TWI411840B - Matrix substrate and liquid crystal display panel - Google Patents
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Description
本發明是有關於一種陣列基板面板及液晶顯示面板，特別是關於一種具有阻擋結構之陣列基板面板及液晶顯示面板。The present invention relates to an array substrate panel and a liquid crystal display panel, and more particularly to an array substrate panel and a liquid crystal display panel having a barrier structure.
平面顯示器因為具有輕薄、短小以及低輻射的特性，目前已被廣泛應用。目前被廣泛應用的液晶顯示器通常具有兩基板，其間夾設一液晶層，一封合膠位於該兩基板之間，以接合兩基板，並將液晶層密封地封合在兩基板之間。Flat panel displays are widely used because of their thinness, shortness, and low radiation. Currently widely used liquid crystal displays generally have two substrates with a liquid crystal layer interposed therebetween, and a glue is placed between the two substrates to bond the two substrates, and the liquid crystal layer is sealingly sealed between the two substrates.
而上下基板表面會分別形成一配向層，形成的方式為塗佈或轉印聚醯亞胺(polyimide，PI)於上下基板之基底上，然後選擇性施以摩擦配向處理，以使其具有特定的配向方向，如此一來配向層可使得液晶顯示器之液晶以特定的傾斜角度有順序的排列於基底上。配向層形成後，再形成封合膠接合兩基板。An alignment layer is formed on the surface of the upper and lower substrates by coating or transferring polyimide (PI) on the substrate of the upper and lower substrates, and then selectively applying a rubbing alignment to make it specific. The alignment direction, such that the alignment layer allows the liquid crystals of the liquid crystal display to be sequentially arranged on the substrate at a specific tilt angle. After the alignment layer is formed, a sealant is formed to bond the two substrates.
第1圖為習知顯示母板的製程概要圖。如第1圖所示，基座110上設置有顯示母板10，基座110係以方向D1移動，顯示母板10上方有印刷滾輪120，印刷滾輪120表面設置有印刷板130(Asahi Photosensitive Resin板，APR板)，逆時鐘轉動的印刷滾輪120可將提供器140提供的聚醯亞胺150印刷至顯示母板10上。在此製程階段，印刷滾輪120係為因為逆時鐘轉動的主滾輪122以及順時鐘 轉動的花紋網目輪121的帶動下而呈逆時鐘轉動，如第1圖所示。Fig. 1 is a schematic view showing the process of a conventional display mother board. As shown in FIG. 1, the base 110 is provided with a display mother board 10, and the base 110 is moved in the direction D1. The display board 10 has a printing roller 120 thereon, and the printing roller 120 is provided with a printing board 130 (Asahi Photosensitive Resin). The plate, APR plate), the counterclockwise rotating printing roller 120 can print the polyimine 150 provided by the provider 140 onto the display mother board 10. In this process stage, the printing roller 120 is the main roller 122 and the clockwise because of the counterclockwise rotation. The rotating pattern mesh wheel 121 is rotated counterclockwise as shown in Fig. 1.
然而，塗佈或轉印聚醯亞胺150於顯示母板10(上下基板)時，因為塗佈壓力或印壓壓力的關係，會將聚醯亞胺150向外延伸一區域，導致聚醯亞胺150延伸到非期望區域中，譬如是後續封合膠預定設置的位置C，如此一來，便會產生下述問題：1. 進入形成封合膠製程時，因為配向層延伸到封合膠預定設置的位置上，而導致封合膠無法順利的被形成在該位置，譬如是感應器感應到該位置已有膜層形成或線寬異常等等，是故，影響製程進行；或2. 若配向層延伸到封合膠預定設置的位置上，封合膠形成在該位置會與配向層有重疊現象(overlap)，因聚亞醯胺與玻璃的接著力較封合膠與玻璃差，是故，在遭受外力作用時封合膠易在與配向層重疊處因配向膜與玻璃剝離，而導致封合膠的封合出現缺口，讓空氣進入到液晶顯示面板之間隙，而產生氣泡(bubble)，影響液晶顯示面板製造良率。或配向膜突出封合膠的位置而使配向膜與空氣接觸，因配向膜成分中聚醯胺酸(polyamic acid)吸收空氣中水分導致水氣進入到液晶顯示面板之間隙，而在顯示畫面時產生斑塊(mura)，影響液晶顯示面板 製造良率。However, when the polyimine 150 is coated or transferred on the display mother board 10 (upper and lower substrates), the polyimine 150 is extended outward in a region due to the relationship of coating pressure or printing pressure, resulting in agglomeration. The imine 150 extends into the undesired region, such as the position C where the subsequent sealant is intended to be set, thus causing the following problems: 1. When entering the process of forming the sealant, since the alignment layer extends to the seal The position of the glue is set at a predetermined position, so that the sealing glue cannot be smoothly formed at the position, for example, the sensor senses that the film layer has formed or the line width is abnormal, etc., so that the process is affected; or 2 If the alignment layer extends to the position where the sealant is to be set, the sealant will form an overlap with the alignment layer at this position, because the adhesion between the polyimide and the glass is worse than that of the sealant and the glass. Therefore, when the external force is applied, the sealing glue is likely to be peeled off from the alignment layer due to the separation of the alignment film and the glass, so that the sealing of the sealing glue is notched, and the air enters the gap of the liquid crystal display panel to generate bubbles. (bubble), affecting liquid crystal display Panel manufacturing yield. Or the alignment film protrudes the position of the sealing glue to make the alignment film contact with the air, because the polyamic acid in the alignment film component absorbs moisture in the air, and the moisture enters the gap of the liquid crystal display panel, and when the screen is displayed Produce plaques, affecting the liquid crystal display panel Create yield.
故在習知液晶顯示面板製程中，如何不讓配向膜的形成影響到封合膠的設置便成為一重要課題。Therefore, in the conventional liquid crystal display panel process, how to prevent the formation of the alignment film from affecting the setting of the sealing adhesive becomes an important issue.
本發明係提供一種陣列基板，包括一基底、陣列結構、配向層以及阻擋結構。陣列結構形成於該基底上；配向層，形成於該陣列結構上；以及阻擋結構，形成於該基底處並大體環繞該配向層，其中該阻擋結構與該基底之一表面構成一段差。The present invention provides an array substrate comprising a substrate, an array structure, an alignment layer, and a barrier structure. An array structure is formed on the substrate; an alignment layer is formed on the array structure; and a barrier structure is formed at the substrate and substantially surrounding the alignment layer, wherein the barrier structure forms a difference from a surface of the substrate.
本發明係提供一種液晶顯示面板，包括陣列基板、對向基板、封合膠以及液晶層。陣列基板包括一基底；一陣列結構，形成於該基底上；一配向層，形成於該陣列結構上；以及一阻擋結構，形成於該基底處並大體環繞該配向層，其中該阻擋結構與該基底之一表面構成一段差。The invention provides a liquid crystal display panel comprising an array substrate, a counter substrate, a sealant and a liquid crystal layer. The array substrate includes a substrate; an array structure formed on the substrate; an alignment layer formed on the array structure; and a barrier structure formed at the substrate and substantially surrounding the alignment layer, wherein the barrier structure and the barrier structure One surface of the substrate constitutes a poor one.
本發明之目的係用以利用本發明之實施例所提供之阻擋結構，於封合膠以及配向層之間，避免在液晶顯示面板的製造過程中，聚醯亞胺會溢流到封合膠設置的位置，而導致封合膠接合兩基板的能力不佳，使終端產品在高濕環境使用時，水氣進入液晶顯示面板之間隙，而產生缺陷。或因聚醯亞胺與無鹼玻璃的接合性不如封合膠成分中的環氧樹脂，而使得當終端產品受外力作用時(如：碰撞或摔落)，由封合膠與聚醯亞胺重合的位置剝離，導致空氣進入液晶顯示面板之間隙，而產生缺陷。The purpose of the present invention is to utilize the barrier structure provided by the embodiment of the present invention between the sealant and the alignment layer to prevent the polyimine from overflowing to the sealant during the manufacturing process of the liquid crystal display panel. The position is set, and the ability of the sealing glue to bond the two substrates is not good, so that when the end product is used in a high-humidity environment, moisture enters the gap of the liquid crystal display panel, and defects are generated. Or because the bond between the polyimide and the alkali-free glass is not as good as that of the epoxy resin in the sealant component, so that when the end product is subjected to an external force (such as collision or falling), the sealant and the gelatin are used. The position at which the amine is superposed is peeled off, causing air to enter the gap of the liquid crystal display panel to cause defects.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。The above and other objects, features and advantages of the present invention will become more <RTIgt;
第2A圖以及第2B圖為本發明之顯示母板20的製程概要圖。顯示母板20可為後續所介紹的陣列基板的顯示母板。2A and 2B are schematic views showing the process of the display mother board 20 of the present invention. The display mother board 20 can be a display mother board of the array substrate described later.
如第2A圖所示，顯示母板20具有阻擋結構，在本例中，係以擋牆201a為例。藉由逆時鐘轉動的印刷滾輪220以及印刷板230，以及沿著方向D2移動的基座210，聚醯亞胺250係被提供至顯示母板20上，因為擋牆201a的設置，聚醯亞胺250便不會溢流至封合膠預定設置的位置C，而被擋牆201a阻擋在顯示區內，在第2A圖中，虛線繪製的封合膠202會在後續製程形成，封合膠202會形成在位置C。As shown in Fig. 2A, the display mother board 20 has a blocking structure. In this example, the retaining wall 201a is taken as an example. The polyimine 250 is supplied to the display mother board 20 by the counterclockwise printing roller 220 and the printing plate 230, and the susceptor 210 moving in the direction D2, because of the arrangement of the retaining wall 201a, The amine 250 will not overflow to the position C where the sealing glue is set, but is blocked by the retaining wall 201a in the display area. In the second drawing, the sealing glue 202 drawn by the broken line will be formed in the subsequent process, and the sealing glue is formed. 202 will form at position C.
第2B圖為本發明之顯示母板20的製程概要圖之另一例，與第2A圖不同的是，阻擋結構係以凹槽201b為例，如第2B圖所示，溢流的聚醯亞胺250會限制至凹槽201b內而不會延伸至封合膠預定設置的位置C，在第2B圖中，虛線繪製的封合膠202會在後續製程形成，封合膠202會形成在位置C。2B is another example of the process schematic diagram of the display mother board 20 of the present invention. Unlike the second embodiment, the barrier structure is exemplified by the recess 201b, as shown in FIG. 2B. The amine 250 is confined to the recess 201b without extending to the position C where the sealant is intended to be disposed. In the second panel BB, the sealant 202 drawn by the dashed line is formed in a subsequent process, and the sealant 202 is formed at the position. C.
第2C圖為在本製程步驟中，顯示母板20以及印刷滾輪220相對位置的上視概要圖。如第2C圖所示，因為滾輪 印刷及顯示母板20以方向D2移動的緣故，聚醯亞胺250會往圖示的下方位置擠，因此每一段聚醯亞胺250印刷的終點會有較嚴重的聚醯亞胺250溢流狀況。如第2C圖所示，阻擋結構(201a或201b)係可設置在後續對應的陣列基板(顯示母板20切割而成)之一側，當然，阻擋結構(201a或201b)設置的位置並不侷限，所有可限制聚醯亞胺250不溢流至封合膠預定設置的位置C為目的之配置狀況均在本發明之範圍內。Fig. 2C is a top plan view showing the relative positions of the mother board 20 and the printing roller 220 in the present process step. As shown in Figure 2C, because of the scroll wheel Printing and display of the mother board 20 moving in the direction D2, the polyimine 250 will be squeezed to the lower position shown in the figure, so each end of the polyimine 250 printing will have a more serious polyimine 250 overflow situation. As shown in FIG. 2C, the blocking structure (201a or 201b) may be disposed on one side of the corresponding corresponding array substrate (the display mother board 20 is cut). Of course, the blocking structure (201a or 201b) is not disposed at a position. Limitations, all configurations that limit the position at which the polyimine 250 does not overflow to the predetermined location of the sealant are within the scope of the present invention.
聚醯亞胺250被塗佈或轉印聚醯亞胺250於顯示母板20後，經過固化，便會形成配向膜，之後，在顯示母板20上形成封合膠302，封合膠302舉例係為光感或熱感框膠，然後與另一對向顯示母板(未繪製)結合，以及形成液晶層(未繪製)於顯示母板20和對向顯示母板之間而形成面板半成品，最後，對該面板半成品進行切割，便形成後續所示的液晶顯示面板。After the polyimine 250 is coated or transferred to the display mother substrate 20, after curing, an alignment film is formed. Thereafter, a sealant 302 is formed on the display mother substrate 20, and the sealant 302 is formed. For example, it is a light or thermal frame glue, and then combined with another opposite display mother board (not drawn), and a liquid crystal layer (not drawn) is formed between the display mother board 20 and the opposite display mother board to form a panel. The semi-finished product, finally, the panel semi-finished product is cut to form a liquid crystal display panel as shown later.
第3圖為本發明之液晶顯示面板1之概要圖。液晶顯示面板1包括陣列基板30、對向基板40、液晶層以及封合膠302。對向基板40與陣列基板30對向設置，封合膠302位於該陣列基板30以及該對向基板40之間，液晶層位於該陣列基板30以及該對向基板40之間。Fig. 3 is a schematic view showing a liquid crystal display panel 1 of the present invention. The liquid crystal display panel 1 includes an array substrate 30, a counter substrate 40, a liquid crystal layer, and a sealant 302. The opposite substrate 40 is disposed opposite to the array substrate 30. The sealing paste 302 is located between the array substrate 30 and the opposite substrate 40. The liquid crystal layer is located between the array substrate 30 and the opposite substrate 40.
第4A圖至第4E圖為本發明之液晶顯示面板1沿剖面線I-I’繪製之各實施例之剖面圖。4A to 4E are cross-sectional views showing respective embodiments of the liquid crystal display panel 1 of the present invention taken along a section line I-I'.
本發明之液晶顯示面板1之詳細構件如下述文字所示，並佐以圖示詳細說明：The detailed components of the liquid crystal display panel 1 of the present invention are as follows, and are described in detail with reference to the drawings:
第4A圖為本發明之第一實施例之陣列基板以及液晶顯示面板。液晶顯示面板1包括陣列基板30、對向基板40、液晶層31以及封合膠302。4A is an array substrate and a liquid crystal display panel according to the first embodiment of the present invention. The liquid crystal display panel 1 includes an array substrate 30, a counter substrate 40, a liquid crystal layer 31, and a sealant 302.
陣列基板30包括基底300、陣列結構303、配向層35以及阻擋結構，在本實施例中，阻擋結構係以擋牆301a為例。陣列結構303可為一薄膜電晶體顯示陣列。擋牆301a之材質係包括金屬、色阻、樹脂、氧化物或有機材料。阻擋結構形成於該基底300處並大體環繞該配向層35，其中該阻擋結構與該基底300之一表面300s構成一段差d1。擋牆301a係不與對向基板40接觸。The array substrate 30 includes a substrate 300, an array structure 303, an alignment layer 35, and a barrier structure. In the present embodiment, the barrier structure is exemplified by the retaining wall 301a. Array structure 303 can be a thin film transistor display array. The material of the retaining wall 301a includes metal, color resist, resin, oxide or organic material. A barrier structure is formed at the substrate 300 and substantially surrounds the alignment layer 35, wherein the barrier structure forms a difference d1 from a surface 300s of the substrate 300. The retaining wall 301a is not in contact with the opposite substrate 40.
對向基板40包括基底400、陣列結構403、配向層45以及阻擋結構，在本實施例中，阻擋結構係以擋牆401a為例。陣列結構403可為一彩色濾光片陣列。擋牆401a之材質係包括金屬、色阻、樹脂、氧化物或有機材料。阻擋結構形成於該基底400處並大體環繞該配向層45，其中該阻擋結構與該基底400之一表面400s構成一段差d2。擋牆301a係不與陣列基板30接觸。擋牆301a與擋牆401a可重疊或是錯開設置。The opposite substrate 40 includes a substrate 400, an array structure 403, an alignment layer 45, and a barrier structure. In the present embodiment, the barrier structure is exemplified by the retaining wall 401a. Array structure 403 can be a color filter array. The material of the retaining wall 401a includes metal, color resist, resin, oxide or organic material. A barrier structure is formed at the substrate 400 and substantially surrounds the alignment layer 45, wherein the barrier structure forms a difference d2 from a surface 400s of the substrate 400. The retaining wall 301a is not in contact with the array substrate 30. The retaining wall 301a and the retaining wall 401a may overlap or be staggered.
藉由設置在配向層35(45)以及封合膠302之間的阻擋結構，配向層35(45)可以與封合膠302有效分離而不重疊，是故，在製程中可增加良率以及避免產生生產異常感應狀況的發生。By providing a barrier structure between the alignment layer 35 (45) and the sealant 302, the alignment layer 35 (45) can be effectively separated from the sealant 302 without overlapping, thereby increasing the yield during the process and Avoid the occurrence of abnormal production conditions.
第4B圖為本發明之第二實施例之陣列基板以及液晶顯示面板。液晶顯示面板1包括陣列基板30、對向基板40、液晶層31以及封合膠302。本實施例與第一實施例有些許結構上不同，但用以有效分離配向層35(45)以及封合膠302之目的係大致相同。4B is an array substrate and a liquid crystal display panel according to a second embodiment of the present invention. The liquid crystal display panel 1 includes an array substrate 30, a counter substrate 40, a liquid crystal layer 31, and a sealant 302. This embodiment is somewhat different in structure from the first embodiment, but the purpose for effectively separating the alignment layer 35 (45) and the sealant 302 is substantially the same.
陣列基板30包括基底300、陣列結構303、配向層35以及阻擋結構，在本實施例中，阻擋結構係以凹槽301b為例。陣列結構303可為一薄膜電晶體顯示陣列。阻擋結構形成於該基底300處並大體環繞該配向層35，其中該阻擋結構與該基底300之一表面300s構成一段差d3。The array substrate 30 includes a substrate 300, an array structure 303, an alignment layer 35, and a barrier structure. In the present embodiment, the barrier structure is exemplified by the recess 301b. Array structure 303 can be a thin film transistor display array. A barrier structure is formed at the substrate 300 and substantially surrounds the alignment layer 35, wherein the barrier structure forms a difference d3 with a surface 300s of the substrate 300.
對向基板40包括基底400、陣列結構403、配向層45以及阻擋結構，在本實施例中，阻擋結構係以凹槽401b為例。陣列結構403可為一彩色濾光片陣列。阻擋結構形成於該基底400處並大體環繞該配向層45，其中該阻擋結構與該基底400之一表面400s構成一段差d4。The opposite substrate 40 includes a substrate 400, an array structure 403, an alignment layer 45, and a barrier structure. In the present embodiment, the barrier structure is exemplified by the recess 401b. Array structure 403 can be a color filter array. A barrier structure is formed at the substrate 400 and substantially surrounds the alignment layer 45, wherein the barrier structure forms a difference d4 from a surface 400s of the substrate 400.
第4C圖為本發明之第三實施例之陣列基板以及液晶顯示面板。液晶顯示面板1包括陣列基板30、對向基板40、液晶層31以及封合膠302。本實施例與第一實施例有些許結構上不同，但用以有效分離配向層35(45)以及封合膠302之目的係大致相同。4C is an array substrate and a liquid crystal display panel according to a third embodiment of the present invention. The liquid crystal display panel 1 includes an array substrate 30, a counter substrate 40, a liquid crystal layer 31, and a sealant 302. This embodiment is somewhat different in structure from the first embodiment, but the purpose for effectively separating the alignment layer 35 (45) and the sealant 302 is substantially the same.
陣列基板30包括基底300、陣列結構303以及配向層 35。陣列結構303可為一薄膜電晶體顯示陣列。The array substrate 30 includes a substrate 300, an array structure 303, and an alignment layer 35. Array structure 303 can be a thin film transistor display array.
對向基板40包括基底400、陣列結構403、配向層45以及阻擋結構，在本實施例中，阻擋結構係以凹槽401b為例。陣列結構403可為一彩色濾光片陣列。阻擋結構形成於該基底400處並大體環繞該配向層45，其中該阻擋結構與該基底400之一表面400s構成一段差d4。The opposite substrate 40 includes a substrate 400, an array structure 403, an alignment layer 45, and a barrier structure. In the present embodiment, the barrier structure is exemplified by the recess 401b. Array structure 403 can be a color filter array. A barrier structure is formed at the substrate 400 and substantially surrounds the alignment layer 45, wherein the barrier structure forms a difference d4 from a surface 400s of the substrate 400.
然而，凹槽可形成在基底300處而不形成在基底400處，但不侷限，視製程需求而定。However, the grooves may be formed at the substrate 300 without being formed at the substrate 400, but are not limited, depending on process requirements.
第4D圖為本發明之第四實施例之陣列基板以及液晶顯示面板。液晶顯示面板1包括陣列基板30、對向基板40、液晶層31以及封合膠302。本實施例與第一實施例有些許結構上不同，但用以有效分離配向層35(45)以及封合膠302之目的係大致相同。4D is an array substrate and a liquid crystal display panel according to a fourth embodiment of the present invention. The liquid crystal display panel 1 includes an array substrate 30, a counter substrate 40, a liquid crystal layer 31, and a sealant 302. This embodiment is somewhat different in structure from the first embodiment, but the purpose for effectively separating the alignment layer 35 (45) and the sealant 302 is substantially the same.
陣列基板30包括基底300、陣列結構303、配向層35以及阻擋結構。陣列結構303可為一薄膜電晶體顯示陣列。The array substrate 30 includes a substrate 300, an array structure 303, an alignment layer 35, and a barrier structure. Array structure 303 can be a thin film transistor display array.
對向基板40包括基底400、陣列結構403、配向層45以及阻擋結構，在本實施例中，阻擋結構係以擋牆401a為例。陣列結構403可為一彩色濾光片陣列。阻擋結構形成於該基底400處並大體環繞該配向層45，其中該阻擋結構與該基底400之一表面400s構成一段差d4。The opposite substrate 40 includes a substrate 400, an array structure 403, an alignment layer 45, and a barrier structure. In the present embodiment, the barrier structure is exemplified by the retaining wall 401a. Array structure 403 can be a color filter array. A barrier structure is formed at the substrate 400 and substantially surrounds the alignment layer 45, wherein the barrier structure forms a difference d4 from a surface 400s of the substrate 400.
然而，擋牆可形成在基底300處而不形成在基底400處，但不侷限，視製程需求而定。However, the retaining wall may be formed at the substrate 300 without being formed at the substrate 400, but is not limited, depending on process requirements.
第4E圖為本發明之第五實施例之陣列基板以及液晶顯示面板。液晶顯示面板1包括陣列基板30、對向基板40、液晶層31以及封合膠302。本實施例與第一實施例有些許結構上不同，但用以有效分離配向層35(45)以及封合膠302之目的係大致相同。4E is an array substrate and a liquid crystal display panel according to a fifth embodiment of the present invention. The liquid crystal display panel 1 includes an array substrate 30, a counter substrate 40, a liquid crystal layer 31, and a sealant 302. This embodiment is somewhat different in structure from the first embodiment, but the purpose for effectively separating the alignment layer 35 (45) and the sealant 302 is substantially the same.
陣列基板30包括基底300、陣列結構303、配向層35以及阻擋結構，在本實施例中，阻擋結構係以凹槽301b為例。陣列結構303可為一薄膜電晶體顯示陣列。阻擋結構形成於該基底300處並大體環繞該配向層35，其中該阻擋結構與該基底300之一表面300s構成一段差d3。The array substrate 30 includes a substrate 300, an array structure 303, an alignment layer 35, and a barrier structure. In the present embodiment, the barrier structure is exemplified by the recess 301b. Array structure 303 can be a thin film transistor display array. A barrier structure is formed at the substrate 300 and substantially surrounds the alignment layer 35, wherein the barrier structure forms a difference d3 with a surface 300s of the substrate 300.
對向基板40包括基底400、陣列結構403、配向層45以及阻擋結構，在本實施例中，阻擋結構係以擋牆401a為例。陣列結構403可為一彩色濾光片陣列。阻擋結構形成於該基底400處並大體環繞該配向層45，其中該阻擋結構與該基底400之一表面400s構成一段差d2。The opposite substrate 40 includes a substrate 400, an array structure 403, an alignment layer 45, and a barrier structure. In the present embodiment, the barrier structure is exemplified by the retaining wall 401a. Array structure 403 can be a color filter array. A barrier structure is formed at the substrate 400 and substantially surrounds the alignment layer 45, wherein the barrier structure forms a difference d2 from a surface 400s of the substrate 400.
第4F圖為本發明之第六實施例之陣列基板以及液晶顯示面板。液晶顯示面板1包括陣列基板30、對向基板40、液晶層31以及封合膠302。與上述實施例部分不同的是，對向基板40包括黑色矩陣404以及位於黑色矩陣404上之間隙物405。陣列基板30包括擋牆301a，擋牆301a包括金屬導線305、絕緣層306以及金屬導線307，需特別注意 的是，間隙物405係與擋牆301a接觸且至少部分彼此重疊(overlap)。4F is an array substrate and a liquid crystal display panel according to a sixth embodiment of the present invention. The liquid crystal display panel 1 includes an array substrate 30, a counter substrate 40, a liquid crystal layer 31, and a sealant 302. Different from the above embodiment, the opposite substrate 40 includes a black matrix 404 and a spacer 405 on the black matrix 404. The array substrate 30 includes a retaining wall 301a including a metal wire 305, an insulating layer 306, and a metal wire 307, which requires special attention. The spacers 405 are in contact with the retaining wall 301a and at least partially overlap each other.
第4G圖為本發明之第七實施例之陣列基板以及液晶顯示面板。液晶顯示面板1包括陣列基板30、對向基板40、液晶層31以及封合膠302。本實施例大體與第六實施例相同，唯一不同處在於間隙物405係與擋牆301a不接觸，且至少部分彼此重疊(overlap)。其餘部分相同，在此不贅述。Fig. 4G is an array substrate and a liquid crystal display panel of a seventh embodiment of the present invention. The liquid crystal display panel 1 includes an array substrate 30, a counter substrate 40, a liquid crystal layer 31, and a sealant 302. This embodiment is generally the same as the sixth embodiment except that the spacers 405 are not in contact with the retaining wall 301a and at least partially overlap each other. The rest are the same and will not be described here.
第5A圖至第5C圖為本發明之陣列基板50之上視圖，係用以說明阻擋結構之分布狀況之各變形例。阻擋結構舉例係為上述各實施例之擋牆或是凹槽。5A to 5C are top views of the array substrate 50 of the present invention, and are intended to explain various modifications of the distribution of the barrier structure. The barrier structure is exemplified by the retaining walls or grooves of the above embodiments.
如第5A圖所示，阻擋結構501a(501b)、配向層55以及封合膠502均位於基底500上。阻擋結構501a(501b)係大體環繞配向層55，阻擋結構501a(501b)係位於配向層55以及封合膠502之間。As shown in FIG. 5A, the barrier structure 501a (501b), the alignment layer 55, and the sealant 502 are all located on the substrate 500. The barrier structure 501a (501b) is substantially surrounding the alignment layer 55, and the barrier structure 501a (501b) is located between the alignment layer 55 and the sealant 502.
如第5B圖所示，與第5A圖不同的是，阻擋結構501a(501b)僅位在基底500上之一側，而大體呈一直線。阻擋結構501a(501b)係位於配向層55以及封合膠502之一側之間。As shown in FIG. 5B, unlike FIG. 5A, the blocking structure 501a (501b) is located only on one side of the substrate 500, and is generally in a straight line. The barrier structure 501a (501b) is located between the alignment layer 55 and one side of the sealant 502.
如第5C圖所示，與第5A圖不同的是，阻擋結構501a(501b)僅位在基底500上之相連三側，而大體呈一ㄇ 字型(U字型)。阻擋結構501a(501b)係位於配向層55以及封合膠502之相連三側之間。As shown in FIG. 5C, unlike FIG. 5A, the blocking structure 501a (501b) is located only on the three sides of the substrate 500, and is substantially in the same manner. Font type (U type). The barrier structure 501a (501b) is located between the alignment layer 55 and the connected three sides of the sealant 502.
第6A圖至第6G圖為本發明之陣列基板之阻擋結構之各變形例局部放大圖。本處之陣列基板之陣列結構為彩色濾光片陣列，換言之，本處之陣列基板係以彩色濾光片基板為例。6A to 6G are partial enlarged views of respective modifications of the barrier structure of the array substrate of the present invention. The array structure of the array substrate of the present embodiment is a color filter array. In other words, the array substrate of the present embodiment is exemplified by a color filter substrate.
如第6A圖所示，位於基底600上的阻擋結構為擋牆601a，擋牆601a為單一膜層結構，擋牆601a之材質係包括色阻、樹脂或有機材料，舉例而言，在形成彩色濾光片陣列時，便同時以色阻603或是黑色矩陣604來形成擋牆601a，黑色矩陣604的厚度h2約為0.65微米至1.6微米。擋牆601a的寬度w1約為5微米至30微米，擋牆601a的厚度h1約為0.65微米至5微米，較佳的是厚度h1約為0.65微米至4微米。需特別注意的是，擋牆601a以及黑色矩陣604之間自然形成凹槽601b，凹槽601b的寬度w2約為5微米至500微米，較佳的是，寬度w2約為50微米至500微米，視設計需求而定。藉由擋牆601a或是凹槽601b的設置，配向層便不易堆積至封合膠602預定設置的位置，而導致後續形成的封合膠602會形成在配向層上，造成製程異常，也就是配向層不會位於後續形成的封合膠602以及基底600之間。As shown in FIG. 6A, the barrier structure on the substrate 600 is a retaining wall 601a, and the retaining wall 601a is a single film structure. The material of the retaining wall 601a includes a color resist, a resin or an organic material, for example, in forming a color. In the case of the filter array, the retaining wall 601a is formed by the color resist 603 or the black matrix 604, and the thickness h2 of the black matrix 604 is about 0.65 micrometers to 1.6 micrometers. The width w1 of the retaining wall 601a is about 5 micrometers to 30 micrometers, and the thickness h1 of the retaining wall 601a is about 0.65 micrometers to 5 micrometers, and preferably the thickness h1 is about 0.65 micrometers to 4 micrometers. It should be particularly noted that the recess 601b is naturally formed between the retaining wall 601a and the black matrix 604. The width w2 of the recess 601b is about 5 micrometers to 500 micrometers. Preferably, the width w2 is about 50 micrometers to 500 micrometers. Depending on design needs. By the arrangement of the retaining wall 601a or the recess 601b, the alignment layer is less likely to accumulate to the position where the sealing adhesive 602 is set, and the subsequently formed sealing adhesive 602 is formed on the alignment layer, causing an abnormal process, that is, The alignment layer is not located between the subsequently formed sealant 602 and the substrate 600.
如第6B圖所示，與第6A圖不同的是，位於基底600上的阻擋結構為擋牆601a，擋牆601a為多層膜層結構，擋牆601a包括第一層601a1以及位於第一層601a1上的第 二層601a2。擋牆601a之材質係包括色阻603、樹脂、黑色矩陣604或有機材料，舉例而言，在形成彩色濾光片陣列時，以黑色矩陣604來形成第一層601a1，之後以色阻在第一層601a1上形成第二層601a2，然而，第一層601a1以及第二層601a2之材質並不侷限，也可以是第一層601a1以色阻形成，第二層601a2以有機材料形成，在此所謂之有機材料舉例係為在垂直配向(vertical alignment，VA)模式之配向凸塊所形成。擋牆601a的厚度h1約為0.65微米至5微米，較佳的是厚度h1約為0.65微米至4微米。黑色矩陣604的厚度h2約為0.65微米至1.6微米。其餘部分與第6A圖相同，在此不贅述。As shown in FIG. 6B, unlike FIG. 6A, the barrier structure on the substrate 600 is a retaining wall 601a, and the retaining wall 601a is a multi-layered film structure. The retaining wall 601a includes a first layer 601a1 and a first layer 601a1. On the first The second floor is 601a2. The material of the retaining wall 601a includes a color resist 603, a resin, a black matrix 604 or an organic material. For example, when forming a color filter array, the first layer 601a1 is formed by a black matrix 604, and then the color resist is used. The second layer 601a2 is formed on the first layer 601a1. However, the materials of the first layer 601a1 and the second layer 601a2 are not limited. The first layer 601a1 may be formed by color resistance, and the second layer 601a2 may be formed of organic material. The so-called organic materials are exemplified by alignment bumps in a vertical alignment (VA) mode. The thickness h1 of the retaining wall 601a is about 0.65 micrometers to 5 micrometers, and preferably the thickness h1 is about 0.65 micrometers to 4 micrometers. The black matrix 604 has a thickness h2 of about 0.65 microns to 1.6 microns. The rest is the same as Figure 6A and will not be described here.
如第6C圖所示，位於基底600上的阻擋結構為擋牆601a，擋牆601a為單一膜層結構，擋牆601a之材質係包括色阻603或有機材料，需特別注意的是，擋牆601a之部分區域係位於黑色矩陣604上，是故，擋牆601a具有一最小厚度h1約為1微米至2.4微米，擋牆601a之寬度w1約為14微米至30微米，而位於黑色矩陣604上之擋牆601a部分之寬度w3約為7微米至15微米。As shown in FIG. 6C, the barrier structure on the substrate 600 is a retaining wall 601a, and the retaining wall 601a is a single film layer structure. The material of the retaining wall 601a includes a color resist 603 or an organic material, and special attention is paid to the retaining wall. A portion of the region 601a is located on the black matrix 604. Therefore, the retaining wall 601a has a minimum thickness h1 of about 1 micrometer to 2.4 micrometers, and the width w1 of the retaining wall 601a is about 14 micrometers to 30 micrometers, and is located on the black matrix 604. The width w3 of the portion of the retaining wall 601a is about 7 microns to 15 microns.
如第6D圖所示，與第6C圖不同的是，位於基底600上的阻擋結構為擋牆601a，擋牆601a為多層膜層結構，擋牆601a包括第一層601a1以及位於第一層601a1上的第二層601a2。擋牆601a之材質係包括色阻603、樹脂、黑色矩陣604或有機材料，舉例而言，在形成彩色濾光片陣列時，以黑色矩陣604來形成第一層601a1，之後以有機 材料在第一層601a1上形成第二層601a2，然而，第一層601a1以及第二層601a2之材質並不侷限，也可以是第一層601a1以第一色阻形成，第二層601a2以第二色阻形成，第一色阻以及第二色阻顏色不同。擋牆601a具有一最小厚度h1約為1微米至4微米，擋牆601a之寬度w1約為14微米至30微米，而位於黑色矩陣604上之擋牆601a部分之寬度w3約為7微米至15微米。其餘部分與第6C圖相同，在此不贅述。As shown in FIG. 6D, unlike FIG. 6C, the barrier structure on the substrate 600 is a retaining wall 601a, and the retaining wall 601a is a multi-layered film structure. The retaining wall 601a includes a first layer 601a1 and a first layer 601a1. The second layer 601a2 on. The material of the retaining wall 601a includes a color resist 603, a resin, a black matrix 604 or an organic material. For example, when forming a color filter array, the first layer 601a1 is formed by a black matrix 604, followed by organic The second layer 601a2 is formed on the first layer 601a1. However, the material of the first layer 601a1 and the second layer 601a2 is not limited. The first layer 601a1 may be formed by a first color resistance, and the second layer 601a2 may be The two color resists are formed, and the first color resist and the second color resist have different colors. The retaining wall 601a has a minimum thickness h1 of about 1 micrometer to 4 micrometers, the width w1 of the retaining wall 601a is about 14 micrometers to 30 micrometers, and the width w3 of the retaining wall 601a portion of the black matrix 604 is about 7 micrometers to 15 micrometers. Micron. The rest is the same as that of Figure 6C and will not be described here.
如第6E圖所示，位於基底600上的阻擋結構為擋牆601a，擋牆601a更位於黑色矩陣604上，此外，後續形成之封合膠602也位於黑色矩陣604上。擋牆601a之材質係包括色阻603、樹脂或有機材料，舉例而言，在形成彩色濾光片陣列時，便同時以色阻603來形成擋牆601a，擋牆601a之厚度h1約為1微米至2.4微米。As shown in FIG. 6E, the barrier structure on the substrate 600 is the retaining wall 601a, and the retaining wall 601a is further located on the black matrix 604. Further, the subsequently formed sealant 602 is also located on the black matrix 604. The material of the retaining wall 601a includes a color resist 603, a resin or an organic material. For example, when forming a color filter array, the retaining wall 601a is formed by the color resist 603 at the same time, and the thickness h1 of the retaining wall 601a is about 1. Micron to 2.4 microns.
如第6F圖所示，位於基底600上的阻擋結構為擋牆601a，擋牆601a更位於黑色矩陣604上，與第6E圖不同的是，後續形成之封合膠602係位於基底600上，擋牆601a之材質係包括色阻603、樹脂或有機材料，舉例而言，在形成彩色濾光片陣列時，便同時以色阻603來形成擋牆601a，擋牆601a之厚度h1約為1微米至2.4微米。而擋牆601a加上黑色矩陣604的厚度h3約為1.65微米至5微米，黑色矩陣604的厚度h3較佳為1.65微米至4微米。As shown in FIG. 6F, the barrier structure on the substrate 600 is the retaining wall 601a, and the retaining wall 601a is located on the black matrix 604. Unlike the 6E, the subsequently formed sealant 602 is located on the substrate 600. The material of the retaining wall 601a includes a color resist 603, a resin or an organic material. For example, when forming a color filter array, the retaining wall 601a is formed by the color resist 603 at the same time, and the thickness h1 of the retaining wall 601a is about 1. Micron to 2.4 microns. The thickness h3 of the retaining wall 601a plus the black matrix 604 is about 1.65 micrometers to 5 micrometers, and the thickness h3 of the black matrix 604 is preferably 1.65 micrometers to 4 micrometers.
如第6G圖所示，與第6E圖不同的是，凹槽601b係被形成在黑色矩陣604中，換句話說擋牆601a位於凹槽601b 以及後續形成之封合膠602之間。凹槽601b之深度d1約為0.65微米至1.3微米。其餘部分與第6E圖相同，在此不贅述。As shown in FIG. 6G, unlike FIG. 6E, the groove 601b is formed in the black matrix 604, in other words, the retaining wall 601a is located in the groove 601b. And between the subsequently formed sealant 602. The depth d1 of the groove 601b is about 0.65 micrometers to 1.3 micrometers. The rest is the same as that of Figure 6E and will not be described here.
第7A圖至第7M圖為本發明之陣列基板之阻擋結構之各變形例局部放大圖。本處之陣列基板之陣列結構為薄膜電晶體顯示陣列，換言之，本處之陣列基板係以薄膜電晶體顯示陣列基板為例。7A to 7M are partial enlarged views of respective modifications of the barrier structure of the array substrate of the present invention. The array structure of the array substrate of the present invention is a thin film transistor display array. In other words, the array substrate of the present embodiment is exemplified by a thin film transistor display array substrate.
如第7A圖所示，位於基底700上的阻擋結構為凹槽701b。其形成的方式舉例為，形成金屬導線705於基底700後，於金屬導線705形成凹陷(未標示)，之後，形成一保護層704於該金屬導線705以及基底700上，如此一來，在凹陷的位置自然形成凹槽701b，凹槽701b深度d3約為0.4微米至0.45微米。而後續形成之封合膠702係形成在保護層704上。As shown in FIG. 7A, the barrier structure on the substrate 700 is a recess 701b. The method is formed by forming a metal wire 705 on the substrate 700 and forming a recess (not labeled) on the metal wire 705. Thereafter, a protective layer 704 is formed on the metal wire 705 and the substrate 700, so that the recess is formed. The position naturally forms a groove 701b, and the groove 701b has a depth d3 of about 0.4 μm to 0.45 μm. The subsequently formed sealant 702 is formed on the protective layer 704.
如第7B圖所示，與第7A圖不同的是，形成金屬導線705後，形成絕緣層706於金屬導線705上，然後形成金屬導線707於絕緣層706上，接下來，在金屬導線707/絕緣層706/金屬導線705形成凹陷(未標示)，之後，形成一保護層704於該金屬導線705以及基底700上，如此一來，在凹陷的位置自然形成凹槽701b，凹槽701b深度d3約為0.7微米至0.76微米。而後續形成之封合膠702係形成在保護層704上。與第7A圖相比，本例之凹槽701b深度d3大於第7A圖之凹槽701b深度d3，是故，對於避免聚醯亞胺會溢流到封合膠設置的位置之功能係為更佳。As shown in FIG. 7B, unlike FIG. 7A, after the metal wire 705 is formed, the insulating layer 706 is formed on the metal wire 705, and then the metal wire 707 is formed on the insulating layer 706, and then, on the metal wire 707/ The insulating layer 706/metal wire 705 forms a recess (not shown), and then a protective layer 704 is formed on the metal wire 705 and the substrate 700. Thus, the groove 701b is naturally formed at the recessed position, and the groove 701b has a depth d3. It is about 0.7 microns to 0.76 microns. The subsequently formed sealant 702 is formed on the protective layer 704. Compared with the 7A figure, the depth d3 of the groove 701b of this example is larger than the depth d3 of the groove 701b of the 7A drawing, so that the function for avoiding the overflow of the polyimine to the position where the sealant is disposed is more good.
如第7C圖所示，擋牆701a形成於基底700上，擋牆701a舉例係由金屬導線705、絕緣層706或是金屬導線707所形成，之後，保護層704形成在擋牆701a以及基底700上，後續形成之結合層702係位在保護層704上。擋牆701a的厚度d1約為0.3微米至0.45微米。As shown in FIG. 7C, the retaining wall 701a is formed on the substrate 700. The retaining wall 701a is formed by a metal wire 705, an insulating layer 706 or a metal wire 707. Thereafter, the protective layer 704 is formed on the retaining wall 701a and the substrate 700. The subsequently formed bonding layer 702 is tied to the protective layer 704. The thickness d1 of the retaining wall 701a is about 0.3 micrometers to 0.45 micrometers.
如第7D圖所示，與第7C圖不同的是，擋牆701a係為雙層結構，擋牆701a包括金屬導線705以及位於金屬導線705上的絕緣層706。擋牆701a的厚度d1約為0.7微米至0.85微米，其餘部分與第7C圖相同，在此不贅述。As shown in FIG. 7D, unlike the 7C, the retaining wall 701a has a two-layer structure, and the retaining wall 701a includes a metal wire 705 and an insulating layer 706 on the metal wire 705. The thickness d1 of the retaining wall 701a is about 0.7 micrometers to 0.85 micrometers, and the rest is the same as that of the seventh embodiment, and will not be described herein.
如第7E圖所示，與第7C圖不同的是，擋牆701a係為多層結構，擋牆701a包括金屬導線705、位於金屬導線705上的絕緣層706以及位於絕緣層706上的金屬導線706。擋牆701a的厚度d1約為1.1微米至1.2微米，其餘部分與第7C圖相同，在此不贅述。As shown in FIG. 7E, unlike FIG. 7C, the retaining wall 701a is a multi-layered structure, and the retaining wall 701a includes a metal wire 705, an insulating layer 706 on the metal wire 705, and a metal wire 706 on the insulating layer 706. . The thickness d1 of the retaining wall 701a is about 1.1 micrometers to 1.2 micrometers, and the rest is the same as that of the seventh embodiment, and will not be described herein.
若比較第7C圖至第7E圖的擋牆701a厚度d1，第7E圖之擋牆701a厚度d1大於第7D圖之擋牆701a厚度d1，且第7D圖之擋牆701a厚度d1大於第7C圖之擋牆701a厚度d1，是故，擋牆701a厚度d1越大的，阻擋聚醯亞胺會溢流到封合膠設置的位置的功效越強。If the thickness d1 of the retaining wall 701a of FIGS. 7C to 7E is compared, the thickness d1 of the retaining wall 701a of FIG. 7E is greater than the thickness d1 of the retaining wall 701a of the 7D drawing, and the thickness d1 of the retaining wall 701a of the 7D drawing is larger than the 7C. The thickness d1 of the retaining wall 701a is such that the greater the thickness d1 of the retaining wall 701a, the stronger the effect of blocking the polyimine from overflowing to the position where the sealing gel is disposed.
如第7F圖所示，位於基底700上的阻擋結構為擋牆701a。其形成的方式舉例為，形成金屬導線705於基底700後，於金屬導線705上形成擋牆701a，擋牆701a可為由絕緣層706或金屬導線707形成，接下來，形成一保護層704於該擋牆701a以及基底700上，之後，後續形成之封 合膠702係形成在保護層704上而不位於擋牆701a上。擋牆701a之厚度d1約為0.3微米至0.4微米。As shown in FIG. 7F, the barrier structure on the substrate 700 is the retaining wall 701a. The method is formed by forming a metal wire 705 on the substrate 700 and forming a retaining wall 701a on the metal wire 705. The retaining wall 701a may be formed by an insulating layer 706 or a metal wire 707. Next, a protective layer 704 is formed. The retaining wall 701a and the base 700, and then the subsequent formed seal The glue 702 is formed on the protective layer 704 without being located on the retaining wall 701a. The thickness d1 of the retaining wall 701a is about 0.3 micrometers to 0.4 micrometers.
如第7G圖所示，與第7F圖不同的是，後續形成之封合膠702係形成在保護層704以及擋牆701a上。其餘部分與第7F圖相同，在此不贅述。As shown in Fig. 7G, unlike the 7F, the subsequently formed sealant 702 is formed on the protective layer 704 and the retaining wall 701a. The rest is the same as that of Figure 7F and will not be described here.
如第7H圖所示，與第7F圖不同的是，擋牆701a係為雙層結構，擋牆701a包括金屬導線705以及位於金屬導線705上的絕緣層706。擋牆701a的厚度d1約為0.7微米至0.75微米，擋牆701a的寬度w4約為3微米至10微米，其餘部分與第7F圖相同，在此不贅述。As shown in FIG. 7H, unlike the 7F, the retaining wall 701a is a two-layer structure, and the retaining wall 701a includes a metal wire 705 and an insulating layer 706 on the metal wire 705. The thickness d1 of the retaining wall 701a is about 0.7 micrometer to 0.75 micrometer, and the width w4 of the retaining wall 701a is about 3 micrometers to 10 micrometers, and the rest is the same as that of the seventh embodiment, and will not be described herein.
如第71圖所示，基底700上形成有金屬導線705、絕緣層706、擋牆701a、金屬導線707以及保護層704。擋牆701a具有厚度d1約為0.4微米，如此一來，後續形成在保護層704上的封合膠702便會藉由擋牆701a，而不會有聚醯亞胺會溢流至該位置的現象而導致製程異常。As shown in FIG. 71, a metal wire 705, an insulating layer 706, a retaining wall 701a, a metal wire 707, and a protective layer 704 are formed on the substrate 700. The retaining wall 701a has a thickness d1 of about 0.4 μm, so that the sealant 702 subsequently formed on the protective layer 704 will pass through the retaining wall 701a without overflowing the polyimine to the position. The phenomenon caused the process to be abnormal.
如第7J圖所示，金屬導線705形成於基底700後，在，金屬導線705形成凹陷(未標示)，之後，形成擋牆701a於金屬導線705上，之後，全面性形成保護層704，在凹陷的位置自然形成凹槽701b，而後續形成之封合膠702係形成在保護層704上而不位於擋牆701a上。擋牆701a之厚度d1約為0.25微米至0.45微米，凹槽701b之深度d3約為0.4微米至0.45微米。As shown in FIG. 7J, after the metal wire 705 is formed on the substrate 700, the metal wire 705 is recessed (not labeled), and then the retaining wall 701a is formed on the metal wire 705, and then the protective layer 704 is formed comprehensively. The recessed position naturally forms the recess 701b, and the subsequently formed sealant 702 is formed on the protective layer 704 without being located on the retaining wall 701a. The thickness d1 of the retaining wall 701a is about 0.25 micrometers to 0.45 micrometers, and the depth d3 of the recess 701b is about 0.4 micrometers to 0.45 micrometers.
如第7K圖所示，與第7J圖不同的是，後續形成之封合膠702係形成在保護層704以及擋牆701a上，其餘部分 與第7J圖相同，在此不贅述。As shown in FIG. 7K, unlike FIG. 7J, the subsequently formed sealant 702 is formed on the protective layer 704 and the retaining wall 701a, and the rest. The same as Fig. 7J, and will not be described here.
如第7L圖所示，與第7J圖不同的是，擋牆701a係為雙層結構。擋牆701a包括絕緣層706以及位於絕緣層706上的金屬導線707。擋牆701a厚度d1約為0.65微米至0.8微米，凹槽701b之深度d3約為0.4微米至0.45微米。其餘部分與第7J圖相同，在此不贅述。As shown in Fig. 7L, unlike the 7Jth diagram, the retaining wall 701a has a two-layer structure. The retaining wall 701a includes an insulating layer 706 and a metal wire 707 on the insulating layer 706. The thickness d1 of the retaining wall 701a is about 0.65 micrometers to 0.8 micrometers, and the depth d3 of the recess 701b is about 0.4 micrometers to 0.45 micrometers. The rest is the same as Fig. 7J and will not be described here.
如第7M圖所示，依序形成金屬導線705、絕緣層706、擋牆701a以及金屬導線707於基底700上，之後圖案化金屬導線705、絕緣層706以及金屬導線707，而形成凹陷(未標示)，接下來，全面性形成保護層704，故自然形成凹槽701b，而後續形成之封合膠702係位於保護層704上。凹槽701b之深度d3約為0.7微米至0.76微米。擋牆701a之厚度約為0.34微米至0.5微米。As shown in FIG. 7M, a metal wire 705, an insulating layer 706, a retaining wall 701a, and a metal wire 707 are sequentially formed on the substrate 700, and then the metal wire 705, the insulating layer 706, and the metal wire 707 are patterned to form a recess (not Indicatively, next, the protective layer 704 is formed comprehensively, so that the recess 701b is naturally formed, and the subsequently formed sealant 702 is located on the protective layer 704. The depth d3 of the groove 701b is about 0.7 micrometers to 0.76 micrometers. The thickness of the retaining wall 701a is about 0.34 micrometers to 0.5 micrometers.
在上述例中，各擋牆之厚度約為0.3微米至5微米，凹槽深度約為0.4微米至1.6微米，舉例為0.4微米至0.76微米或0.65微米至1.6微米。In the above examples, each of the retaining walls has a thickness of about 0.3 micrometers to 5 micrometers and a groove depth of about 0.4 micrometers to 1.6 micrometers, for example, 0.4 micrometers to 0.76 micrometers or 0.65 micrometers to 1.6 micrometers.
綜上所述，本發明主要在提供一阻擋結構於封合膠以及配向層之間，避免在液晶顯示面板的製造過程中，聚醯亞胺會溢流到封合膠設置的位置，而導致封合膠接合兩基板的能力不佳，水氣進入液晶顯示面板之間隙，而產生缺陷。In summary, the present invention mainly provides a barrier structure between the sealant and the alignment layer, so as to prevent the polyimine from overflowing to the position where the sealant is disposed during the manufacturing process of the liquid crystal display panel, resulting in The ability of the sealant to join the two substrates is poor, and the moisture enters the gap of the liquid crystal display panel to cause defects.
雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾， 因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. , Therefore, the scope of the invention is defined by the scope of the appended claims.
1‧‧‧液晶顯示面板1‧‧‧LCD panel
10‧‧‧顯示母板10‧‧‧Display motherboard
110‧‧‧基座110‧‧‧Base
120‧‧‧印刷滾輪120‧‧‧Printing wheel
121‧‧‧花紋網目輪121‧‧‧pattern mesh wheel
122‧‧‧主滾輪122‧‧‧Main wheel
130‧‧‧印刷板130‧‧‧Printing board
140‧‧‧提供器140‧‧‧Provider
150‧‧‧聚醯亞胺150‧‧‧ Polyimine
20‧‧‧顯示母板20‧‧‧ display mother board
201a‧‧‧擋牆201a‧‧‧Retaining wall
201b‧‧‧凹槽201b‧‧‧ Groove
202‧‧‧封合膠202‧‧‧ Sealing glue
210‧‧‧基座210‧‧‧Base
220‧‧‧印刷滾輪220‧‧‧Printing wheel
230‧‧‧印刷板230‧‧‧Printing board
250‧‧‧聚醯亞胺250‧‧‧ Polyimine
30‧‧‧陣列基板30‧‧‧Array substrate
300‧‧‧基底300‧‧‧Base
300s‧‧‧表面300s‧‧‧ surface
301a‧‧‧擋牆301a‧‧ ‧ retaining wall
301b‧‧‧凹槽301b‧‧‧ Groove
302‧‧‧封合膠302‧‧‧ Sealing glue
303‧‧‧陣列結構303‧‧‧Array structure
31‧‧‧液晶層31‧‧‧Liquid layer
35‧‧‧配向層35‧‧‧Alignment layer
40‧‧‧陣列基板40‧‧‧Array substrate
400‧‧‧基底400‧‧‧Base
401a‧‧‧擋牆401a‧‧ ‧ retaining wall
401b‧‧‧凹槽401b‧‧‧ Groove
403‧‧‧陣列結構403‧‧‧Array structure
405‧‧‧間隙物405‧‧‧ spacers
45‧‧‧配向層45‧‧‧Alignment layer
50‧‧‧陣列基板50‧‧‧Array substrate
500‧‧‧基底500‧‧‧Base
501a、501b‧‧‧阻擋結構501a, 501b‧‧‧ blocking structure
502‧‧‧封合膠502‧‧‧ Sealing glue
55‧‧‧配向層55‧‧‧Alignment layer
600‧‧‧基底600‧‧‧Base
601a‧‧‧擋牆601a‧‧ ‧ retaining wall
601a1‧‧‧第一層601a1‧‧‧ first floor
601a2‧‧‧第二層601a2‧‧‧ second floor
601b‧‧‧凹槽601b‧‧‧ Groove
602‧‧‧封合膠602‧‧‧ Sealing glue
603‧‧‧色阻603‧‧‧Color resistance
604‧‧‧黑色矩陣604‧‧‧Black matrix
700‧‧‧基底700‧‧‧Base
701a‧‧‧擋牆701a‧‧‧Retaining wall
701b‧‧‧凹槽701b‧‧‧ Groove
702‧‧‧封合膠702‧‧‧ Sealing glue
704‧‧‧保護層704‧‧‧Protective layer
705‧‧‧金屬導線705‧‧‧Metal wire
706‧‧‧絕緣層706‧‧‧Insulation
707‧‧‧金屬導線707‧‧‧Metal wire
第1圖為習知顯示母板的製程概要圖；第2A圖以及第2B圖為本發明之顯示母板的製程概要圖；第2C圖為在本發明之顯示母板的製程中，顯示母板以及印刷滾輪相對位置的上視概要圖；第3圖為本發明之液晶顯示面板之概要圖；第4A圖為本發明之第一實施例之陣列基板以及液晶顯示面板；第4B圖為本發明之第二實施例之陣列基板以及液晶顯示面板；第4C圖為本發明之第三實施例之陣列基板以及液晶顯示面板；第4D圖為本發明之第四實施例之陣列基板以及液晶顯示面板；第4E圖為本發明之第五實施例之陣列基板以及液晶顯示面板；第4F圖為本發明之第六實施例之陣列基板以及液晶顯示面板；第4G圖為本發明之第七實施例之陣列基板以及液晶 顯示面板；第5A圖至第5C圖為本發明之陣列基板50之上視圖，係用以說明阻擋結構之分布狀況之各變形例；第6A圖至第6G圖為本發明之彩色濾光片基板之阻擋結構之各變形例局部放大圖；及第7A圖至第7M圖為本發明之薄膜電晶體顯示陣列基板之阻擋結構之各變形例局部放大圖。1 is a schematic view showing a process of a conventional display mother board; FIGS. 2A and 2B are schematic views showing a process of a display mother board of the present invention; and FIG. 2C is a view showing a mother board in the process of displaying a mother board of the present invention; 3 is a schematic view of a liquid crystal display panel of the present invention; FIG. 4A is an array substrate and a liquid crystal display panel according to a first embodiment of the present invention; The array substrate and the liquid crystal display panel of the second embodiment of the present invention; FIG. 4C is an array substrate and a liquid crystal display panel according to a third embodiment of the present invention; FIG. 4D is an array substrate and a liquid crystal display according to a fourth embodiment of the present invention; 4E is an array substrate and a liquid crystal display panel according to a fifth embodiment of the present invention; FIG. 4F is an array substrate and a liquid crystal display panel according to a sixth embodiment of the present invention; and FIG. 4G is a seventh embodiment of the present invention; Array substrate and liquid crystal Display panel; 5A to 5C are top views of the array substrate 50 of the present invention, which are used to illustrate various variations of the distribution of the barrier structure; and FIGS. 6A to 6G are color filters of the present invention. A partially enlarged view of each modification of the barrier structure of the substrate; and FIGS. 7A to 7M are partially enlarged views of various modifications of the barrier structure of the thin film transistor display array substrate of the present invention.
50‧‧‧陣列基板50‧‧‧Array substrate
500‧‧‧基底500‧‧‧Base
501a、501b‧‧‧阻擋結構501a, 501b‧‧‧ blocking structure
55‧‧‧配向層55‧‧‧Alignment layer
Claims (12)
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| Application Number | Priority Date | Filing Date | Title |
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| TW97127774A TWI411840B (en) | 2008-07-22 | 2008-07-22 | Matrix substrate and liquid crystal display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| TW97127774A TWI411840B (en) | 2008-07-22 | 2008-07-22 | Matrix substrate and liquid crystal display panel |
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| TW201005360A TW201005360A (en) | 2010-02-01 |
| TWI411840B true TWI411840B (en) | 2013-10-11 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI408453B (en) * | 2010-07-30 | 2013-09-11 | Wdongguan Masstop Liquid Crystal Display Co Ltd | Substrate assembly and liquid crystal display panel |
| TWI447492B (en) * | 2011-07-29 | 2014-08-01 | Au Optronics Corp | Display panel |
| US9513514B2 (en) | 2014-03-14 | 2016-12-06 | Innolux Corporation | Display device |
| US9570365B2 (en) | 2014-03-14 | 2017-02-14 | Innolux Corporation | Display device and test pad thereof |
| TWI537656B (en) | 2014-03-14 | 2016-06-11 | 群創光電股份有限公司 | Display device |
| TWI571682B (en) * | 2014-03-14 | 2017-02-21 | 群創光電股份有限公司 | Display device |
| US9659973B2 (en) | 2014-03-14 | 2017-05-23 | Innolux Corporation | Display device |
| US10324345B2 (en) | 2014-03-14 | 2019-06-18 | Innolux Corporation | Display device and display substrate |
| US9507222B2 (en) | 2014-03-14 | 2016-11-29 | Innolux Corporation | Display device |
| US9750140B2 (en) | 2014-03-14 | 2017-08-29 | Innolux Corporation | Display device |
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| US6018380A (en) * | 1997-09-02 | 2000-01-25 | Prime View International Co. | LCD having trench formed on the substrate(s) to stop sealing material flowing to display areas |
| TW575764B (en) * | 2000-07-28 | 2004-02-11 | Ibm | Liquid crystal cell, display device, and method of fabricating liquid crystal cell |
| TW200632478A (en) * | 2005-03-04 | 2006-09-16 | Innolux Display Corp | Substrate and liquid crystal display using it |
| TW200712614A (en) * | 2005-09-20 | 2007-04-01 | Chi Mei Optoelectronics Corp | Liquid crystal display panel and manufacturing method of substrate thereof |
| TW200743839A (en) * | 2006-05-19 | 2007-12-01 | Chunghwa Picture Tubes Ltd | Liquid crystal display |
-
2008
- 2008-07-22 TW TW97127774A patent/TWI411840B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6018380A (en) * | 1997-09-02 | 2000-01-25 | Prime View International Co. | LCD having trench formed on the substrate(s) to stop sealing material flowing to display areas |
| TW575764B (en) * | 2000-07-28 | 2004-02-11 | Ibm | Liquid crystal cell, display device, and method of fabricating liquid crystal cell |
| TW200632478A (en) * | 2005-03-04 | 2006-09-16 | Innolux Display Corp | Substrate and liquid crystal display using it |
| TW200712614A (en) * | 2005-09-20 | 2007-04-01 | Chi Mei Optoelectronics Corp | Liquid crystal display panel and manufacturing method of substrate thereof |
| TW200743839A (en) * | 2006-05-19 | 2007-12-01 | Chunghwa Picture Tubes Ltd | Liquid crystal display |
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| Publication number | Publication date |
|---|---|
| TW201005360A (en) | 2010-02-01 |
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