TWI428064B - 薄膜電路板 - Google Patents
薄膜電路板 Download PDFInfo
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- TWI428064B TWI428064B TW100111652A TW100111652A TWI428064B TW I428064 B TWI428064 B TW I428064B TW 100111652 A TW100111652 A TW 100111652A TW 100111652 A TW100111652 A TW 100111652A TW I428064 B TWI428064 B TW I428064B
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- 239000012528 membrane Substances 0.000 title 1
- 239000010410 layer Substances 0.000 claims description 121
- 239000011342 resin composition Substances 0.000 claims description 54
- 239000002245 particle Substances 0.000 claims description 45
- 239000010409 thin film Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 33
- 239000011347 resin Substances 0.000 claims description 33
- 239000000843 powder Substances 0.000 claims description 23
- 239000011247 coating layer Substances 0.000 claims description 14
- 239000010408 film Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 5
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 4
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 4
- 230000005484 gravity Effects 0.000 claims description 4
- 239000002904 solvent Substances 0.000 description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 229920001187 thermosetting polymer Polymers 0.000 description 9
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 8
- 238000010526 radical polymerization reaction Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 230000008961 swelling Effects 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000007858 starting material Substances 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical class O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
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- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Ceramic Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本發明係有關薄膜電路板。
筆記型電腦之基板間接續配線材或數位家電用之開關電路,係使用薄膜電路板。薄膜電路板,係在具有塑料等之可撓性之膠片(film)基板上印刷銀膏形成電路層而作成(參照下述專利文獻1)。因此,薄膜電路板,相較於在塑料膠片上蝕刻或者電鍍銅形成電路層之可撓性印刷電路板(FPC),能夠較為容易且較低成本製造。從而,薄膜電路板,漸漸常被使用作為FPC較便宜的代替品。
[專利文獻1]日本專利特開2006-261198號公報
可是,在薄膜電路板,必須保護電路層。此外,隨著小型化薄膜電路板也多層化電路層。因此,用絕緣覆蓋層將電路層覆蓋就成為必要。
但是,在利用銀膏印刷而在基板上形成電路層後,在該電路層塗布樹脂組成物使之硬化而形成絕緣覆蓋層時,電路層之電路電阻顯著上升之場合會發生。此外,該電路電阻之上升程度,係隨絕緣覆蓋層之種類不同而異,所使用之絕緣覆蓋層會造成電路電阻變得相當大。因而,能夠使用之絕緣覆蓋層之種類受到限定。
本發明有鑑於上述情事,其目的在於提供一種薄膜電路板,不論絕緣覆蓋層之種類為何,在電路層以絕緣覆蓋層覆蓋之前後之電路電阻的變化可被充分抑制。
本發明人等為解決上述課題一再專注研究之結果,考慮到電路層之電路電阻顯著變化之原因可能如下。亦即,思考在用絕緣覆蓋層覆蓋電路層時,絕緣覆蓋層中之溶劑侵入電路層中,而該溶劑是否會使電路層所含之樹脂成分膨潤或者溶解之問題。於是,思考是否會藉此,相互接觸之銀粒子與銀粒子分離、電路層之電路電阻顯著地改變之問題。此外,侵入電路層中之溶劑會隨絕緣覆蓋層種類之不同而異。因此,隨絕緣覆蓋層種類之不同而電路電阻之變化率也不同,是否是因溶劑種類不同而造成電路層中樹脂成分之膨潤或者程度相異的緣故,這是本發明人等所思考的問題。於是,本發明人等,為了抑制電路層中樹脂成分之膨潤或溶解,而著眼於電路層中之凝膠分率反覆銳意研究。結果,藉由將電路層中樹脂成分之凝膠分率設定在指定值以上,找出抑制電路層中樹脂成分之膨潤或者溶解,且藉此得以解決上述課題,達到完成本發明。
亦即,本發明係一種薄膜電路板,具備絕緣基材,與被設在前述絕緣基材上、將包含導電粉之導電性漿劑(paste)所形成之電路層以絕緣覆蓋層覆蓋而形成之至少1個的電路部等之薄膜電路板,其特徵係前述電路層為包含具有90百分比以上之凝膠分率之樹脂成分。
利用該薄膜電路板,藉由電路部之電路層中樹脂成分之凝膠分率為90百分比以上,可足以抑制電路層中樹脂成分之膨潤或溶解、充分抑制導電粉與粉之分離。因而,實現薄膜電路板,不論絕緣覆蓋層之種類為何,在電路層以絕緣覆蓋層覆蓋之前後之電路電阻的變化可被充分抑制。
在上述薄膜電路板,前述絕緣覆蓋層最好是使紫外線硬化型抗蝕劑硬化所形成之覆蓋層。
此場合,相比於絕緣覆蓋層是將熱硬化型抗蝕劑硬化而形成之場合,前者可實現薄膜電路板在電路層以絕緣覆蓋層覆蓋之前後之電路層電路電阻的變化可被更充分抑制。
於上述薄膜電路板,最好是前述樹脂成分係將包含自由基聚合系樹脂組成物之樹脂組成物予以硬化而形成,前述自由基聚合系樹脂組成物係包含氨酯丙烯酸酯寡聚合物(urethane-acrylate-oligomer)、季戊四醇三丙烯酸酯以及季戊四醇四丙烯酸酯,而前述樹脂組成物中前述自由基聚合系樹脂組成物之含有率則是70質量百分比以上。
此場合,相比於樹脂組成物中自由基聚合系樹脂組成物之含有率低於70質量百分比之場合,前者可實現薄膜電路板在電路層以絕緣覆蓋層覆蓋之前後之電路層電路電阻的變化可被更充分抑制。
利用本發明,提供一種薄膜電路板,不論絕緣覆蓋層之種類為何,在電路層以絕緣覆蓋層覆蓋時,電路電阻的變化可被充分抑制。
以下,針對本發明之實施型態用圖1至圖3詳細地加以說明。
圖1係顯示有關本發明之薄膜電路板之一實施型態之平面圖,圖2係沿著圖1之II─II線之剖面圖,圖3係顯示圖2之電路層之放大圖。如圖1以及圖2所示,本實施型態之薄膜電路板100係具備絕緣基材1、被設在絕緣基材1上之第1電路部2、與被設在第1電路部2上之第2電路部3。
第1電路部2,係將設在絕緣基材1上之電路層2a以絕緣覆蓋層2b覆蓋而形成之部分。此外,第2電路部3,係將設在第1電路部2之絕緣覆蓋層2b上之電路層3a以絕緣覆蓋層3b覆蓋而形成之部分。
電路層2a以及電路層3a皆是利用含導電粉之導電性漿劑所形成的,電路層2a以及電路層3a,如圖3所示,係包含導電粉4、與樹脂成分5,樹脂成分5則是具有90百分比以上之凝膠分率。
根據該薄膜電路板100,藉由第1電路部2之電路層2a中樹脂成分5之凝膠分率為90百分比以上,可足以抑制電路層2a中樹脂成分5之膨潤或溶解、充分抑制導電粉4與粉的分離。此外,藉由第2電路部3之電路層3a中樹脂成分5之凝膠分率為90百分比以上,可足以抑制電路層3a中樹脂成分5之膨潤或溶解、充分抑制導電粉4與粉的分離。因此,利用薄膜電路板100,不論絕緣覆蓋層2b、3b之種類為何,在電路層2a以絕緣覆蓋層2b覆蓋之前後之電路層2a電路電阻之變化、以及在電路層3a以絕緣覆蓋層3b覆蓋之前後之電路層3a電路電阻之變化可以被充分抑制。
在此,電路層2a、3a中樹脂成分5之凝膠分率最好是在94百分比以上,在96百分比以上更佳。
其次,針對薄膜電路板100之製造方法加以說明。
首先,準備絕緣基材1。構成絕緣基材1之絕緣材料,通常是由塑料(plastics)所構成。作為該種塑料,舉例如聚對苯二甲酸乙二醇酯樹脂(PET)、聚乙烯萘二甲酸樹脂(PEN)等之聚酯樹脂(polyester)、聚亞胺(polyimido)、聚醚亞胺(polyetherimido)等等。
其次,準備導電性漿劑。作為導電性漿劑,可以採用混合導電粉4、用以形成樹脂成分5之樹脂組成物、與溶劑等所構成之漿劑。
導電粉4,通常上,可以是薄片狀導電粒子或者球狀導電粒子,該等之混合物亦可。
導電粉4之平均粒徑並未特別限制,但是,通常為0.1~20μm,最好是0.5~10μm。
作為導電粉4,如圖3所示,最好是採用薄片狀導電粒子4a與球狀導電粒子4b之混合物。該場合,在乾燥導電性漿劑時,球狀導電粒子4b變得容易混入薄片狀導電粒子4a間之間隙,結果,即使薄片狀導電粒子4a與粒子分離也可利用球狀導電粒子4b而容易確保薄片狀導電粒子4a間之導電通過。在此,球狀導電粒子4b之平均粒徑對薄片狀導電粒子4a之平均粒徑,兩者之比最好是0.1~1,在0.25~0.5更佳。該場合,即使薄片狀導電粒子4a與粒子分離,也可利用球狀導電粒子4b更容易確保薄片狀導電粒子4a間的導電通過。又,薄片狀導電粒子4a以及球狀導電粒子4b之粒徑,在用電子顯微鏡觀察導電粒子之場合下,可認為是由下記數式:粒徑=(最小長度+最大長度)/2所算出之值。又,球狀導電粒子4b,可以稱作最大長度對最小長度之比為1~2之導電粒子。又,平均粒徑,可以稱作利用雷射回折法所測定之值之50%的值。
作為導電粉4,能採用例如銀。
作為樹脂組成物,可以採用自由基聚合系樹脂組成物、陽離子聚合系樹脂組成物、不飽和聚酯樹脂等等。其中,自由基聚合系樹脂組成物,就反應速度之觀點而言較佳。
在此,作為自由基聚合系樹脂組成物,適合採用包含氨酯丙烯酸酯寡聚合物、季戊四醇三丙烯酸酯及季戊四醇四丙烯酸酯之樹脂組成物(例如UV-5501;日本合成化學工業社製),或者包含氨酯丙烯酸酯寡聚合物、用不飽和脂肪酸烴基烷基酯所修飾之ε-己內酯(ε-caprolactone)、2-烴基乙基丙烯酸酯之樹脂組成物(例如UV-7510B;日本合成化學工業社製)。該等係能夠分別單獨或者混合使用。
在此,使用包含氨酯丙烯酸酯寡聚合物、季戊四醇三丙烯酸酯以及季戊四醇四丙烯酸酯之自由基聚合系樹脂組成物之場合,上述樹脂組成物中自由基聚合系樹脂組成物之含有率在70質量百分比以上較佳,80質量百分比以上更佳。此場合,相比於樹脂組成物中自由基聚合系樹脂組成物之含有率低於70質量百分比之場合,前者可更充分抑制在電路層2a以絕緣覆蓋層覆蓋2b覆蓋之前後下之電路層2a電路電阻的變化。但是,上述樹脂組成物中自由基聚合系樹脂組成物之含有率,通常為100質量百分比以下。
作為溶劑,能夠採用乙醇(ethanol)、丙醇(propanol)、四氫呋喃(tetrahydrofuran)、異佛爾酮(isophorone)、萜品醇(terpineol)、三甘醇單丁醚(triethylene-glycol-monobutyl-ether)、丁基溶纖劑醋酸酯(butyl-cellosolve-acetate)、乙酸卡必醇酯(carbitol acetate)等等有機溶劑。該等係可以分別單獨使用或者組合2種以上使用。
在導電性漿劑中,在將固形分基料,亦即固形分之導電粉4以及樹脂組成物之合計設為100質量百分比之場合下,最好是含有導電粉4在70~95質量百分比之比重,含有樹脂組成物5~30質量百分比之比重較佳。導電粉4以及樹脂組成物之含有率在上述範圍內時,針對電路層2a以及電路層3a之樹脂成分5可容易實現90百分比以上之凝膠分率,而且,也容易實現良好的導電性以及印刷性。
其次,在絕緣基材1上利用印刷法塗布上述導電性漿劑。印刷法方面,能夠採用例如網版印刷法(screen printing)、照相凹版印刷法(gravure printing)、轉寫印刷法、輥塗法(roll coat)等等。
其次,對導電性漿劑照射電子線。此時,吸收線量,通常上設為100~200kGy即可。利用電子線的照射,導電性漿劑中之樹脂組成物會被架橋化(硬化),可得到具有凝膠分率90百分比以上之樹脂成分5。此時,如果吸收線量增加,能夠提高凝膠分率;如果吸收線量減少,就能降低樹脂成分5之凝膠分率。如此一來,便在絕緣基材1上形成電路層2a。
其次,將電路層2a用絕緣覆蓋層2b覆蓋。絕緣覆蓋層2b,係能夠藉由在絕緣基材1上以覆蓋電路層2a之方式塗布樹脂組成物並使之硬化而得到。此時,作為樹脂組成物,能夠採用紫外線硬化型抗蝕劑或熱硬化型抗蝕劑。在此,紫外線硬化型抗蝕劑,係由包含紫外線硬化性樹脂以及光聚合開始劑所構成的;熱硬化型抗蝕劑,則是由包含熱硬化性樹脂以及硬化劑所構成的。
作為紫外線硬化性樹脂,可舉例如聚酯(偏;meta)丙烯酸酯、聚氨酯(偏)丙烯酸酯以及聚醚(偏)丙烯酸酯等等。在作為電路層2a中的樹脂成分5而採用飽和聚酯樹脂之場合,因為比較不易使樹脂成分5膨潤,所以採用聚氨酯(偏)丙烯酸酯較佳。
樹脂組成物之硬化,能夠藉由對樹脂組成物照射紫外線而進行。
作為樹脂組成物,採用熱硬化型抗蝕劑之場合,熱硬化性樹脂方面,例如,能夠採用飽和聚酯樹脂等。再者,硬化劑方面,能使用例如聚異氰酸酯(polyisocyanate)等。
在使用熱硬化型抗蝕劑作為樹脂組成物之場合,就能夠藉由加熱樹脂組成物使之硬化,而得到絕緣覆蓋層2b。
作為樹脂組成物,最好是採用紫外線硬化型抗蝕劑。此場合,相比於絕緣覆蓋層2b是採用熱硬化型抗蝕劑而被形成之場合,前者可實現薄膜電路板100在以絕緣覆蓋層2b覆蓋電路層2a之前後下電路電阻的變化可被更充分抑制。
其次,在絕緣覆蓋層2b上,利用印刷法塗布與上述同樣之導電性漿劑。接著,與形成電路層2a之場合同樣地作法利用電子線照射使導電性漿劑硬化。如此作法,在絕緣覆蓋層2b上形成電路層3a。
最後,將電路層3a用絕緣覆蓋層3b覆蓋。絕緣覆蓋層3b,與絕緣覆蓋層2b同樣,也以覆蓋電路層3a之方式在絕緣覆蓋層2b上塗布樹脂組成物並使之硬化。此時,樹脂組成物方面,最好是採用紫外線硬化型抗蝕劑這點係與絕緣覆蓋層2b之場合相同。此場合,可更充分抑制在以絕緣覆蓋層覆蓋3b覆蓋電路層3a之前後下電路層3a電路電阻的變化。
如此一來,便可得到薄膜電路板100。
本發明並不限定於上述實施型態。例如上述實施型態中,電路部被形成2層,但是,電路部僅被形成1層、或被形成3層以上皆可。形成電路部3層以上之場合,係在電路部3上,採用上述導電性漿劑形成電路層、在該電路層塗布樹脂組成物並使之硬化後形成絕緣覆蓋層得到電路部,反覆進行該工程即可。
以下,舉出實施例以及比較例,更具體地說明本發明之內容,但是,本發明並不限定於以下之實施例。
首先,如以下作法,準備導電性漿劑。亦即,混合銀粒子、樹脂組成物以及溶劑,用3支滾筒(roll)予以拌合後得到導電性漿劑。此時,銀粒子以及樹脂組成物,係按表1所示之比重加以混合。又,表1中之數值單位,只要不特別指定就以「質量%」表示。此外,表1所示之導電性漿劑中各成分之含有率,係顯示以固形分基料,亦即將固形分之合計設為100質量%之場合之含有率。溶劑,係相對於固形分100質量部而言添加3~20質量部。
此外,銀粒子、樹脂組成物以及溶劑方面,具體而言,係使用下述物品。
S-303:大研化學工業(股)製(平均粒徑2.4μm之薄片狀銀粒子)
S-602:大研化學工業(股)製(平均粒徑1.07μm之球狀粒子)
UV-5501:日本合成化學工業社製之自由基聚合系樹脂組成物
UV-7501B:日本合成化學工業社製之自由基聚合系樹脂組成物
其次,將上述導電性漿劑,在由厚度75μm之聚對苯二甲酸乙二醇酯(PET)所形成之塑料基材上,利用網版印刷法,並以形成厚度10μm且直線狀印刷圖案之方式加以塗布,在該印刷圖案,用電子線照射裝置,以加速電壓300kV、吸收線量200kGy照射電子線,形成電路層。
其次,在以上述方式所得到之電路層上,利用網版印刷法,並以使電路層的兩端露出來之方式,塗布表1所示之熱硬化型抗蝕劑(藤倉化成(股)XB-3027),將該抗蝕劑用IR爐以150℃加熱5分鐘使之硬化,形成絕緣覆蓋層。如此作法,得到薄膜電路板。
在以實施例1~9所得到之各電路層上,將表1所示之紫外線硬化型抗蝕劑(互應化學工業(股)製PTF-300G),利用網版印刷法,以使電路層之兩端露出來之方式進行塗布,在該抗蝕劑,藉由用金屬滷化物燈(metal halide lamp)照射強度1000mJ/cm2
之紫外線使抗蝕劑硬化,形成厚度20μm之絕緣覆蓋層,除上述以外係與實施例1同樣地作法得到薄膜電路板。
在將表1所示之組成之導電性漿劑,利用網版印刷法,塗布於塑料基材上而形成直線狀印刷圖案之後,將該印刷圖案,用IR爐以150℃加熱5分鐘使之硬化後形成電路層,除上述以外係與實施例1同樣地作法得到薄膜電路板。又,比較例1之導電性漿劑,係由銀粒子、自由基聚合系樹脂組成物、開始劑以及溶劑所構成之漿劑,開始劑方面,係採用偶氮二異丁腈(AIBN)。
在將表1所示之組成之導電性漿劑,利用網版印刷法,塗布於塑料基材上而形成直線狀印刷圖案之後,將該印刷圖案,用IR爐以150℃加熱5分鐘使之硬化後形成電路層,除上述以外係與實施例10同樣地作法得到薄膜電路板。又,比較例2之導電性漿劑,係由銀粒子、自由基聚合系樹脂組成物、開始劑以及溶劑所構成之漿劑,開始劑方面,係採用偶氮二異丁腈(AIBN)。
導電性漿劑方面,係採用互應化學工業(股)製PAF-25F,設電路層中樹脂成分之凝膠分率如表1所示,除上述以外係與實施例1同樣地作法得到薄膜電路板。
導電性漿劑方面,係採用互應化學工業(股)製PAF-25F,設電路層中樹脂成分之凝膠分率如表1所示,除上述以外係與實施例10同樣地作法得到薄膜電路板。
凝膠分率係以以下方式求出。亦即,在將實施例1~18以及比較例1~4所得到之電路層之一部份切下來作為試驗片,且將該試驗片浸漬於MEK(甲基乙基酮;methyl ethyl ketone)中1小時之後,以105℃乾燥1小時,測定浸漬前後試驗片的重量變化,藉此算出凝膠分率。
針對實施例1~18以及比較例1~4所得到之薄膜電路板,以以下作法評價電路電阻。
在實施例1~18以及比較例1~4所得到之薄膜電路板之製造途中,測定用絕緣覆蓋層覆蓋電路層之前之電路層的電阻值(R1)並設為初期電阻,而且,測定完成薄膜電路板後之電路層的電阻值(R2)。結果顯示於表1。又,此時,電阻值R1、R2,係採用數位多用電表(digital-multimeter),並利用4端子法加以測定。於是,根據數學式:電阻變化率(%)=100×(R2-R1)/R1,算出電阻之變化率。結果顯示於表1。
根據表1所示之結果可知,具有凝膠分率90%以上之電路層之實施例1~18之薄膜電路板,相比於具有凝膠分率低於90%之電路層之比較例1~4之薄膜電路板,前者能夠充分抑制電路電阻之變化。此外亦可知,不論絕緣覆蓋層之種類為何,能夠充分地抑制電路電阻之變化。
從而確認,根據本發明之薄膜電路板,可藉由將電路層中樹脂成分之凝膠分率設在90%以上,不論絕緣覆蓋層之種類為何,在電路層以絕緣覆蓋層覆蓋之前後之電路電阻的變化可被充分抑制。
1...絕緣基材
2...第1電路部
3...第2電路部
2a,3a...電路層
2b,3b...絕緣覆蓋層
4...導電粉
4a...薄片狀導電粒子
4b...球狀導電粒子
5...樹脂成分
100...薄膜電路板
圖1係顯示本發明薄膜電路板之一實施型態之平面圖。
圖2係沿著圖1之II-II線之剖面圖。
圖3係圖示圖2之電路層之放大圖。
1...絕緣基材
2...第1電路部
3...第2電路部
2a,3a...電路層
2b,3b...絕緣覆蓋層
100...薄膜電路板
Claims (5)
- 一種薄膜電路板,係具備:絕緣基材;與被設在前述絕緣基材上,使包含導電粉之導電性漿劑(paste)所形成之電路層以絕緣覆蓋層覆蓋而形成之至少1個的電路部其特徵為:前述電路層為包含具有90百分比以上之凝膠分率之樹脂成分;在前述導電性漿劑中,在將前述導電粉以及前述樹脂組成物之合計設為100質量百分比之場合下,含有前述導電粉70~95質量百分比之比重,含有前述樹脂組成物5~30質量百分比之比重。
- 如申請專利範圍第1項記載之薄膜電路板,其中前述絕緣覆蓋層係使紫外線硬化型抗蝕劑(resist)硬化後所形成之絕緣覆蓋層。
- 如申請專利範圍第1項記載之薄膜電路板,其中前述樹脂成分係將包含自由基聚合系樹脂組成物之樹脂組成物予以硬化而形成;前述自由基聚合系樹脂組成物係包含氨酯丙烯酸酯寡聚合物(urethane-acrylate-oligomer)、季戊四醇三丙烯酸酯以及季戊四醇四丙烯酸酯;前述樹脂組成物中之前述自由基聚合系樹脂組成物之含有率為70質量百分比以上。
- 如申請專利範圍第1、2、3項之任一項記載之薄膜電路板,其中前述導電粉係薄片狀導電粒子與球狀導電粒子之混合物。
- 如申請專利範圍第4項記載之薄膜電路板,其中前述球狀導電粒子之平均粒徑對前述薄片狀導電粒子之平均粒徑之比為0.1~1。
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