TWI440232B - Light source module - Google Patents
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- TWI440232B TWI440232B TW100102384A TW100102384A TWI440232B TW I440232 B TWI440232 B TW I440232B TW 100102384 A TW100102384 A TW 100102384A TW 100102384 A TW100102384 A TW 100102384A TW I440232 B TWI440232 B TW I440232B
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Description
本發明是有關於一種光源模組，且特別是有關於一種減少散熱片與金屬背板之間熱阻(thermal resistance)的光源模組。The invention relates to a light source module, and in particular to a light source module for reducing thermal resistance between a heat sink and a metal back plate.
一般而言，發光元件係以導熱膠貼附於散熱片的吸熱面。為了減少導熱膠的熱阻，係以高導熱係數的銀膠為主，因此很快地將熱由發光元件傳導至散熱片，而比較不會囤積在導熱膠上。另外，散熱片通常以螺絲鎖固或是以低導熱係數的導熱膠接合而固定於光源模組的背板上，但使用導熱膠接合的方式將會造成發光元件所產生的熱仍囤積在此導熱膠上而無法將熱傳導至光源模組的背板及外界，影響發光元件的使用壽命及發光元件的發光效率。In general, the light-emitting element is attached to the heat absorbing surface of the heat sink with a heat-conductive adhesive. In order to reduce the thermal resistance of the thermal conductive adhesive, silver-based glue with high thermal conductivity is mainly used, so that heat is quickly transmitted from the light-emitting element to the heat sink, and is not accumulated on the thermal conductive adhesive. In addition, the heat sink is usually fixed by screw or fixed by a low thermal conductivity thermal conductive adhesive on the back plate of the light source module, but the heat bonding adhesive will cause the heat generated by the light emitting component to accumulate here. The thermal conductive adhesive does not transfer heat to the back plate of the light source module and the outside, affecting the service life of the light-emitting element and the luminous efficiency of the light-emitting element.
為了改善散熱的問題，常見的做法是在導熱膠內添加導熱性較佳的材質，然而此種方式對於整體散熱改善有限，且長時間熱反應後會造成導熱膠的黏性降低，而容易發生散熱片與背板分離。In order to improve the heat dissipation problem, it is common practice to add a material with better thermal conductivity to the thermal conductive adhesive. However, this method has limited improvement on the overall heat dissipation, and the thermal resistance of the thermal conductive adhesive is reduced after a long period of thermal reaction, which is prone to occur. The heat sink is separated from the back plate.
本發明係有關於一種光源模組，藉由嵌合的方式固定散熱片與背板，不易發生分離，且散熱片與背板直接接觸，以減少散熱片與背板之間因導熱膠的熱阻過高而影響散熱。The invention relates to a light source module, wherein the heat sink and the back plate are fixed by a fitting manner, and the separation is not easy, and the heat sink and the back plate are in direct contact, so as to reduce the heat of the heat conductive adhesive between the heat sink and the back plate. The resistance is too high and affects heat dissipation.
根據本發明之一方面，提出一種光源模組，其包括一發光元件、一散熱片以及一金屬背板。散熱片配置於發光元件的底部，散熱片具有一第一嵌合部。金屬背板具有一第二嵌合部，第二嵌合部與第一嵌合部相互卡合，以使散熱片固定在金屬背板上。According to an aspect of the invention, a light source module is provided, comprising a light emitting element, a heat sink and a metal back plate. The heat sink is disposed at the bottom of the light emitting element, and the heat sink has a first fitting portion. The metal back plate has a second fitting portion, and the second fitting portion and the first fitting portion are engaged with each other to fix the heat sink on the metal back plate.
為了對本發明之上述及其他方面有更佳的瞭解，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下：In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:
本實施例之光源模組，係將散熱片以嵌合方式固定於背板上，以使熱能快速地由發光元件傳輸至散熱片以及背板，避免熱囤積在散熱片與背板之間而影響發光元件的使用壽命及發光元件的發光效率。在組裝上，散熱片與背板可藉由凹凸配合的嵌合結構組裝為一體，組裝方便，因此所需的工時相對少於以螺絲鎖固或是以導熱膠貼附所需的工時。In the light source module of the embodiment, the heat sink is fixed to the back plate in a fitting manner, so that the heat energy is quickly transmitted from the light emitting element to the heat sink and the back plate to prevent heat from being accumulated between the heat sink and the back plate. It affects the service life of the light-emitting element and the luminous efficiency of the light-emitting element. In assembly, the heat sink and the back plate can be assembled by a fitting structure with a concave-convex fit, and the assembly is convenient, so the required working time is relatively less than the man-hour required for screwing or fixing with a thermal conductive adhesive. .
請參照第1A圖，其繪示依照一實施例之嵌合結構的剖面圖。嵌合結構101包括一第一嵌合部121以及一第二嵌合部131。第一嵌合部121於垂直剖面上具有一第一卡勾部121a，第二嵌合部131於垂直剖面上具有一第二卡勾部131a，第一卡勾部121a與第二卡勾部131a在垂直方向上相互干涉。在一實施例中，第一嵌合部121例如為一凹槽，凹槽凹陷於散熱片120的背面124，第一卡勾部121a位於凹槽的開口處。此外，第二嵌合部131例如為一凸塊，凸塊與凹槽的形狀互補且突出於金屬背板130的內表面134。第二卡勾部131a位於凸塊的頂部，因此當第一嵌合部121與第二嵌合部131相互卡合時，第一卡勾部121a與第二卡勾部131a在垂直方向上相互干涉。Please refer to FIG. 1A, which illustrates a cross-sectional view of a fitting structure in accordance with an embodiment. The fitting structure 101 includes a first fitting portion 121 and a second fitting portion 131. The first engaging portion 121 has a first hook portion 121a on a vertical cross section, and the second engaging portion 131 has a second hook portion 131a on the vertical cross section, and the first hook portion 121a and the second hook portion The 131a interfere with each other in the vertical direction. In one embodiment, the first fitting portion 121 is, for example, a groove recessed in the back surface 124 of the heat sink 120, and the first hook portion 121a is located at the opening of the groove. In addition, the second fitting portion 131 is, for example, a bump that is complementary in shape to the groove and protrudes from the inner surface 134 of the metal back plate 130. The second hook portion 131a is located at the top of the bump. Therefore, when the first engaging portion 121 and the second engaging portion 131 are engaged with each other, the first hook portion 121a and the second hook portion 131a are mutually perpendicular in the vertical direction. put one's oar in.
從垂直剖面來看，第一嵌合部121的形狀可為向內凹的卡合結構，例如以球形凹面為卡合面之結構，或是以雙L形凹面為卡合面之結構。同樣，第二嵌合部131的形狀可為向外凸的卡合結構，例如是以球形塊為卡合塊之結構，或是以雙L形臂為卡合臂之結構，均可與第一嵌合部121達到形狀互補且相互卡合之功效。The shape of the first fitting portion 121 may be an inwardly concave engaging structure, for example, a structure in which a spherical concave surface is an engaging surface, or a double L-shaped concave surface as an engaging surface. Similarly, the shape of the second fitting portion 131 may be an outwardly convex engaging structure, for example, a structure in which a spherical block is a snap block, or a structure in which a double L-shaped arm is a snap arm. A fitting portion 121 achieves the effects of complementary shapes and mutual engagement.
請參照第1B圖，其繪示依照另一實施例之嵌合結構的剖面圖。在本實施例中，第一嵌合部122不為凹槽，而是以一凸塊取代，此凸塊突出於散熱片120的背面124，而第一卡勾部122a位於凸塊的頂部。同樣地，第二嵌合部132不為凸塊，而是以一凹槽取代，此凹槽與凸塊的形狀互補且凹陷於金屬背板130的內表面134。第二卡勾部132a位於凹槽的開口處，以使第二卡勾部131a與第一卡勾部121a於垂直方向上相互卡合。Please refer to FIG. 1B, which illustrates a cross-sectional view of a fitting structure in accordance with another embodiment. In this embodiment, the first fitting portion 122 is not a groove, but is replaced by a bump protruding from the back surface 124 of the heat sink 120, and the first hook portion 122a is located at the top of the bump. Similarly, the second fitting portion 132 is not a bump but is replaced by a groove that is complementary to the shape of the bump and recessed on the inner surface 134 of the metal back plate 130. The second hook portion 132a is located at the opening of the recess such that the second hook portion 131a and the first hook portion 121a are engaged with each other in the vertical direction.
請參考第2圖，其繪示依照一實施例之光源模組的剖面圖。光源模組100包括一發光元件110、一散熱片120以及一金屬背板130。散熱片120配置於發光元件110的底部，散熱片120具有一第一嵌合部121。金屬背板130具有一第二嵌合部131，第二嵌合部131與第一嵌合部121相互卡合，以使散熱片120固定在金屬背板130上。Please refer to FIG. 2 , which illustrates a cross-sectional view of a light source module according to an embodiment. The light source module 100 includes a light emitting element 110, a heat sink 120, and a metal back plate 130. The heat sink 120 is disposed at the bottom of the light emitting element 110, and the heat sink 120 has a first fitting portion 121. The metal back plate 130 has a second fitting portion 131. The second fitting portion 131 and the first fitting portion 121 are engaged with each other to fix the heat sink 120 to the metal back plate 130.
在第2圖中，光源模組100更可包括一電路板112。電路板112具有一導熱區112a以及一電性連接區112b，導熱區112a與發光元件110的底部接觸，電性連接區112b與發光元件110的電極111電性連接。In FIG. 2, the light source module 100 further includes a circuit board 112. The circuit board 112 has a heat conducting area 112a and an electrical connection area 112b. The heat conducting area 112a is in contact with the bottom of the light emitting element 110, and the electrical connection area 112b is electrically connected to the electrode 111 of the light emitting element 110.
在一實施例中，發光元件110可直接以導熱膠貼附在散熱片120上，並以多條導線電性連接發光元件110的電極111至外部的驅動電路。因此，本實施例之發光元件110不限定以電路板112配置於散熱片120上，以減少熱阻之產生。此外，當發光元件110以電路板112固定在散熱片120上，電路板112之背面可藉由高導熱性之導熱膠114貼附在散熱片120上，以加快散熱的時間。In one embodiment, the light-emitting element 110 can be directly attached to the heat sink 120 with a thermal conductive adhesive, and electrically connected to the electrode 111 of the light-emitting element 110 to the external driving circuit by a plurality of wires. Therefore, the light-emitting element 110 of the present embodiment is not limited to being disposed on the heat sink 120 by the circuit board 112 to reduce the generation of thermal resistance. In addition, when the light-emitting element 110 is fixed on the heat sink 120 by the circuit board 112, the back surface of the circuit board 112 can be attached to the heat sink 120 by the high thermal conductivity thermal conductive adhesive 114 to accelerate the heat dissipation time.
以下介紹第一嵌合部121與電路板112的導熱區112a及電性連接區112b的相對位置關係。請參考第2圖，在一實施例中，第一嵌合部121對應位於導熱區112a的下方，也就是位於發光元件110的熱源下方，可得知熱傳導的路徑為最短的直線，因此發光元件110所產生的熱可直接由導熱區112a傳導至第一嵌合部121，再由第一嵌合部121傳導至第二嵌合部131，以加快散熱的時間。The relative positional relationship between the first fitting portion 121 and the heat transfer portion 112a and the electrical connection portion 112b of the circuit board 112 will be described below. Referring to FIG. 2, in an embodiment, the first fitting portion 121 is located below the heat conducting portion 112a, that is, under the heat source of the light emitting element 110, and the path of heat conduction is the shortest straight line, so the light emitting element The heat generated by the 110 can be directly conducted to the first fitting portion 121 by the heat conducting portion 112a, and then conducted to the second fitting portion 131 by the first fitting portion 121 to accelerate the heat dissipation time.
此外，在另一實施例(未繪示於圖中)，第一嵌合部121對應位於電性連接區112b的下方，也就是位於導熱區112a之周圍區域，由此可知熱傳輸的路徑是先向兩側擴散之後再往下傳導，因此同樣可使導熱區112a上的熱經由第一嵌合部121傳導至第二嵌合部131。另外，為了減少熱阻之產生，散熱片120之背面124與金屬背板130之內表面134較佳為完整的平面，如此散熱片120之背面124可完全貼附在金屬背板130的內表面134上，增加散熱的效果。同時，在理想的公差配合下，散熱片120可單靠嵌合結構固定在金屬背板130上，不需藉由外加的螺絲鎖附或以導熱膠貼附等傳統的做法來固定散熱片120，即使可以使用螺絲或黏膠，但螺絲的使用量可減少以及避免黏膠可能因長時間熱反應後會造成黏性降低，進而避免發生散熱片120與金屬背板130分離的現象。In addition, in another embodiment (not shown), the first fitting portion 121 is located below the electrical connection region 112b, that is, in the surrounding area of the heat conduction region 112a, so that the path of the heat transmission is After being diffused to the both sides and then conducting downward, the heat on the heat transfer portion 112a can also be conducted to the second fitting portion 131 via the first fitting portion 121. In addition, in order to reduce the occurrence of thermal resistance, the back surface 124 of the heat sink 120 and the inner surface 134 of the metal back plate 130 are preferably completely flat, such that the back surface 124 of the heat sink 120 can be completely attached to the inner surface of the metal back plate 130. On the 134, the effect of heat dissipation is increased. At the same time, under the ideal tolerance, the heat sink 120 can be fixed on the metal back plate 130 by the fitting structure alone, and the heat sink 120 is not fixed by the conventional method such as external screw locking or thermal adhesive bonding. Even if screws or adhesives can be used, the amount of screws can be reduced and the viscosity of the adhesives may be reduced due to long-term thermal reaction, thereby preventing the separation of the heat sink 120 from the metal back plate 130.
接著，請參考第3A及3B圖，其繪示兩種型態之陣列光源模組的示意圖。陣列光源模組200包括多個發光元件210、一散熱片220以及一金屬背板230。發光元件210例如是發光二極體，其可沿著散熱片220的延伸方向排列，以形成一陣列光源。散熱片220為長板狀，散熱片220的第一嵌合部221與金屬背板230的第二嵌合部231相互卡合，以使散熱片220固定在金屬背板230上。第一嵌合部221包括多個凹槽221a，此些凹槽221a凹陷於散熱片220的背面224，並沿著散熱片220的延伸方向排列。此外，第二嵌合部231包括多個凸塊231a，此些凸塊231a與此些凹槽221a的形狀互補且突出於金屬背板230的內表面234，以使第一嵌合部221與第二嵌合部231相互卡合。Next, please refer to Figures 3A and 3B, which show schematic diagrams of two types of array light source modules. The array light source module 200 includes a plurality of light emitting elements 210, a heat sink 220, and a metal back plate 230. The light emitting elements 210 are, for example, light emitting diodes that are arranged along the extending direction of the heat sink 220 to form an array of light sources. The heat sink 220 has a long plate shape, and the first fitting portion 221 of the heat sink 220 and the second fitting portion 231 of the metal back plate 230 are engaged with each other to fix the heat sink 220 to the metal back plate 230. The first fitting portion 221 includes a plurality of grooves 221a recessed in the back surface 224 of the heat sink 220 and arranged along the extending direction of the heat sink 220. In addition, the second fitting portion 231 includes a plurality of protrusions 231a, and the protrusions 231a are complementary to the shapes of the grooves 221a and protrude from the inner surface 234 of the metal back plate 230 such that the first fitting portion 221 is The second fitting portions 231 are engaged with each other.
在一實施例中，各個凹槽231a對應位於各個發光元件210的下方，如第3A圖所示，因此每個發光元件210的下方均有獨立的熱傳輸路徑，以增加散熱量。此外，在另一實施例中，若發光元件210所需的散熱量較少時，凹槽221a的數量可少於發光元件210的數量，例如為三個，如第3B圖所示。另外，第一嵌合部221與第二嵌合部231可藉由擠製、衝壓或銑削的方式成形，擠製或衝壓成形的時間較短，且成本較低，適合大量製造及減少工時。In one embodiment, each of the recesses 231a is located below each of the light-emitting elements 210, as shown in FIG. 3A, so that each of the light-emitting elements 210 has an independent heat transfer path below it to increase the amount of heat dissipation. Further, in another embodiment, if the amount of heat radiation required for the light-emitting element 210 is small, the number of the grooves 221a may be less than the number of the light-emitting elements 210, for example, three, as shown in FIG. 3B. In addition, the first fitting portion 221 and the second fitting portion 231 can be formed by extrusion, stamping or milling, and the pressing or stamping forming time is short, and the cost is low, which is suitable for mass production and reduced working hours. .
由此可知，本實施例之陣列光源模組200，係將散熱片220以嵌合方式固定於金屬背板230上，以使熱能快速地由多個發光元件210傳輸至散熱片220以及金屬背板230，避免熱囤積在散熱片220與金屬背板230之間而影響發光元件的使用壽命及發光元件的發光效率。在組裝上，散熱片220與金屬背板230可藉由凹凸配合的嵌合結構組裝為一體，組裝方便，因此所需的工時相對少於以螺絲鎖固或是以導熱膠貼附所需的工時。Therefore, the array light source module 200 of the embodiment is configured to fix the heat sink 220 on the metal back plate 230 in a fitting manner, so that the heat energy is quickly transmitted from the plurality of light emitting elements 210 to the heat sink 220 and the metal back. The plate 230 prevents heat from being accumulated between the heat sink 220 and the metal back plate 230 to affect the service life of the light-emitting element and the light-emitting efficiency of the light-emitting element. In assembly, the heat sink 220 and the metal back plate 230 can be assembled by a fitting structure with a concave-convex fit, and the assembly is convenient, so that the required working time is relatively less than that required by screwing or fixing with a thermal conductive adhesive. Working hours.
同時，在理想的公差配合下，散熱片220可單靠嵌合結構固定在金屬背板230上，不需藉由外加的螺絲鎖附或以導熱膠貼附等傳統的做法來固定散熱片220，即使可以使用螺絲或黏膠，但螺絲的使用量可減少以及避免黏膠可能因長時間熱反應後會造成黏性降低，進而避免發生散熱片220與金屬背板230分離的現象。At the same time, under the ideal tolerance, the heat sink 220 can be fixed on the metal back plate 230 by the fitting structure alone, and the heat sink 220 is not fixed by the conventional method such as external screw locking or thermal adhesive bonding. Even if screws or adhesives can be used, the amount of screws can be reduced and the viscosity of the adhesives may be reduced due to long-term thermal reaction, thereby preventing the separation of the heat sink 220 from the metal back plate 230.
綜上所述，雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作各種之更動與潤飾。因此，本發明之保護範圍當視後附之申請專利範圍所界定者為準。In conclusion, the present invention has been disclosed in the above preferred embodiments, and is not intended to limit the present invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
100．．．光源模組100. . . Light source module
101．．．嵌合結構101. . . Chimeric structure
110、210．．．發光元件110, 210. . . Light-emitting element
111．．．電極111. . . electrode
112．．．電路板112. . . Circuit board
112a．．．導熱區112a. . . Thermal conduction zone
112b．．．電性連接區112b. . . Electrical connection zone
114．．．導熱膠114. . . Thermal adhesive
120、220．．．散熱片120, 220. . . heat sink
121、122、221．．．第一嵌合部121, 122, 221. . . First fitting
121a、122a．．．第一卡勾部121a, 122a. . . First hook
124、224．．．背面124, 224. . . back
131、132、231．．．第二嵌合部131, 132, 231. . . Second fitting part
131a、132a．．．第二卡勾部131a, 132a. . . Second hook
130、230．．．金屬背板130, 230. . . Metal backplane
134、234．．．內表面134, 234. . . The inner surface
200．．．陣列光源模組200. . . Array light source module
221a．．．凹槽221a. . . Groove
231a．．．凸塊231a. . . Bump
第1A圖繪示依照一實施例之嵌合結構的剖面圖。FIG. 1A is a cross-sectional view showing a fitting structure in accordance with an embodiment.
第1B圖繪示依照另一實施例之嵌合結構的剖面圖。FIG. 1B is a cross-sectional view showing a fitting structure according to another embodiment.
第2圖繪示依照一實施例之光源模組的剖面圖。2 is a cross-sectional view of a light source module in accordance with an embodiment.
第3A及3B圖繪示兩種型態之陣列光源模組的示意圖。3A and 3B are schematic views showing two types of array light source modules.
100．．．光源模組100. . . Light source module
110．．．發光元件110. . . Light-emitting element
111．．．電極111. . . electrode
112．．．電路板112. . . Circuit board
112a．．．導熱區112a. . . Thermal conduction zone
112b．．．電性連接區112b. . . Electrical connection zone
114．．．導熱膠114. . . Thermal adhesive
120．．．散熱片120. . . heat sink
121．．．第一嵌合部121. . . First fitting
121a．．．第一卡勾部121a. . . First hook
124．．．背面124. . . back
131．．．第二嵌合部131. . . Second fitting part
131a．．．第二卡勾部131a. . . Second hook
130．．．金屬背板130. . . Metal backplane
134．．．內表面134. . . The inner surface
Claims (11)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100102384A TWI440232B (en) | 2011-01-21 | 2011-01-21 | Light source module |
| CN2011100612610A CN102606903A (en) | 2011-01-21 | 2011-03-14 | Light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100102384A TWI440232B (en) | 2011-01-21 | 2011-01-21 | Light source module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201232853A TW201232853A (en) | 2012-08-01 |
| TWI440232B true TWI440232B (en) | 2014-06-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100102384A TWI440232B (en) | 2011-01-21 | 2011-01-21 | Light source module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102606903A (en) |
| TW (1) | TWI440232B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI497751B (en) * | 2012-09-10 | 2015-08-21 | Lextar Electronics Corp | Light emitting diode substrate array |
| CN110750026B (en) * | 2019-09-25 | 2021-01-29 | 深圳市火乐科技发展有限公司 | Projector with a light source |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101526199A (en) * | 2008-03-04 | 2009-09-09 | 瀚宇彩晶股份有限公司 | Backlight module and light-emitting device thereof |
| CN101363606A (en) * | 2008-08-29 | 2009-02-11 | 北京中庆微数字设备开发有限公司 | High-efficiency heat radiation LED lamp and system thereof |
| CN201396712Y (en) * | 2009-05-07 | 2010-02-03 | 徐志锋 | Mounting structure of LED lamp |
| CN101943356B (en) * | 2010-07-14 | 2013-03-13 | 深圳市华星光电技术有限公司 | Backlight module and luminous source encapsulation structure thereof |
-
2011
- 2011-01-21 TW TW100102384A patent/TWI440232B/en active
- 2011-03-14 CN CN2011100612610A patent/CN102606903A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW201232853A (en) | 2012-08-01 |
| CN102606903A (en) | 2012-07-25 |
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