TWI410313B - Substrate breaking device - Google Patents
Substrate breaking device Download PDFInfo
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- TWI410313B TWI410313B TW100102599A TW100102599A TWI410313B TW I410313 B TWI410313 B TW I410313B TW 100102599 A TW100102599 A TW 100102599A TW 100102599 A TW100102599 A TW 100102599A TW I410313 B TWI410313 B TW I410313B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Liquid Crystal (AREA)
Abstract
Description
本發明係關於一種將形成有複數個單位顯示面板圖案之母基板(亦稱為貼合基板、貼合母基板)分斷之基板分斷裝置。The present invention relates to a substrate breaking device for dividing a mother substrate (also referred to as a bonded substrate and a bonded mother substrate) in which a plurality of unit display panel patterns are formed.
本說明書之說明使用之「刻劃槽」係指對作為加工對象之脆性材料基板進行刻劃加工，使脆性材料基板之破壞現象從基板表面往內部產生時朝基板內部進展而形成之龜裂。The "scratch groove" used in the description of the present specification refers to a crack formed by scribing a brittle material substrate to be processed, and causing the destruction phenomenon of the brittle material substrate to progress toward the inside from the substrate surface.
作為加工對象之脆性材料基板係指以玻璃基板為首之半導體晶圓、石英、陶瓷等利用於平面顯示面板之基板。The brittle material substrate to be processed refers to a substrate used for a flat display panel such as a semiconductor wafer including a glass substrate, quartz, or ceramics.
又，上述「刻劃加工」係指在脆性材料基板之加工，利用脆性破壞形成龜裂之加工。此外，將沿著以刻劃加工形成之劃線進行裂斷以將基板切斷(成面板)之動作稱為「分斷」。此外，在使用高滲透性刀輪進行刻劃加工時，會有形成不需要進行裂斷程度之深裂痕之情形，此情形不以「進行裂斷」而以「進行分離」來表現。Moreover, the above-mentioned "scoring processing" refers to a process of forming a crack in a brittle material substrate and forming a crack by brittle fracture. Further, the operation of cutting the scribe line formed by the scribe process to cut the substrate (forming the panel) is referred to as "breaking". Further, when the scribing process is performed using the high-permeability cutter wheel, there is a case where a deep crack which does not require a degree of cracking is formed, and this case is not expressed by "separating" by "cutting".
以下，以液晶顯示面板為例進行說明。液晶顯示面板製造用之母基板，係隔著將液晶密封之密封材將複數個彩色濾光片圖案化形成之第一基板(亦稱為CF側基板)與複數個TFT(薄膜電晶體)及端子區域圖案化形成之第二基板(亦稱為TFT側基板)加以貼合。此時，第二基板係以形成有TFT或端子區域之基板面作為與第一基板之接合面之方式加以貼合。Hereinafter, a liquid crystal display panel will be described as an example. A mother substrate for manufacturing a liquid crystal display panel is a first substrate (also referred to as a CF side substrate) and a plurality of TFTs (thin film transistors) formed by patterning a plurality of color filters with a liquid crystal sealing material; The second substrate (also referred to as a TFT side substrate) patterned in the terminal region is bonded. At this time, the second substrate is bonded so that the substrate surface on which the TFT or the terminal region is formed is a bonding surface with the first substrate.
第二基板之端子區域係在TFT與外部機器之間連接訊號線之區域，因此必須使其露出。因此，將母基板分割成各單位顯示面板時，將與端子區域對向之第一基板(CF側基板)之部位作為端材除去。具體而言，沿著與連接TFT側相反側之端子區域之外側端將第二基板側分斷，接著，在從端子區域之外側端往內側進入用以安裝訊號線所需之寬度(端子寬度)之位置將第一基板分斷。藉此，將與端子區域對向之第一基板之部位作為端材切除。The terminal region of the second substrate is a region where the signal line is connected between the TFT and the external device, and therefore must be exposed. Therefore, when the mother substrate is divided into the unit display panels, the portion of the first substrate (the CF side substrate) facing the terminal region is removed as the end material. Specifically, the second substrate side is divided along the outer side end of the terminal region on the side opposite to the connection TFT side, and then the width required for mounting the signal line is entered from the outer side end side of the terminal region (terminal width) The position of the first substrate is broken. Thereby, the portion of the first substrate facing the terminal region is cut off as an end material.
一般而言，在將母基板分割成各單位顯示面板之步驟，利用使用刀輪之分斷方法。此情形，分別對構成母基板之2片基板(CF側基板與TFT側基板)將刀輪壓接於分斷預定位置(刻劃預定線)以將刻劃槽刻於各基板。接著，沿著刻劃槽將母基板完全分斷成各單位顯示面板。作為此分斷方法，利用以刻劃槽為分界對左右之基板在上下施加力量之方法、或將左右任一方之基板往水平方向拉以進行裂斷之機械性裂斷方法。接著，藉由搬出機械臂將分割後之每一個單位顯示面板移送至後續步驟。In general, in the step of dividing the mother substrate into individual unit display panels, a breaking method using a cutter wheel is used. In this case, the cutter wheel is press-bonded to the predetermined breaking position (scratched line) on the two substrates (the CF side substrate and the TFT side substrate) constituting the mother substrate to scribe the grooves on the respective substrates. Next, the mother substrate is completely divided into unit display panels along the scribed grooves. As the breaking method, a method of applying force to the left and right substrates by the scribed grooves as a boundary or a mechanical breaking method in which the left and right substrates are pulled in the horizontal direction to perform cracking is used. Next, each of the divided unit display panels is transferred to the subsequent step by moving out the robot arm.
對母基板之上下兩面同時形成刻劃槽，不使基板反轉即進行加工之基板加工系統(基板分斷系統)或基板加工方法已揭示於例如專利文獻1或專利文獻2。根據此等文獻，使用上下一對刀輪將母基板從上下方向二面同時進行刻劃。接著，二面同時分離，分割成各單位顯示面板。A substrate processing system (substrate breaking system) or a substrate processing method in which a scribed groove is formed on both the upper and lower surfaces of the mother substrate and the substrate is not reversed is disclosed in, for example, Patent Document 1 or Patent Document 2. According to these documents, the mother substrate is simultaneously scribed from both sides in the vertical direction using a pair of upper and lower cutter wheels. Then, the two sides are simultaneously separated and divided into unit display panels.
此處，針對將母基板分斷成各單位顯示面板時之端子區域之加工進行說明。圖10係顯示在形成單位顯示面板之端子區域之部分形成有刻劃槽之狀態的圖，圖11係顯示沿著已形成之刻劃槽分斷後之狀態的圖。Here, the processing of the terminal region when the mother substrate is divided into the unit display panels will be described. Fig. 10 is a view showing a state in which a scribed groove is formed in a portion where a terminal region of a unit display panel is formed, and Fig. 11 is a view showing a state in which a groove is formed along a scribed groove.
在左側之單位顯示面板U1與右側之單位顯示面板U2之邊界設定有用以形成端子區域之3條刻劃預定線，沿著此等加工出3條刻劃槽。如圖10所示，第一刻劃槽S1與第二刻劃槽S2係形成為對第一基板G1與第二基板G2各自之加工端面一致。第三刻劃槽S3係在第一基板側形成於從刻劃槽S1離開端子寬度L之位置。Three scribed grooves are formed along the boundary between the unit display panel U1 on the left side and the unit display panel U2 on the right side, and three scribed grooves are formed along the boundary. As shown in FIG. 10, the first scribed groove S1 and the second scribed groove S2 are formed to coincide with the respective processed end faces of the first substrate G1 and the second substrate G2. The third scribed groove S3 is formed on the first substrate side at a position away from the terminal width L from the scribed groove S1.
接著，藉由沿著3條刻劃槽S1～S3進行裂斷，如圖11所示，形成2個切斷面Ca,Cb。Next, by cutting along the three scribed grooves S1 to S3, as shown in Fig. 11, two cut surfaces Ca and Cb are formed.
此等之中，將由第一刻劃槽S1與第二刻劃槽S2構成之切斷面稱為對齊切斷面Ca。對齊切斷面Ca係將單位顯示面板U1與單位顯示面板U2分離成相同端面之面。Among these, the cut surface formed by the first scribed groove S1 and the second scribed groove S2 is referred to as an aligned cut surface Ca. The alignment cut surface Ca separates the unit display panel U1 from the unit display panel U2 into the same end surface.
又，將在從對齊切斷面Ca離開端子寬度L之位置僅形成在第一基板G1側之切斷面稱為端子切斷面Cb。端子切斷面Cb係為了使端子區域T之端子面露出而分斷之切斷面。此外，在對齊切斷面Ca與端子切斷面Cb之間之第一基板G1產生端材E。Moreover, the cut surface formed only on the side of the first substrate G1 at a position away from the terminal width L from the alignment cut surface Ca is referred to as a terminal cut surface Cb. The terminal cut surface Cb is a cut surface that is cut to expose the terminal surface of the terminal region T. Further, the end material E is generated on the first substrate G1 between the aligned cut surface Ca and the terminal cut surface Cb.
在實際之製程，會產生端材E附著於對齊切斷面Ca之狀態、或附著於端子切斷面Cb之狀態之情形。是以，不論是端材E附著於對齊切斷面Ca之狀態、或附著於端子切斷面Cb之狀態，皆須進行追加之裂斷處理以作成良品。In the actual process, there is a case where the end material E adheres to the aligned cut surface Ca or adheres to the terminal cut surface Cb. Therefore, regardless of whether the end material E adheres to the aligned cut surface Ca or adheres to the terminal cut surface Cb, additional cracking treatment is required to make a good product.
因此，必需額外準備與各附著狀態對應之二種裂斷機構，判定為二種附著狀態之何者，與端材E之附著狀態對應選擇裂斷機構，進行追加之裂斷處理，由於必須要二種裂斷機構，因此裂斷步驟變複雜。Therefore, it is necessary to additionally prepare two kinds of breaking mechanisms corresponding to the respective attachment states, and determine which of the two types of attachment states, and select the breaking mechanism in accordance with the attachment state of the end material E, and perform additional cracking treatment, since it is necessary to A cracking mechanism, so the breaking step becomes complicated.
因此，揭示有恆使端材E附著於對齊切斷面Ca，在下一步驟使用單一種類之裂斷機構確實分離端材E之分割方法(參照專利文獻3)。Therefore, it is disclosed that the end material E is adhered to the alignment cut surface Ca, and the separation method of the end material E is surely separated by a single type of breaking mechanism in the next step (see Patent Document 3).
根據此文獻所記載之分割方法，在以刀輪進行刻劃加工時，首先，對第一基板G1(CF側基板)進行加工，接著上下反轉對第二基板G2(TFT側基板)進行加工。在進行此刻劃加工時，使加工第二刻劃槽S2以及第三刻劃槽S3之刀輪之按壓力變強、使加工第一刻劃槽S1時之刀輪之按壓力變弱來進行。以此方式對刻劃賦予強弱以調整刻劃槽之深度，如圖12所示能在恆使端材E附著於對齊切斷面Ca之狀態下進行裂斷。其結果，僅準備一種裂斷機構即可高效率除去端材E。According to the division method described in this document, when the scribing process is performed by the cutter wheel, first, the first substrate G1 (CF side substrate) is processed, and then the second substrate G2 (TFT side substrate) is processed upside down. . When performing the scribe process, the pressing force of the cutter wheel for processing the second scribed groove S2 and the third scribed groove S3 is made strong, and the pressing force of the cutter wheel when the first scribed groove S1 is processed is weakened. get on. In this way, the strength is given to the scribe to adjust the depth of the scribed groove, and as shown in Fig. 12, the rupture can be performed in a state where the end material E is constantly attached to the aligned cut surface Ca. As a result, the end material E can be removed with high efficiency by preparing only one breaking mechanism.
專利文獻1：國際公開WO2005/087458號公報Patent Document 1: International Publication WO2005/087458
專利文獻2：國際公開WO2002/057192號公報Patent Document 2: International Publication WO2002/057192
專利文獻3：日本特開2008-056507號公報Patent Document 3: Japanese Laid-Open Patent Publication No. 2008-056507
然而，端材E附著於對齊切斷面Ca側之狀態，如圖12所示，成為端材E突出至對齊切斷面Ca之外側。亦即，分斷後之單位顯示面板U1,U2之分斷面形成為段差狀。以下，本發明中將此形態稱為「偏移形狀」。是以，若欲在右側之單位顯示面板U2之前將左側之單位顯示面板U1往上方取出、將單位顯示面板U1往第一基板G1側拉離而施力時，成為在單位顯示面板U1之端子區域與端材E接觸之狀態下按壓。此時，若端材E緊固地附著於單位顯示面板U2側之對齊切斷面Ca，則會有損傷端子區域之虞。However, the end material E adheres to the side of the aligned cut surface Ca side, and as shown in FIG. 12, the end material E protrudes to the outer side of the aligned cut surface Ca. That is, the divided sections of the unit display panels U1 and U2 after the division are formed into a stepped shape. Hereinafter, this form is referred to as an "offset shape" in the present invention. Therefore, if the unit display panel U1 on the left side is taken out before the unit display panel U2 on the right side, and the unit display panel U1 is pulled away from the first substrate G1 side to apply force, the terminal is displayed on the unit display panel U1. The area is pressed in contact with the end material E. At this time, if the end material E is firmly attached to the aligned cut surface Ca on the unit display panel U2 side, there is a possibility that the terminal area is damaged.
又，使單位顯示面板U1在水平方向移動分離之裂斷手段(參照專利文獻1)，由於附著於第一基板之端材E與單位顯示面板U1之端子區域T以面接觸水平移動，因此仍會因摩擦使端子區域產生損傷，而有生產之產率劣化之課題。In addition, the breaking means for moving the unit display panel U1 in the horizontal direction (see Patent Document 1), since the end material E attached to the first substrate and the terminal region T of the unit display panel U1 are horizontally moved in surface contact, There is a problem that the terminal area is damaged by friction, and the yield of production is deteriorated.
因此，本發明之目的在於提供一種即使分斷後母基板之單位顯示面板U1,U2之分斷面成為偏移形狀之情形，亦可不損傷單位顯示面板之端子區域即快速分斷之基板分斷裝置。Therefore, an object of the present invention is to provide a substrate breaking device that can quickly break a terminal region of a unit display panel without damaging the terminal portion of the unit display panel U1 and U2 after the division of the mother substrate. .
本發明中，作為前提，基板分斷裝置加工之母基板具有貼合有第一基板與第二基板之構造，在母基板之第一基板及第二基板分別設定有複數條刻劃預定線。此外，本發明之基板分斷裝置，係藉由沿著複數條刻劃預定線將母基板分斷，形成第二基板側較第一基板側突出之段差，分斷成在段差部分形成有端子區域之單位顯示面板之基板分斷裝置。In the present invention, the mother substrate processed by the substrate cutting device has a structure in which the first substrate and the second substrate are bonded to each other, and a plurality of predetermined scribe lines are set on the first substrate and the second substrate of the mother substrate. Further, in the substrate cutting device of the present invention, the mother substrate is divided along a plurality of predetermined lines, and a step difference between the second substrate side and the first substrate side is formed, and the terminal is formed to have a terminal formed in the step portion. The unit of the area displays the substrate breaking device of the panel.
此外，為了解決上述課題，本發明之基板分斷裝置具備以下構成。亦即，本發明之基板分斷裝置，係由配置於上述母基板之上下之第一刀輪以及第二刀輪、分別個別保持由刻劃預定線左右劃分之母基板之一對保持構件構成，在至少一方之保持構件設有用以使其在相對另一方之保持構件分離之方向且朝向斜方向移動之移動手段。Further, in order to solve the above problems, the substrate cutting device of the present invention has the following configuration. In other words, the substrate cutting device of the present invention comprises a first cutter wheel and a second cutter wheel disposed above and below the mother substrate, and each of the mother substrates respectively divided by the left and right scribe lines is formed by the holding member. At least one of the holding members is provided with a moving means for moving in a direction opposite to the other holding member and moving in an oblique direction.
根據本發明之基板分斷裝置，使分別個別保持由刻劃預定線左右劃分之母基板之一對保持構件之至少一方在相對另一方之保持構件遠離之方向且朝向第一基板側斜方向移動。藉此，端材(第一基板之端材部分與第二基板之端子區域部分)不接觸端子區域之面即可瞬間使其分離，具有可確實防止因摩擦等造成之端子區域之損傷且縮短分斷所需時間之效果。According to the substrate cutting device of the present invention, at least one of the mother substrate and the holding member, which are individually held by the right and left sides of the scribe line, are moved in a direction away from the other holding member and obliquely toward the first substrate side. . Thereby, the end material (the end portion of the first substrate and the terminal region portion of the second substrate) can be instantaneously separated without contacting the surface of the terminal region, and the terminal region can be reliably prevented from being damaged by friction or the like. The effect of breaking the time required.
上述發明中，保持構件之移動手段包含可在垂直方向移動地安裝於支承柱之垂直移動體，保持構件係配置成可在垂直移動體之上面於水平方向移動，使保持構件與垂直移動體同步移動，藉此使保持構件往斜上方移動亦可。In the above invention, the moving means of the holding member includes a vertically movable body that is movably attached to the support post in a vertical direction, and the holding member is configured to be movable in a horizontal direction above the vertically movable body to synchronize the holding member with the vertical moving body. Moving, thereby moving the holding member obliquely upward.
藉此，能使平台在穩定之狀態下確實往斜方向移動。Thereby, the platform can be moved in an oblique direction in a stable state.
以下根據顯示本發明實施形態之圖式詳細說明本發明之詳細。The details of the present invention are described in detail below based on the drawings showing embodiments of the present invention.
圖1係顯示本發明之基板分斷裝置M之刻劃機構部分之實施形態的立體圖。Fig. 1 is a perspective view showing an embodiment of a scribing mechanism portion of a substrate cutting device M of the present invention.
基板分斷裝置M具備作為保持待加工母基板之保持構件之水平平台1,2。在此平台1,2之上方以及下方隔著平台配置有用以形成刻劃槽之第一以及第二刀輪3,3。平台1,2係由沿著圖1之X方向(前後方向)分割後之前部平台1與後部平台2構成，配置成刀輪3,3位於平台1,2之間。平台1,2具備吸附保持母基板W(參照圖2)之吸附功能。又，設有使母基板W在平台上於Y方向移動之搬送機構(未圖示)。The substrate cutting device M is provided with horizontal platforms 1, 2 as holding members for holding the mother substrate to be processed. Above and below the platform 1, 2, a first and a second cutter wheel 3, 3 are provided which are spaced apart to form a scribed groove. The platforms 1, 2 are composed of a front platform 1 and a rear platform 2 which are divided along the X direction (front and rear direction) of Fig. 1, and are arranged such that the cutter wheels 3, 3 are located between the platforms 1, 2. The platforms 1 and 2 have an adsorption function of adsorbing and holding the mother substrate W (see FIG. 2). Further, a transport mechanism (not shown) for moving the mother substrate W in the Y direction on the stage is provided.
刀輪3,3係可上下移動地安裝於支承體4,4，支承體4,4係安裝成可沿著藉由兩側之支承柱5,5水平架設於X方向之上下之導桿6,6之導件7,7移動，藉由馬達8,8之旋轉移動於X方向。The cutter wheels 3, 3 are mounted on the support bodies 4, 4 so as to be movable up and down, and the support bodies 4, 4 are mounted so as to be horizontally erected above the X direction by the support columns 5, 5 on both sides. The guides 7, 7 of 6 are moved by the rotation of the motors 8, 8 in the X direction.
又，在可移動於X方向及Y方向之台座9,9分別設置有攝影機10,10。台座9,9係沿著在支承台9a上延伸於X方向之導件11移動。攝影機10,10能以手動操作上下移動，調整拍攝之焦點。以攝影機10,10拍攝之影像係顯示於顯示器12,12。Further, cameras 10 and 10 are provided in the pedestals 9, 9 which are movable in the X direction and the Y direction, respectively. The pedestals 9, 9 are moved along the guides 11 extending in the X direction on the support table 9a. The cameras 10, 10 can be moved up and down by manual operation to adjust the focus of the shooting. The images captured by the cameras 10, 10 are displayed on the displays 12, 12.
在裝載於平台1,2上之母基板W之表面設有用以特定位置之對準標記，藉由攝影機10,10拍攝對準標記以調整母基板W之位置。具體而言，藉由攝影機10,10拍攝平台1,2所支承之母基板W表面之對準標記以特定對準標記之位置。根據特定後之對準標記之位置，以影像處理檢測母基板W表面裝載時之位置及方向偏移。其結果，對母基板進行刻劃時，針對位置偏移變更刻劃開始位置，針對方向偏移藉由組合X軸及Y軸方向之刻劃動作之直線內插動作形成劃線。On the surface of the mother substrate W mounted on the stages 1, 2, alignment marks for specific positions are provided, and the alignment marks are photographed by the cameras 10, 10 to adjust the position of the mother substrate W. Specifically, the alignment marks of the surface of the mother substrate W supported by the platforms 1, 2 are photographed by the cameras 10, 10 to position the alignment marks. The position and direction shift when the surface of the mother substrate W is loaded is detected by image processing according to the position of the specific alignment mark. As a result, when the mother substrate is scribed, the scribe start position is changed for the positional shift, and the scribe line is formed by the linear interpolation operation for combining the sculpt operation in the X-axis and Y-axis directions with respect to the direction shift.
如圖2所示，上述平台1,2之中，至少一方之平台(本實施例中為前部平台1)係形成為可藉由移動手段13在遠離另一方之平台2之方向且朝向斜上方或斜下方移動。圖2所示之實施例中，移動手段13包含可在垂直方向移動地安裝於支承柱14之垂直移動體15，平台1係配置成可在垂直移動體15之上面沿著軌道16在水平方向(Y方向)移動，可藉由使平台1與垂直移動體15同步電動移動，使平台1在遠離另一方之平台2之方向往斜上方或斜下方移動。As shown in FIG. 2, at least one of the platforms 1 and 2 (the front platform 1 in this embodiment) is formed to be tiltable by the moving means 13 in the direction away from the platform 2 of the other side. Move up or down. In the embodiment shown in Fig. 2, the moving means 13 comprises a vertical moving body 15 movably mounted in a vertical direction on the support post 14, the platform 1 being arranged to be horizontally along the track 16 above the vertical moving body 15. In the (Y direction) movement, the platform 1 can be moved obliquely upward or obliquely in the direction away from the other platform 2 by electrically moving the platform 1 in synchronization with the vertical moving body 15.
在將母基板W分斷時，如圖2所示，在母基板W之第一基板(TFT側基板)為上側之狀態下將母基板W以既定位置(刻劃預定線位於刀輪3之延伸上之位置)裝載於平台1,2並吸附保持。接著，從上下方向使刀輪3,3沿著刻劃預定線緊壓母基板W進行刻劃。When the mother substrate W is divided, as shown in FIG. 2, the mother substrate W is placed at a predetermined position in a state where the first substrate (TFT side substrate) of the mother substrate W is on the upper side (the planned line is located at the cutter wheel 3) The position on the extension is loaded on the platform 1, 2 and adsorbed and held. Next, the cutter wheels 3, 3 are pressed from the vertical direction to the mother substrate W along the scribed line to perform the scribe.
此時，以分斷後之單位顯示面板U1,U2之分斷面如圖9所示成為偏移形狀之方式進行刻劃。亦即，如圖3及圖7所示，在使刀輪3,3於橫方向離開端子寬度L之狀態下，以強按壓力緊壓於第一基板G1與第二基板G2進行刻劃，加工第二刻劃槽S2以及第三刻劃槽S3。接著，如圖4及圖8所示，在與第二刻劃槽S2相對之位置以較弱力量對第一基板G1加工第一刻劃槽S1。此外，此時，較佳為，預先使無刃前緣之輥輪(未圖示)抵接在與第三刻劃槽S3相對之第二基板G2之位置，以賦予對加工第一刻劃槽S1時之下方向之力之阻力。此情形，預先在圖1中下方側之支承體4於刀輪3旁並行配置具備與其相同之升降機構之輥輪，在加工第一刻劃槽S1時使其作動即可。At this time, the divisional display panels U1 and U2 are sectioned so as to have an offset shape as shown in FIG. In other words, as shown in FIG. 3 and FIG. 7, in the state where the cutter wheels 3, 3 are separated from the terminal width L in the lateral direction, the first substrate G1 and the second substrate G2 are pressed with a strong pressing force to perform scribing. The second scribed groove S2 and the third scribed groove S3 are processed. Next, as shown in FIGS. 4 and 8, the first scribed groove S1 is processed to the first substrate G1 with a weak force at a position opposed to the second scribed groove S2. Further, in this case, it is preferable that the roller (not shown) having the leading edge of the blade is brought into contact with the second substrate G2 opposed to the third scribed groove S3 in advance to impart the first scribe to the processing. The resistance of the force in the direction below the slot S1. In this case, the support body 4 on the lower side in FIG. 1 is disposed in parallel with the roller having the same elevating mechanism in the vicinity of the cutter wheel 3, and may be actuated when the first scribed groove S1 is processed.
之後，如圖5及圖9所示，藉由移動手段13使前部平台1在遠離後部平台2之方向且往斜上方移動將母基板W分割，加工出單位顯示面板U1,U2。附著有端材E之單位顯示面板U2，在下一步驟從第一刻劃槽S1切除端材E。Thereafter, as shown in FIGS. 5 and 9, the front stage 1 is moved by the moving means 13 in a direction away from the rear stage 2 and obliquely upward to divide the mother substrate W, and the unit display panels U1, U2 are machined. The unit display panel U2 to which the end material E is attached is cut off from the first scribed groove S1 in the next step.
藉此，不接觸端子區域之面即可瞬間使其分斷，可確實防止摩擦等造成之端子區域T之損傷，且縮短分斷所需時間。又，在分斷時無以偏移形狀上下重疊之部分(單位顯示面板U2之端材部分E與單位顯示面板U1之端子區域部分)之接觸，不損傷端子區域T即可分斷。Thereby, the surface of the terminal region can be instantaneously disconnected without contacting the surface of the terminal region, and the damage of the terminal region T due to friction or the like can be surely prevented, and the time required for the disconnection can be shortened. Further, at the time of breaking, there is no contact between the upper and lower portions of the offset shape (the end portion E of the unit display panel U2 and the terminal region portion of the unit display panel U1), and the terminal region T can be broken without being damaged.
上述實施例中，雖顯示在將母基板W分斷時，在母基板W之第一基板(TFT側基板)為上側之狀態下將母基板W吸附保持於平台1,2並分斷之例，但相反地在母基板W之第一基板(TFT側基板)為下側之狀態下將母基板W吸附保持於平台1,2並同樣地刻劃後，如圖6所示，使平台1往箭頭所示之斜下方移動進行分斷亦可。In the above-described embodiment, when the mother substrate W is divided, the mother substrate W is adsorbed and held on the stage 1 and 2 while the first substrate (TFT side substrate) of the mother substrate W is on the upper side. On the contrary, the mother substrate W is adsorbed and held on the stage 1 and 2 while the first substrate (TFT side substrate) of the mother substrate W is on the lower side, and is similarly scribed, as shown in FIG. Move to the oblique downward direction as indicated by the arrow to break.
以上，雖針對本發明之代表性實施例進行了說明，但本發明並不一定要特定於上述實施形態。例如，上述實施例中，僅使前部平台可透過移動手段在斜方向移動，但亦可形成為前後之平台皆可斜向移動。又，上述移動手段只要為能使平台穩定地斜向移動之機構則何種構造皆可。例如，亦可使平台透過連桿機構在斜方向移動。除此之外，本發明中，在達成其目的且不超出申請專利範圍之情況下可適當地進行修正、變更。Although the representative embodiments of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, in the above embodiment, only the front platform can be moved in the oblique direction by the moving means, but the front and rear platforms can also be moved obliquely. Further, the above-described moving means may be any structure as long as it is a mechanism capable of stably moving the platform obliquely. For example, the platform can also be moved in an oblique direction through the link mechanism. In addition, in the present invention, corrections and changes can be appropriately made without departing from the scope of the patent application.
又，上述實施形態中，雖使平台在Y方向移動，但若使平台在XY方向分割，亦可在Y方向及X方向移動，進行二維斜向移動。Further, in the above-described embodiment, although the stage is moved in the Y direction, if the stage is divided in the XY direction, the table can be moved in the Y direction and the X direction to perform two-dimensional oblique movement.
本發明可利用於對液晶面板用之母基板進行刻劃並分割成單位顯示面板之基板分斷裝置。The present invention can be utilized in a substrate breaking device that scribes a mother substrate for a liquid crystal panel and divides it into a unit display panel.
W．．．基板W. . . Substrate
G1．．．第一基板G1. . . First substrate
G2．．．第二基板G2. . . Second substrate
1．．．前部平台(保持構件)1. . . Front platform (holding member)
2．．．後部平台(保持構件)2. . . Rear platform (holding member)
3．．．第一、第二刀輪3. . . First and second cutter wheels
13．．．移動手段13. . . Mobile means
14．．．支承柱14. . . Support column
15．．．垂直移動體15. . . Vertical moving body
圖1係顯示本發明之基板分斷裝置之刻劃機構部分的立體圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view showing a portion of a scoring mechanism of a substrate cutting device of the present invention.
圖2係顯示上述刻劃機構及平台移動手段之局部的前視圖。Fig. 2 is a front elevational view showing a portion of the above scribing mechanism and platform moving means.
圖3係顯示對圖1之母基板進行刻劃時之加工步驟之第一過程的圖。3 is a view showing a first process of the processing steps when the mother substrate of FIG. 1 is scribed.
圖4係顯示對圖1之母基板進行刻劃時之加工步驟之第二過程的圖。4 is a view showing a second process of the processing steps when the mother substrate of FIG. 1 is scribed.
圖5係顯示將圖1之母基板分斷後之狀態的圖。Fig. 5 is a view showing a state in which the mother substrate of Fig. 1 is broken.
圖6係顯示將圖1之母基板分斷後之另一狀態的圖。Fig. 6 is a view showing another state in which the mother substrate of Fig. 1 is divided.
圖7係圖3之主要部分放大圖。Fig. 7 is an enlarged view of a main part of Fig. 3.
圖8係圖4之主要部分放大圖。Fig. 8 is an enlarged view of a main part of Fig. 4.
圖9係圖5之主要部分放大圖。Fig. 9 is an enlarged view of a main part of Fig. 5.
圖10係顯示在單位顯示面板之端子區域之部分形成有刻劃槽之狀態的圖。Fig. 10 is a view showing a state in which a scribed groove is formed in a portion of a terminal region of a unit display panel.
圖11係顯示沿著已形成之刻劃槽分斷後之狀態的圖。Fig. 11 is a view showing a state after being divided along the formed scribed groove.
圖12係顯示使加工第二刻劃槽S2以及第三刻劃槽S3時之刀輪之按壓力變強、使加工第一刻劃槽S1時之刀輪之按壓力變弱時之分離狀態之例的圖。Fig. 12 is a view showing a state in which the pressing force of the cutter wheel when the second scribed groove S2 and the third scribed groove S3 is processed is made strong, and the pressing force of the cutter wheel when the first scribed groove S1 is processed is weakened. A diagram of an example.
U1,U2．．．單位顯示面板U1, U2. . . Unit display panel
W．．．基板W. . . Substrate
1．．．前部平台(保持構件)1. . . Front platform (holding member)
2．．．後部平台(保持構件)2. . . Rear platform (holding member)
13．．．移動手段13. . . Mobile means
Claims (2)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010026879A JP4996703B2 (en) | 2010-02-09 | 2010-02-09 | Substrate cutting device |
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| Publication Number | Publication Date |
|---|---|
| TW201132479A TW201132479A (en) | 2011-10-01 |
| TWI410313B true TWI410313B (en) | 2013-10-01 |
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| TW100102599A TWI410313B (en) | 2010-02-09 | 2011-01-25 | Substrate breaking device |
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| JP (1) | JP4996703B2 (en) |
| KR (1) | KR101345615B1 (en) |
| CN (1) | CN102152414A (en) |
| TW (1) | TWI410313B (en) |
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| TWI660828B (en) * | 2014-09-26 | 2019-06-01 | 日商三星鑽石工業股份有限公司 | Manufacturing method of liquid crystal display panel |
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| JP2011178054A (en) * | 2010-03-02 | 2011-09-15 | Ihi Corp | Brittle material cutting device and cutting method |
| JP5156085B2 (en) * | 2010-12-13 | 2013-03-06 | 三星ダイヤモンド工業株式会社 | Method for dividing bonded substrates |
| KR102048921B1 (en) | 2012-06-20 | 2019-11-27 | 삼성디스플레이 주식회사 | Cell cutting device and Cell cutting method |
| KR101614379B1 (en) * | 2014-06-25 | 2016-04-21 | 한국미쯔보시다이아몬드공업(주) | Method for cutting of bonded substrate |
| TWI585845B (en) * | 2016-01-11 | 2017-06-01 | 田宇科技股份有限公司 | Cutting method for cutting brittle material substrates |
| JP2018069614A (en) * | 2016-10-31 | 2018-05-10 | 三星ダイヤモンド工業株式会社 | Substrate dividing device |
| CN108218212A (en) * | 2016-12-14 | 2018-06-29 | 塔工程有限公司 | Substrate dividing apparatus |
| KR102064891B1 (en) | 2017-08-29 | 2020-01-10 | 한국미쯔보시다이아몬드공업(주) | Panel breaking device of brittle material substrate and panel breaking method using the same |
| KR101980606B1 (en) * | 2017-08-29 | 2019-05-21 | 한국미쯔보시다이아몬드공업(주) | Tilting type panel breaking device of brittle material substrate and tilting type panel breaking method using the same |
| KR102067987B1 (en) * | 2017-11-23 | 2020-01-20 | 주식회사 탑 엔지니어링 | Apparatus for cutting substrate |
| KR20190059575A (en) * | 2017-11-23 | 2019-05-31 | 주식회사 탑 엔지니어링 | Apparatus for cutting substrate |
| CN109531829B (en) * | 2019-01-28 | 2021-06-15 | 林华勇 | Ceramic matrix lath splitter of stretching type LED filament lamp |
| CN112331589B (en) * | 2020-10-26 | 2023-08-22 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Rolling unit, scribing wafer separation device and scribing wafer separation method |
| CN116023016A (en) * | 2023-03-17 | 2023-04-28 | 苏州威创达智能设备有限公司 | Swing arm for glass breaking and breaking table |
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Also Published As
| Publication number | Publication date |
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| KR101345615B1 (en) | 2013-12-27 |
| JP4996703B2 (en) | 2012-08-08 |
| CN102152414A (en) | 2011-08-17 |
| TW201132479A (en) | 2011-10-01 |
| JP2011162394A (en) | 2011-08-25 |
| KR20110093609A (en) | 2011-08-18 |
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