TW202212842A - Modularized testing apparatus and testing equipment using the same - Google Patents
Modularized testing apparatus and testing equipment using the same Download PDFInfo
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Abstract
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本發明提供一種模組化而利於修護更換,並提高作業便利性之模組化測試裝置。The present invention provides a modularized test device which is convenient for maintenance and replacement, and improves the convenience of operation.
在現今,電子元件於製作完畢後,必須以測試設備對電子元件執行測試作業,以淘汰出不良品。請參閱圖1,目前測試設備於機台11之前段部配置供料裝置12及收料裝置13,於後段部水平排列配置複數個測試裝置14A、14B
、14C、14D、14E、14F,以測試裝置14A為例,其於機台11固設二電性連接之測試座141A及電路板142A,以供對電子元件執行測試作業,測試裝置14A另於機台11設置機架143A,機架143A裝配壓接器144A,壓接器144A對應於測試座141A,以供下壓測試座141A內之電子元件執行測試作業;測試設備以輸送器15伸入於測試裝置14A,而於測試座141A取出一已測電子元件,以及將一待測電子元件移入測試座141A而接續執行測試作業,依此類推,輸送器15依序於複數個測試裝置14B、14C、14D、14E、14F執行取出已測電子元件及放置待測電子元件之作業;惟,輸送器15必須多次往復出入複數個測試裝置14A、14B、14C
、14D、14E、14F,方可移入或移出單一電子元件,不僅增加作動時序而耗費時間,更降低測試產能。另於更換不同型式之測試座、電路板及壓接器時,必須逐一於各測試裝置14A、14B、14C、14D、14E、14F拆卸測試座、電路板及壓接器,以致更換作業繁瑣耗時。再者,測試裝置14A為供輸送器15可移入於壓接器144A與測試座141A之間,而必須增加機架143A及壓接器144A之架設高度,不僅增加測試裝置14A之體積,更延長壓接器144A之下壓行程而增加作業時間。
Nowadays, after the electronic components are fabricated, the electronic components must be tested with testing equipment to eliminate defective products. Please refer to FIG. 1. Currently, the testing equipment is equipped with a
本發明之目的一,提供一種模組化測試裝置,包含承置單元、測試單元及壓接單元,承置單元之載具承置可滑移之測試單元,測試單元之承板配置複數個測試器,測試器供承置及測試複數個電子元件,壓接單元以可拆式框架裝配於承置單元之載具,框架裝配複數個壓接器,複數個壓接器對位於複數個測試器,藉以模組化測試裝置利於修護更換,並於測試單元滑出載具時而供便利取放一批次複數個電子元件,以及於滑入載具時而供壓接單元壓接複數個電子元件執行測試作業,進而提高使用效能。The first objective of the present invention is to provide a modular testing device, which includes a holding unit, a testing unit and a crimping unit. The tester is used to hold and test a plurality of electronic components. The crimping unit is assembled on the carrier of the holding unit by a detachable frame. , so that the modular test device is convenient for maintenance and replacement, and when the test unit slides out of the carrier, it is convenient to pick up and place a batch of multiple electronic components, and when the test unit slides into the carrier, the crimping unit can crimp multiple electronic components. Electronic components perform testing operations to improve performance.
本發明之目的二,提供一種模組化測試裝置,其測試單元之承板裝配複數個測試器,於承板移出承置單元時,可供輸送器一批次取放複數個電子元件,以縮減取放料作動時序,進而提高生產效能。The second objective of the present invention is to provide a modular testing device, wherein the support plate of the test unit is equipped with a plurality of testers, when the support plate is moved out of the support unit, the conveyor can pick up and place a plurality of electronic components in one batch, so as to Reduce the timing of picking and unloading, thereby improving production efficiency.
本發明之目的三,提供一種模組化測試裝置,其壓接單元以快拆器將框架裝配於承置單元之載具,於變換應用之壓接器數量或型式時,利用快拆器而可迅速拆卸框架,以利卸下一批次複數個壓接器,而縮減更換作業時間 ,進而提高生產效能。 The third object of the present invention is to provide a modular testing device, in which the crimping unit uses a quick release to assemble the frame to the carrier of the holding unit. Quickly remove the frame to facilitate removal of multiple crimpers in one batch, reducing replacement time , thereby improving production efficiency.
本發明之目的四,提供一種模組化測試裝置,其壓接單元之複數個壓接器分別鎖固於框架,於修護時,可各別獨立更換壓接器,毋需更換整組壓接單元,進而有效節省成本。The fourth object of the present invention is to provide a modular testing device, in which a plurality of crimpers of the crimping unit are respectively locked to the frame. During maintenance, the crimpers can be replaced independently without replacing the entire set of crimpers. Connect the unit, thereby effectively saving costs.
本發明之目的五,提供一種模組化測試裝置,其於承置單元裝配可滑移之測試單元及可快拆之壓接單元,不僅整體微型化,以利應用於空間有限之場所而執行測試作業,並供省力搬運,進而提高使用效能及便利性。The fifth objective of the present invention is to provide a modular testing device, which is equipped with a slidable testing unit and a quick-release crimping unit on the holding unit, which is not only miniaturized as a whole, but also suitable for use in places with limited space. Test operation, and for labor-saving handling, thereby improving the use efficiency and convenience.
本發明之目的六,提供一種模組化測試裝置,其壓接單元之壓接器於第一活動件與第二活動件間設有驅動源,以驅動第一活動件與第二活動件沿作業軸線作反向位移,第一活動件之底部裝配作業件,作業件以供壓接電子元件,壓接器另設有一由第二活動件驅動位移之作動具,作動具裝配至少一限位件,於限位件承擋受限後,而可定位作動具及第二活動件,以防止第一活動件及作業件沿作業軸線退縮位移,使作業件確實壓接電子元件執行預設作業,進而提升作業品質。The sixth object of the present invention is to provide a modular testing device, in which the crimper of the crimping unit is provided with a driving source between the first movable member and the second movable member to drive the first movable member and the second movable member along the edge. The working axis is displaced in the opposite direction, the bottom of the first movable piece is assembled with working piece, the working piece is used for crimping electronic components, the crimper is also provided with an actuating tool which is driven and displaced by the second movable piece, and the actuating tool is equipped with at least one limiter After the stopper is limited, the actuating tool and the second movable piece can be positioned to prevent the first movable piece and the working piece from retreating and displaced along the working axis, so that the working piece can be pressed against the electronic components to perform the preset operation. , thereby improving the quality of work.
本發明之目的七,提供一種模組化測試裝置,其壓接單元之壓接器於第一調整件及第二調整件設有相互配合之第一浮接部及第二浮接部,第二調整件並以連接件連接作動具或第二活動件,利用作動具或第二活動件帶動第二調整件作一浮動位移(如X方向、Y方向或水平角度Θ)而解除卡掣,使第一活動件可帶動作業件作浮動位移,進而微調作業件之位置,使作業件精準壓接電子元件,進而提高使用效能。The seventh object of the present invention is to provide a modular testing device, wherein the crimping device of the crimping unit is provided with a first floating part and a second floating part which cooperate with each other on the first adjusting part and the second adjusting part, and the first floating part and the second floating part are mutually matched. The two adjusting members are connected with the actuating tool or the second movable member by the connecting member, and the second adjusting member is driven by the actuating tool or the second movable member to make a floating displacement (such as the X direction, the Y direction or the horizontal angle Θ) to release the jam, The first movable piece can drive the working piece to float and displace, so as to fine-tune the position of the working piece, so that the working piece can be accurately pressed against the electronic components, thereby improving the use efficiency.
本發明之目的八,提供一種應用模組化測試裝置之測試設備,包含供料裝置、收料裝置、多層式架體、本發明模組化測試裝置、輸送裝置及中央控制裝置;供料裝置配置於機台,並設有至少一容納待作業電子元件之供料承置器;收料裝置配置於機台,並設有至少一容納已作業電子元件之收料承置器;多層式架體配置於機台,並設有複數層,各層設有至少一架置空間;複數個模組化測試裝置配置於多層式架體之複數層架置空間,各模組化測試裝置以供測試一批次電子元件;輸送裝置配置於機台,並設有至少一第一輸送器,以輸送電子元件;中央控制裝置以供控制及整合各裝置作動,以執行自動化作業 ,達到提升作業效能之實用效益。 The eighth object of the present invention is to provide a testing device using a modular testing device, including a feeding device, a receiving device, a multi-layer frame, the modular testing device of the present invention, a conveying device and a central control device; a feeding device It is arranged on the machine table and is provided with at least one feeder and holder for accommodating the electronic components to be operated; the receiving device is arranged on the machine table and is provided with at least one material holder for accommodating the electronic components that have been processed; a multi-layer rack The body is arranged on the machine, and there are multiple layers, and each layer is provided with at least one mounting space; a plurality of modular test devices are arranged in the multiple layers of the mounting space of the multi-layer frame, and each modular test device is used for testing. A batch of electronic components; the conveying device is arranged on the machine, and is provided with at least one first conveyor for conveying electronic components; the central control device is used to control and integrate the actions of each device to perform automated operations , to achieve the practical benefits of improving operational efficiency.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your examiners further understand the present invention, hereby give a preferred embodiment and cooperate with the drawings, the details are as follows:
請參閱圖2至5,本發明模組化測試裝置20包含承置單元、測試單元及壓接單元,可視作業需求,更包含一驅動單元,以自動化驅動測試單元移入/移出承置單元。Referring to FIGS. 2 to 5 , the
承置單元設有至少一載具21,載具21可為面板、架體或箱體,其型式可為一平板型或ㄩ型,載具21僅需承置測試單元、壓接單元及驅動單元,不受限於本實施例;於本實施例,載具21包含底板211及二側板212,二側板212呈Z方向固設於底板21,底板211與二側板212間形成一測試區213。The holding unit is provided with at least one
測試單元包含承板22及複數個測試器,承板22可移入/移出於承置單元之載具21,複數個測試器裝配於承板22,以供對電子元件執行測試作業
,於修護更換測試單元時,可取出承板22,而一次更換一批次複數個測試器,以提高作業便利性;更進一步,承板22與載具21間設有滑軌組,承板22可供手動式或自動式位移,例如於承板22配置把手,把手可供手動式拉動承板22位移
;例如承板22連結一驅動器,驅動器驅動承板22自動式位移。
The test unit includes a
於本實施例,承板22位於載具21之測試區213,並設有複數個支撐部件221,支撐部件221可與承板22一體成型或各為獨立元件,於本實施例,承板22開設有複數個容置孔222,各容置孔222裝配一為塊體之支撐部件221。承板22之複數個支撐部件221供裝配複數個測試器,各測試器包含電性連接之電路板231及具探針2321之測試座232,測試座232供承置及測試電子元件,並以栓具鎖固於承板22之支撐部件221,利用支撐部件221輔助支撐測試座232而防止受壓變形。測試座232以頂面作為承擋面2322,並設有為定位孔之第一定位部件2323
。又承板22與載具21間設有複數個呈X方向配置之滑軌組24,各滑軌組24於承板22之底面設置滑軌,以及於載具21之底板211配置複數個可供滑軌滑置之滑座
,承板22利用滑軌組24而於載具21上平穩位移。
In this embodiment, the
驅動單元於承板22與載具21間配置至少一驅動器,驅動器可為壓缸或包含馬達及至少一傳動組,不受限於本實施例;於本實施例,驅動器包含馬達251及一為皮帶輪組252之傳動組,馬達251裝配於載具21之側板212,並以轉軸驅動皮帶輪組252,皮帶輪組252連結帶動承板22及複數個測試器作自動式移入/移出載具21之測試區213。The driving unit is configured with at least one driver between the
壓接單元設有至少一框架26及複數個壓接器,框架26裝配於承置單元之載具21,複數個壓接器裝配於框架26,以供壓接測試器之電子元件;更進一步,框架26可作固定式或活動式裝配於載具21,例如框架26以栓具或快拆器組裝於載具21,以供拆卸整組壓接單元;於本實施例,框架26與載具21間設有一為扣具261之快拆器,框架26利用扣具261扣合組裝於載具21,並供修護更換壓接單元時,可開啟扣具261,以利迅速快拆取下框架26及一批次複數個壓接器,進而提高作業便利性。The crimping unit is provided with at least one
壓接器包含第一活動件271、第二活動件272、驅動源、壓接件273、作動具274及限位件275,可視作業需求,壓接器更包含調整結構、復歸結構。The crimper includes a first
第一活動件271可為一缸本體或面板,而沿作業軸線L位移,並於第一表面2711沿作業軸線L凹設有容置空間2712,及以相對第一表面2711之一面作為裝配面2713,於本實施例,第一活動件271為一缸本體,並於側面設有套合塊2714,套合塊2714開設有導孔2715。The first
第二活動件272與第一活動件271沿作業軸線L作相對配置,第二活動件272可沿作業軸線L作反向位移,更進一步,第二活動件272可為面板、活塞或膜片,於本實施例,第二活動件272為一活塞,並可位移地裝配於第一活動件271之容置空間2712,第二活動件272之第二表面2721與容置空間2712之內底面間形成一氣室2716,另第二活動件272以相對第二表面2721之一面作為連接面2722。The second
驅動源以供驅動第一活動件271及第二活動件272作反向位移,更進一步,驅動源可為氣囊、壓電元件或包含氣室及通氣道,只要可驅動第一活動件271及第二活動件272作反向位移均可,不受限於本實施例。例如驅動源為氣囊,可直接裝配連結於第一活動件271之第一表面2711與第二活動件272之第二表面2721,於氣囊充氣膨脹時,以驅動第一活動件271及第二活動件272作反向位移,而可省略第一活動件271之容置空間2712及氣室2716。例如驅動源包含氣室及通氣道,氣室設於第一活動件271之容置空間2712內底面與第二活動件272之第二表面2721間,通氣道可設於第一活動件271或第二活動件272,通氣道將氣體輸入於氣室,以驅動第一活動件271及第二活動件272作反向位移。於本實施例,驅動源包含氣室2716及通氣道2717,氣室2716位於第一活動件271之容置空間2712內底面與第二活動件272之第二表面2721間,通氣道2717位於第一活動件271,其一端相通氣室2716,另一端連通供氣設備(圖未示出)及氣壓檢知器
,以供輸入氣體至氣室2716。
The driving source is used to drive the first
壓接件273裝配於第一活動件271,以供壓接電子元件,更進一步
,壓接件273裝配至少一溫控器,溫控器可為加熱件或致冷晶片,以使電子元件位於模擬日後應用場所溫度之測試環境;於本實施例,壓接件273裝配於第一活動件271之裝配面2713,並設有至少一下壓部2731,以對電子元件執行壓接作業
。另壓接件273於下壓部2731之周側設有擋面2732及第二定位部件2733,擋面2732之位置高度高於下壓部2731,並於相對應第一定位部件2323之位置凸設有為定位銷之第二定位部件2733。
The crimping
再者,壓接器可視作業需求,於壓接件273之下壓部2731裝配電性連接之另一電路板(圖未示出)及另複數支探針(圖未示出),以供測試具雙面接點之電子元件。Furthermore, the crimper may, depending on operational requirements, mount another circuit board (not shown in the figure) and a plurality of probes (not shown in the figure) on the crimping
作動具274裝配於第二活動件272,以供第二活動件272驅動沿作業軸線L作反向位移;更進一步,作動具274包含至少一第一構件2741,以裝配於第二活動件272,裝配方式可為鎖固或跨置等方式,均可供第二活動件272帶動第一構件2741同步位移;於本實施例,作動具274包含第一構件2741、第二構件2742及第三構件2743,更進一步,第一構件2741、第二構件2742及第三構件2743可為一體成型或各別為獨立構件;於本實施例,作動具274之第一構件2741
、第二構件2742及第三構件2743各別為獨立構件,第一構件2741為一面板,並呈水平配置鎖固於第二活動件272的連接面2722,第二構件2742為呈Z軸向配置之導桿,其一端組裝於第一構件2741,另一端穿伸出第一活動件271之導孔2715
,以供第一活動件271沿第二構件2742平穩作Z方向位移,第三構件2743為一呈X方向配置之架體,並組裝於第二構件2742之另一端,使得第二活動件272可帶動第一構件2741、第二構件2742及第三構件2743同步反向位移。
The
限位件275設於作動具274,以於限位件275承擋受限時,而可定位第二活動件272,以防止第一活動件271及壓接件273退縮位移;更進一步,限位件275與作動具274可為一體成型或各別為獨立元件,限位件275可呈Y方向或Z方向設於作動具274;例如限位件275可為一面板,並呈Y方向延伸設於作動具274之第三構件2743;例如限位件275可為一L型件,並呈Z方向配置於作動具274之第一構件2741或第三構件2743,當限位件275配置於第一構件2741,作動具274可省略第三構件2743。The limiting
調整結構包含第一調整件276、第二調整件277及連接件278,更包含第一彈性件279及蓋板280。第一調整件276設有第一浮接部2761,第二調整件277設有第二浮接部2771,第二浮接部2771與第一浮接部2761作相互配合,更進一步,第一浮接部2761與第一調整件276可一體成型或各別為獨立元件,例如第一調整件276可一體成型一為弧凸塊之第一浮接部2761;例如第一調整件276可裝配一具有為珠體之第一浮接部2761的面板;同樣地,第二浮接部2771與第二調整件277亦可一體成型或各別為獨立元件;另第二浮接部2771與第一浮接部2761可呈相互配合之弧形或V形,其形狀只要於第二調整件277未浮動時,可使第一調整件276及第二調整件277相互配合卡掣。連接件278連接第二調整件277與作動具274或第二活動件272,利用作動具274或第二活動件272帶動第二調整件277作一浮動位移(如X方向、Y方向或水平角度Θ)而解除卡掣,使第一活動件271可帶動壓接件273作浮動位移,進而微調壓接件273之擺置位置或擺置角度,使壓接件273精準壓接電子元件。The adjustment structure includes a
於本實施例,第一調整件276為一面板,並鎖固裝配於框架26,於拆卸第一調整件276時,可便利取出整個壓接器;第一調整件276與作動具274之第一構件2741具有適當間距,第一調整件276於相對第二活動件272之位置設有容置槽2762,容置槽2762之底板2763開設有第一通孔2764,以供穿置第二調整件277,第一調整件276於底板2763設有複數個為弧凸塊之第一浮接部2761。第二調整件277為一面板,並位於第一調整件276之容置槽2762,且與容置槽2762間具有適當之移動間距,第二調整件277於相對應第一調整件276之第一浮接部2761的位置設有呈弧槽之第二浮接部2771,於未作動狀態,第二調整件277以本身之自重或第一構件2741或第二活動件272之自重,令第二浮接部2771貼合卡掣於第一調整件276之第一浮接部2761。連接件278為一栓具,並鎖接第二調整件277及第一構件2741,令第一構件2741帶動第二調整件277之第二浮接部2771脫離第一浮接部2761或沿第一浮接部2761作浮動位移而解除卡掣,使第二活動件272帶動第一活動件271及壓接件273作浮動位移(如X-Y方向或水平角度Θ),進而微調壓接件273之擺置位置或擺置角度。In this embodiment, the
復歸結構於第一調整件276與作動具274或第二活動件272間配置第一彈性件279,以帶動作動具274復位;於本實施例,第二調整件277開設有第二通孔2772,供穿置第一彈性件279,第一彈性件279之一端頂抵於作動具274之第一構件2741,另一端頂抵一鎖固於第一調整件276之蓋板280,以帶動作動具274復位。In the return structure, a first
復歸結構另於作動具274與第一活動件271間配置至少一第二彈性件281,以帶動第一活動件271復位;於本實施例,復歸結構於第一活動件271之二相對套合塊2714間設有延伸部2718,延伸部2718設有呈凹槽之讓位部2719,復歸結構於作動具274之第三構件2743相對應讓位部2719之位置設有立柱282,立柱282穿套第二彈性件281及卡抵塊283,卡抵塊283之一面頂抵於第一活動件271之延伸部2718,以頂撐第一活動件271,卡抵塊283之另一面頂抵於第二彈性件281。In the return structure, at least one second
然測試時序,壓接機構之限位件275於承擋受限後,可限位第二活動件272及第一活動件271,至於擋掣限位件275之設計可視作業需求,而於測試座232、承板22或框架26上,且相對於限位件275之位置設有至少一擋掣部件
;例如限位件275呈Y方向配置時,可於測試座232或承板22相對應限位件275之位置設有一為擋片之擋掣部件;例如限位件275呈Z方向配置時,可於框架26相對應限位件275之位置設有一為擋槽之擋掣部件,前述舉例設計均可擋掣限位件275,不受限於本實施例。於本實施例,測試座232於相對限位件275之位置設有一呈Y方向延伸且為擋片之擋掣部件2324,擋掣部件2324與測試座232可為一體成型或各別為獨立元件,作動具274於未作動狀態,可使限位件275與擋掣部件2324具有適當間距。
However, in the test sequence, the limiting
請參閱圖4、6、7,本發明之模組化測試裝置20輕便且易搬運,可便利擺置於一承載物(如實驗室的實驗台桌或小型工作桌),模組化測試裝置20之載具21亦可以定位用元件(如栓具或定位銷)而定位於承載物;於本實施例中,模組化測試裝置20鎖固於小型工作桌30之桌板。於測試時,驅動單元以馬達251經皮帶輪組252帶動測試單元之承板22作X方向位移移出載具21之測試區213,由於壓接器之限位件275未貼接測試座232之擋掣部件2324,使得承板22可載送一批次複數個測試座232同步移出測試區213,而位於載具21之外部,以供輸送器(圖未示出)將一批次複數個待測電子元件移入測試座232;之後,馬達251經皮帶輪組252帶動承板22載送一批次複數個具待測電子元件之測試座232移入測試區213。Please refer to FIGS. 4 , 6 and 7 . The
請參閱圖8、9,由於測試座232相對於壓接器,並令擋掣部件2324位於壓接器之限位件275的上方,於壓測時,壓接器之通氣道2717輸入氣體至第一活動件271之氣室2716,氣室2716內之氣體分別推動第一活動件271及第二活動件272沿作業軸線L作反向位移,第一活動件271即帶動壓接件273同步作Z方向向下位移,若壓接件273之第二定位部件2733與測試座232之第一定位部件2323具有微小位差,壓接件273之第二定位部件2733會頂抵於測試座232之承擋面2322;由於氣室2716內之氣體無法推動壓接件273繼續向下位移,在氣室2716內持續輸入氣體之狀態下,氣體會推動第二活動件272沿作業軸線L作Z方向反向向上位移,第二活動件272再頂推作動具274及第二調整件277作Z方向向上浮動,第二活動件272即利用第二調整件277之第二浮接部2771沿第一調整件276之第一浮接部2761作Y方向浮動位移,而帶動第一活動件271及壓接件273作Y方向位移,以微調壓接件273之位置,使壓接件273之第二定位部件2733對位測試座232之第一定位部件2323。Please refer to FIGS. 8 and 9 , since the
然,作動具274作Z方向向上位移時,並以第三構件2743帶動限位件275同步位移,令限位件275抵頂於測試座232之擋掣部件2324,以限位作動具274,由於作動具274連接第二活動件272,亦同步限位第二活動件272,在氣室2716保持一定預設氣壓的要件下,氣室2716的氣體即頂推第一活動件271帶動壓接件273沿作業軸線L作Z方向向下位移,使壓接件273之第二定位部件2733***於測試座232之第一定位部件2323,並使第一活動件271承受氣室2716之氣體向下推力,而有效防止第一活動件271及壓接件273沿作業軸線L反向位移,不僅可使壓接件273之下壓部2731順利壓接電子元件,更可使壓接件273確實以預設下壓力壓接電子元件,進而提高測試品質。However, when the
請參閱圖2~5、10,本發明模組化測試裝置20應用於測試設備,測試設備包含機台40、供料裝置50、收料裝置60、多層式架體70、本發明模組化測試裝置20、輸送裝置80及中央控制裝置(圖未示出);供料裝置50配置於機台40,並設有至少一容納待作業電子元件之供料承置器51;收料裝置60配置於機台40,並設有至少一容納已作業電子元件之收料承置器61;多層式架體70配置於機台40,並設有複數層,各層設有至少一架置空間71;複數個模組化測試裝置20配置於多層式架體70之複數層架置空間71,各模組化測試裝置20以供測試一批次電子元件,於本實施例中,架體70各層之架置空間71供裝配模組化測試裝置20之載具21,而可迅速將載具21承載整組之測試單元、壓接單元及驅動單元裝配於架體70上,以利修護更換;輸送裝置80配置於機台40,並設有至少一第一輸送器,以輸送電子元件;更進一步,第一輸送器可為移料器或搬盤器
,輸送裝置80依作業需求而增設至少一第二輸送器,第二輸送器可為載台,第二輸送器可配置於機台40,或與一第三輸送器同步作Z方向位移至架體70之各層架置空間71前方,又第二輸送器配置於機台40可採定點固設,或於機台40上作至少一方向位移;再者,第二輸送器可設有複數個承槽,以供容置待測電子元件及已測電子元件,而第一輸送器則為移料器,以供移載電子元件;第二輸送器可承載一供料承置器51及一收料承置器61,以迅速供應整盤具待測電子元件之供料承置器51,以及利用收料承置器61收置整盤已測電子元件,而第一輸送器則為搬盤器,以供搬移供料承置器51。於本實施例,輸送裝置80包含第一輸送器81、第二輸送器82、第三輸送器83及第四輸送器84,第一輸送器81為一搬盤器,以將供料裝置50之具整盤待測電子元件之供料承置器51搬移至一為載台之第二輸送器82,第二輸送器82並設有一空的收料承置器61,於模組化測試裝置20之驅動單元驅動測試單元之承板22載送複數個測試座232由測試區213移出至換料區41,第二輸送器82與第三輸送器83同步作Z方向位移至承板22之一方,第三輸送器83之複數個吸嘴可作變距調整位置,以一次於複數個測試座232取出複數個已測之電子元件,並移載至第二輸送器82之收料承置器61收置,第三輸送器83再於第二輸送器82之供料承置器51取出複數個待測電子元件,並移載至承板22之複數個測試座232,測試裝置20之驅動單元驅動承板22載送複數個具待測電子元件之測試座232由換料區41移入至測試區213而執行測試作業;第四輸送器84為一搬盤器,以將第二輸送器82之收料承置器61依測試結果,而搬移至收料裝置60收置;中央控制裝置以供控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。
Please refer to FIGS. 2 to 5 and 10. The
[習知] 11:機台 12:供料裝置 13:收料裝置 14A、14B、14C、14D、14E、14F:測試裝置 141A:測試器 142A:電路板 143A:機架 144A:壓接器 15:輸送器 [本發明] 20:測試裝置 21:載具 211:底板 212:側板 213:測試區 22:承板 221:支撐部件 222:容置孔 231:電路板 232:測試座 2321:探針 2322:承擋面 2323:第一定位部件 2324:擋掣部件 24:滑軌組 251:馬達 252:皮帶輪組 26:框架 261:扣具 271:第一活動件 2711:第一表面 2712:容置空間 2713:裝配面 2714:套合塊 2715:導孔 2716:氣室 2717:通氣道 2718:延伸部 2719:讓位部 272:第二活動件 2721:第二表面 2722:連接面 273:壓接件 2731:下壓部 2732:擋面 2733:第二定位部件 274:作動具 2741:第一構件 2742:第二構件 2743:第三構件 275:限位件 276:第一調整件 2761:第一浮接部 2762:容置槽 2763:底板 2764:第一通孔 277:第二調整件 2771:第二浮接部 2772:第二通孔 278:連接件 279:第一彈性件 280:蓋板 281:第二彈性件 282:立柱 283:卡抵塊 L:作業軸線 30:工作桌 40:機台 41:換料區 50:供料裝置 51:供料承置器 60:收料裝置 61:收料承置器 70:架體 71:架置空間 80:輸送裝置 81:第一輸送器 82:第二輸送器 83:第三輸送器 84:第四輸送器 [acquaintance] 11: Machine 12: Feeding device 13: Receiving device 14A, 14B, 14C, 14D, 14E, 14F: Test Sets 141A: Tester 142A: circuit board 143A: Rack 144A: Crimper 15: Conveyor [this invention] 20: Test device 21: Vehicle 211: Bottom plate 212: Side panels 213: Test Area 22: Bearing plate 221: Support parts 222: accommodating hole 231: circuit board 232: Test seat 2321: Probe 2322: bearing surface 2323: The first positioning part 2324: Stopper parts 24: Slide rail group 251: Motor 252: Pulley set 26: Frame 261: Buckle 271: First moving piece 2711: First Surface 2712: accommodating space 2713: Assembly Surface 2714: Nesting block 2715: Pilot Hole 2716: Air Chamber 2717: Airway 2718: Extensions 2719: Give way 272: Second moving piece 2721: Second Surface 2722: Connection Surface 273: Crimp 2731: Press down 2732: blocking face 2733: Second positioning part 274: Actuator 2741: First Member 2742: Second Member 2743: Third member 275: Limiter 276: First adjustment piece 2761: The first floating part 2762: Receptacle slot 2763: Bottom Plate 2764: first through hole 277: Second adjustment piece 2771: Second floating part 2772: Second Via 278: Connector 279: First elastic piece 280: Cover 281: Second elastic piece 282: Column 283: Card block L: Working axis 30: Work Desk 40: Machine 41: Refueling area 50: Feeding device 51: Feed holder 60: Receiving device 61: Receiving holder 70: Frame 71: Mounting space 80: Conveying device 81: First Conveyor 82: Second conveyor 83: Third Conveyor 84: Fourth Conveyor
圖1:習知測試裝置之使用示意圖。 圖2:本發明模組化測試裝置之前視圖。 圖3:本發明模組化測試裝置之側視圖。 圖4:本發明壓接器與測試器之示意圖。 圖5:本發明壓接器之側視圖。 圖6:本發明模組化測試裝置之使用示意圖(一)。 圖7:本發明模組化測試裝置之使用示意圖(二)。 圖8:本發明模組化測試裝置之使用示意圖(三)。 圖9:本發明模組化測試裝置之使用示意圖(四)。 圖10:本發明模組化測試裝置應用於測試設備之配置圖。 Figure 1: A schematic diagram of the use of a conventional test device. Figure 2: Front view of the modular testing device of the present invention. Figure 3: A side view of the modular testing device of the present invention. Figure 4: Schematic diagram of the crimper and the tester of the present invention. Figure 5: Side view of the crimper of the present invention. FIG. 6 is a schematic diagram of the use of the modular testing device of the present invention (1). FIG. 7 is a schematic diagram (2) of the use of the modular testing device of the present invention. FIG. 8 is a schematic diagram of the use of the modular testing device of the present invention (3). FIG. 9 is a schematic diagram (4) of the use of the modular testing device of the present invention. FIG. 10 is a configuration diagram of the application of the modular testing device of the present invention to testing equipment.
20:測試裝置 20: Test device
21:載具 21: Vehicle
211:底板 211: Bottom plate
212:側板 212: Side panels
213:測試區 213: Test Area
22:承板 22: Bearing plate
221:支撐部件 221: Support parts
222:容置孔 222: accommodating hole
232:測試座 232: Test seat
24:滑軌組 24: Slide rail group
251:馬達 251: Motor
252:皮帶輪組 252: Pulley set
26:框架 26: Frame
261:扣具 261: Buckle
273:壓接件 273: Crimp
276:第一調整件 276: First adjustment piece
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