TWI406608B - Manufacturing method of fpcb - Google Patents
Manufacturing method of fpcb Download PDFInfo
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- TWI406608B TWI406608B TW97123764A TW97123764A TWI406608B TW I406608 B TWI406608 B TW I406608B TW 97123764 A TW97123764 A TW 97123764A TW 97123764 A TW97123764 A TW 97123764A TW I406608 B TWI406608 B TW I406608B
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- acrylate
- copolymer
- vinyl
- fpcb
- methacrylate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
本發明關於一種利用在高溫下發泡之發泡板的柔性印刷電路板(flexible printed circuit board，FPCB)。更具體而言，本發明關於一種用於FPCB之發泡板，其藉由採用一相互反應性共聚物樹脂作為一黏著層而具有優異的黏著強度且可藉由高溫加熱而輕易地自被黏著體(adherend)分離，以及關於一種使用該發泡板以製造FPCB之方法。The present invention relates to a flexible printed circuit board (FPCB) that utilizes a foamed sheet that is foamed at a high temperature. More specifically, the present invention relates to a foamed sheet for an FPCB which has excellent adhesion strength by using a mutually reactive copolymer resin as an adhesive layer and can be easily adhered by heating at a high temperature. Adherend separation, and a method of using the foamed sheet to manufacture an FPCB.
近來，對於FPCB的需求已隨著電子產品(如行動電話、數位相機、MP3播放器、DMB播放器或結合二或多種這些裝置之功能的多功能產品)之小型化及輕量化而急速增加。Recently, the demand for FPCB has rapidly increased with the miniaturization and weight reduction of electronic products such as mobile phones, digital cameras, MP3 players, DMB players, or multifunctional products that combine the functions of two or more of these devices.
在傳統製造FPCB之方法中，由於FPCB之可撓性，在利用黏著帶將FPCB固定在所謂載體或背板的基板上之後，才進行該方法。近來，業經研究一種使用發泡板製造FPCB之方法，以利於在該製造方法完成之後使FPCB自該黏著帶分離。In the conventional method of manufacturing an FPCB, the method is performed after the FPCB is fixed on a substrate of a so-called carrier or a backing plate by an adhesive tape due to the flexibility of the FPCB. Recently, a method of manufacturing an FPCB using a foamed sheet has been studied to facilitate separation of the FPCB from the adhesive tape after the manufacturing method is completed.
一般而言，在製造多層晶片電容器或晶片電感器時，發泡板主要用作黏著或切割的支撐物。此時，喪失黏著力的條件為120至130℃之溫度範圍及常壓下，且黏著力及發泡性為重要的物理性因子。然而，在製造FPCB的情況中，發泡板在150至160℃及40公斤/平方公分、歷時超過40分鐘的條件下(此為熱壓合(hot press lamination)之條件)應不會產生發泡室之破裂(break out of foam cell)，且應於熱壓合完成之後在較高溫度(即約180℃)下發泡。 並且，必須避免在製造FPCB之過程中因黏著性樹脂之轉移(transcription)所造成的FPCB污染。In general, when manufacturing multilayer wafer capacitors or wafer inductors, the foamed sheet is primarily used as a support for adhesion or cutting. At this time, the conditions for loss of adhesion are in the temperature range of 120 to 130 ° C and under normal pressure, and adhesion and foaming are important physical factors. However, in the case of manufacturing FPCB, the foamed sheet should not be produced at 150 to 160 ° C and 40 kg / cm 2 for more than 40 minutes (this is the condition of hot press lamination). The break out of foam cell should be foamed at a higher temperature (i.e., about 180 ° C) after the completion of the thermocompression. Also, FPCB contamination due to the transfer of the adhesive resin during the manufacture of the FPCB must be avoided.
然而，由於傳統發泡板在約150℃下開始發泡，無論發泡板的發泡溫度多高，傳統發泡板在較高溫度下的使用仍有限制。However, since the conventional foamed sheet starts to foam at about 150 ° C, the use of the conventional foamed sheet at a higher temperature is still limited regardless of the high foaming temperature of the foamed sheet.
同時，除了以如上所述使用在高溫下發泡的發泡板製造FPCB之方法以外，業經提出一種藉由將FPCBs貼附至雙面發泡板之兩面上來製造FPCB之方法，以提高FPCB製造商的獲利率。在這種方法中，係使用雙面發泡板以於製造過程中固定FPCB。使用這種方法，在不改變現有製程的情況下，經由單一製程同時生產兩個產品，且因此在製造FPCB之方法中可將每單位時間的生產力加倍。為了在製造多層FPCB或剛性FPCB之製程中提供靈活運用度，不可避免地要製造單面FPCB。雖然有製造商裝備了能同時對兩面進行加工的製造設備，但只有單一面可被加工，且因而在生產力的提升上存在限制。然而，在目前製造FPCB之方法中，由於可利用雙面黏著性發泡板來將FPCBs貼附至發泡板的兩面上而同時加工兩面，則可將生產力加倍。並且，由於發泡板可取代形成程序中之載體薄膜或氣墊薄膜的角色，則可能減少製造FPCB之過程中所用之次要材料的消耗量。Meanwhile, in addition to the method of manufacturing an FPCB using a foamed sheet which is foamed at a high temperature as described above, there has been proposed a method of manufacturing an FPCB by attaching FPCBs to both sides of a double-sided foamed sheet to improve FPCB manufacturing. The interest rate of the business. In this method, a double-sided foamed sheet is used to fix the FPCB during the manufacturing process. Using this method, two products are simultaneously produced via a single process without changing the existing process, and thus the productivity per unit time can be doubled in the method of manufacturing the FPCB. In order to provide flexibility in the process of manufacturing a multilayer FPCB or a rigid FPCB, it is inevitable to manufacture a single-sided FPCB. Although there are manufacturers equipped with manufacturing equipment capable of processing both sides at the same time, only a single side can be processed, and thus there is a limit in productivity improvement. However, in the current method of manufacturing the FPCB, the productivity can be doubled since the double-sided adhesive foam board can be used to attach the FPCBs to both sides of the foam board while processing both sides. Moreover, since the foamed sheet can replace the role of the carrier film or the air-cushion film in the process, it is possible to reduce the consumption of the secondary material used in the process of manufacturing the FPCB.
用來藉由將單面FPCB貼附至發泡板之兩面上而進行製程的發泡板，必須在160℃之溫度及40公斤/平方公分之壓力且歷時超過40分鐘的條件下不會發泡或受熱變形、對製造FPCB之過程期間接觸發泡板之化學品具有抗化學性、於製造FPCB之製程完成後在170至190℃下可輕易地發泡、以及避免在製造FPCB之過程期 間因黏著性樹脂之轉移所造成之FPCB的污染。The foamed board used for the process by attaching the single-sided FPCB to both sides of the foamed sheet must be produced at a temperature of 160 ° C and a pressure of 40 kg / cm 2 and over 40 minutes. Bubble or heat deformation, chemical resistance to chemicals that contact the foam board during the process of manufacturing FPCB, easy foaming at 170 to 190 ° C after the process of manufacturing FPCB, and avoiding the process of manufacturing FPCB The contamination of the FPCB caused by the transfer of the adhesive resin.
傳統上，使用主要含有交聯官能基及交聯劑的丙烯酸類黏著劑作為發泡板產品之黏著劑。為了藉由使這種黏著劑凝聚在微球上並限制微球的膨脹而提高發泡溫度，該黏著劑必須含有高比例的交聯官能基，亦必須使用大量的交聯劑。因此，黏性會顯著改變，且當交聯作用隨時間進行時，凝膠化作用隨之而進行，並且當塗覆進行超過4小時，經塗覆之產品的物理性質在開始階段及結束階段會變得不同。韓國專利申請案公開第10－2002－0060659號、第10－2002－0060656號與第10－2002－0060657號及韓國專利第10－0514611號已提出使用發泡板以減少雙面連接式(double access type)FPCB、單面FPCB及薄FPCB之製程。然而，係透過以下步驟進行FPCB之製造：去毛邊－貼附乾薄膜－曝光－顯影該乾薄膜－腐蝕銅－乾燥－捲繞－捲式切割－標籤黏合－形成覆蓋膜(熱壓)－去毛邊－表面處理－無電電鍍－衝孔(punching)。特定言之，覆蓋膜(coverlay)形成程序係在150至160℃及40公斤/平方公分且歷時超過40分鐘的條件下進行，且由於現有發泡板在這種條件下的覆蓋膜形成程序期間會發泡，故現有發泡板只可用在覆蓋膜形成程序之前的步驟。因此，傳統的發泡板並不實用。Conventionally, an acrylic adhesive mainly containing a crosslinking functional group and a crosslinking agent is used as an adhesive for a foamed sheet product. In order to increase the foaming temperature by agglomerating the adhesive on the microspheres and limiting the expansion of the microspheres, the adhesive must contain a high proportion of cross-linking functional groups, and a large amount of cross-linking agent must also be used. Therefore, the viscosity will change significantly, and when the crosslinking progresses with time, the gelation proceeds, and when the coating is carried out for more than 4 hours, the physical properties of the coated product are at the beginning and the end. Will become different. The use of a foamed plate to reduce the double-sided connection (double) has been proposed in Korean Patent Application Publication No. 10-2002-0060659, No. 10-2002-0060656 and No. 10-2002-0060657, and Korean Patent No. 10-0514611. Access type) Process for FPCB, single-sided FPCB and thin FPCB. However, the FPCB is manufactured by the following steps: deburring - attaching dry film - exposure - developing the dry film - etching copper - drying - winding - roll cutting - label bonding - forming a cover film (hot pressing) - going Burr - surface treatment - electroless plating - punching. In particular, the coverlay forming procedure is carried out at 150 to 160 ° C and 40 kg/cm 2 and over 40 minutes, and due to the existing film forming process of the foamed sheet under such conditions. It will foam, so the existing foamed board can only be used in the steps before the film forming process. Therefore, the conventional foam board is not practical.
再者，日東電工有限公司(日本)之日本專利公開案第2003－338678號揭示透過將單面FPCB貼附至發泡板之兩面上而使用雙面發泡板作為製程中的載體薄膜。然而，這種方法僅可部分應用於使用目前可取得之發泡板之製造程序的起初階段中。Further, Japanese Patent Publication No. 2003-338678 to Nitto Denko Co., Ltd. (Japan) discloses the use of a double-sided foamed sheet as a carrier film in a process by attaching a single-sided FPCB to both sides of a foamed sheet. However, this method can only be partially applied to the initial stage of the manufacturing process using the currently available foam board.
為解決以上問題，本發明之一目的係提供一種用於高溫發泡之發泡板，其藉由採用一相互反應性共聚物樹脂作為一黏著層而具有優異的黏著強度且可藉由在超過180℃下加熱而輕易地自被黏著體分離，以及提供一種利用該發泡板製造FPCB之方法。In order to solve the above problems, it is an object of the present invention to provide a foamed sheet for high-temperature foaming which has excellent adhesion strength by using a mutually reactive copolymer resin as an adhesive layer and can be exceeded by It is easily separated from the adherend by heating at 180 ° C, and a method of manufacturing an FPCB using the foamed sheet is provided.
本發明之另一目的係提供一種製造FPCB之方法，其相較於傳統製造單面FPCB之方法，可在單一製程中生產兩個單面FPCB，因此增進FPCB製造方法的生產力，此係經由使用一雙面發泡板，該雙面發泡板於熱壓程序期間，即使在160℃及40公斤/平方公分且歷時超過40分鐘的高溫高壓條件下，仍維持黏著力，且該雙面發泡板具有抗化學性而於蝕刻程序期間不會被蝕刻劑液體所滲透。Another object of the present invention is to provide a method of manufacturing an FPCB which can produce two single-sided FPCBs in a single process as compared with the conventional method of manufacturing a single-sided FPCB, thereby improving the productivity of the FPCB manufacturing method. a double-sided foaming board which maintains adhesion even under high temperature and high pressure conditions of 160 ° C and 40 kg / cm 2 and over 40 minutes during the hot pressing process, and the double-sided foaming The bubble plates are chemically resistant and are not penetrated by the etchant liquid during the etching process.
本發明關於一種可用於高溫下之FPCB所用之發泡板，其藉由採用一相互反應性共聚物樹脂作為一黏著層而具有優異的黏著強度且可藉由在超過180℃下加熱而輕易地自被黏著體分離；本發明亦關於一種使用該發泡板製造FPCB之方法。The present invention relates to a foamed sheet which can be used for an FPCB at a high temperature, which has excellent adhesion strength by using a mutually reactive copolymer resin as an adhesive layer and can be easily heated by heating at over 180 ° C. Separating from the adherend; the present invention also relates to a method of manufacturing an FPCB using the foamed sheet.
此後將詳細描述一種製造可用於高溫下之FPCB所用之發泡板的方法以及一種使用該發泡板製造FPCB之方法。對該製造FPCB之方法而言，將接著描述一種製造單面FPCB之方法以及一種藉由將FPCBs貼附至發泡板的兩面上來製造FPCB之方法。Hereinafter, a method of manufacturing a foamed sheet which can be used for an FPCB at a high temperature and a method of manufacturing an FPCB using the foamed sheet will be described in detail. For the method of manufacturing an FPCB, a method of manufacturing a single-sided FPCB and a method of manufacturing an FPCB by attaching FPCBs to both sides of a foamed sheet will be described next.
本發明之用於高溫發泡的發泡板為一黏著板，其中使用混有含熱膨脹性微球的相互反應性共聚物的黏著性樹脂來形成一黏著 層，且當該黏著層藉由加熱產生發泡或膨脹時，其可在高溫下分離。The foamed sheet for high-temperature foaming of the present invention is an adhesive sheet in which an adhesive resin mixed with a heat-expandable microsphere-containing mutually reactive copolymer is used to form an adhesive. The layer, and when the adhesive layer is foamed or expanded by heating, it can be separated at a high temperature.
第1圖為一剖面圖，說明一用於製造單面發泡板之單面發泡板，以及第2圖為一剖面圖，說明一用於製造FPCBs之雙面發泡板，係藉由將FPCBs貼附至該發泡板之兩面上。Figure 1 is a cross-sectional view showing a single-sided foamed sheet for producing a single-sided foamed sheet, and Figure 2 is a cross-sectional view showing a double-sided foamed sheet for manufacturing FPCBs by FPCBs are attached to both sides of the foam board.
如第1圖所示，在依照本發明之單面發泡板中，依序堆疊一基板1、一表面處理層2、一黏著層3及一離型膜(release film)4，且該黏著層3含有熱膨脹性微球及相互反應性共聚物。As shown in FIG. 1, in a single-sided foamed sheet according to the present invention, a substrate 1, a surface treatment layer 2, an adhesive layer 3, and a release film 4 are sequentially stacked, and the adhesive film is adhered. Layer 3 contains heat-expandable microspheres and a mutually reactive copolymer.
基板1可包含適合的商業化薄膜(如PET)並且具有較佳小於250微米且最佳為25至100微米的厚度，但不限於此。在該基板及該黏著層之間形成強化學鍵之表面處理層2係藉由在基板1上進行化學性表面氧化處理所形成，例如鉻酸、臭氧、電暈(corona)、火焰、以及游離輻射處理，或在基板1上處理具高極性之高分子化合物如水解乙烯乙酸乙烯酯(hydrolyzed ethylene vinyl acetate)及聚乙烯丁醛。表面處理層2在加熱後分離時必須不會污染被黏著體，且在製造FPCB之過程期間或在形成條件下不會被所使用的化學品所改變。該表面處理層的厚度係小於5微米，且較佳係小於1微米。較厚的表面處理層厚度在熱處理發泡板後導致較小的黏著層變形及較少的黏著力降低。該表面處理層具有以下作用：在使熱分離性黏著板黏附至該被黏著體時，維持良好的表面形狀並提供大的黏著面積，於此同時，在藉由加熱以發泡或膨脹黏著板而將該黏著板自該被黏著體分離，減少該黏著板之表面方向之發泡或膨脹上的限制並改進該黏著層之波狀變形。在直接將 該發泡黏著層塗覆在該基板上而形成發泡板的情況中，如果該黏著層及該基板之間不存在黏著力，則該發泡層及該基板在發泡及膨脹時會彼此分離。因此，達成所欲目的是不可能的。The substrate 1 may comprise a suitable commercial film such as PET and has a thickness of preferably less than 250 microns and most preferably from 25 to 100 microns, but is not limited thereto. The surface treatment layer 2 which forms a strong chemical bond between the substrate and the adhesive layer is formed by chemical surface oxidation treatment on the substrate 1, such as chromic acid, ozone, corona, flame, and free radiation. The polymer compound having high polarity such as hydrolyzed ethylene vinyl acetate and polyvinyl butyral is treated or treated on the substrate 1. The surface treatment layer 2 must not contaminate the adherend when it is separated after heating, and is not changed by the chemicals used during the process of manufacturing the FPCB or under the forming conditions. The surface treatment layer has a thickness of less than 5 microns, and preferably less than 1 micron. The thicker surface treatment layer thickness results in less adhesion layer deformation and less adhesion reduction after heat treatment of the foamed sheet. The surface treatment layer has a function of maintaining a good surface shape and providing a large adhesive area when the heat-separable adhesive sheet is adhered to the adherend, and at the same time, foaming or expanding the adhesive sheet by heating The adhesive sheet is separated from the adherend, reducing the restriction of foaming or expansion of the surface of the adhesive sheet and improving the wavy deformation of the adhesive layer. In direct In the case where the foamed adhesive layer is coated on the substrate to form a foamed sheet, if there is no adhesive force between the adhesive layer and the substrate, the foamed layer and the substrate will be mutually foamed and expanded. Separation. Therefore, it is impossible to achieve the desired purpose.
黏著層3含有熱膨脹性微球以藉由加熱使該黏附至被黏著體的黏著板輕易地自該被黏著體分離。藉由加熱該黏著層，熱膨脹性微球發泡及膨脹而使黏著層產生穿孔。因此，接觸被黏著體之黏著層的黏著面積會減少，因而可將該黏著板分離。The adhesive layer 3 contains heat-expandable microspheres to easily separate the adhesive sheet adhered to the adherend by heating from the adherend. By heating the adhesive layer, the heat-expandable microspheres are foamed and expanded to cause perforation of the adhesive layer. Therefore, the adhesive area of the adhesive layer contacting the adherend is reduced, so that the adhesive sheet can be separated.
該熱膨脹性微球係一種材料，如異丁烷、丙烷及戊烷，其可輕易氣化且具有熱膨脹性，且其外殼係由適合物質所構成，如偏二氯乙烯及丙烯腈共聚物，該適合物質具熱融熔性或可經熱膨脹而破碎。The heat-expandable microspheres are a material such as isobutane, propane and pentane which are easily vaporized and have thermal expansion, and the outer shell is composed of a suitable material such as a vinylidene chloride and an acrylonitrile copolymer. The suitable material is hot meltable or can be broken by thermal expansion.
具有10至25微米平均顆粒直徑的微球助於其藉由加熱而分散至該黏著性樹脂中，且導致黏著層的大幅變形及黏著力的顯著降低。再者，所形成之黏著層之厚度係大於微球之平均顆粒直徑，較佳係大於最終微球之最大顆粒直徑。另外，較佳的是使該黏著層之表面平滑且在加熱之前達到穩定的黏著力。為了藉由加熱以降低該黏著層之黏著力，該熱膨脹性微球較佳係以超過10倍的體積膨脹比率而發泡及膨脹，並且具有使該熱膨脹性微球在該體積膨脹比率下不會破碎的強度。The microspheres having an average particle diameter of 10 to 25 μm help to disperse into the adhesive resin by heating, and cause a large deformation of the adhesive layer and a significant decrease in adhesion. Further, the thickness of the adhesive layer formed is greater than the average particle diameter of the microspheres, preferably greater than the maximum particle diameter of the final microspheres. Further, it is preferred to make the surface of the adhesive layer smooth and achieve a stable adhesive force before heating. In order to reduce the adhesion of the adhesive layer by heating, the heat-expandable microspheres are preferably foamed and expanded at a volume expansion ratio of more than 10 times, and have the heat-expandable microspheres not at the volume expansion ratio. Will break the strength.
此外，由於在製造FPCB之製程中必然需要160℃之高溫，較佳係使用具有盡可能高之開始發泡溫度的微球。In addition, since a high temperature of 160 ° C is inevitably required in the process of manufacturing the FPCB, it is preferred to use microspheres having a foaming temperature as high as possible.
熱膨脹性微球之含量是依照所欲的黏著層膨脹比率或所欲的黏著力降低程度以適當地確定，但一般係小於50重量份，較佳係5 至20重量份，以100重量份之構成黏著層的黏著性樹脂計。The content of the heat-expandable microspheres is appropriately determined according to the desired expansion ratio of the adhesive layer or the degree of reduction of the desired adhesive force, but is generally less than 50 parts by weight, preferably 5 To 20 parts by weight, based on 100 parts by weight of the adhesive resin constituting the adhesive layer.
為了使黏著層可利用在接近140℃下開始發泡的熱膨脹性微球而在FPCB製造程序中於170至190℃的溫度範圍下被加熱，必須藉由限制微球之膨脹以提高發泡溫度。In order for the adhesive layer to be heated at a temperature ranging from 170 to 190 ° C in the FPCB manufacturing process using heat-expandable microspheres which start to foam at approximately 140 ° C, it is necessary to increase the foaming temperature by limiting the expansion of the microspheres. .
構成該黏著層之相互反應性共聚物為一黏著性樹脂，其中該第一共聚物係以乙烯基單體、乙烯基共聚單體及含羧基之乙烯基單體所共聚合而得，該第二共聚物係以乙烯基單體、乙烯基共聚單體及含噁唑啉基之乙烯基單體所共聚合而得。The mutually reactive copolymer constituting the adhesive layer is an adhesive resin, wherein the first copolymer is obtained by copolymerizing a vinyl monomer, a vinyl comonomer, and a carboxyl group-containing vinyl monomer. The di copolymer is obtained by copolymerization of a vinyl monomer, a vinyl comonomer, and a oxazoline group-containing vinyl monomer.
使用構成第一共聚物及第二共聚物的乙烯基單體及乙烯基共聚單體是為了賦予黏著劑黏著力、內聚力、耐熱性、可撓性、滯留性、彈性等等的目的(若有需要)，且可獨立為選自以下之一者：一或多個含烷基之乙烯基單體，選自丙烯酸甲酯、甲基丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸乙酯、丙烯酸丙酯、甲基丙烯酸丙酯、丙烯酸丁酯、甲基丙烯酸丁酯、丙烯酸己酯、甲基丙烯酸己酯、丙烯酸辛酯及丙烯酸2－乙基己基酯；一或多個含羥基之乙烯基單體，選自丙烯酸羥乙基酯、甲基丙烯酸羥乙基酯、丙烯酸羥丙基酯、甲基丙烯酸羥丙基酯、丙烯酸羥丁基酯、甲基丙烯酸羥丁基酯、丙烯酸羥己基酯及甲基丙烯酸羥己基酯；一或多個含N－取代醯胺乙烯基單體，選自N,N－二甲基丙烯醯胺及N,N－二甲基甲基丙烯醯胺；一或多個烷氧基烷基丙烯酸酯乙烯基單體，選自丙烯酸甲氧基乙基酯、甲基丙烯酸甲氧基乙基酯、丙烯酸乙氧基乙基酯及甲基丙烯酸乙氧基乙基酯；一或多個乙烯基單體，選自乙酸乙烯酯、丙酸乙烯酯、N－乙烯基吡咯烷酮、甲基乙烯基吡咯烷 酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌嗪(vinylpiperazine)、乙烯基吡嗪(vinylpyrazine)、乙烯基吡咯、乙烯基咪唑、乙烯基噁唑、乙烯基嗎啉、N－乙烯基甲醯胺、苯乙烯、α－甲基苯乙烯及N－乙烯基己內醯胺；一或多個氰基丙烯酸酯單體，選自丙烯腈及甲基丙烯腈；一或多個含環氧基之丙烯酸單體，選自丙烯酸縮水甘油酯及甲基丙烯酸縮水甘油酯；一或多個乙二醇丙烯酸酯單體，選自聚乙二醇丙烯酸酯、聚乙二醇甲基丙烯酸酯、聚丙二醇丙烯酸酯、聚丙二醇甲基丙烯酸酯、甲氧基乙二醇丙烯酸酯、甲氧基聚乙二醇甲基丙烯酸酯、甲氧基聚丙二醇丙烯酸酯及甲氧基聚丙二醇甲基丙烯酸酯；一或多個丙烯酸酯單體，選自丙烯酸四氫糠基酯、甲基丙烯酸四氫糠基酯及丙烯酸2－甲氧基乙基酯；一或多個單體，選自異戊二烯、丁二烯、異丁烯及乙烯基醚；或前述之二或多者之混合物。The vinyl monomer and the vinyl comonomer constituting the first copolymer and the second copolymer are used for the purpose of imparting adhesive adhesion, cohesion, heat resistance, flexibility, retention, elasticity, and the like (if any) Required), and may independently be one selected from the group consisting of one or more alkyl-containing vinyl monomers selected from the group consisting of methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, acrylic acid Propyl ester, propyl methacrylate, butyl acrylate, butyl methacrylate, hexyl acrylate, hexyl methacrylate, octyl acrylate and 2-ethylhexyl acrylate; one or more vinyl groups containing hydroxyl groups Monomer selected from hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, hydroxybutyl acrylate, hydroxybutyl methacrylate, hydroxyhexyl acrylate And hydroxyhexyl methacrylate; one or more N-substituted decyl vinyl monomers selected from the group consisting of N,N-dimethyl decylamine and N,N-dimethyl methacrylamide; One or more alkoxyalkyl acrylate vinyl monomers, selected From methoxyethyl acrylate, methoxyethyl methacrylate, ethoxyethyl acrylate and ethoxyethyl methacrylate; one or more vinyl monomers selected from vinyl acetate Ester, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidine Ketone, vinyl pyridine, vinyl piperidone, vinyl pyrimidine, vinylpiperazine, vinylpyrazine, vinyl pyrrole, vinyl imidazole, vinyl oxazole, vinyl morpholine, N-vinylformamide, styrene, α-methylstyrene and N-vinylcaprolactam; one or more cyanoacrylate monomers selected from the group consisting of acrylonitrile and methacrylonitrile; a plurality of epoxy group-containing acrylic monomers selected from the group consisting of glycidyl acrylate and glycidyl methacrylate; one or more ethylene glycol acrylate monomers selected from the group consisting of polyethylene glycol acrylate and polyethylene glycol Methacrylate, polypropylene glycol acrylate, polypropylene glycol methacrylate, methoxy ethylene glycol acrylate, methoxy polyethylene glycol methacrylate, methoxy polypropylene glycol acrylate and methoxy polymerization Propylene glycol methacrylate; one or more acrylate monomers selected from the group consisting of tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate and 2-methoxyethyl acrylate; one or more monomers, Selected from isoprene, butadiene, isobutylene and B Alkenyl ether; or a mixture of two or more of the foregoing.
利用該第一共聚物之含羧基之乙烯基單體是為了藉由自由基聚合反應而賦予交聯性質的目的，且其實例包含2、3或多種選自一官能性單體的共聚物，該官能性單體為例如一或多個選自丙烯酸、甲基丙烯酸、丙烯酸羧乙基酯、丙烯酸羧戊基酯、衣康酸、順丁烯二酸、反丁烯二酸及巴豆酸之含羧基之單體；以及一或多個選自順丁烯二酸酐或衣康酸酐之酸酐單體。The carboxyl group-containing vinyl monomer of the first copolymer is used for the purpose of imparting crosslinking property by radical polymerization, and examples thereof include 2, 3 or more copolymers selected from monofunctional monomers. The functional monomer is, for example, one or more selected from the group consisting of acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxy amyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. a carboxyl group-containing monomer; and one or more anhydride monomers selected from the group consisting of maleic anhydride or itaconic anhydride.
該第一共聚物較佳係由乙烯基單體、乙烯基共聚單體及含羧基之乙烯基單體以1：0.5至1.5：0.05至0.3之重量比所製造。利用該第二共聚物之含噁唑啉基之乙烯基單體是為了藉由自由基聚合反應而賦予交聯性質的目的，含噁唑啉基之乙烯基單體的實例包 含2－乙烯基－2－噁唑啉、2－乙烯基－4－乙烯基－2－噁唑啉、2－乙烯基－5－乙烯基－2－噁唑啉、2－異丙烯基－2－噁唑啉、2－異丙烯基－5－乙基－2－噁唑啉、2－異丙烯基－5－甲基－2－噁唑啉、2－(乙烯芐氧基－1－甲基乙基)－2－噁唑啉、2－(2－羥基－1－甲基乙基)丙烯酸酯、及2－(2－羥基－1－甲基乙基)甲基丙烯酸酯、或前述之二或多者之混合物。The first copolymer is preferably produced from a vinyl monomer, a vinyl comonomer, and a carboxyl group-containing vinyl monomer in a weight ratio of 1:0.5 to 1.5:0.05 to 0.3. The oxazoline group-containing vinyl monomer of the second copolymer is used for the purpose of imparting crosslinking property by radical polymerization, and an example package of the oxazoline group-containing vinyl monomer Containing 2-vinyl-2-oxazoline, 2-vinyl-4-vinyl-2-oxazoline, 2-vinyl-5-vinyl-2-oxazoline, 2-isopropenyl- 2-oxazoline, 2-isopropenyl-5-ethyl-2-oxazoline, 2-isopropenyl-5-methyl-2-oxazoline, 2-(vinylbenzyloxy-1- Methyl ethyl)-2-oxazoline, 2-(2-hydroxy-1-methylethyl) acrylate, and 2-(2-hydroxy-1-methylethyl) methacrylate, or a mixture of two or more of the foregoing.
該第二共聚物較佳係由乙烯基單體、乙烯基共聚單體及含噁唑啉基之乙烯基單體以1：0.5至1.5：0.05至0.3之重量比所製造。The second copolymer is preferably produced from a vinyl monomer, a vinyl comonomer, and an oxazoline group-containing vinyl monomer in a weight ratio of 1:0.5 to 1.5:0.05 to 0.3.
供本發明FPCB之發泡板之黏著層用的塗覆液係藉由在分別製備含羧基之第一共聚物及含噁唑啉基之第二共聚物後，將微球分散至由第一共聚物及第二共聚物混合所得的黏著性樹脂中所製備。所製得之用於黏著層的塗覆液係穩定的，儘管在室溫下長期貯存仍不會產生顯著的改變，並且相較於傳統發泡板的塗覆液可提高發泡溫度最高達10至30℃。The coating liquid for the adhesive layer of the foamed sheet of the FPCB of the present invention is obtained by dispersing the microspheres to the first one after separately preparing the first copolymer containing a carboxyl group and the second copolymer containing an oxazoline group It is prepared in an adhesive resin obtained by mixing a copolymer and a second copolymer. The coating liquid prepared for the adhesive layer is stable, although the long-term storage at room temperature does not produce a significant change, and the foaming temperature can be increased up to the coating liquid of the conventional foamed sheet. 10 to 30 ° C.
該黏著層必須在160℃之溫度及40公斤/平方公分之壓力下歷時40分鐘內不會發泡或受熱變形、對製造FPCB之製程期間接觸該黏著層之化學品具有抗化學性、以及不會在製造FPCB之製程期間因黏著性樹脂之轉移而污染FPCB。再者，黏著層必須在170至190℃之溫度下於一對流烘箱中5至10分鐘內或於一加熱板中10秒至3分鐘內輕易發泡，此乃在完成製造FPCB之製程後輕易地自被黏著體分離的加熱條件。The adhesive layer must not be foamed or thermally deformed for 40 minutes at a temperature of 160 ° C and a pressure of 40 kg / cm 2 , and is chemically resistant to chemicals that contact the adhesive layer during the manufacturing process of the FPCB, and The FPCB will be contaminated by the transfer of adhesive resin during the manufacturing process of the FPCB. Furthermore, the adhesive layer must be easily foamed in a pair of flow ovens at a temperature of 170 to 190 ° C for 5 to 10 minutes or in a heating plate for 10 seconds to 3 minutes, which is easy after the process of manufacturing the FPCB. Heating conditions for separation from the adherend.
同時，如第2圖所示，在依照本發明之雙面發泡板中，依序堆疊一離型膜4’、一黏著層3’、一表面處理層2’、一基板1、一表面處理層2、一黏著層3及一離型膜4，黏著層3及3’包含熱膨脹性 微球及相互反應性共聚物。各元件之細節與用於FPCB之單面發泡板相同。Meanwhile, as shown in FIG. 2, in the double-sided foamed board according to the present invention, a release film 4', an adhesive layer 3', a surface treatment layer 2', a substrate 1, and a surface are sequentially stacked. Treatment layer 2, an adhesive layer 3 and a release film 4, the adhesive layers 3 and 3' comprise thermal expansion Microspheres and mutually reactive copolymers. The details of each component are the same as for a single-sided foamed sheet for FPCB.
下文將描述一種使用本發明之發泡板製造FPCB之方法。A method of manufacturing an FPCB using the foamed sheet of the present invention will be described below.
使用單面發泡板製造單面FPCB係透過以下步驟進行：層壓FCCL及發泡板－去毛邊－層壓乾薄膜－曝光－顯影－蝕刻－分離該乾薄膜－標籤黏合－熱壓－表面處理－衝孔－分離該發泡板。The use of a single-sided foam board to fabricate a single-sided FPCB is carried out by laminating FCCL and foaming sheets - deburring - laminating dry film - exposure - developing - etching - separating the dry film - label bonding - hot pressing - surface Treatment - Punching - Separation of the foamed sheet.
同時，亦進行一種藉由將FPCBs貼附至雙面發泡板來製造FPCB之方法，如上所述，係透過以下步驟：層壓FCCL及發泡板－去毛邊－層壓乾薄膜－曝光－顯影－蝕刻－分離該乾薄膜－標籤黏合－熱壓－表面處理－衝孔－分離該發泡板。然而，在層壓FCCL及發泡板之步驟中，使用雙面發泡板以將FCCL層壓至發泡板的兩面上，如此可同時對經黏附之FCCL的兩面進行製程，且接著進行其餘步驟。因此，經由分離該發泡板，以單一製程可同時製造兩個單面FPCB。At the same time, a method of manufacturing an FPCB by attaching FPCBs to a double-sided foamed board is also carried out, as described above, by the following steps: laminating FCCL and foaming board - deburring - laminating dry film - exposure - Development - Etching - Separation of the dry film - label bonding - hot pressing - surface treatment - punching - separating the foam board. However, in the step of laminating the FCCL and the foamed sheet, a double-sided foamed sheet is used to laminate the FCCL to both sides of the foamed sheet, so that both sides of the adhered FCCL can be simultaneously processed, and then the rest step. Therefore, by separating the foamed sheets, two single-sided FPCBs can be simultaneously manufactured in a single process.
本發明可提供一種使用一發泡板製造FPCB之方法，該發泡板在熱壓程序期間即使在高溫高壓的條件下還維持黏著力、具有抗化學性而於蝕刻程序期間不會被蝕刻劑液體所穿滲、且可藉由高溫加熱輕易地自被黏著體分離。The present invention can provide a method for manufacturing an FPCB using a foamed sheet which maintains adhesion and chemical resistance even under high temperature and high pressure during a hot pressing process without being etched during the etching process. The liquid penetrates and can be easily separated from the adherend by heating at a high temperature.
由以下較佳之具體實施態樣之描述及所附圖式，可使本發明上述之目的、特徵及優點變得更清楚。The above objects, features and advantages of the present invention will become more apparent from the aspects of the appended claims.
下文將參照附圖詳細描述本發明之用於FPCB之發泡板，其使用一相互反應性共聚物樹脂作為一黏著層而具有優異的黏著強度並且可藉由超過180℃之加熱處理輕易地自被黏著體分離，以及使用該發泡板製造FPCB之方法。然而，該具體實施態樣僅為說明之目的，本發明之範圍不限於此。Hereinafter, the foamed sheet for FPCB of the present invention will be described in detail with reference to the accompanying drawings, which uses an inter-reactive copolymer resin as an adhesive layer to have excellent adhesive strength and can be easily self-heated by heat treatment exceeding 180 °C. Separated by an adhesive, and a method of manufacturing an FPCB using the foamed sheet. However, this specific embodiment is for illustrative purposes only, and the scope of the invention is not limited thereto.
第一共聚物之製造Manufacture of the first copolymer
在裝有攪拌器、冷凝器、滴液漏斗、溫度計及夾套的2升玻璃反應器中，將45克作為單體之丙烯酸乙酯、45克作為共聚單體之丙烯酸正丁酯及10克丙烯酸混合，且進一步一同添加0.01克α,α’－偶氮二異丁腈(作為引發劑)與100克乙酸乙酯及20克甲苯，接著於70℃下進行自由基聚合反應。經過30分鐘之後，添加並混合135克丙烯酸乙酯、135克作為共聚單體之丙烯酸正丁酯及30克丙烯酸。將0.5克作為引發劑之α,α’－偶氮二異丁腈溶解於100克乙酸乙酯及40克甲苯中，接著使用滴液漏斗滴加所得溶液歷時約90分鐘。於滴加期間維持溫度恆定。為了在反應完成之後消除殘餘的單體，將1克自由基引發劑溶解於50克乙酸乙酯及50克乙醇中並接著滴加歷時60分鐘，接著進一步反應3小時，由此製得第一共聚物。In a 2 liter glass reactor equipped with a stirrer, condenser, dropping funnel, thermometer and jacket, 45 grams of ethyl acrylate as a monomer, 45 grams of n-butyl acrylate as a comonomer, and 10 grams Acrylic acid was mixed, and 0.01 g of α,α'-azobisisobutyronitrile (as an initiator) was further added together with 100 g of ethyl acetate and 20 g of toluene, followed by radical polymerization at 70 °C. After 30 minutes, 135 grams of ethyl acrylate, 135 grams of n-butyl acrylate as a comonomer, and 30 grams of acrylic acid were added and mixed. 0.5 g of α,α'-azobisisobutyronitrile as an initiator was dissolved in 100 g of ethyl acetate and 40 g of toluene, followed by dropwise addition of the resulting solution using a dropping funnel for about 90 minutes. The temperature was kept constant during the dropwise addition. In order to eliminate residual monomers after completion of the reaction, 1 g of a radical initiator was dissolved in 50 g of ethyl acetate and 50 g of ethanol and then added dropwise for 60 minutes, followed by further reaction for 3 hours, thereby preparing the first Copolymer.
第二共聚物之製造Manufacture of second copolymer
在裝有攪拌器、冷凝器、滴液漏斗、溫度計及夾套的2升玻璃反應器中，將45克作為單體之丙烯酸乙酯、45克作為共聚單體之 丙烯酸正丁酯及10克2－異丙烯基－2－噁唑啉混合。將0.01克作為引發劑之α,α’－偶氮二異丁腈溶解於100克乙酸乙酯及20克甲苯中並且接著添加至反應器中，接著藉由如聚合含羧基之共聚物的相同方式於70℃下進行反應。進行自由基聚合反應。經過30分鐘之後，添加並混合135克丙烯酸乙酯、135克作為共聚單體之丙烯酸正丁酯及30克丙烯酸。將0.5克作為引發劑之α,α’－偶氮二異丁腈溶解於100克乙酸乙酯及40克甲苯中，接著使用滴液漏斗滴加所得溶液歷時約90分鐘。於滴加期間維持溫度恆定。為了在反應完成之後消除殘餘的單體，將1克自由基引發劑溶解於50克乙酸乙酯及50克乙醇中並接著滴加歷時60分鐘，之後進一步反應3小時，由此製得第二共聚物。In a 2 liter glass reactor equipped with a stirrer, a condenser, a dropping funnel, a thermometer and a jacket, 45 g of ethyl acrylate as a monomer and 45 g were used as comonomers. N-butyl acrylate was mixed with 10 g of 2-isopropenyl-2-oxazoline. 0.01 g of α,α'-azobisisobutyronitrile as an initiator was dissolved in 100 g of ethyl acetate and 20 g of toluene and then added to the reactor, followed by the same as by copolymerizing a carboxyl group-containing copolymer The reaction was carried out at 70 °C. A radical polymerization reaction is carried out. After 30 minutes, 135 grams of ethyl acrylate, 135 grams of n-butyl acrylate as a comonomer, and 30 grams of acrylic acid were added and mixed. 0.5 g of α,α'-azobisisobutyronitrile as an initiator was dissolved in 100 g of ethyl acetate and 40 g of toluene, followed by dropwise addition of the resulting solution using a dropping funnel for about 90 minutes. The temperature was kept constant during the dropwise addition. In order to eliminate residual monomers after completion of the reaction, 1 g of a radical initiator was dissolved in 50 g of ethyl acetate and 50 g of ethanol and then added dropwise for 60 minutes, followed by further reaction for 3 hours, thereby preparing a second Copolymer.
黏著性樹脂之製造Manufacture of adhesive resin
以1：1之重量比混合上述所製造之第一共聚物及第二共聚物。將10克微球(產品名稱：F80VSD，可自松本油脂製藥株式會社購得，在150至160℃下開始發泡)添加並分散至100克的混合樹脂中，由此製得一黏著性樹脂。The first copolymer and the second copolymer produced above were mixed in a weight ratio of 1:1. 10 g of microspheres (product name: F80VSD, available from Matsumoto Oil & Fat Pharmaceutical Co., Ltd., foaming at 150 to 160 ° C) was added and dispersed in 100 g of the mixed resin, thereby preparing an adhesive resin. .
藉由如製造實例1中所描述的相同方式製造黏著性樹脂，但製造第一共聚物及第二共聚物所使用之單體的重量比各自為丙烯酸乙酯/丙烯酸正丁酯/丙烯酸＝4.5/4.5/1.5及丙烯酸乙酯/丙烯酸正丁酯/2－異丙烯基－2－噁唑啉＝4.5/4.5/1.5。The adhesive resin was produced in the same manner as described in Production Example 1, except that the weight ratio of the monomers used in the production of the first copolymer and the second copolymer was each ethyl acrylate/n-butyl acrylate/acrylic acid = 4.5 /4.5/1.5 and ethyl acrylate/n-butyl acrylate/2-isopropenyl-2-oxazoline = 4.5/4.5/1.5.
藉由如製造實例1中所描述的相同方式製造黏著性樹脂，但製 造第一共聚物及第二共聚物所使用之單體的重量比各自為丙烯酸乙酯/丙烯酸正丁酯/丙烯酸＝4.5/4.5/0.6及丙烯酸乙酯/丙烯酸正丁酯/2－異丙烯基－2－噁唑啉＝4.5/4.5/0.6。An adhesive resin was produced in the same manner as described in Production Example 1, but was prepared. The weight ratio of the monomers used in the first copolymer and the second copolymer is each ethyl acrylate/n-butyl acrylate/acrylic acid=4.5/4.5/0.6 and ethyl acrylate/n-butyl acrylate/2-isopropene. Benz-2-oxazoline = 4.5/4.5/0.6.
藉由如製造實例1中所描述的相同方式製造黏著性樹脂，但製造製造實例1之第二共聚物所使用的單體為丙烯酸2－乙基己基酯/甲基丙烯酸甲酯/丙烯酸正丁酯/2－異丙烯基－2－噁唑啉＝2.0/2.5/4.5/1.0。The adhesive resin was produced in the same manner as described in Production Example 1, except that the monomer used in the manufacture of the second copolymer of Production Example 1 was 2-ethylhexyl acrylate/methyl methacrylate/acrylic acid n-butyl acrylate. Ester/2-isopropenyl-2-oxazoline = 2.0/2.5/4.5/1.0.
藉由如製造實例4中所描述的相同方式製造黏著性樹脂，但製造製造實例4之第二共聚物所使用之單體的重量比為丙烯酸2－乙基己基酯/甲基丙烯酸甲酯/丙烯酸正丁酯/2－異丙烯基－2－噁唑啉＝2.0/2.5/4.5/1.5。The adhesive resin was produced in the same manner as described in Production Example 4, but the weight ratio of the monomer used in the production of the second copolymer of Production Example 4 was 2-ethylhexyl acrylate/methyl methacrylate/ N-butyl acrylate/2-isopropenyl-2-oxazoline = 2.0/2.5/4.5/1.5.
經由將製造實例1至5所製造的黏著性樹脂塗敷於聚對苯二甲酸乙二酯薄膜(PET薄膜)(50微米)上、於其上形成37微米發泡黏著層、以及貼附36微米離型膜於其上而製造一發泡板，並且接著將該發泡板老化歷時7天。藉由將FPCBs貼附至該發泡板之兩面上來製造單面FPCBs之全部程序係透過以下步驟進行：層壓FCCL及發泡板－去毛邊－層壓乾薄膜－曝光－顯影－蝕刻－分離該乾薄膜－標籤黏合－熱壓－表面處理－衝孔－分離該發泡板。接著，對各個步驟評估效能。The adhesive resin produced in Production Examples 1 to 5 was applied onto a polyethylene terephthalate film (PET film) (50 μm), a 37 μm foamed adhesive layer was formed thereon, and attached 36 A micron release film was placed thereon to make a foamed sheet, and then the foamed sheet was aged for 7 days. The entire procedure for fabricating single-sided FPCBs by attaching FPCBs to both sides of the foamed sheet is carried out by laminating FCCL and foamed sheets - deburring - laminating dry film - exposure - development - etching - separation The dry film-tag bonding-hot pressing-surface treatment-punching-separating the foaming plate. Next, the performance is evaluated for each step.
A.FCCL之選擇A. FCCL's choice
一般而言，以銅箔、黏著劑、聚醯亞胺薄膜之厚度及該銅箔之種類來分類用於單面FPCB的FCCL。在目前的具體實施態樣中，使用具有表1中所示之規格的銅箔。製造產品中所用覆蓋膜在黏著層的厚度為25微米且在聚醯亞胺層的厚度為25微米。Generally, the FCCL for a single-sided FPCB is classified by the thickness of a copper foil, an adhesive, a polyimide film, and the kind of the copper foil. In the present specific embodiment, a copper foil having the specifications shown in Table 1 was used. The cover film used in the manufacture of the product had a thickness of 25 μm in the adhesive layer and a thickness of 25 μm in the polyimide layer.
B.層壓(FCCL及發泡板)B. Lamination (FCCL and foam board)
在這個步驟中，層壓發泡板及FCCL以使FCCL黏附至發泡板上。層壓是使用一般的層壓機，以單面FCCL之銅箔面朝外且將聚醯亞胺之表面黏附至發泡板的方式來進行。避免在經黏附之產品中產生聚醯亞胺之氣泡及皺褶，且確定周圍部分的黏附狀態，如此於後續步驟中各種化學品不會因為在周圍處的黏著力降低而滲入該經黏附之產品。In this step, the foamed sheet and FCCL are laminated to adhere the FCCL to the foamed sheet. The lamination is carried out by using a general laminating machine in which the copper foil of the one-sided FCCL faces outward and the surface of the polyimide is adhered to the foamed sheet. Avoid the formation of bubbles and wrinkles of polyimine in the adhered product, and determine the adhesion state of the surrounding parts, so that in the subsequent steps, various chemicals will not penetrate into the adhered by the adhesion at the surrounding area. product.
C.去毛邊C. Deburring
在去毛邊步驟中，去除塗在銅箔表面上用來防止銅箔表面腐蝕的防鏽劑，銅箔表面上會產生不平坦(unevenness)而增加銅箔的表面積並提高對乾薄膜(感光樹脂)的黏著力。此步驟是經由化學方法之輕微腐蝕銅的表面而進行，且使用硫酸(H2 SO4 )及過氧化氫(H2 O2 )的混合溶液作為化學品。In the deburring step, the rust inhibitor coated on the surface of the copper foil to prevent corrosion of the surface of the copper foil is removed, and unevenness is generated on the surface of the copper foil to increase the surface area of the copper foil and improve the dry film (photosensitive resin) ) the adhesion. This step is carried out by chemically etching the surface of the copper slightly, and a mixed solution of sulfuric acid (H 2 SO 4 ) and hydrogen peroxide (H 2 O 2 ) is used as the chemical.
D.層壓乾薄膜D. Laminated dry film
乾薄膜層壓係一種將感光樹脂黏附於銅箔上而在銅箔上形成電 路的步驟。當製造單面FPCB時，於銅箔表面上層壓乾薄膜，且由於FCCL很薄，將位在相反面的聚醯亞胺表面貼附至一載體薄膜上，以防止在後續步驟中產生皺摺或撕裂。Dry film lamination is a method in which a photosensitive resin is adhered to a copper foil to form electricity on the copper foil. The steps of the road. When manufacturing a single-sided FPCB, a dry film is laminated on the surface of the copper foil, and since the FCCL is thin, the surface of the opposite side polyimide is attached to a carrier film to prevent wrinkles in subsequent steps. Or tear.
E.曝光E. Exposure
在曝光步驟中，當為形成電路而將紫外線(UV)照射在一放置於黏附有感光樹脂之FCCL上方的光罩薄膜時，該UV不能透射該光罩薄膜之黑暗部分且僅能透射該光罩薄膜之透明部分。因此，交聯作用僅發生於該乾薄膜有接受到UV的部分。In the exposure step, when ultraviolet light (UV) is irradiated to form a photomask film placed over the FCCL to which the photosensitive resin is adhered to form a circuit, the UV cannot transmit the dark portion of the photomask film and can transmit only the light. The transparent portion of the cover film. Therefore, the crosslinking action only occurs when the dry film has a portion that receives UV.
F.顯影F. Development
使該乾薄膜暴露於3%碳酸鈉溶液中。結果，接受UV而產生交聯作用的部分未被溶解，但未接受UV而未發生交聯作用的部分則被溶解而曝露出銅。The dry film was exposed to a 3% sodium carbonate solution. As a result, the portion which received UV to cause cross-linking was not dissolved, but the portion which did not receive UV and did not undergo cross-linking was dissolved to expose copper.
G.蝕刻G. Etching
乾薄膜在將藉由顯影形成電路的部分處覆蓋銅箔而作為抗蝕劑，且將蝕刻劑(CuCl2 、HCl、H2 O2 )加到經曝露的銅箔上以腐蝕除電路以外之其餘部分的銅箔。The dry film is covered with a copper foil at a portion where the circuit is formed by development as a resist, and an etchant (CuCl 2 , HCl, H 2 O 2 ) is applied to the exposed copper foil to etch the circuit other than the circuit. The rest of the copper foil.
個別步驟中所用的化學品及加工條件係列於表2中。The chemicals and processing conditions used in the individual steps are summarized in Table 2.
H.標籤黏合H. Label bonding
在藉由蝕刻以在FCCL中形成電路之後，為保護電路，將覆蓋膜黏附到除了將與連接器連接的部分及將經焊接而供安裝零件(mounting parts)用之部分以外的電路部份。由於覆蓋膜係經熱固性黏著劑塗覆，所以黏著力很微弱。因此，在藉由熱壓進行黏著劑之固化以前，該覆蓋膜及已形成電路的FCCL係使用焊接而部分地且暫時地被固定，以防止該覆蓋膜移動。After etching to form a circuit in the FCCL, the protective film is adhered to a circuit portion other than the portion to be connected to the connector and the portion to be soldered for mounting parts. Since the cover film is coated with a thermosetting adhesive, the adhesion is weak. Therefore, before the curing of the adhesive by hot pressing, the cover film and the circuit-formed FCCL are partially and temporarily fixed by welding to prevent the cover film from moving.
I.熱壓I. Hot pressing
熱壓是為了藉由熱固作用而黏附覆蓋膜，且在表3所顯示的條件下進行。於此步驟中，使用加熱及加壓條件下歷經一預定時間的熱壓以使覆蓋膜之黏著劑受熱固化。為了使用該發泡板，於此步驟之加工條件下，該發泡板必須未發泡，且該發泡板及FPCB必須沒有外部形狀的變形或尺寸的改變。The hot pressing was performed to adhere the cover film by thermosetting, and was carried out under the conditions shown in Table 3. In this step, hot pressing is performed for a predetermined period of time under heating and pressing conditions to thermally cure the adhesive of the cover film. In order to use the foamed sheet, the foamed sheet must be unfoamed under the processing conditions of this step, and the foamed sheet and the FPCB must have no deformation or dimensional change of the outer shape.
J.表面處理J. Surface treatment
一般使用無電電鍍法進行表面處理，且該無電電鍍法為批式並在表4所示的條件下進行。金鍍覆為一複雜的程序且在金鍍覆之前進行使用下表所列之化學品的預步驟。The surface treatment was generally carried out using electroless plating, and the electroless plating method was carried out in batch form and under the conditions shown in Table 4. Gold plating is a complex procedure and the pre-steps of using the chemicals listed in the table below are performed prior to gold plating.
K.形成外部形狀(衝孔)K. Forming an external shape (punching)
為完成最終產品，將以經貼附之發泡板加工的FPCB進行衝孔以形成外部形狀。在此時，依模具之位置精確安裝導向孔以形成外部形狀。To complete the final product, the FPCB processed with the attached foamed sheet is punched to form an outer shape. At this time, the guide holes are precisely mounted depending on the position of the mold to form an outer shape.
L.分離發泡板L. Separation foam board
於此步驟中，必須將該發泡板之兩面上所貼附的FPCBs分離。該發泡板之特性在於，藉由發泡室在預定溫度下之膨脹造成黏著力降低而被分離。發泡溫度已經過設計使得該發泡板在至少170℃下發泡。完成表面處理的產品係利用如對流烘箱之加熱裝置來進行分離。In this step, the FPCBs attached to both sides of the foamed sheet must be separated. The foamed sheet is characterized in that it is separated by a decrease in adhesion caused by expansion of the foaming chamber at a predetermined temperature. The foaming temperature has been designed such that the foamed sheet is foamed at at least 170 °C. The finished surface treated product is separated by a heating device such as a convection oven.
在裝有攪拌器、冷凝器、滴液漏斗、溫度計及夾套的2升玻璃反應器中，將48.5克丙烯酸正丁酯、48.5克丙烯酸乙酯、2克丙烯酸、1克丙烯酸羥丙基酯及0.01克α,α’－偶氮二異丁腈溶解於160克乙酸乙酯及270克甲苯中，之後加入滴液漏斗中，接著以氮替換後之連續流，在80℃下滴加時進行自由基聚合反應歷時8小時。在反應終了時，加入過量之自由基引發劑以消除殘餘的單體，且接著加入10克微球(產品名稱：F80VSD，可自松本油脂製藥株式會社購得，在150至160℃下開始發泡)並分散，之後以黏著 性樹脂中羥基官能基含量的兩倍量添加異氰酸酯交聯劑(產品名稱：AK－75，愛敬化學有限公司)並攪拌，由此製得該黏著性樹脂。In a 2 liter glass reactor equipped with a stirrer, condenser, dropping funnel, thermometer and jacket, 48.5 grams of n-butyl acrylate, 48.5 grams of ethyl acrylate, 2 grams of acrylic acid, 1 gram of hydroxypropyl acrylate And 0.01 g of α,α'-azobisisobutyronitrile was dissolved in 160 g of ethyl acetate and 270 g of toluene, and then added to a dropping funnel, followed by continuous flow with nitrogen, and dropped at 80 ° C. The free radical polymerization was carried out for 8 hours. At the end of the reaction, an excess of free radical initiator was added to eliminate residual monomer, and then 10 g of microspheres were added (product name: F80VSD, available from Matsumoto Oil & Fat Pharmaceutical Co., Ltd., starting at 150 to 160 ° C) Bubble) and disperse, then stick The adhesive resin was prepared by adding an isocyanate crosslinking agent (product name: AK-75, Aijing Chemical Co., Ltd.) twice the amount of the hydroxyl functional group in the resin and stirring.
藉由如比較製造實例1中所描述的相同方式製造黏著性樹脂，但具有交聯官能基之丙烯酸羥丙基酯的用量增加至2.0克。The adhesive resin was produced in the same manner as described in Comparative Production Example 1, except that the amount of the hydroxypropyl acrylate having a crosslinking functional group was increased to 2.0 g.
藉由如比較製造實例1中所描述的相同方式製造黏著性樹脂，但以黏著性樹脂中羥基官能基含量的四倍量添加異氰酸酯交聯劑(產品名稱：AK－75，愛敬化學有限公司)。The adhesive resin was produced in the same manner as described in Comparative Production Example 1, except that the isocyanate crosslinking agent was added in four times the content of the hydroxyl functional group in the adhesive resin (product name: AK-75, Aijing Chemical Co., Ltd.) .
藉由如比較製造實例2中所描述的相同方式製造黏著性樹脂，但以黏著性樹脂中羥基官能基含量的四倍量添加異氰酸酯交聯劑(產品名稱：AK－75，愛敬化學有限公司)。The adhesive resin was produced in the same manner as described in Comparative Production Example 2, but the isocyanate crosslinking agent was added in four times the content of the hydroxyl functional group in the adhesive resin (product name: AK-75, Aijing Chemical Co., Ltd.) .
經由將比較製造實例1至4所製造的黏著性樹脂塗敷於PET薄膜(50微米)上、於其上形成37微米發泡黏著層、以及貼附36微米離型膜於其上而製造一發泡板。將所製造的發泡板老化歷時7天並接著用於最終測試中。藉由將FPCBs貼附至該發泡板的兩面上來製造單面FPCB之整個程序係透過以下步驟進行：層壓FCCL及發泡板－去毛邊－層壓乾薄膜－曝光－顯影－蝕刻－分離該乾薄膜－標籤黏合－熱壓－表面處理－衝孔－分離該發泡板。接著，對各個步驟評估效能。The adhesive resin produced in Comparative Production Examples 1 to 4 was coated on a PET film (50 μm), a 37 μm foamed adhesive layer was formed thereon, and a 36 μm release film was attached thereto to fabricate a film. Foam board. The foamed panels produced were aged for 7 days and then used in the final test. The entire process for fabricating a single-sided FPCB by attaching FPCBs to both sides of the foamed sheet is carried out by laminating FCCL and foamed sheets - deburring - laminating dry film - exposure - development - etching - separation The dry film-tag bonding-hot pressing-surface treatment-punching-separating the foaming plate. Next, the performance is evaluated for each step.
為了對使用上述製造實例、比較製造實例、實例及比較實例所 製造的黏著性樹脂及發泡板而藉由將FPCBs貼附至發泡板的兩面上來製造單面FPCB之方法進行測試，在以下材料及加工條件下對每一個製造FPCB之步驟評估用於高溫發泡之發泡板的可靠性。In order to use the above manufacturing examples, comparative manufacturing examples, examples and comparative examples The adhesive resin and the foamed sheet are manufactured by testing the method of manufacturing the single-sided FPCB by attaching the FPCBs to both sides of the foamed board, and evaluating each step of manufacturing the FPCB for the high temperature under the following materials and processing conditions The reliability of the foamed foam board.
1.未加工板之選擇1. Selection of unprocessed board
為用於FPCB之製造，用於發泡板之未加工板經過設計使得發泡劑在至少180℃下發泡成最適體積。因此，由於必須在發泡時使熱傳遞達到最大且必須在考慮可加工性或捲式方法的情況下具有可撓性，使用厚度為25至100微米之PET薄膜。另外，由於重複進行加熱至高溫及冷卻至室溫，必須沒有尺寸上的熱改變。為了符合這種條件，使用厚度為50微米之基板及厚度為36微米之離型膜。For use in the manufacture of FPCBs, the unprocessed panels for the foamed panels are designed such that the blowing agent is foamed to an optimum volume at at least 180 °C. Therefore, since it is necessary to maximize heat transfer at the time of foaming and must have flexibility in consideration of workability or a roll method, a PET film having a thickness of 25 to 100 μm is used. In addition, since heating is repeated to a high temperature and cooling to room temperature, there must be no thermal change in size. In order to meet this condition, a substrate having a thickness of 50 μm and a release film having a thickness of 36 μm were used.
2.發泡之條件及方法2. Conditions and methods of foaming
一般而言，使用對流烘箱及加熱板以分離發泡板。使用最小寬度超過250毫米之發泡板於FPCB之製造中，且由於在熱壓步驟中該發泡板必須是可耐用的，所以發泡劑本身應具有高發泡溫度之物理性質。因此，依照所欲的發泡力及FPCB的尺寸改變而在考慮熱傳導效率的情況下選擇發泡板分離設備。In general, a convection oven and a heating plate are used to separate the foamed sheets. A foamed sheet having a minimum width of more than 250 mm is used in the manufacture of the FPCB, and since the foamed sheet must be durable in the hot pressing step, the blowing agent itself should have physical properties of high foaming temperature. Therefore, the foamed sheet separating apparatus is selected in consideration of the heat transfer efficiency in accordance with the desired foaming power and the size change of the FPCB.
3.可靠性之評估3. Reliability assessment
將該發泡板應用到製造單面FPCB之方法中，且接著確認是否可能藉由將FPCBs貼附至發泡板的兩面上來製造FPCB而將製程效率加倍，及減少由於薄厚度的FPCB所導致之在製造程序中產生的皺摺或撕裂。尤其，當使用該發泡板加工時，另外實驗是否該發泡板本身會提高FPCB之品質，及是否製造FPCB之程序中會 產生負面因子而降低生產力並生產出不良產品。Applying the foamed sheet to a method of manufacturing a single-sided FPCB, and then confirming whether it is possible to fabricate the FPCB by attaching the FPCBs to both sides of the foamed board to double the process efficiency and reduce the FPCB due to the thin thickness Wrinkles or tears that occur during the manufacturing process. In particular, when using the foamed sheet for processing, it is additionally tested whether the foamed sheet itself will improve the quality of the FPCB, and whether the process of manufacturing the FPCB will be Produce negative factors to reduce productivity and produce bad products.
使溫度維持在70℃，將FCCL層壓至發泡板的兩面上。在層壓步驟期間，在經黏著之產品中不會產生聚醯亞胺之氣泡及皺褶。尤其，確定周圍部分的黏著狀態，如此各種化學品不會因為周圍處的黏著力降低而滲入經黏著之產品，且結果顯示出強的黏著力。即使當黏附有銅箔之發泡板被捲繞在捲筒中而彎曲時，也沒有發現發泡板與銅箔之分離。去毛邊所用之化學品為硫酸(H2 SO4 )及過氧化氫(H2 O2 )的混合溶液，且可確認該溶液不會滲入黏附於該發泡板的表面。於此步驟中，當將FCCLs貼附至該發泡板的兩面上時仍可維持厚度，因而不需要載體薄膜，該載體薄膜為一種次要材料。再者，可確認由於乾薄膜同時層壓至兩面上，工作程序降低至50%。另外，亦可確認曝光機自正面及背面照射UV以在曝光步驟中同時曝光兩面，且由於在利用發泡板進行曝光步驟時可對兩面同時曝光，故生產力增進至兩倍。藉由將FCCLs貼附至發泡板的兩面上而進行之FCCLs分離程序，已確認不會影響產品品質，且亦確認可提昇加工之簡易度。在顯影步驟中，沒有發現因顯影液(Na2 CO3 )之滲透所造成的分離現象。在蝕刻步驟中，類似於顯影步驟，有由於強酸溶液之滲透而造成FCCL及該發泡板分離的可能性，但在實際測試中沒有發現該分離現象。在標籤黏合步驟中，使用熨斗(iron)且當使用該發泡板進行加工時也使用熨斗。因此，必須使發泡板不會因為熨斗而發泡，且可證實在標籤黏合步驟之後沒有發生部分發泡。The temperature was maintained at 70 ° C and FCCL was laminated to both sides of the foamed sheet. During the lamination step, bubbles and wrinkles of the polyimide are not produced in the adhered product. In particular, the adhesion state of the surrounding portion is determined, so that various chemicals do not penetrate into the adhered product due to a decrease in adhesion at the periphery, and the result shows a strong adhesive force. Even when the foamed sheet to which the copper foil was adhered was bent in the roll, the separation of the foamed sheet from the copper foil was not observed. The chemical used for deburring was a mixed solution of sulfuric acid (H 2 SO 4 ) and hydrogen peroxide (H 2 O 2 ), and it was confirmed that the solution did not penetrate into the surface adhered to the foamed sheet. In this step, the thickness can be maintained when the FCCLs are attached to both sides of the foamed sheet, so that a carrier film is not required, and the carrier film is a secondary material. Furthermore, it was confirmed that the work procedure was reduced to 50% since the dry film was laminated to both sides at the same time. Further, it was confirmed that the exposure machine irradiated UV from the front and the back to simultaneously expose both sides in the exposure step, and since the both surfaces were simultaneously exposed when the exposure step was performed using the foamed plate, the productivity was doubled. The FCCLs separation procedure carried out by attaching FCCLs to both sides of the foam board has confirmed that the quality of the product will not be affected and that the ease of processing can be improved. In the developing step, no separation phenomenon due to penetration of the developer (Na 2 CO 3 ) was observed. In the etching step, similar to the development step, there is a possibility that the FCCL and the foamed sheet are separated due to the penetration of the strong acid solution, but the separation phenomenon was not found in actual tests. In the label bonding step, an iron is used and an iron is also used when processing using the foamed sheet. Therefore, it is necessary to prevent the foamed sheet from being foamed by the iron, and it can be confirmed that partial foaming does not occur after the label bonding step.
為了在熱壓步驟期間證實尺寸穩定性，使用及未使用該發泡板 製造之產品的尺寸係利用三維測量器來測量。尺寸穩定性之目標值設定為小於0.03%。In order to confirm dimensional stability during the hot pressing step, the foam board is used and not used The dimensions of the manufactured product are measured using a three-dimensional measuring device. The target value of dimensional stability is set to be less than 0.03%.
因化學品之滲透而造成該發泡板的分離是無電電鍍(即表面處理步驟)中的重要問題。在本發明中的無電電鍍步驟中，使用一種沉積方式的化學處理且由目視檢測(visual testing)之結果可證實液體不會滲透。The separation of the foamed sheet due to the penetration of chemicals is an important issue in electroless plating (i.e., surface treatment steps). In the electroless plating step in the present invention, a chemical treatment of a deposition method is used and the result of visual testing can confirm that the liquid does not penetrate.
於此步驟中，應分離貼附至該發泡板兩面上的FPCBs。該發泡板藉由發泡室在預定溫度下之膨脹造成黏著力降低而分離。發泡室經過設計以在至少170℃下發泡。完成表面處理的產品係使用如對流烘箱之加熱裝置而分離。完全分離之FPCB所需的證明因子如下文所述。第一，該發泡板之黏著劑應該未轉移至FPCB之背面上。第二，在發泡及分離步驟中應該未產生產品上的皺摺。第三，在使用該等化學品的整個程序中，該發泡板應該避免液體之滲透所造成的沾污。實際上，產品上的皺褶係於自該發泡板中不均勻顆粒大小之發泡室之發泡之後而產生的。然而，可藉由使該發泡板之顆粒大小及粒徑分佈皆為均勻，生產具有與現有利用單面發泡板之方法相同品質的最終產品。表5顯示將實例及比較實例所獲得之樣本應用至製造FPCB之方法中的結果。In this step, the FPCBs attached to both sides of the foamed sheet should be separated. The foamed sheet is separated by the expansion of the foaming chamber at a predetermined temperature to cause a decrease in adhesion. The foaming chamber is designed to foam at at least 170 °C. The finished surface treated product is separated using a heating device such as a convection oven. The proof factors required for a fully separated FPCB are as follows. First, the adhesive of the foamed sheet should not be transferred to the back of the FPCB. Second, no wrinkles on the product should be produced during the foaming and separation steps. Third, in the entire procedure for the use of such chemicals, the foamed sheet should avoid contamination by the penetration of liquid. In fact, the wrinkles on the product are produced after the foaming of the foaming chamber of the uneven particle size in the foamed sheet. However, by making the particle size and particle size distribution of the foamed sheet uniform, a final product having the same quality as the conventional one using the single-sided foamed sheet can be produced. Table 5 shows the results of applying the samples obtained by the examples and comparative examples to the method of manufacturing the FPCB.
為了確認熱壓步驟之後的尺寸穩定性，使用三維測量器來測量使用該發泡板所製造之產品的尺寸以及藉由現有方法使用單面發泡板所製造之產品的尺寸。如第4圖及第5圖所示，所測得之結果顯示尺寸改變之速率係小於0.03%，此乃尺寸穩定性之目標值。這表示在使用該發泡板加工時尺寸問題不會影響產品的製造。In order to confirm the dimensional stability after the hot pressing step, a three-dimensional measuring device was used to measure the size of the product manufactured using the foamed sheet and the size of the product manufactured by using the single-sided foamed sheet by the existing method. As shown in Figures 4 and 5, the measured results show that the rate of dimensional change is less than 0.03%, which is the target value for dimensional stability. This means that dimensional problems during processing using the foamed sheet do not affect the manufacture of the product.
當進行藉由將FPCBs貼附至發泡板之兩面上來製造FPCBs之方法時，製造過程中會添加各種化學品。確認是否該發泡板之黏著劑會溶解於所使用的化學品中且被所使用的化學品滲透。如果該黏著劑被溶解且被滲透，則不可能進行因該黏著劑之黏著力降低而造成該發泡板與FCCL分離的程序，且可能產生因液體之滲透所造成之FCCL之污染。然而，本發明之發泡板不會產生因化學品(如蝕刻劑液體等等)之滲透所造成的品質問題。並且，自表6可確認藉由將FPCBs貼附至該發泡板之兩面上之單面FPCBs之方法在生產力上所達之提昇效果。When a method of manufacturing FPCBs by attaching FPCBs to both sides of a foamed sheet is performed, various chemicals are added during the manufacturing process. It is confirmed whether the adhesive of the foam board dissolves in the chemicals used and is infiltrated by the chemicals used. If the adhesive is dissolved and permeated, it is impossible to carry out a procedure for separating the foamed sheet from the FCCL due to a decrease in the adhesive force of the adhesive, and contamination of the FCCL due to penetration of the liquid may occur. However, the foamed sheet of the present invention does not cause quality problems caused by penetration of chemicals such as etchant liquids and the like. Moreover, from Table 6, the improvement in productivity by the method of attaching FPCBs to the single-sided FPCBs on both sides of the foamed sheet can be confirmed.
如上所述，依照本發明可提供一種使用一發泡板製造FPCB之方法，該發泡板在熱壓程序期間在高溫高壓的條件下還維持黏著力、具有抗化學性而於蝕刻程序期間不會被蝕刻劑液體滲透、並且藉由高溫加熱可與被黏著體分離。As described above, according to the present invention, there can be provided a method of manufacturing an FPCB using a foamed sheet which maintains adhesion and chemical resistance under high temperature and high pressure during a hot pressing process without during the etching process. It will be infiltrated by the etchant liquid and can be separated from the adherend by heating at a high temperature.
再者，於本發明中，相較於傳統製造單面FPCB之方法，由於利用一雙面發泡板，因此可在單一製程中生產兩個單面FPCB並且因而增進FPCB製造方法的生產力。Furthermore, in the present invention, two single-sided FPCBs can be produced in a single process and thus the productivity of the FPCB manufacturing method can be improved by using a double-sided foamed board as compared with the conventional method of manufacturing a single-sided FPCB.
1‧‧‧基板1‧‧‧Substrate
2‧‧‧表面處理層2‧‧‧Surface treatment layer
2’‧‧‧表面處理層2'‧‧‧Surface treatment layer
3‧‧‧利用相互反應性共聚物之混合物的發泡板3‧‧‧Foam board using a mixture of mutually reactive copolymers
3’‧‧‧利用相互反應性共聚物之混合物的發泡板3'‧‧‧Foam board using a mixture of mutually reactive copolymers
4‧‧‧離型膜4‧‧‧ release film
4’‧‧‧離型膜4'‧‧‧ release film
第1圖係一剖面圖，說明本發明之單面發泡板；第2圖係一剖面圖，說明本發明之雙面發泡板第3圖係一圖表，顯示本發明所用之熱壓之加工條件；第4圖係一圖表，顯示在使用本發明之發泡板加工時尺寸改變之速率；以及第5圖係一圖表，顯示在使用傳統單面發泡板加工時尺寸改變之速率。1 is a cross-sectional view showing a single-sided foamed sheet of the present invention; and FIG. 2 is a cross-sectional view showing a third embodiment of the double-sided foamed sheet of the present invention, showing a hot press used in the present invention. Processing conditions; Fig. 4 is a graph showing the rate of dimensional change when processing using the foamed sheet of the present invention; and Fig. 5 is a graph showing the rate of dimensional change when processed using a conventional single-sided foamed sheet.
1‧‧‧基板1‧‧‧Substrate
2‧‧‧表面處理層2‧‧‧Surface treatment layer
3‧‧‧利用相互反應性共聚物之混合物的發泡板3‧‧‧Foam board using a mixture of mutually reactive copolymers
4‧‧‧離型膜(releasing film)4‧‧‧releasing film
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|---|---|---|---|---|
| KR101055495B1 (en) * | 2009-04-14 | 2011-08-08 | 삼성전기주식회사 | Carrier member for substrate manufacturing and substrate manufacturing method using same |
| KR101122146B1 (en) * | 2009-11-25 | 2012-03-16 | 엘지이노텍 주식회사 | Half Buried PCB, Multi-Layer PCB and Fabricating Method of the same |
| JP2011149009A (en) * | 2009-12-25 | 2011-08-04 | Nitto Denko Corp | Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet |
| US8961678B2 (en) * | 2012-12-20 | 2015-02-24 | Rohm And Haas Electronic Materials Llc | Organic solderability preservative and method |
| CN104646861A (en) * | 2013-11-25 | 2015-05-27 | 刘现梅 | Soldering flux containing thiadiazole derivative |
| CN111993731B (en) * | 2019-05-27 | 2023-11-14 | 宁波长阳科技股份有限公司 | Foaming release film and preparation method thereof |
| CN115260877A (en) * | 2022-08-02 | 2022-11-01 | 广东希贵光固化材料有限公司 | UV temporary protective coating for heating film fading and application thereof |
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| US20040241417A1 (en) * | 2003-05-30 | 2004-12-02 | Fischer Patrick J. | Thermally conducting foam interface materials |
| TW200712607A (en) * | 2005-09-14 | 2007-04-01 | Ind Tech Res Inst | Flexible pixel array substrate and method of fabricating the same |
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| JPS60109294A (en) * | 1983-11-18 | 1985-06-14 | ソニー株式会社 | Method of producing flexible circuit board |
| JPH0768499B2 (en) * | 1988-12-02 | 1995-07-26 | 株式会社日本触媒 | Aqueous dispersion type pressure sensitive adhesive composition |
| JPH0768501B2 (en) * | 1988-12-08 | 1995-07-26 | 株式会社日本触媒 | Contact adhesive composition for composites |
| JP3085108B2 (en) * | 1993-11-16 | 2000-09-04 | 住友化学工業株式会社 | Aqueous emulsion composition for flame-retardant foam sheet |
| KR100407502B1 (en) * | 2001-09-13 | 2003-11-28 | (주)해은켐텍 | Heat-exfoliation type foam sheet comprising emulsion type adhesive |
| JP4115711B2 (en) * | 2002-02-14 | 2008-07-09 | 日東電工株式会社 | Adhesive sheet for fixing flexible printed wiring board and method for mounting electronic component on flexible printed wiring board |
| KR100514611B1 (en) * | 2002-06-24 | 2005-09-13 | 삼신써키트 주식회사 | Manufacturing method of double access typed flexible printed circuit board |
| KR20020060659A (en) * | 2002-06-24 | 2002-07-18 | 민병성 | Manufacturing method of single side typed flexible printed circuit board |
| KR20020060657A (en) * | 2002-06-24 | 2002-07-18 | 민병성 | Manufacturing method of thin film flexible printed circuit board |
| JP4475934B2 (en) * | 2003-12-17 | 2010-06-09 | 日本カーバイド工業株式会社 | Aqueous pressure-sensitive adhesive composition and method for producing pressure-sensitive adhesive sheet using the same |
| JP2005200505A (en) * | 2004-01-14 | 2005-07-28 | Nitto Denko Corp | Heat-releasable adhesive sheet and method for processing adherend |
| JP4906035B2 (en) * | 2005-05-19 | 2012-03-28 | 日本カーバイド工業株式会社 | Aqueous pressure-sensitive adhesive composition and method for producing pressure-sensitive adhesive sheet using the same |
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2007
- 2007-06-25 KR KR20070062512A patent/KR100945039B1/en active IP Right Grant
-
2008
- 2008-06-25 CN CN2008800095358A patent/CN101682994B/en not_active Expired - Fee Related
- 2008-06-25 JP JP2010500847A patent/JP5021806B2/en not_active Expired - Fee Related
- 2008-06-25 WO PCT/KR2008/003622 patent/WO2009002083A2/en active Application Filing
- 2008-06-25 TW TW97123764A patent/TWI406608B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040241417A1 (en) * | 2003-05-30 | 2004-12-02 | Fischer Patrick J. | Thermally conducting foam interface materials |
| TW200712607A (en) * | 2005-09-14 | 2007-04-01 | Ind Tech Res Inst | Flexible pixel array substrate and method of fabricating the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010522442A (en) | 2010-07-01 |
| WO2009002083A3 (en) | 2009-02-26 |
| WO2009002083A2 (en) | 2008-12-31 |
| CN101682994A (en) | 2010-03-24 |
| TW200922407A (en) | 2009-05-16 |
| KR100945039B1 (en) | 2010-03-05 |
| CN101682994B (en) | 2011-06-15 |
| KR20080113709A (en) | 2008-12-31 |
| JP5021806B2 (en) | 2012-09-12 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |