TWI443329B - System and method for integrating defect detecting result - Google Patents
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本發明是有關於一種瑕疵(defect)檢測結果整合系統及方法，特別是指一種適用於多製程階段的瑕疵檢測結果整合系統及方法。The invention relates to a system and method for integrating defect detection results, in particular to a system and method for integrating flaw detection results suitable for a multi-process stage.
偏光膜為液晶顯示器(Liquid Crystal Display，簡稱LCD)的關鍵零組件之一，其屬於一種高分子多層複合材料，且其製造包含了像是延伸、貼合、塗佈、及精密裁切等多個製程階段。在偏光膜的各製程階段中，對其進行瑕疵檢測有助於提升產品的品質；目前已有各式自動光學檢測(Automated Optical Inspection，簡稱AOI)裝置，可自動化地針對各製程階段的偏光膜進行瑕疵檢測。The polarizing film is one of the key components of a liquid crystal display (LCD), which belongs to a polymer multilayer composite material, and its manufacturing includes stretching, laminating, coating, and precision cutting. Process phase. In each process stage of the polarizing film, the flaw detection is used to improve the quality of the product; there are various automatic optical inspection (AOI) devices, which can automatically target the polarizing film of each process stage. Perform flaw detection.
近年來，卷對卷(roll to roll)架構的製造設備挾著其高產能及低成本的優勢，已成為軟性電子產品(flexible electronics，例如，偏光膜)之主流生產設備。由於偏光膜在各製程階段是獨立地進行瑕疵檢測，再者，同一捲偏光膜在某一製程階段(例如，延伸-貼合製程階段)處理完後到下一製程階段(例如，PSA(Pressure Sensitive Adhesives)塗佈階段)，會因為收放捲的位置不同，上、下捲料互換等因素而無法準確對位；所以現有的作法為：針對每一製程階段，在進行瑕疵檢測後皆須加設一台噴印裝置(printer)，並在進入下一製程階段前，於偏光膜上被檢測出瑕疵的發生處進行噴印以作為標記(mark)；最後還需藉由人工方式進一步對各製程階段的瑕疵檢測結果進行判斷、評估及整合，造成效率不彰且容易有判斷標準不一的情況發生。In recent years, the roll-to-roll architecture manufacturing equipment has become a mainstream production equipment for flexible electronics (for example, polarizing film) due to its high productivity and low cost. Since the polarizing film is independently detected in each process stage, the same roll of polarizing film is processed in a certain process stage (for example, the extension-bonding process stage) to the next process stage (for example, PSA (Pressure) Sensitive Adhesives) will not be accurately aligned due to different positions of the rewinding and unwinding, and the upper and lower coils are interchanged. Therefore, the existing practice is: for each process stage, after the sputum test is required, A printer is provided, and before the next process stage, the occurrence of defects on the polarizing film is printed as a mark; finally, each is further manually Judgment, evaluation and integration of the flaw detection results in the process stage result in inefficient and easy to judge.
因此，本發明之目的，即在提供一種瑕疵檢測結果整合方法，適用於整合一個多層膜於一個製造設備所進行的各製程階段對應的瑕疵檢測結果。其中，於各製程階段中，該製造設備持續地產生與該多層膜的位置相關的脈波訊號。Accordingly, it is an object of the present invention to provide a method for integrating flaw detection results that is suitable for integrating the results of a flaw detection corresponding to each process stage performed by a multilayer film in a manufacturing facility. Wherein, in each process stage, the manufacturing apparatus continuously generates a pulse wave signal associated with the position of the multilayer film.
於是，本發明瑕疵檢測結果整合方法，利用包括一個處理單元、一個瑕疵檢測裝置、一個定位記號讀取單元，及一個記憶單元的一個系統來執行，該方法包含下列步驟：Thus, the method for integrating detection results of the present invention is performed by a system including a processing unit, a defect detecting device, a positioning mark reading unit, and a memory unit, the method comprising the following steps:
(A)於一個第一製程階段中，利用該瑕疵檢測裝置擷取該多層膜於該第一製程階段中的一個第一影像以產生一個第一影像訊框，其中，該第一影像涵蓋已標示於該多層膜的一個定位記號，該定位記號載有一筆參考點位置資訊，該參考點位置資訊與該定位記號被標示於該多層膜的位置相關；(A) in the first process stage, the first image frame of the multilayer film in the first process stage is captured by the defect detecting device to generate a first image frame, wherein the first image covers the Marking a positioning mark on the multilayer film, the positioning mark carrying a reference point position information, and the reference point position information is related to the position of the positioning mark indicated by the multilayer film;
(B)利用該瑕疵檢測裝置根據該第一影像訊框進行瑕疵檢測，以得到對應於該第一影像的一個第一瑕疵檢測結果，其中，當該第一影像中有至少一個瑕疵存在時，該第一瑕疵檢測結果用以指示該瑕疵於該第一影像中的發生處；(B) performing the 瑕疵 detection according to the first image frame by using the 瑕疵 detecting device to obtain a first 瑕疵 detection result corresponding to the first image, wherein when at least one 瑕疵 exists in the first image, The first detection result is used to indicate the occurrence of the defect in the first image;
(C)當該第一影像中有瑕疵存在時，利用該處理單元根據該第一瑕疵檢測結果，及來自該製造設備的脈波訊號，以得到該瑕疵於該第一影像中的發生處，相對於該第一影像中的該定位記號的一個第一瑕疵相對位置資訊，其中，該第一瑕疵相對位置資訊係對應於該第一影像中的該定位記號所載的該參考點位置資訊；(C) when there is a defect in the first image, the processing unit uses the first detection result and the pulse signal from the manufacturing device to obtain the occurrence of the defect in the first image. a first relative position information of the positioning mark in the first image, wherein the first relative position information corresponds to the reference point position information carried by the positioning mark in the first image;
(D)利用該處理單元將該第一瑕疵相對位置資訊記錄於該記憶單元；(D) using the processing unit to record the first relative position information in the memory unit;
(E)於一個第二製程階段中，當該定位記號讀取單元讀取到一個已標示於該多層膜的定位記號時，傳送此步驟中所讀取到的該定位記號所載的該參考點位置資訊；(E) in a second process stage, when the positioning mark reading unit reads a positioning mark already marked on the multilayer film, transmitting the reference contained in the positioning mark read in the step Point location information;
(F)利用該瑕疵檢測裝置擷取該多層膜於該第二製程階段中的一個第二影像以產生一個第二影像訊框，該第二影像涵蓋步驟(E)中讀取到的該定位記號；(F) using the flaw detection device to capture a second image of the multilayer film in the second process stage to generate a second image frame, the second image covering the position read in step (E) mark;
(G)利用該瑕疵檢測裝置根據該第二影像訊框進行瑕疵檢測，以得到對應於該第二影像的一個第二瑕疵檢測結果，其中，當該第二影像中有至少一個瑕疵存在時，該第二瑕疵檢測結果用以指示該瑕疵於第二影像中的發生處；(G) performing the chirp detection according to the second image frame by using the chirp detecting device to obtain a second chirp detecting result corresponding to the second image, wherein when at least one of the second images is present, The second detection result is used to indicate the occurrence of the defect in the second image;
(H)當該第二影像中有瑕疵存在時，利用該處理單元根據該第二瑕疵檢測結果，及來自該製造設備的脈波訊號，以得到該瑕疵於該第二影像中的發生處，相對於該第二影像中的該定位記號的一個第二瑕疵相對位置資訊，其中，該第二瑕疵相對位置資訊係對應於該第二影像中的該定位記號所載的該參考點位置資訊；及(H) when there is a defect in the second image, the processing unit uses the pulse detection signal from the manufacturing device according to the second detection result to obtain the occurrence in the second image, a second relative position information of the positioning mark in the second image, wherein the second relative position information corresponds to the reference point position information carried by the positioning mark in the second image; and
(I)利用該處理單元根據該參考點位置資訊、該第一瑕疵相對位置資訊，及該第二瑕疵相對位置資訊，得到一筆瑕疵位置整合資訊。(I) using the processing unit to obtain a piece of position integration information according to the reference point position information, the first relative position information, and the second relative position information.
本發明之另一目的，即在提供一種瑕疵檢測結果整合系統，適用於整合一個多層膜於一個製造設備所進行的各製程階段對應的瑕疵檢測結果。其中，於各製程階段中，該製造設備持續地產生與該多層膜的位置相關的脈波訊號。Another object of the present invention is to provide an integrated detection system for flaw detection results suitable for integrating the detection results of a multilayer film in each manufacturing process performed by a multilayer device. Wherein, in each process stage, the manufacturing apparatus continuously generates a pulse wave signal associated with the position of the multilayer film.
於是，本發明瑕疵檢測結果整合系統包含：一個瑕疵檢測裝置、一個定位記號讀取單元，及一個電子裝置。Thus, the 瑕疵 detection result integration system of the present invention comprises: a 瑕疵 detection device, a positioning mark reading unit, and an electronic device.
該瑕疵檢測裝置用以擷取該多層膜分別於一個第一製程階段中及一個第二製程階段中的一個第一影像及一個第二影像，以分別產生一個第一影像訊框及一個第二影像訊框，其中，該第一影像及該第二影像分別涵蓋已標示於該多層膜的一個定位記號，其中，每一定位記號載有一筆參考點位置資訊，每一參考點位置資訊與該定位記號被標示於該多層膜的位置相關，該瑕疵檢測裝置還用以分別根據該第一影像訊框及該第二影像訊框進行瑕疵檢測，以分別得到對應於該第一影像的一個第一瑕疵檢測結果及對應於該第二影像的一個第二瑕疵檢測結果，其中，當該第一影像中有至少一個瑕疵存在時，該第一瑕疵檢測結果用以指示該瑕疵於該第一影像中的發生處，當該第二影像中有至少一個瑕疵存在時，該第二瑕疵檢測結果用以指示該瑕疵於該第二影像中的發生處。The 瑕疵 detecting device is configured to capture a first image and a second image of the multilayer film in a first process stage and a second process stage, respectively, to generate a first image frame and a second An image frame, wherein the first image and the second image respectively cover a positioning mark that is marked on the multilayer film, wherein each positioning symbol carries a reference point position information, and each reference point position information and the The positioning mark is associated with the position of the multi-layer film, and the detecting device is further configured to perform the detecting according to the first image frame and the second image frame respectively to obtain a first corresponding to the first image. a detection result and a second detection result corresponding to the second image, wherein when at least one defect exists in the first image, the first detection result is used to indicate the first image Wherein, in the presence of at least one defect in the second image, the second detection result is used to indicate the occurrence of the defect in the second image .
該定位記號讀取單元用以當其讀取到一個已標示於該多層膜的定位記號時，傳送該定位記號所載的該參考點位置資訊。The positioning mark reading unit is configured to transmit the reference point position information carried by the positioning mark when it reads a positioning mark already marked on the multilayer film.
該電子裝置可與該製造設備、該瑕疵檢測裝置及該定位記號讀取單元進行通訊，該電子裝置包括一個處理單元及一個記憶單元。其中，當該第一影像中有瑕疵存在時，該處理單元用以根據該第一瑕疵檢測結果，及來自該製造設備的脈波訊號，以得到該瑕疵於該第一影像中的發生處，相對於該第一影像中的該定位記號的一個第一瑕疵相對位置資訊，並用以將該第一瑕疵相對位置資訊記錄於該記憶單元，其中，該第一瑕疵相對位置資訊係對應於該第一影像中的該定位記號所載的該參考點位置資訊。其中，當該第二影像中有瑕疵存在時，該處理單元還用以根據該第二瑕疵檢測結果，及來自該製造設備的脈波訊號，以得到該瑕疵於該第二影像中的發生處，相對於該第二影像中的該定位記號的一個第二瑕疵相對位置資訊，並用以將該第二瑕疵相對位置資訊記錄於該記憶單元，其中，該第二瑕疵相對位置資訊係對應於該第二影像中的該定位記號所載的該參考點位置資訊。其中，該處理單元還根據該參考點位置資訊、該第一瑕疵相對位置資訊，及該第二瑕疵相對位置資訊，得到一筆瑕疵位置整合資訊。The electronic device can communicate with the manufacturing device, the defect detecting device and the positioning mark reading unit, the electronic device comprising a processing unit and a memory unit. The processing unit is configured to: according to the first detection result, and the pulse signal from the manufacturing device, to obtain the occurrence of the defect in the first image, a first relative position information of the positioning mark in the first image, and used to record the first relative position information in the memory unit, wherein the first relative position information corresponds to the first The reference point position information carried by the positioning mark in an image. The processing unit is further configured to: according to the second detection result, and the pulse signal from the manufacturing device, to obtain the occurrence of the second image in the second image. Corresponding to a second relative position information of the positioning mark in the second image, and used to record the second relative position information in the memory unit, wherein the second relative position information corresponds to the The reference point position information carried by the positioning mark in the second image. The processing unit further obtains a piece of position integration information according to the reference point position information, the first relative position information, and the second relative position information.
本發明之功效在於：藉由標示於該多層膜的該膜邊的定位記號，使得多個不同製程階段中檢測到的瑕疵位置(例如，該第一、二瑕疵相對位置資訊)有對位的依據，可供自動地整合該等製程階段的瑕疵檢測結果，而得到該瑕疵位置整合資訊。The effect of the invention is that the position of the defect detected in a plurality of different process stages (for example, the first and second relative position information) is aligned by the positioning mark indicated on the film edge of the multilayer film. Based on the fact that the detection results of the process stages can be automatically integrated to obtain the information of the location integration.
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之較佳實施例的詳細說明中，將可清楚的呈現。The foregoing and other objects, features, and advantages of the invention are set forth in the <RTIgt;
請參閱圖1與圖2，本發明瑕疵檢測結果整合系統1之較佳實施例，適用於整合一個多層膜2於一個製造設備(圖未示)所進行的各製程階段對應的瑕疵檢測結果；在本較佳實施例中，該多層膜2為偏光膜，該製造設備(圖未示)係採用卷對卷(Roll to Roll)架構來進行多個相異的製程階段以製造偏光膜；由於該製造設備(圖未示)的各個構件之功能及詳細實作方式係為熟習此項技術者所熟知，故不在此贅述。Referring to FIG. 1 and FIG. 2, a preferred embodiment of the 瑕疵 test result integration system 1 of the present invention is suitable for integrating a 多层 test result corresponding to each process stage performed by a multilayer film 2 in a manufacturing apparatus (not shown); In the preferred embodiment, the multilayer film 2 is a polarizing film, and the manufacturing apparatus (not shown) adopts a roll-to-roll architecture to perform a plurality of different process stages to manufacture a polarizing film; The function and detailed implementation of the various components of the manufacturing apparatus (not shown) are well known to those skilled in the art and are not described herein.
該瑕疵檢測結果整合系統1包含一個電子裝置11、一個標示裝置12、一個瑕疵檢測裝置13，及一個定位記號讀取單元14。在本較佳實施例中，該電子裝置11為一台伺服器(server)，該標示裝置12為一台噴印裝置。該電子裝置11包括一個收發單元111、一個處理單元112，及一個記憶單元113；該電子裝置11藉由該收發單元111可與該製造設備(圖未示)、該標示裝置12、該瑕疵檢測裝置13，及該定位記號讀取單元14以有線或無線的方式進行通訊；該記憶單元113的實施態樣為資料庫。The flaw detection integration system 1 includes an electronic device 11, a marking device 12, a flaw detecting device 13, and a positioning mark reading unit 14. In the preferred embodiment, the electronic device 11 is a server, and the marking device 12 is a printing device. The electronic device 11 includes a transceiver unit 111, a processing unit 112, and a memory unit 113. The electronic device 11 can be connected to the manufacturing device (not shown), the marking device 12, and the detecting device 111. The device 13 and the positioning mark reading unit 14 communicate in a wired or wireless manner; the implementation of the memory unit 113 is a database.
在該多層膜2的製造過程中，係藉由該製造設備(圖未示)的驅動件(例如，馬達，圖未示)之驅動而帶動該多層膜2朝預定的輸送方向傳送；其中，前述驅動件係搭配驅動件編碼器(例如，馬達編碼器，圖未示)來使用，其中，驅動件編碼器用以產生脈波訊號(encoder pulse)，以作為提供與該多層膜2於傳送中相關的位置資訊之用；該多層膜2具有至少一個膜邊21。由於利用脈波訊號求得位置之相關運算係為熟習此項技術者所熟知，故不在此贅述。In the manufacturing process of the multilayer film 2, the multi-layer film 2 is driven to be driven in a predetermined conveying direction by driving of a driving member (for example, a motor, not shown) of the manufacturing device (not shown); The driving member is used in conjunction with a driving member encoder (for example, a motor encoder, not shown), wherein the driving member encoder is configured to generate an encoder pulse for providing and transmitting the multilayer film 2 The associated positional information; the multilayer film 2 has at least one film edge 21. Since the correlation calculation using the pulse signal to obtain the position is well known to those skilled in the art, it will not be described here.
請參閱圖1至圖3，為了更進一步說明本發明瑕疵檢測結果整合系統1的各個構件之功能、運作，以及該瑕疵檢測結果整合系統1與該製造設備(圖未示)於製造過程中之互動關係，以下配合本發明瑕疵檢測結果整合方法之較佳實施例來描述。Referring to FIG. 1 to FIG. 3, in order to further explain the functions and operations of the components of the detection result integration system 1 of the present invention, and the manufacturing process integration system 1 and the manufacturing equipment (not shown) are in the manufacturing process. The interactive relationship is described below in conjunction with the preferred embodiment of the method for integrating detection results of the present invention.
為了便於描述，先給出下列定義：平行於該多層膜2的該膜邊21的一個第一軸L1，以及垂直於該第一軸L1的一個第二軸L2。For convenience of description, the following definitions are given: a first axis L1 parallel to the film side 21 of the multilayer film 2, and a second axis L2 perpendicular to the first axis L1.
在步驟301中，該電子裝置11的該收發單元111接收來自該製造設備(圖未示)的一個第一開始訊號；其中，該第一開始訊號用於指示一個第一製程階段的開始。在本較佳實施例中，該第一製程階段為一個延伸-貼合製程階段。In step 301, the transceiver unit 111 of the electronic device 11 receives a first start signal from the manufacturing device (not shown); wherein the first start signal is used to indicate the start of a first process phase. In the preferred embodiment, the first process stage is an extension-bonding process stage.
值得一提的是，在該第一製程階段的以下步驟之處理過程中，該電子裝置11的該收發單元111係持續地接收來自該製造設備(圖未示)的脈波訊號，以供該電子裝置11的該處理單元112進行相關運算及處理。It is to be noted that during the processing of the following steps in the first process stage, the transceiver unit 111 of the electronic device 11 continuously receives a pulse wave signal from the manufacturing device (not shown) for the The processing unit 112 of the electronic device 11 performs correlation calculations and processing.
在步驟302中，該電子裝置11的該處理單元112透過該收發單元111傳送一個參考點位置資訊給該標示裝置12。在本較佳實施例中，該第一製程階段之起始的(第一個)該參考點位置資訊可為0米(meter)。In step 302, the processing unit 112 of the electronic device 11 transmits a reference point position information to the marking device 12 through the transceiver unit 111. In the preferred embodiment, the first (first) reference point position information of the first process stage may be 0 meters.
在步驟303中，該標示裝置12根據該參考點位置資訊於該多層膜2標示(例如，噴印)載有(carry)該參考點位置資訊的一個定位記號，在本較佳實施例中，該標示裝置12係於該多層膜2的該膜邊21對應標示該定位記號，該處理單元112同時將該參考點位置資訊，及目前透過該收發單元111接收到的脈波訊號記錄至該記憶單元113，並以此步驟中所記錄的脈波訊號作為第一筆第一參考脈波訊號；更進一步來說，該參考點位置資訊與該定位記號被標示於該多層膜2的該膜邊21的位置相關；且該膜邊21所標示的該定位記號不會受到各製程階段的製程效果之影響而被遮蔽。在本較佳實施例中，該定位記號讀取單元14會接著立即讀取此步驟中所標示的該定位記號，以核對其所載的資訊是否無誤；該定位記號為載有該參考點位置資訊的一個二維條碼(2D barcode)，該定位記號讀取單元14為一個二維條碼讀取器(2D barcode reader)。In step 303, the marking device 12 marks (eg, prints) a positioning mark carrying the reference point position information on the multilayer film 2 according to the reference point position information. In the preferred embodiment, The marking device 12 is corresponding to the positioning mark of the film edge 21 of the multilayer film 2, and the processing unit 112 simultaneously records the reference point position information and the pulse wave signal currently received through the transceiver unit 111 to the memory. The unit 113, and the pulse wave signal recorded in the step is used as the first first reference pulse wave signal; further, the reference point position information and the positioning mark are marked on the film edge of the multilayer film 2 The position of 21 is related; and the positioning mark indicated by the film edge 21 is not obscured by the process effect of each process stage. In the preferred embodiment, the positioning mark reading unit 14 will immediately read the positioning mark indicated in this step to check whether the information contained therein is correct; the positioning mark carries the position of the reference point. A 2D barcode of the information, the positioning mark reading unit 14 is a 2D barcode reader.
在步驟304中，該瑕疵檢測裝置13擷取該多層膜2於該第一製程階段中的一個第一影像(image)以產生一個第一影像訊框(frame)，其中，該第一影像至少涵蓋一個已標示於該膜邊21的定位記號。In step 304, the flaw detection device 13 captures a first image of the multilayer film 2 in the first process stage to generate a first image frame, wherein the first image is at least A positioning mark that has been marked on the edge 21 of the film is covered.
在步驟305中，該瑕疵檢測裝置13根據該第一影像訊框進行瑕疵檢測，以得到對應於該第一影像的一個第一瑕疵檢測結果。由於該瑕疵檢測裝置13所進行的瑕疵檢測係為熟習此項技術者所熟知，故不在此贅述。In step 305, the flaw detecting device 13 performs flaw detection according to the first image frame to obtain a first flaw detection result corresponding to the first image. Since the flaw detection performed by the flaw detection device 13 is well known to those skilled in the art, it will not be described here.
在步驟306中，該處理單元112根據該第一瑕疵檢測結果判斷該第一影像中是否有瑕疵存在；若是，則至步驟307繼續進行處理；否則，至步驟309繼續進行處理。其中，當該第一影像中有至少一個瑕疵存在時，該第一瑕疵檢測結果用以指示該瑕疵於該第一影像中的發生處。In step 306, the processing unit 112 determines whether there is a defect in the first image according to the first detection result; if yes, the process proceeds to step 307; otherwise, the process proceeds to step 309. The first flaw detection result is used to indicate the occurrence of the flaw in the first image when at least one flaw exists in the first image.
在步驟307中，該處理單元112根據該第一瑕疵檢測結果、該記憶單元113內所記錄的最近一筆第一參考脈波訊號，及當檢測到該瑕疵發生時透過該收發單元111所接收到的脈波訊號，以得到該瑕疵於該第一影像中的發生處，相對於該第一影像中的該定位記號的一個第一瑕疵相對位置資訊；更進一步來說，該第一瑕疵相對位置資訊係對應於該第一影像中的該定位記號所載的該參考點位置資訊。令該第一軸L1及該第二軸L2構成一個二維直角座標系，並以該第一影像中的該定位記號為一個參考點，在本較佳實施例中，該第一瑕疵相對位置資訊即為該瑕疵於該第一影像中的發生處相對於該參考點的一個二維相對座標。In step 307, the processing unit 112 receives the latest first reference pulse signal recorded in the memory unit 113 according to the first detection result, and receives the transmission through the transceiver unit 111 when the detection occurs. a pulse signal for obtaining a first relative position information of the position mark in the first image relative to the occurrence of the first image; and further, the first relative position The information corresponds to the reference point position information carried by the positioning mark in the first image. The first axis L1 and the second axis L2 form a two-dimensional orthogonal coordinate system, and the positioning mark in the first image is used as a reference point. In the preferred embodiment, the first relative position of the first axis The information is a two-dimensional relative coordinate of the occurrence of the click in the first image relative to the reference point.
在步驟308中，該處理單元112將步驟307所得到的該第一瑕疵相對位置資訊記錄至該記憶單元113。In step 308, the processing unit 112 records the first relative position information obtained in step 307 to the memory unit 113.
舉例來說，如圖4所示，其顯示了一個涵蓋載有該第一製程階段之起始的(第一個)該參考點位置資訊的該定位記號的第一影像4。為了便於描述，將載有起始的該參考點位置資訊的該定位記號以A表示。假設於該第一製程階段的該第一影像4中有一個瑕疵存在，且其發生處以P1表示。該處理單元112根據該記憶單元113內所記錄的最近一筆第一參考脈波訊號，及當檢測到該瑕疵發生時透過該收發單元111所接收到的脈波訊號，可求得P1沿著該第一軸L1相對於該定位記號A的一個距離資訊x1；由於該處理單元112根據該第一瑕疵檢測結果，還可得到P1分別沿該第一、二軸L1、L2相對於該定位記號A的一個距離比例(假設該距離比例以R表示)，因此該處理單元112可再根據該距離資訊x1及該距離比例R，以求得P1沿著該第二軸L2相對於該定位記號A的一個距離資訊y1，即，y1=x1÷R；換言之，P1的該第一瑕疵相對位置(二維相對座標)包括x1及y1，其可表示為(x1,y1)。For example, as shown in FIG. 4, it shows a first image 4 of the positioning mark covering the (first) reference point position information of the beginning of the first process stage. For convenience of description, the positioning mark carrying the initial reference point position information is denoted by A. It is assumed that one of the first images 4 in the first process stage exists, and its occurrence is represented by P1. The processing unit 112 can obtain P1 along the latest first reference pulse wave signal recorded in the memory unit 113 and the pulse wave signal received by the transceiver unit 111 when the detection occurs. A distance information x1 of the first axis L1 relative to the positioning mark A; since the processing unit 112 can obtain P1 along the first and second axes L1, L2 with respect to the positioning mark A according to the first flaw detection result a distance ratio (assuming the distance ratio is represented by R), so the processing unit 112 can further determine the distance P1 along the second axis L2 relative to the positioning mark A according to the distance information x1 and the distance ratio R. A distance information y1, that is, y1=x1÷R; in other words, the first relative position (two-dimensional relative coordinates) of P1 includes x1 and y1, which can be expressed as (x1, y1).
請參閱圖1至圖3，在步驟309中，該處理單元112判斷該收發單元111是否接收到來自該製造設備(圖未示)的一個第一結束訊號；若是，則結束處理；否則，至步驟310繼續進行處理。其中，該第一結束訊號用於指示該第一製程階段的結束。Referring to FIG. 1 to FIG. 3, in step 309, the processing unit 112 determines whether the transceiver unit 111 receives a first end signal from the manufacturing device (not shown); if yes, ends the process; otherwise, to Step 310 continues with processing. The first end signal is used to indicate the end of the first process phase.
在步驟310中，該處理單元112根據該記憶單元113內所記錄的最近一筆第一參考脈波訊號，及目前透過該收發單元111所接收到的脈波訊號，以得到一個間距。In step 310, the processing unit 112 obtains a pitch according to the most recent first reference pulse wave signal recorded in the memory unit 113 and the pulse wave signal currently received by the transceiver unit 111.
在步驟311中，該處理單元112判斷該間距是否等於一個預設的間距；若是，則至步驟312繼續進行處理；否則，回到步驟310繼續進行處理。In step 311, the processing unit 112 determines whether the spacing is equal to a predetermined spacing; if so, then proceeds to step 312 to continue processing; otherwise, returns to step 310 to continue processing.
在步驟312中，該處理單元112將當該間距等於該預設的間距時所接收到的脈波訊號記錄至該記憶單元113，並以此步驟中所記錄的脈波訊號作為一個第一參考脈波訊號。In step 312, the processing unit 112 records the pulse wave signal received when the pitch is equal to the preset pitch to the memory unit 113, and uses the pulse signal recorded in the step as a first reference. Pulse signal.
在步驟313中，該處理單元112根據該記憶單元113內所記錄的最近一筆第一參考脈波訊號，及該記憶單元113內所記錄的第一筆第一參考脈波訊號，以得到該參考點位置資訊，並將該參考點位置資訊記錄至該記憶單元113，且將其透過該收發單元111傳送給該標示裝置12。In step 313, the processing unit 112 obtains the reference according to the latest first reference pulse wave signal recorded in the memory unit 113 and the first first reference pulse wave signal recorded in the memory unit 113. The location information is recorded, and the reference location information is recorded to the memory unit 113 and transmitted to the identification device 12 through the transceiver unit 111.
在步驟314中，該標示裝置12根據該參考點位置資訊於該多層膜2的該膜邊21標示載有該參考點位置資訊的一個定位記號；然後，回到步驟304繼續進行處理。在本較佳實施例中，該定位記號讀取單元14會接著立即讀取此步驟中所標示的該定位記號，以核對其所載的資訊是否無誤。In step 314, the marking device 12 marks a positioning mark carrying the reference point position information on the film side 21 of the multilayer film 2 according to the reference point position information; then, returning to step 304 to continue the processing. In the preferred embodiment, the positioning mark reading unit 14 will immediately read the positioning mark indicated in this step to check whether the information contained therein is correct.
換言之，該參考點位置資訊實質上即為步驟314中所標示的該定位記號，沿著該第一軸L1相對於載有起始的該參考點位置資訊的該定位記號的一個距離資訊。In other words, the reference point position information is substantially the position mark indicated in step 314 along a distance information of the first axis L1 relative to the positioning mark carrying the initial position information of the reference point.
小結上述，在該第一製程階段結束之後，該多層膜2的該膜邊21於每相隔該預設的間距之處會被對應標示該定位記號，假設該預設的間距為l ，且該等定位記號依序以A、B、C及D表示，則其等載有的該等參考點位置資訊分別為0、l 、2l ，及3l (米)。假設在該第一製程階段中所檢測到的多個瑕疵的發生處分別以P1、P2、P3，及P4表示，則該記憶單元113已記錄有該等第一參考脈波訊號、該等參考點位置資訊，以及P1~P4的第一瑕疵相對位置。更進一步來說，由該記憶單元113所記錄的該等第一參考脈波訊號、該等參考點位置資訊，以及該等第一瑕疵相對位置，可得知相鄰的兩個定位記號間，已檢測到的瑕疵所對應之第一瑕疵相對位置。Summary, after the end of the first process stage, the film edge 21 of the multilayer film 2 is correspondingly marked with the positioning mark every time the predetermined interval is separated, assuming that the preset pitch is l , and the The positioning marks are sequentially represented by A, B, C, and D, and the position information of the reference points carried by them are 0, l , 2 l , and 3 l (m), respectively. Assuming that the occurrences of the plurality of defects detected in the first process phase are represented by P1, P2, P3, and P4, respectively, the memory unit 113 has recorded the first reference pulse signals, and the reference Point position information, and the relative position of the first point of P1~P4. Further, the first reference pulse signals recorded by the memory unit 113, the reference position information, and the relative positions of the first frames can be used to learn between two adjacent positioning marks. The first relative position corresponding to the detected 瑕疵.
請參閱圖1、圖2與圖5，在步驟501中，該電子裝置11的該收發單元111接收來自該製造設備(圖未示)的一個第二開始訊號；其中，該第二開始訊號用於指示一個第二製程階段的開始。在本較佳實施例中，該第二製程階段為一個PSA塗佈階段；更進一步來說，如圖2所示，該多層膜2在該第一、二製程階段中，其上、下捲料是互換的。Referring to FIG. 1 , FIG. 2 and FIG. 5 , in step 501 , the transceiver unit 111 of the electronic device 11 receives a second start signal from the manufacturing device (not shown); wherein the second start signal is used. Indicates the beginning of a second process phase. In the preferred embodiment, the second process stage is a PSA coating stage; further, as shown in FIG. 2, the multilayer film 2 is in the first and second process stages, and the upper and lower rolls thereof The materials are interchangeable.
值得一提的是，在該第二製程階段的以下步驟之處理過程中，該電子裝置11的該收發單元111仍持續地接收來自該製造設備(圖未示)的脈波訊號，以供該電子裝置11的該處理單元112進行相關運算及處理。It is to be noted that during the processing of the following steps of the second process stage, the transceiver unit 111 of the electronic device 11 continuously receives the pulse wave signal from the manufacturing device (not shown) for the The processing unit 112 of the electronic device 11 performs correlation calculations and processing.
在步驟502中，該定位記號讀取單元14持續地讀取資料，且當該定位記號讀取單元14讀取到已標示於該多層膜2的該膜邊21的其中一個定位記號時，至步驟503繼續進行處理。In step 502, the positioning mark reading unit 14 continuously reads the data, and when the positioning mark reading unit 14 reads the one of the positioning marks that have been marked on the film side 21 of the multilayer film 2, Step 503 continues with the processing.
在步驟503中，該定位記號讀取單元14將步驟502中所讀取到的該定位記號所載的該參考點位置資訊傳送給該電子裝置11，該處理單元112同時將目前透過該收發單元111接收到的脈波訊號記錄至該記憶單元113，並以此步驟中記錄的脈波訊號作為一筆第二參考脈波訊號。In step 503, the positioning mark reading unit 14 transmits the reference point position information carried in the positioning mark read in step 502 to the electronic device 11, and the processing unit 112 simultaneously transmits the current transmitting unit. The received pulse wave signal is recorded to the memory unit 113, and the pulse wave signal recorded in this step is used as a second reference pulse wave signal.
在步驟504中，該瑕疵檢測裝置13擷取該多層膜2於該第二製程階段中的一個第二影像以產生一個第二影像訊框，其中，該第二影像涵蓋步驟502中讀取到的該定位記號。In step 504, the defect detecting device 13 captures a second image of the multilayer film 2 in the second process stage to generate a second image frame, wherein the second image covers the reading in step 502. The positioning token.
在步驟505中，該瑕疵檢測裝置13根據該第二影像訊框進行瑕疵檢測，以得到對應於該第二影像的一個第二瑕疵檢測結果。In step 505, the detection device 13 performs detection based on the second image frame to obtain a second detection result corresponding to the second image.
在步驟506中，該處理單元112根據該第二瑕疵檢測結果判斷該第二影像中是否有瑕疵存在；若是，則至步驟507繼續進行處理；否則，至步驟509繼續進行處理。其中，當該第二影像中有至少一個瑕疵存在時，該第二瑕疵檢測結果用以指示該瑕疵於該第二影像中的發生處。In step 506, the processing unit 112 determines whether there is a defect in the second image according to the second detection result; if yes, the process proceeds to step 507; otherwise, the process proceeds to step 509. Wherein, when at least one of the second images is present, the second detection result is used to indicate the occurrence of the second image.
在步驟507中，該處理單元112根據該第二瑕疵檢測結果、該記憶單元113內所記錄的最近一筆第二參考脈波訊號，及當檢測到該瑕疵發生時透過該收發單元111所接收到的脈波訊號，以得到該瑕疵於該第二影像中的發生處，相對於該第二影像中的該定位記號的一個第二瑕疵相對位置資訊；更進一步來說，該第二瑕疵相對位置資訊係對應於該第二影像中的該定位記號所載的該參考點位置資訊。類似地，以該第二影像中的該定位記號為一個參考點，在本較佳實施例中，該第二瑕疵相對位置資訊即為該瑕疵於該第二影像中的發生處相對於該參考點的一個二維相對座標。In step 507, the processing unit 112 receives the latest second reference pulse signal recorded in the memory unit 113 according to the second detection result, and receives the transmission through the transceiver unit 111 when the detection occurs. a pulse signal for obtaining a second relative position information of the positioning mark in the second image; and further, the second relative position The information corresponds to the reference point position information carried by the positioning mark in the second image. Similarly, the positioning symbol in the second image is used as a reference point. In the preferred embodiment, the second relative position information is the occurrence of the second image relative to the reference. A two-dimensional relative coordinate of the point.
在步驟508中，該處理單元112將步驟507所得到的該第二瑕疵相對位置資訊記錄至該記憶單元113。In step 508, the processing unit 112 records the second relative position information obtained in step 507 to the memory unit 113.
在步驟509中，該處理單元112判斷該收發單元111是否接收到來自該製造設備(圖未示)的一個第二結束訊號；若是，則至步驟510繼續進行處理；否則，回到步驟502繼續進行處理。其中，該第二結束訊號用於指示該第二製程階段的結束。In step 509, the processing unit 112 determines whether the transceiver unit 111 receives a second end signal from the manufacturing device (not shown); if so, proceeds to step 510 to continue processing; otherwise, returns to step 502 to continue. Process it. The second end signal is used to indicate the end of the second process phase.
在步驟510中，該處理單元112根據記錄於該記憶單元113的該(等)參考點位置資訊，該(等)第二瑕疵相對位置資訊，以及該(等)第一瑕疵相對位置資訊，得到一筆瑕疵位置整合資訊，並將其傳送給該標示裝置12。In step 510, the processing unit 112 obtains the second information relative position information and the first relative position information according to the (equal) reference point position information recorded in the memory unit 113. The information is integrated into the location and transmitted to the signage device 12.
在步驟511中，該標示裝置12根據該瑕疵位置整合資訊對應地於該多層膜2上標示至少一個瑕疵標記，並於所有的瑕疵標記標示完後結束處理。如圖2所示，在本較佳實施例中，係以虛線方框來作為該瑕疵標記。In step 511, the marking device 12 correspondingly marks at least one 瑕疵 mark on the multilayer film 2 according to the 瑕疵 position integration information, and ends the processing after all the 瑕疵 marks are marked. As shown in FIG. 2, in the preferred embodiment, a dashed box is used as the 瑕疵 mark.
延續以上範例，並請配合回顧圖4，其還顯示了一個涵蓋該定位記號D的第二影像6。假設於該第二製程階段的該第二影像6中有一個瑕疵存在，且其發生處以P′表示。在本較佳實施例中，由於該多層膜2在該第一、二製程階段中，其上、下捲料是互換的，因此，於該第一製程階段檢測到的該瑕疵的發生處P4的該第一瑕疵相對位置資訊必須經過座標轉換後，得到該瑕疵的發生處P4相對於該定位記號D的一個二維相對座標，以供該處理單元112據以得到一筆瑕疵位置整合資訊，其中，該瑕疵位置整合資訊包括該定位記號D所載的該參考點位置資訊、於該第二製程階段檢測到的該瑕疵的發生處P′的該第二瑕疵相對位置資訊，及於該第一製程階段檢測到的該瑕疵的發生處P4相對於該定位記號D的該二維相對座標。值得一提的是，「座標轉換」的目的是用於將不同製程階段檢測到的瑕疵相對位置轉換成相對於同一參考點，以便後續進行整合標示之用，因此，是否需進行「座標轉換」端視實際製程階段的狀況而定(例如，有上、下捲料互換的情況即需進行座標轉換)，並不限於本範例所揭露。Continuing the above example, and in conjunction with reviewing FIG. 4, it also shows a second image 6 covering the positioning mark D. It is assumed that there is a defect in the second image 6 in the second process stage, and its occurrence is represented by P'. In the preferred embodiment, since the multilayer film 2 is in the first and second process stages, the upper and lower coils are interchanged, and therefore, the occurrence of the flaw detected in the first process stage is P4. The first relative position information must be converted by coordinates to obtain a two-dimensional relative coordinate of the occurrence point P4 of the 相对 relative to the positioning mark D, so that the processing unit 112 can obtain a piece of position integration information, wherein The location integration information includes the reference point location information carried by the location mark D, the second relative position information of the occurrence point of the flaw detected in the second processing stage, and the first The occurrence of the flaw P4 detected in the process phase is relative to the two-dimensional relative coordinate of the positioning mark D. It is worth mentioning that the purpose of "coordinate conversion" is to convert the relative position detected in different process stages to the same reference point for subsequent integration, so whether "coordinate conversion" is required. Depending on the actual process stage (for example, there is a need for coordinate conversion when the upper and lower coils are interchanged), it is not limited to this example.
在本較佳實施例中，係在接收到該第二結束訊號後才進行瑕疵標記的整合標示，然，該處理單元112亦可於該定位記號讀取單元14讀取到其中一個定位記號時，根據記錄於該記憶單元113中相關的該第一瑕疵相對位置資訊得到該瑕疵位置整合資訊，以供該標示裝置12即時地進行標記，並不限於本較佳實施例所揭露。In the preferred embodiment, the integrated indication of the 瑕疵 mark is performed after receiving the second end signal. However, the processing unit 112 can also read one of the positioning marks when the positioning mark reading unit 14 reads the position mark. The location integration information is obtained according to the first relative position information recorded in the memory unit 113 for the marking device 12 to mark immediately, and is not limited to the preferred embodiment.
又，雖然在以上的描述當中，僅以兩個製程階段(即，該第一製程階段及該第二製程階段)為例進行說明，然，其步驟與概念可延伸應用於兩個以上的製程階段；並不限於以上描述所揭露。再者，雖然在本較佳實施例中主要係以製造偏光膜的製程階段為例進行說明，然，本發明瑕疵檢測結果整合系統1及方法，亦可搭配各種用於進行多個製程階段且製程階段彼此之間缺乏對位資訊的製造設備(圖未示)來應用，並不限於本較佳實施例所揭露。Moreover, although in the above description, only two process stages (ie, the first process stage and the second process stage) are taken as an example, the steps and concepts may be extended to more than two processes. Stage; not limited to the above description. In addition, in the preferred embodiment, the manufacturing process of manufacturing the polarizing film is mainly taken as an example. However, the detection result integration system 1 and method of the present invention may be combined with various methods for performing multiple process stages. The manufacturing process (not shown) lacking alignment information between the process stages is applied, and is not limited to the preferred embodiment.
綜上所述，藉由標示於該多層膜2的該膜邊21的定位記號，使得多個不同製程階段中檢測到的瑕疵位置(例如，該第一、二瑕疵相對位置資訊)有對位的依據，可供自動地整合該等製程階段的瑕疵檢測結果，而得到該瑕疵位置整合資訊，故確實能達成本發明之目的。In summary, the position of the defect detected in the plurality of different process stages (for example, the first and second relative position information) is aligned by the positioning mark of the film edge 21 of the multilayer film 2 The basis for the automatic integration of the detection results of the process stages, and the integration of the location information, can indeed achieve the purpose of the present invention.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
1．．．瑕疵檢測結果整合系統1. . .瑕疵 test result integration system
11．．．電子裝置11. . . Electronic device
111．．．收發單元111. . . Transceiver unit
112．．．處理單元112. . . Processing unit
113．．．記憶單元113. . . Memory unit
12．．．標示裝置12. . . Marking device
13．．．瑕疵檢測裝置13. . .瑕疵Detection device
14．．．定位記號讀取單元14. . . Positioning mark reading unit
2．．．多層膜2. . . Multilayer film
21．．．膜邊twenty one. . . Membrane edge
L1．．．第一軸L1. . . First axis
L2．．．第二軸L2. . . Second axis
A~D．．．定位記號A~D. . . Positioning mark
P1~P4．．．第一製程階段中所檢測到的瑕疵的發生處P1~P4. . . The occurrence of defects detected in the first process stage
P′．．．第二製程階段中所檢測到的瑕疵的發生處P'. . . The occurrence of defects detected in the second process stage
301~314．．．步驟301~314. . . step
4．．．第一影像4. . . First image
501~511．．．步驟501~511. . . step
6．．．第二影像6. . . Second image
圖1是一方塊圖，說明本發明瑕疵檢測結果整合系統之較佳實施例；1 is a block diagram showing a preferred embodiment of the 瑕疵 test result integration system of the present invention;
圖2是一示意圖，說明在一個第一製程階段結束之後，一個多層膜的一個膜邊於每相隔一個預設的間距之處已標示的定位記號及被檢測到的瑕疵的發生處，以及在一個第二製程階段結束之後，被檢測到的瑕疵的發生處及已對應標示的瑕疵標記；Figure 2 is a schematic view showing the position marks of a film of a multilayer film at a predetermined interval and the occurrence of the detected flaws after the end of a first process stage, and After the end of a second process phase, the occurrence of the detected flaw and the corresponding mark of the mark;
圖3是一流程圖，說明本發明瑕疵檢測結果整合方法之較佳實施例於該第一製程階段所執行的步驟；3 is a flow chart showing the steps performed by the preferred embodiment of the method for integrating detection results of the present invention in the first process stage;
圖4是一示意圖，說明在該第一製程階段所擷取的一個第一影像，及在該第二製程階段所擷取的一個第二影像；及4 is a schematic diagram showing a first image captured during the first process stage and a second image captured during the second process stage; and
圖5是一流程圖，說明本發明瑕疵檢測結果整合方法之較佳實施例於該第二製程階段所執行的步驟。Figure 5 is a flow chart showing the steps performed by the preferred embodiment of the method for integrating detection results of the present invention in the second process stage.
1．．．瑕疵檢測結果整合系統1. . .瑕疵 test result integration system
11．．．電子裝置11. . . Electronic device
111．．．收發單元111. . . Transceiver unit
112．．．處理單元112. . . Processing unit
113．．．記憶單元113. . . Memory unit
12．．．標示裝置12. . . Marking device
13．．．瑕疵檢測裝置13. . .瑕疵Detection device
14．．．定位記號讀取單元14. . . Positioning mark reading unit
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| US10429318B2 (en) | 2017-12-19 | 2019-10-01 | Industrial Technology Research Institute | Detection system for a multilayer film and method thereof using dual image capture devices for capturing forward scattered light and back scattered light |
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| US10429318B2 (en) | 2017-12-19 | 2019-10-01 | Industrial Technology Research Institute | Detection system for a multilayer film and method thereof using dual image capture devices for capturing forward scattered light and back scattered light |
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