)。
The following describes the operation mode of this embodiment. Please refer to FIGS. 4A to 4D at the same time; FIGS. 4A to 4D are actuation cross-sectional views of a preferred embodiment of the detection device of the present invention, which presents the electronic
首先,圖4A顯示取放頭2尚未完全下降時,而圖4B顯示取放頭2開始下降,而吸取部21已吸取電子元件C,但定位推塊3尚未被啟動,故定位推塊3之頂塊310係位於電子元件C與取放頭2之間,此時電子
元件C略呈傾斜狀態。接著,取放頭2持續下降,而承載裝置T之凸塊部Tb接觸並推動定位推塊3之施力端32,使定位推塊3之頂塊310移出電子元件C與取放頭2之間,此時電子裝置已大致呈現水平狀態,即如圖4C所示。
First, FIG. 4A shows that the pick-and-
最後,如圖4D所示,當取放頭2開始上升,而定位推塊3之施力端32不再受承載裝置T之凸塊部Tb所推壓時,此時因為致動件4之撐張力Ft轉化為一側向推力Fp,其施加於推抵端31,而讓頂塊310去推動電子元件C,使之朝定位推塊3之對向側靠攏而完成定位。
Finally, as shown in FIG. 4D, when the pick-and-
請同時參閱圖5A、及圖5B,圖5A係本發明電子元件移載裝置吸取電子元件後之仰視圖,圖5B係本發明電子元件移載裝置吸取電子元件後之剖視圖;其中,圖5B特別翻轉180度,使之與圖5A相對應。需先說明的是,電子元件C在尚未定位之前,電子元件C之中心線Li與取放頭2之中心線Lc應呈重疊;然而,完成定位之後,即如圖中所示,電子元件C之中心線Li與取放頭2之中心線Lc已明顯錯位,主要是因為定位推塊3已經推抵電子元件C,使其朝定位推塊3之對向側靠攏,故電子元件C已達成定位。
Please refer to FIG. 5A and FIG. 5B at the same time. FIG. 5A is a bottom view of the electronic component transfer device of the present invention after absorbing electronic components. FIG. 5B is a cross-sectional view of the electronic component transfer device of the present invention after absorbing electronic components; Flip 180 degrees to correspond to Figure 5A. It should be noted that before the electronic component C is positioned, the center line Li of the electronic component C and the center line Lc of the pick and
請一併參閱圖6A、及圖6B,圖6A係本發明電子元件移載裝置與測試裝置呈分離狀態之立體圖,圖6B係本發明電子元件移載裝置與測試裝置呈結合狀態之剖視圖。以下說明,將電子元件置入測試裝置S之過程。 Please refer to FIG. 6A and FIG. 6B together. FIG. 6A is a perspective view of the electronic device transfer device and the test device of the present invention in a separated state, and FIG. 6B is a cross-sectional view of the electronic device transfer device and the test device of the present invention in a combined state. The following describes the process of inserting electronic components into the testing device S.
如圖6A中所示,使取放頭2所吸取之電子元件C對準測試裝置S之晶片容置槽St後,開始下降,而本實施例之測試裝置S的表面挖設有容槽Sc,故當取放頭2與測試裝置S結合時,即如圖6B所示,定位推塊3則可容置於測試裝置S之容槽Sc內,而使電子元件C始終處於被定位之狀態。
As shown in FIG. 6A, after aligning the electronic component C sucked by the pick-and-
換言之,即便當電子元件C完整地被放入晶片容置槽St內時,定位推塊3將不會受到測試裝置S之推壓或干涉,始終保持於被定位之狀態。而且,在測試進行的過程中,取放頭2將持續地壓抵電子元件C,讓電子元件C之接點或接腳可完整地接觸測試裝置S之探針或接點(圖中未示),且定位推塊3也持續地推抵電子元件,使其定位於預定位置上。
In other words, even when the electronic component C is completely placed in the wafer accommodating groove St, the
除此之外,雖然上述實施例僅係揭露由單一定位推塊3來達成單向(X方向)定位功能,不過本發明並不以為限,本發明亦可在取放頭2上不同方位處皆設置有定位推塊3,例如雙軸向(X、Y軸向),來達成多向定位。
In addition, although the above embodiment only discloses that the single
由上可知,本發明至少具備以下優勢:(1).結構相當簡單,成本低廉,且功效相當顯著;而且除定位功能外,亦可提升取放頭固持電子元件的效果,因除了吸取部之吸附力外,又增加了定位推塊推擠電子元件之夾持力;(2).於取放頭吸取電子元件之過程中即完成定位,且整個移載過程和整個測試過程中,電子元件都是處於定位狀態; (3).不需額外的定位作業時間,亦即完全不會因為具備定位功能而降低設備的檢測效率;以及(4).可藉由在取放頭上不同方位處增設定位推塊,即可達成多向定位。 It can be seen from the above that the present invention has at least the following advantages: (1). The structure is quite simple, the cost is low, and the effect is quite remarkable; and in addition to the positioning function, the effect of holding the electronic component by the pick-and-place head can also be improved, because in addition to the suction part In addition to the adsorption force, the clamping force of the positioning push block to push the electronic component is increased; (2). The positioning is completed during the process of the electronic component being picked by the pick-and-place head, and the electronic component is moved during the entire transfer process and the entire test process. Are in a state of positioning; (3). No additional positioning operation time is needed, that is, the detection efficiency of the device will not be reduced because of the positioning function; and (4). By adding setting push blocks at different positions on the pick and place head, Achieve multi-directional positioning.
上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。 The above embodiments are only examples for the convenience of description, and the scope of rights claimed by the present invention should be subject to the scope of the patent application, and not limited to the above embodiments.
11‧‧‧安裝座 11‧‧‧Mount
12‧‧‧連接塊 12‧‧‧Connecting block
2‧‧‧取放頭 2‧‧‧ pick and place head
21‧‧‧吸取部 21‧‧‧Suction Department
210‧‧‧負壓通道 210‧‧‧Negative pressure channel
22‧‧‧支承銷 22‧‧‧support pin
3‧‧‧定位推塊 3‧‧‧Positioning push block
31‧‧‧推抵端 31‧‧‧ Push to the end
310‧‧‧頂塊 310‧‧‧Top block
32‧‧‧施力端 32‧‧‧Forcing end
33‧‧‧折角部 33‧‧‧Folded corner
4‧‧‧致動件 4‧‧‧actuator
Claims (10)
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TW107136133A TWI674411B (en) | 2018-10-15 | 2018-10-15 | Electronic component transfer device with positioning function, testing apparatus having the same and transfer method thereof |
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TW107136133A TWI674411B (en) | 2018-10-15 | 2018-10-15 | Electronic component transfer device with positioning function, testing apparatus having the same and transfer method thereof |
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TWI674411B TWI674411B (en) | 2019-10-11 |
TW202016549A true TW202016549A (en) | 2020-05-01 |
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Cited By (1)
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US20230417796A1 (en) * | 2022-06-27 | 2023-12-28 | Western Digital Technologies, Inc. | Integrated circuit test socket with integrated device picking mechanism |
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SG44966A1 (en) * | 1995-08-04 | 1997-12-19 | Advantest Corp | Integrated circuit transportating apparatus |
TWI257685B (en) * | 2005-05-26 | 2006-07-01 | Motech Taiwan Automatic Corp | IC pick-up head structure suitable for testing bases of different sizes |
TWI375291B (en) * | 2008-05-16 | 2012-10-21 | Hon Tech Inc | Testing device for use in testing a chip |
KR101256994B1 (en) * | 2011-11-23 | 2013-04-26 | 이재학 | Test socket with stopper member |
US10852321B2 (en) * | 2016-08-19 | 2020-12-01 | Delta Design, Inc. | Test handler head having reverse funnel design |
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