TWI443058B - Workpiece processor - Google Patents
Workpiece processor Download PDFInfo
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- TWI443058B TWI443058B TW100137848A TW100137848A TWI443058B TW I443058 B TWI443058 B TW I443058B TW 100137848 A TW100137848 A TW 100137848A TW 100137848 A TW100137848 A TW 100137848A TW I443058 B TWI443058 B TW I443058B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
Description
本發明係關於一種自卡匣將太陽能電池用晶圓等片狀之工件，一次供給一片至搬送裝置之搬入位置之工件供給裝置、及具備有此工件供給裝置之工件處理裝置。The present invention relates to a workpiece supply device that supplies a sheet-like workpiece such as a wafer for a solar cell to a loading position of a conveying device at a time, and a workpiece processing device including the workpiece supply device.
在製造太陽能電池用晶圓時之複數個步驟中，包含有片狀工件之檢查步驟。在工件之檢查步驟中，例如利用攝影裝置對工件之既定位置進行攝影。工件係利用搬送裝置搬送至設有攝影裝置之檢查位置。作為搬送工件之搬送裝置存在有使用循環皮帶者(例如，參照專利文獻1)。In a plurality of steps in manufacturing a wafer for a solar cell, an inspection step of a sheet-like workpiece is included. In the inspection step of the workpiece, for example, a predetermined position of the workpiece is photographed by the photographing device. The workpiece is transported to the inspection position where the photographing device is provided by the transport device. There is a person who uses an endless belt as a conveyance device for conveying a workpiece (for example, refer to Patent Document 1).
為了提高檢查步驟之產距時間(takt time)，就必須以既定之時序逐片地將工件平穩地供給至搬送裝置。In order to increase the takt time of the inspection step, it is necessary to smoothly supply the workpiece to the conveying device piece by piece at a predetermined timing.
因此，作為將工件供給至搬送裝置之工件供給裝置，存在有使用卡匣者，該卡匣係配置為將逐片地收容工件之複數個收容部沿上下方向堆疊為多段。使卡匣在水平面內朝與搬送裝置之搬送方向正交之方向往返移動，並在搬送裝置之搬入位置將卡匣內之工件載置於循環皮帶上，使卡匣在下降或上升1段後使卡匣往返移動。Therefore, as the workpiece supply device that supplies the workpiece to the conveying device, there is a use card that is arranged such that a plurality of housing portions that accommodate the workpiece piece by piece are stacked in a plurality of stages in the vertical direction. The cassette is reciprocated in a horizontal plane in a direction orthogonal to the conveying direction of the conveying device, and the workpiece in the cassette is placed on the circulation belt at the loading position of the conveying device, so that the cassette is lowered or raised by one step. Move the cassette back and forth.
[專利文獻1]日本專利特開2000-012652號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-012652
雖然在卡匣之各收容部必須1個收容部收容1片工件，但是如太陽能電池用晶圓般厚度較薄之工件，誤將2片以上之工件收容在單一收容部之可能性很高。在習知之工件供給裝置中，對於卡匣之各收容部進行1次之供給動作，當單一收容部收容有複數片工件之情況時，複數片工件將會一次地都供給至搬送裝置，使檢查步驟無法適當地進行。此一問題不只在檢查步驟時，在對搬送裝置所搬送之工件進行檢查步驟以外之步驟而搬送工件時亦會同樣地發生。Although it is necessary to accommodate one workpiece in one accommodating portion in each of the accommodating portions of the cassette, it is highly probable that two or more workpieces are erroneously accommodated in a single accommodating portion as a workpiece having a thin thickness as a wafer for a solar cell. In the conventional workpiece supply device, the supply operation is performed once for each of the accommodating portions of the cassette, and when a plurality of workpieces are accommodated in the single accommodating portion, the plurality of workpieces are once supplied to the transfer device for inspection. The steps cannot be done properly. This problem also occurs not only in the inspection step but also when the workpiece is conveyed in a step other than the inspection step of the workpiece conveyed by the conveyance device.
本發明之目的在於提供一種工件供給裝置及工件處理裝置，該工件供給裝置及工件處理裝置即使在卡匣內之單一收容部收容有複數片工件之情況時，亦可將工件一次供給一片至搬送裝置，可對搬送中之工件進行適當地處理。An object of the present invention is to provide a workpiece supply device and a workpiece processing device that can supply a workpiece one at a time to a conveyance even when a plurality of workpieces are accommodated in a single housing portion in the cassette The device can properly handle the workpiece being transported.
本發明之工件供給裝置，具備有卡匣、升降機構、第1搬出構件、及第2搬出構件，且將工件供給至在沿著主搬送方向搬送片狀之工件之搬送裝置中的工件之搬入位置。卡匣係配置為將收容片狀工件之複數個收容部，沿上下方向堆疊為多段。升降機構係以使上下方向之複數個收容部各自之位置與搬送面之位置順序一致之方式使卡匣下降或上升。第1搬出機構係將收容在複數個收容部中之上下方向之位置與搬送面之位置一致之收容部的工件，自底面側沿著第1方向搬出。第2搬出機構係將由第1搬出構件所搬出之工件自上表面側沿著與第1方向不同之第2方向搬出至搬入位置。The workpiece supply device of the present invention includes a cassette, a lifting mechanism, a first carrying member, and a second carrying member, and supplies the workpiece to the workpiece in the conveying device that transports the sheet-like workpiece along the main conveying direction. position. The cassette is configured to stack a plurality of housing portions for accommodating the sheet-like workpiece in a plurality of stages in the vertical direction. The elevating mechanism lowers or raises the cassette so that the position of each of the plurality of housing portions in the vertical direction coincides with the position of the transport surface. The first unloading mechanism carries out the workpiece in the accommodating portion that is positioned in the upper and lower positions of the plurality of accommodating portions and the position of the transport surface, and is carried out from the bottom surface side in the first direction. In the second unloading mechanism, the workpiece carried out by the first carry-out member is carried out to the carry-in position from the upper surface side in the second direction different from the first direction.
根據本發明，即使在卡匣內之單一收容部收容有複數片工件之情況時，亦可將工件一次供給一片至搬送裝置之搬入位置，可對搬送中之工件進行適當地處理。According to the present invention, even when a plurality of workpieces are accommodated in a single housing portion in the cassette, the workpiece can be supplied one at a time to the loading position of the conveying device, and the workpiece being conveyed can be appropriately processed.
以下參照圖式說明本發明之實施形態之工件供給裝置及工件處理裝置。如圖1所示，本發明之實施形態之工件供給裝置10構成工件處理裝置100之一部分。工件處理裝置100具備有：搬送裝置110，其搬送作為片狀之工件之例如太陽能電池用晶圓；及處理部120，其係根據例如攝影裝置121所攝影之影像資料，對搬送裝置110所搬送之工件進行檢查處理。搬送裝置110係由作為一例之張掛在複數個滾輪之循環皮帶所構成。Hereinafter, a workpiece supply device and a workpiece processing device according to embodiments of the present invention will be described with reference to the drawings. As shown in Fig. 1, a workpiece supply device 10 according to an embodiment of the present invention constitutes a part of a workpiece processing apparatus 100. The workpiece processing apparatus 100 includes a transport apparatus 110 that transports, for example, a wafer for solar cells as a sheet-like workpiece, and a processing unit 120 that transports the transport apparatus 110 based on image data captured by the photographing apparatus 121, for example. The workpiece is inspected. The conveying device 110 is constituted by, for example, an endless belt that is hung on a plurality of rollers.
再者，搬送裝置110亦可由複數個滾輪或鏈帶等所構成。另外，處理部120所進行之處理，並不限定於使用攝影裝置121之檢查處理。Furthermore, the conveying device 110 may be composed of a plurality of rollers or chain belts. The processing performed by the processing unit 120 is not limited to the inspection processing using the imaging device 121.
如圖1及圖2所示，工件供給裝置10係配置為接近搬送裝置110之搬入部111，並將工件一次供給一片至搬入部111。因此，工件供給裝置10具備有卡匣1、升降機構2、第1搬出機構3、第2搬出機構4及回收托盤5。As shown in FIGS. 1 and 2, the workpiece supply device 10 is disposed close to the loading unit 111 of the conveying device 110, and supplies the workpiece one at a time to the loading unit 111. Therefore, the workpiece supply device 10 includes the cassette 1, the elevating mechanism 2, the first unloading mechanism 3, the second unloading mechanism 4, and the recovery tray 5.
卡匣1具備有在上下方向堆疊為多段之複數個收容部11。在複數個收容部11，係以1個收容部分別收容一片片狀之工件為原則。升降裝置2，係以上下方向之複數個收容部11各自之位置與搬送裝置110之搬入部111之搬送面的位置順序一致之方式使卡匣1升降。The cassette 1 is provided with a plurality of housing portions 11 stacked in a plurality of stages in the vertical direction. In the plurality of accommodating portions 11, the one accommodating portion accommodates a plurality of sheet-shaped workpieces. In the lifting device 2, the cassette 1 is moved up and down so that the position of each of the plurality of housing portions 11 in the upper and lower directions coincides with the position of the conveying surface of the loading unit 111 of the conveying device 110.
第1搬出機構3，作為一例係由張掛在複數個滾輪之循環皮帶31所構成。第1搬出機構3將收容於複數個收容部11中之上下方向之位置與搬送面之位置一致之收容部11的工件，自底面側沿著第1方向X朝向回收托盤5搬出。即，第1搬出機構3將工件載置於循環皮帶31之上表面並加以搬出。第1方向X係平行於搬送裝置110之搬送方向。The first carry-out mechanism 3 is constituted by an endless belt 31 that is hung on a plurality of rollers as an example. The first unloading mechanism 3 carries out the workpiece of the accommodating portion 11 that is placed in the upper and lower positions of the plurality of accommodating portions 11 in the vertical direction from the bottom surface side toward the recovery tray 5 in the first direction X. In other words, the first unloading mechanism 3 mounts the workpiece on the upper surface of the endless belt 31 and carries it out. The first direction X is parallel to the transport direction of the transport device 110.
第2搬出機構4，作為一例係具備有真空卡盤41及滑動機構42。第2搬出機構4將第1搬出機構3所搬出之工件，在第1搬出機構3與回收托盤5之間，自上表面側沿著與第1方向X正交之第2方向Y搬出至搬入部111。因此，滑動機構42，使真空卡盤41沿著第2方向Y在第2搬出機構4之上方與搬送裝置110之搬入部111之間往返移動。The second carry-out mechanism 4 is provided with a vacuum chuck 41 and a slide mechanism 42 as an example. The second unloading mechanism 4 carries out the workpiece carried out by the first unloading mechanism 3 to the loading direction between the first unloading mechanism 3 and the collection tray 5 in the second direction Y orthogonal to the first direction X from the upper surface side. Part 111. Therefore, the slide mechanism 42 reciprocates the vacuum chuck 41 between the upper side of the second carry-out mechanism 4 and the carry-in part 111 of the conveyance device 110 along the second direction Y.
若利用升降機構2使配置於卡匣1內之複數個收容部11中任一個之上下方向的位置與搬送面的位置一致時，收容於該收容部11之工件就會利用第1搬出機構3自底面側沿著第1方向X搬出。沿第1方向X所搬出之工件係利用第2搬出機構4，自上表面側沿著第2方向Y搬出至搬送裝置110之搬入部111。When the position of the upper and lower sides of the plurality of accommodating portions 11 disposed in the cassette 1 is aligned with the position of the transport surface by the elevating mechanism 2, the workpiece accommodated in the accommodating portion 11 uses the first unloading mechanism 3 The bottom surface side is carried out along the first direction X. The workpiece that has been carried out in the first direction X is carried out from the upper surface side in the second direction Y to the loading unit 111 of the conveying device 110 by the second unloading mechanism 4 .
當在單一收容部11誤收容有複數片工件之情況時，在複數片工件全部沿著第1方向X搬出之後，第2搬出機構4之真空卡盤41只吸附位於最上部之1片工件，其他工件係利用本身之重量而停在第1搬出機構3上。因此，只有位於最上部之1片工件會沿著第2方向Y搬出至搬送裝置110之搬入部111。即使在單一收容部11誤收容有複數片工件之情況時，因為對搬入部111只供給1片工件，所以在工件處理裝置100可對工件正確地進行處理。When a plurality of workpieces are erroneously accommodated in the single accommodating portion 11, after all of the plurality of workpieces are carried out along the first direction X, the vacuum chuck 41 of the second unloading mechanism 4 adsorbs only one workpiece at the uppermost portion. The other workpieces are stopped by the first carry-out mechanism 3 by their own weight. Therefore, only one piece of the workpiece located at the uppermost portion is carried out to the carry-in portion 111 of the conveying device 110 along the second direction Y. Even when a plurality of workpieces are erroneously accommodated in the single accommodating portion 11, since only one workpiece is supplied to the loading portion 111, the workpiece processing apparatus 100 can accurately process the workpiece.
位於最上部之1片工件以外之工件，係利用第1搬出機構3搬送至回收托盤5。回收托盤5係本發明之回收部，收容未處理之工件。在收容於單一收容部11內之複數片工件中，當位於最上部之工件以外之工件為不要之情況時，可省略回收托盤5。The workpiece other than the one piece of the workpiece at the top is conveyed to the collection tray 5 by the first carry-out mechanism 3. The recovery tray 5 is a collection unit of the present invention, and accommodates an unprocessed workpiece. In the case of a plurality of workpieces accommodated in the single housing portion 11, when the workpiece other than the workpiece at the uppermost portion is unnecessary, the recovery tray 5 can be omitted.
再者，在圖1所示之實例中，卡匣1、升降機構2、第1搬出機構3及回收托盤5雖然分別配置於包夾搬入部111之兩側，但此等亦可配置於搬入部111之至少一方。然而，藉由將此等分別配置於包夾搬入部111之兩側，可在供給收容於一方之卡匣1之全部工件後，繼續自另一方之卡匣1供給工件，而可在此期間將一方之卡匣1與新的卡匣1交換。Furthermore, in the example shown in FIG. 1, the cassette 1, the elevating mechanism 2, the first unloading mechanism 3, and the recovery tray 5 are disposed on both sides of the esport loading unit 111, but these may be arranged to be carried in. At least one of the parts 111. However, by arranging these on the both sides of the ferrule loading unit 111, it is possible to continue to supply the workpiece from the other cassette 1 after supplying all the workpieces accommodated in one of the cassettes 1, and during this period, Exchange one card 匣1 with the new card 匣1.
另外，藉由使第1方向X平行於搬送裝置100之搬送方向，且使第2方向Y正交於第1方向X，雖然可使工件供給裝置10之設置空間成為最小，但並不限定於此一方式。In addition, by making the first direction X parallel to the conveyance direction of the conveyance device 100 and the second direction Y being orthogonal to the first direction X, the installation space of the workpiece supply device 10 can be minimized, but the invention is not limited thereto. This way.
上述實施形態之說明，全部之情形均為例示，不應考量為限制用者。本發明之範圍不以上述實施形態，而是以申請專利範圍表示。而且，本發明之範圍，意指與申請專利範圍均等之意思及包含範圍內之所有變更。In the description of the above embodiments, all the cases are examples, and should not be considered as limiting users. The scope of the present invention is not indicated by the above embodiments, but by the scope of the patent application. Further, the scope of the present invention is intended to mean that all modifications are within the meaning and scope of the invention.
1．．．卡匣1. . . Card
2．．．升降機構2. . . Lifting mechanism
3．．．第1搬出機構3. . . First removal mechanism
4．．．第2搬出機構4. . . Second removal mechanism
5．．．回收托盤5. . . Recycling tray
10．．．工件供給裝置10. . . Workpiece supply device
11．．．收容部11. . . Containment department
31．．．循環皮帶31. . . Circulating belt
41．．．真空卡盤41. . . Vacuum chuck
42．．．滑動機構42. . . Sliding mechanism
100．．．工件處理裝置100. . . Workpiece processing device
110．．．搬送裝置110. . . Transport device
111．．．搬入部111. . . Moving in
120．．．處理部120. . . Processing department
121．．．攝影裝置121. . . Photography device
X．．．第1方向X. . . First direction
Y．．．第2方向Y. . . Second direction
圖1係本發明實施形態之具備有工件供給裝置之工件處理裝置的俯視圖。Fig. 1 is a plan view showing a workpiece processing apparatus including a workpiece supply device according to an embodiment of the present invention.
圖2係同一工件供給裝置之側視圖。Figure 2 is a side view of the same workpiece supply device.
2．．．升降機構2. . . Lifting mechanism
3．．．第1搬出機構3. . . First removal mechanism
4．．．第2搬出機構4. . . Second removal mechanism
5．．．回收托盤5. . . Recycling tray
10．．．工件供給裝置10. . . Workpiece supply device
41．．．真空卡盤41. . . Vacuum chuck
42．．．滑動機構42. . . Sliding mechanism
100．．．工件處理裝置100. . . Workpiece processing device
110．．．搬送裝置110. . . Transport device
111．．．搬入部111. . . Moving in
120．．．處理部120. . . Processing department
121．．．攝影裝置121. . . Photography device
X．．．第1方向X. . . First direction
Y．．．第2方向Y. . . Second direction
Claims (4)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010241748 | 2010-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201242867A TW201242867A (en) | 2012-11-01 |
| TWI443058B true TWI443058B (en) | 2014-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100137848A TWI443058B (en) | 2010-10-28 | 2011-10-19 | Workpiece processor |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5606546B2 (en) |
| TW (1) | TWI443058B (en) |
| WO (1) | WO2012056893A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6011311B2 (en) * | 2012-12-18 | 2016-10-19 | 日本電気硝子株式会社 | Work conveying apparatus and work conveying method |
| CN109625744A (en) * | 2019-01-29 | 2019-04-16 | 佛山市新泓达机械有限公司 | A kind of glass warehousing system and control method |
| CN211034290U (en) * | 2019-10-14 | 2020-07-17 | 苏州赛腾精密电子股份有限公司 | Conveying device and detection system |
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|---|---|---|---|---|
| JPH0834234B2 (en) * | 1986-07-25 | 1996-03-29 | 株式会社ニコン | Wafer transfer device |
| JPH01321257A (en) * | 1988-06-21 | 1989-12-27 | Nitto Denko Corp | Method of sticking thin plate to adhesive tape |
| JP2752965B2 (en) * | 1997-02-07 | 1998-05-18 | 株式会社日立製作所 | Vacuum processing equipment |
| JP2000012652A (en) * | 1998-06-24 | 2000-01-14 | Sony Corp | Semiconductor wafer carrying device |
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2011
- 2011-10-13 WO PCT/JP2011/073512 patent/WO2012056893A1/en active Application Filing
- 2011-10-13 JP JP2012540766A patent/JP5606546B2/en not_active Expired - Fee Related
- 2011-10-19 TW TW100137848A patent/TWI443058B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2012056893A1 (en) | 2014-03-20 |
| WO2012056893A1 (en) | 2012-05-03 |
| TW201242867A (en) | 2012-11-01 |
| JP5606546B2 (en) | 2014-10-15 |
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