TWI443701B - Protection elements, battery control devices, and battery packs - Google Patents

Protection elements, battery control devices, and battery packs Download PDF

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Publication number
TWI443701B
TWI443701B TW100112146A TW100112146A TWI443701B TW I443701 B TWI443701 B TW I443701B TW 100112146 A TW100112146 A TW 100112146A TW 100112146 A TW100112146 A TW 100112146A TW I443701 B TWI443701 B TW I443701B
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Taiwan
Prior art keywords
insulating layer
battery
metal body
protective element
charge
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TW100112146A
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Chinese (zh)
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TW201205632A (en
Inventor
Koichi Mukai
Masahiko Ishimaru
Takahiro Asada
Chisato Komori
Shoko Nagaki
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Dexerials Corp
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Publication of TWI443701B publication Critical patent/TWI443701B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4264—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing with capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00308—Overvoltage protection
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/0031—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits using battery or load disconnect circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/0241—Structural association of a fuse and another component or apparatus
    • H01H2085/0275—Structural association with a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H61/02—Electrothermal relays wherein the thermally-sensitive member is heated indirectly, e.g. resistively, inductively
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H01M2200/10—Temperature sensitive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H01M2200/10—Temperature sensitive devices
    • H01M2200/108—Normal resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combustion & Propulsion (AREA)
  • Fuses (AREA)
  • Battery Mounting, Suspending (AREA)
  • Secondary Cells (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Description

保護元件、電池控制裝置、及電池包Protection components, battery control devices, and battery packs

本發明係關於一種用以保護由可充放電之電池單元構成之電池與充放電控制電路之保護元件、組裝有此保護元件之電池控制裝置、及電池包。The present invention relates to a protective element for protecting a battery and a charge and discharge control circuit composed of a rechargeable battery unit, a battery control device incorporating the protective element, and a battery pack.

本申請係以2010年4月8日在日本申請之日本專利申請號碼特願2010-89613號為基準，主張優先權者，參照此申請，藉此援引於本申請。The present application is based on Japanese Patent Application No. 2010-89613, filed on Jan.

作為不僅可防止過電流亦可防止過電壓、在攜帶型電子機器用之電池包等有用之保護元件，使用使低熔點金屬體介於電池單元之充放電電流路徑上並且在此低熔點金屬體之附近配置發熱電阻體之保護元件。如圖9所示，此種保護元件100，一般係在使用氧化鋁等之陶瓷之絕緣基板101上設置發熱電阻體102，在發熱電阻體102上配置低熔點金屬體104。As a protective element that can prevent overcurrent and prevent overvoltage and is used in battery packs for portable electronic devices, the low melting point metal body is interposed between the charge and discharge current paths of the battery cells and the low melting point metal body is used. The protective element of the heating resistor is placed in the vicinity. As shown in FIG. 9, in such a protective element 100, a heating resistor 102 is generally provided on an insulating substrate 101 made of ceramic such as alumina, and a low-melting metal body 104 is placed on the heating resistor 102.

低熔點金屬體104設置於絕緣基板101上，且連接於成為電池單元與電池單元之充放電電流路徑之充放電電路之間所連接之導電層106。導電層106具備：與絕緣基板101之表面相對向設置之一對表面電極106a、與絕緣基板101之背面相對向設置之一對背面電極106b、及分別連接各表面電極106a與背面電極106b之端子電極106c。背面電極106b之一側連接於電池單元，另一側連接於充放電電路。The low-melting-point metal body 104 is provided on the insulating substrate 101, and is connected to the conductive layer 106 which is connected between the charge and discharge circuits of the charge and discharge current paths of the battery cells and the battery cells. The conductive layer 106 includes a pair of surface electrodes 106a facing the surface of the insulating substrate 101, a pair of back electrodes 106b facing the back surface of the insulating substrate 101, and terminals for connecting the surface electrodes 106a and 106b, respectively. Electrode 106c. One side of the back electrode 106b is connected to the battery cell, and the other side is connected to the charge and discharge circuit.

發熱電阻體102透過設置於絕緣基板101上未圖示之導電圖案而與電流控制元件連接，並且透過低熔點金屬體104而與充放電電流路徑連接。又，發熱電阻體102透過由玻璃層構成之第1絕緣層107設置於絕緣基板101之表面，並且於上方設置有由玻璃層構成之第2絕緣層108。又，低熔點金屬體104透過導體109設置於第2絕緣層108上，並且與發熱電阻體102連接。The heating resistor 102 is connected to the current control element through a conductive pattern (not shown) provided on the insulating substrate 101, and is connected to the charge and discharge current path through the low melting metal body 104. Further, the heating resistor 102 is provided on the surface of the insulating substrate 101 through the first insulating layer 107 made of a glass layer, and the second insulating layer 108 made of a glass layer is provided on the upper surface. Further, the low-melting-point metal body 104 is provided on the second insulating layer 108 via the conductor 109, and is connected to the heating resistor 102.

又，保護元件100，在電池單元之過充電或過放電等之異常時，過電流流經發熱電阻體102後，藉由電流控制元件進行控制，俾使電流從電池單元流經發熱電阻體102，藉由從發熱電阻體102所產生之熱使低熔點金屬體104熔融，用以將充放電電流路徑截斷。Further, when the protection element 100 is in an abnormal state such as overcharging or overdischarging of the battery cell, an overcurrent flows through the heating resistor body 102, and is controlled by the current control element to cause a current to flow from the battery cell through the heating resistor body 102. The low-melting-point metal body 104 is melted by heat generated from the heating resistor 102 to cut off the charge and discharge current path.

專利文獻1：日本特開2009-259724號公報Patent Document 1: Japanese Laid-Open Patent Publication No. 2009-259724

該保護元件100中，由於藉由發熱電阻體102所產生之熱使低熔點金屬體104熔融，以將從電池單元所流之充放電電流路徑截斷，因此異常時，為及時截斷充放電電流路徑，必須使發熱電阻體102之熱高效率傳導至低熔點金屬體104。In the protective element 100, the low-melting-point metal body 104 is melted by the heat generated by the heating resistor 102 to cut off the charging/discharging current path flowing from the battery cell. Therefore, in the case of an abnormality, the charging/discharging current path is cut off in time. The heat of the heating resistor 102 must be efficiently conducted to the low melting metal body 104.

然而，由於習知之保護元件100，藉由玻璃形成有設置於低熔點金屬體104周圍之第1、第2之絕緣層107、108，因此導熱率較低，無法將發熱電阻體102之熱高效率傳導至低熔點金屬體104。However, since the protective element 100 of the prior art has the first and second insulating layers 107 and 108 provided around the low-melting-point metal body 104 by the glass, the thermal conductivity is low, and the heat of the heating resistor 102 cannot be high. The efficiency is conducted to the low melting point metal body 104.

又，習知之保護元件100，從發熱電阻體102所產生之熱透過低熔點金屬體104及表面電極106a傳導至絕緣基板101，又，亦透過第1絕緣層107傳導至絕緣基板101。習知之保護元件100，由於絕緣基板101使用氧化鋁等導熱率高之材料，因此形成從發熱電阻體102所產生之熱透過第1絕緣層107傳導至絕緣基板101之傳熱路徑、及透過導體層106傳導至絕緣基板101之傳熱路徑，無法使低熔點金屬體104之溫度高效率上升。Further, the conventional protective element 100 transmits heat generated from the heating resistor 102 to the insulating substrate 101 through the low melting point metal body 104 and the surface electrode 106a, and is also conducted to the insulating substrate 101 through the first insulating layer 107. In the conventional protective element 100, since the insulating substrate 101 is made of a material having a high thermal conductivity such as alumina, the heat generated by the heating resistor 102 is transmitted through the first insulating layer 107 to the insulating substrate 101, and the transmission conductor and the transmission conductor are formed. The layer 106 is conducted to the heat transfer path of the insulating substrate 101, and the temperature of the low melting point metal body 104 cannot be increased with high efficiency.

因此，本發明之目的在於提供使從發熱電阻體所產生之熱通過保護元件之傳熱路徑、不損耗且高效率傳導至低熔點金屬體，當電池單元之過充電或過放電等之異常時，可及時將電池單元之充放電電流路徑截斷之保護元件、電池控制裝置、及電池包。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a heat transfer path from a heat generating resistor to a low melting point metal body without loss and high efficiency through a heat transfer path of the protective element, when the battery unit is overcharged or overdischarged. The protection component, the battery control device, and the battery pack that can cut off the charging and discharging current path of the battery unit in time.

為解決上述課題，本發明之保護元件，係連接於電路之電流路徑上，其特徵在於，具有：絕緣基板；發熱電阻體，隔著第1絕緣層形成於該絕緣基板之一面；低熔點金屬體，隔著第2絕緣層配置於該發熱電阻體之上方，構成電流路徑之一部分；以及連接部，與該低熔點金屬體之兩端連接，將該電流路徑與該低熔點金屬體加以電氣連接；該連接部係隔著第3絕緣層設於該絕緣基板之該一面。In order to solve the above problems, the protection element of the present invention is connected to a current path of a circuit, and has an insulating substrate, a heating resistor formed on one surface of the insulating substrate via a first insulating layer, and a low melting point metal. a body disposed above the heating resistor body via a second insulating layer to form a portion of the current path; and a connecting portion connected to both ends of the low melting point metal body to electrically connect the current path and the low melting point metal body The connection portion is provided on the one surface of the insulating substrate via the third insulating layer.

又，本發明之電池控制裝置，具備：充放電控制電路，係連接於由可充放電之電池單元構成之電池之充放電電流路徑上，控制該電池之充放電；檢測電路，檢測該電池單元之電壓值；保護元件，在藉由該檢測電路所檢測之電池單元之電壓值成為既定範圍外時，將該充放電電流路徑截斷；以及電流控制元件，用以驅動該保護元件；該保護元件，具有：絕緣基板；發熱電阻體，隔著第1絕緣層形成於該絕緣基板之一面；低熔點金屬體，隔著第2絕緣層配置於該發熱電阻體之上方，構成該充放電電流路徑之一部分；以及連接部，與該低熔點金屬體之兩端連接，將該充放電電流路徑與該低熔點金屬體加以電氣連接；該連接部係隔著第3絕緣層設於該絕緣基板之該一面。Further, the battery control device of the present invention includes: a charge and discharge control circuit that is connected to a charge and discharge current path of a battery formed of a chargeable and dischargeable battery cell to control charging and discharging of the battery; and a detection circuit that detects the battery unit a voltage value; the protection element intercepts the charge and discharge current path when a voltage value of the battery unit detected by the detection circuit becomes outside a predetermined range; and a current control element for driving the protection element; the protection element And an insulating substrate; the heating resistor is formed on one surface of the insulating substrate via a first insulating layer; and the low melting point metal body is disposed above the heating resistor via a second insulating layer to form the charging/discharging current path And a connecting portion connected to both ends of the low melting point metal body to electrically connect the charging and discharging current path to the low melting point metal body; the connecting portion is disposed on the insulating substrate via the third insulating layer That side.

又，本發明之電池包，具備：電池，係由可充放電之電池單元構成；充放電控制電路，係連接於該電池之充放電電流路徑上，控制該電池之充放電；檢測電路，檢測該電池單元之電壓值；保護元件，在藉由該檢測電路所檢測之電池單元之電壓值成為既定範圍外時，將該充放電電流路徑截斷；以及電流控制元件，用以驅動該保護元件；該保護元件，具有：絕緣基板；發熱電阻體，隔著第1絕緣層形成於該絕緣基板之一面；低熔點金屬體，隔著第2絕緣層配置於該發熱電阻體之上方，構成該充放電電流路徑之一部分；以及連接部，與該低熔點金屬體之兩端連接，將該充放電電流路徑與該低熔點金屬體加以電氣連接；該連接部係隔著第3絕緣層設於該絕緣基板之該一面。Further, the battery pack of the present invention comprises: a battery comprising a rechargeable battery unit; and a charge and discharge control circuit connected to a charge and discharge current path of the battery to control charging and discharging of the battery; and a detection circuit for detecting a voltage value of the battery unit; the protection element, when the voltage value of the battery unit detected by the detection circuit is outside a predetermined range, the charging and discharging current path is cut off; and a current control element for driving the protection element; The protective element includes: an insulating substrate; a heating resistor formed on one surface of the insulating substrate via a first insulating layer; and a low melting point metal body disposed above the heating resistor via a second insulating layer to constitute the charging a portion of the discharge current path; and a connection portion connected to both ends of the low melting point metal body to electrically connect the charge and discharge current path to the low melting point metal body; the connection portion is disposed on the third insulating layer The one side of the insulating substrate.

依據本發明，由於在基板與連接部之間設置第3絕緣層，因此可抑制發熱電阻體之熱經由低熔點金屬體而從連接部往絕緣基板側散熱，可使熱高效率蓄積於低熔點金屬體，快速熔斷。According to the present invention, since the third insulating layer is provided between the substrate and the connection portion, heat of the heating resistor can be prevented from being radiated from the connection portion to the insulating substrate side via the low-melting-point metal body, and heat can be efficiently accumulated in the low melting point. Metal body, fast blown.

以下，參照圖式詳細說明本發明適用之保護元件、電池控制裝置、及電池包。另外，本發明並非僅限定於以下實施形態者，在不脫離本發明要旨之範圍，當然可進行各種變更。Hereinafter, the protective element, the battery control device, and the battery pack to which the present invention is applied will be described in detail with reference to the drawings. The present invention is not limited to the embodiments described below, and various modifications can be made without departing from the scope of the invention.

本發明適用之保護元件，係用以保護例如由可充放電之電池單元構成之電池與充放電控制電路之元件，如圖1所示，係組裝於電池包1中來使用，該電池包1具有由複數個(此處合計為4個)可充放電之電池單元11～14構成之電池10。The protective element to which the present invention is applied is used to protect components such as a battery and a charge and discharge control circuit composed of a rechargeable battery unit, as shown in FIG. 1 , which is assembled in a battery pack 1 for use. The battery 10 is composed of a plurality of (four in total) chargeable and dischargeable battery cells 11 to 14.

電池包1具備：電池10、用以控制電池10之充放電之充放電控制電路20、用以保護電池10與充放電控制電路20之保護元件30、用以檢測各電池單元11～14之電壓之檢測電路40、以及依據檢測電路40之檢測結果以控制保護元件30之動作之電流控制元件50。The battery pack 1 includes a battery 10, a charge and discharge control circuit 20 for controlling charge and discharge of the battery 10, a protection element 30 for protecting the battery 10 and the charge and discharge control circuit 20, and a voltage for detecting each of the battery cells 11 to 14. The detection circuit 40 and the current control element 50 that controls the operation of the protection element 30 in accordance with the detection result of the detection circuit 40.

電池10係如上所述，串聯有電池單元11～14者，該電池單元11～14要進行控制以避免成為例如如鋰離子二次電池之過充電及過放電狀態；透過電池包1之正極端子1a、負極端子1b以可拆裝方式連接於充電裝置2，施加來自充電裝置2之充電電壓。The battery 10 is as described above, and the battery cells 11 to 14 are connected in series, and the battery cells 11 to 14 are controlled to avoid, for example, an overcharge and overdischarge state of a lithium ion secondary battery; 1a, the negative electrode terminal 1b is detachably connected to the charging device 2, and the charging voltage from the charging device 2 is applied.

充放電控制電路20具備：2個電流控制元件21、22，係串聯於從電池10流經充電裝置2之充放電電流路徑；以及用以控制此等電流控制元件21、22之動作之控制部23。電流控制元件21、22係由例如場效電晶體(以下稱為FET)構成，藉由控制部23所控制之閘極電壓，以控制電池10之充放電電流路徑之導通與截斷。控制部23係從充電裝置2接受電力供應以進行動作，依據檢測電路40之檢測結果控制電流控制元件21、22之動作，俾使當電池10為過放電或過充電時，將充放電電流路徑予以截斷。The charge and discharge control circuit 20 includes two current control elements 21 and 22 connected in series to a charge and discharge current path flowing from the battery 10 through the charging device 2, and a control unit for controlling the operations of the current control elements 21 and 22. twenty three. The current control elements 21 and 22 are composed of, for example, field effect transistors (hereinafter referred to as FETs), and are controlled by the gate voltage controlled by the control unit 23 to control the on and off of the charge and discharge current path of the battery 10. The control unit 23 receives power supply from the charging device 2 to operate, controls the operation of the current control elements 21 and 22 in accordance with the detection result of the detection circuit 40, and causes the charge and discharge current path when the battery 10 is over-discharged or over-charged. Cut off.

保護元件30係連接於電池10與充放電控制電路20之間之充放電電流路徑上，其動作藉由電流控制元件50進行控制。The protection element 30 is connected to the charge and discharge current path between the battery 10 and the charge and discharge control circuit 20, and its operation is controlled by the current control element 50.

檢測電路40係與各電池單元11～14連接，用以檢測各電池單元11～14之電壓值，將各電壓值供應給充放電控制電路20之控制部23。又，當任一個電池單元11～14成為過充電電壓或過放電電壓時，檢測電路40輸出用以控制電流控制元件50之控制訊號。The detection circuit 40 is connected to each of the battery cells 11 to 14, and detects the voltage value of each of the battery cells 11 to 14, and supplies each voltage value to the control unit 23 of the charge and discharge control circuit 20. Further, when any one of the battery cells 11 to 14 becomes an overcharge voltage or an overdischarge voltage, the detection circuit 40 outputs a control signal for controlling the current control element 50.

當電池單元11～14之電壓值成為既定之範圍外時，具體而言，當成為過放電或過充電狀態時，電流控制元件50依據從檢測電路40所輸出之控制訊號，使保護元件30動作，進行控制，用以將電池10之充放電電流路徑予以截斷。When the voltage values of the battery cells 11 to 14 are outside the predetermined range, specifically, when the battery is in an overdischarged or overcharged state, the current control component 50 operates the protection component 30 in accordance with the control signal output from the detection circuit 40. Control is performed to cut off the charge and discharge current path of the battery 10.

接著，具體說明保護元件30之構成。本發明適用之保護元件30具有圖2所示之電路構成，係對應寬廣之電池10之電壓變動，因電阻體之熱而確實將熔絲熔融，用以將電池10之充放電電流路徑予以截斷者。Next, the configuration of the protective element 30 will be specifically described. The protective element 30 to which the present invention is applied has the circuit configuration shown in FIG. 2, and corresponds to a wide voltage variation of the battery 10, and the fuse is surely melted by the heat of the resistor body to cut off the charge and discharge current path of the battery 10. By.

亦即，保護元件30係如圖2所示，具備：熔絲31a、31b，係由靠加熱予以熔斷之低熔點金屬體構成；以及電阻體32，通電後產生使熔絲31a、31b熔融之熱。That is, as shown in FIG. 2, the protective element 30 includes fuses 31a and 31b which are formed of a low-melting-point metal body which is blown by heating, and a resistor body 32 which is formed to melt the fuses 31a and 31b after being energized. heat.

熔絲31a、31b，例如，物理上係在電路構成上分離一個低熔點金屬體，透過接點P1進行串聯之元件，串聯於電池10與充放電控制電路20之間之充放電電流路徑上。例如，熔絲31a係透過未與熔絲31b連接之接點A3而與充放電控制電路20連接，熔絲31b係透過未與熔絲31a連接之接點A1而與電池10連接。The fuses 31a and 31b are, for example, physically separated from a low melting point metal body by a circuit configuration, and connected in series through the contact point P1, and connected in series to a charge and discharge current path between the battery 10 and the charge and discharge control circuit 20. For example, the fuse 31a is connected to the charge and discharge control circuit 20 through the contact A3 which is not connected to the fuse 31b, and the fuse 31b is connected to the battery 10 through the contact A1 which is not connected to the fuse 31a.

電阻體32之一端設置有與熔絲31a、31b之接點P1，另一端與連接於電流控制元件50之端子部33連接。又，電阻體32藉由電流控制元件50通電後，會產生使構成熔絲31a、31b之低熔點金屬體熔解之熱。One end of the resistor body 32 is provided with a contact P1 to the fuses 31a and 31b, and the other end is connected to a terminal portion 33 connected to the current control element 50. Further, when the resistor 32 is energized by the current control element 50, heat is generated to melt the low melting point metal body constituting the fuses 31a and 31b.

由以上所述之電路構成所構成之保護元件30藉由例如如圖3、圖4A及圖4B所示之構造體可實現。圖3係從以三維正交座標XYZ軸為基準所配置之保護元件30之XZ平面觀察之剖面圖。又，圖4A及圖4B係用以說明從XY平面觀察之保護元件30之積層構造圖。The protective element 30 constituted by the above-described circuit configuration can be realized by, for example, a structure as shown in FIGS. 3, 4A and 4B. Fig. 3 is a cross-sectional view taken from the XZ plane of the protective element 30 arranged with reference to the three-dimensional orthogonal coordinate XYZ axis. 4A and 4B are views for explaining a laminated structure of the protective element 30 viewed from the XY plane.

保護元件30具有：發熱電阻體64，隔著絕緣層形成於陶瓷等之絕緣性矩形狀之基板60之一面60a上；低熔點金屬體67，隔著絕緣層設置於發熱電阻體64之上方，用以構成充放電電流路徑之一部分；以及連接部611～613，與低熔點金屬體67之兩端連接，用以連接充放電電流路徑與低熔點金屬體67。又，保護元件30，其連接部611、612係隔著低導熱性之玻璃層70、71設置於基板60。The protective element 30 has a heating resistor 64 formed on one surface 60a of an insulating rectangular substrate 60 such as ceramics via an insulating layer, and a low melting metal body 67 disposed above the heating resistor 64 via an insulating layer. A portion for forming a charge and discharge current path; and connecting portions 611 to 613 connected to both ends of the low melting point metal body 67 for connecting the charge and discharge current path and the low melting point metal body 67. Further, in the protective element 30, the connecting portions 611 and 612 are provided on the substrate 60 via the glass layers 70 and 71 having low thermal conductivity.

絕緣基板60使用例如機械強度高之氧化鋁等之陶瓷。氧化鋁之優點係基板60之機械強度高，且容易加工或處理，相反地，導熱率高約為25W/m‧K。又，基板60雖亦可使用混合氧化鋁與玻璃系材料之玻璃陶瓷等導熱率較低之材料，但由於含有玻璃等之部分變脆弱，因此除有損加工性或耐久性等之外，當玻璃系材料未均勻混合時，在強度或導熱率亦會產生偏差，且製造成本亦提高。保護元件30，如後所述，藉由在基板60之兩面設置玻璃層70、71之積層構造，將發熱電阻體64之熱有效率地傳導至低熔點金屬體67，因此基板60亦可使用氧化鋁。As the insulating substrate 60, for example, a ceramic such as alumina having high mechanical strength is used. The advantage of alumina is that the substrate 60 has high mechanical strength and is easy to process or handle. Conversely, the thermal conductivity is about 25 W/m‧K. Further, although the substrate 60 may be made of a material having a low thermal conductivity such as a glass ceramic having a mixed alumina or a glass-based material, the portion containing the glass or the like is weak, so that it is detrimental to workability, durability, and the like. When the glass-based material is not uniformly mixed, there is a variation in strength or thermal conductivity, and the manufacturing cost is also increased. As described later, the protective element 30 has a laminated structure in which the glass layers 70 and 71 are provided on both surfaces of the substrate 60, and the heat of the heating resistor 64 is efficiently conducted to the low melting point metal body 67. Therefore, the substrate 60 can also be used. Alumina.

以此種方式，若考量機械強度及導熱率，作為可使用於基板60之材料，列舉有例如，氧化鋁(Al2 O3 ，導熱率25W/m‧K)、在氧化鋁70%中混合富鋁紅柱石(mullite)(3Al2 O3 ‧2SiO2 )30%者(導熱率7W/m‧K)、在氧化鋁50%中混合富鋁紅柱石50%者(導熱率4W/m‧K)、二氧化鋯(ZrO2 ，導熱率3W/m‧K)。In this manner, in consideration of mechanical strength and thermal conductivity, as a material which can be used for the substrate 60, for example, alumina (Al 2 O 3 , thermal conductivity: 25 W/m‧K), and 70% in alumina are mixed. 30% of mullite (3Al 2 O 3 ‧2SiO 2 ) (thermal conductivity 7W/m‧K), 50% of mullite mixed in 50% alumina (thermal conductivity 4W/m‧ K), zirconium dioxide (ZrO 2 , thermal conductivity 3W/m‧K).

其中，使用在導熱率5W/m‧K以下即氧化鋁50%中混合富鋁紅柱石50%者、或二氧化鋯以作為基板60之材料時，除可抑制玻璃層70、71所產生之散熱外，亦可抑制基板60所產生之散熱，可將發熱電阻體64之熱高效率傳導至低熔點金屬體67。Among them, when a material having a thermal conductivity of 5 W/m‧K or less, that is, 50% of alumina rich in 50% of mullite or zirconium dioxide is used as the material of the substrate 60, it is possible to suppress the occurrence of the glass layers 70 and 71. In addition to heat dissipation, the heat generated by the substrate 60 can be suppressed, and the heat of the heating resistor 64 can be efficiently conducted to the low-melting metal body 67.

又，圖3中，在位於XY平面上之基板60形成有連接部611～613，用以將保護元件30與充電裝置2、電池10及電流控制元件50連接於側面部。連接部611～613具有：分別形成於基板60之一面60a之導體61b；形成於基板60之另一面60b之導體61c；以及導通孔61a，用以連接此等將基板60內往Z方向貫通所形成之導體61b及導體61c。Further, in FIG. 3, the substrate 60 on the XY plane is formed with connecting portions 611 to 613 for connecting the protective element 30 to the charging device 2, the battery 10, and the current steering element 50 to the side surface portion. The connecting portions 611 to 613 include a conductor 61b formed on one surface 60a of the substrate 60, a conductor 61c formed on the other surface 60b of the substrate 60, and a via hole 61a for connecting the substrate 60 to the Z direction. The conductor 61b and the conductor 61c are formed.

在此等3個連接部611～613中，相對向之2個連接部611、612成為各導體61c分別與電池10及充放電控制電路20連接之接點。又，另一連接部613係作為導體61c與電流控制元件50連接之端子部33之功能。Among the three connection portions 611 to 613, the two connection portions 611 and 612 are connected to the battery 10 and the charge and discharge control circuit 20, respectively. Further, the other connecting portion 613 functions as the terminal portion 33 to which the conductor 61c is connected to the current steering element 50.

連接部611～613之導體61b、導體61c及導通孔61a係藉由將導電糊印刷於基板60之既定部位來形成。作為構成連接部611～613之導電材料，可使用例如銀、銅、鎢(W)。The conductor 61b, the conductor 61c, and the via hole 61a of the connection portions 611 to 613 are formed by printing a conductive paste on a predetermined portion of the substrate 60. As the conductive material constituting the connecting portions 611 to 613, for example, silver, copper, or tungsten (W) can be used.

連接部611、612之導體61b係隔著成為絕緣層之第1玻璃層70形成於基板60之一面60a上。又，連接部611、612之導體61c係隔著成為絕緣層之第2玻璃層71形成於基板60之另一面60b上。The conductors 61b of the connecting portions 611 and 612 are formed on one surface 60a of the substrate 60 via the first glass layer 70 which is an insulating layer. Further, the conductors 61c of the connecting portions 611 and 612 are formed on the other surface 60b of the substrate 60 via the second glass layer 71 which is an insulating layer.

又，在基板60之一面60a之中央部形成有板狀之第1絕緣層62。在此第1絕緣層62之表面62a構裝有導體圖案63a、與導體圖案63a連接之發熱電阻體64、與發熱電阻體64連接之導體圖案63b。此處，導體圖案63b係與作為端子部33功能之連接部613之導體61b連接，導體圖案63a，係隔著導體66而與低熔點金屬體67連接，藉由此種連接關係，保護元件30，其作為端子部33功能之連接部613隔著導體圖案63b、發熱電阻體64、導體圖案63a，經由導體66而與低熔點金屬體67連接。Further, a plate-shaped first insulating layer 62 is formed at a central portion of one surface 60a of the substrate 60. A conductor pattern 63a, a heating resistor 64 connected to the conductor pattern 63a, and a conductor pattern 63b connected to the heating resistor 64 are disposed on the surface 62a of the first insulating layer 62. Here, the conductor pattern 63b is connected to the conductor 61b which is the connection portion 613 which functions as the terminal portion 33, and the conductor pattern 63a is connected to the low-melting-point metal body 67 via the conductor 66, and the protection element 30 is connected by such a connection relationship. The connection portion 613 functioning as the terminal portion 33 is connected to the low-melting-point metal body 67 via the conductor 66 via the conductor pattern 63b, the heating resistor 64, and the conductor pattern 63a.

發熱電阻體64可使用例如釕(Ru)、碳化矽(SiC，相對電阻：10Ω‧cm)、矽化鉬(MoSi2 ，相對電阻：2.E+0.5Ω‧cm)、鑭鉻氧化物(LaCro3 )、碳(C，相對電阻：1.00E-3Ω‧cm)。As the heating resistor 64, for example, ruthenium (Ru), tantalum carbide (SiC, relative resistance: 10 Ω ‧ cm), molybdenum telluride (MoSi 2 , relative resistance: 2.E + 0.5 Ω ‧ cm), ruthenium chrome oxide (LaCro) can be used. 3 ), carbon (C, relative resistance: 1.00E-3 Ω ‧ cm).

導體圖案63a、63b及發熱電阻體64係藉由第2絕緣層65予以被覆。又，透過導體66，在此第2絕緣層65之被覆面構裝有低熔點金屬體67。另外，導體66與低熔點金屬體67係藉由焊料(未圖示)予以連接。The conductor patterns 63a and 63b and the heating resistor 64 are covered by the second insulating layer 65. Further, the low-melting-point metal body 67 is placed on the covering surface of the second insulating layer 65 through the conductor 66. Further, the conductor 66 and the low-melting-point metal body 67 are connected by solder (not shown).

又，導體圖案63a之一端部P11係透過導體66之P12而與低熔點金屬體67連接。具體而言，為進行此種連接，如從-Z方向觀察保護元件30所見之圖4A所示，在第1絕緣層62之上設置導體圖案63a、63b，在構裝有發熱電阻體64之構裝面之導體圖案63a之端部設置接點P11。又，如圖4B所示，為連接此接點P11與導體66之接點P12，透過第2絕緣層65，將導體66加以被覆，又，在導體66之上構裝低熔點金屬體67。亦即，將端部P11設置於發熱電阻體64之外周部之外側，將端部P12設置於第2絕緣層65之外周部之外側，積層各構件時，使端部P11、P12一致。Further, one end portion P11 of the conductor pattern 63a is connected to the low-melting-point metal body 67 through the P12 of the conductor 66. Specifically, in order to perform such a connection, as shown in FIG. 4A as seen from the view of the protective element 30 in the -Z direction, the conductor patterns 63a and 63b are provided on the first insulating layer 62, and the heating resistor 64 is disposed. A contact point P11 is provided at an end portion of the conductor pattern 63a of the mounting surface. Further, as shown in FIG. 4B, in order to connect the contact P12 of the contact P11 and the conductor 66, the conductor 66 is covered by the second insulating layer 65, and the low-melting metal body 67 is formed on the conductor 66. In other words, the end portion P11 is provided on the outer side of the outer peripheral portion of the heating resistor 64, and the end portion P12 is provided on the outer side of the outer peripheral portion of the second insulating layer 65. When each member is laminated, the end portions P11 and P12 are aligned.

低熔點金屬體67係透過焊料而與連接部611、612(作為與電池10及充放電控制電路20連接之接點之功能)之各導體61b連接。又，在低熔點金屬體67之上面設置有助焊劑68。又，低熔點金屬體67之上部係藉由罩體69加以覆蓋。The low-melting-point metal body 67 is connected to each of the conductors 61b of the connection portions 611 and 612 (functions as contacts to the battery 10 and the charge and discharge control circuit 20) through the solder. Further, a flux 68 is provided on the upper surface of the low melting point metal body 67. Further, the upper portion of the low-melting-point metal body 67 is covered by the cover 69.

此種方式之保護元件30，檢測電路40檢測電壓，藉此檢測出電池單元11～14之過充電或過放電等之異常時，將控制訊號輸出至電流控制元件50。電流控制元件50接收控制訊號後，使發熱電阻體64通電並發熱。保護元件30之發熱電阻體64之熱透過第2絕緣層65、導體66而傳導至低熔點金屬體67，以使低熔點金屬體67熔解。藉此，保護元件30之連接部611、612之各導體61b間被切斷，將電池10之充放電電流路徑予以截斷。In the protection element 30 of this type, when the detection circuit 40 detects a voltage and detects an abnormality such as overcharge or overdischarge of the battery cells 11 to 14, the control signal is output to the current control element 50. After receiving the control signal, the current control element 50 energizes the heating resistor 64 and generates heat. The heat of the heat generating resistor 64 of the protective element 30 is transmitted to the low melting point metal body 67 through the second insulating layer 65 and the conductor 66 to melt the low melting point metal body 67. Thereby, the conductors 61b of the connection portions 611 and 612 of the protection element 30 are cut off, and the charge and discharge current path of the battery 10 is cut off.

此處，保護元件30，作為傳導發熱電阻體64之熱之路徑，如圖3所示，具有：透過第1絕緣層62而朝基板60側散熱之第1傳熱路徑A、及透過第2絕緣層65、導體66、低熔點金屬體67及導體61b而朝基板60側散熱之第2傳熱路徑B。又，保護元件30，由於必須適應電流控制元件50之動作，用以截斷充放電電流路徑，因此較佳係使發熱電阻體64之熱高效率傳導至低熔點金屬體67。Here, as shown in FIG. 3, the protective element 30 has a heat path for conducting the heating resistor 64, and has a first heat transfer path A that transmits heat to the substrate 60 side through the first insulating layer 62, and a second heat transmission path. The insulating layer 65, the conductor 66, the low-melting-point metal body 67, and the conductor 61b are radiated to the second heat transfer path B toward the substrate 60 side. Further, since the protection element 30 has to be adapted to the operation of the current control element 50 to cut off the charge and discharge current path, it is preferable to conduct the heat of the heating resistor 64 to the low-melting metal body 67 with high efficiency.

又，保護元件30，使成為第3絕緣層之第1玻璃層70介於位於第2傳熱路徑B上之導體61b與基板60之一面60a之間，又，使成為第4絕緣層之第2玻璃層71介於位於第2傳熱路徑B上之導體61c與基板60之另一面60b之間。藉此，保護元件30係抑制發熱電阻體64所產生之熱透過低熔點金屬體67及導體61b而往導熱率高之基板60側散熱，又，抑制從導熱率高之基板60往導體61c側散熱。另外，作為成為第3絕緣層、第4絕緣層之第1、第2玻璃層70、71，可使用各種玻璃類。Further, in the protective element 30, the first glass layer 70 serving as the third insulating layer is interposed between the conductor 61b located on the second heat transfer path B and one surface 60a of the substrate 60, and becomes the fourth insulating layer. 2 The glass layer 71 is interposed between the conductor 61c located on the second heat transfer path B and the other surface 60b of the substrate 60. Thereby, the protective element 30 suppresses the heat generated by the heating resistor 64 from passing through the low-melting-point metal body 67 and the conductor 61b, and dissipates heat to the substrate 60 having a high thermal conductivity, and suppresses the substrate 60 having a high thermal conductivity from the side of the conductor 61c. Cooling. Further, various types of glass can be used as the first and second glass layers 70 and 71 to be the third insulating layer and the fourth insulating layer.

因此，若保護元件30靠抑制第2傳熱路徑B之散熱，使發熱電阻體64之溫度高效率上升，藉由電流控制元件50進行通電後，立即能使低熔點金屬體67熔解，而將充放電電流路徑截斷。又，由於保護元件30可將發熱電阻體64之熱高效率傳導至低熔點金屬體67，因此即使縮小發熱電阻體64亦可使低熔點金屬體67充分熔解，可謀求保護元件30整體之小型化。又，由於保護元件30可將發熱電阻體64之熱高效率傳導至低熔點金屬體67，因此可抑制往發熱電阻體64通電之電流量，可謀求省電力化。Therefore, when the protective element 30 suppresses the heat dissipation of the second heat transfer path B, the temperature of the heating resistor 64 is increased with high efficiency, and immediately after the current is supplied by the current control element 50, the low melting point metal body 67 can be melted. The charge and discharge current path is cut off. Further, since the protective element 30 can efficiently transfer the heat of the heating resistor 64 to the low-melting-point metal body 67, even if the heating resistor 64 is reduced, the low-melting-point metal body 67 can be sufficiently melted, and the entire protective element 30 can be made small. Chemical. Further, since the protective element 30 can efficiently transfer the heat of the heating resistor 64 to the low-melting-point metal body 67, the amount of current that is supplied to the heating resistor 64 can be suppressed, and power saving can be achieved.

另外，保護元件30之第1玻璃層70及第2玻璃層71僅形成於與導體61b及導體61c重疊之位置，在被夾於基板60之另一面60b之第2玻璃層71之第1傳熱路徑A上設置有空氣層。由於空氣層之導熱率(0.0241W/m‧K)非常低，因此可抑制被夾於第2玻璃層71之第1傳熱路徑A之散熱，可將該抑制量之熱傳導至第2傳熱路徑B。Further, the first glass layer 70 and the second glass layer 71 of the protective element 30 are formed only at positions overlapping the conductor 61b and the conductor 61c, and are first transmitted to the second glass layer 71 sandwiched between the other surface 60b of the substrate 60. An air layer is disposed on the heat path A. Since the thermal conductivity (0.0241 W/m‧K) of the air layer is extremely low, heat dissipation by the first heat transfer path A sandwiched between the second glass layers 71 can be suppressed, and the heat of the suppression can be conducted to the second heat transfer. Path B.

又，保護元件30係使用玻璃以作為第1、第2絕緣層62、65，並且位於第2傳熱路徑B上之第2絕緣層65之導熱率，較佳係位於第1傳熱路徑A上之第1絕緣層62之導熱率以上。藉由具備該構成，保護元件30可防止發熱電阻體64所產生之熱對第1傳熱路徑大量散熱本身。Further, the protective element 30 uses glass as the first and second insulating layers 62 and 65, and the thermal conductivity of the second insulating layer 65 on the second heat transfer path B is preferably located in the first heat transfer path A. The thermal conductivity of the first insulating layer 62 is higher than the above. With this configuration, the protective element 30 can prevent the heat generated by the heating resistor 64 from dissipating a large amount of heat to the first heat transfer path.

又，保護元件30，作為位於第2傳熱路徑B上之第2絕緣層65，更佳係使用相對導熱率較位於第1傳熱路徑A上之第1絕緣層62為高之玻璃。藉由具備該構成，保護元件30可抑制發熱電阻體64所產生之熱往與低熔點金屬體67相反側之基板60側散熱。因此，保護元件30，使發熱電阻體64所產生之熱傳導至第2傳熱路徑B側，可高效率使低熔點金屬體67之溫度上升。Further, the protective element 30 is preferably a glass having a higher thermal conductivity than the first insulating layer 62 located on the first heat transfer path A as the second insulating layer 65 on the second heat transfer path B. With this configuration, the protective element 30 can suppress the heat generated by the heating resistor 64 from dissipating heat to the substrate 60 side opposite to the low melting point metal body 67. Therefore, the protective element 30 causes the heat generated by the heating resistor 64 to be conducted to the second heat transfer path B side, and the temperature of the low melting point metal body 67 can be increased with high efficiency.

以此種方式，作為構成第1絕緣層62之導熱率相對低之玻璃，可使用例如SiO2 ‧B2 O3 ‧RO(導熱率0.83W/m‧K)、或SiO2 ‧B2 O3 ‧PbO(導熱率1.42W/m‧K)。又，作為構成第2絕緣層65之導熱率相對高之玻璃，可使用例如SiO2 ‧B2 O3 ‧RO(導熱率2.1W/m‧K)。In this manner, as the glass constituting the first insulating layer 62 having a relatively low thermal conductivity, for example, SiO 2 ‧B 2 O 3 ‧RO (thermal conductivity: 0.83 W/m‧K) or SiO 2 ‧B 2 O can be used. 3 ‧PbO (thermal conductivity 1.42W/m‧K). Further, as the glass constituting the second insulating layer 65 having a relatively high thermal conductivity, for example, SiO 2 ‧B 2 O 3 ‧RO (thermal conductivity: 2.1 W/m‧K) can be used.

另外，構成第1絕緣層62之玻璃相對於構成第2絕緣層65之玻璃，由於只要相對導熱率低即可，因此例如作為構成第1絕緣層62之玻璃，使用SiO2 ‧B2 O3 ‧RO(導熱率0.83W/m‧K)時，作為構成第2絕緣層65之玻璃，亦可使用SiO2 ‧B2 O3 ‧PbO(導熱率1.42W/m‧K)。In addition, the glass constituting the first insulating layer 62 is required to have a low thermal conductivity with respect to the glass constituting the second insulating layer 65. Therefore, for example, SiO 2 ‧B 2 O 3 is used as the glass constituting the first insulating layer 62 ‧ When RO (thermal conductivity: 0.83 W/m‧K), SiO 2 ‧B 2 O 3 ‧PbO (thermal conductivity: 1.42 W/m‧K) can be used as the glass constituting the second insulating layer 65.

此種保護元件30係用以下方式製造。首先，在氧化鋁或氧化鋁50%中混合富鋁紅柱石50%之物，或藉由二氧化鋯等之陶瓷材料形成基板60。接著，形成用以構成連接導體61b及導體61c之貫通孔61a之貫通孔，藉由網版印刷等印刷構成成為第3絕緣層之第1玻璃層70及第1絕緣層62之玻璃糊，藉由燒成，將第1絕緣層62及第1玻璃層70形成於同一平面。亦即，保護元件30，構成第1絕緣層62之玻璃與構成第1玻璃層70之玻璃為相同材料。Such a protective element 30 is manufactured in the following manner. First, 50% of mullite is mixed in 50% of alumina or alumina, or the substrate 60 is formed by a ceramic material such as zirconium dioxide. Next, a through hole for forming the through hole 61a of the connection conductor 61b and the conductor 61c is formed, and the glass paste constituting the first glass layer 70 and the first insulating layer 62 which are the third insulating layers is printed by screen printing or the like. The first insulating layer 62 and the first glass layer 70 are formed on the same plane by firing. That is, the protective element 30 has the same material as the glass constituting the first insulating layer 62 and the glass constituting the first glass layer 70.

同樣地，形成成為第4絕緣層之第2玻璃層71。接著，印刷導電糊並加以燒成，藉此將導體61b形成於第1玻璃層70上，並且形成貫通孔61a，又，形成發熱電阻體64、導體圖案63a及導體圖案63b。又，印刷導電糊並加以燒成，藉此將導體61c形成於第2玻璃層71上。Similarly, the second glass layer 71 serving as the fourth insulating layer is formed. Then, the conductive paste is printed and fired, whereby the conductor 61b is formed on the first glass layer 70, and the through hole 61a is formed, and the heating resistor 64, the conductor pattern 63a, and the conductor pattern 63b are formed. Further, the conductive paste is printed and fired, whereby the conductor 61c is formed on the second glass layer 71.

接著，印刷玻璃糊並加以燒成，藉此形成第2絕緣層65，構導體66、低熔點金屬體67、助焊劑68後，用罩體69加以覆蓋。藉由以上步驟，製造保護元件30。Next, the glass paste is printed and fired to form the second insulating layer 65, and the conductor 66, the low-melting-point metal body 67, and the flux 68 are covered, and then covered with a cover 69. Through the above steps, the protective element 30 is fabricated.

＜實施例1＞<Example 1>

接著，說明保護元件30之實施例。在此實施例中，保護元件30具備第1玻璃層70及第2玻璃層71，準備了各玻璃層70、71之厚度為10μm者(實施例1)、各玻璃層70、71之厚度為20μm者(實施例2)、各玻璃層70、71之厚度為40μm者(實施例3)。又，保護元件30僅具備第1玻璃層70，準備了玻璃層70之厚度為10μm者(實施例4)、玻璃層70之厚度為20μm者(實施例5)、玻璃層70之厚度為40μm者(實施例6)。又，作為比較例，在圖9所示之絕緣基板101上未設置玻璃層，而準備了形成導電層106之保護元件100。Next, an embodiment of the protective element 30 will be described. In this embodiment, the protective element 30 is provided with the first glass layer 70 and the second glass layer 71, and the thickness of each of the glass layers 70 and 71 is 10 μm (Example 1), and the thickness of each of the glass layers 70 and 71 is The thickness of each of the glass layers 70 and 71 of 20 μm (Example 2) was 40 μm (Example 3). Further, the protective element 30 includes only the first glass layer 70, and the thickness of the glass layer 70 is 10 μm (Example 4), the thickness of the glass layer 70 is 20 μm (Example 5), and the thickness of the glass layer 70 is 40 μm. (Example 6). Further, as a comparative example, the glass substrate was not provided on the insulating substrate 101 shown in FIG. 9, and the protective element 100 on which the conductive layer 106 was formed was prepared.

針對此等實施例1～6及比較例1測量到達既定溫度之時間。溫度之測量點係在發熱電阻體64之下部，為低熔點金屬體67之大致中央部分。The time to reach a predetermined temperature was measured for each of Examples 1 to 6 and Comparative Example 1. The temperature measurement point is below the heating resistor 64 and is a substantially central portion of the low melting metal body 67.

如圖5所示，若測量測量點上升到例如800℃之時間，實施例1～6約在20秒以內，相對於此，比較例約要花費30秒。As shown in Fig. 5, in the case where the measurement measurement point is raised to, for example, 800 ° C, the examples 1 to 6 are within about 20 seconds, whereas the comparative example takes about 30 seconds.

又，在實施例中，實施例3之溫度最快上升，接著，溫度依實施例6、實施例2、實施例5、實施例1、實施例4之順序上升。由此可知，即使僅在基板60之一面60a設置玻璃層，靠加厚其厚度，亦可抑制發熱電阻體64所產生之熱往基板60側散熱，將熱有效地傳導至低熔點金屬體67。Further, in the examples, the temperature of the third embodiment was increased as the fastest, and then the temperature was increased in the order of the sixth embodiment, the second embodiment, the fifth embodiment, the first embodiment, and the fourth embodiment. From this, it is understood that even if the glass layer is provided only on one surface 60a of the substrate 60, the thickness of the substrate 60a can be increased, and heat generated by the heating resistor 64 can be prevented from being radiated to the substrate 60 side, and heat can be efficiently conducted to the low-melting metal body 67. .

另外，保護元件30，亦可在連接發熱電阻體64與電流控制元件50之連接部613之導體61b與基板60之一面60a之間設置第1玻璃層70。此時，第1玻璃層70可抑制發熱電阻體64之熱透過導體圖案63b而往連接部613之導體61b及基板60散熱。Further, the protective element 30 may be provided with a first glass layer 70 between the conductor 61b connecting the connection portion 613 of the heating resistor 64 and the current steering element 50 and one surface 60a of the substrate 60. At this time, the first glass layer 70 can suppress the heat radiation conductor pattern 63b of the heating resistor 64 from being radiated to the conductor 61b of the connection portion 613 and the substrate 60.

又，保護元件30亦可如圖6所示，未形成第2玻璃層71，而在基板60之另一面60b形成連接部611、612之導體61c。此時，保護元件30，使第1玻璃層70介於位於第2傳熱路徑B上之導體61b與基板60之一面60a之間，藉此可抑制發熱電阻體64所產生之熱透過低熔點金屬體67及導體61b而往導熱率高之基板60側散熱。Further, as shown in FIG. 6, the protective element 30 may be formed with the conductors 61c of the connecting portions 611 and 612 on the other surface 60b of the substrate 60 without forming the second glass layer 71. At this time, the protective element 30 causes the first glass layer 70 to be interposed between the conductor 61b located on the second heat transfer path B and one surface 60a of the substrate 60, whereby the heat generated by the heating resistor 64 can be suppressed from passing through the low melting point. The metal body 67 and the conductor 61b dissipate heat to the side of the substrate 60 having a high thermal conductivity.

因此，在保護元件30抑制第2傳熱路徑B中之散熱，藉此使發熱電阻體64之溫度高效率上升，並藉由電流控制元件50通電後，立即使低熔點金屬67熔解，可將充放電電流路徑截斷。Therefore, the protective element 30 suppresses heat dissipation in the second heat transfer path B, thereby increasing the temperature of the heating resistor 64 with high efficiency, and immediately after the current control element 50 is energized, the low melting point metal 67 is melted. The charge and discharge current path is cut off.

又，保護元件30亦可改變第1絕緣層62之玻璃材料與第1玻璃層70之玻璃材料，使第1玻璃層70之導熱率較第1絕緣層62之導熱率為小。藉由具備該構成，可抑制從第1傳熱路徑A上之第1絕緣層62往第2傳熱路徑B上之第1玻璃層70側散熱。此時，第1絕緣層62與第1玻璃層70係以另一步驟，藉由印刷及燒成材質不同之玻璃來形成。Further, the protective element 30 may change the glass material of the first insulating layer 62 and the glass material of the first glass layer 70 so that the thermal conductivity of the first glass layer 70 is smaller than the thermal conductivity of the first insulating layer 62. With this configuration, heat dissipation from the first insulating layer 62 on the first heat transfer path A to the first glass layer 70 side on the second heat transfer path B can be suppressed. At this time, the first insulating layer 62 and the first glass layer 70 are formed in another step by printing and firing glass having different materials.

又，保護元件30亦可如圖7所示，在電路構成上具備複數個電阻體32(例如圖7中為2個)，從各電阻體32a、32b之接點P2延設端子部33a，並且從電阻體32b之端部延設端子部33b，依據電池單元數選擇與電流控制元件50連接之端子部，藉此切換電阻體32之發熱量。此時，保護元件30，例如如圖8所示，在第1絕緣層62上形成複數個導體圖案，將發熱電阻體64分割成複數個(圖8中有64a與64b兩個)，將未與導體66連接之剩下之導體圖案63b、63c之端部與形成於基板60之側面之連接部613、614連接。又，依據電池單元數選擇與電流控制元件50連接之連接部，藉此使保護元件30通電時導通之發熱電阻體之電阻值增減，可調整發熱量。Further, as shown in FIG. 7, the protective element 30 may include a plurality of resistors 32 (for example, two in FIG. 7) in the circuit configuration, and the terminal portions 33a may be extended from the contacts P2 of the resistors 32a and 32b. Further, the terminal portion 33b is extended from the end portion of the resistor body 32b, and the terminal portion connected to the current control element 50 is selected in accordance with the number of battery cells, whereby the amount of heat generation of the resistor body 32 is switched. At this time, as shown in FIG. 8, for example, as shown in FIG. 8, a plurality of conductor patterns are formed on the first insulating layer 62, and the heating resistor 64 is divided into a plurality of (two in 64a and 64b in FIG. 8). The end portions of the remaining conductor patterns 63b and 63c connected to the conductor 66 are connected to the connection portions 613 and 614 formed on the side faces of the substrate 60. Further, the connection portion connected to the current control element 50 is selected in accordance with the number of battery cells, whereby the resistance value of the heating resistor that is turned on when the protection device 30 is energized is increased or decreased, and the amount of heat generation can be adjusted.

亦即，保護元件30依據電池10之電壓值之變動範圍調整發熱之電阻體數，藉此可多階段調整發熱電阻體整體之電阻值，能對發熱電阻體64，防止依據電池數變動之電壓值變過大而使發熱電阻體64受損傷之情形。藉此，保護元件30，使用於例如2單元之電池包時，可對1個發熱電阻體64通電，使用於4單元之電池包時，可對2個發熱電阻體64通電等，可以一個元件對應複數個電池包。In other words, the protection element 30 adjusts the number of resistors generated by the heating according to the range of fluctuations in the voltage value of the battery 10, thereby adjusting the resistance value of the entire heating resistor body in multiple stages, and preventing the heating resistor 64 from varying in voltage according to the number of batteries. The value becomes too large to cause the heating resistor 64 to be damaged. Thereby, when the protection element 30 is used for, for example, a battery pack of two units, one heating resistor 64 can be energized, and when it is used for a battery pack of four units, two heating resistors 64 can be energized, and the like. Corresponding to a plurality of battery packs.

又，保護元件30，在圖8所示之構成中，除在各連接部611、612之外，亦在連接部613、614之導體61b與基板60之一面60a之間設置第1玻璃層70，又，亦在連接部613、614之導體61c與基板60之另一面60b之間設置第2玻璃層71，藉此亦可抑制透過導體圖案63b、63c之散熱，可將發熱電阻體64之熱高效率蓄熱於低熔點金屬體。又，保護元件30，即使少發熱量亦可將低熔點金屬體67熔斷，可謀求發熱電阻體64之小型化及省電力化。Further, in the configuration of the protective element 30, in addition to the respective connecting portions 611 and 612, the first glass layer 70 is provided between the conductor 61b of the connecting portions 613 and 614 and one surface 60a of the substrate 60. Further, the second glass layer 71 is provided between the conductor 61c of the connection portions 613 and 614 and the other surface 60b of the substrate 60, whereby the heat dissipation of the transmission conductor patterns 63b and 63c can be suppressed, and the heating resistor 64 can be used. Thermally efficient heat storage in low melting point metal bodies. Further, the protective element 30 can melt the low-melting-point metal body 67 even if heat is generated, and the heating resistor 64 can be reduced in size and power-saving.

以上，雖針對設置於電池單元(被設置於電池包內)之充放電電流路徑上之保護元件30加以說明，但保護元件30，除適用於電池之充放電電路以外，可適用於為保護避免過電流、過電壓之所有電路。Although the protective element 30 provided on the charge and discharge current path of the battery unit (provided in the battery pack) has been described above, the protective element 30 can be applied to protect the battery 30 in addition to the charge and discharge circuit of the battery. All circuits of over current and over voltage.

1．．．電池包1. . . Battery pack

2．．．充電裝置2. . . Charging device

10．．．電池10. . . battery

11～14．．．電池單元11~14. . . Battery unit

20．．．充放電控制電路20. . . Charge and discharge control circuit

21、22．．．電流控制元件21, 22. . . Current control element

23．．．控制部twenty three. . . Control department

30‧‧‧保護元件30‧‧‧Protection components

31‧‧‧熔絲31‧‧‧Fuse

32‧‧‧電阻體32‧‧‧resist

33‧‧‧端子部33‧‧‧ Terminals

40‧‧‧檢測電路40‧‧‧Detection circuit

50‧‧‧電流控制元件50‧‧‧ Current control components

60‧‧‧基板60‧‧‧Substrate

61a‧‧‧貫通孔61a‧‧‧through hole

61b、61c‧‧‧導體61b, 61c‧‧‧ conductor

62‧‧‧第1絕緣層62‧‧‧1st insulation layer

63‧‧‧導體圖案63‧‧‧ conductor pattern

64‧‧‧發熱電阻體64‧‧‧heating resistor

65‧‧‧第2絕緣層65‧‧‧2nd insulation layer

66‧‧‧導體66‧‧‧Conductors

67‧‧‧低熔點金屬體67‧‧‧Low melting point metal body

68‧‧‧助焊劑68‧‧‧ Flux

69‧‧‧罩體69‧‧‧ Cover

70‧‧‧第1玻璃層70‧‧‧1st glass layer

71‧‧‧第2玻璃層71‧‧‧2nd glass layer

圖1係表示本發明適用之電池包之整體構成圖。Fig. 1 is a view showing the overall configuration of a battery pack to which the present invention is applied.

圖2係表示本發明適用之電池包之電路構成圖。Fig. 2 is a circuit diagram showing the configuration of a battery pack to which the present invention is applied.

圖3係本發明適用之保護元件之剖面圖。Figure 3 is a cross-sectional view of a protective element to which the present invention is applicable.

圖4A及圖4B係說明本發明適用之保護元件之層構成之俯視圖。4A and 4B are plan views showing the layer constitution of the protective member to which the present invention is applied.

圖5係用以說明本發明適用之保護元件之溫度特性之曲線圖。Figure 5 is a graph for explaining the temperature characteristics of the protective member to which the present invention is applied.

圖6係本發明適用之另一保護元件之剖面圖。Figure 6 is a cross-sectional view of another protective element to which the present invention is applicable.

圖7係表示本發明適用之另一保護元件之電路構成圖。Fig. 7 is a circuit diagram showing another protective element to which the present invention is applied.

圖8係說明本發明適用之另一保護元件之層構成之俯視圖。Fig. 8 is a plan view showing the layer constitution of another protective member to which the present invention is applied.

圖9係習知之保護元件之剖面圖。Figure 9 is a cross-sectional view of a conventional protective element.

30．．．保護元件30. . . Protective component

60．．．基板60. . . Substrate

60a．．．一面60a. . . one side

60b．．．另一面60b. . . the other side

61a．．．貫通孔61a. . . Through hole

61b．．．導體61b. . . conductor

61c．．．導體61c. . . conductor

62．．．第1絕緣層62. . . First insulating layer

62a．．．表面62a. . . surface

63a．．．導體圖案63a. . . Conductor pattern

63b．．．導體圖案63b. . . Conductor pattern

64．．．發熱電阻體64. . . Heating resistor

65．．．第2絕緣層65. . . Second insulation layer

66．．．導體66. . . conductor

67．．．低熔點金屬體67. . . Low melting point metal body

68．．．助焊劑68. . . Flux

69．．．罩體69. . . Cover

70．．．第1玻璃層70. . . First glass layer

71．．．第2玻璃層71. . . Second glass layer

611．．．連接部611. . . Connection

612．．．連接部612. . . Connection

Claims (12)

一種保護元件，係連接於電路之電流路徑上，其特徵在於，具有：絕緣基板；發熱電阻體，隔著第1絕緣層形成於該絕緣基板之一面；低熔點金屬體，隔著第2絕緣層配置於該發熱電阻體之上方，構成電流路徑之一部分；以及連接部，與該低熔點金屬體之兩端連接，將該電流路徑與該低熔點金屬體加以電氣連接；該連接部係隔著第3絕緣層設於該絕緣基板之該一面。 A protective element is connected to a current path of a circuit, and has an insulating substrate; a heating resistor formed on one surface of the insulating substrate via a first insulating layer; and a low melting metal body separated by a second insulating layer a layer disposed above the heating resistor body to form a portion of the current path; and a connecting portion connected to both ends of the low melting point metal body to electrically connect the current path to the low melting point metal body; the connecting portion is separated The third insulating layer is provided on the one side of the insulating substrate. 如申請專利範圍第1項之保護元件，其中，僅在該連接部之下部形成有該第3絕緣層。 A protective element according to claim 1, wherein the third insulating layer is formed only under the connecting portion. 如申請專利範圍第1或2項之保護元件，其中，該連接部係隔著第4絕緣層設於與該絕緣基板之該一面對向之另一面。 The protective element according to claim 1 or 2, wherein the connecting portion is provided on the other surface facing the insulating substrate via the fourth insulating layer. 如申請專利範圍第3項之保護元件，其中，僅在與該連接部重疊之位置形成有該第3、第4絕緣層。 A protective element according to claim 3, wherein the third and fourth insulating layers are formed only at a position overlapping the connecting portion. 如申請專利範圍第1或2項之保護元件，其中，該第2絕緣層之導熱率係該第1絕緣層之導熱率以上。 The protective element according to claim 1 or 2, wherein a thermal conductivity of the second insulating layer is equal to or higher than a thermal conductivity of the first insulating layer. 如申請專利範圍第4項之保護元件，其中，該第2絕緣層之導熱率係該第1絕緣層之導熱率以上。 The protective element of claim 4, wherein the thermal conductivity of the second insulating layer is greater than or equal to the thermal conductivity of the first insulating layer. 如申請專利範圍第5項之保護元件，其中，該第1、第2絕緣層係玻璃層。 The protective element of claim 5, wherein the first and second insulating layers are glass layers. 如申請專利範圍第3項之保護元件，其中，該第3、第4絕緣層係玻璃層。 The protective element of claim 3, wherein the third and fourth insulating layers are glass layers. 如申請專利範圍第1或2項之保護元件，其中，該第3絕緣層之導熱率小於該第1絕緣層之導熱率。 The protective element of claim 1 or 2, wherein the third insulating layer has a thermal conductivity lower than a thermal conductivity of the first insulating layer. 如申請專利範圍第6項之保護元件，其中，該第3絕緣層之導熱率小於該第1絕緣層之導熱率。 The protective element of claim 6, wherein the third insulating layer has a thermal conductivity lower than a thermal conductivity of the first insulating layer. 一種電池控制裝置，具備：充放電控制電路，係連接於由可充放電之電池單元構成之電池之充放電電流路徑上，控制該電池之充放電；檢測電路，檢測該電池單元之電壓值；保護元件，在藉由該檢測電路所檢測之電池單元之電壓值成為既定範圍外時，將該充放電電流路徑截斷；以及電流控制元件，用以驅動該保護元件；該保護元件，具有：絕緣基板；發熱電阻體，隔著第1絕緣層形成於該絕緣基板之一面；低熔點金屬體，隔著第2絕緣層配置於該發熱電阻體之上方，構成該充放電電流路徑之一部分；以及連接部，與該低熔點金屬體之兩端連接，將該充放電電流路徑與該低熔點金屬體加以電氣連接；該連接部係隔著第3絕緣層設於該絕緣基板之該一面。 A battery control device comprising: a charge and discharge control circuit connected to a charge and discharge current path of a battery formed by a chargeable and dischargeable battery unit to control charging and discharging of the battery; and a detection circuit for detecting a voltage value of the battery unit; a protection element that cuts a charge/discharge current path when a voltage value of the battery cell detected by the detection circuit becomes outside a predetermined range; and a current control element for driving the protection element; the protection element having: insulation a substrate; a heating resistor formed on one surface of the insulating substrate via a first insulating layer; and a low melting point metal body disposed above the heating resistor via a second insulating layer to constitute one of the charge and discharge current paths; The connection portion is connected to both ends of the low-melting-point metal body, and electrically connects the charge/discharge current path to the low-melting-point metal body; the connection portion is provided on the one surface of the insulating substrate via the third insulating layer. 一種電池包，具備：電池，係由可充放電之電池單元構成； 充放電控制電路，係連接於該電池之充放電電流路徑上，控制該電池之充放電；檢測電路，檢測該電池單元之電壓值；保護元件，在藉由該檢測電路所檢測之電池單元之電壓值成為既定範圍外時，將該充放電電流路徑截斷；以及電流控制元件，用以驅動該保護元件；該保護元件，具有：絕緣基板；發熱電阻體，隔著第1絕緣層形成於該絕緣基板之一面；低熔點金屬體，隔著第2絕緣層配置於該發熱電阻體之上方，構成該充放電電流路徑之一部分；以及連接部，與該低熔點金屬體之兩端連接，將該充放電電流路徑與該低熔點金屬體加以電氣連接；該連接部係隔著第3絕緣層設於該絕緣基板之該一面。A battery pack comprising: a battery, which is composed of a battery unit that can be charged and discharged; The charge and discharge control circuit is connected to the charge and discharge current path of the battery to control charging and discharging of the battery; the detecting circuit detects the voltage value of the battery unit; and the protection component is in the battery unit detected by the detecting circuit When the voltage value is outside the predetermined range, the charge/discharge current path is cut off; and the current control element is configured to drive the protection element; the protection element has: an insulating substrate; and a heating resistor body formed on the first insulating layer One surface of the insulating substrate; the low melting point metal body is disposed above the heating resistor body via the second insulating layer to form a portion of the charging and discharging current path; and the connecting portion is connected to both ends of the low melting point metal body The charge and discharge current path is electrically connected to the low melting point metal body; the connection portion is provided on the one side of the insulating substrate via the third insulating layer.
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JP5260592B2 (en) 2013-08-14
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KR101382942B1 (en) 2014-04-08
TW201205632A (en) 2012-02-01
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HK1176160A1 (en) 2013-07-19
US20130049679A1 (en) 2013-02-28
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US9184609B2 (en) 2015-11-10
WO2011126091A1 (en) 2011-10-13
JP2011222264A (en) 2011-11-04

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