TWI413394B - Chip card retaining structure - Google Patents
Chip card retaining structure Download PDFInfo
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- TWI413394B TWI413394B TW94124083A TW94124083A TWI413394B TW I413394 B TWI413394 B TW I413394B TW 94124083 A TW94124083 A TW 94124083A TW 94124083 A TW94124083 A TW 94124083A TW I413394 B TWI413394 B TW I413394B
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- wafer card
- holding structure
- card holding
- positioning
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Credit Cards Or The Like (AREA)
Description
本發明係關於一種晶片卡固持結構，尤其係關於一種用於行動電話之晶片卡固持結構。 The present invention relates to a wafer card holding structure, and more particularly to a wafer card holding structure for a mobile phone.
隨著行動通訊事業之迅速發展，行動電話已成為愈來愈多消費者日常工作及生活不可缺少之工具。行動電話之用戶識別卡(subscriber identification module card)係一種裝有IC晶片之塑膠晶片卡，其具有記錄個人用戶號碼及通訊簿等功能，藉由更換晶片卡，一支行動電話可以供多個用戶使用。 With the rapid development of the mobile communication industry, mobile phones have become an indispensable tool for more and more consumers' daily work and life. The subscriber identification module card is a plastic wafer card equipped with an IC chip, which has the functions of recording a personal user number and an address book. By replacing the wafer card, a mobile phone can be used for multiple users. use.
請參閱第一圖，一種習知之晶片卡固持結構，其用於固定行動電話中之晶片卡，可使晶片卡(圖未示)和晶片卡連接器40電連接，主要包括一基座42及閉鎖組件44。基座42上開設有安裝口421，安裝口421內設置有連接器40，安裝口421與晶片卡尺寸相當，用於容納晶片卡。閉鎖組件44設置於基座42上且鄰近安裝口421，其可以如圖所示箭頭方向往復移動。 Please refer to the first figure, a conventional wafer card holding structure for fixing a wafer card in a mobile phone, and electrically connecting the chip card (not shown) and the chip card connector 40, mainly including a base 42 and Blocking assembly 44. The base 42 is provided with a mounting opening 421. The mounting opening 421 is provided with a connector 40. The mounting opening 421 is sized to accommodate the wafer card. The latch assembly 44 is disposed on the base 42 adjacent the mounting port 421 and is reciprocally movable in the direction of the arrow as shown.
安裝時，撥動閉鎖組件44，使閉鎖組件44朝遠離安裝口421方向移動，即自安裝口421上方退開，然後將晶片卡裝於安裝口421中，並反方向撥動閉鎖組件44至安裝口421上方，以將晶片卡固持於安裝口421內。同樣藉由撥動閉鎖組件44亦可取出已裝於安裝口421內之晶片卡。 During installation, the latching assembly 44 is moved to move the latching assembly 44 away from the mounting opening 421, that is, to retreat from above the mounting opening 421, and then the wafer is snapped into the mounting opening 421, and the latching assembly 44 is toggled in the opposite direction to Above the mounting opening 421, the wafer card is held in the mounting opening 421. The wafer card that has been mounted in the mounting opening 421 can also be removed by the toggle latch assembly 44.
然，上述晶片卡固持結構中，撥動閉鎖組件44，即可輕易地使閉鎖組件44 於基座42上往復移動，故當行動電話不慎落地時，外力之衝擊會使閉鎖組件44極易從安裝口421上方退開，如此將會使晶片卡無法有效地與晶片卡連接器40電連接，甚至使晶片卡自安裝口421中脫出，進而嚴重影響行動電話之使用性。 However, in the above-mentioned wafer card holding structure, the latching assembly 44 can be easily moved to lock the latching assembly 44. Reciprocatingly moving on the base 42, when the mobile phone accidentally falls, the impact of the external force will make the locking assembly 44 easily retreat from above the mounting opening 421, which will make the wafer card unable to effectively interface with the wafer card connector 40. The electrical connection even causes the wafer card to come out of the mounting port 421, thereby seriously affecting the usability of the mobile phone.
鑒於以上習知技術之缺點，有必要提供一結構簡單、使晶片卡穩固容置於行動電話中之晶片卡固持結構。 In view of the above disadvantages of the prior art, it is necessary to provide a wafer card holding structure which is simple in structure and enables the wafer card to be securely housed in a mobile phone.
一種晶片卡固持結構，其包括一容置部及一鎖固組件，該容置部具有一用以容置晶片卡之容置空間、一開口端及一用以防止晶片卡由容置空間脫出之止擋結構；該鎖固組件鄰接開口端設置，其包括一定位結構及一擋板，所述擋板藉由該定位結構固持並可相對該定位結構滑動以開合容置部之開口端。 A chip card holding structure includes a receiving portion and a locking component, the receiving portion has a receiving space for receiving the chip card, an open end, and a device for preventing the wafer card from being taken off by the receiving space a stop structure; the locking component is disposed adjacent to the open end, and includes a positioning structure and a baffle, the baffle is retained by the positioning structure and can slide relative to the positioning structure to open and close the opening of the receiving portion end.
相較習知技術，所述晶片卡固持結構通過設置一擋片及一可移動地封閉容置晶片卡之容置部之擋板，即可將晶片卡穩定地鎖緊於行動電話內，結構簡單，晶片卡裝卸亦較方便。 Compared with the prior art, the wafer card holding structure can stably lock the wafer card into the mobile phone by providing a blocking piece and a baffle that movably closes the receiving portion of the receiving chip card. Simple, wafer card loading and unloading is also more convenient.
10‧‧‧本體 10‧‧‧ Ontology
11‧‧‧上表面 11‧‧‧ upper surface
12‧‧‧收容腔 12‧‧‧ containment chamber
122‧‧‧側壁 122‧‧‧ side wall
14‧‧‧容置部 14‧‧‧ 容 部
142‧‧‧開口端 142‧‧‧Open end
144‧‧‧凸條 144‧‧ ‧ ribs
146‧‧‧第一側部 146‧‧‧ first side
148‧‧‧第二側部 148‧‧‧ second side
149‧‧‧擋片 149‧‧ ‧Flap
16‧‧‧凸台 16‧‧‧Boss
21‧‧‧第一定位部 21‧‧‧First Positioning Department
211‧‧‧第一凸起 211‧‧‧First bulge
22‧‧‧第二定位部 22‧‧‧Second Positioning Department
222‧‧‧第二凸起 222‧‧‧second bulge
23‧‧‧上彈片 23‧‧‧Upper film
24‧‧‧下彈片 24‧‧‧Shraps
25‧‧‧擋板 25‧‧ ‧Baffle
251‧‧‧第一凹部 251‧‧‧First recess
252‧‧‧第二凹部 252‧‧‧Second recess
253‧‧‧推動部 253‧‧‧Promotion Department
30‧‧‧晶片卡 30‧‧‧wafer card
32‧‧‧晶片卡連接器 32‧‧‧wafer card connector
第一圖係習知之晶片卡固持結構示意圖；第二圖係本發明晶片卡固持結構較佳實施例之立體分解圖；第三圖係本發明晶片卡固持結構較佳實施例組裝圖；第四圖係第三圖之IV部分之局部放大圖；第五圖係本發明晶片卡固持結構較佳實施例安裝晶片卡過程之立體圖。 The first figure is a schematic view of a conventional wafer card holding structure; the second drawing is an exploded perspective view of a preferred embodiment of the wafer card holding structure of the present invention; and the third drawing is an assembled view of a preferred embodiment of the wafer card holding structure of the present invention; The figure is a partially enlarged view of a portion IV of the third drawing; the fifth drawing is a perspective view of a preferred embodiment of the wafer card holding structure of the present invention for mounting a wafer card.
本發明較佳實施例公開了一種晶片卡固持結構，其用以與設於行動電話中 之晶片卡連接器搭配適用。請參照第二圖，該行動電話(圖未示)包括一本體10，本體10之上表面11開設一收容腔12(僅示出部分)，由此於本體10上形成一圍成收容腔12之側壁122，收容腔12用以容置行動電話電池。該晶片卡固持結構包括一容置一晶片卡30之容置部14及一鎖固組件(未標示)。 A preferred embodiment of the present invention discloses a wafer card holding structure for use in a mobile phone. The chip card connector is suitable for use. Referring to the second figure, the mobile phone (not shown) includes a body 10, and the upper surface 11 of the body 10 defines a receiving cavity 12 (only a part is shown), thereby forming a receiving cavity 12 on the body 10. The side wall 122 and the receiving cavity 12 are for accommodating the mobile phone battery. The chip card holding structure includes a receiving portion 14 for accommodating a wafer card 30 and a locking component (not shown).
容置部14位於側壁122一側且鄰接收容腔12設置，其容置空間之尺寸與晶片卡30相當用以容納晶片卡30。容置部14大致呈“(”形，其一端形成有供晶片卡30滑入容置部14之開口端142，該開口端142鄰接側壁122。容置部14之容置空間由突出於本體10上之凸條144及本體10之上表面11之一部分圍成，凸條144具一第一側部146、第二側部148及一橫向部(未標示)，該第一側部146、第二側部148平行佈置，該橫向部連接該第一側部146及第二側部148且與該第一側部146及第二側部148垂直，第一側部146鄰近本體10之外緣。二擋片149分別由本體10之凸條144之第一側部146及第二側部148延伸至容置部14上方，其形狀可為矩形。容置部14內露出設置於本體10之上表面11之晶片卡連接器32。 The accommodating portion 14 is disposed on one side of the side wall 122 and adjacent to the receiving cavity 12, and the accommodating space has a size corresponding to the wafer card 30 for accommodating the wafer card 30. The receiving portion 14 has a substantially "(" shape, and one end thereof is formed with an open end 142 for the wafer card 30 to slide into the accommodating portion 14. The open end 142 abuts the side wall 122. The accommodating space of the accommodating portion 14 protrudes from the body. A portion of the upper strip 144 and the upper surface 11 of the body 10 are surrounded by a first side portion 146, a second side portion 148 and a lateral portion (not labeled), the first side portion 146, The second side portions 148 are arranged in parallel, and the lateral portions are connected to the first side portion 146 and the second side portion 148 and are perpendicular to the first side portion 146 and the second side portion 148. The first side portion 146 is adjacent to the body portion 10 The second blocking piece 149 extends from the first side portion 146 and the second side portion 148 of the protruding strip 144 of the main body 10 to the upper portion of the accommodating portion 14 and has a rectangular shape. The receiving portion 14 is exposed to the body 10 . The wafer card connector 32 of the upper surface 11.
該鎖固組件包括設於本體10上之第一定位部21、第二定位部22、複數上彈片23、複數下彈片24及一擋板25。 The locking component includes a first positioning portion 21 , a second positioning portion 22 , a plurality of upper elastic pieces 23 , a plurality of lower elastic pieces 24 and a baffle plate 25 disposed on the body 10 .
請一併參閱第三圖及第四圖，本體10上鄰接第一側部146及側壁122一端設置一凸台16，該第一定位部21由凸台16向收容腔12上方延伸，其下表面向下延伸一第一凸起211，該第一凸起211大概呈半圓柱狀，其主軸垂直於側壁122表面。第一定位部21末端向下延伸一凸塊。側壁122上邊緣沿垂直於側壁表面朝收容腔12之方向延伸複數上彈片23，該上彈片23末端向下延伸一凸塊。側壁122下邊緣沿垂直於側壁表面朝收容腔12之方向延伸一第二定位部22及複數下彈片24，該第二定位部22之上表面向上延伸一第二凸起 222，該第二凸起222大概呈半圓柱狀，其主軸垂直於側壁122表面，第二定位部22末端向上延伸一凸塊。該下彈片24末端向上延伸一凸塊。該側壁122、第一定位部21、複數上彈片23、複數下彈片24及第二定位部22共同圍成一滑槽(未標示)。擋板25可為條形板狀，其長度大於容置部14之開口端142之長度，並大於第一定位部21與其相鄰之上彈片23之間距，從而使擋板25可容置於該鎖固組件之滑槽內不會脫離，並使擋板25於該滑槽內沿與側壁122平行之方向移動。擋板25一端部之邊緣上設有一第一凹部251，該第一凹部251與第一定位部21之第一凸起211相配合。擋板25另一端部與第一凹部251相對之邊緣上設有一第二凹部252，該第二凹部252與第二定位部22之第二凸起222相配合。擋板25之一表面上設有一推動部253，該推動部253係由複數凸起排成之陣列。 Referring to the third and fourth figures, a protrusion 16 is disposed on the body 10 adjacent to the first side portion 146 and the side wall 122. The first positioning portion 21 extends from the boss 16 to the upper portion of the receiving cavity 12, and the lower portion thereof A first protrusion 211 extends downward from the surface, and the first protrusion 211 is substantially semi-cylindrical with a major axis perpendicular to the surface of the side wall 122. The end of the first positioning portion 21 extends downwardly with a bump. The upper edge of the side wall 122 extends a plurality of upper elastic pieces 23 in a direction perpendicular to the surface of the side wall toward the receiving cavity 12, and a protruding piece extends downward from the end of the upper elastic piece 23. A second positioning portion 22 and a plurality of lower elastic pieces 24 extend from a lower edge of the side wall 122 in a direction perpendicular to the surface of the side wall toward the receiving cavity 12, and a second protrusion extends upward from the upper surface of the second positioning portion 22. 222, the second protrusion 222 is substantially semi-cylindrical, the main axis of which is perpendicular to the surface of the sidewall 122, and the end of the second positioning portion 22 extends upwardly with a bump. The bottom of the lower elastic piece 24 extends upwards with a bump. The side wall 122, the first positioning portion 21, the plurality of upper elastic pieces 23, the plurality of lower elastic pieces 24 and the second positioning portion 22 collectively form a sliding groove (not shown). The baffle 25 can be a strip-shaped plate having a length greater than the length of the open end 142 of the receiving portion 14 and larger than the distance between the first positioning portion 21 and the adjacent elastic piece 23 thereof, so that the baffle 25 can be accommodated. The sliding groove of the locking assembly does not disengage, and the baffle 25 moves in the sliding groove in a direction parallel to the side wall 122. A first recess 251 is defined on an edge of one end of the baffle 25, and the first recess 251 is engaged with the first protrusion 211 of the first positioning portion 21. A second recess 252 is disposed on an edge of the opposite end of the baffle 25 opposite to the first recess 251. The second recess 252 is engaged with the second protrusion 222 of the second positioning portion 22. One of the baffles 25 is provided with a pushing portion 253 on its surface, and the pushing portion 253 is an array in which a plurality of projections are arranged.
將擋板25裝配至該鎖固組件之滑槽內時，第一定位部21、複數上彈片23、複數下彈片24及第二定位部22受擋板25之擠壓產生彈性形變，當擋板25完全容置於該滑槽內後，第一定位部21、複數上彈片23、複數下彈片24及第二定位部22彈性復位，使擋板25不會從滑槽內脫離。擋板25設有推動部253之表面外露。當擋板25位於容置部14之開口端142一端時，其第一凹部251與第一定位部21之第一凸起211相配合，使擋板25固定於第一穩定位置。當擋板25位於遠離容置部14之開口端142一端時，其第二凹部252與第二定位部22之第二凸起222相配合，使擋板25固定於第二穩定位置，此時擋板25設有第一凹部251之一端退離開口端142，即不遮擋開口端142。 When the baffle 25 is assembled into the sliding slot of the locking assembly, the first positioning portion 21, the plurality of upper elastic pieces 23, the plurality of lower elastic pieces 24 and the second positioning portion 22 are elastically deformed by the pressing of the baffle 25, and are blocked. After the plate 25 is completely received in the sliding slot, the first positioning portion 21, the plurality of upper elastic pieces 23, the plurality of lower elastic pieces 24 and the second positioning portion 22 are elastically reset, so that the baffle plate 25 is not detached from the sliding groove. The baffle 25 is provided with a surface exposed by the pushing portion 253. When the baffle 25 is located at one end of the open end 142 of the accommodating portion 14, the first concave portion 251 cooperates with the first protrusion 211 of the first positioning portion 21 to fix the baffle 25 in the first stable position. When the baffle 25 is located away from the end of the open end 142 of the accommodating portion 14, the second recess 252 cooperates with the second protrusion 222 of the second positioning portion 22 to fix the baffle 25 to the second stable position. The baffle 25 is provided with one end of the first recess 251 which is retracted from the mouth end 142, that is, the open end 142 is not blocked.
請一併參照第五圖，安裝晶片卡30時，擋板25位於第二穩定位置，第二凸起222位於第二凹部252內。將晶片卡30由容置部14之開口端142推入容置部14內，使晶片卡30於凸條144之第一側部146及第二側部148之引導下滑入容置部14之二擋片149下，繼續施加外力，使晶片卡30完全容置於容置 部14內。用手撥動擋板25之推動部253，使擋板25向開口端142一端移動，擋板25擠壓第二凸起222，使第二定位部22發生彈性形變，從而使第二凹部252脫離與第二凸起222之配合，使擋板25離開該第二穩定位置。當擋板25移動到第一定位部21時，擋板25擠壓第一凸起211使第一定位部21發生彈性形變，直至第一凹部251移動至第一凸起211下方時，在彈性回復力之作用下，第一凸起211卡置於第一凹部251內，使擋板25位於該第一穩定位置，將晶片卡30穩固鎖固於容置部14內。取出晶片卡30之過程於上述裝配過程相反。 Referring to FIG. 5 together, when the wafer card 30 is mounted, the shutter 25 is located at the second stable position, and the second protrusion 222 is located within the second recess 252. The wafer card 30 is pushed into the accommodating portion 14 from the open end 142 of the accommodating portion 14 to guide the wafer card 30 to the accommodating portion 14 at the first side portion 146 and the second side portion 148 of the rib 144. Under the second blocking piece 149, the external force is continuously applied to completely accommodate the wafer card 30. Inside the department 14. The pushing portion 253 of the shutter 25 is manually moved to move the shutter 25 toward one end of the open end 142, and the shutter 25 presses the second protrusion 222 to elastically deform the second positioning portion 22, thereby causing the second recess 252. The engagement with the second projection 222 disengages the baffle 25 from the second stable position. When the shutter 25 is moved to the first positioning portion 21, the shutter 25 presses the first protrusion 211 to elastically deform the first positioning portion 21 until the first recess 251 moves below the first protrusion 211, and is elastic Under the action of the restoring force, the first protrusion 211 is locked in the first recess 251, so that the baffle 25 is located at the first stable position, and the wafer card 30 is firmly locked in the accommodating portion 14. The process of removing the wafer card 30 is reversed in the above assembly process.
可以理解，所述晶片卡止擋結構之擋片149可以為一片或者多片，其形狀亦不限於矩形。另，擋片149可由其它止擋結構代替，即於圍成所述容置部14之凸條144之第一側部146或第二側部148之至少一方之面向容置部14之容置空間一側開設一滑槽，由此所述晶片卡30可沿所述滑槽順利滑入容置部14內，同時由所述滑槽卡持。 It can be understood that the flap 149 of the wafer card stop structure may be one or more pieces, and the shape thereof is not limited to a rectangle. In addition, the blocking piece 149 can be replaced by another stopping structure, that is, the accommodating portion 14 of the first side portion 146 or the second side portion 148 of the rib 144 surrounding the accommodating portion 14 facing the accommodating portion 14 A sliding slot is formed on one side of the space, so that the wafer card 30 can smoothly slide into the accommodating portion 14 along the sliding slot while being held by the sliding slot.
所述擋板25亦可藉由其它定位結構與本體10連接，如本發明晶片卡固持結構之另一較佳實施例，擋板25之二長邊分別設有一溝槽，該溝槽與上彈片23及下彈片24之凸塊相配合，使擋板25沿與側壁平行之方向移動以開合容置部14之開口端142。 The baffle 25 can also be connected to the body 10 by other positioning structures. As another preferred embodiment of the wafer card holding structure of the present invention, the two long sides of the baffle 25 are respectively provided with a groove, the groove and the upper The projections of the elastic piece 23 and the lower elastic piece 24 cooperate to move the baffle 25 in a direction parallel to the side wall to open and close the open end 142 of the accommodating portion 14.
綜上所述，本發明符合發明專利要件，爰依法提出專利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在援依本案發明精神所作之等效修飾或變化，皆應包含於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧本體 10‧‧‧ Ontology
11‧‧‧上表面 11‧‧‧ upper surface
12‧‧‧收容腔 12‧‧‧ containment chamber
122‧‧‧側壁 122‧‧‧ side wall
14‧‧‧容置部 14‧‧‧ 容 部
142‧‧‧開口端 142‧‧‧Open end
144‧‧‧凸條 144‧‧ ‧ ribs
146‧‧‧第一側部 146‧‧‧ first side
148‧‧‧第二側部 148‧‧‧ second side
149‧‧‧擋片 149‧‧ ‧Flap
16‧‧‧凸台 16‧‧‧Boss
21‧‧‧第一定位部 21‧‧‧First Positioning Department
211‧‧‧第一凸起 211‧‧‧First bulge
22‧‧‧第二定位部 22‧‧‧Second Positioning Department
222‧‧‧第二凸起 222‧‧‧second bulge
23‧‧‧上彈片 23‧‧‧Upper film
24‧‧‧下彈片 24‧‧‧Shraps
25‧‧‧擋板 25‧‧ ‧Baffle
251‧‧‧第一凹部 251‧‧‧First recess
252‧‧‧第二凹部 252‧‧‧Second recess
253‧‧‧推動部 253‧‧‧Promotion Department
30‧‧‧晶片卡 30‧‧‧wafer card
32‧‧‧晶片卡連接器 32‧‧‧wafer card connector
Claims (13)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94124083A TWI413394B (en) | 2005-07-15 | 2005-07-15 | Chip card retaining structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94124083A TWI413394B (en) | 2005-07-15 | 2005-07-15 | Chip card retaining structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200704118A TW200704118A (en) | 2007-01-16 |
| TWI413394B true TWI413394B (en) | 2013-10-21 |
Family
ID=49771682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94124083A TWI413394B (en) | 2005-07-15 | 2005-07-15 | Chip card retaining structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI413394B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001001324A1 (en) * | 1999-06-25 | 2001-01-04 | Ip-Tpg Holdco S.A.R.L. | Contact device for several sim cards |
| US6200166B1 (en) * | 1998-09-24 | 2001-03-13 | Taika Denki Co., Ltd. | Smart card interface arrangements |
| KR20010059478A (en) * | 1999-12-30 | 2001-07-06 | 윤종용 | Fixing device for subscriber identification module card inportable radiotelephone |
| US6343945B1 (en) * | 1998-06-26 | 2002-02-05 | Nokia Mobile Phones Ltd. | Cardholder cover and ejector |
| US6461193B1 (en) * | 1998-10-19 | 2002-10-08 | Nokia Mobile Phones Limited | Data card connector |
| TWI229533B (en) * | 2003-11-19 | 2005-03-11 | Benq Corp | SIM card retainer |
| US6896548B2 (en) * | 2002-11-08 | 2005-05-24 | Motorola, Inc. | Multiple SIM card holding apparatus |
-
2005
- 2005-07-15 TW TW94124083A patent/TWI413394B/en not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6343945B1 (en) * | 1998-06-26 | 2002-02-05 | Nokia Mobile Phones Ltd. | Cardholder cover and ejector |
| US6200166B1 (en) * | 1998-09-24 | 2001-03-13 | Taika Denki Co., Ltd. | Smart card interface arrangements |
| US6461193B1 (en) * | 1998-10-19 | 2002-10-08 | Nokia Mobile Phones Limited | Data card connector |
| WO2001001324A1 (en) * | 1999-06-25 | 2001-01-04 | Ip-Tpg Holdco S.A.R.L. | Contact device for several sim cards |
| KR20010059478A (en) * | 1999-12-30 | 2001-07-06 | 윤종용 | Fixing device for subscriber identification module card inportable radiotelephone |
| US6896548B2 (en) * | 2002-11-08 | 2005-05-24 | Motorola, Inc. | Multiple SIM card holding apparatus |
| TWI229533B (en) * | 2003-11-19 | 2005-03-11 | Benq Corp | SIM card retainer |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200704118A (en) | 2007-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |