TWI423298B - An excimer lamp and a method for manufacturing the excimer lamp - Google Patents
An excimer lamp and a method for manufacturing the excimer lamp Download PDFInfo
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- TWI423298B TWI423298B TW097148238A TW97148238A TWI423298B TW I423298 B TWI423298 B TW I423298B TW 097148238 A TW097148238 A TW 097148238A TW 97148238 A TW97148238 A TW 97148238A TW I423298 B TWI423298 B TW I423298B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J65/00—Lamps without any electrode inside the vessel; Lamps with at least one main electrode outside the vessel
- H01J65/04—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels
- H01J65/042—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels by an external electromagnetic field
- H01J65/046—Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating plasma display panels by an external electromagnetic field the field being produced by using capacitive means around the vessel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/50—Means forming part of the tube or lamps for the purpose of providing electrical connection to it
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/30—Vessels; Containers
- H01J61/35—Vessels; Containers provided with coatings on the walls thereof; Selection of materials for the coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/54—Igniting arrangements, e.g. promoting ionisation for starting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/245—Manufacture or joining of vessels, leading-in conductors or bases specially adapted for gas discharge tubes or lamps
- H01J9/247—Manufacture or joining of vessels, leading-in conductors or bases specially adapted for gas discharge tubes or lamps specially adapted for gas-discharge lamps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
- H05B41/14—Circuit arrangements
- H05B41/26—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc
- H05B41/28—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters
- H05B41/2806—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters with semiconductor devices and specially adapted for lamps without electrodes in the vessel, e.g. surface discharge lamps, electrodeless discharge lamps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B41/00—Circuit arrangements or apparatus for igniting or operating discharge lamps
- H05B41/14—Circuit arrangements
- H05B41/26—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc
- H05B41/28—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters
- H05B41/2806—Circuit arrangements in which the lamp is fed by power derived from dc by means of a converter, e.g. by high-voltage dc using static converters with semiconductor devices and specially adapted for lamps without electrodes in the vessel, e.g. surface discharge lamps, electrodeless discharge lamps
- H05B41/2813—Arrangements for protecting lamps or circuits against abnormal operating conditions
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Vessels And Coating Films For Discharge Lamps (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
本發明是關於準分子燈及準分子燈的製造方法。尤其是，關於在半導體基板或液晶基板等的製程中，被利用於半導體基板或液晶基板的洗淨等的準分子燈及該準分子燈的製造方法。The present invention relates to a method of producing an excimer lamp and an excimer lamp. In particular, in the process of a semiconductor substrate, a liquid crystal substrate, or the like, an excimer lamp used for cleaning a semiconductor substrate or a liquid crystal substrate, and a method of manufacturing the excimer lamp.
在最近的半導體基板或是液晶基板等的製程中，作為除去附著於半導體基板的矽晶圓或液晶基板的玻璃基板的表面的有機化合物等的污垢的方法，廣泛地被利用著利用紫外線的乾式洗淨方法。尤其是在使用從準分子燈所放射的真空紫外光的臭氧或活性氧氣所致的洗淨方法中，有更有效率且在短時間加以洗淨的各種洗淨裝置被提案，眾如有如專利文獻1(日本特開2000-260396號)。In the process of a semiconductor substrate or a liquid crystal substrate, a dry method using ultraviolet rays is widely used as a method of removing dirt such as an organic compound on the surface of a glass substrate or a liquid crystal substrate of a liquid crystal substrate. Washing method. In particular, in the cleaning method using ozone or active oxygen derived from vacuum ultraviolet light emitted from an excimer lamp, various cleaning devices which are more efficiently and washed in a short time are proposed, and are as patented as in the patent. Document 1 (Japanese Patent Laid-Open No. 2000-260396).
表示於專利文獻1的紫外線照射處理裝置是準分子燈連設複數於被處理體的搬運方向，而構成準分子照射面對於被處理體成為一定距離，一面朝所定方向搬運被處理體，一面點燈驅動各個準分子燈，藉由將從各個準分子燈所放射的準分子光照射到被處理體的表面，俾乾式洗淨被處理體的表面。依照表示於同文獻的紫外線照射處理裝置，藉由氧氣使得準分子光被吸收而為了抑制準分子光被衰減的情形，在將被處理體配置在距準分子照射面8mm以內的狀態下，作成將準分子光照射在被處理體的表面。In the ultraviolet irradiation processing apparatus of the patent document 1, the excimer lamp is connected to the conveyance direction of the object to be processed, and the object to be processed is conveyed in a predetermined direction while the excimer irradiation surface is at a predetermined distance from the object to be processed. Each of the excimer lamps is driven by the lighting to dry the surface of the object to be processed by irradiating the excimer light emitted from each of the excimer lamps onto the surface of the object to be processed. According to the ultraviolet irradiation processing apparatus shown in the same document, excimer light is absorbed by oxygen, and in order to suppress the attenuation of excimer light, the object to be processed is placed within 8 mm from the excimer irradiation surface. Excimer light is irradiated on the surface of the object to be processed.
可是，習知的準分子燈是具備如專利文獻2(日本特開2004-342369號)所示的饋電構造。第8圖是表示習知的準分子燈的饋電構造的概略圖式。However, the conventional excimer lamp is provided with a feed structure as shown in Patent Document 2 (JP-A-2004-342369). Fig. 8 is a schematic view showing a feed structure of a conventional excimer lamp.
表示於同圖的準分子燈A是具備：在被形成於介質材料所成的長方體形狀的放電容器B的內部的密閉空間S封入有生成準分子分子的氣體，而且設置於隔著放電容器B的密閉空間S相對的位置的一對電極C,D。各個電極C,D是藉由真空蒸鍍鎳或鉻等的金屬薄膜所形成，一方的電極D是網目狀地形成除了為了取出紫外線而附設引入線的端部以外。在電極D的端部，藉由使用焊料F焊接有解開成為露出的複數條芯線的狀態的引入線E的芯線部Ea。The excimer lamp A shown in the same figure is provided with a gas for generating an excimer molecule in a sealed space S formed inside a discharge vessel B formed of a dielectric material, and is provided with a discharge capacitor B interposed therebetween. A pair of electrodes C, D at the opposite positions of the confined space S. Each of the electrodes C and D is formed by vacuum-depositing a metal thin film such as nickel or chromium, and one electrode D is formed in a mesh shape in addition to an end portion to which a lead-in wire is attached for taking out ultraviolet rays. At the end of the electrode D, a core portion Ea of the lead-in wire E in a state in which a plurality of exposed core wires are unwound is welded by using the solder F.
專利文獻1：日本特開2000-260396號專利文獻2：日本特開2004-342369號Patent Document 1: Japanese Patent Laid-Open No. 2000-260396 Patent Document 2: Japanese Patent Laid-Open No. 2004-342369
在專利文獻1的紫外線照射處理裝置中，因以下的理由，判明了藉由氧化固定表示於第8圖的準分子燈A的電極D與引入線E的芯線部Ea，有降低兩者的連接部的機械性強度之虞。亦即，可能為從準分子燈A所放射的紫外線被吸收在存在於準分子燈周圍的氧氣而在準分子燈的周圍生成臭氧，藉由所生成的臭氧會氧化焊料F的表面而導致焊料F會劣化者。如此地，若劣化固定電極與引入線的焊料，則在用來進行下一洗淨的被處理體被搬運為止的期間，熄燈準分子燈而待機時，或是點燈驅動準分子燈來進行被處理體的洗淨時等把焊料破損而引入線從電極離開，藉此，欲對於被處理體照射紫外線時成為無法點亮準分子燈，或是對於被處理體照射紫外線時，產生突然熄掉準分子燈的不方便。In the ultraviolet irradiation processing apparatus of the patent document 1, it is considered that the electrode D of the excimer lamp A shown in Fig. 8 and the core portion Ea of the lead-in line E are fixed by oxidation, and the connection between the two is lowered. The mechanical strength of the Ministry. That is, it is possible that ultraviolet rays emitted from the excimer lamp A are absorbed in the oxygen existing around the excimer lamp to generate ozone around the excimer lamp, and the generated ozone oxidizes the surface of the solder F to cause solder. F will deteriorate. In this way, when the solder of the fixed electrode and the lead-in wire is deteriorated, the excimer lamp is turned off while the object to be processed for the next cleaning is being carried, and the excimer lamp is driven by the lamp. When the object to be treated is damaged, the solder is broken and the lead-in wire is separated from the electrode. Therefore, when the object to be processed is irradiated with ultraviolet rays, the excimer lamp cannot be turned on, or when the object to be processed is irradiated with ultraviolet rays, a sudden extinguishment occurs. It is inconvenient to drop the excimer lamp.
由以上，本發明的目的是在於提供一對電極隔著放電容器的密閉空間相對所形成，而且藉由焊料固定著各個電極與將電力供應於各個電極所用的引入線的準分子燈，可抑制焊料的劣化的準分子燈及該準分子燈的製造方法。In view of the above, an object of the present invention is to provide an excimer lamp in which a pair of electrodes are formed opposite to each other through a sealed space of a discharge vessel, and each electrode and a lead wire for supplying electric power to each electrode are fixed by solder. An excimer lamp for deteriorating solder and a method of manufacturing the same.
本發明的準分子燈，是在被形成於由介質材料所構成的放電容器內部的密閉空間封入有放電用氣體，金屬薄膜所成的一對電極隔著上述密閉空間而被形成於上述放電容器的外表面，用以饋電於各個電極的各個引入線經由焊料被電性地連接於各個電極的準分子燈，其特徵為：在上述焊料的周圍形成有保護膜。In the excimer lamp of the present invention, a discharge gas is sealed in a sealed space formed inside a discharge vessel formed of a dielectric material, and a pair of electrodes formed of a metal thin film are formed in the discharge vessel via the sealed space. The outer surface of the excimer lamp for electrically feeding the respective lead-in wires of the respective electrodes to the respective electrodes via solder is characterized in that a protective film is formed around the solder.
又，在上述引入線連接有板狀饋電端子，該饋電端子與上述電極為藉由上述焊料所連接，為其特徵者。Further, a plate-shaped feed terminal is connected to the lead-in wire, and the feed terminal and the electrode are connected by the solder.
又，在上述饋電端子的周圍形成有上述保護膜，為其特徵者。Further, the protective film is formed around the feed terminal, and is characterized by the above.
又，上述保護膜為二氧化矽所成，為其特徵者。Further, the protective film is made of cerium oxide and is characterized by the above.
又，上述保護膜為塗佈聚矽氨烷溶液，而藉由轉化成二氧化矽所形成，為其特徵者。Further, the protective film is characterized by being coated with a polyamidane solution and formed by conversion into cerium oxide.
又，上述電極是被連接有上述引入線的部位與其他以外的部位分開，而且連接有該引入線的部位與其他以外的部位藉由導電性糊電性地被連接，在該導電性糊的周圍形成有上述保護膜，為其特徵者。Further, the electrode is separated from the other portion by the portion to which the lead-in wire is connected, and the portion to which the lead-in wire is connected is electrically connected to the other portion by a conductive paste, and the conductive paste is electrically connected to the conductive paste. The above protective film is formed around it and is characterized by it.
又，本發明的製造方法，是在被形成於由介質材料所構成的放電容器內部的密閉空間封入有放電用氣體，金屬薄膜所成的一對電極隔著上述密閉空間而被形成於上述放電容器的外表面，用以饋電於各個電極的各個引入線經由焊料被電性地連接於各個電極的準分子燈的製造方法，其特徵為：具備以下製程：1.在放電容器的外表面形成金屬薄膜所成的電極的製程，2.在1.的製程之後，藉由加熱熔融焊料，而經由焊料電性地連接外部電極與引入線的製程，3.在2.的製程之後，在焊料的周圍塗佈聚矽氨烷溶液，而使之乾燥，而在焊料的周圍形成保護膜的製程。Further, in the manufacturing method of the present invention, a discharge gas is sealed in a sealed space formed in a discharge vessel formed of a dielectric material, and a pair of electrodes formed of a metal thin film are formed in the discharge via the sealed space. The outer surface of the container, the manufacturing method of the excimer lamp for electrically feeding the respective lead-in wires of the respective electrodes to the respective electrodes via solder, characterized in that the following processes are provided: 1. On the outer surface of the discharge vessel a process for forming an electrode formed by a metal thin film, 2. a process of electrically connecting the external electrode and the lead-in wire via solder by heating the molten solder after the 1. process, 3. after the 2. process, A process in which a polyamidane solution is applied around the solder to dry it to form a protective film around the solder.
依照本發明的準分子燈，一對電極隔著放電容器的密閉空間而相對所形成，而且藉由焊料來固定各個電極與用以將電力供應於各個電極的各個引入線者，在焊料的周圍形成有保護膜之故，因而確實地可防止藉由發生在準分子燈的周圍的臭氧把焊料氧化而劣化的情形。所以一直到下一被處理體被搬運為止的等待期間或在點燈驅動放電燈時，焊料不會破損，引入線不會從電極離開的情形，因此，欲點亮準分子燈時則確實地可點亮，又確實地可防止對於被處理體照射紫外線來洗淨被處理體的期間不會突然地熄熄滅準分子燈的情形。According to the excimer lamp of the present invention, a pair of electrodes are opposed to each other via a sealed space of the discharge vessel, and each of the electrodes and the respective lead wires for supplying electric power to the respective electrodes are fixed by solder, around the solder. Since the protective film is formed, it is possible to surely prevent deterioration of the solder by oxidation of ozone generated around the excimer lamp. Therefore, the solder is not damaged until the waiting period of the next object to be processed or when the discharge lamp is driven by the lighting, and the lead-in wire does not leave the electrode. Therefore, when the excimer lamp is to be lit, it is surely It is possible to illuminate and reliably prevent the target body from being suddenly extinguished during the period in which the object to be processed is irradiated with ultraviolet rays to clean the object to be processed.
又，在上述引入線連接有饋電端子，而藉由上述焊料固定有饋電端子與上述電極之故，因而可將饋電端子與外部電極的連接作成更牢固。Further, a feed terminal is connected to the lead-in wire, and the feed terminal and the electrode are fixed by the solder, so that the connection between the feed terminal and the external electrode can be made stronger.
又，在上述饋電端子的周圍形成有上述保護膜之故，因而確實地可防止藉由臭氧把饋電端子作成劣化的情形。Further, since the protective film is formed around the feed terminal, it is possible to reliably prevent the feed terminal from being deteriorated by ozone.
又，上述保護膜由二氧化矽所成者之故，因而更確實地可防止焊料的劣化。Further, since the protective film is made of ruthenium dioxide, deterioration of the solder can be prevented more reliably.
又，上述保護膜藉由塗佈乾燥聚矽氨烷溶液所形成之故，因而不必進行高溫的加熱處理可形成保護膜。所以，藉由焊料成為焊料不會熔融程度的溫度的熱處理可形成保護膜之故，因而具有避免焊料朝固定部以外的部位流動，或是避免金屬電極分散於焊料中而被剝落的優點。Further, since the protective film is formed by applying a dried polyamidane solution, it is not necessary to perform a high-temperature heat treatment to form a protective film. Therefore, since the protective film is formed by the heat treatment in which the solder becomes a temperature at which the solder does not melt, there is an advantage that the solder is prevented from flowing toward a portion other than the fixed portion, or the metal electrode is prevented from being scattered in the solder and peeled off.
又，上述電極是被連接有上述引入線的部位與其他以外的部位離開，而且連接有該引入線的部位與其他以外的部位藉由導電性糊電性被連接，而在該導電性糊的周圍形成有上述保護膜。因此，不會有電性地連接引入線的部位與其他以外的部位的導電性糊藉由臭氧被劣化之虞。Further, the electrode is separated from the other portion by the portion to which the lead-in wire is connected, and the portion to which the lead-in wire is connected is connected to the other portion by conductive paste, and the conductive paste is The above protective film is formed around. Therefore, there is no possibility that the conductive paste of the portion where the lead-in wire is electrically connected and the other portion is deteriorated by ozone.
還有，依照上述的本發明的製造方法，藉由使用聚矽氨烷溶液，藉由以焊料不會熔解程度的溫度進行熱處理，而可將二氧化矽所成的保護膜容易形成在焊料的周圍之故，因而不會損及焊接部的可靠性地形成二氧化矽膜，而具有可提昇焊接部的耐久性的優點。Further, according to the above-described production method of the present invention, the protective film formed of cerium oxide can be easily formed on the solder by using a polyamitane solution and heat-treating at a temperature at which the solder does not melt. In addition, the ruthenium dioxide film is formed without damaging the reliability of the welded portion, and has an advantage of improving the durability of the welded portion.
第1圖是表示本發明的準分子燈的全體構成的立體圖。第2圖是表示擴大本發明的準分子燈的電極與引入線的連接部的斷面圖。在第2圖中，為了方便僅表示一方的電極與一方的引入線的連接部分的構成。Fig. 1 is a perspective view showing the overall configuration of an excimer lamp of the present invention. Fig. 2 is a cross-sectional view showing a portion in which the electrode of the excimer lamp of the present invention and the inlet are enlarged. In the second drawing, for the sake of convenience, only the configuration of the connection portion between one electrode and one lead-in line is shown.
準分子燈100是由介質材料的矽玻璃所構成，具有在四隅部具圓味的扁平的方筒形狀的放電容器1，在形成於放電容器1的內部的密閉空間S，例如氯氣體等的稀有氣體，或是將氯氣體等的鹵素氣體混合於稀有氣體者充填作為放電氣體，藉由氣體的種類發生著不相同波長的準分子光。放電氣體一般是以約10～100KPa的壓力被填充。The excimer lamp 100 is made of a bismuth glass of a dielectric material, and has a flat rectangular tube-shaped discharge vessel 1 having a rounded taste at the four sides, and is formed in the sealed space S inside the discharge vessel 1, for example, chlorine gas or the like. A rare gas or a halogen gas such as a chlorine gas mixed with a rare gas is filled as a discharge gas, and excimer light having a different wavelength is generated by the type of the gas. The discharge gas is generally filled at a pressure of about 10 to 100 KPa.
放電容器1是位於紙面的上方側的平坦壁11與位於紙面的下方側的平坦壁12為互相地隔開而平行地伸展，而且在平坦壁11,12的各個寬度方向(對於管軸正交的方向)的端部分別連續形成有彎曲部13。此種放電容器1是在第1圖的紙面位於上下的平坦壁11,12的任一形成朝被處理體出射紫外線所用的光出射面。例如，在將被處理體配置於放電容器1的下方時，位於下方側的平坦壁12成為光出射面。表示此種放電容器1的數值例，則管軸方向的全長為904mm，發光長(配設有電極的領域的管軸方向的全長度)為790mm，左右的寬度方向的長度為43mm，而上下的高度方向的長度為15mm。The discharge vessel 1 is such that the flat wall 11 on the upper side of the paper surface and the flat wall 12 on the lower side of the paper surface are spaced apart from each other and extend in parallel, and in the respective width directions of the flat walls 11, 12 (orthogonal to the tube axis) The bent portion 13 is continuously formed at the ends of the direction. The discharge vessel 1 is a light-emitting surface for forming an ultraviolet ray that emits ultraviolet light toward the object to be processed, in any of the flat walls 11 and 12 on the upper and lower sides of the paper surface of Fig. 1. For example, when the object to be processed is placed under the discharge vessel 1, the flat wall 12 located on the lower side becomes the light exit surface. In the numerical example of the discharge vessel 1, the total length in the tube axis direction is 904 mm, the light emission is long (the full length in the tube axis direction in the field in which the electrode is disposed) is 790 mm, and the length in the left and right width directions is 43 mm. The length in the height direction is 15 mm.
在平坦壁11,12，分別配置有電極3,4。電極3,4是例如將金、銀、銅、鎳、鉻等的耐蝕性金屬藉由進行印刷或蒸鍍於平坦壁11,12上，例如厚度形成成為0.1um～數十um。例如，如上述地位於下方側的平坦壁12成為光出射面時，電極4是將上述金屬藉由進行印刷或蒸鍍成為格子狀俾形成具有透光性。電極3是被連接於饋電裝置14的高壓側的引入線15，而位於下方的電極4是被連接於接地側的引入線16。Electrodes 3, 4 are disposed on the flat walls 11, 12, respectively. The electrodes 3 and 4 are printed or vapor-deposited on the flat walls 11 and 12 by, for example, a corrosion-resistant metal such as gold, silver, copper, nickel or chromium. For example, the thickness is 0.1 μm to several tens of um. For example, when the flat wall 12 located on the lower side is the light emitting surface as described above, the electrode 4 is formed to have light transmissivity by printing or vapor-depositing the metal into a lattice shape. The electrode 3 is a lead-in line 15 connected to the high voltage side of the power feeding device 14, and the electrode 4 located below is a lead-in line 16 connected to the ground side.
如第2圖所示地，引入線15是藉由絕緣材料被除去而成為露出的芯線部15a與以絕緣材料覆蓋芯線周圍的被覆部15b所構成，芯線部15a為使用焊料17被焊接於電極3，藉此，電性及機械性地被固定於電極3。焊料17是設置成可圍繞引入線15的芯線部15a的周圍。在焊料17的周圍，形成有耐臭氧性材料所成的保護膜18成為不會把焊料17露出於外部。焊料17是例如有Sn-Pb、Sn-In等，惟一般為臭氧耐性低者。作為形成保護膜18的耐臭氧性材料，例如有二氧化矽、沃其滋莫(商品名稱)，斯迷世拉母(商品名稱)等，惟由下述理由特別以二氧化矽較佳。As shown in Fig. 2, the lead-in wire 15 is formed by removing the core portion 15a which is exposed by the insulating material and covering the periphery of the core wire with an insulating material, and the core portion 15a is soldered to the electrode using the solder 17. 3, thereby being electrically and mechanically fixed to the electrode 3. The solder 17 is disposed around the core portion 15a that can surround the lead-in wire 15. A protective film 18 formed of an ozone-resistant material is formed around the solder 17 so that the solder 17 is not exposed to the outside. The solder 17 is, for example, Sn-Pb, Sn-In or the like, but generally has low ozone resistance. Examples of the ozone-resistant material that forms the protective film 18 include cerium oxide, volcanic acid (trade name), and smectite (trade name). However, cerium oxide is particularly preferable for the following reasons.
第3圖是表示用以說明本發明的準分子燈的製造方法的概念圖。Fig. 3 is a conceptual view showing a method of manufacturing the excimer lamp of the present invention.
如第3(a)圖所示地，將上述的金屬藉由印刷或蒸鍍於位於合成石英玻璃所成的扁平筒狀的放電容器1的上方側的平坦壁11上，俾形成金屬薄膜所成的電極3。As shown in Fig. 3(a), the above-mentioned metal is printed or vapor-deposited on the flat wall 11 on the upper side of the flat cylindrical discharge vessel 1 formed of synthetic quartz glass, and a metal thin film is formed. The electrode 3 is formed.
第1製程之後，如第3(b)圖所示地，將引入線15的芯線部15a配置在電極3上的狀態下在兩者近旁配置焊料17的塊體而以約300℃的溫度來加熱焊料使之熔融。藉由將經熔融的焊料自然冷卻到常溫來固定芯線部15a與電極3。After the first process, as shown in Fig. 3(b), the core portion 15a of the lead-in wire 15 is placed on the electrode 3, and the block of the solder 17 is placed in the vicinity of the electrode 3 at a temperature of about 300 °C. The solder is heated to melt it. The core portion 15a and the electrode 3 are fixed by naturally cooling the molten solder to a normal temperature.
如第3(c)圖所示地，在第2製程之後，對於使用刷子塗佈於焊料17周圍的聚矽氨烷溶液18’在大氣中以大約90℃溫度進行1小時的熱處理。藉由將聚矽氨烷溶液18’自然冷卻到常溫經乾燥，如第3(d)圖所示地，在焊料17的周圍形成二氧化矽所成的保護膜18。As shown in Fig. 3(c), after the second process, the polycarbamate solution 18' coated with the brush around the solder 17 was heat-treated at atmospheric temperature for about 1 hour at a temperature of about 90 °C. The polyimide film 18 is naturally cooled to a normal temperature and dried, and as shown in Fig. 3(d), a protective film 18 made of ruthenium dioxide is formed around the solder 17.
在上述的第3製程中，若將聚矽氨烷溶液予以乾燥，則聚矽氨烷是與大氣中的水分或氧氣耦合，藉此轉化成二氧化矽，藉由使用聚矽氨烷溶液，即使來過度地進行高溫的熱處理也可形成保護膜18。而且，藉由以液體狀態使用聚矽氨烷，則可塗佈到表面形狀容易成為不穩定的焊料17的周圍每個角落之故，因而焊料17的外表面與外氣完全地被遮斷的方式使得形成保護膜18成為容易。In the third process described above, if the polyamidane solution is dried, the polyamidane is coupled with moisture or oxygen in the atmosphere, thereby being converted into cerium oxide by using a polyamidane solution. The protective film 18 can be formed even if the heat treatment at a high temperature is excessively performed. Further, by using the polyamidane in a liquid state, it can be applied to every corner around the solder 17 whose surface shape is liable to become unstable, so that the outer surface of the solder 17 and the outside air are completely blocked. The manner makes it easy to form the protective film 18.
在上述第3製程中所使用的聚矽氨烷溶液，是如下地被調配。混合原料的全氫化聚矽氨烷與溶媒的二甲苯，來製作約10～20%的全氫化聚矽氨烷溶液。作為溶媒使用二丁醚，索爾別索(Solvesso，商品名稱)，石油餾份等也可以。對於所製作的全氟化聚矽氨烷溶液添加鈀系或胺系的觸媒。藉由添加觸媒，以更低溫的熱處理就可形成二氧化矽所成的保護膜。The polyamitane solution used in the above third process was formulated as follows. The perhydropolydecane of the starting material and the xylene of the solvent are mixed to prepare a solution of about 10 to 20% of the perhydropolyamine. Dibutyl ether, Solvesso (trade name), petroleum fraction, etc. may be used as a solvent. A palladium-based or amine-based catalyst is added to the produced perfluoropolyamidane solution. A protective film made of cerium oxide can be formed by adding a catalyst to heat treatment at a lower temperature.
又，在上述第3製程中，對於塗佈於焊料周圍的聚矽氨烷溶液進行熱處理，乃為了將聚矽氨烷在短時間內使之轉化成二氧化矽。變更熱處理為進行加濕處理，也在短時間內可使之轉化成二氧化矽，若不必縮短轉化成二氧化矽的時間，則不必進行熱處理等。Further, in the third process described above, the polyammonium solution applied around the solder is heat-treated in order to convert the polyamidane into cerium oxide in a short time. The heat treatment is changed to perform humidification treatment, and it can be converted into cerium oxide in a short time. If it is not necessary to shorten the time for conversion to cerium oxide, heat treatment or the like is not necessary.
第4圖是表示具備本發明的準分子燈的紫外線照射處理裝置的構成的概略概念圖。Fig. 4 is a schematic conceptual view showing a configuration of an ultraviolet irradiation treatment apparatus including the excimer lamp of the present invention.
紫外線照射處理裝置是將從配置於氮氣等惰性氣體所填充的筐體40內的準分子燈100所放射的紫外線，對於藉由複數滾子42朝水平方向被搬運在筐體40下方的被處理體W施以照射，來進行該被處理體W的表面洗淨等的處理者，被處理體W是矽晶圓基板，液晶顯示器製造用，電漿顯示面板製造用等的平面顯示器製造用的玻璃基板等。此些基板的表面，是依各製程經過而狀態不相同，作為施以光阻，透明導電膜、電路等的狀態。The ultraviolet irradiation treatment device is an ultraviolet ray emitted from the excimer lamp 100 placed in the casing 40 filled with an inert gas such as nitrogen, and is processed by being transported under the casing 40 in the horizontal direction by the plurality of rollers 42. The processor W is irradiated to perform surface cleaning of the object W, and the object to be processed W is a wafer substrate, and is used for manufacturing a flat panel display for manufacturing a liquid crystal display or a plasma display panel. Glass substrate, etc. The surface of these substrates is in a state in which the process is different depending on the respective processes, and is applied as a photoresist, a transparent conductive film, a circuit, or the like.
收容準分子燈100的筐體40，是相對於被處理體W的下方側被開放，而在筐體40內部有準分子燈100配置於距被處理體W約數mm的位置，而且在該準分子燈100的上方側配置具有氣體噴出口41a的惰性氣體放出機構41。筐體40的內部，是不會因藉由從準分子燈100所放射的紫外線被氧氣吸收而有衰減的方式，以氮氣體等惰性氣體所置換，尤其是在準分子燈100與被處理體W間被置換成反應所必須的最低限的氧氣濃度。作為惰性氣體，除了氮氣以外，也可使用氦、氬、氖等。The casing 40 accommodating the excimer lamp 100 is opened to the lower side of the object to be processed W, and the excimer lamp 100 is disposed inside the casing 40 at a position of about several mm from the object W to be processed. An inert gas discharge mechanism 41 having a gas discharge port 41a is disposed on the upper side of the molecular lamp 100. The inside of the casing 40 is not replaced by an inert gas such as a nitrogen gas because the ultraviolet light emitted from the excimer lamp 100 is absorbed by oxygen, and is particularly used in the excimer lamp 100 and the object to be processed. The W is replaced by the minimum oxygen concentration necessary for the reaction. As the inert gas, in addition to nitrogen, helium, argon, helium or the like can also be used.
此種紫外線照射處理裝置，是當藉由所搬運來的被處理體W使得筐體40的下方使開口成為幾乎關閉的狀態，則來自惰性氣體放出機構41的惰性氣體充滿於筐體40內而降低內部的氧氣濃度，例舉一例，在被處理體W的寬度為1100mm，準分子燈100的全長度為1300mm，筐體40的全長度為1500mm，高度為50mm，寬度為150mm，從惰性氣體放出機構41所放出的惰性氣體的流量為300L/分的情形，則在被處理體W幾乎塞住筐體40下方側的開口時，筐體40內的氧氣濃度是成為大約0.5%。In the ultraviolet irradiation processing apparatus, when the object to be processed W is conveyed so that the opening of the casing 40 is almost closed, the inert gas from the inert gas discharge mechanism 41 is filled in the casing 40. The internal oxygen concentration is lowered. For example, the width of the object to be processed W is 1100 mm, the total length of the excimer lamp 100 is 1300 mm, the total length of the casing 40 is 1500 mm, the height is 50 mm, and the width is 150 mm. When the flow rate of the inert gas discharged from the discharge mechanism 41 is 300 L/min, the oxygen concentration in the casing 40 is about 0.5% when the object to be processed W almost closes the opening on the lower side of the casing 40.
在表示於以上的第4圖的紫外線照射處理裝置中，筐體40內部未完全地密閉之故，因而成為氧氣容易殘留在筐體40內部的環境。然而，本發明的準分子燈是在如此地藉由殘留著氧氣而容易發生臭氧的環境化下即使進行點燈驅動，耐臭氧性材料所成的保護膜18被形成在固定電極3與引入線15的芯線部15a的焊料17的周圍之故，因而藉由發生在準分子燈100的周圍的臭氧也不會使得焊料17氧化而被劣化的情形。所以，一直到下一洗淨所用的被處理體被搬運為止的等待期間或是對於被處理體照射紫外線而正進行洗淨被處理體的期間，確實地可防止引入線15的芯線部15a從電極3離開的情形。因此，不會產生欲點亮準分子燈時無法點亮，或是在正對於被處理體照射紫外線的期間突然地熄滅準分子燈的不方便。In the ultraviolet irradiation processing apparatus shown in FIG. 4 described above, the inside of the casing 40 is not completely sealed, and thus oxygen is likely to remain in the interior of the casing 40. However, the excimer lamp of the present invention is formed in the fixed electrode 3 and the lead-in line by the ozone-resistant material even if the lighting is driven by the environment in which ozone is easily generated by the residual oxygen. The periphery of the solder 17 of the core portion 15a of 15 is such that ozone generated around the excimer lamp 100 does not oxidize the solder 17 to be deteriorated. Therefore, it is possible to surely prevent the core portion 15a of the lead-in wire 15 from being waited until the object to be processed for the next cleaning is transported or when the object to be processed is being irradiated with ultraviolet rays. The case where the electrode 3 is separated. Therefore, there is no inconvenience that the excimer lamp is suddenly turned off when the excimer lamp is to be turned on, or the excimer lamp is suddenly extinguished while the object to be processed is being irradiated with ultraviolet rays.
又，依照本發明的準分子燈的製造方法，如上述的第3製程所示地為了形成保護膜18而使用聚矽氨烷溶液之故，因而不必過度地進行高溫的熱處理就可形成保護膜18。所以，藉由第3製程的熱處理就可避免焊料17過度地成為高溫狀態，又可確實地避免焊料17再度熔融的情形。在第3製程中，若焊料再度熔融，則焊料會流到固定部以外的部位，或是有金屬電極被分散於焊料中產生被剝落的不方便之虞。又，液體的聚矽氨烷被塗佈到焊料17的外表面各個角落之故，因而焊料17的外表面從外氣完全地被遮斷的方式成為容易形成保護膜18。Further, according to the method for producing an excimer lamp of the present invention, since the polyamitane solution is used to form the protective film 18 as shown in the third process described above, the protective film can be formed without excessively heat-treating at a high temperature. 18. Therefore, by the heat treatment of the third process, the solder 17 can be prevented from excessively becoming a high temperature state, and the solder 17 can be surely prevented from being remelted again. In the third process, if the solder is melted again, the solder may flow to a portion other than the fixed portion, or the metal electrode may be dispersed in the solder to cause peeling. Further, since the liquid polyamidane is applied to each corner of the outer surface of the solder 17, the outer surface of the solder 17 is easily blocked from the outside air, and the protective film 18 is easily formed.
第5圖至第7圖是表示用以說明本發明的準分子燈的其他實施形態的主要部分擴大圖。在第5圖至第7圖中，針對於與第1圖，第2圖共通的部位給予與在第1圖，第2圖所給予的符號同一符號而省略了說明。Fig. 5 to Fig. 7 are enlarged views of main parts for explaining another embodiment of the excimer lamp of the present invention. In the fifth to seventh embodiments, the same components as those in the first and second figures are given the same reference numerals as those in the first and second figures, and the description thereof is omitted.
依照表示於第5圖的形態，引入線15是除了芯線部15a，被覆部15b以外，還具備：捆紮芯線部15a的鎳製套管19與被焊接於該套管19的板狀饋電端子20。引入線15是板狀饋電端子20藉由焊料17被固定於電極3，藉此經由饋電端子20被電性地連接於電極3。套管19及饋電端子20是防止隨著藉由發生在準分子燈的周圍的臭氧而被氧化成為劣化之故，因而藉由耐臭氧性材料分別所構成。例如套管19是藉由鎳，而饋電端子20是藉由鎳所構成。According to the embodiment shown in Fig. 5, the lead-in wire 15 includes, in addition to the core portion 15a and the covering portion 15b, a nickel sleeve 19 that binds the core portion 15a and a plate-shaped feed terminal that is welded to the sleeve 19. 20. The lead-in wire 15 is such that the plate-shaped feed terminal 20 is fixed to the electrode 3 by the solder 17, whereby it is electrically connected to the electrode 3 via the feed terminal 20. The sleeve 19 and the feed terminal 20 are prevented from being oxidized and deteriorated by ozone generated around the excimer lamp, and are thus composed of ozone-resistant materials. For example, the sleeve 19 is made of nickel, and the feed terminal 20 is made of nickel.
依照表示於此種第5圖的實施形態，可期待如以下所說明的實用上的效果。引入線15的芯線部15a是為了具有柔軟性而分成複數細線之故，因而很難焊接於饋電端子20的表面，或是複數細線容易鬍鬚狀地鼓出之故，因而接觸於其他週邊機器而成為誤動作的原因之虞。因此，藉由將套管19安裝於複數細線所成的芯線部15a而可將套管19容易地焊接於饋電端子20，而且可避免細線鬍鬚狀地鼓出之故，因而可減低準分子燈對於週邊機器的不良影響。According to the embodiment shown in the fifth embodiment, practical effects as described below can be expected. The core portion 15a of the lead-in wire 15 is divided into a plurality of thin wires for flexibility, so that it is difficult to solder to the surface of the feed terminal 20, or a plurality of thin wires are easily burled in a whisker shape, thereby contacting other peripheral devices. It is the cause of the malfunction. Therefore, the sleeve 19 can be easily welded to the feed terminal 20 by attaching the sleeve 19 to the core portion 15a formed by the plurality of thin wires, and the thin wire whisker can be prevented from being bulged, thereby reducing the excimer The adverse effects of the lamp on the surrounding machine.
又，藉由設置薄板狀饋電端子20，與將芯線部15a或是捆紮芯線部15a的套管19直接地焊接於電極3的情形相比較，則可確保與電極3的接觸面積，而且可將熱容量近似於電極3之故，因而容易地可進行依焊料17之固定。所以，饋電端子20與電極3的機械性連接強度會變高，而可將引入線15與電極3的電性連接的可靠性作成高者。板狀饋電端子20是其熱容量接近於電極3的熱容量較佳。Further, by providing the thin plate-shaped feed terminal 20, the contact area with the electrode 3 can be ensured as compared with the case where the core portion 15a or the sleeve 19 of the bundled core portion 15a is directly welded to the electrode 3. The heat capacity is approximated to the electrode 3, so that the fixing by the solder 17 can be easily performed. Therefore, the mechanical connection strength between the feed terminal 20 and the electrode 3 becomes high, and the reliability of electrically connecting the lead wire 15 and the electrode 3 can be made high. The plate-shaped feed terminal 20 is preferably a heat capacity whose heat capacity is close to that of the electrode 3.
又，套管19，饋電端子20是並一定藉由耐臭氧性材料所構成也可以。如第6圖所示地，在焊料17，導電性套管19及板狀饋電端子20的周圍，也可形成有保護膜18成為此些的外表面不會觸及外氣。依照表示於第6圖的實施形態，即使套管19，饋電端子20為耐臭氧性低的材料，也不會藉由臭氧來氧化此些之虞。Further, the sleeve 19 and the feed terminal 20 may be formed of an ozone-resistant material. As shown in Fig. 6, the protective film 18 may be formed around the solder 17, the conductive sleeve 19, and the plate-like feed terminal 20 so that the outer surface does not touch the outside air. According to the embodiment shown in Fig. 6, even if the sleeve 19 and the feed terminal 20 are made of a material having low ozone resistance, the oxide electrode 20 is not oxidized by ozone.
依照表示於第7圖的實施形態，電極3是被分離成藉由焊料17固定有引入線15的芯線部15a的引入線固定部3a，及引入線固定部3a以外的放電形成部3b，而引入線固定部3a與放電形成部3b藉由不同體的導電性糊21被確保導通。導電性糊21是例如使用著在環氧樹脂混合銀或鎳填隙料者，一般藉由臭氧耐性低的材料所構成。又，在焊料17及導電性糊21的周圍形成有二氧化矽所成的保護膜18，藉由保護膜18從外氣來遮斷焊料17及導電性糊21的外表面。According to the embodiment shown in Fig. 7, the electrode 3 is separated into a lead-line fixing portion 3a in which the core portion 15a of the lead-in wire 15 is fixed by the solder 17, and a discharge forming portion 3b other than the lead-in fixing portion 3a. The lead wire fixing portion 3a and the discharge forming portion 3b are ensured to be electrically connected by the conductive paste 21 of a different body. The conductive paste 21 is, for example, a material in which silver or nickel interstitial material is mixed in an epoxy resin, and is generally composed of a material having low ozone resistance. Further, a protective film 18 made of ruthenium dioxide is formed around the solder 17 and the conductive paste 21, and the outer surface of the solder 17 and the conductive paste 21 is blocked by the protective film 18 from the outside air.
依照表示於此時種第7圖的實施形態，可期待如下的實用性的效果。在上述的本發明的準分子燈的製造方法的第2製程，若為了短時間熔融焊料17而以高溫過度地加熱焊料17，則藉由電極3成為高溫狀態，也有構成電極3的金屬有熔入在經熔融的焊料的情形。在此種情形，如第7圖所示地，電極3是會被分離或引入線固定部3a與其他以外的放電形成部3b，會產生對於放電形成部3b的饋電成為不可能的不方使之虞。因此，在第2過程中，即使引入線固定部3a與放電形成部3b被分離的情形，藉由導電性糊21使得引入線固定部3a與放電形成部3b被導通之故，因而成為也確實地可點亮準分子燈。According to the embodiment shown in Fig. 7 at this time, the following practical effects can be expected. In the second process of the method for producing an excimer lamp of the present invention, when the solder 17 is excessively heated at a high temperature in order to melt the solder 17 for a short period of time, the electrode 3 is heated at a high temperature, and the metal constituting the electrode 3 is also melted. In the case of molten solder. In this case, as shown in Fig. 7, the electrode 3 is separated or introduced into the wire fixing portion 3a and the other discharge forming portion 3b, and the feeding of the discharge forming portion 3b is impossible. Make it awkward. Therefore, in the second process, even if the lead wire fixing portion 3a and the discharge forming portion 3b are separated, the lead wire fixing portion 3a and the discharge forming portion 3b are electrically connected by the conductive paste 21, and thus The ground can illuminate the excimer lamp.
又，除了焊料17的周圍以外，在導電性糊21的周圍也形成著保護膜18之故，因而不會有藉由耐臭氧性低的材料所構成的導電性糊21藉由發生在準分子燈周圍的臭氧被氧化而劣化之虞。Further, in addition to the periphery of the solder 17, the protective film 18 is formed around the conductive paste 21, so that the conductive paste 21 composed of a material having low ozone resistance does not occur in the excimer. The ozone around the lamp is oxidized and deteriorates.
以上，針對於本發明的準分子燈的各種實施形態加以說明，惟本發明是並不被限定於上述的實施形態者。放電容器的形狀是並不限定在扁平的方筒狀者，例如也可適用圓筒狀者，又，也可適用在同軸地配置內徑互相不相同的兩支直管，而且藉由密封各個直管的端部而在內部形成氣密空間的雙重圓筒管構造者。Although various embodiments of the excimer lamp of the present invention have been described above, the present invention is not limited to the above embodiments. The shape of the discharge vessel is not limited to a flat rectangular tube shape. For example, a cylindrical shape may be applied. Alternatively, two straight tubes having mutually different inner diameters may be disposed coaxially, and each of them may be sealed by sealing. A double cylindrical tube builder that forms an airtight space inside the end of the straight tube.
100．．．準分子燈100. . . Excimer lamp
1．．．放電容器1. . . Discharge capacitor
3．．．電極3. . . electrode
3a．．．引入線固定部3a. . . Lead wire fixing
3b．．．放電形成部3b. . . Discharge formation
4．．．電極4. . . electrode
11,12．．．平坦壁11,12. . . Flat wall
13．．．彎曲部13. . . Bending
14．．．饋電裝置14. . . Feeder
15,16．．．引入線15,16. . . Lead-in
15a．．．芯線15a. . . Wire
15b．．．被覆部15b. . . Covered part
17．．．焊料17. . . solder
18．．．保護膜18. . . Protective film
19．．．套管19. . . casing
20．．．饋電端子20. . . Feed terminal
21．．．導電性糊twenty one. . . Conductive paste
第1圖是表示本發明的準分子燈的全體構成的立體圖。Fig. 1 is a perspective view showing the overall configuration of an excimer lamp of the present invention.
第2圖是表示本發明的準分子燈的主要部分擴大斷面圖。Fig. 2 is an enlarged cross-sectional view showing the main part of the excimer lamp of the present invention.
第3(a)圖至第3(d)圖是表示說明本發明的準分子燈的製造方法的概念圖。3(a) to 3(d) are conceptual views showing a method of manufacturing the excimer lamp of the present invention.
第4圖是表示具備本發明的準分子燈的紫外線照射處理裝置的構成的概略概念圖。Fig. 4 is a schematic conceptual view showing a configuration of an ultraviolet irradiation treatment apparatus including the excimer lamp of the present invention.
第5圖是表示本發明的準分子燈的其他實施形態的主要部分擴大斷面圖。Fig. 5 is a partially enlarged sectional view showing another embodiment of the excimer lamp of the present invention.
第6圖是表示本發明的準分子燈的其他實施形態的主要部分擴大斷面圖。Fig. 6 is a partially enlarged cross-sectional view showing another embodiment of the excimer lamp of the present invention.
第7圖是表示本發明的準分子燈的其他實施形態的主要部分擴大斷面圖。Fig. 7 is a partially enlarged sectional view showing another embodiment of the excimer lamp of the present invention.
第8圖是表示習知的準分子燈的構成的概略斷面圖。Fig. 8 is a schematic cross-sectional view showing the configuration of a conventional excimer lamp.
1．．．放電容器1. . . Discharge capacitor
3．．．電極3. . . electrode
4．．．電極4. . . electrode
11,12．．．平坦壁11,12. . . Flat wall
13．．．彎曲部13. . . Bending
14．．．饋電裝置14. . . Feeder
15,16．．．引入線15,16. . . Lead-in
15a．．．芯線15a. . . Wire
15b．．．被覆部15b. . . Covered part
17．．．焊料17. . . solder
18．．．保護膜18. . . Protective film
100．．．準分子燈100. . . Excimer lamp
Claims (7)
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| JP2008059494A JP5311271B2 (en) | 2008-03-10 | 2008-03-10 | Excimer lamp and method of manufacturing the excimer lamp |
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| KR (1) | KR20090097103A (en) |
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| JP5195675B2 (en) * | 2009-07-14 | 2013-05-08 | ウシオ電機株式会社 | Excimer lamp |
| US8857861B2 (en) | 2009-10-12 | 2014-10-14 | Mueller International, Llc | Self-restrained pipe joint system |
| US8544851B2 (en) | 2010-08-24 | 2013-10-01 | Mueller International, Llc | Gasket for parabolic ramp self restraining bell joint |
| MX2013001186A (en) | 2010-08-24 | 2013-03-21 | Mueller Int Llc | Gasket for parabolic ramp self restraining bell joint. |
| JP5979016B2 (en) * | 2013-01-21 | 2016-08-24 | ウシオ電機株式会社 | Excimer lamp |
| JP7040033B2 (en) * | 2017-03-16 | 2022-03-23 | 株式会社リコー | Laser device and internal combustion engine |
| US20210234253A1 (en) * | 2018-06-05 | 2021-07-29 | AGC Inc. | Vehicle window glass with terminal |
| CN111508816B (en) * | 2019-01-30 | 2023-06-06 | 崇翌科技股份有限公司 | Excimer lamp and method for manufacturing excimer lamp |
| KR102649866B1 (en) | 2022-08-11 | 2024-03-21 | 주식회사 원익큐엔씨 | Elastic Connector Module and UV Lamp structure having the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001126664A (en) * | 1999-10-22 | 2001-05-11 | Ushio Inc | Dielectric barrier discharge lamp and device for supplying its illumination |
| JP2004342369A (en) * | 2003-05-13 | 2004-12-02 | Japan Storage Battery Co Ltd | Excimer lamp |
| TW200739658A (en) * | 2005-12-28 | 2007-10-16 | Ushio Electric Inc | Excimer lamp |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0717363B2 (en) * | 1986-01-10 | 1995-03-01 | 閃一 増田 | Ozone generator |
| JP2606785B2 (en) * | 1992-09-30 | 1997-05-07 | 東陶機器株式会社 | Method of manufacturing corona discharger |
| JP2000260396A (en) * | 1999-03-05 | 2000-09-22 | Quark Systems Co Ltd | Excimer lamp, excimer irradiation device, and organic compond decomposition method |
| JP2004111326A (en) * | 2002-09-20 | 2004-04-08 | Japan Storage Battery Co Ltd | Excimer lamp |
| JP2005135716A (en) * | 2003-10-29 | 2005-05-26 | Kyocera Corp | Discharge element |
| JP2006310029A (en) * | 2005-04-27 | 2006-11-09 | Hitachi Displays Ltd | Liquid crystal display and lighting system |
| JP2007103056A (en) * | 2005-09-30 | 2007-04-19 | Matsushita Electric Ind Co Ltd | Dielectric barrier discharge lamp |
| JP2007173090A (en) * | 2005-12-22 | 2007-07-05 | Ushio Inc | Ultraviolet light source system |
| JP2008004507A (en) * | 2006-06-26 | 2008-01-10 | Matsushita Electric Ind Co Ltd | External electrode type discharge lamp, and backlight unit |
| JP2008039977A (en) * | 2006-08-03 | 2008-02-21 | Ntn Corp | Pattern correction method and device |
| JP4830722B2 (en) * | 2006-08-29 | 2011-12-07 | ウシオ電機株式会社 | Excimer lamp |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001126664A (en) * | 1999-10-22 | 2001-05-11 | Ushio Inc | Dielectric barrier discharge lamp and device for supplying its illumination |
| JP2004342369A (en) * | 2003-05-13 | 2004-12-02 | Japan Storage Battery Co Ltd | Excimer lamp |
| TW200739658A (en) * | 2005-12-28 | 2007-10-16 | Ushio Electric Inc | Excimer lamp |
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| KR20090097103A (en) | 2009-09-15 |
| JP5311271B2 (en) | 2013-10-09 |
| CN101533756B (en) | 2012-09-26 |
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| JP2009218055A (en) | 2009-09-24 |
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