CN102507607B - System and method for integrating defect detection results - Google Patents
System and method for integrating defect detection results Download PDFInfo
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- CN102507607B CN102507607B CN 201110390357 CN201110390357A CN102507607B CN 102507607 B CN102507607 B CN 102507607B CN 201110390357 CN201110390357 CN 201110390357 CN 201110390357 A CN201110390357 A CN 201110390357A CN 102507607 B CN102507607 B CN 102507607B
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Abstract
The invention discloses a system and method for integrating defect detection results. The system for integrating the defect detection results comprises a defect detection device, a setting mark reading unit and an electronic device. The defect detection device is used for capturing first and second images of multiple layers of films in first and second processing phases to generate first and second image frames, and obtaining first and second defect detection results according to the first and second image frames, wherein setting marks, on which reference point position information are loaded, are covered by the first and second images. The setting mark reading unit is used for transmitting the reference point position information which is read by the setting mark reading unit and loaded by the setting marks. A processing unit of the electronic device is used for obtaining relative position information of first and second defects according to the first and second defect detection results and pulse signals from manufacturing equipment, and obtaining defect position integration information according to the reference point position information and the relative position information ofthe first and second defects. The system and method provided by the invention have the advantage of automatically integrating the defect detection results of all the processing phases so as to obtainthe defect position integration information.
Description
Technical field
The invention relates to a kind of flaw (defect) testing result integration system and method, refer to a kind of Defect Detection that is applicable to many process stage integration system and method as a result especially.
Background technology
Light polarizing film is one of key part and component of LCD (Liquid Crystal Display, be called for short LCD), and it belongs to a kind of macromolecule multilayer materials, and its manufacturing comprised similarly be extend, fit, coating, and precision a plurality of process stage such as cut.In each process stage of light polarizing film, it is carried out the quality that Defect Detection helps to promote product; Existing various automated optical detects (Automated OpticalInspection is called for short AOI) device at present, but robotization ground carries out Defect Detection at the light polarizing film of each process stage.
In recent years, the manufacturing equipment of volume to volume (roll to roll) framework is being held its high production capacity and advantage cheaply under the arm, has become the main flow production equipment of soft electronic product (flexible electronics, for example, light polarizing film).Because light polarizing film is to carry out Defect Detection independently in each process stage, moreover, same volume light polarizing film in a certain process stage (for example, extension-applying process stage) to next process stage (for example handles the back, PSA (Pressure Sensitive Adhesives) the coating stage), can be because the position difference of unwinding and rewinding, factor such as upper and lower coiled strip exchange and accurately contraposition; So the existing practice is: at each process stage, after carrying out Defect Detection, all must add a jet printing appts (printer), and before entering next process stage, the nidus that is detected flaw on light polarizing film carries out spray printing with serve as a mark (mark); Also need at last further the Defect Detection result of each process stage to be judged, assesses and integrates by manual type, cause efficient situation unclear and that have criterion to differ easily to take place.
Summary of the invention
Therefore, purpose of the present invention namely is to provide a kind of Defect Detection integration method as a result, is applicable to the Defect Detection result who integrates each process stage correspondence that multilayer film carries out in manufacturing equipment.Wherein, in each process stage, this manufacturing equipment produces the pulse signal relevant with the position of this multilayer film constantly.
So Defect Detection of the present invention is integration method as a result, utilize to comprise processing unit, Defect Detection device, setting mark reading unit, a system that reaches mnemon carries out, and this method comprises the following step:
(A) in first process stage, utilize this Defect Detection device to capture first image of this multilayer film in this first process stage to produce first image news frame, wherein, this first image is contained the setting mark that is shown in this multilayer film, this setting mark is loaded with a reference point locations information, and this reference point locations information is relevant with the position that this setting mark is shown in this multilayer film;
(B) utilize this Defect Detection device to carry out Defect Detection according to this first image news frame, to obtain the first Defect Detection result corresponding to this first image, wherein, when having at least one flaw to exist in this first image, this first Defect Detection result is in order to indicate the nidus of this flaw in this first image;
(C) when having flaw to exist in this first image, utilize this processing unit according to this first Defect Detection result, reach the pulse signal from this manufacturing equipment, to obtain the nidus of this flaw in this first image with respect to the first flaw relative position information of this setting mark in this first image, wherein, this first flaw relative position information is corresponding to this contained reference point locations information of this setting mark in this first image;
(D) utilize this processing unit that this first flaw relative position information is recorded in this mnemon;
(E) in second process stage, when this setting mark reading unit reads the setting mark that is shown in this multilayer film, transmit this contained reference point locations information of this setting mark that reads in this step;
(F) utilize this Defect Detection device to capture second image of this multilayer film in this second process stage to produce second image news frame, this second image is contained this setting mark that reads in the step (E);
(G) utilize this Defect Detection device to carry out Defect Detection according to this second image news frame, to obtain the second Defect Detection result corresponding to this second image, wherein, when having at least one flaw to exist in this second image, this second Defect Detection result is in order to indicate the nidus of this flaw in second image;
(H) when having flaw to exist in this second image, utilize this processing unit according to this second Defect Detection result, reach the pulse signal from this manufacturing equipment, to obtain the nidus of this flaw in this second image with respect to the second flaw relative position information of this setting mark in this second image, wherein, this second flaw relative position information is corresponding to this contained reference point locations information of this setting mark in this second image; And
(I) utilize this processing unit according to this reference point locations information, this first flaw relative position information, and this second flaw relative position information, a flaw location integrate information obtained.
As optional technical scheme, this system also comprises indication device, and this method also comprises step (A) the following step before:
(J) utilize this indication device to indicate this setting mark according to this reference point locations information in this multilayer film.
As optional technical scheme, this multilayer film has at least one film limit, wherein, in this step (J), utilizes this indication device to indicate this setting mark according to this reference point locations information in this film limit of this multilayer film.
As optional technical scheme, definition is parallel to first of this film limit of this multilayer film, and perpendicular to this first second, wherein, step (C) comprises following substep:
(c-1) according to the pulse signal from this manufacturing equipment, obtain the nidus of this flaw in this first image along this first range information x1 with respect to this setting mark in this first image;
(c-2) according to this first Defect Detection result, obtain the nidus of this flaw in this first image respectively along this first and second with respect to the distance proportion of this setting mark in this first image; And
(c-3) according to this range information x1 and this distance proportion, along this second range information y1 with respect to this setting mark in this first image, wherein, this first flaw relative position comprises x1 and y1 in the hope of the nidus of this flaw in this first image.
As optional technical scheme, this system also comprises indication device, and this method also comprises step (I) the following step afterwards:
(K) utilize this indication device on this multilayer film, to indicate at least one flaw mark accordingly according to this flaw location integrate information.
Another object of the present invention is namely providing a kind of Defect Detection integration system as a result, is applicable to the Defect Detection result who integrates each process stage correspondence that multilayer film carries out in manufacturing equipment.Wherein, in each process stage, this manufacturing equipment produces the pulse signal relevant with the position of this multilayer film constantly.
So Defect Detection of the present invention integration system as a result comprises: Defect Detection device, setting mark reading unit, and an electronic installation.This Defect Detection device is in order to capture this multilayer film respectively at first image and second image that reach in first process stage in second process stage, to produce first image news frame and second image news frame respectively, wherein, this first image and this second image are contained the setting mark that has been shown in this multilayer film respectively, wherein, each setting mark is loaded with a reference point locations information, each reference point locations information is relevant with the position that this setting mark is shown in this multilayer film, this Defect Detection device is also in order to carry out Defect Detection according to this first image news frame and this second image news frame respectively, to obtain respectively corresponding to the first Defect Detection result of this first image and corresponding to the second Defect Detection result of this second image, wherein, when having at least one flaw to exist in this first image, this first Defect Detection result is in order to indicate the nidus of this flaw in this first image, when having at least one flaw to exist in this second image, this second Defect Detection result is in order to indicate the nidus of this flaw in this second image.
This setting mark reading unit transmits this contained reference point locations information of this setting mark when reading the setting mark that is shown in this multilayer film when it.
This electronic installation can carry out communication with this manufacturing equipment, this Defect Detection device and this setting mark reading unit, and this electronic installation comprises processing unit and mnemon.Wherein, when having flaw to exist in this first image, this processing unit is in order to according to this first Defect Detection result, reach the pulse signal from this manufacturing equipment, to obtain the nidus of this flaw in this first image with respect to the first flaw relative position information of this setting mark in this first image, and in order to this first flaw relative position information is recorded in this mnemon, wherein, this first flaw relative position information is corresponding to this contained reference point locations information of this setting mark in this first image.Wherein, when having flaw to exist in this second image, this processing unit is also in order to according to this second Defect Detection result, reach the pulse signal from this manufacturing equipment, to obtain the nidus of this flaw in this second image with respect to the second flaw relative position information of this setting mark in this second image, and in order to this second flaw relative position information is recorded in this mnemon, wherein, this second flaw relative position information system is corresponding to this contained reference point locations information of this setting mark in this second image.Wherein, this processing unit is also according to this reference point locations information, this first flaw relative position information, and this second flaw relative position information, obtains a flaw location integrate information.
As optional technical scheme, also comprise the indication device that can carry out communication with this electronic installation, in order to indicate this setting mark according to this reference point locations information in this multilayer film.
As optional technical scheme, this multilayer film has at least one film limit, and wherein, this indication device indicates this setting mark according to this reference point locations information in this film limit of this multilayer film.
As optional technical scheme, definition is parallel to first of this film limit of this multilayer film, and perpendicular to this first second, wherein, when having flaw to exist in this first image, this processing unit carries out following processing, to obtain this first flaw relative position:
According to the pulse signal from this manufacturing equipment, obtain the nidus of this flaw in this first image along this first range information x1 with respect to this setting mark in this first image;
According to this first Defect Detection result, obtain the nidus of this flaw in this first image respectively along this first and second with respect to the distance proportion of this setting mark in this first image; And
According to this range information x1 and this distance proportion, along this second range information y1 with respect to this setting mark in this first image, wherein, this first flaw relative position comprises x1 and y1 in the hope of the nidus of this flaw in this first image.
As optional technical scheme, also comprise the indication device that can carry out communication with this electronic installation, in order on this multilayer film, to indicate at least one flaw mark accordingly according to this flaw location integrate information.
Compared with prior art, the present invention's effect is: by the setting mark on this film limit that is shown in this multilayer film, make that detected flaw location (for example in a plurality of different process stage, this first and second flaw relative position information) foundation of contraposition is arranged, can supply automatically to integrate the Defect Detection result of these process stage, and obtain this flaw location integrate information.
Description of drawings
Fig. 1 is depicted as according to the present invention the Defect Detection calcspar of the preferred embodiment of integration system as a result;
Figure 2 shows that after first process stage finishes, the nidus of the setting mark that a film limit of multilayer film has indicated in the default spacing part of whenever being separated by and the flaw that is detected, and after second process stage finishes, the synoptic diagram of the nidus of the flaw that is detected and the corresponding flaw mark that indicates;
Figure 3 shows that the preferred embodiment of integration method as a result of according to the present invention Defect Detection is in the performed flow chart of steps of this first process stage;
Figure 4 shows that first image that captures in this first process stage, reach the synoptic diagram of second image that captures in this second process stage; And
Figure 5 shows that the preferred embodiment of integration method as a result of according to the present invention Defect Detection is in the performed flow chart of steps of this second process stage.
Embodiment
About aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to graphic preferred embodiment, can clearly present.
See also Fig. 1 and Fig. 2, Figure 1 shows that according to the present invention the Defect Detection calcspar of the preferred embodiment of integration system 1 as a result, be applicable to the Defect Detection result who integrates each process stage correspondence that multilayer film 2 carries out in the manufacturing equipment (not shown); In this preferred embodiment, multilayer film 2 is light polarizing film, and the manufacturing equipment (not shown) adopts volume to volume (Roll to Roll) framework to carry out a plurality of different process stage to make light polarizing film; Because function and the detailed operation mode of each member of manufacturing equipment (not shown) are known by those who familiarize themselves with the technology, so do not give unnecessary details at this.
Defect Detection integration system 1 as a result comprises electronic installation 11, indication device 12, Defect Detection device 13, and setting mark reading unit 14.In this preferred embodiment, electronic installation 11 is a station server (server), and indication device 12 is a jet printing appts.Electronic installation 11 comprises Transmit-Receive Unit 111, processing unit 112 and mnemon 113; Electronic installation 11 by Transmit-Receive Unit 111 can with manufacturing equipment (not shown), indication device 12, Defect Detection device 13, and setting mark reading unit 14 carries out communication in wired or wireless mode; The embodiment of mnemon 113 for example is database.
In the manufacture process of multilayer film 2, drive multilayer film 2 by the driving of the actuator of manufacturing equipment (not shown) (for example, motor, figure does not show) and transmit towards predetermined throughput direction; Wherein, aforementioned actuator collocation actuator scrambler (for example, motor encoder, figure does not show) use, wherein, the actuator scrambler is in order to producing pulse signal (encoder pulse), with as the usefulness that provides with multilayer film 2 relevant positional information in transmitting; Multilayer film 2 has at least one film limit 21.Because the related operation that utilizes pulse signal to try to achieve the position is known by those who familiarize themselves with the technology, so do not give unnecessary details at this.
See also Fig. 1 to Fig. 3, in order to illustrate further Defect Detection of the present invention function, the running of each member of integration system 1 as a result, and Defect Detection integration system 1 and the interactive relationship of manufacturing equipment (not shown) in manufacture process as a result, below cooperate the Defect Detection of the present invention preferred embodiment of integration method as a result to describe.
For convenience of description, provide following definition earlier: be parallel to first L1 on the film limit 21 of multilayer film 2, and perpendicular to second L2 of this first L1.
First process stage:
In step 301, first commencing signal that the Transmit-Receive Unit 111 of electronic installation 11 receives from the manufacturing equipment (not shown); Wherein, first commencing signal is used to indicate the beginning of first process stage.In this preferred embodiment, first process stage is extension-applying process stage.
What deserves to be mentioned is, in the processing procedure of the following steps of first process stage, the Transmit-Receive Unit 111 of electronic installation 11 receives the pulse signal from the manufacturing equipment (not shown) constantly, carries out related operation and processing for the processing unit 112 of electronic installation 11.
In step 302, the processing unit 112 of electronic installation 11 sees through Transmit-Receive Unit 111 and transmits reference point locations information to indication device 12.In this preferred embodiment, initial (first) reference point locations information of first process stage can be 0 meter (meter).
In step 303, indication device 12 (for example indicates in multilayer film 2 according to reference point locations information, spray printing) is loaded with the setting mark of (carry) reference point locations information, in this preferred embodiment, indication device 12 is in the film limit of the multilayer film 2 21 corresponding setting marks that indicate, processing unit 112 is simultaneously with reference point locations information, and see through at present the pulse signal that Transmit-Receive Unit 111 receives and be recorded to mnemon 113, and with the pulse signal that recorded in this step as the first stroke first reference burst signal; Further, to be shown in the position on film limit 21 of multilayer film 2 relevant for reference point locations information and setting mark; And the setting mark that film limit 21 indicates can not be subjected to the influence of processing procedure effect of each process stage and crested.In this preferred embodiment, whether setting mark reading unit 14 can then read the setting mark that indicates in this step immediately, errorless to check its contained information; Setting mark is the two-dimensional bar (2D barcode) that is loaded with reference point locations information, and setting mark reading unit 14 is two-dimensional bar reader (2D barcode reader).
In step 304, first image (image) of Defect Detection device 13 acquisition multilayer films 2 in first process stage is to produce first image news frame (frame), and wherein, first image is contained the setting mark that has been shown in film limit 21 at least.
In step 305, Defect Detection device 13 carries out Defect Detection according to first image news frame, to obtain the first Defect Detection result corresponding to first image.Because the Defect Detection that Defect Detection device 13 carries out is known by those who familiarize themselves with the technology, so do not give unnecessary details at this.
In step 306, processing unit 112 judges whether have flaw to exist in first image according to the first Defect Detection result; If then proceed to handle to step 307; Otherwise, proceed to handle to step 309.Wherein, when having at least one flaw to exist in first image, the first Defect Detection result is in order to indicate the nidus of flaw in this first image.
In step 307, processing unit 112 is according to nearest first reference burst signal that records in the first Defect Detection result, the mnemon 113, and when detecting this flaw and take place through the received pulse signal of Transmit-Receive Unit 111, to obtain the nidus of flaw in first image with respect to the first flaw relative position information of the setting mark in first image; Further, the first flaw relative position information is corresponding to the contained reference point locations information of the setting mark in first image.Make first L1 and second L2 constitute a two-dimentional rectangular coordinate system, and be a reference point with the setting mark in first image, in this preferred embodiment, the first flaw relative position information is the nidus of flaw in first image with respect to a two-dimentional relative coordinate of reference point.
In step 308, processing unit 112 is recorded to mnemon 113 with the resulting first flaw relative position information of step 307.
For instance, as shown in Figure 4, it has shown first image 4 of containing the setting mark of initial (first) reference point locations information that is loaded with first process stage.For convenience of description, the setting mark that is loaded with initial reference point locations information is represented with A.Suppose in first image 4 of first process stage, to have a flaw to exist, and its nidus is represented with P1.Processing unit 112 is according to nearest first reference burst signal that records in the mnemon 113, and when detecting flaw and take place through the received pulse signal of Transmit-Receive Unit 111, can try to achieve P1 along the range information x1 of first L1 with respect to setting mark A; Because processing unit 112 is according to the first Defect Detection result, also can obtain P1 respectively along first and second L1, L2 with respect to the distance proportion of setting mark A (suppose this distance proportion represent with R), therefore processing unit 112 can be again according to this range information x1 and distance proportion R, in the hope of P1 along the range information y1 of second L2 with respect to setting mark A, that is y1=x1 ÷ R; In other words, the first flaw relative position (two-dimentional relative coordinate) of P1 comprises x1 and y1, its can be expressed as (x1, y1).
See also Fig. 1 to Fig. 3, in step 309, processing unit 112 judges whether Transmit-Receive Unit 111 receives first end signal from the manufacturing equipment (not shown); If, end process then; Otherwise, proceed to handle to step 310.Wherein, first end signal is used to indicate the end of first process stage.
In step 310, processing unit 112 is according to nearest first reference burst signals that record in the mnemon 113, and sees through the received pulse signal of Transmit-Receive Unit 111 at present, to obtain spacing.
In step 311, processing unit 112 is judged the spacing whether this spacing equals to preset; If then proceed to handle to step 312; Otherwise, get back to step 310 and proceed to handle.
In step 312, received pulse signal was recorded to mnemon 113 when processing unit 112 will be worked as the spacing that this spacing equals to preset, and with the pulse signal that recorded in this step as first reference burst signal.
In step 313, processing unit 112 is according to nearest first reference burst signal that records in the mnemon 113, and the first stroke first reference burst signal that records in the mnemon 113, to obtain reference point locations information, and reference point locations information is recorded to mnemon 113, and it is seen through Transmit-Receive Unit 111 sends indication device 12 to.
In step 314, indication device 12 indicates the setting mark that is loaded with reference point locations information according to reference point locations information in the film limit 21 of multilayer film 2; Then, getting back to step 304 proceeds to handle.In this preferred embodiment, whether setting mark reading unit 14 can then read the setting mark that indicates in this step immediately, errorless to check its contained information.
In other words, reference point locations information is the setting mark that indicates in the step 314 in fact, along the range information of first L1 with respect to the setting mark that is loaded with initial reference point locations information.
Brief summary is above-mentioned, after first process stage finishes, the film limit 21 of multilayer film 2 can be by the corresponding setting mark that indicates in the spacing part of whenever being separated by default, suppose that this default spacing is d, and these setting marks are represented with A, B, C and D in regular turn, then these reference point locations information of being loaded with of its grade be respectively 0, d, 2d, and 3d (rice).Suppose that the nidus of detected a plurality of flaws in first process stage is respectively with P1, P2, P3, and P4 represents, then mnemon 113 has recorded these first reference burst signals, these reference point locations information, and the first flaw relative position of P1～P4.Further, these first reference burst signals, these reference point locations information of being recorded by mnemon 113, and these first flaw relative positions, can learn between two adjacent setting marks the corresponding first flaw relative position of detected flaw.
Second process stage:
See also Fig. 1, Fig. 2 and Fig. 5, in step 501, second commencing signal that the Transmit-Receive Unit 111 of electronic installation 11 receives from the manufacturing equipment (not shown); Wherein, this second commencing signal is used to indicate the beginning of second process stage.In this preferred embodiment, second process stage is the PSA coating stage; Further, as shown in Figure 2, multilayer film 2 is in first and second process stage, and its upper and lower coiled strip exchanges.
What deserves to be mentioned is, in the processing procedure of the following steps of second process stage, the Transmit-Receive Unit 111 of electronic installation 11 still receives the pulse signal from the manufacturing equipment (not shown) constantly, carries out related operation and processing for the processing unit 112 of electronic installation 11.
In step 502, setting mark reading unit 14 reads data constantly, and when setting mark reading unit 14 reads one of them setting mark on the film limit 21 that is shown in multilayer film 2, proceeds to handle to step 503.
In step 503, the setting mark reading unit 14 reference point locations information that the setting mark that reads in the step 502 is contained sends electronic installation 11 to, processing unit 112 simultaneously will be at present sees through the pulse signal that Transmit-Receive Unit 111 receive and is recorded to mnemon 113, and with the pulse signal that records in this step as second reference burst signal.
In step 504, second image of Defect Detection device 13 acquisition multilayer films 2 in second process stage is to produce second image news frame, and wherein, second image is contained the setting mark that reads in the step 502.
In step 505, Defect Detection device 13 carries out Defect Detection according to second image news frame, to obtain the second Defect Detection result corresponding to second image.
In step 506, processing unit 112 judges whether have flaw to exist in second image according to the second Defect Detection result; If then proceed to handle to step 507; Otherwise, proceed to handle to step 509.Wherein, when having at least one flaw to exist in second image, the second Defect Detection result is in order to indicate the nidus of flaw in this second image.
In step 507, processing unit 112 is according to nearest second reference burst signal that records in the second Defect Detection result, the mnemon 113, and when detecting flaw and take place through the received pulse signal of Transmit-Receive Unit 111, to obtain the nidus of flaw in this second image, with respect to the second flaw relative position information of the setting mark in second image; Further, the second flaw relative position information is corresponding to the contained reference point locations information of the setting mark in this second image.Similarly, be a reference point with the setting mark in second image, in this preferred embodiment, the second flaw relative position information is the nidus of flaw in second image with respect to a two-dimentional relative coordinate of reference point.
In step 508, processing unit 112 is recorded to mnemon 113 with the resulting second flaw relative position information of step 507.
In step 509, processing unit 112 judges whether Transmit-Receive Unit 111 receives second end signal from the manufacturing equipment (not shown); If then proceed to handle to step 510; Otherwise, get back to step 502 and proceed to handle.Wherein, second end signal is used to indicate the end of second process stage.
In step 510, processing unit 112 is according to (these) reference point locations information that is recorded in mnemon 113, (these) second flaw relative position information, and (these) first flaw relative position information, obtain a flaw location integrate information, and send it to indication device 12.
In step 511, indication device 12 indicates at least one flaw mark accordingly according to the flaw location integrate information on multilayer film 2, and in the intact back of all flaw labeling indicias end process.As shown in Figure 2, in this preferred embodiment, be used as the flaw mark with dashed rectangle.
Continue above example, and please cooperate review Fig. 4, it has also shown second image 6 of containing this setting mark D.Suppose in second image 6 of second process stage, to have a flaw to exist, and its nidus is with P ' expression.In this preferred embodiment, because multilayer film 2 is first, in two process stage, on it, following coiled strip exchanges, therefore, the first flaw relative position information in the nidus P4 of the detected flaw of first process stage must be through after the coordinate conversion, obtain the nidus P4 of flaw with respect to the two-dimentional relative coordinate of setting mark D, obtain a flaw location integrate information according to this for processing unit 112, wherein, the flaw location integrate information comprises the reference point locations information that setting mark D is contained, in the second flaw relative position information of the nidus P ' of the detected flaw of second process stage, and in the nidus P4 of the detected flaw of the first process stage two-dimentional relative coordinate with respect to setting mark D.What deserves to be mentioned is, the purpose of " coordinate conversion " is for the detected flaw relative position of different process stage is converted to respect to same reference point, so that the follow-up usefulness of integrating sign, therefore, whether need carry out " coordinate conversion " looks closely the situation of actual process stage and (for example decides, the situation that has upper and lower coiled strip to exchange namely need be carried out coordinate conversion), be not limited to this example and disclose.
In this preferred embodiment, be that the integration of just carrying out the flaw mark after receiving this second end signal indicates, so, processing unit 112 also can be when setting mark reading unit 14 reads one of them setting mark, obtain the flaw location integrate information according to being recorded in first relevant in the mnemon 113 flaw relative position information, carry out mark in real time for indication device 12, be not limited to this preferred embodiment and disclose.
Again, though in the middle of above description, only with two process stage (that is, first process stage and second process stage) for example describes, right, its step and concept be extensible to be applied to plural process stage; Being not limited to above description discloses.Moreover, though in this preferred embodiment mainly be the process stage of making light polarizing film be that example describes, so, Defect Detection of the present invention is integration system 1 and method as a result, also can arrange in pairs or groups and variously use be used to carrying out the manufacturing equipment (not shown) that a plurality of process stage and process stage lack contraposition information each other, be not limited to this preferred embodiment and disclose.
In sum, setting mark by the film limit 21 that is shown in multilayer film 2, make that detected flaw location (for example in a plurality of different process stage, first and second flaw relative position information) foundation of contraposition is arranged, can be for the Defect Detection result who automatically integrates these process stage, and obtain the flaw location integrate information, so can reach purpose of the present invention really.
The above person, it only is preferred embodiment of the present invention, when not limiting scope of the invention process with this, namely the simple equivalent of doing according to claim of the present invention and invention description content generally changes and modifies, and all still belongs in the scope that patent of the present invention contains.
Claims (10)
1. Defect Detection integration method as a result, it is characterized in that this method utilization comprises processing unit, Defect Detection device, setting mark reading unit, and the system of mnemon carries out, be applicable to the Defect Detection result who integrates each process stage correspondence that multilayer film carries out in manufacturing equipment, in each process stage, this manufacturing equipment produces the pulse signal relevant with the position of this multilayer film constantly, and this method comprises the following step:
(A) in first process stage, utilize this Defect Detection device to capture first image of this multilayer film in this first process stage to produce first image news frame, wherein, this first image is contained the setting mark that is shown in this multilayer film, this setting mark is loaded with a reference point locations information, and this reference point locations information is relevant with the position that this setting mark is shown in this multilayer film;
(B) utilize this Defect Detection device to carry out Defect Detection according to this first image news frame, to obtain the first Defect Detection result corresponding to this first image, wherein, when having at least one flaw to exist in this first image, this first Defect Detection result is in order to indicate the nidus of this flaw in this first image;
(C) when having flaw to exist in this first image, utilize this processing unit according to this first Defect Detection result, reach the pulse signal from this manufacturing equipment, to obtain the nidus of this flaw in this first image with respect to the first flaw relative position information of this setting mark in this first image, wherein, this first flaw relative position information is corresponding to this contained reference point locations information of this setting mark in this first image;
(D) utilize this processing unit that this first flaw relative position information is recorded in this mnemon;
(E) in second process stage, when this setting mark reading unit reads the setting mark that is shown in this multilayer film, transmit this contained reference point locations information of this setting mark that reads in this step;
(F) utilize this Defect Detection device to capture second image of this multilayer film in this second process stage to produce second image news frame, this second image is contained this setting mark that reads in the step (E);
(G) utilize this Defect Detection device to carry out Defect Detection according to this second image news frame, to obtain the second Defect Detection result corresponding to this second image, wherein, when having at least one flaw to exist in this second image, this second Defect Detection result is in order to indicate the nidus of this flaw in second image;
(H) when having flaw to exist in this second image, utilize this processing unit according to this second Defect Detection result, reach the pulse signal from this manufacturing equipment, to obtain the nidus of this flaw in this second image with respect to the second flaw relative position information of this setting mark in this second image, wherein, this second flaw relative position information is corresponding to this contained reference point locations information of this setting mark in this second image; And
(I) utilize this processing unit according to this reference point locations information, this first flaw relative position information, and this second flaw relative position information, a flaw location integrate information obtained.
2. Defect Detection as claimed in claim 1 integration method as a result is characterized in that this system also comprises indication device, and this method also comprises step (A) the following step before:
(J) utilize this indication device to indicate this setting mark according to this reference point locations information in this multilayer film.
3. Defect Detection as claimed in claim 2 integration method as a result, it is characterized in that this multilayer film has at least one film limit, wherein, in this step (J), utilize this indication device to indicate this setting mark according to this reference point locations information in this film limit of this multilayer film.
4. Defect Detection as claimed in claim 3 integration method as a result is characterized in that defining first of this film limit of being parallel to this multilayer film, and perpendicular to this first second, wherein, step (C) comprises following substep:
(c-1) according to the pulse signal from this manufacturing equipment, obtain the nidus of this flaw in this first image along this first range information x1 with respect to this setting mark in this first image;
(c-2) according to this first Defect Detection result, obtain the nidus of this flaw in this first image respectively along this first and second with respect to the distance proportion of this setting mark in this first image; And
(c-3) according to this range information x1 and this distance proportion, along this second range information y1 with respect to this setting mark in this first image, wherein, this first flaw relative position comprises x1 and y1 in the hope of the nidus of this flaw in this first image.
5. Defect Detection as claimed in claim 1 integration method as a result is characterized in that this system also comprises indication device, and this method also comprises step (I) the following step afterwards:
(K) utilize this indication device on this multilayer film, to indicate at least one flaw mark accordingly according to this flaw location integrate information.
6. Defect Detection integration system as a result, be applicable to the Defect Detection result who integrates each process stage correspondence that multilayer film carries out in manufacturing equipment, in each process stage, this manufacturing equipment produces the pulse signal relevant with the position of this multilayer film constantly, and this system comprises:
The Defect Detection device, in order to capture this multilayer film respectively at first image and second image that reach in first process stage in second process stage, to produce first image news frame and second image news frame respectively, wherein, this first image and this second image are contained the setting mark that has been shown in this multilayer film respectively, wherein, each setting mark is loaded with a reference point locations information, each reference point locations information is relevant with the position that this setting mark is shown in this multilayer film, this Defect Detection device is also in order to carry out Defect Detection according to this first image news frame and this second image news frame respectively, to obtain respectively corresponding to the first Defect Detection result of this first image and corresponding to the second Defect Detection result of this second image, wherein, when having at least one flaw to exist in this first image, this first Defect Detection result is in order to indicate the nidus of this flaw in this first image, when having at least one flaw to exist in this second image, this second Defect Detection result is in order to indicate the nidus of this flaw in this second image;
The setting mark reading unit when reading the setting mark that is shown in this multilayer film when it, transmits this contained reference point locations information of this setting mark; And
Electronic installation can carry out communication with this manufacturing equipment, this Defect Detection device and this setting mark reading unit, and this electronic installation comprises processing unit and mnemon;
Wherein, when having flaw to exist in this first image, this processing unit is in order to according to this first Defect Detection result, reach the pulse signal from this manufacturing equipment, to obtain the nidus of this flaw in this first image with respect to the first flaw relative position information of this setting mark in this first image, and in order to this first flaw relative position information is recorded in this mnemon, wherein, this first flaw relative position information is corresponding to this contained reference point locations information of this setting mark in this first image;
Wherein, when having flaw to exist in this second image, this processing unit is also in order to according to this second Defect Detection result, reach the pulse signal from this manufacturing equipment, to obtain the nidus of this flaw in this second image with respect to the second flaw relative position information of this setting mark in this second image, and in order to this second flaw relative position information is recorded in this mnemon, wherein, this second flaw relative position information is corresponding to this contained reference point locations information of this setting mark in this second image;
Wherein, this processing unit is also according to this reference point locations information, this first flaw relative position information, and this second flaw relative position information, obtains a flaw location integrate information.
7. Defect Detection as claimed in claim 6 integration system as a result is characterized in that also comprising the indication device that can carry out communication with this electronic installation, in order to indicate this setting mark according to this reference point locations information in this multilayer film.
8. Defect Detection as claimed in claim 7 integration system as a result is characterized in that this multilayer film has at least one film limit, and wherein, this indication device indicates this setting mark according to this reference point locations information in this film limit of this multilayer film.
9. Defect Detection as claimed in claim 8 integration system as a result, it is characterized in that defining first of this film limit of being parallel to this multilayer film, and perpendicular to this first second, wherein, when having flaw to exist in this first image, this processing unit carries out following processing, to obtain this first flaw relative position:
According to the pulse signal from this manufacturing equipment, obtain the nidus of this flaw in this first image along this first range information x1 with respect to this setting mark in this first image;
According to this first Defect Detection result, obtain the nidus of this flaw in this first image respectively along this first and second with respect to the distance proportion of this setting mark in this first image; And
According to this range information x1 and this distance proportion, along this second range information y1 with respect to this setting mark in this first image, wherein, this first flaw relative position comprises x1 and y1 in the hope of the nidus of this flaw in this first image.
10. Defect Detection as claimed in claim 6 integration system as a result, it is characterized in that also comprising the indication device that can carry out communication with this electronic installation, this indication device is in order to indicate at least one flaw mark accordingly according to this flaw location integrate information on this multilayer film.
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| CN103698334B (en) * | 2013-10-25 | 2016-01-27 | 明基材料有限公司 | The pin hole Defect Detection system of barrier film and detection method thereof |
| CN103630554B (en) * | 2013-11-06 | 2017-02-08 | 江苏大学 | Detection device and method for defects on double faces of lens |
| CN105842337A (en) * | 2015-01-13 | 2016-08-10 | 台湾动力检测科技股份有限公司 | Method for detecting defect points in adhesive layer of fiber cloth |
| CN109215022A (en) * | 2018-09-05 | 2019-01-15 | 深圳灵图慧视科技有限公司 | Cloth inspection method, device, terminal device, server, storage medium and system |
| CN114393895B (en) * | 2022-01-21 | 2024-05-17 | 山东晶创新材料科技有限公司 | Preparation method of composite waterproof coiled material TPO based on polypropylene filament non-woven fabric |
| CN115870233A (en) * | 2022-09-30 | 2023-03-31 | 杭州利珀科技有限公司 | Linkage method and system for pre-RTP process and RTP process of polarizing film |
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