TWI470593B - Method of manufacturing flexible display panel - Google Patents
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Description
本發明是有關於一種可撓式顯示面板的製造方法。The present invention relates to a method of manufacturing a flexible display panel.
隨著顯示技術的突飛猛進,顯示器已從早期的陰極射線管(CRT)顯示器逐漸地發展到目前的平面顯示器(Flat Panel Display,FPD)。相較於硬質載板(諸如玻璃基板)所構成的平面顯示器,由於可撓性基板(諸如塑膠基板)具有可撓曲及耐衝擊等特性,因此近年來已著手研究將主動元件製作於可撓性基板上的可撓式顯示器。With the rapid advancement of display technology, displays have evolved from early cathode ray tube (CRT) displays to current flat panel displays (FPDs). Compared with a flat panel display composed of a rigid carrier (such as a glass substrate), since a flexible substrate (such as a plastic substrate) has characteristics such as flexibility and impact resistance, it has been studied in recent years to make an active component flexible. A flexible display on a substrate.
一般來說,可撓式顯示面板的製作方式是先將塑膠基板固定在玻璃基板上。之後再於塑膠基板上進行顯示元件的製造程序。待完成顯示元件製造完成以形成顯示面板之後,再將此可撓式顯示面板從玻璃基板上取下。Generally, the flexible display panel is manufactured by first fixing the plastic substrate to the glass substrate. Then, the manufacturing process of the display element is performed on the plastic substrate. After the display element is completed to form the display panel, the flexible display panel is removed from the glass substrate.
而在將可撓式顯示面板從玻璃基板上取下的過程之中,因為可撓式顯示面板與玻璃基板之間的真空度遠低於環境壓力,因而使得可撓式顯示面板不容易自玻璃基板上取下來。若可撓式顯示面板從玻璃基板上取下的過程沒有控制得宜,將容易對可撓式顯示面板內之元件產生損傷。In the process of removing the flexible display panel from the glass substrate, since the vacuum between the flexible display panel and the glass substrate is much lower than the ambient pressure, the flexible display panel is not easily self-glazed. Remove from the substrate. If the process of removing the flexible display panel from the glass substrate is not well controlled, it will easily damage the components in the flexible display panel.
本發明提供一種可撓式顯示面板的製造方法,其可以解決傳統可撓式顯示面板的製造方法所存在的問題。The present invention provides a method of manufacturing a flexible display panel that can solve the problems of the conventional method of manufacturing a flexible display panel.
本發明提出一種可撓式顯示面板的製造方法,此方法包括提供支撐基板,且支撐基板上具有離形層(de-bonding layer),且離形層上設置有可撓式顯示面板,其中支撐基板具有切割線,且切割線與可撓式顯示面板之邊緣相距特定距離。將支撐基板翻轉至承載裝置上,以使得可撓式顯示面板位於承載裝置以及支撐基板之間。沿著切割線對支撐基板進行切割程序,以使可撓式顯示面板的一部份裸露出來。對可撓式顯示面板被裸露出的部份施予下壓力道,以使可撓式顯示面板與離形層之間產生縫細。將支撐基板以及離形層自可撓式顯示面板移除。The present invention provides a method of manufacturing a flexible display panel, the method comprising providing a support substrate, and having a de-bonding layer on the support substrate, wherein the release layer is provided with a flexible display panel, wherein the support The substrate has a cutting line and the cutting line is at a specific distance from the edge of the flexible display panel. The support substrate is flipped onto the carrier such that the flexible display panel is positioned between the carrier and the support substrate. The support substrate is subjected to a cutting process along the cutting line to expose a portion of the flexible display panel. The lower pressure channel is applied to the exposed portion of the flexible display panel to create a thin seam between the flexible display panel and the release layer. The support substrate and the release layer are removed from the flexible display panel.
基於上述,本發明先對支撐基板進行切割程序,並且對可撓式顯示面板被裸露出的部份施予下壓力道以使可撓式顯示面板與離形層之間產生縫細,藉以達到破除可撓式顯示面板與支撐基板之間的真空度。如此一來,後續便可輕易的將支撐基板以及離形層自可撓式顯示面板移除。Based on the above, the present invention first performs a cutting process on the support substrate, and applies a lower pressure channel to the exposed portion of the flexible display panel to create a seam between the flexible display panel and the release layer. The degree of vacuum between the flexible display panel and the support substrate is broken. In this way, the support substrate and the release layer can be easily removed from the flexible display panel.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1A至圖1F是根據本發明一實施例之可撓式顯示面板的製造方法的流程示意圖。請參照圖1A,首先提供支撐基板100,且支撐基板100上具有離形層102。支撐基板100之材質可為玻璃、石英、金屬、陶瓷、或其它可適用的材。離形層102是貼附在支撐基板100的表面上。離形 層102之材料可為聚合物、有機材料、無機材料、或上述之組合。本實施例之離形層102是以聚合物為範例,但不限於此。另外,離形層102上設置了可撓式顯示面板200。1A-1F are schematic flow charts of a method of manufacturing a flexible display panel according to an embodiment of the invention. Referring to FIG. 1A, a support substrate 100 is first provided, and the support substrate 100 has a release layer 102 thereon. The material of the support substrate 100 may be glass, quartz, metal, ceramic, or other applicable materials. The release layer 102 is attached to the surface of the support substrate 100. Detached The material of layer 102 can be a polymer, an organic material, an inorganic material, or a combination thereof. The release layer 102 of the present embodiment is exemplified by a polymer, but is not limited thereto. In addition, a flexible display panel 200 is disposed on the release layer 102.
根據本實施例,位於離形層102上之可撓式顯示面板200包括基材202、顯示介質層204以及阻障層206。According to the present embodiment, the flexible display panel 200 on the release layer 102 includes a substrate 202, a display dielectric layer 204, and a barrier layer 206.
上述之基材202上具有畫素陣列層(未繪示出)。基材202為可撓式基材,其例如是有機聚合物基材。另外,位於基材202上之畫素陣列層包括多條掃描線、多條資料線以及多個畫素單元,每一個畫素單元包括至少一個主動元件以及與主動元件電性連接的至少一畫素電極。The substrate 202 described above has a pixel array layer (not shown). Substrate 202 is a flexible substrate such as an organic polymeric substrate. In addition, the pixel array layer on the substrate 202 includes a plurality of scan lines, a plurality of data lines, and a plurality of pixel units, each of the pixel units including at least one active element and at least one picture electrically connected to the active element. Prime electrode.
顯示介質層204位於基材202上以覆蓋畫素陣列層。顯示介質層204可為電泳顯示介質層、液晶顯示介質層、電濕潤顯示介質層或是其他適用的顯示介質層。Display medium layer 204 is located on substrate 202 to cover the pixel array layer. Display medium layer 204 can be an electrophoretic display medium layer, a liquid crystal display medium layer, an electrowetting display medium layer, or other suitable display medium layer.
阻障層206覆蓋顯示介質層204,其主要是用來保護顯示介質層204。阻障層206可為有機絕緣薄膜或是無機絕緣薄膜。根據本實施例,阻障層206之尺寸大於顯示介質層204以及基材202之尺寸,因此阻障層206之邊緣部未被顯示介質層204以及基材202覆蓋,但本發明不以此為限。換言之,在其他的實施例中,阻障層206之尺寸也可以與顯示介質層204以及基材202之尺寸相當。另外,根據其他實施例,在阻障層206與顯示介質層204之間可進一步設置電極層(未繪示),但本發明不以此為限。The barrier layer 206 covers the display dielectric layer 204, which is primarily used to protect the display dielectric layer 204. The barrier layer 206 can be an organic insulating film or an inorganic insulating film. According to the embodiment, the size of the barrier layer 206 is larger than the size of the display dielectric layer 204 and the substrate 202. Therefore, the edge portion of the barrier layer 206 is not covered by the display dielectric layer 204 and the substrate 202, but the present invention does not limit. In other words, in other embodiments, the size of the barrier layer 206 may also be comparable to the dimensions of the display dielectric layer 204 and the substrate 202. In addition, according to other embodiments, an electrode layer (not shown) may be further disposed between the barrier layer 206 and the display dielectric layer 204, but the invention is not limited thereto.
根據本實施例,上述支撐基板100與離形層102之間的黏著力大於離形層102與可撓式顯示面板200(基材202) 之間的黏著力。According to the embodiment, the adhesion between the support substrate 100 and the release layer 102 is greater than that of the release layer 102 and the flexible display panel 200 (substrate 202). The adhesion between them.
值得一提的是,上述之支撐基板100具有切割線CL,且切割線CL與可撓式顯示面板200之邊緣E相距距離d。根據本實施例,所述切割線CL與可撓式顯示面板200之邊緣E之間的距離d例如是約1~2um。換言之,支撐基板100之切割線CL與可撓式顯示面板200之邊緣E不是彼此對齊。It is worth mentioning that the above-mentioned support substrate 100 has a cutting line CL, and the cutting line CL is at a distance d from the edge E of the flexible display panel 200. According to the embodiment, the distance d between the cutting line CL and the edge E of the flexible display panel 200 is, for example, about 1 to 2 um. In other words, the cutting line CL of the support substrate 100 and the edge E of the flexible display panel 200 are not aligned with each other.
在本實施例中,如圖1A及如圖2所示,可撓式顯示面板200具有多個邊緣區域,且支撐基板100之切割線CL是對應設置在顯示面板200之其中一個邊緣區域。換言之,本實施例之支撐基板100之切割線CL可以不需要圍繞在顯示面板200之周圍,其可以僅對應設置在顯示面板200之其中一邊緣即可。In the present embodiment, as shown in FIG. 1A and FIG. 2, the flexible display panel 200 has a plurality of edge regions, and the cutting line CL of the support substrate 100 is correspondingly disposed on one of the edge regions of the display panel 200. In other words, the cutting line CL of the support substrate 100 of the present embodiment may not need to surround the display panel 200 , and may be disposed only on one edge of the display panel 200 .
接著,請參照圖1B,將支撐基板100翻轉至承載裝置300上,以使得可撓式顯示面板200位於承載裝置300以及支撐基板100之間。根據本實施例,當將支撐基板100翻轉至承載裝置300上以使得可撓式顯示面板200同時被翻轉至承載裝置300之後,可撓式顯示面板200之阻障層206與承載裝置300接觸。在此,承載裝置300可為真空承載裝置,因此當可撓式顯示面板200被翻轉至承載裝置300上之後,藉由承載裝置300之真空吸附力302可使得可撓式顯示面板200被真空吸附於承載裝置300上。Next, referring to FIG. 1B , the support substrate 100 is flipped onto the carrier device 300 such that the flexible display panel 200 is located between the carrier device 300 and the support substrate 100 . According to the present embodiment, after the support substrate 100 is flipped onto the carrier device 300 such that the flexible display panel 200 is simultaneously flipped to the carrier device 300, the barrier layer 206 of the flexible display panel 200 is in contact with the carrier device 300. Here, the carrying device 300 can be a vacuum carrying device, so after the flexible display panel 200 is flipped onto the carrying device 300, the flexible display panel 200 can be vacuum-adsorbed by the vacuum suction force 302 of the carrying device 300. On the carrying device 300.
之後,沿著支撐基板100之切割線CL對支撐基板100進行切割程序,以使可撓式顯示面板200的一部份裸露出 來,如圖1C所示。也就是說,切割線CL之外的一小部份支撐基板100會被移除,以暴露出可撓式顯示面板200的一部份,而切割線CL之內的一大部份支撐基板100仍會被保留。在本實施例中,上述之切割程序是同時切割支撐基板100以及離形層102。另外,上述之切割程序例如是採用機械刀具切割、光學切割或是其他合適的切割方式。在此,於對支撐基板100進行切割程序時,承載裝置300之真空吸附力302可使得可撓式顯示面板200被真空吸附於承載裝置300上。因此,於進行上述切割程序時,可撓式顯示面板200仍可固定在特定位置而不會產生位移。Thereafter, the support substrate 100 is subjected to a cutting process along the cutting line CL of the support substrate 100 to expose a portion of the flexible display panel 200 Come, as shown in Figure 1C. That is, a small portion of the support substrate 100 other than the cutting line CL is removed to expose a portion of the flexible display panel 200, and a large portion of the support substrate 100 within the cutting line CL is supported. Will still be retained. In the present embodiment, the above cutting process is to simultaneously cut the support substrate 100 and the release layer 102. In addition, the above cutting procedure is, for example, mechanical cutting, optical cutting or other suitable cutting method. Here, when the cutting process is performed on the support substrate 100, the vacuum adsorption force 302 of the carrier device 300 may cause the flexible display panel 200 to be vacuum-adsorbed onto the carrier device 300. Therefore, when the above cutting process is performed, the flexible display panel 200 can be fixed at a specific position without displacement.
值得一提的是,由於支撐基板100之切割線CL與可撓式顯示面板200之邊緣E相距距離d(例如是約1~2um),因此在沿著支撐基板100之切割線CL對支撐基板100進行切割程序並且將被切割的支撐基板100之邊緣部分移除之後,可撓式顯示面板200的一部份會被裸露出來。更詳細來說,可撓式顯示面板200之基材202的一部份會被裸露出來。It is worth mentioning that since the cutting line CL of the supporting substrate 100 is at a distance d from the edge E of the flexible display panel 200 (for example, about 1 to 2 um), the supporting substrate is aligned on the cutting line CL along the supporting substrate 100. After the cutting process is performed 100 and the edge portion of the cut support substrate 100 is removed, a portion of the flexible display panel 200 is exposed. In more detail, a portion of the substrate 202 of the flexible display panel 200 will be exposed.
請參照圖1D,對可撓式顯示面板200被裸露出的部份施予下壓力道,以使可撓式顯示面板200與離形層102之間產生縫細S。換言之,上述可撓式顯示面板200之基材202被裸露出來的一部份可作為對可撓式顯示面板200施予下壓力道的著力處。根據本實施例,上述施予下壓力道之步驟例如是利用下壓工具400對可撓式顯示面板200(基材202)被裸露出的部份施予下壓力道。由於可撓式 顯示面板200(基材202)本身具有一定的柔軟性,因此當下壓工具400對可撓式顯示面板200(基材202)被裸露出的部份施予下壓力道之後,可使得可撓式顯示面板200之基材202與離形層102之間產生細縫S,進而使可撓式顯示面板200之基材202與離形層102之間的真空度被破壞掉。而由於可撓式顯示面板200之基材202與離形層102之間的真空度已經被破壞掉,因而可撓式顯示面板200之基材202與離形層102之間便不再緊密地貼合在一起。Referring to FIG. 1D, a lower pressure channel is applied to the exposed portion of the flexible display panel 200 to create a slit S between the flexible display panel 200 and the release layer 102. In other words, a portion of the substrate 202 of the flexible display panel 200 that is exposed may serve as a force for applying the lower pressure channel to the flexible display panel 200. According to the present embodiment, the step of applying the lower pressure path is, for example, applying a lower pressure path to the exposed portion of the flexible display panel 200 (substrate 202) by the pressing tool 400. Due to flexible The display panel 200 (substrate 202) itself has a certain flexibility, so that when the pressing tool 400 applies a lower pressure path to the exposed portion of the flexible display panel 200 (substrate 202), the flexible type can be made flexible. A slit S is formed between the substrate 202 of the display panel 200 and the release layer 102, so that the degree of vacuum between the substrate 202 of the flexible display panel 200 and the release layer 102 is destroyed. Since the vacuum between the substrate 202 and the release layer 102 of the flexible display panel 200 has been destroyed, the substrate 202 of the flexible display panel 200 and the release layer 102 are no longer closely spaced. Fit together.
在本實施例中,於對可撓式顯示面板200被裸露出的部份施予下壓力道時,承載裝置300之真空吸附力302可使得可撓式顯示面板200被真空吸附於承載裝置300上。因此,於進行上述程序時,可撓式顯示面板200仍可固定在特定位置而不會產生位移。In the embodiment, when the lower pressure channel is applied to the exposed portion of the flexible display panel 200, the vacuum adsorption force 302 of the carrying device 300 can cause the flexible display panel 200 to be vacuum-adsorbed to the carrying device 300. on. Therefore, when the above procedure is performed, the flexible display panel 200 can be fixed at a specific position without displacement.
之後,如圖1E所示,將支撐基板100以及離形層102自可撓式顯示面板200移除。根據本實施例,將支撐基板100以及離形層102自可撓式顯示面板200移除的方法例如是採用真空吸附裝置500將支撐基板100以及離形層102自可撓式顯示面板200移除。更詳細來說,真空吸附裝置500可藉由真空吸附力502將支撐基板100吸附住,而因支撐基板100與離形層102之間的黏著力又大於離形層102與可撓式顯示面板200(基材202)之間的黏著力。此外,可撓式顯示面板200又被真空承載裝置300之真空吸附力302吸附住。此時,因為可撓式顯示面板200之基材202與離形層102之間的真空度已經被破壞掉,因而當真 空吸附裝置500將支撐基板100移開可撓式顯示面板200時,即可輕易的將支撐基板100以及離形層102自可撓式顯示面板200移除或是剝離。Thereafter, as shown in FIG. 1E, the support substrate 100 and the release layer 102 are removed from the flexible display panel 200. According to the embodiment, the method of removing the support substrate 100 and the release layer 102 from the flexible display panel 200 is, for example, removing the support substrate 100 and the release layer 102 from the flexible display panel 200 by using the vacuum adsorption device 500. . In more detail, the vacuum adsorption device 500 can adsorb the support substrate 100 by the vacuum adsorption force 502, and the adhesion between the support substrate 100 and the release layer 102 is greater than that of the release layer 102 and the flexible display panel. Adhesion between 200 (substrate 202). In addition, the flexible display panel 200 is again attracted by the vacuum suction force 302 of the vacuum carrying device 300. At this time, since the degree of vacuum between the substrate 202 of the flexible display panel 200 and the release layer 102 has been destroyed, it is true. When the empty adsorption device 500 removes the support substrate 100 from the flexible display panel 200, the support substrate 100 and the release layer 102 can be easily removed or peeled off from the flexible display panel 200.
在將支撐基板100以及離形層102自可撓式顯示面板200移除或是剝離之後,可撓式顯示面板200之基材202會被裸露出來。因此,為了避免可撓式顯示面板200之基材202受到損傷,可進一步在可撓式顯示面板200之基材202之表面覆蓋一層保護膜600,如圖1F所示。上述之保護層600可為有機材質之保護膜或是無機材質之保護膜。After the support substrate 100 and the release layer 102 are removed or peeled off from the flexible display panel 200, the substrate 202 of the flexible display panel 200 may be exposed. Therefore, in order to prevent the substrate 202 of the flexible display panel 200 from being damaged, the surface of the substrate 202 of the flexible display panel 200 may be further covered with a protective film 600, as shown in FIG. 1F. The protective layer 600 may be a protective film of an organic material or a protective film of an inorganic material.
綜上所述,在上述實施例之製造方法中,因此方法是先對支撐基板進行切割程序以使可撓式顯示面板的一部份裸露出來,之後再對可撓式顯示面板被裸露出的部份施予下壓力道以使可撓式顯示面板與離形層之間產生縫細,藉以達到破除可撓式顯示面板與支撐基板之間的真空度。由於可撓式顯示面板與支撐基板之間的真空度已經被破壞。因此,後續便可輕易的將支撐基板以及離形層自可撓式顯示面板移除。由於支撐基板以及離形層可輕易的自可撓式顯示面板移除,因此於進行支撐基板以及離形層自可撓式顯示面板移除之過程之中不需採用其他額外的輔助製程或是以強力撕除方式移除,因而本發明之方法不易對可撓式顯示面板造成傷害。In summary, in the manufacturing method of the above embodiment, the method is to first perform a cutting process on the supporting substrate to expose a part of the flexible display panel, and then expose the flexible display panel. Part of the lower pressure channel is applied to create a thin seam between the flexible display panel and the release layer, thereby breaking the vacuum between the flexible display panel and the support substrate. The degree of vacuum between the flexible display panel and the support substrate has been destroyed. Therefore, the support substrate and the release layer can be easily removed from the flexible display panel in the subsequent steps. Since the support substrate and the release layer can be easily removed from the flexible display panel, no additional auxiliary process is required during the process of removing the support substrate and the release layer from the flexible display panel. It is removed by strong tearing, so the method of the present invention is not easy to damage the flexible display panel.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. this The scope of the invention is defined by the scope of the appended claims.
100‧‧‧支撐基板100‧‧‧Support substrate
102‧‧‧離形層102‧‧‧Fractal layer
200‧‧‧可撓式顯示面板200‧‧‧flexible display panel
202‧‧‧基材202‧‧‧Substrate
204‧‧‧顯示介質層204‧‧‧Display media layer
206‧‧‧阻障層206‧‧‧Barrier layer
300‧‧‧承載裝置300‧‧‧ Carrying device
302‧‧‧真空吸附力302‧‧‧vacuum adsorption
400‧‧‧下壓工具400‧‧‧Under pressure tool
500‧‧‧真空吸附裝置500‧‧‧Vacuum adsorption device
502‧‧‧真空吸附力502‧‧‧vacuum adsorption
600‧‧‧保護膜600‧‧‧Protective film
S‧‧‧細縫S‧‧‧Slit
E‧‧‧邊緣E‧‧‧ edge
CL‧‧‧切割線CL‧‧‧ cutting line
d‧‧‧距離D‧‧‧distance
圖1A至圖1F是根據本發明一實施例之可撓式顯示面板的製造方法的流程示意圖。1A-1F are schematic flow charts of a method of manufacturing a flexible display panel according to an embodiment of the invention.
圖2是圖1A的上視示意圖。Figure 2 is a top plan view of Figure 1A.
100‧‧‧支撐基板100‧‧‧Support substrate
102‧‧‧離形層102‧‧‧Fractal layer
200‧‧‧可撓式顯示面板200‧‧‧flexible display panel
202‧‧‧基材202‧‧‧Substrate
204‧‧‧顯示介質層204‧‧‧Display media layer
206‧‧‧阻障層206‧‧‧Barrier layer
300‧‧‧承載裝置300‧‧‧ Carrying device
302‧‧‧真空吸附力302‧‧‧vacuum adsorption
S‧‧‧細縫S‧‧‧Slit
400‧‧‧下壓工具400‧‧‧Under pressure tool
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TW201039297A (en) * | 2009-04-17 | 2010-11-01 | Ind Tech Res Inst | Method for isolating a flexible substrate from a carrier and method for fabricating an electric device |
EP2246732A1 (en) * | 2009-04-28 | 2010-11-03 | Samsung Corning Precision Materials Co., Ltd. | Flexible substrate for display panel and manufacturing method thereof |
WO2011031605A1 (en) * | 2009-09-08 | 2011-03-17 | Global Oled Technology Llc | Tiled display with overlapping flexible substrates |
TW201113147A (en) * | 2009-10-09 | 2011-04-16 | Micro Technology Co Ltd | Process for producing flexible glass substrate, and flexible glass substrate |
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TW201039297A (en) * | 2009-04-17 | 2010-11-01 | Ind Tech Res Inst | Method for isolating a flexible substrate from a carrier and method for fabricating an electric device |
EP2246732A1 (en) * | 2009-04-28 | 2010-11-03 | Samsung Corning Precision Materials Co., Ltd. | Flexible substrate for display panel and manufacturing method thereof |
WO2011031605A1 (en) * | 2009-09-08 | 2011-03-17 | Global Oled Technology Llc | Tiled display with overlapping flexible substrates |
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