CN101526199A - Backlight module and light-emitting device thereof - Google Patents
Backlight module and light-emitting device thereof Download PDFInfo
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- CN101526199A CN101526199A CN200810083214A CN200810083214A CN101526199A CN 101526199 A CN101526199 A CN 101526199A CN 200810083214 A CN200810083214 A CN 200810083214A CN 200810083214 A CN200810083214 A CN 200810083214A CN 101526199 A CN101526199 A CN 101526199A
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Abstract
The invention relates to a light-emitting device, which comprises a light source unit, a printed circuit board and a thermal pad. The printed circuit board is provided with an upper surface, a lower surface and a first joint, wherein the upper surface is used for bearing the light source unit; the lower surface is opposite to the upper surface; and the first joint is positioned on the lower surface. The thermal pad comprises a second joint which is clamped on the first joint so as to make the thermal pad fixed on the lower surface of the printed circuit board.
Description
Technical field
The present invention relates to a kind of backlight module, relate more specifically to a kind of light-emitting device of backlight module, its heat conductive pad can stretch in the printed circuit board (PCB), and this heat conductive pad is fully contacted with this printed circuit board (PCB).
Background technology
Along with the progress of electronics technology, the accompanied electronic product is in vogue especially in daily life, increases day by day for the demand of the display compact, that power consumption is low.LCD because have that power consumption power is low, caloric value is few, the advantage of in light weight and non-light emitting type display or the like, be often used in this type of the electronic product, even progressively replace traditional cathode-ray tube display.
With reference to Fig. 1, it shows the available liquid crystal display.Generally speaking, LCD 8 comprises liquid crystal panel 10 and backlight module 20.This backlight module 20 is disposed at the below of this liquid crystal panel 10, is used for light that light source is sent, is dispensed to uniformly on this liquid crystal panel 10.The backlight module 20 that is used for LCD 8 generally can be divided into straight form of light source and side form of light source down.In addition, this LCD 8 also comprises housing 11, is used for fixing this liquid crystal panel 10 and this backlight module 20.
With reference to Fig. 2, it shows a kind of straight form of light source backlight module 20a down.Should use the design of light source direct irradiation light inlet by straight form of light source backlight module 20a down, and comprise shell on the back 22, light-emitting device 90 and a plurality of blooming piece 24.This shell on the back 22 has base plate 26, is used to carry this light-emitting device 90, and this light-emitting device 90 is disposed in this shell on the back 22.This blooming piece 24 is disposed at the top of this shell on the back 22 such as prismatic lens and diffusion sheet.
With reference to Fig. 3, it shows a kind of side form of light source backlight module 20b.This side form of light source backlight module 20b uses the design of side light inlet, and comprises LGP 30, light-emitting device 90, U type reflector 34, reflecting plate 36 and a plurality of blooming piece 24.This light-emitting device 90 is installed at least one side 32 of this LGP 30, and comprises a plurality of light sources.This U-shaped reflector 34 is around this light-emitting device 90, and the opening 38 of this U-shaped reflector 34 is towards the side 32 of this LGP 30.This reflecting plate 36 is fixed in the bottom surface of this LGP 30.This blooming piece 24 such as prismatic lens and diffusion sheet etc., is fixed in the end face of this LGP 30.Because this light-emitting device 90 is disposed on the side 32 of this LGP 30, so the thickness of this side form of light source backlight module 20b just is minimized.
Present owing to LED source is light source first-selection of future generation and has plurality of advantages, such as characteristic, therefore can be widely used in the backlight liquid crystal display module with power saving.With reference to Fig. 4, this light-emitting device 90 comprises LED source 92, metallic core printed circuit board (PCB) (Metal Core Printed Circuit Board; MCPCB) 94 and heat conductive pad 96.This heat conductive pad 96 can be attached on this metallic core printed circuit board (PCB) 94 by adhesion layer 98.LED source can improve the display quality of LCD, that is LED source is far superior to the CCFL light source on colour gamut (Color Gamut).LED source also has the environmental protection characteristic, that is does not have mercury.
With reference to Fig. 5, with side form of light source backlight module is example, this backlight module 20 also comprises shell on the back 42 and framework 44, wherein this shell on the back 42 combines with this framework 44, is used for this LGP 30, this light-emitting device 90, this U type reflector 34, this optical diaphragm group 24 and this reflecting plate 36 are fixedly arranged between this shell on the back 42 and this framework 44.Luminous efficiency for the LED source 92 that increases this light-emitting device 90, must overcome the heat dissipation problem of LED source 92, the normal mode of using is exactly that printed circuit board (PCB) 94 and 34 of U type reflectors at this light-emitting device 90 is provided with heat conductive pad (Thermal Pad) 96, is used for the heat of this light-emitting device 90 is sent to this U type reflector 34.In addition, in order to increase the product assembleability, this heat conductive pad 96 is attached on this printed circuit board (PCB) 94 by adhesion layer 98 usually, slides with respect to this printed circuit board (PCB) 94 to avoid this heat conductive pad 96.Yet this adhesion layer will reduce radiating effect, and then influences the luminous efficiency of this LED source.
Therefore, just having to provide a kind of light-emitting device, can solve aforesaid problem.
Summary of the invention
A purpose of the present invention is to provide a kind of light-emitting device, its heat conductive pad can stretch in the printed circuit board (PCB), this heat conductive pad is fully contacted with this printed circuit board (PCB), easy assembling is aimed at, and this printed circuit board (PCB) is with the increase of this heat conductive pad contact area and make heat conducting effect better.
For reaching above-mentioned purpose, the invention provides a kind of light-emitting device, comprise light source cell, printed circuit board (PCB) and heat conductive pad.This printed circuit board (PCB) has upper surface, lower surface and first joint portion, and wherein this upper surface is used to carry this light source cell, and this lower surface is with respect to this upper surface, and this first binding site is in this lower surface.This heat conductive pad comprises second joint portion, and it is sticked in this first joint portion, makes this heat conductive pad be fixed in the lower surface of this printed circuit board (PCB) thus.
With respect to prior art, the heat conductive pad of light-emitting device of the present invention does not need to be attached on this printed circuit board (PCB) by adhesion layer, therefore can not reduce radiating effect.In addition, the heat conductive pad of light-emitting device of the present invention can stretch to (that is second joint portion of this heat conductive pad is sticked in first joint portion of this printed circuit board (PCB)) in the printed circuit board (PCB), this heat conductive pad is fully contacted with this printed circuit board (PCB), design is not only assembled easily and is aimed at like this, and this printed circuit board (PCB) and this heat conductive pad contact area increase and make heat conducting effect better, and then improve the luminous efficiency of this LED source.
In order to allow above and other objects of the present invention, feature and the advantage can be more obvious, hereinafter will be in conjunction with the accompanying drawings, be described in detail below.
Description of drawings
Fig. 1 is the exploded perspective schematic diagram of the LCD of prior art;
Fig. 2 is the straight decomposition generalized section of form of light source backlight module down of prior art;
Fig. 3 is the decomposition generalized section of the side form of light source backlight module of prior art;
Fig. 4 is the schematic perspective view of the light-emitting device of prior art;
Fig. 5 is the part amplification profile schematic diagram of the side form of light source backlight module of prior art;
Fig. 6 a is the schematic perspective view of the light-emitting device of the first embodiment of the present invention;
Fig. 6 b and 6c are the exploded perspective schematic diagram of the light-emitting device of the first embodiment of the present invention;
Fig. 7 a to 7f is the schematic perspective view of the heat conductive pad of light-emitting device of the present invention;
Fig. 8 is the generalized section of the light-emitting device of the first embodiment of the present invention;
Fig. 9 a and 9b are the generalized section of light-emitting device of the present invention, and the top width degree of the section of its demonstration protuberance is greater than the bottom width degree;
Figure 10 a and 10b are the generalized section of light-emitting device of the present invention, and its top width degree that shows the section of protuberance equals the bottom width degree;
Figure 11 a and 11b are the generalized section of light-emitting device of the present invention, and the top width degree of the section of its demonstration protuberance is less than the bottom width degree;
Figure 12 is the schematic perspective view of the light-emitting device of the first embodiment of the present invention;
Figure 13 a and 13b are the schematic perspective view of the heat conductive pad of light-emitting device of the present invention;
Figure 14 is the part amplification profile schematic diagram of side form of light source backlight module of the present invention;
Figure 15 is the straight decomposition generalized section of form of light source backlight module down of the present invention.
The specific embodiment
With reference to Fig. 6 a, it shows the light-emitting device 200 of the first embodiment of the present invention.This light-emitting device 200 comprises light source cell 202, printed circuit board (PCB) 210 and heat conductive pad 230.This light source cell 202 is the long strip type lamp bracket (LEDLight-bar) that a plurality of light emitting diodes are arranged along two-dimensional directional.This printed circuit board (PCB) 210 has upper surface 212 and the lower surface 214 and first joint portion 216.This upper surface 212 is used to carry this light source cell 202, and this lower surface 214 is with respect to this upper surface 212, and this first joint portion 216 is positioned at this lower surface 214.This heat conductive pad 230 comprises second joint portion 232, and it is sticked in this first joint portion 216, makes this heat conductive pad 230 be fixed in the lower surface 214 of this printed circuit board (PCB) 210 thus.The material of this heat conductive pad can be polyethyleneterephthalate (Polythelene terephthalate; PET) made.
These light-emitting device 200 definition have the XYZ triaxial coordinate, because this second joint portion 232 can be by being sticked in this first joint portion 216 along push-down stack mode on the direction of arrow 250 (shown in Fig. 6 b) or by slip into mode (shown in Fig. 6 c) along the direction of arrow about 252, therefore the present invention can limit this heat conductive pad 230 at least and slides with respect to this printed circuit board (PCB) 210 along X-direction, and then the effect that this heat conductive pad 230 is fixed in X-direction.
In the present embodiment, this first joint portion 216 comprises at least one recess, and this second joint portion 232 comprises at least one protuberance, and this protuberance is sticked in this recess, makes this heat conductive pad 230 be fixed in the lower surface 214 of this printed circuit board (PCB) 210 thus.On the contrary, in another embodiment, this first joint portion 216 comprises at least one protuberance (figure does not show), and this second joint portion 232 comprises at least one recess (figure does not show), and this protuberance is sticked in this recess, also can make this heat conductive pad be fixed in the lower surface of this printed circuit board (PCB) thus.Preferably, the volume of this protuberance equals the volume of this recess substantially, can make the contact area maximum of this protuberance and this recess.
With reference to Fig. 7 a to 7f, heat conductive pad 230 of the present invention can be following form, and has contact-making surface 234, and these contact-making surface 234 definition have length direction (that is Y direction) and width (that is X-direction).Protuberance 232 is a plurality of, and is positioned at this contact-making surface 234.This protuberance 232 of at least a portion is arranged along this length direction, and perhaps this protuberance 232 of at least a portion is arranged along this width.With reference to Fig. 7 a, this protuberance 232 can be a plurality of rectangular block shape, and arranges in regular turn along this length direction, and wherein this protuberance 232 is sticked in its corresponding recess by last push-down stack mode.With reference to Fig. 7 b, this protuberance 232 can be a plurality of circular block, and arranges in regular turn along this length direction, and wherein this protuberance 232 is sticked in its corresponding recess by last push-down stack mode.With reference to Fig. 7 c, this protuberance can be a plurality of cross bulks, and arranges in regular turn along this length direction, and wherein this protuberance 232 is sticked in its corresponding recess by last push-down stack mode.With reference to Fig. 7 d, this protuberance 232 is the strip of extending orthoscopic along this length direction, wherein this protuberance 232 by last push-down stack mode or about slip into mode and be sticked in its corresponding recess.With reference to Fig. 7 e, this protuberance 232 is for extending the strip of the formula of crawling along this length direction, wherein this protuberance 232 by last push-down stack mode or about slip into mode and be sticked in its corresponding recess.With reference to Fig. 7 f, this protuberance 232 is a plurality of strips of extending along this width, wherein this protuberance 232 by last push-down stack mode or about slip into mode and be sticked in its corresponding recess.
With reference to Fig. 8, in the present embodiment, this printed circuit board (PCB) 210 can comprise line layer 218 and heat-conducting plate 220, and this line layer 218 and heat-conducting plate 220 are between the upper surface 212 and lower surface 214 of this printed circuit board (PCB) 210, and this recess 216 ' is positioned on this heat-conducting plate 220.This heat-conducting plate 220 can be metallic plate, such as aluminium sheet.Protuberance 232 ' the thickness V2 of this heat conductive pad 230 is not more than the difference of the thickness E of the thickness V1 of this printed circuit board (PCB) 210 and this line layer 218.Protuberance 232 ' the thickness V2 of this heat conductive pad 230 preferably, can design greater than about 0.3mm.This heat conductive pad 230 also comprises body 236, and this protuberance 232 ' is positioned on this body 236.Body 236 thickness T of this heat conductive pad 230 preferably, can design between about 0.5mm and about 5mm.Body 236 thickness T of this heat conductive pad 230 and the ratio of protuberance 232 ' thickness V2 are less than 15.
In the combination of the protuberance and the recess of following three kinds of forms of the present invention, this protuberance all can be sticked in this recess, also can limit this heat conductive pad and slide along X-direction or Z-direction with respect to this printed circuit board (PCB).
With reference to Fig. 9 a, with regard to the combination of the protuberance 232 ' of first kind of form and recess 216 ', if the top width degree H1 of the section of this protuberance 232 ' is greater than bottom width degree H2 (such as the ratio of bottom width degree H2 and top width degree H1 less than 0.9), and the ratio of the width W of the top width degree H1 of the section of this protuberance 232 ' and this heat conductive pad 230 bodies 236 is less than 1, and then this protuberance 232 ' has the effect that engages with recess 216 '.Preferably, H1/W ratio is 0.5 o'clock, can take into account heat radiation and stationarity and H1 and not have too small and unmanageable problem.In other words, this moment, the section of this protuberance 232 ' was the profile of dovetail (dovetail), and the effect that it has best engaging also can limit this heat conductive pad 230 and slide along X-direction and Z-direction with respect to this printed circuit board (PCB) 210.With reference to Fig. 9 b, the section of this protuberance 232 ' is made of top margin 242 ' and dual-side 244 '.Preferably, the included angle A between the side 244 ' of the section of this protuberance 232 ' and this body 236 surfaces 238, B between about 10 and about 90 degree between.Best, included angle A, the B between the side 244 ' of the section of this protuberance 232 ' and this body 236 surfaces 238 is 45 degree.
With reference to Figure 10 a, protuberance 232 with regard to second kind of form " with recess 216 " combination with regard to, if this protuberance 232 " the top width degree H1 of section equal bottom width degree H2; and this protuberance 232 " the ratio of top width degree H1 (or bottom width degree H2) and the width W of these heat conductive pad 230 bodies 236 of section less than 1, this protuberance 232 then " with recess 216 " have an effect that engages.Preferably, H1/W ratio is 0.5 o'clock, can take into account heat radiation and stationarity and H1 and not have too small and unmanageable problem.In other words, this moment this protuberance 232 " section be the profile of rectangle, it has the effect of preferable engaging, also can limit this heat conductive pad 230 and slide with respect to this printed circuit board (PCB) 210 along X-direction.With reference to Figure 10 b, this protuberance 232 " section by top margin 242 " and dual-side 244 " constitute.This protuberance 232 " the side 244 of section " and these body 236 surfaces 238 between included angle A, B be 90 degree.
With reference to Figure 11 a, protuberance 232 with regard to the third form " ' with recess 216 " ' combination with regard to, if this protuberance 232 " ' the top width degree H1 of section less than bottom width degree H2 (such as the ratio of top width degree H1 and bottom width degree H2 less than 0.9); and this protuberance 232 " ' the bottom width degree H2 of section and the ratio of the width W of this heat conductive pad 230 bodies 236 less than 1, this protuberance 232 then " ' with recess 216 " ' still have an effect that engages.Preferably, H1/W ratio is 0.5 o'clock, can take into account heat radiation and stationarity and H1 and not have too small and unmanageable problem.In other words, this moment this protuberance 232 " ' section be trapezoidal profile, it still has the effect of engaging, that is still can limit this heat conductive pad 230 and slide with respect to this printed circuit board (PCB) 210 along X-direction.With reference to Figure 11 b, this protuberance 232 " ' section by top margin 242 " ' and dual-side 244 " ' constitute.Preferably, this protuberance 232 " included angle A, B between the side 244 of section ' " ' and these body 236 surfaces 238 be between 90 and 170 degree.Best, this protuberance 232 " included angle A, B between the side 244 of section ' " ' and these body 236 surfaces 238 be 135 degree.
With respect to prior art, the heat conductive pad of light-emitting device of the present invention does not need to be attached on this printed circuit board (PCB) by adhesion layer, therefore can not reduce radiating effect.In addition, the heat conductive pad of light-emitting device of the present invention can stretch to (that is second joint portion of this heat conductive pad is sticked in first joint portion of this printed circuit board (PCB)) in the printed circuit board (PCB), this heat conductive pad is fully contacted with this printed circuit board (PCB), design is not only assembled easily and is aimed at like this, and this printed circuit board (PCB) and this heat conductive pad contact area increase and make heat conducting effect better, and then improve the luminous efficiency of this LED source.
With reference to Figure 12, it shows the light-emitting device 300 of the second embodiment of the present invention.This light-emitting device 300 comprises light source cell 302, printed circuit board (PCB) 310 and heat conductive pad 330.Light-emitting device 300 among second kind of embodiment is similar to first kind of light-emitting device 200 among the embodiment substantially, and wherein similarly assembly indicates similar label.The main difference of light-emitting device 300 among second kind of embodiment and the light-emitting device 200 of first kind of embodiment is the plane formula lamp brackets that this light source cell 302 is arranged along two-dimensional directional for a plurality of light emitting diodes.
In the present embodiment, first joint portion 316 of this printed circuit board (PCB) 310 comprises at least one recess, second joint portion 332 of this heat conductive pad 330 comprises at least one protuberance, and this protuberance is sticked in this recess, makes this heat conductive pad 330 be fixed in the lower surface 314 of this printed circuit board (PCB) 310 thus.On the contrary, in another embodiment, this first joint portion 316 comprises at least one protuberance (figure does not show), and this second joint portion 332 comprises at least one recess (figure does not show), and this protuberance is sticked in this recess, also can make this heat conductive pad be fixed in the lower surface of this printed circuit board (PCB) thus.
With reference to Figure 13 a to 13b, in the present embodiment, this heat conductive pad 330 can be following form, and has contact-making surface 334, these contact-making surface 334 definition have length direction (that is Y direction) and width (that is X-direction), and this protuberance 332 ' is positioned at this contact-making surface 334.With reference to Figure 13 a, this protuberance 332 ' is that wherein this protuberance 332 ' is sticked in this recess 316 ' by last push-down stack mode along the cross-bar shape of this length direction and width extension.With reference to Figure 13 b, this protuberance 332 " be the strip of extending orthoscopic along this length direction, and by last push-down stack mode or about slip into mode and be sticked in this recess 316 ".Perhaps, this protuberance 332 " for extending the strip (figure does not show) of orthoscopic along this width, and by last push-down stack mode or about slip into mode and be sticked in this recess.
With reference to Figure 14, it shows a kind of side form of light source backlight module 120b that utilizes light-emitting device 200 of the present invention.This side form of light source backlight module 120b comprises LGP 130, light-emitting device 200, reflector (such as U type reflector) 134, reflecting plate 136 and a plurality of blooming piece 124.This light-emitting device 200 is installed at least one side 132 of this LGP 130.This reflector 134 is around this light-emitting device 200, and the opening 138 of this reflector 134 is towards the side 132 of this LGP 130, is used for the light of the light source cell of this light-emitting device 200 is reflexed to this LGP 130.This reflecting plate 136 is fixed in the bottom surface of this LGP 130.This blooming piece 124 such as prismatic lens and diffusion sheet etc., is fixed in the end face of this LGP 130.This backlight module 120b also comprises shell on the back 142 and framework 144, wherein this shell on the back 142 combines with this framework 144, be used for this LGP 130, this light-emitting device 200, this reflector 134, this optical diaphragm group 124 and this reflecting plate 136 be fixedly arranged on this shell on the back 142 and this framework 144 between.This heat conductive pad 230 is contacted with this reflector 134, is used for the heat of this light-emitting device 200 is sent to this reflector 134.This reflector 134 is contacted with this shell on the back 142, is used for the heat of this light-emitting device 200 is sent to this shell on the back 142.
With reference to Figure 15, it shows a kind of straight form of light source backlight module 120a down that utilizes light-emitting device 300 of the present invention.Be somebody's turn to do straight form of light source backlight module 120a down and comprise shell on the back 122, light-emitting device 300 and a plurality of blooming piece 124.This shell on the back 122 has base plate 126, is used to carry this light-emitting device 300, and this light-emitting device 300 is disposed in this shell on the back 122, and wherein this heat conductive pad 330 is contacted with this base plate 126, is used for the heat of this light-emitting device 300 is sent to this base plate 126.This blooming piece 124 is disposed at the top of this shell on the back 122 such as prismatic lens and diffusion sheet.
In addition, backlight module 120a of the present invention, 120b can be applicable to LCD.This LCD comprises liquid crystal panel and backlight module 120a of the present invention, 120b.This backlight module 120a, 120b are disposed at the below of this liquid crystal panel, are used for the light that light source cell sent with this light-emitting device 300,200, are dispensed to uniformly on this liquid crystal panel.This LCD also comprises housing, is used for fixing this liquid crystal panel and backlight module 120a of the present invention, 120b.
Though the present invention is open with previous embodiment, so it is not to be used to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention, when doing various changes and modification.Therefore protection scope of the present invention is as the criterion when looking the accompanying Claim person of defining.
Claims (13)
1, a kind of light-emitting device comprises:
Light source cell;
Printed circuit board (PCB) has upper surface, lower surface and first joint portion, and wherein said upper surface is used to carry described light source cell, and described lower surface is with respect to described upper surface, and described first binding site is on described lower surface; And
Heat conductive pad comprises second joint portion, and it is sticked in described first joint portion, makes described heat conductive pad be fixed in the lower surface of described printed circuit board (PCB) thus.
2, light-emitting device as claimed in claim 1, wherein said first joint portion comprises at least one recess, and described second joint portion comprises at least one protuberance, and described protuberance is sticked in described recess.
3, light-emitting device as claimed in claim 2, the protuberance thickness of wherein said heat conductive pad are not more than the difference of the thickness of the thickness of described printed circuit board (PCB) and described line layer.
4, light-emitting device as claimed in claim 2, wherein said heat conduction are paid somebody's debt and expected repayment later and are comprised body, and described protuberance is positioned on the described body, and the ratio of described body thickness and protuberance thickness is less than 15.
5, light-emitting device as claimed in claim 2, wherein said protuberance be shaped as wherein a kind of of rectangular block shape, circular bulk and cross bulk.
6, light-emitting device as claimed in claim 3, the section of wherein said protuberance have top width degree and bottom width degree, and the top width degree of the section of described protuberance is greater than the bottom width degree, and the ratio of the width of the top width degree of the section of described protuberance and described heat conductive pad is less than 1.
7, light-emitting device as claimed in claim 6, the ratio of the top width degree of the section of wherein said protuberance and the width of described heat conductive pad is 0.5.
8, light-emitting device as claimed in claim 6, the ratio of wherein said bottom width degree and top width degree is less than 0.9.
9, light-emitting device as claimed in claim 6, the section of wherein said protuberance is made of top margin and dual-side, and the angle between the side of the section of described protuberance and the described body surface between about 10 and about 90 degree between, or between about 90 spend with about 170 between.
10, light-emitting device as claimed in claim 6, the angle between the side of the section of wherein said protuberance and the described body surface are 45 degree.
11, light-emitting device as claimed in claim 6, the angle between the side of the section of wherein said protuberance and the described body surface are 135 degree.
12, a kind of backlight module comprises:
LGP has the side;
Light-emitting device is disposed at the side of described LGP, and comprises:
Light source cell;
Printed circuit board (PCB) has upper surface, lower surface and first joint portion, and wherein said upper surface is used to carry described light source cell, and described lower surface is with respect to described upper surface, and described first binding site is in described lower surface; And
Heat conductive pad comprises second joint portion, and it is sticked in described first joint portion, makes described heat conductive pad be fixed in the lower surface of described printed circuit board (PCB) thus; And
Reflector, around described light-emitting device, and comprise the side of opening surface, be used for the light of described light source cell is reflexed to described LGP to described LGP, wherein said heat conductive pad is contacted with described reflector, is used for the heat of described light-emitting device is sent to described reflector.
13, a kind of backlight module comprises:
Light-emitting device comprises;
Light source cell;
Printed circuit board (PCB) has upper surface, lower surface and first joint portion, and wherein said upper surface is used to carry described light source cell, and described lower surface is with respect to described upper surface, and described first binding site is in described lower surface; And
Heat conductive pad comprises second joint portion, and it is sticked in described first joint portion, makes described heat conductive pad be fixed in the lower surface of described printed circuit board (PCB) thus; And
Shell on the back has base plate, is used to carry described light-emitting device, and described light-emitting device is disposed in the described shell on the back, and wherein said heat conductive pad is contacted with described base plate, is used for the heat of described light-emitting device is sent to described base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810083214A CN101526199A (en) | 2008-03-04 | 2008-03-04 | Backlight module and light-emitting device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810083214A CN101526199A (en) | 2008-03-04 | 2008-03-04 | Backlight module and light-emitting device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101526199A true CN101526199A (en) | 2009-09-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810083214A Pending CN101526199A (en) | 2008-03-04 | 2008-03-04 | Backlight module and light-emitting device thereof |
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| Country | Link |
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| CN (1) | CN101526199A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102235620A (en) * | 2010-04-30 | 2011-11-09 | 瀚宇彩晶股份有限公司 | Liquid crystal display device and backlight module thereof |
| CN102606903A (en) * | 2011-01-21 | 2012-07-25 | 隆达电子股份有限公司 | Light source module |
-
2008
- 2008-03-04 CN CN200810083214A patent/CN101526199A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102235620A (en) * | 2010-04-30 | 2011-11-09 | 瀚宇彩晶股份有限公司 | Liquid crystal display device and backlight module thereof |
| CN102235620B (en) * | 2010-04-30 | 2016-06-29 | 瀚宇彩晶股份有限公司 | LCD device and backlight module thereof |
| CN102606903A (en) * | 2011-01-21 | 2012-07-25 | 隆达电子股份有限公司 | Light source module |
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