TWI427357B - Method for fabricating display panel - Google Patents
Method for fabricating display panel Download PDFInfo
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- TWI427357B TWI427357B TW099121471A TW99121471A TWI427357B TW I427357 B TWI427357 B TW I427357B TW 099121471 A TW099121471 A TW 099121471A TW 99121471 A TW99121471 A TW 99121471A TW I427357 B TWI427357 B TW I427357B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
Description
本發明是有關於一種顯示面板的製造方法，且特別是有關於一種具有簡化步驟之顯示面板的製造方法。 The present invention relates to a method of fabricating a display panel, and more particularly to a method of fabricating a display panel having simplified steps.
隨著顯示科技的日益進步，人們藉著顯示器的輔助可使生活更加便利，為求顯示器輕、薄之特性，促使平面顯示器(flat panel display,FPD)成為目前的主流。近年來，由於各種顯示技術不斷地蓬勃發展，在經過持續地研究開發之後，如電泳顯示器、液晶顯示器、電漿顯示器、有機發光二極體顯示器等產品，已逐漸地商業化並應用於各種尺寸以及各種面積的顯示裝置。隨著可攜式電子產品的日益普及，電子紙(e-paper)、電子書(e-book)等已逐漸受到市場的關注。 With the advancement of display technology, people can make life more convenient by the aid of the display. In order to make the display light and thin, the flat panel display (FPD) has become the mainstream. In recent years, as various display technologies continue to flourish, after continuous research and development, products such as electrophoretic displays, liquid crystal displays, plasma displays, and organic light-emitting diode displays have been gradually commercialized and applied to various sizes. And display devices of various sizes. With the increasing popularity of portable electronic products, e-paper, e-book, etc. have gradually attracted market attention.
一般而言，習知用來作為電子紙、電子書的小尺寸顯示面板通常是藉由先將大片的下基板材料與大片的上基板材料分別裁切成所需的適當尺寸之後，分別將裁切後的一個下基板與一個上基板貼合形成顯示面板單元，之後再分別對顯示面板單元進行後續製程步驟以完成顯示面板。也就是說，習知的製造方法是採用切割後的上下基板進行片對片貼合，因此後續貼上其他膜層或進行封裝等製程都要針對每個顯示面板單元一一分別進行，造成同樣的製程步驟必須重複多次才能製作出顯示面板。如此一來，造成製 程時間拉長且無法批次作業，而使得成本無法進一步的降低。 In general, a small-sized display panel conventionally used as an electronic paper or an e-book is usually cut by separately cutting a large piece of the lower substrate material and a large piece of the upper substrate material into a desired appropriate size. The cut one lower substrate is bonded to one upper substrate to form a display panel unit, and then the display panel unit is separately subjected to a subsequent process step to complete the display panel. That is to say, the conventional manufacturing method uses the diced upper and lower substrates to perform the sheet-to-sheet bonding, so that subsequent processes of attaching other film layers or performing packaging are performed separately for each display panel unit, resulting in the same The process steps must be repeated multiple times to create a display panel. In this way The process time is lengthened and it is impossible to batch work, so the cost cannot be further reduced.
有鑑於此，本發明提供一種顯示面板的製造方法，其具有簡化的製程步驟。 In view of this, the present invention provides a method of manufacturing a display panel having a simplified process step.
本發明提出一種顯示面板的製造方法，其包括下列步驟。提供一下基板，下基板上具有多個顯示區域，且每一顯示區域內已形成有一畫素陣列。在下基板的每一顯示區域邊緣形成導電膠。提供多個上基板，且每一上基板上已經形成有一導電層以及一顯示層。於每一上基板中形成一接觸開口，以使上基板上的導電層暴露出來。分別將上基板貼附於下基板的顯示區域上，其中位於下基板上之導電膠填入上基板之接觸開口中以與導電層電性連接。分別於上基板與對應的顯示區域的周圍塗佈框膠材料。進行切割程序，以形成多個顯示面板。 The present invention provides a method of manufacturing a display panel comprising the following steps. A substrate is provided, the display substrate has a plurality of display areas, and a pixel array is formed in each display area. A conductive paste is formed on the edge of each display region of the lower substrate. A plurality of upper substrates are provided, and a conductive layer and a display layer are formed on each of the upper substrates. A contact opening is formed in each of the upper substrates to expose the conductive layer on the upper substrate. The upper substrate is respectively attached to the display area of the lower substrate, wherein the conductive adhesive on the lower substrate is filled in the contact opening of the upper substrate to be electrically connected to the conductive layer. A sealant material is applied to the periphery of the upper substrate and the corresponding display area, respectively. A cutting process is performed to form a plurality of display panels.
在本發明之一實施例中，上述於塗佈框膠材料之後，更包括分別在下基板的每一顯示區域的周邊形成驅動裝置。於形成驅動裝置之後，更包括於驅動裝置上形成保護膠材。 In an embodiment of the invention, after the coating of the sealant material, the driving device is further formed on the periphery of each display area of the lower substrate. After forming the driving device, the protective material is further formed on the driving device.
在本發明之一實施例中，上述在下基板的每一顯示區域邊緣形成導電膠之前，更包括對每一顯示區域中的畫素陣列進行測試程序。於進行測試程序之後，更包括對每一顯示區域進行清潔程序。 In an embodiment of the invention, before forming the conductive paste on the edge of each display area of the lower substrate, the method further includes performing a test procedure on the pixel array in each display area. After the test procedure, the cleaning procedure is also included for each display area.
在本發明之一實施例中，上述將上基板貼附於該下基板的顯示區域上的方法包括下列步驟：於下基板的顯示區域上形成膠層，其中膠層包括感壓膠、熱感膠、光感膠或是水膠；將上基板放置於下基板之顯示區域的膠層上；以及進行加壓貼合程序。於進行加壓貼合程序之後，更包括進行烘烤步驟。於進行烘烤步驟之後，更包括進行測試步驟。 In an embodiment of the invention, the method for attaching the upper substrate to the display area of the lower substrate comprises the steps of: forming a glue layer on the display area of the lower substrate, wherein the glue layer comprises pressure sensitive glue and thermal sensation Glue, light-sensitive adhesive or water-based glue; the upper substrate is placed on the adhesive layer of the display area of the lower substrate; and a pressure bonding process is performed. After the pressure bonding process is performed, the baking step is further included. After the baking step, the testing step is further included.
在本發明之一實施例中，上述之框膠材料包括熱固膠、感光膠或是感光後熱固膠。 In an embodiment of the invention, the sealant material comprises a thermosetting adhesive, a photosensitive adhesive or a photosensitive thermosetting adhesive.
在本發明之一實施例中，上述之顯示層包括電致變色顯示層、電泳顯示層或是膽固醇液晶層，其中電泳顯示層包括微膠囊型電泳顯示層或是微杯型電泳顯示層。 In an embodiment of the invention, the display layer comprises an electrochromic display layer, an electrophoretic display layer or a cholesteric liquid crystal layer, wherein the electrophoretic display layer comprises a microcapsule-type electrophoretic display layer or a microcup-type electrophoretic display layer.
在本發明之一實施例中，上述分別將上基板貼附於下基板之後，更包括分別於上基板上貼附阻隔層。 In an embodiment of the invention, after the upper substrate is attached to the lower substrate, the barrier layer is further attached to the upper substrate.
在本發明之一實施例中，上述之分別將上基板貼附於下基板的顯示區域上之步驟包括：(a)將一個上基板貼附於下基板的一個顯示區域上；以及(b)重複步驟(a)，依序將每一上基板貼附下基板之對應的顯示區域上。 In an embodiment of the invention, the step of attaching the upper substrate to the display area of the lower substrate respectively comprises: (a) attaching an upper substrate to a display area of the lower substrate; and (b) Step (a) is repeated, and each of the upper substrates is sequentially attached to the corresponding display area of the substrate.
在本發明之一實施例中，上述分別將上基板貼附於下基板的顯示區域上之步驟包括：先將上基板放置在上真空裝置上；將下基板放置在下真空裝置上；以及將上真空裝置及下真空裝置對位並且壓合，以使上基板貼附於下基板的顯示區域上。 In an embodiment of the invention, the step of respectively attaching the upper substrate to the display area of the lower substrate comprises: first placing the upper substrate on the upper vacuum device; placing the lower substrate on the lower vacuum device; and placing the upper substrate The vacuum device and the lower vacuum device are aligned and pressed to attach the upper substrate to the display area of the lower substrate.
在本發明之一實施例中，上述分別將上基板貼附於下 基板之後，更包括將多個阻隔層放置在上真空裝置上；將下基板放置在下真空裝置上；以及將上真空裝置及下真空裝置對位並且壓合，以使阻隔層分別貼附至位於下基板的上基板上。 In an embodiment of the invention, the upper substrate is attached to the lower substrate After the substrate, further comprising placing a plurality of barrier layers on the upper vacuum device; placing the lower substrate on the lower vacuum device; and aligning and pressing the upper vacuum device and the lower vacuum device to attach the barrier layers to the respective On the upper substrate of the lower substrate.
在本發明之一實施例中，上述分別將上基板貼附於下基板並且於上基板與對應的顯示區域的周圍塗佈框膠材料之後，更包括在下基板上全面地貼附阻隔層，以覆蓋上基板以及框膠材料；以及對阻隔層以及下基板進行切割程序，以形成顯示面板。於進行切割程序之後，更包括在每一顯示面板的周邊形成驅動裝置。於形成該驅動裝置之後，更包括於驅動裝置上形成保護膠材。 In an embodiment of the present invention, after the upper substrate is attached to the lower substrate and the sealant material is applied around the upper substrate and the corresponding display area, the barrier layer is further attached to the lower substrate. Covering the upper substrate and the sealant material; and performing a cutting process on the barrier layer and the lower substrate to form a display panel. After the cutting process is performed, the driving device is further formed on the periphery of each display panel. After forming the driving device, the protective device is further formed on the driving device.
在本發明之一實施例中，上述之下基板包括支撐基板以及位於支撐基板上之可撓式基板，且畫素陣列形成在可撓式基板上。於提供下基板之步驟之後，對下基板進行第一切割程序，以形成多個下基板單元，其中每一下基板單元上具有至少一個顯示區域。 In an embodiment of the invention, the lower substrate comprises a support substrate and a flexible substrate on the support substrate, and the pixel array is formed on the flexible substrate. After the step of providing the lower substrate, a first cutting process is performed on the lower substrate to form a plurality of lower substrate units each having at least one display area thereon.
本發明另提出一種顯示面板的製造方法，其包括下列步驟。提供一下基板，下基板上具有多個顯示區域，且每一顯示區域內已形成有一畫素陣列。在下基板的每一顯示區域邊緣形成導電膠。提供多個上基板，且每一上基板上已經形成有一導電層以及一顯示層。於每一上基板中形成接觸開口，以使上基板上的導電層暴露出來。將上基板貼附於下基板的顯示區域上，其中位於下基板上之導電膠填入上基板之接觸開口中以與導電層電性連接。在下基板上 全面地塗佈阻隔層。對阻隔層進行光罩曝光步驟，以使每一顯示區域上之阻隔層硬化，其中每一顯示區域周圍的阻隔層作為框膠。進行切割程序，以形成多個顯示面板。 The present invention further provides a method of manufacturing a display panel comprising the following steps. A substrate is provided, the display substrate has a plurality of display areas, and a pixel array is formed in each display area. A conductive paste is formed on the edge of each display region of the lower substrate. A plurality of upper substrates are provided, and a conductive layer and a display layer are formed on each of the upper substrates. A contact opening is formed in each of the upper substrates to expose the conductive layer on the upper substrate. The upper substrate is attached to the display area of the lower substrate, wherein the conductive adhesive on the lower substrate is filled in the contact opening of the upper substrate to be electrically connected to the conductive layer. On the lower substrate The barrier layer is fully coated. A mask exposure step is performed on the barrier layer to harden the barrier layer on each of the display regions, wherein the barrier layer around each display region acts as a sealant. A cutting process is performed to form a plurality of display panels.
在本發明之一實施例中，上述將上基板貼附於下基板的顯示區域上之步驟包括：先將上基板放置在上真空裝置上；將下基板放置在下真空裝置上；以及將上真空裝置及下真空裝置對位並且壓合，以使上基板貼附於下基板的顯示區域上。 In an embodiment of the invention, the step of attaching the upper substrate to the display area of the lower substrate comprises: first placing the upper substrate on the upper vacuum device; placing the lower substrate on the lower vacuum device; and placing the upper vacuum The device and the lower vacuum device are aligned and pressed to attach the upper substrate to the display area of the lower substrate.
在本發明之一實施例中，於進行切割程序之後，更包括在每一顯示面板的周邊形成驅動裝置。於形成驅動裝置之後，更包括於驅動裝置上形成保護膠材。 In an embodiment of the invention, after the cutting process is performed, the driving device is further formed on the periphery of each display panel. After forming the driving device, the protective material is further formed on the driving device.
本發明另提出一種顯示面板的製造方法，其包括下列步驟。提供下基板，下基板上具有多個顯示區域，且每一顯示區域內已形成有畫素陣列。在下基板的每一顯示區域邊緣形成一導電膠。提供多個上基板，且每一上基板上已經形成有一導電層以及一顯示層。於每一上基板中形成一接觸開口，以使上基板上的導電層暴露出來。分別將上基板貼附於下基板的顯示區域上，其中位於下基板上之導電膠填入上基板之接觸開口中以與導電層電性連接。進行一切割程序，以形成多個顯示面板。 The present invention further provides a method of manufacturing a display panel comprising the following steps. A lower substrate is provided, and the lower substrate has a plurality of display regions, and a pixel array is formed in each display region. A conductive paste is formed on the edge of each display area of the lower substrate. A plurality of upper substrates are provided, and a conductive layer and a display layer are formed on each of the upper substrates. A contact opening is formed in each of the upper substrates to expose the conductive layer on the upper substrate. The upper substrate is respectively attached to the display area of the lower substrate, wherein the conductive adhesive on the lower substrate is filled in the contact opening of the upper substrate to be electrically connected to the conductive layer. A cutting process is performed to form a plurality of display panels.
基於上述，本發明之顯示面板的製造方法藉由將多個具有導電層、顯示層的上基板貼附於在大片下基板的顯示區域上，再連續性地進行後續製程步驟，之後才進行切割步驟以形成多個顯示面板。因此，在進行切割程序形成多 個顯示面板之前，進行一次性的製程步驟即可同時處理貼附有多個上基板之下基板，因而有助於簡化製程，並節省製程時間及增加產能。 Based on the above, the manufacturing method of the display panel of the present invention is performed by attaching a plurality of upper substrates having a conductive layer and a display layer to the display area of the large-substrate substrate, and then performing subsequent processing steps continuously, and then performing the cutting. Steps to form a plurality of display panels. Therefore, the cutting process is formed more Before the display panel, a one-time process step can simultaneously process the substrate with a plurality of upper substrates attached, thereby facilitating the process, saving process time and increasing productivity.
為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 In order to make the above features and advantages of the present invention more obvious, the following The embodiments are described in detail with reference to the accompanying drawings.
本發明之顯示面板的製造方法主要是藉由在一片大 片下基板上先形成元件陣列結構，並將已切割之多個具有 顯示層的上基板一一對準並貼附於大片的下基板上；在對 貼附有多個上基板之下基板進行檢測、封裝等步驟之後， 進行切割步驟以形成多個顯示面板。本發明之顯示面板的 製造方法可以同時對貼附有多個上基板之下基板進行連續 的製程步驟而完成多個顯示面板的批次製作，因此可有助 於簡化製程並節省時間。上述製作完成的顯示面板可依顯 示層的不同而為電致變色顯示面板(electrochromic display panel)、電泳顯示面板(electrophoretic display panel)或 是膽固醇液晶顯示面板(cholesterol liquid crystal display panel)。 The manufacturing method of the display panel of the present invention is mainly by a large one An element array structure is formed on the underlying substrate, and the plurality of cuts have The upper substrate of the display layer is aligned and attached to the large substrate of the large piece; After attaching a plurality of substrates under the upper substrate for detection, packaging, etc., A cutting step is performed to form a plurality of display panels. Display panel of the present invention The manufacturing method can simultaneously perform continuous bonding on a substrate on which a plurality of upper substrates are attached Process steps to complete batch production of multiple display panels, so it can help Simplify the process and save time. The above completed display panel can be displayed The electrochromic display panel (electrochromic display) Panel), electrophoretic display panel or Cholesterol liquid crystal display Panel).
接下來，進一步以流程圖搭配立體圖或剖面圖的方式來說明本發明之實施例。須注意的是，以下所述之流程主要是為了詳細說明本發明在實際應用時貼合上下基板並切割成多個顯示面板的步驟順序，以使熟習此項技術者能夠據以實施，但並非用以限定本發明之範圍。至於其它構件的配置、形成方式及形成順序，均可依所屬技術領域中具有通常知識者所知的技術製作，而不限於下述實施例所述。 Next, an embodiment of the present invention will be further described in the form of a flowchart in conjunction with a perspective view or a sectional view. It should be noted that the flow described below is mainly for explaining in detail the sequence of steps in which the present invention is applied to the upper and lower substrates and cut into a plurality of display panels in practical applications, so that those skilled in the art can implement the same, but not It is intended to define the scope of the invention. The arrangement, formation manner, and order of formation of other members can be made according to techniques known to those skilled in the art, and are not limited to the embodiments described below.
圖1是依照本發明之第一實施例之一種顯示面板的製造方法的步驟流程圖。圖2A至圖2D是依照本發明之第一實施例之顯示面板的製造方法的立體示意圖。圖3A至圖3J是依照本發明之第一實施例之顯示面板的製造方法的剖面示意圖。 1 is a flow chart showing the steps of a method of manufacturing a display panel in accordance with a first embodiment of the present invention. 2A to 2D are perspective views of a method of manufacturing a display panel in accordance with a first embodiment of the present invention. 3A to 3J are schematic cross-sectional views showing a method of manufacturing a display panel in accordance with a first embodiment of the present invention.
請參照圖1、圖2A及圖3A，進行步驟S102，提供下 基板200，下基板200上具有多個顯示區域202，且每一個顯示區域202內已形成有畫素陣列204。下基板200例如是硬質基板(rigid substrate)，如玻璃基板，或是可撓式基板，如塑膠基板。在一實施例中，畫素陣列204包括多個主動元件(如薄膜電晶體)、多條掃描線、多條資料線以及多個畫素電極。為了方便說明，圖2A及圖3A所繪示之畫素陣列204結構省略上述構件的細節，然任何具有本發明所屬技術領域之通常知識者，理應可判斷被省略之構件的實際位置與作用，故於此便不再逐一說明。而且，圖2A中是以4個顯示區域202為例來進行說明，但下基板200上只要具有多個顯示區域202而可貼附多個上基板並同時對多個上基板進行連續製程即可，本發明並不限定顯示區域202的數量。 Referring to FIG. 1 , FIG. 2A and FIG. 3A , step S102 is performed, and the following is provided. The substrate 200 has a plurality of display regions 202 on the lower substrate 200, and a pixel array 204 has been formed in each of the display regions 202. The lower substrate 200 is, for example, a rigid substrate such as a glass substrate or a flexible substrate such as a plastic substrate. In one embodiment, the pixel array 204 includes a plurality of active elements (such as thin film transistors), a plurality of scan lines, a plurality of data lines, and a plurality of pixel electrodes. For convenience of description, the pixel array 204 structure illustrated in FIGS. 2A and 3A omits the details of the above-described components, and any person having ordinary knowledge in the technical field to which the present invention pertains should be able to judge the actual position and function of the omitted members. Therefore, it will not be explained one by one. In addition, in FIG. 2A, four display areas 202 are taken as an example. However, as long as the plurality of display areas 202 are provided on the lower substrate 200, a plurality of upper substrates can be attached and a plurality of upper substrates can be continuously processed. The present invention does not limit the number of display areas 202.
進行步驟S104，在完成下基板200上畫素陣列204的製作之後，可選擇性地對每一個顯示區域202中的畫素陣列204進行測試程序。測試程序例如是使用自動光學檢測(auto optic inspection,AOI)及其他檢測程序等方法對下基板200上的畫素陣列204結構進行檢視，以辨識是否存在有缺陷，而有助於避免因下基板200有缺陷而造成後續預形成之顯示面板報廢的情況發生。 Step S104 is performed to perform a test procedure on the pixel array 204 in each display area 202 after the fabrication of the pixel array 204 on the lower substrate 200 is completed. The test program, for example, uses a method such as auto optic inspection (AOI) and other detection programs to examine the structure of the pixel array 204 on the lower substrate 200 to identify whether there is a defect and to help avoid the lower substrate. 200 is defective, causing the subsequent pre-formed display panel to be scrapped.
進行步驟S106，於進行完步驟S104的測試程序之 後，可選擇性地對每一個顯示區域202進行清潔程序，以徹底清除下基板200上殘留之顆粒或雜質，並提升製程中的潔淨度而確保後續預形成之顯示面板的品質。 Going to step S106, after performing the test procedure of step S104 Thereafter, each of the display regions 202 can be selectively cleaned to completely remove particles or impurities remaining on the lower substrate 200, and the cleanliness in the process is improved to ensure the quality of the subsequently preformed display panel.
請參照圖1與圖3B，進行步驟S108，在下基板200的每一個顯示區域202邊緣形成導電膠206。導電膠206例如是銀膠或可供導電的其他材質，以便後續可將外部驅動電路的訊號通過導電膠206傳送至上基板的電極。導電膠206的形成方法例如可以使用多針點膠設備，以同時在多個顯示區域202的邊緣形成導電膠206。在此說明的是，本實施例中是以在每一個顯示區域202邊緣的角落形成導電膠206為例來進行說明，但本發明並不限於此，導電膠206的形成位置、數量並不限定於本實施例中所述。 Referring to FIG. 1 and FIG. 3B, step S108 is performed to form a conductive paste 206 on the edge of each display region 202 of the lower substrate 200. The conductive paste 206 is, for example, silver paste or other material for conducting electricity, so that the signal of the external driving circuit can be subsequently transmitted to the electrode of the upper substrate through the conductive paste 206. The method of forming the conductive paste 206 may, for example, use a multi-needle dispensing device to simultaneously form the conductive paste 206 at the edges of the plurality of display regions 202. It is to be noted that in the present embodiment, the conductive paste 206 is formed at a corner of the edge of each display region 202 as an example. However, the present invention is not limited thereto, and the position and number of the conductive adhesive 206 are not limited. As described in this embodiment.
另一方面，請參照圖1與圖3C，進行步驟S110，提供多個上基板208，且每一個上基板208上已經形成有導電層210以及顯示層212。上基板208例如是可撓式基板(flexible substrate)，如聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)等塑膠基板。導電層210的材料可以採用透明導電材料，以作為電極之用。上述之透明導電材料例如是銦錫氧化物(indium tin oxide,ITO)、銦鋅氧化物(indium zinc oxide,IZO)、氧化鋁鋅(Al doped ZnO,AZO)、銦鎵鋅氧化物(Indium-Gallium-Zinc Oxide,IGZO)、摻鎵氧化鋅(Ga doped zinc oxide,GZO)、鋅錫氧化物(Zinc-Tin Oxide,ZTO)、氧化銦(In2O3)、氧化鋅(ZnO)、或二氧化錫(SnO2)等。顯示層212例如是電致變色顯示層、電泳顯示 層或是膽固醇液晶層，其中電泳顯示層可以是微膠囊型(microcapsule)電泳顯示層或是微杯型(microcup)電泳顯示層。 On the other hand, referring to FIG. 1 and FIG. 3C, step S110 is performed to provide a plurality of upper substrates 208, and a conductive layer 210 and a display layer 212 have been formed on each of the upper substrates 208. The upper substrate 208 is, for example, a flexible substrate such as a plastic substrate such as polyethylene terephthalate (PET). The material of the conductive layer 210 may be a transparent conductive material for use as an electrode. The above transparent conductive material is, for example, indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (Aldoped ZnO, AZO), indium gallium zinc oxide (Indium- Gallium-Zinc Oxide, IGZO), Ga doped zinc oxide (GZO), Zinc-Tin Oxide (ZTO), Indium oxide (In 2 O 3 ), Zinc Oxide (ZnO), or Tin dioxide (SnO 2 ) and the like. The display layer 212 is, for example, an electrochromic display layer, an electrophoretic display layer or a cholesteric liquid crystal layer, wherein the electrophoretic display layer may be a microcapsule electrophoretic display layer or a microcup electrophoretic display layer.
請參照圖1與圖3D，進行步驟S112，於每一個上基板208中形成接觸開口214，以使上基板208上的導電層210暴露出來。在此說明的是，每一個上基板208的接觸開口214例如是對應於下基板200上每一個顯示區域202邊緣的導電膠206而配置。因此，在本實施例中，接觸開口214是配置於每一個上基板208邊緣的角落。 Referring to FIG. 1 and FIG. 3D, step S112 is performed to form a contact opening 214 in each of the upper substrates 208 to expose the conductive layer 210 on the upper substrate 208. It is explained here that the contact opening 214 of each of the upper substrates 208 is configured, for example, by the conductive paste 206 corresponding to the edge of each of the display regions 202 on the lower substrate 200. Therefore, in the present embodiment, the contact opening 214 is a corner disposed at the edge of each of the upper substrates 208.
之後，將上述步驟S108所形成之下基板200及步驟S112所形成之上基板208進行組裝以及其他處理步驟以製作出多個顯示面板，其細節將詳述如下。請參照圖1、圖2B及圖3E，分別將上基板208貼附於下基板200的顯示區域202上，其中位於下基板202上之導電膠206填入上基板208之接觸開口214中以與導電層210電性連接。如圖3E所示，由於上基板208的接觸開口214與下基板200的導電膠206是相對應配置的，因此在使上基板208對準貼附於下基板200時，導電膠206會填入接觸開口214。實務上，導電膠206還可進一步與外部的驅動電路(未繪示)電性連接，因而可將外部驅動電路的訊號通過導電膠206傳送至上基板208的導電層210。 Thereafter, the lower substrate 200 formed in the above step S108 and the upper substrate 208 formed in the step S112 are assembled and other processing steps are performed to fabricate a plurality of display panels, the details of which will be described in detail below. Referring to FIG. 1 , FIG. 2B and FIG. 3E , the upper substrate 208 is respectively attached to the display area 202 of the lower substrate 200 , wherein the conductive paste 206 on the lower substrate 202 is filled in the contact opening 214 of the upper substrate 208 to The conductive layer 210 is electrically connected. As shown in FIG. 3E, since the contact opening 214 of the upper substrate 208 is disposed corresponding to the conductive paste 206 of the lower substrate 200, the conductive paste 206 is filled in when the upper substrate 208 is aligned and attached to the lower substrate 200. Contact opening 214. In practice, the conductive paste 206 can be further electrically connected to an external driving circuit (not shown), so that the signal of the external driving circuit can be transmitted to the conductive layer 210 of the upper substrate 208 through the conductive paste 206.
在一實施例中，分別將上基板208貼附於下基板200的顯示區域202上之方法可以藉由下列步驟而達成。先進行步驟S114a，將一個上基板208貼附於下基板200的一 個顯示區域202上。之後，步驟S114b，重複進行多次步驟S114a，以依序將每一個上基板208貼附下基板200之對應的顯示區域202上。 In an embodiment, the method of attaching the upper substrate 208 to the display region 202 of the lower substrate 200, respectively, can be achieved by the following steps. First, step S114a is performed to attach one upper substrate 208 to one of the lower substrate 200. Display area 202. Thereafter, in step S114b, step S114a is repeated a plurality of times to sequentially attach each of the upper substrates 208 to the corresponding display area 202 of the lower substrate 200.
如圖3E所示，可以藉由在下基板200的顯示區域202上形成膠層216，接著將多個上基板208放置於下基板200之顯示區域202的膠層216上，並進行加壓貼合程序，因而分別將上基板208分別貼附於下基板200的顯示區域202上。膠層216例如是感壓膠(pressure sensitive adhesive,PSA)、熱感膠、光感膠或是水膠。而膠層216的形成方法可以是利用貼合、塗佈(coating)或沉積(deposition)的方式在下基板200的顯示區域202上形成一層膠材。 As shown in FIG. 3E, a glue layer 216 can be formed on the display area 202 of the lower substrate 200, and then a plurality of upper substrates 208 are placed on the glue layer 216 of the display area 202 of the lower substrate 200, and pressure bonding is performed. The program thus attaches the upper substrate 208 to the display area 202 of the lower substrate 200, respectively. The glue layer 216 is, for example, a pressure sensitive adhesive (PSA), a heat sensitive adhesive, a photosensitive adhesive or a water gel. The adhesive layer 216 may be formed by forming a layer of glue on the display area 202 of the lower substrate 200 by means of lamination, coating or deposition.
具體而言，上述加壓貼合程序例如是使用滾輪218對放置於下基板200之顯示區域202的膠層216上之上基板208加壓，並可依據膠材的不同而選擇性地進行加熱或照光程序使上基板208可貼合於膠層216上。而且利用滾輪218壓合的方式也可以是直接滾貼，或是先滾貼後再進行加熱或照光程序，或是在滾貼的同時進行加熱或照光程序以完成同步性貼合。當膠層216為感壓膠(PSA)時，可以利用滾輪218直接加壓以將上基板208貼附於下基板200的顯示區域202上。當膠層216為熱感膠時，可以直接加熱滾輪218對上基板208及下基板200進行加壓貼合程序，或者是可以利用加熱板等方式加熱下基板200並利用滾輪218進行加壓貼合程序，也可以同時加熱滾輪218及加熱下基板200來進行加壓貼合程序，以將上基板208一一貼 附於下基板200的顯示區域202上。當然，使用熱感膠作為膠層216時，還可以選擇先將上基板208全部冷貼於下基板200之顯示區域202上，之後再利用加熱滾輪218對多個上基板208進行一次性的壓合，以使上基板208貼附於下基板200上。當膠層216為光感膠時，可以一邊照光一邊使用滾輪218將上基板208一一壓合貼附於下基板200上；或是先使用滾輪218將上基板208全部貼上下基板200後，再進行一次性的照光同時使多個上基板208能夠貼附黏著於下基板200的顯示區域202上。 Specifically, the pressure bonding process is performed by, for example, pressing the upper substrate 208 on the adhesive layer 216 of the display region 202 of the lower substrate 200 by using the roller 218, and selectively heating according to the difference of the rubber material. Or the illumination process allows the upper substrate 208 to conform to the glue layer 216. Moreover, the method of pressing the roller 218 can also be a direct roll, or a heating or illuminating process after the roll is applied, or a heating or illuminating process can be performed while rolling to complete the synchronous fit. When the glue layer 216 is a pressure sensitive adhesive (PSA), the roller 218 can be directly pressurized to attach the upper substrate 208 to the display area 202 of the lower substrate 200. When the adhesive layer 216 is a thermal adhesive, the upper substrate 208 and the lower substrate 200 may be directly heated and heated by the roller 218, or the lower substrate 200 may be heated by a heating plate or the like and pressed by the roller 218. In the process, the roller 218 can be simultaneously heated and the lower substrate 200 can be heated to perform a pressure bonding process to paste the upper substrate 208 one by one. Attached to the display area 202 of the lower substrate 200. Of course, when the thermal adhesive is used as the adhesive layer 216, the upper substrate 208 may be cold-applied to the display area 202 of the lower substrate 200, and then the plurality of upper substrates 208 may be pressed once by the heating roller 218. The upper substrate 208 is attached to the lower substrate 200. When the adhesive layer 216 is a light-sensitive adhesive, the upper substrate 208 may be pressed and attached to the lower substrate 200 by using the roller 218 while being illuminated, or the upper substrate 208 may be attached to the upper and lower substrates 200 by using the roller 218. The plurality of upper substrates 208 can be attached and adhered to the display region 202 of the lower substrate 200 while performing one-time illumination.
藉由多片對大片(multiple chips to sheet)的貼合製程，將已切割之多個具有導電層210、顯示層212的上基板208貼附於大片的下基板200的顯示區域202上，再同時對貼附有多個上基板208之下基板200連續性地進行後續製程步驟，之後才進行切割步驟以形成多個顯示面板。因此，在進行切割程序形成多個顯示面板之前，進行一次性的製程步驟即可同時處理貼附有多個上基板208之下基板200，因而有助於簡化製程，並可以批次的方式完成多個顯示面板的製作。 The plurality of cut upper substrates 208 having the conductive layer 210 and the display layer 212 are attached to the display area 202 of the large lower substrate 200 by a plurality of multiple chips to sheet bonding processes, and then At the same time, the subsequent process steps are continuously performed on the substrate 200 to which the plurality of upper substrates 208 are attached, and then the cutting step is performed to form a plurality of display panels. Therefore, before performing the cutting process to form a plurality of display panels, the one-time process step can be performed to simultaneously process the substrate 200 to which the plurality of upper substrates 208 are attached, thereby facilitating the process and can be completed in batches. Production of multiple display panels.
值得一提的是，以上實施例是以在下基板200的顯示區域202上形成膠層216之後，將多個上基板208放置於膠層216上為例來進行說明，但本發明並不限於此。在另一實施例中，也可以是使膠層216形成於多個上基板208上，之後再藉由類似上述之方式將具有膠層216之上基板208分別貼附於下基板200的顯示區域202上。 It should be noted that the above embodiment is described by taking an example of placing a plurality of upper substrates 208 on the adhesive layer 216 after forming the adhesive layer 216 on the display region 202 of the lower substrate 200, but the present invention is not limited thereto. . In another embodiment, the adhesive layer 216 may be formed on the plurality of upper substrates 208, and then the substrate 208 having the adhesive layer 216 is respectively attached to the display area of the lower substrate 200 by a method similar to the above. 202.
此外，於進行加壓貼合程序之後，還可以選擇性地依序進行烘烤步驟，以去除多餘的水氣，使上基板208能夠穩固黏著於下基板200上。於進行烘烤步驟之後，更包括進行測試步驟，其例如是對相貼合之上基板208及下基板200的電路進行電性測試，而確保每一個上基板208在貼附於下基板200上時皆對準其相對應之顯示區域202。 In addition, after the pressure bonding process is performed, the baking step may be selectively performed in order to remove excess moisture, so that the upper substrate 208 can be firmly adhered to the lower substrate 200. After the baking step, the testing step is further included, for example, electrically testing the circuits of the upper substrate 208 and the lower substrate 200, and ensuring that each of the upper substrates 208 is attached to the lower substrate 200. The time is aligned with its corresponding display area 202.
請參照圖1及圖3F，進行步驟S116，在分別將上基板208貼附於下基板200之後，還可選擇性地分別於上基板208上貼附阻隔層220，以進一步有效阻隔水氣以及氧氣侵入至後續預形成之顯示面板中。於上基板208上貼附阻隔層220的方法可以採用類似於前述將上基板208分別貼附於下基板200的顯示區域202上的方式來進行加壓貼合程序。也就是說，可以利用滾輪222對放置於上基板208上的阻隔層220加壓而使其貼合。阻隔層220例如是使用能夠阻水阻氣的材料，其例如是有機材料或無機材料薄膜、玻璃或是其他的水氣阻隔材料。其中有機材料例如是聚對苯二甲酸乙二酯(PET)、聚丙烯(polypropylene)、聚苯乙烯(polystyrene)等。無機材料例如是金屬氧化物、金屬氮化物、金屬氮氧化物、矽氧化物、矽氮化物、矽氮氧化物、矽碳化物、矽碳氧化物以及其組合。金屬氧化物例如可以是氧化鋁(AlOx)、氧化鈦(TiOx)等，但不限於此。另外，阻隔層220亦可以是有機材料與無機材料的混成(Hybrid)形式製作而成。 Referring to FIG. 1 and FIG. 3F, in step S116, after the upper substrate 208 is attached to the lower substrate 200, the barrier layer 220 may be selectively attached to the upper substrate 208 to further effectively block moisture and Oxygen invades into the subsequently preformed display panel. The method of attaching the barrier layer 220 to the upper substrate 208 may be performed by a pressure bonding process in a manner similar to that described above in which the upper substrate 208 is attached to the display region 202 of the lower substrate 200, respectively. That is, the barrier layer 220 placed on the upper substrate 208 can be pressed by the roller 222 to be attached. The barrier layer 220 is, for example, a material that is resistant to water and gas barrier, and is, for example, an organic material or an inorganic material film, glass, or other water vapor barrier material. The organic material is, for example, polyethylene terephthalate (PET), polypropylene, polystyrene or the like. The inorganic material is, for example, a metal oxide, a metal nitride, a metal oxynitride, a cerium oxide, a cerium nitride, a cerium oxynitride, a cerium carbide, a cerium carbon oxide, and combinations thereof. The metal oxide may be, for example, alumina (AlO x ), titanium oxide (TiO x ), or the like, but is not limited thereto. In addition, the barrier layer 220 may also be formed in a hybrid form of an organic material and an inorganic material.
一般而言，為了使光線可以經阻隔層220透射出，阻 隔層220可採用透明材質。在一實施例中，於上基板208上貼附阻隔層220之後，還可以進行高壓蒸氣滅菌處理(autoclave)，以藉由施加壓力來去除形成於阻隔層220上的氣泡。 In general, in order to allow light to be transmitted through the barrier layer 220, the resistance The spacer 220 can be made of a transparent material. In an embodiment, after the barrier layer 220 is attached to the upper substrate 208, an autoclave may be performed to remove bubbles formed on the barrier layer 220 by applying pressure.
當然，在另一實施例中，在將上基板208分別貼附於下基板200的顯示區域202上之前，也可以先在上基板208上貼附阻隔層220，接著再將貼附有阻隔層220之上基板208分別貼附於下基板200上。如此一來，在將上基板208分別貼附於下基板200的顯示區域202上之後，上基板208上也會具有阻隔層220，而同樣能夠達到防止水氣侵入之效果。 Of course, in another embodiment, before the upper substrate 208 is attached to the display area 202 of the lower substrate 200, the barrier layer 220 may be attached to the upper substrate 208, and then the barrier layer may be attached. The substrate 208 above 220 is attached to the lower substrate 200, respectively. In this way, after the upper substrate 208 is attached to the display region 202 of the lower substrate 200, the upper substrate 208 also has the barrier layer 220, and the effect of preventing moisture intrusion can be achieved.
請參照圖1、圖2C及圖3G，進行步驟S118，分別於上基板208與對應的顯示區域202的周圍塗佈框膠材料224，以密封每一個上基板208與下基板200之間的空隙，以阻隔水氣或微粒。在一實施例中，框膠材料224可以覆蓋部分的阻隔層220及下基板200，以確保密封上基板208與下基板200之交界處而達到側向保護之功效。框膠材料224例如是熱固膠、感光膠或是感光後熱固膠。 Referring to FIG. 1 , FIG. 2C and FIG. 3G , step S118 is performed to apply a sealant material 224 around the upper substrate 208 and the corresponding display area 202 to seal the gap between each of the upper substrate 208 and the lower substrate 200 . To block moisture or particles. In an embodiment, the sealant material 224 may cover a portion of the barrier layer 220 and the lower substrate 200 to ensure the lateral protection of the interface between the upper substrate 208 and the lower substrate 200. The sealant material 224 is, for example, a thermosetting adhesive, a photosensitive adhesive, or a photosensitive thermosetting adhesive.
詳言之，當框膠材料224為熱固膠時，可以先一次性直接於全部的上基板208與對應的顯示區域202的周圍塗佈框膠材料224之後，再利用烤箱進行一次烘烤使框膠材料224固化。當框膠材料224為熱固膠時，也可以先在塗佈框膠材料224時同時加熱下基板200作預固烘烤，待完成全部的上基板208與對應的顯示區域202的周圍塗佈框 膠材料224之後再送入烤箱一起烘烤。當然，使用使用熱固膠作為框膠材料224時，還可以直接加熱下基板200並同時於上基板208與對應的顯示區域202的周圍塗佈框膠材料224，使框膠材料224接觸到加熱的下基板200後可以同步固化。另一方面，當框膠材料224為感光膠時，可以一邊塗佈框膠材料224並一邊照光而進行同步化固化；或是先直接於全部的上基板208與對應的顯示區域202的周圍塗佈框膠材料224完成之後，再進行一次性照光使框膠材料224固化。此外，當框膠材料224為感光後熱固膠時，可以一邊塗佈框膠材料224並一邊照光使塗佈於每個上基板208周圍的框膠材料224分別進行預固化，待完成全部框膠材料224的塗佈之後再送入烤箱進行烘烤固化。當框膠材料224為感光後熱固膠時，也可以先全面性地完成框膠材料224的塗佈之後，進行一次性照光使框膠材料224預固化，接著再送入烤箱烘烤使框膠材料224固化成形。 In detail, when the sealant material 224 is a thermosetting adhesive, the sealant material 224 may be applied to the entire upper substrate 208 and the corresponding display area 202 at a time, and then baked in the oven. The sealant material 224 is cured. When the sealant material 224 is a thermosetting glue, the lower substrate 200 may be simultaneously heated and pre-baked while the sealant material 224 is applied, and all the upper substrate 208 and the corresponding display area 202 are to be coated. frame The glue material 224 is then sent to the oven for baking. Of course, when the thermosetting glue is used as the sealant material 224, the lower substrate 200 can be directly heated and the sealant material 224 can be applied to the periphery of the upper substrate 208 and the corresponding display region 202 to bring the sealant material 224 into contact with the heating. The lower substrate 200 can be cured simultaneously. On the other hand, when the sealant material 224 is a photosensitive adhesive, the sealant material 224 may be coated and simultaneously cured by illumination; or directly coated on the entire upper substrate 208 and the corresponding display area 202. After the frame glue material 224 is completed, a one-time illumination is performed to cure the sealant material 224. In addition, when the sealant material 224 is a post-photosensitive thermosetting adhesive, the sealant material 224 can be applied to each of the upper substrate 208 to be pre-cured while applying the sealant material 224, and all the frames are to be completed. The coating of the glue material 224 is then sent to the oven for baking curing. When the sealant material 224 is a post-photosensitive thermosetting adhesive, the coating material 224 can be completely cured after the coating is completed, and the sealant 224 is pre-cured, and then sent to the oven for baking. Material 224 is cured.
請參照圖1及圖3H，進行步驟S120，於塗佈框膠材料224之後，分別在下基板200的每一顯示區域202的周邊形成驅動裝置226。在一實施例中，驅動裝置226可包括驅動電路晶片226a以及線路層226b。驅動電路晶片226a配置於每一顯示區域202周圍的下基板200上。線路層226b例如是可撓性印刷線路(flexible printed circuit,FPC)，其連接於驅動電路晶片226a與外部的電路板(未繪示)，以使外部的電路板之電訊號可藉由線路層226b傳 輸至驅動電路晶片226a，進而控制後續預形成之顯示面板。具體而言，線路層226b的一末端可藉由異方性導電膜(anisotropic conductive film,ACF)等黏著劑接合於驅動電路晶片226a的相對應末端上，而線路層226b的另一末端同樣可藉由異方性導電膜等黏著劑接合於電路板的相對應末端上。上述異方性導電膜可以是熱固型異方性導電膜、感光型異方性導電膜或是感光後熱固型異方性導電膜，且其形成方法可依據不同類型而採用不同的固化成形方式，所屬技術領域中具有通常知識者當可依前述實施例知其變化及應用，故於此不再贅述。 Referring to FIG. 1 and FIG. 3H, in step S120, after the sealant material 224 is applied, the driving device 226 is formed on each periphery of each display region 202 of the lower substrate 200. In an embodiment, the driving device 226 can include a driver circuit wafer 226a and a circuit layer 226b. The driver circuit wafer 226a is disposed on the lower substrate 200 around each display region 202. The circuit layer 226b is, for example, a flexible printed circuit (FPC) connected to the driving circuit chip 226a and an external circuit board (not shown) so that the electrical signal of the external circuit board can be passed through the circuit layer. 226b biography It is input to the driver circuit wafer 226a, which in turn controls the subsequently preformed display panel. Specifically, one end of the wiring layer 226b may be bonded to the corresponding end of the driving circuit wafer 226a by an adhesive such as an anisotropic conductive film (ACF), and the other end of the wiring layer 226b may also be The adhesive is bonded to the corresponding end of the circuit board by an adhesive such as an anisotropic conductive film. The anisotropic conductive film may be a thermosetting anisotropic conductive film, a photosensitive anisotropic conductive film or a post-photosensitive thermosetting anisotropic conductive film, and the forming method thereof may adopt different curing according to different types. The forming method, which is generally known to those skilled in the art, can be changed and applied according to the foregoing embodiments, and thus will not be described again.
請參照圖1及圖3I，進行步驟S122，於形成驅動裝置226之後，於驅動裝置226上形成保護膠材228。保護膠材228例如是環繞下基板200的每一顯示區域202的周邊，以覆蓋保護驅動電路晶片226a與線路層226b的接合處。在一實施例中，保護膠材228可以是熱固膠、感光膠或是感光後熱固膠，且其形成方法亦類似於步驟S118中塗佈形成框膠材料224的方法，而可依據保護膠材228的種類進行相對應的處理程序，故於此不再贅述。另外，在形成保護膠材228之後，還可選擇性地進行電性測試，以確保後續預形成之顯示面板的品質。 Referring to FIG. 1 and FIG. 3I, step S122 is performed to form a protective adhesive 228 on the driving device 226 after the driving device 226 is formed. The protective adhesive 228 is, for example, a periphery of each of the display regions 202 surrounding the lower substrate 200 to cover the joint of the protective driving circuit wafer 226a and the wiring layer 226b. In an embodiment, the protective adhesive 228 may be a thermosetting adhesive, a photosensitive adhesive or a photosensitive thermosetting adhesive, and the forming method thereof is also similar to the method of forming the sealant material 224 in step S118, and may be protected according to the protection. The type of the glue 228 is subjected to a corresponding processing procedure, and thus will not be described again. In addition, after forming the protective adhesive 228, electrical testing can also be selectively performed to ensure the quality of the subsequently preformed display panel.
請參照圖1、圖2D及圖3J，進行步驟S124，進行切割程序，以形成多個顯示面板230。切割程序例如是使用刀輪或雷射光束等切割設備沿著每一個驅動裝置226的外部周圍對下基板200進行裁切，而形成至少具有相貼合的 下基板200a與上基板208之顯示面板230。在一實施例中，在完成顯示面板230的製作之後，還可以視需求於顯示面板230上方貼附觸控面板(未繪示)或其他膜層、元件，以完成具有所需功能之顯示裝置。 Referring to FIG. 1 , FIG. 2D and FIG. 3J , step S124 is performed to perform a cutting process to form a plurality of display panels 230 . The cutting process, for example, uses a cutting device such as a cutter wheel or a laser beam to cut the lower substrate 200 along the outer periphery of each of the driving devices 226 to form at least a suitable fit. The display panel 230 of the lower substrate 200a and the upper substrate 208. In an embodiment, after the display panel 230 is completed, a touch panel (not shown) or other film layers and components may be attached to the display panel 230 to complete the display device having the desired function. .
特別說明的是，上述步驟S116至步驟S122是以在進行切割程序(S124)之前分別於上基板208上貼附阻隔層220、塗佈框膠材料224、形成驅動裝置226及保護膠材228為例來進行說明，亦即上述步驟S124所形成之顯示面板230已貼附有阻隔層220並分別具有驅動裝置226，但本發明並不限於此。在另一實施例中，也可是在進行步驟S114b將上基板208貼附於下基板200上之後，直接進行步驟S124的切割程序以形成多個不具有阻隔層220、框膠材料224、驅動裝置226及保護膠材228的顯示面板230。然後，才依序進行步驟S116至步驟S122，以分別於每一個顯示面板230的上基板208上貼附阻隔層220、塗佈框膠材料224、形成驅動裝置226及保護膠材228。 Specifically, the above steps S116 to S122 are performed by attaching the barrier layer 220 to the upper substrate 208, applying the sealant material 224, forming the driving device 226, and the protective adhesive 228 before performing the cutting process (S124). For example, the display panel 230 formed in the above step S124 has the barrier layer 220 attached thereto and has the driving device 226, respectively, but the present invention is not limited thereto. In another embodiment, after the upper substrate 208 is attached to the lower substrate 200 in step S114b, the cutting process of step S124 is directly performed to form a plurality of barrier layers 220, the sealant material 224, and the driving device. 226 and display panel 230 of protective glue 228. Then, step S116 to step S122 are sequentially performed to attach a barrier layer 220, a capping material 224, a driving device 226, and a protective adhesive 228 to the upper substrate 208 of each display panel 230.
圖4是依照本發明之第二實施例之一種顯示面板的製造方法的步驟流程圖。圖5A至圖5D是依照本發明之第二實施例之顯示面板的製造方法的剖面示意圖。須注意的是，在圖4及圖5A至圖5D中，與圖1及圖3A至圖3J相同的步驟、構件則使用相同的標號並省略其說明。 4 is a flow chart showing the steps of a method of manufacturing a display panel in accordance with a second embodiment of the present invention. 5A to 5D are schematic cross-sectional views showing a method of manufacturing a display panel in accordance with a second embodiment of the present invention. It is to be noted that in FIG. 4 and FIG. 5A to FIG. 5D, the same steps and members as those in FIGS. 1 and 3A to 3J are denoted by the same reference numerals and the description thereof will be omitted.
在此實施例中，圖4所示之顯示面板的製造流程與圖1所示之顯示面板的製造流程部分相同，然而兩者之間的 差異主要是在於下基板的構件配置。詳言之，用以形成本發明之顯示面板的下基板並不限於第一實施例所述之硬質基板，也可以使用其他可撓式基板作為顯示面板的下基板。 In this embodiment, the manufacturing process of the display panel shown in FIG. 4 is the same as the manufacturing process of the display panel shown in FIG. 1, but between the two The difference is mainly in the component configuration of the lower substrate. In detail, the lower substrate for forming the display panel of the present invention is not limited to the rigid substrate described in the first embodiment, and other flexible substrates may be used as the lower substrate of the display panel.
請參照圖4及圖5A，在步驟S402中，提供下基板500，下基板500包括支撐基板502以及位於支撐基板502上之可撓式基板504，且畫素陣列204形成在可撓式基板504上。在一實施例中，下基板500還可包括黏著層503，位於支撐基板502與可撓式基板504之間，以使可撓式基板504固定黏著於支撐基板502上。可撓式基板504的材質可以是有機材料或無機材料。於提供下基板500(步驟S402)之後，進行步驟S404，對下基板500進行第一切割程序，以形成多個下基板單元500a，其中每一下基板單元500a上具有至少一個顯示區域202，如圖5A及圖5B所示。在此實施例中，第一切割程序是將下基板500劃分成四個下基板單元500a，但本發明並不限定下基板單元500a的數量。之後，利用類似於第一實施例所述之方式，對下基板單元500a進行後續的處理步驟(如步驟S104、S106、S108')，再分別將多個上基板208貼附於下基板單元500a的顯示區域202上(如步驟S114a'、S114b')，並進行後續之製程步驟，而形成多個顯示面板。 Referring to FIG. 4 and FIG. 5A , in step S402 , a lower substrate 500 is provided. The lower substrate 500 includes a support substrate 502 and a flexible substrate 504 on the support substrate 502 , and the pixel array 204 is formed on the flexible substrate 504 . on. In an embodiment, the lower substrate 500 further includes an adhesive layer 503 between the support substrate 502 and the flexible substrate 504 to fix the flexible substrate 504 to the support substrate 502. The material of the flexible substrate 504 may be an organic material or an inorganic material. After the lower substrate 500 is provided (step S402), step S404 is performed to perform a first cutting process on the lower substrate 500 to form a plurality of lower substrate units 500a, wherein each lower substrate unit 500a has at least one display area 202, as shown in the figure. 5A and 5B. In this embodiment, the first dicing process divides the lower substrate 500 into four lower substrate units 500a, but the present invention does not limit the number of lower substrate units 500a. Thereafter, the subsequent processing steps (such as steps S104, S106, and S108') are performed on the lower substrate unit 500a in a manner similar to that described in the first embodiment, and the plurality of upper substrates 208 are respectively attached to the lower substrate unit 500a. On the display area 202 (steps S114a', S114b'), and subsequent processing steps are performed to form a plurality of display panels.
在此說明的是，由於每一下基板單元500a包括支撐基板502以及可撓式基板504，因此在完成顯示面板的製作之前必須將可撓式基板504自支撐基板502上取下(步驟S406)。如圖4所示，在一實施例中，將可撓式基板504 自支撐基板502上取下的步驟S406可以在形成驅動裝置(步驟S120')之前進行，也可以在形成驅動裝置及保護膠材(步驟S120'及步驟S122)之後進行。將可撓式基板504自支撐基板502上取下的的方法例如是使用刀輪或雷射光束等切割設備沿著每一個顯示區域202的外側邊緣進行切割，並且移除邊緣的可撓式基板504、黏著層503及支撐基板502，因而使可撓式基板504與支撐基板502相互分離。而且，在使可撓式基板504自支撐基板502分離之後，還可選擇性地於可撓式基板504的背面(畫素陣列202的相對側)貼附鋁箔506，或是聚對苯二甲酸乙二酯(PET)基板，阻水阻氣材料，如阻隔層220所述材料，以保護可撓式基板504。接著，分別於每一個可撓式基板504與對應之鋁箔506的周圍塗佈框膠材料508，以密封每一個可撓式基板504與鋁箔506之間的空隙，而阻隔水氣或微粒。 It is noted that since each lower substrate unit 500a includes the support substrate 502 and the flexible substrate 504, the flexible substrate 504 must be removed from the support substrate 502 before the fabrication of the display panel is completed (step S406). As shown in FIG. 4, in an embodiment, the flexible substrate 504 is used. The step S406 of removing the self-supporting substrate 502 may be performed before the driving device is formed (step S120'), or may be performed after the driving device and the protective rubber material are formed (step S120' and step S122). The method of removing the flexible substrate 504 from the support substrate 502 is, for example, cutting along the outer edge of each display area 202 using a cutting device such as a cutter wheel or a laser beam, and removing the edge of the flexible substrate. 504, the adhesive layer 503 and the support substrate 502, thereby separating the flexible substrate 504 and the support substrate 502 from each other. Moreover, after the flexible substrate 504 is separated from the support substrate 502, the aluminum foil 506 or the poly-terephthalic acid may be selectively attached to the back surface of the flexible substrate 504 (opposite side of the pixel array 202). An ethylene glycol (PET) substrate, a water blocking gas barrier material, such as the material of the barrier layer 220, protects the flexible substrate 504. Next, a sealant material 508 is applied around each of the flexible substrate 504 and the corresponding aluminum foil 506 to seal the gap between each of the flexible substrate 504 and the aluminum foil 506 to block moisture or particles.
圖6是依照本發明之第三實施例之一種顯示面板的製造方法的步驟流程圖。圖7A至圖7B是依照本發明之第三實施例之顯示面板的製造方法的剖面示意圖。須注意的是，在圖6及圖7A至圖7B中，與圖1及圖3A至圖3J相同的步驟、構件則使用相同的標號並省略其說明。 Figure 6 is a flow chart showing the steps of a method of manufacturing a display panel in accordance with a third embodiment of the present invention. 7A through 7B are schematic cross-sectional views showing a method of fabricating a display panel in accordance with a third embodiment of the present invention. It is to be noted that in FIGS. 6 and 7A to 7B, the same steps and members as those in FIGS. 1 and 3A to 3J are denoted by the same reference numerals and the description thereof will be omitted.
在此實施例中，圖6所示之顯示面板的製造流程與圖1所示之顯示面板的製造流程部分相同，然而兩者之間的差異主要是在於：將步驟S108所形成之下基板200及步驟S112所形成之上基板208進行組裝的方法，亦即分別 將上基板208貼附於下基板200的顯示區域202上之步驟。詳言之，請參照圖6及圖7A，在進行步驟S108形成下基板200及步驟S112形成上基板208之後，進行步驟S602，先將多個上基板208放置在上真空裝置702上，並將下基板200放置在下真空裝置704上。之後，進行步驟S604，將上真空裝置702及下真空裝置704對位並且壓合，以使上基板208貼附於下基板200的顯示區域202上。特別說明的是，藉由在上真空裝置702上放置多個上基板208可以同時將多個上基板208貼附在下基板200上，因此不需重複進行多次的上下基板貼附步驟，即可一次使全部的上基板208貼附至下基板200之對應的顯示區域202上，因而可更有效地簡化製程，減少製程時間。 In this embodiment, the manufacturing process of the display panel shown in FIG. 6 is the same as that of the manufacturing process of the display panel shown in FIG. 1. However, the difference between the two is mainly because the substrate 200 formed in step S108 is formed. And the method of assembling the upper substrate 208 formed in step S112, that is, respectively The step of attaching the upper substrate 208 to the display region 202 of the lower substrate 200. In detail, referring to FIG. 6 and FIG. 7A, after the lower substrate 200 is formed in step S108 and the upper substrate 208 is formed in step S112, step S602 is performed to first place a plurality of upper substrates 208 on the upper vacuum device 702, and The lower substrate 200 is placed on the lower vacuum device 704. Thereafter, step S604 is performed to align and press the upper vacuum device 702 and the lower vacuum device 704 to attach the upper substrate 208 to the display region 202 of the lower substrate 200. In particular, by placing a plurality of upper substrates 208 on the upper vacuum device 702, a plurality of upper substrates 208 can be attached to the lower substrate 200 at the same time. Therefore, it is not necessary to repeat the steps of attaching the upper and lower substrates repeatedly. All of the upper substrate 208 is attached to the corresponding display area 202 of the lower substrate 200 at a time, so that the process can be more effectively simplified and the process time can be reduced.
請參照圖6及圖7B，在將上基板208貼附於下基板200之後，還可選擇性地分別於上基板208上貼附阻隔層220。於上基板208上貼附阻隔層220的方法例如是先進行步驟S606，將多個阻隔層220放置在上真空裝置702上，並將貼附有上基板208之下基板200放置在下真空裝置704上。進行步驟S608，將上真空裝置702及下真空裝置704對位並且壓合，以使阻隔層220分別貼附至位於下基板200的上基板208上。同樣地，利用真空裝置可以同時將多個阻隔層220貼附在對應的上基板208上，因此可進一步節省製程時間。 Referring to FIG. 6 and FIG. 7B , after the upper substrate 208 is attached to the lower substrate 200 , the barrier layer 220 may be selectively attached to the upper substrate 208 . The method of attaching the barrier layer 220 to the upper substrate 208 is performed, for example, by performing step S606, placing a plurality of barrier layers 220 on the upper vacuum device 702, and placing the substrate 200 attached to the upper substrate 208 under the lower vacuum device 704. on. Step S608 is performed to align and press the upper vacuum device 702 and the lower vacuum device 704 such that the barrier layer 220 is attached to the upper substrate 208 of the lower substrate 200, respectively. Similarly, a plurality of barrier layers 220 can be simultaneously attached to the corresponding upper substrate 208 by means of a vacuum device, thereby further saving process time.
圖8是依照本發明之第四實施例之一種顯示面板的製 造方法的步驟流程圖。圖9A至圖9B是依照本發明之第四實施例之顯示面板的製造方法的立體示意圖。須注意的是，在圖8及圖9A至圖9B中，與前述圖式相同的步驟、構件則使用相同的標號並省略其說明。 Figure 8 is a diagram showing the manufacture of a display panel in accordance with a fourth embodiment of the present invention. A flow chart of the steps of the method. 9A to 9B are perspective views of a method of manufacturing a display panel in accordance with a fourth embodiment of the present invention. It is to be noted that in FIG. 8 and FIG. 9A to FIG. 9B, the same steps and members as those in the above-described drawings are denoted by the same reference numerals and the description thereof will be omitted.
在此實施例中，圖8所示之顯示面板的製造流程與圖6所示之顯示面板的製造流程部分相同，然而兩者之間的差異主要是在於：於上基板208上貼附阻隔層的方式。詳言之，請參照圖8及圖9A，在進行步驟S604之後直接進行步驟S118，亦即分別將上基板208貼附於下基板200之後以及在上基板上貼附阻隔層之前，於上基板208與對應的顯示區域202的周圍塗佈框膠材料224。接著，進行步驟S802，在下基板200上全面地貼附一片大片的阻隔層902，以覆蓋多個上基板208以及框膠材料224。在一實施例中，大片的阻隔層902例如是具有阻水阻氣功能之薄膜或玻璃，而能夠直接全面地貼附在下基板200上。 In this embodiment, the manufacturing process of the display panel shown in FIG. 8 is the same as the manufacturing process of the display panel shown in FIG. 6, but the difference between the two is mainly as follows: a barrier layer is attached to the upper substrate 208. The way. In detail, referring to FIG. 8 and FIG. 9A, after step S604 is performed, step S118 is directly performed, that is, after the upper substrate 208 is attached to the lower substrate 200 and before the barrier layer is attached on the upper substrate, respectively, on the upper substrate. The sealant material 224 is applied to the periphery of the corresponding display area 202. Next, in step S802, a large piece of barrier layer 902 is entirely attached on the lower substrate 200 to cover the plurality of upper substrates 208 and the sealant material 224. In one embodiment, the bulk of the barrier layer 902 is, for example, a film or glass having a water blocking and gas barrier function, and can be directly and completely attached to the lower substrate 200.
請參照圖9B，進行步驟S804，對阻隔層902以及下基板200進行切割程序，以形成多個顯示面板904。切割程序例如是使用刀輪或雷射光束等切割設備沿著每一個顯示區域202的外部周圍對阻隔層902及下基板200進行裁切，而形成顯示面板904。如圖9B所示，在進行切割程序時，還可以進一步移除覆蓋下基板200的部分阻隔層902，以使切割後的阻隔層902a仍完全覆蓋在上基板208上。而切割後的阻隔層902a所暴露出的部分下基板200，可有助於使後續預形成之驅動裝置容易與顯示面板904進行線路 接合。 Referring to FIG. 9B, step S804 is performed to perform a cutting process on the barrier layer 902 and the lower substrate 200 to form a plurality of display panels 904. The cutting process forms a display panel 904 by cutting a barrier layer 902 and a lower substrate 200 along the outer periphery of each display area 202, for example, using a cutting device such as a cutter wheel or a laser beam. As shown in FIG. 9B, a portion of the barrier layer 902 covering the lower substrate 200 may be further removed during the cutting process so that the diced barrier layer 902a remains completely overlying the upper substrate 208. The portion of the lower substrate 200 exposed by the diced barrier layer 902a can help facilitate subsequent pre-formed driving devices to be routed to the display panel 904. Engage.
此外，於進行切割程序形成顯示面板904之後，更包括進行步驟S120，以在每一顯示面板904的周邊形成驅動裝置。於形成驅動裝置之後，進行步驟S122，以於驅動裝置上形成保護膠材，而完成類似圖3J所示之顯示面板結構。 In addition, after the cutting process is performed to form the display panel 904, step S120 is further included to form a driving device at the periphery of each display panel 904. After the driving device is formed, step S122 is performed to form a protective adhesive material on the driving device, and a display panel structure similar to that shown in FIG. 3J is completed.
當然，在第四實施例中，分別將上基板208貼附於下基板200的顯示區域202上的方法並不限於圖8的流程所述之利用真空裝置同時將多個上基板208貼附在下基板200上。在另一實施例中，也可以採用如第一實施例所述之方式，亦即分別將一個上基板208貼附於下基板200的一個顯示區域202上，並重複進行多次以依序將每一個上基板208貼附下基板200之對應的顯示區域202上，本發明於此不作特別之限定。 Of course, in the fourth embodiment, the method of attaching the upper substrate 208 to the display region 202 of the lower substrate 200, respectively, is not limited to the use of the vacuum device to simultaneously attach the plurality of upper substrates 208 to the lower portion as described in the flow of FIG. On the substrate 200. In another embodiment, an upper substrate 208 may be attached to one display area 202 of the lower substrate 200, and repeatedly performed in sequence as described in the first embodiment. Each of the upper substrates 208 is attached to the corresponding display area 202 of the lower substrate 200, and the present invention is not particularly limited herein.
圖10是依照本發明之第五實施例之一種顯示面板的製造方法的步驟流程圖。圖11A至圖11C是依照本發明之第五實施例之顯示面板的製造方法的立體示意圖。須注意的是，在圖10及圖11A至圖11C中，與前述圖式相同的步驟、構件則使用相同的標號並省略其說明。 Figure 10 is a flow chart showing the steps of a method of manufacturing a display panel in accordance with a fifth embodiment of the present invention. 11A to 11C are perspective views of a method of manufacturing a display panel in accordance with a fifth embodiment of the present invention. It is to be noted that in FIG. 10 and FIG. 11A to FIG. 11C, the same steps and members as those of the above-described drawings are denoted by the same reference numerals and the description thereof will be omitted.
在第五實施例中，圖10所示之顯示面板的製造流程與圖6所示之顯示面板的製造流程部分相同，然而兩者之間的差異主要是在於：於上基板208上貼附阻隔層的方式。詳言之，請參照圖10及圖11A，在進行步驟S604之 後，進行步驟S1002，在下基板200上全面地塗佈阻隔層1102，並覆蓋多個上基板208。在一實施例中，在下基板200上全面性塗佈阻隔層1102，接著可再進行固化步驟而使其成形，其中阻隔層1102的材料例如是無機材料、有機材料或有機材料與無機材料互相搭配使用的複合式材料。而且，上述阻隔層1102的材料可以是熱固型阻隔材料、感光型阻隔材料或是感光後熱固型阻隔材料，且其固化方法可依據不同類型的材料而採用類似於前述之固化成形方式，所屬技術領域中具有通常知識者當可依前述實施例知其變化及應用，故於此不再贅述。 In the fifth embodiment, the manufacturing process of the display panel shown in FIG. 10 is the same as that of the manufacturing process of the display panel shown in FIG. 6, but the difference between the two is mainly due to the adhesion of the upper substrate 208. The way the layer is. In detail, please refer to FIG. 10 and FIG. 11A, and step S604 is performed. Thereafter, in step S1002, the barrier layer 1102 is entirely coated on the lower substrate 200 and covers the plurality of upper substrates 208. In one embodiment, the barrier layer 1102 is entirely coated on the lower substrate 200, and then the curing step is further performed to form the material. The material of the barrier layer 1102 is, for example, an inorganic material, an organic material, or an organic material and an inorganic material. Composite material used. Moreover, the material of the barrier layer 1102 may be a thermosetting barrier material, a photosensitive barrier material or a photosensitive post-curing barrier material, and the curing method thereof may adopt a curing forming method similar to the foregoing according to different types of materials. Those skilled in the art can change the application and the application according to the foregoing embodiments, and thus will not be described again.
之後，請參照圖11B，進行步驟S1004，對阻隔層1102進行光罩曝光步驟，以使每一顯示區域202上之阻隔層1102硬化。在一實施例中，光罩曝光步驟可使用遮罩(shadow mask)1104作為罩幕，其中遮罩1104具有多個開口而暴露出顯示區域202，且遮罩1104例如是遮蔽相鄰顯示區域202之間的範圍。在照射紫外光(UV)進行曝光之後，被遮罩1104遮蔽的阻隔層1102材料會因未被照射到紫外光而可被移除。也就是說，在經過光罩曝光步驟之後，相鄰顯示區域202之間的阻隔層1102材料會被移除，而剩下全面覆蓋在每一個上基板208周圍的阻隔層1102a。在此說明的是，由於具有阻水阻氣功能之阻隔層1102a全面性覆蓋每一個上基板208與對應的顯示區域202的周圍，因此每一顯示區域202周圍的阻隔層1102a可作為框膠，而可省去於上基板208與對應的顯示區域202的周圍塗佈 框膠材料之步驟(如圖1之步驟S118)。 Thereafter, referring to FIG. 11B, step S1004 is performed to perform a mask exposure step on the barrier layer 1102 to harden the barrier layer 1102 on each display region 202. In an embodiment, the reticle exposure step may use a shadow mask 1104 as a mask, wherein the mask 1104 has a plurality of openings to expose the display area 202, and the mask 1104, for example, masks the adjacent display area 202. The range between. After exposure to ultraviolet light (UV), the material of the barrier layer 1102 masked by the mask 1104 can be removed by exposure to ultraviolet light. That is, after passing through the reticle exposure step, the barrier layer 1102 material between adjacent display regions 202 is removed, leaving a barrier layer 1102a that completely covers each of the upper substrate 208. It is explained here that since the barrier layer 1102a having the water blocking and gas blocking function comprehensively covers the periphery of each of the upper substrate 208 and the corresponding display region 202, the barrier layer 1102a around each display region 202 can serve as a sealant. The coating of the upper substrate 208 and the corresponding display area 202 can be omitted. The step of sealing the material (step S118 of Fig. 1).
請參照圖11C，進行步驟S1006，進行切割程序，以形成多個顯示面板1106。切割程序可以利用如上述實施力之方式，故於此不在贅述。在此說明的是，由於相鄰顯示區域202之間的阻隔層材料已被移除，因此可直接對下基板200進行切割。此外，於進行切割程序形成顯示面板1106之後，更包括進行步驟S120，以在每一顯示面板1106的周邊形成驅動裝置。於形成驅動裝置之後，進行步驟S122，以於驅動裝置上形成保護膠材，而完成類似圖3J所示之顯示面板結構。 Referring to FIG. 11C, step S1006 is performed to perform a cutting process to form a plurality of display panels 1106. The cutting program can utilize the method of implementing the force as described above, and therefore will not be described herein. It is explained here that since the barrier layer material between the adjacent display regions 202 has been removed, the lower substrate 200 can be directly cut. In addition, after the cutting process is performed to form the display panel 1106, step S120 is further included to form a driving device at the periphery of each display panel 1106. After the driving device is formed, step S122 is performed to form a protective adhesive material on the driving device, and a display panel structure similar to that shown in FIG. 3J is completed.
在第五實施例中，分別將上基板208貼附於下基板200的顯示區域202上的方法並不限於圖10的流程所述之利用真空裝置同時將多個上基板208貼附在下基板200上。在另一實施例中，也可以採用如第一實施例所述之方式，亦即分別將一個上基板208貼附於下基板200的一個顯示區域202上，並重複進行多次以依序將每一個上基板208貼附下基板200之對應的顯示區域202上，本發明於此不作特別之限定。 In the fifth embodiment, the method of attaching the upper substrate 208 to the display region 202 of the lower substrate 200, respectively, is not limited to attaching the plurality of upper substrates 208 to the lower substrate 200 by using a vacuum device as described in the flow of FIG. on. In another embodiment, an upper substrate 208 may be attached to one display area 202 of the lower substrate 200, and repeatedly performed in sequence as described in the first embodiment. Each of the upper substrates 208 is attached to the corresponding display area 202 of the lower substrate 200, and the present invention is not particularly limited herein.
綜上所述，本發明之顯示面板的製造方法藉由在大片的下基板上先形成畫素陣列，並將已切割之多個具有導電層、顯示層的上基板貼附於下基板的顯示區域上，再同時對貼附有多個上基板之下基板連續性地進行後續製程步驟，之後才進行切割步驟以形成多個顯示面板。因此，在進行切割程序形成多個顯示面板之前，進行一次性的製程 步驟即可同時處理貼附有多個上基板之下基板，因而有助於簡化製程，並可以批次的方式完成多個顯示面板的製作。 In summary, the manufacturing method of the display panel of the present invention first forms a pixel array on a large lower substrate, and attaches the cut upper substrate having the conductive layer and the display layer to the lower substrate. On the area, a subsequent process step is continuously performed on the substrate underlying the plurality of upper substrates, and then the cutting step is performed to form a plurality of display panels. Therefore, a one-time process is performed before the cutting process is performed to form a plurality of display panels. The step can simultaneously process the substrate attached with a plurality of upper substrates, thereby facilitating the simplification of the process, and the production of a plurality of display panels can be completed in batches.
此外，本發明之顯示面板的製造方法可以應用在多種顯示面板的製作，並能夠與現有的製程相整合，製程簡單且可有效節省製程時間及增加產能。 In addition, the manufacturing method of the display panel of the present invention can be applied to the production of a plurality of display panels, and can be integrated with the existing process, the process is simple, and the process time and the productivity can be effectively saved.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
200、200a、500‧‧‧下基板 200, 200a, 500‧‧‧ lower substrate
202‧‧‧顯示區域 202‧‧‧Display area
204‧‧‧畫素陣列 204‧‧‧ pixel array
206‧‧‧導電膠 206‧‧‧ conductive adhesive
208‧‧‧上基板 208‧‧‧Upper substrate
210‧‧‧導電層 210‧‧‧ Conductive layer
212‧‧‧顯示層 212‧‧‧Display layer
214‧‧‧接觸開口 214‧‧‧Contact opening
216‧‧‧膠層 216‧‧ ‧ adhesive layer
218、222‧‧‧滾輪 218, 222‧‧‧ Wheels
220、902、902a、1102、1102a‧‧‧阻隔層 220, 902, 902a, 1102, 1102a‧‧‧ barrier
224‧‧‧框膠材料 224‧‧‧Frame material
226‧‧‧驅動裝置 226‧‧‧ drive
226a‧‧‧驅動電路晶片 226a‧‧‧Drive Circuit Wafer
226b‧‧‧線路層 226b‧‧‧circuit layer
228‧‧‧保護膠材 228‧‧‧Protective glue
230、904、1106‧‧‧顯示面板 230, 904, 1106‧‧‧ display panels
500a‧‧‧下基板單元 500a‧‧‧lower substrate unit
502‧‧‧支撐基板 502‧‧‧Support substrate
503‧‧‧黏著層 503‧‧‧Adhesive layer
504‧‧‧可撓式基板 504‧‧‧Flexible substrate
506‧‧‧鋁箔 506‧‧‧Aluminum foil
508‧‧‧框膠材料 508‧‧‧Frame material
702‧‧‧上真空裝置 702‧‧‧Upper vacuum device
704‧‧‧下真空裝置 704‧‧‧Under vacuum
1104‧‧‧遮罩 1104‧‧‧ mask
S102~S124、S402~S406、S602~S608、S802~S804、S1002~S1006‧‧‧步驟 S102~S124, S402~S406, S602~S608, S802~S804, S1002~S1006‧‧‧ steps
圖1是依照本發明之第一實施例之一種顯示面板的製造方法的步驟流程圖。 1 is a flow chart showing the steps of a method of manufacturing a display panel in accordance with a first embodiment of the present invention.
圖2A至圖2D是依照本發明之第一實施例之顯示面板的製造方法的立體示意圖。 2A to 2D are perspective views of a method of manufacturing a display panel in accordance with a first embodiment of the present invention.
圖3A至圖3J是依照本發明之第一實施例之顯示面板的製造方法的剖面示意圖。 3A to 3J are schematic cross-sectional views showing a method of manufacturing a display panel in accordance with a first embodiment of the present invention.
圖4是依照本發明之第二實施例之一種顯示面板的製造方法的步驟流程圖。 4 is a flow chart showing the steps of a method of manufacturing a display panel in accordance with a second embodiment of the present invention.
圖5A至圖5D是依照本發明之第二實施例之顯示面板的製造方法的剖面示意圖。 5A to 5D are schematic cross-sectional views showing a method of manufacturing a display panel in accordance with a second embodiment of the present invention.
圖6是依照本發明之第三實施例之一種顯示面板的製造方法的步驟流程圖。 Figure 6 is a flow chart showing the steps of a method of manufacturing a display panel in accordance with a third embodiment of the present invention.
圖7A至圖7B是依照本發明之第三實施例之顯示面板 的製造方法的剖面示意圖。 7A to 7B are display panels in accordance with a third embodiment of the present invention. A schematic cross-sectional view of the manufacturing method.
圖8是依照本發明之第四實施例之一種顯示面板的製造方法的步驟流程圖。 Figure 8 is a flow chart showing the steps of a method of manufacturing a display panel in accordance with a fourth embodiment of the present invention.
圖9A至圖9B是依照本發明之第四實施例之顯示面板的製造方法的立體示意圖。 9A to 9B are perspective views of a method of manufacturing a display panel in accordance with a fourth embodiment of the present invention.
圖10是依照本發明之第五實施例之一種顯示面板的製造方法的步驟流程圖。 Figure 10 is a flow chart showing the steps of a method of manufacturing a display panel in accordance with a fifth embodiment of the present invention.
圖11A至圖11C是依照本發明之第五實施例之顯示面板的製造方法的立體示意圖。 11A to 11C are perspective views of a method of manufacturing a display panel in accordance with a fifth embodiment of the present invention.
S102~S124‧‧‧步驟 S102~S124‧‧‧Steps
Claims (27)
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| US8164818B2 (en) | 2010-11-08 | 2012-04-24 | Soladigm, Inc. | Electrochromic window fabrication methods |
| US10606142B2 (en) | 2011-12-12 | 2020-03-31 | View, Inc. | Thin-film devices and fabrication |
| US11048137B2 (en) | 2011-12-12 | 2021-06-29 | View, Inc. | Thin-film devices and fabrication |
| US10739658B2 (en) | 2011-12-12 | 2020-08-11 | View, Inc. | Electrochromic laminates |
| TWI451134B (en) * | 2012-03-21 | 2014-09-01 | Au Optronics Corp | Stereoscopic display panel and display panel |
| CA2935687C (en) * | 2014-01-02 | 2024-02-13 | View, Inc. | Thin-film devices and fabrication |
| KR101995817B1 (en) * | 2017-07-18 | 2019-07-03 | 주식회사 하이딥 | Touch input apparatus making method and apparatus for making the same |
| CN108519709A (en) * | 2018-06-01 | 2018-09-11 | Oppo广东移动通信有限公司 | Electrochromism motherboard, electrochromic cells, shell and electronic equipment |
| CN115219580B (en) * | 2021-04-15 | 2024-04-02 | 川奇光电科技（扬州）有限公司 | Detection method of electrophoresis display layer |
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| US20030057425A1 (en) * | 1990-12-31 | 2003-03-27 | Kopin Corporation | Active matrix display device |
| TW200701473A (en) * | 2005-03-17 | 2007-01-01 | Samsung Electronics Co Ltd | Thin film transistor, thin film transistor display panel, and manufacturing method thereof |
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| JPH10282515A (en) | 1997-04-08 | 1998-10-23 | Sanyo Electric Co Ltd | Liquid crystal display device |
| JPH11174485A (en) | 1997-12-15 | 1999-07-02 | Seiko Epson Corp | Liquid crystal display device, manufacturing method thereof, and electronic equipment using it |
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| US20030057425A1 (en) * | 1990-12-31 | 2003-03-27 | Kopin Corporation | Active matrix display device |
| US6403985B1 (en) * | 1991-01-18 | 2002-06-11 | Kopin Corporation | Method of making light emitting diode displays |
| TW200701473A (en) * | 2005-03-17 | 2007-01-01 | Samsung Electronics Co Ltd | Thin film transistor, thin film transistor display panel, and manufacturing method thereof |
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| KR101185647B1 (en) | 2012-09-24 |
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