CN105900179A - 导电性胶带 - Google Patents

导电性胶带 Download PDF

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CN105900179A
CN105900179A CN201480072808.9A CN201480072808A CN105900179A CN 105900179 A CN105900179 A CN 105900179A CN 201480072808 A CN201480072808 A CN 201480072808A CN 105900179 A CN105900179 A CN 105900179A
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conductive
network
adhesive tape
polymeric matrix
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J·A·布罗德
C·克里希南
姜晶
D·扎米亚
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Cima Nanotech Israel Ltd
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Abstract

一种用于制备导电性胶带的方法，所述方法包括：(a)提供包含基材和限定了单元格的导电金属轨迹的网络的制品，所述单元格在基材上对可见光透明；(b)将导电轨迹的网络包埋在聚合物基质中，所述聚合物基质的表面上沉积了压敏粘合剂；以及(c)去除所述基材以形成导电性胶带。

Description

导电性胶带
相关申请的交叉引用
本申请要求2014年1月8日提交的美国临时申请系列第61/924,862的优先权。在先申请的公开内容被认为是本申请公开的部分(且通过引用纳入本文)。
技术领域
本发明涉及导电性胶带。
背景
已知并发现将导电性胶带用于电子器件应用，包括接地连接、静电耗散和EMI屏蔽。这些胶带通常采用在粘合性基质中的导电颗粒填料(例如颗粒或纤维)制备，例如在压敏粘合性(PSA)基质中的银或碳颗粒。其它胶带使用包埋在粘合性基质中的导电性粗布，例如无纺碳粗布。导电性胶带的有用性能属性包括薄层电阻、减少的厚度、减少的重量、适应性、形状因素和挠性。对于一些应用而言透明性也是需要的。
发明概述
描述了一种用于制备导电性胶带的方法，所述方法包括：(a)提供包含基材和在基材上的导电金属轨迹的网络的制品，所述导电金属轨迹限定了单元格(cell)，所述单元格对可见光透明；(b)将导电金属轨迹的网络包埋在聚合物基质中，所述聚合物基质的表面上沉积了压敏粘合剂；以及(c)去除所述基材以形成导电性胶带。
在一些实施方式中，所述方法包括(a)在导电轨迹网络上施加UV可聚合组合物；(b)在UV可聚合组合物上施加压敏粘合剂；以及(c)将UV可聚合物组合物暴露于紫外辐射以聚合所述组合物并形成聚合物基质，所述导电轨迹网络包埋在该聚合物基质中。在其它实施方式中，所述方法包括(a)在导电轨迹网络上施加UV可聚合组合物；(b)将UV可聚合组合物暴露于紫外辐射以聚合所述组合物并形成聚合物基质，所述导电轨迹网络包埋在该聚合物基质中；以及(c)在其中包埋了导电轨迹网络的聚合物基质上施加压敏粘合剂。
合适的金属轨迹的例子包括由至少部分连接的金属纳米颗粒，例如银纳米颗粒形成的轨迹。在一些实施方式中，导电轨迹的特征可在于已被一层或多层金属层电镀的金属基。例如，金属轨迹的特征可在于，被一层或多层金属(例如铜、锡或镍)电镀或无电镀覆的银基。电镀降低了导电性胶带的整体薄层电阻。在一些实施方式中，压敏粘合剂层是不导电的。
还描述了一种导电性胶带，其包括：(a)具有第一表面和第二表面的聚合物基质；(b)包埋在所述聚合物基质中的限定了单元格的导电金属轨迹的网络，所述单元格对可见光透明；以及(c)沉积在所述聚合物基质的第二表面上的压敏粘合剂。将导电金属轨迹的网络暴露在所述聚合物基质的第一表面上。
在一些实施方式中，所述导电金属轨迹包括至少部分连接的金属纳米颗粒，例如银纳米颗粒。所述聚合物基质可以是固化的(甲基)丙烯酸类树脂。胶带的可见光透光率可大于60％，大于70％或大于75％。胶带的薄层电阻可小于10欧姆/平方米，小于1欧姆/平方米，或小于0.1欧姆/平方米。胶带的整体厚度可小于50μm，小于30μm，或小于15μm。所述压敏粘合剂层本身可以是不导电的。
在附图和以下描述中详细说明了本发明的一种或多种实施方式。本发明的其他特征、目的和优势通过描述、附图以及权利要求书将是显而易见的。
附图说明
图1是透明的导电胶带的截面图。
不同附图中的相同附图标记表示相同的元件。
发明详述
图1是透明的导电胶带10的截面图。胶带10包括透明的导电网络20、固化的树脂层(聚合物基质)30和压敏粘合剂(PSA)层40。PSA层40形成了胶带的粘合性表面。如上所述，“透明的”是指对可见光辐射透明。胶带10的相对表面是具有暴露的导电网络的平坦导电性表面。PSA层40可任选地具有用于运输和处理的剥离衬垫。胶带的可见光辐射透光率可大于60％，优选大于70％或优选大于75％。胶带的薄层电阻可小于10欧姆/平方米，优选小于1欧姆/平方米，或最优选小于0.1欧姆/平方米。胶带的整体厚度可小于50μm，小于30μm，或小于15μm。胶带可以是的柔韧的，例如可将胶带辊成非平面构造而不显著损失导电性。柔韧性也使得胶带能符合非平面表面。胶带可以是各种尺寸的，从片状到条状到卷状都可以。
导电网络20是透明的金属轨迹导电网络。金属轨迹网络可以是对电持续传导的并且限定了对可见光(即可见辐射)透明的单元格。网络和由所述网络限定的单元格的形状(例如图案)可以是规则的、不规则的或随机的。有用的网络可由自组装成透明的导电网络轨迹和单元格的金属，例如银的纳米颗粒形成，如美国专利第7,601,406号所述，所述专利通过引用纳入本文。这样的网络包括由至少部分连接的金属纳米颗粒形成的轨迹以提供导电性。其它有用的导电网络包括由导电油墨通过印刷工艺沉积的网络、由卤化银乳液图案化暴露在辐射中并随后显影而形成的网络、以及由导电颗粒沉积成基材中凹槽的预成形的图案而形成的网络。
可在聚合物基材，例如聚酯膜(如PET)上形成所述网络，如美国专利申请公开第2011/0273085号所述，对于转移工艺而言所述聚合物基材可以是牺牲基材，所述美国专利申请公开转让给了与本申请同样的受让人并且通过引入纳入本文。市售的透明导电网络膜的例子是Sante FS100 EMI屏蔽膜和SanteFS200接触膜(美国明尼苏达州圣保罗市的西玛纳米技术公司(CimaNanoTech,St.Paul,MN))。如美国专利第8,105,472号和美国专利申请公开第2011/0003141号所述，所述导电网络一旦形成，其可进一步用导电金属电镀或无电镀覆以降低薄层电阻，上述两个文件都被转让给了与本申请相同的受让人，并通过引用纳入本文。合适的电镀或无电镀覆的导电金属的例子包括铜、镍或锡。市售的电镀导电网络膜的例子是FS100-LR-1N EMI屏蔽膜(美国明尼苏达州圣保罗市的西玛纳米技术公司)。可通过将基材和导电网络浸没在常规无电镀覆浴中进行无电镀覆，所述无电镀覆浴是例如含有购自罗门哈斯电子材料公司(Rohm and Haas Electronic Materials)的Solderon ST300的那些。如下文所述，导电网络的电镀和无电镀覆也可有助于将所述网络从原始基材上转移至新基材的工艺。
将导电网络20包埋在固化的树脂层(聚合物基质)30中，除了与牺牲基材相连的导电网络的表面之外，所述表面之后会被暴露并通常可与固化的树脂层的表面共平面。固化的树脂层可由能被涂覆到导电网络上和支撑基材的可固化的(例如可聚合的)树脂形成，随后通过固化形成固化的树脂层。固化的树脂层所需的性质包括能形成自支撑(例如自立式)膜、挠性、适应性、可拉伸性(即膜是弹性的)、与导电网络和PSA层的粘合性、透明度、和固化后非粘性表面。优选的可聚合树脂是光可固化树脂，例如含有光引发剂的并可用可见波长或UV波长固化的树脂。丙烯酸类和甲基丙烯酸类(统称为“(甲基)丙烯酸类”)树脂或它们的组合可用于形成所述固化的树脂层，一个例子是Unidic V 9510丙烯酸树脂(美国新泽西州派西派尼市的DIC公司(DIC Corp.,Parsippany,NJ))。固化的树脂层的厚度可小于30μm，小于20μm，或小于10μm。
PSA层40可由各种压敏粘合剂形成。PSA可作为剥离膜上预成形的粘合剂提供并准备用于层叠体，或者它们可由涂覆在固化的树脂层上的溶液形成。PSA层的厚度可小于30μm，小于20μm，或小于10μm。PSA层优选是对可见光透明的。优选的PSA常用于电子器件，一个例子是3M双层涂覆胶带9019(美国明尼苏达州圣保罗市的3M公司(3M,St.Paul,MN))。
导电胶带10的形成方法包括以下步骤：在牺牲基材上提供透明的导电网络，在含有导电网络的牺牲基材的表面上涂覆或层叠可固化的树脂层，例如UV可聚合的组合物，在可固化的树脂层上涂覆或层叠PSA层，固化所述可固化的树脂层，以及移除牺牲材料以形成完成的导电胶带。任选地，可在层叠PSA层的步骤之前固化所述可固化的树脂层。
层叠步骤可使用常规层叠技术，例如施压和/或加热。优选地，使用光可固化树脂和可见光辐射或UV辐射完成可固化的树脂层的固化。如果在PAS涂覆前完成固化，辐射可来自具有可固化树脂的表面或相对表面，即辐射通过牺牲材料，所述牺牲材料可对使用的波长透明。如果在PSA涂覆之后完成固化，优选地，辐射可通过牺牲基材进行而不是来自PSA表面。整个加工步骤中，可使用常用的载体膜、保护性膜和剥离膜以促进加工，例如辊到辊加工。
本文所述的导电胶带可用于各种电子器件和应用。例子包括EMI屏蔽、天线，以及提供接地通路或形成电连接。在使用中，将一片导电胶带切割成所需尺寸，将胶带的粘性表面按压到电子部件或器件上，以及使用常规技术例如导电箔或焊接由胶带的暴露的非粘表面形成电连接。对于一些应用，例如天线，可在与电子器件连接之前或之后，使用常规技术例如激光烧蚀或化学蚀刻在导电网络上形成图案。
实施例
使用两步法，电镀一片由在PET基材(购自西玛纳米技术公司的SanteFS200接触膜)上的自组装银纳米颗粒形成的约13×23cm的透明导电膜。首先，通过将电极连接至样品，随后将样品浸没在包括Copper Gleam 125T-2(美国马萨诸塞州马耳波罗市的罗门哈斯电子材料公司)的浴中并使用制造商的说明完成电解铜镀覆。在室温下以0.1A电镀20分钟，随后以0.5A电镀25分钟来完成电镀。在包含Nickal PC-3(罗门哈斯电子材料公司)的浴中使用电解镍镀覆并使用制造商的说明完成遮蔽铜镀覆的红色色调的第二镀覆步骤。在室温下使用0.1A电镀20分钟完成所述镀覆。
随后经电镀的膜涂覆UV可固化树脂(购自美国新泽西州派西派尼市的DIC公司的Unidic V 9510丙烯酸树脂)，涂覆在具有导电网络的表面上，湿厚度为24um。随后使用GHQ-320 PR3层压机以300mm/分钟将压敏粘合剂(购自美国明尼苏达州圣保罗市的3M公司的3M双层涂覆胶带9019)层压至UV树脂涂层上，使得剥离衬垫连接到PSA的暴露粘性侧。在融合UV固化***(美国马里兰州盖瑟斯堡市的融合UV***公司)中，H灯泡、以6英寸/分钟、功率接近0.207J/cm2固化UV树脂层。通过PET基材完成固化(即使得层状膜与具有PSA层的表面相反的表面暴露于UV辐射)。一旦固化完成，将PET基材剥离，从而暴露具有导电网络的表面。
得到的膜是挠性的，即其可被卷起和解绕而不会改变薄层电阻。经测试，所述膜的薄层电阻为0.04-0.05欧姆/平方米(Loresta-GP MCP T610 4点探针，购自弗吉尼亚州切萨皮克市的三菱化学公司)。透明度为73％，用日本电色株式会社(Nippon Denshoku)(日本)雾度计，NDH5000型，使用ASTM1003测试。
描述了本发明的许多实施方式。然而，应理解可进行各种改进而不背离本发明的精神和范围。因此，其他实施方式落在本文权利要求书的范围内。

Claims (19)

1.一种用于制备导电性胶带的方法，所述方法包括：
(a)提供包含基材和在基材上的导电金属轨迹的网络的制品，所述导电金属轨迹限定了单元格，所述单元格对可见光透明；
(b)将导电轨迹的网络包埋在聚合物基质中，所述聚合物基质的表面上沉积了压敏粘合剂；以及
(c)去除所述基材以形成所述导电性胶带。
2.如权利要求1所述的方法，该方法包括：
(a)在导电轨迹的网络上施加UV可聚合组合物；
(b)在UV可聚合组合物上施加压敏粘合剂；以及
(c)将所述UV可聚合物组合物暴露于紫外辐射以聚合所述组合物并形成在其中包埋了导电轨迹网络的聚合物基质。
3.如权利要求1所述的方法，该方法包括：
(a)在导电轨迹的网络上施加UV可聚合组合物；
(b)将所述UV可聚合物组合物暴露于紫外辐射以聚合所述组合物并形成在其中包埋了导电轨迹网络的聚合物基质；以及
(c)在所述于其中包埋了导电轨迹网络的聚合物基质上施加压敏粘合剂。
4.如权利要求1所述的方法，其特征在于，所述金属轨迹包括金属基和在所述金属基上至少一层电镀或无电镀覆的金属层。
5.如权利要求1所述的方法，其特征在于，所述轨迹包括至少部分连接的金属纳米颗粒。
6.一种导电胶带，其根据权利要求1所述的方法制备。
7.一种导电胶带，其包含：
(a)具有第一表面和第二表面的聚合物基质；
(b)包埋在所述聚合物基质中的限定了单元格的导电金属轨迹的网络，所述单元格对可见光透明；以及
(c)沉积在所述聚合物基质的第二表面上的压敏粘合剂，
其中，将导电金属轨迹的网络暴露在所述聚合物基质的第一表面上。
8.如权利要求7所述的导电胶带，其特征在于，所述导电金属轨迹包含至少部分连接的金属纳米颗粒。
9.如权利要求8所述的导电胶带，其特征在于，所述金属纳米颗粒包括银纳米颗粒。
10.如权利要求7所述的导电胶带，其特征在于，所述聚合物基质包括固化的(甲基)丙烯酸类树脂。
11.如权利要求7所述的导电胶带，其特征在于，所述胶带的可见光透明度大于60％。
12.如权利要求7所述的导电胶带，其特征在于，所述胶带的可见光透明度大于70％。
13.如权利要求7所述的导电胶带，其特征在于，所述胶带的可见光透明度大于75％。
14.如权利要求7所述的导电胶带，其特征在于，所述胶带的薄层电阻小于10欧姆/平方米。
15.如权利要求7所述的导电胶带，其特征在于，所述胶带的薄层电阻小于1欧姆/平方米。
16.如权利要求7所述的导电胶带，其特征在于，所述胶带的薄层电阻小于0.1欧姆/平方米。
17.如权利要求7所述的导电胶带，其特征在于，所述胶带的整体厚度小于50μm。
18.如权利要求7所述的导电胶带，其特征在于，所述胶带的整体厚度小于30μm。
19.如权利要求7所述的导电胶带，其特征在于，所述胶带的整体厚度小于15μm。
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