TWI402171B - Pressing device and pressing method thereof - Google Patents
Pressing device and pressing method thereof Download PDFInfo
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- TWI402171B TWI402171B TW99138817A TW99138817A TWI402171B TW I402171 B TWI402171 B TW I402171B TW 99138817 A TW99138817 A TW 99138817A TW 99138817 A TW99138817 A TW 99138817A TW I402171 B TWI402171 B TW I402171B
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Description
本發明是有關於一種壓合裝置，特別是指一種用以將預壓薄膜壓合在基材上的壓合裝置及其壓合方法。The present invention relates to a press-fit apparatus, and more particularly to a press-fit apparatus for pressing a pre-compressed film onto a substrate and a method of pressing the same.
目前半導體的微影製程中，將光阻依覆在晶圓上的方式大致可分為濕式與乾式兩種，濕式是將液態光阻以旋塗法塗佈在晶圓上，再以烘烤方式將液態光阻烘乾。乾式是將乾膜光阻(Dry film resist)製成光阻帶，並經由壓合機將乾膜光阻貼附在晶圓上，例如台灣專利第502310公告號(申請案號為090130837)專利案所揭露的乾膜光阻之壓合裝置。At present, in the lithography process of semiconductor, the way of blocking the photoresist on the wafer can be roughly divided into wet type and dry type. In the wet type, the liquid photoresist is coated on the wafer by spin coating, and then The baking method is to dry the liquid photoresist. The dry type is a dry film resist made of a photoresist strip, and the dry film resist is attached to the wafer via a press machine, for example, the patent of Taiwan Patent No. 502310 (Application No. 090130837) The dry film photoresist press device disclosed in the case.
由於晶圓表面上會設有複數個高低不同的晶粒或圖案(pattern)，使得晶圓表面是呈現凹凸不平的狀態，因此，如何構思出一種能將乾膜光阻壓合並填覆在晶圓之表面的壓合裝置設計，遂成為本發明要進一步改進的主題。Since there are a plurality of different grains or patterns on the surface of the wafer, the surface of the wafer is in a state of unevenness. Therefore, how to conceive a dry film by photo-resisting and filling the crystal The design of the press device on the surface of the circle is the subject of further improvement of the present invention.
本發明之主要目的，在於提供一種用以將預壓薄膜壓合在基材上並能將預壓薄膜填覆於基材之表面的壓合裝置。SUMMARY OF THE INVENTION A primary object of the present invention is to provide a press-fit apparatus for pressing a pre-compressed film onto a substrate and filling the surface of the substrate with a pre-compressed film.
本發明之另一目的，在於提供一種壓合方法，能將預壓薄膜填覆於基材之表面。Another object of the present invention is to provide a method of pressing a pre-compressed film to the surface of a substrate.
本發明的目的及解決先前技術問題是採用以下技術手段來實現的，依據本發明所揭露的壓合裝置，適於將一預壓薄膜壓合於一基材表面，壓合裝置包含一承載座及一壓合盤。The object of the present invention and the prior art are solved by the following technical means. The pressing device disclosed in the present invention is suitable for pressing a pre-pressed film onto a surface of a substrate, and the pressing device comprises a bearing seat. And a pressure plate.
承載座包括一供基材放置的固定座體，及一設置於固定座體內的頂推件，頂推件可在一凸伸出固定座體以承載基材的承載位置，及一使基材貼覆於固定座體的收合位置之間往復運動；壓合盤包含一設置於底端的彈性壓膜，及一可對彈性壓膜吸氣或吹氣的第一氣體流道，壓合盤可在一間隔位於承載座上方的初始位置，及一壓合於承載座且彈性壓膜壓迫預壓薄膜使其貼覆於基材表面的壓合位置之間往復運動。The carrier includes a fixing base for the substrate, and a pushing member disposed in the fixing body. The pushing member can extend the fixing body to carry the bearing position of the substrate, and the substrate is Reciprocatingly moving between the folding positions of the fixed seat; the pressing plate comprises an elastic pressing film disposed at the bottom end, and a first gas flow path for inhaling or blowing the elastic pressing film, the pressing plate The device can be reciprocated between an initial position above the carrier at a spacing and a press-fit position that is pressed against the carrier and the elastic film presses the pre-compressed film to adhere to the surface of the substrate.
本發明的目的及解決先前技術問題還可以採用以下技術手段進一步實現。The object of the present invention and solving the prior art problems can be further achieved by the following technical means.
固定座體包含一頂面，及一形成於頂面的第二氣體流道，所述第二氣體流道可對基材吸氣。The fixed seat body includes a top surface and a second gas flow path formed on the top surface, and the second gas flow path can inhale the substrate.
固定座體還包含一形成於頂面的第三氣體流道，當壓合盤在壓合位置時，第三氣體流道可對壓合盤與承載座之間所形成的一腔室吸氣。The fixing base further comprises a third gas flow passage formed on the top surface. When the pressing disc is in the pressing position, the third gas flow passage can inhale a chamber formed between the pressing disc and the bearing seat. .
固定座體還包含一用以供頂推件安裝的安裝槽，安裝槽的一開口形成於頂面。頂推件包含一可吸附基材的吸氣孔。The fixing base further comprises a mounting groove for mounting the pushing member, and an opening of the mounting groove is formed on the top surface. The pushing member includes a suction hole that can adsorb the substrate.
固定座體還包含一可對基材加熱的下加熱元件，下加熱元件包括一用以產生熱源的加熱部、一設置於加熱部頂端並可與基材接觸的導熱部，及一設置於加熱部底端的隔熱部。The fixing base further comprises a lower heating element capable of heating the substrate, the lower heating element comprises a heating part for generating a heat source, a heat conducting part disposed at the top end of the heating part and contacting the substrate, and a heating part The thermal insulation at the bottom of the section.
壓合盤還包含一可對彈性壓膜加熱的上加熱元件，上加熱元件包括一用以產生熱源的加熱部、一設置於加熱部底端與彈性壓膜之間的導熱部，及一設置於加熱部頂端的隔熱部。The pressure plate further comprises an upper heating element capable of heating the elastic pressing film, wherein the upper heating element comprises a heating portion for generating a heat source, a heat conducting portion disposed between the bottom end of the heating portion and the elastic pressing film, and a setting The heat insulating portion at the top end of the heating portion.
彈性壓膜為矽膠或橡膠材質。The elastic film is made of silicone or rubber.
依據本發明所揭露的壓合方法，適於將一預壓薄膜壓合於一基材表面，該方法包含下述步驟：The pressing method according to the present invention is suitable for pressing a pre-pressed film onto a surface of a substrate, the method comprising the steps of:
(A)透過一承載座承載基材；(A) carrying a substrate through a carrier;
(B)壓合一壓合盤於該承載座上，對該壓合盤的一彈性壓膜朝下吹氣，該彈性壓膜壓迫該預壓薄膜使其貼覆於該基材表面；(B) pressing a pressing plate on the carrier, blowing an elastic pressing film of the pressing plate downward, the elastic pressing film pressing the pre-pressing film to adhere to the surface of the substrate;
(C)對該彈性壓膜朝上吸氣，使該彈性壓膜與該預壓薄膜分離；及(C) inhaling the elastic pressing film upward to separate the elastic pressing film from the pre-compressed film;
(D)移離該壓合盤使其與該承載座分離。(D) moving away from the pressure plate to separate it from the carrier.
藉由上述技術手段，本發明壓合裝置的優點及功效在於，藉由彈性壓膜設計，當壓合盤在壓合位置時，第一氣體流道會對彈性壓膜朝下吹氣，彈性壓膜會向下壓迫並擠壓預壓薄膜，使得預壓薄膜的光阻層能填覆基材的表面，藉此，能減少光阻層與基材之表面間的空隙，以提昇壓合的良率。According to the above technical means, the advantages and effects of the pressing device of the present invention are that, by the elastic lamination design, when the pressing disc is in the pressing position, the first gas flow path blows the elastic laminating film downward, and the elasticity The film presses down and compresses the pre-pressed film, so that the photoresist layer of the pre-pressed film can fill the surface of the substrate, thereby reducing the gap between the photoresist layer and the surface of the substrate to enhance the pressing. Yield.
有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之一個較佳實施例的詳細說明中，將可清楚的呈現。透過具體實施方式的說明，當可對本發明為達成預定目的所採取的技術手段及功效得以更加深入且具體的了解，然而所附圖式只是提供參考與說明之用，並非用來對本發明加以限制。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The technical means and functions of the present invention for achieving the intended purpose can be more deeply and specifically understood by the description of the specific embodiments. However, the drawings are only for the purpose of reference and description, and are not intended to limit the invention. .
在本發明被詳細描述之前，要注意的是，在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.
如圖1及圖2所示，是本發明壓合裝置的一較佳實施例，該壓合裝置300主要是用以將一預壓薄膜1壓合在一基材2上，在本實施例中，預壓薄膜1是以一光阻帶為例作說明，而基材2是以一晶圓為例作說明，當然，預壓薄膜1也可為保護膜或其他形式的薄膜。As shown in FIG. 1 and FIG. 2, it is a preferred embodiment of the pressing device of the present invention. The pressing device 300 is mainly used for pressing a pre-pressed film 1 onto a substrate 2, in this embodiment. The pre-pressed film 1 is exemplified by a photoresist strip, and the substrate 2 is exemplified by a wafer. Of course, the pre-pressed film 1 can also be a protective film or other forms of film.
預壓薄膜1包括一光阻層11，及一貼覆於光阻層11頂面的保護層12，保護層12的材質可為聚對苯二甲酸乙二酯(PET)，能對光阻層11提供保護的作用。由於基材2上設置有複數個高低不同的凸部21，前述凸部21可為晶粒或者是圖案(pattern)，使得基材2的一表面22是呈現凹凸不平的狀態，而預壓薄膜1是以其光阻層11預先貼合在基材2的表面22上，在本實施例中，預壓薄膜1是呈圓形且面積略大於基材2的面積，使得預壓薄膜1能完全蓋覆在基材2的表面22上。當然，預壓薄膜1面積可視實際需求設計得比基材2面積大或是等於基材2面積，並不以本實施例所揭露的為限。The pre-pressed film 1 comprises a photoresist layer 11 and a protective layer 12 attached to the top surface of the photoresist layer 11. The protective layer 12 is made of polyethylene terephthalate (PET) and can be used for photoresist. Layer 11 provides protection. Since the substrate 2 is provided with a plurality of convex portions 21 having different heights, the convex portion 21 may be a crystal grain or a pattern, so that a surface 22 of the substrate 2 is in a state of unevenness, and the pre-pressed film 1 is preliminarily bonded to the surface 22 of the substrate 2 by the photoresist layer 11. In the present embodiment, the pre-pressed film 1 is circular and has an area slightly larger than the area of the substrate 2, so that the pre-pressed film 1 can It is completely covered on the surface 22 of the substrate 2. Of course, the area of the pre-pressed film 1 can be designed to be larger than the area of the substrate 2 or equal to the area of the substrate 2, which is not limited by the embodiment.
如圖2及圖3所示，壓合裝置300包含一承載座3，及一間隔設置於承載座3上方的壓合盤4。承載座3包括一固定座體31，及一設置於固定座體31內的頂推件32，固定座體31包含一座本體310，及一設置於座本體310內用以對基材2(如圖1)加熱的下加熱元件316，下加熱元件316包括一用以產生熱源的加熱部317、一設置於加熱部317頂端並可與基材2接觸的導熱部318，及一設置於加熱部317底端的隔熱部319，固定座體31之導熱部318的一頂面311可供基材2放置，導熱部318可將加熱部317所產生的熱源傳導至基材2，藉此，可對基材2均勻地加熱。另外，隔熱部319則用以阻隔加熱部317所產生的熱源向下發散，使得加熱部317的熱源大部份都能有效地透過導熱部318的傳導而對基材2加熱，藉此，能避免熱源的損失。As shown in FIG. 2 and FIG. 3 , the pressing device 300 includes a carrier 3 and a pressing plate 4 spaced above the carrier 3 . The carrier 3 includes a fixing body 31 and a pushing member 32 disposed in the fixing body 31. The fixing body 31 includes a body 310, and is disposed in the housing body 310 for the substrate 2 (eg 1) a heated lower heating element 316 comprising a heating portion 317 for generating a heat source, a heat conducting portion 318 disposed at the top end of the heating portion 317 and in contact with the substrate 2, and a heat conducting portion 318 disposed at the heating portion A heat insulating portion 319 at the bottom end of the 317, a top surface 311 of the heat conducting portion 318 of the fixing base 31 is disposed for the substrate 2, and the heat conducting portion 318 can conduct the heat source generated by the heating portion 317 to the substrate 2, thereby The substrate 2 is uniformly heated. In addition, the heat insulating portion 319 is configured to block the heat source generated by the heating portion 317 from being diverged downward, so that most of the heat source of the heating portion 317 can effectively heat the substrate 2 through the conduction of the heat conducting portion 318, thereby Can avoid the loss of heat source.
固定座體31的座本體310以及下加熱元件316共同形成一用以供頂推件32安裝的安裝槽312，安裝槽312的一開口313形成於頂面311並可供頂推件32穿出。頂推件32底端與一驅動機構(圖未示)相連接，頂推件32可受驅動機構帶動而在一凸伸出固定座體31的頂面311以承載基材2的承載位置(如圖6所示)，及一使基材2貼覆於頂面311的收合位置(如圖7所示)之間往復運動。當移載機構(圖未示)將基材2平移至間隔承載座3上方一段距離時，頂推件32能上移至承載位置以承載基材2，藉此，可縮短頂推件32與基材2之間的距離，以避免移載機構在放置基材2於承載座3之頂面311的過程中因為落摔而造成基材2受損的情形產生。The seat body 310 of the fixed base 31 and the lower heating element 316 together form a mounting groove 312 for mounting the pushing member 32. An opening 313 of the mounting groove 312 is formed on the top surface 311 and is permeable to the pushing member 32. . The bottom end of the pushing member 32 is connected to a driving mechanism (not shown), and the pushing member 32 can be driven by the driving mechanism to protrude from the top surface 311 of the fixing base 31 to carry the bearing position of the substrate 2 ( As shown in FIG. 6, and a reciprocating motion between the substrate 2 and the folded position of the top surface 311 (shown in FIG. 7). When the transfer mechanism (not shown) translates the substrate 2 to a distance above the spacer carrier 3, the pushing member 32 can be moved up to the carrying position to carry the substrate 2, whereby the pushing member 32 can be shortened The distance between the substrates 2 is to prevent the transfer mechanism from being damaged by the falling of the substrate 2 during the placement of the substrate 2 on the top surface 311 of the carrier 3.
較佳地，頂推件32包含一吸氣孔321，吸氣孔321包括一呈縱向延伸的孔部322，及複數個形成於頂端並與孔部322相連通的溝槽部323，各溝槽部323呈圓環形並可吸附基材2，藉此，當頂推件32帶動基材2在承載位置與收合位置之間移動的過程中，能避免基材2產生晃動的情形。Preferably, the pushing member 32 includes a suction hole 321 including a longitudinally extending hole portion 322 and a plurality of groove portions 323 formed at the top end and communicating with the hole portion 322. The groove portion 323 is annular and can adsorb the substrate 2, whereby the substrate 2 can be prevented from being shaken during the movement of the substrate 2 between the carrying position and the folding position.
如圖2及圖4所示，壓合盤4包含一座體41、一彈性壓膜42及一壓環43，彈性壓膜42為矽膠或橡膠材質所製成，彈性壓膜42外周緣是透過壓環43的壓合而固定在座體41底面，使得彈性壓膜42能接合在座體41與壓環43之間。壓合盤4還包含一設置於座體41內的上加熱元件44，上加熱元件44包括一用以產生熱源的加熱部441、一設置於加熱部441底端與彈性壓膜42之間的導熱部442，及一設置於加熱部441頂端的隔熱部443，導熱部442與彈性壓膜42內表面接觸並可將加熱部441所產生的熱源傳導至彈性壓膜42，藉此，可對彈性壓膜42均勻地加熱。另外，隔熱部443則用以阻隔加熱部441所產生的熱源向上發散，使得加熱部441的熱源大部份都能有效地透過導熱部442的傳導而對彈性壓膜42加熱，藉此，能避免熱源的損失。As shown in FIG. 2 and FIG. 4, the press-fit disc 4 includes a body 41, an elastic pressing film 42 and a pressing ring 43. The elastic pressing film 42 is made of silicone rubber or rubber material, and the outer peripheral edge of the elastic pressing film 42 is transparent. The pressing ring 43 is pressed and fixed to the bottom surface of the seat body 41 so that the elastic pressing film 42 can be engaged between the seat body 41 and the pressure ring 43. The pressing plate 4 further includes an upper heating element 44 disposed in the base 41. The upper heating element 44 includes a heating portion 441 for generating a heat source, and a heating portion 441 disposed between the bottom end of the heating portion 441 and the elastic pressing film 42. The heat transfer portion 442 and a heat insulating portion 443 provided at the top end of the heating portion 441, the heat transfer portion 442 is in contact with the inner surface of the elastic pressure film 42 and can conduct the heat source generated by the heating portion 441 to the elastic pressure film 42. The elastic pressure film 42 is uniformly heated. In addition, the heat insulating portion 443 is configured to block the heat source generated by the heating portion 441 from being diverged upward, so that most of the heat source of the heating portion 441 can effectively pass through the conduction of the heat conducting portion 442 to heat the elastic pressing film 42. Can avoid the loss of heat source.
壓合盤4還包含一形成於座體41與加熱元件44之間的第一氣體流道45，第一氣體流道45的一端是與氣體供應裝置(圖未示)相連接，而另一端則被彈性壓膜42所封閉，透過氣體供應裝置的控制使得第一氣體流道45可對彈性壓膜42吸氣或吹氣，藉此，使得彈性壓膜42能貼覆於加熱元件44的導熱部442上，或者是與導熱部442分離而凸伸出壓環43底面。另外，壓合盤4可透過驅動機構的帶動在一間隔位於承載座3上方的初始位置(如圖2所示)，及一壓合於承載座3的壓合位置(如圖8所示)之間往復運動，當壓合盤4在壓合位置時，透過第一氣體流道45對彈性壓膜42吹氣使得彈性壓膜42能壓迫預壓薄膜1使其貼覆在基材2的表面22。The pressure plate 4 further includes a first gas flow path 45 formed between the seat body 41 and the heating element 44. One end of the first gas flow path 45 is connected to a gas supply device (not shown), and the other end is connected. Then, it is closed by the elastic pressing film 42 and controlled by the gas supply device so that the first gas flow path 45 can inhale or blow the elastic pressing film 42 , whereby the elastic pressing film 42 can be attached to the heating element 44. The heat transfer portion 442 is separated from the heat transfer portion 442 and protrudes from the bottom surface of the pressure ring 43. In addition, the pressing plate 4 can be driven by the driving mechanism at an initial position above the bearing frame 3 (as shown in FIG. 2), and a pressing position pressed against the carrier 3 (as shown in FIG. 8). During the reciprocating motion, when the press-fit disc 4 is in the pressing position, the elastic pressing film 42 is blown through the first gas flow path 45 so that the elastic pressing film 42 can press the pre-pressing film 1 to be attached to the substrate 2. Surface 22.
以下將針對壓合裝置300的壓合方法進行詳細說明：The pressing method of the pressing device 300 will be described in detail below:
如圖1、圖5及圖6所示，圖5為預壓薄膜1的壓合方法流程圖，圖5的主要流程為：As shown in FIG. 1, FIG. 5 and FIG. 6, FIG. 5 is a flow chart of a method for pressing the pre-pressed film 1, and the main flow of FIG. 5 is as follows:
如步驟51，透過承載座3承載基材2。In step 51, the substrate 2 is carried through the carrier 3.
在使用壓合裝置300時，壓合盤4是在一間隔位於承載座3上方的初始位置(如圖6所示)，使得壓合盤4與承載座3的固定座體31之間具有空間可供頂推件32活動，並且可供移載機構伸入以進行基材2的置放動作。另外，透過第一氣體流道45向上吸氣並抽真空，使得彈性壓膜42能保持在貼覆於加熱元件44的導熱部442上的位置，藉此，以便於導熱部442能將加熱部441產生的熱源傳遞至彈性壓膜42，以對彈性壓膜42進行加熱。When the press-fit device 300 is used, the press-fit disc 4 is in an initial position (shown in FIG. 6) spaced above the carrier 3 such that there is space between the press-fit disc 4 and the fixed seat 31 of the carrier 3. The pusher 32 is movable and the transfer mechanism can be extended to perform the placement of the substrate 2. In addition, the first gas flow path 45 is sucked up and evacuated, so that the elastic pressure film 42 can be held at a position on the heat transfer portion 442 of the heating element 44, thereby allowing the heat transfer portion 442 to heat the portion The heat source generated by 441 is transmitted to the elastic pressing film 42 to heat the elastic pressing film 42.
藉由驅動機構帶動頂推件32由圖2所示的收合位置沿箭頭I方向向上移動至承載位置後，移載機構能伸入壓合盤4與固定座體31之間，以將基材2及預貼在基材2的表面22上的預壓薄膜1移載至頂推件32上供頂推件32承載。透過頂推件32的吸氣孔321朝下吸氣，使得基材2能被溝槽部323吸附在頂推件32的頂面。接著，如圖7所示，驅動機構會帶動頂推件32由承載位置沿箭頭II方向向下移動，由於基材2被吸氣孔321的溝槽部323所吸附，因此在下移過程中，能避免基材2產生晃動的情形。當頂推件32向下移動到收合位置時，基材2會貼覆在固定座體31之下加熱元件316的頂面311。固定座體31還包含一形成於座本體310與下加熱元件316上的第二氣體流道315，第二氣體流道315包括一與氣體供應裝置相連接的孔部320，及複數個形成於頂面311並與孔部320相連通的溝槽部324，各溝槽部324呈圓環形用以對基材2吸氣，使得基材2能平整地貼覆在固定座體31的頂面311。After the driving mechanism drives the pushing member 32 to move upward from the folding position shown in FIG. 2 in the direction of the arrow I to the carrying position, the transfer mechanism can extend between the pressing plate 4 and the fixing base 31 to The material 2 and the pre-compressed film 1 pre-applied to the surface 22 of the substrate 2 are transferred to the pushing member 32 for carrying by the pushing member 32. The air is sucked downward through the air suction hole 321 of the pushing member 32, so that the base material 2 can be attracted to the top surface of the pushing member 32 by the groove portion 323. Next, as shown in FIG. 7, the driving mechanism drives the pushing member 32 to move downward from the carrying position in the direction of the arrow II. Since the substrate 2 is adsorbed by the groove portion 323 of the air suction hole 321, the lowering process is performed. It is possible to avoid the situation in which the substrate 2 is shaken. When the pusher 32 is moved down to the collapsed position, the substrate 2 will be applied to the top surface 311 of the heating element 316 below the fixed seat body 31. The fixing base 31 further includes a second gas flow path 315 formed on the seat body 310 and the lower heating element 316. The second gas flow path 315 includes a hole portion 320 connected to the gas supply device, and a plurality of holes are formed in the hole The top surface 311 and the groove portion 324 communicating with the hole portion 320, each groove portion 324 is annularly shaped to inhale the substrate 2, so that the substrate 2 can be flatly attached to the top of the fixing base 31 Face 311.
如圖5及圖8所示，如步驟52，壓合壓合盤4於承載座3上，對壓合盤4的彈性壓膜42朝下吹氣，彈性壓膜42壓迫預壓薄膜1使其貼覆於基材2的表面22(如圖1)。As shown in FIG. 5 and FIG. 8, in step 52, the pressure-bonding disc 4 is pressed onto the carrier 3, and the elastic pressing film 42 of the pressing disc 4 is blown downward, and the elastic pressing film 42 presses the pre-pressing film 1 so that It is applied to the surface 22 of the substrate 2 (Fig. 1).
藉由驅動機構帶動壓合盤4沿箭頭II方向下移，當壓合盤4的壓環43抵壓於承載座3的一設置於頂面311的氣密環314時，壓合座4與承載座3之間所形成的一腔室5呈一氣密狀態，其中，氣密環314是由橡膠或矽膠等彈性材質所製成。在氣密狀態下，上加熱元件44的加熱部441會產生熱源，使得導熱部442能對彈性壓膜42進行加熱，而下加熱元件316的加熱部317也會產生熱源，使得導熱部318能對基材2進行加熱。When the pressing mechanism 4 is moved downward in the direction of the arrow II by the driving mechanism, when the pressing ring 43 of the pressing plate 4 is pressed against the airtight ring 314 of the bearing seat 3 disposed on the top surface 311, the pressing seat 4 is A chamber 5 formed between the carriers 3 is in an airtight state, wherein the airtight ring 314 is made of an elastic material such as rubber or silicone. In the airtight state, the heating portion 441 of the upper heating element 44 generates a heat source, so that the heat conducting portion 442 can heat the elastic pressing film 42, and the heating portion 317 of the lower heating element 316 also generates a heat source, so that the heat conducting portion 318 can The substrate 2 is heated.
接著，如圖9及圖10所示，固定座體31還包含一形成於座本體310上的第三氣體流道325，第三氣體流道325包括一與氣體供應裝置相連接的孔部326，及一形成於下加熱元件316外周圍與座本體310之間的溝槽部327，各溝槽部327呈圓環形用以對腔室5向下吸氣，同時，壓合座4的第一氣體流道45會對彈性壓膜42朝下吹氣而解除真空狀態，藉此，彈性壓膜42會向下壓迫並擠壓預壓薄膜1，使預壓薄膜1貼覆在基材2的表面22上。由於彈性壓膜42具有彈性並且能塑性變形，因此，彈性壓膜42受第一氣體流道45的氣體下壓以及第三氣體流道325的溝槽部327吸附時，彈性壓膜42能將預壓薄膜1的光阻層11擠壓入基材2之表面22的凹部221內，使得光阻層11能填覆基材2之凹凸不平的表面22，藉此，能減少光阻層11與基材2之表面22間的空隙。Next, as shown in FIG. 9 and FIG. 10, the fixing base 31 further includes a third gas flow path 325 formed on the seat body 310. The third gas flow path 325 includes a hole portion 326 connected to the gas supply device. And a groove portion 327 formed between the outer periphery of the lower heating element 316 and the seat body 310. Each groove portion 327 is annularly shaped to inhale the chamber 5 downwardly, and at the same time, press the seat 4 The first gas flow path 45 blows the elastic pressure film 42 downward to release the vacuum state, whereby the elastic pressure film 42 presses down and presses the pre-pressure film 1 to cause the pre-pressure film 1 to be attached to the substrate. 2 on the surface 22. Since the elastic pressing film 42 is elastic and plastically deformable, when the elastic pressing film 42 is adsorbed by the gas of the first gas flow path 45 and the groove portion 327 of the third gas flow path 325, the elastic pressing film 42 can The photoresist layer 11 of the pre-pressed film 1 is extruded into the concave portion 221 of the surface 22 of the substrate 2, so that the photoresist layer 11 can fill the uneven surface 22 of the substrate 2, whereby the photoresist layer 11 can be reduced. A gap with the surface 22 of the substrate 2.
如圖5、圖11及圖12所示，如步驟53，對彈性壓膜42朝上吸氣，使彈性壓膜42與預壓薄膜1分離。As shown in FIGS. 5, 11, and 12, in step 53, the elastic pressing film 42 is sucked upward, and the elastic pressing film 42 is separated from the pre-compressed film 1.
透過第三氣體流道325的溝槽部327停止吸氣，以及第一氣體流道45向上吸氣，使得彈性壓膜42能被向上吸附而與預壓薄膜1的保護層12分離，藉此，使彈性壓膜42能回復到貼覆於上加熱元件44的導熱部442上的位置。The suction is stopped through the groove portion 327 of the third gas flow path 325, and the first gas flow path 45 is sucked upward, so that the elastic pressure film 42 can be adsorbed upward to be separated from the protective layer 12 of the pre-compression film 1, whereby The elastic pressing film 42 can be returned to a position attached to the heat transfer portion 442 of the upper heating element 44.
如圖5及圖13所示，如步驟54，移離壓合盤4使其與承載座3分離。As shown in FIGS. 5 and 13, as in step 54, the pressure plate 4 is removed from the carrier 3 .
藉由驅動機構帶動壓合盤4沿箭頭I方向上移，使壓合盤4回復到間隔位於承載座3上方的初始位置。By driving the pressing plate 4 up in the direction of the arrow I by the driving mechanism, the pressing plate 4 is returned to the initial position where the spacing is above the carrier 3.
如圖5及圖14所示，如步驟55，將基材2及貼覆於基材2的表面22的預壓薄膜1頂離承載座3。As shown in FIGS. 5 and 14, in step 55, the substrate 2 and the pre-compressed film 1 attached to the surface 22 of the substrate 2 are lifted off the carrier 3.
藉由第二氣體流道315的溝槽部324停止吸氣，使得基材2不會被吸附在頂面311，藉此，當驅動機構帶動頂推件32沿箭頭I方向向上移動時，預壓薄膜1及基材2能輕易地被頂推件32往上頂。當頂推件32上移至承載位置後，移載機構即可伸入壓合盤4與固定座體31之間將基材2移離頂推件32，此時，即完成預壓薄膜1的壓合作業。之後，重覆步驟51~55即可進行下一個預壓薄膜1與基材2的壓合作業。The suction is stopped by the groove portion 324 of the second gas flow path 315, so that the substrate 2 is not adsorbed on the top surface 311, whereby when the driving mechanism drives the pushing member 32 to move upward in the direction of the arrow I, The pressed film 1 and the substrate 2 can be easily topped up by the pushing member 32. When the pushing member 32 is moved up to the carrying position, the transfer mechanism can extend between the pressing plate 4 and the fixing base 31 to move the substrate 2 away from the pushing member 32. At this time, the pre-pressing film 1 is completed. The pressure of cooperation. Thereafter, the pressing of the next pre-compressed film 1 and the substrate 2 can be carried out by repeating steps 51 to 55.
歸納上述，本實施例的壓合裝置300，藉由壓合盤4之彈性壓膜42設計，當壓合盤4在壓合位置時，第一氣體流道45會對彈性壓膜42朝下吹氣，彈性壓膜42會向下壓迫並擠壓預壓薄膜1，使預壓薄膜1的光阻層11被擠壓入基材2之表面22的凹部221內，使得光阻層11能填覆基材2之表面22，藉此，能減少光阻層11與基材2之表面22間的空隙，以提昇壓合的良率，故確實能達成本發明所訴求之目的。In summary, the pressing device 300 of the present embodiment is designed by the elastic pressing film 42 of the pressing plate 4, and when the pressing plate 4 is in the pressing position, the first gas flow path 45 faces the elastic pressing film 42 downward. By blowing, the elastic pressing film 42 presses down and presses the pre-pressed film 1 so that the photoresist layer 11 of the pre-pressed film 1 is pressed into the concave portion 221 of the surface 22 of the substrate 2, so that the photoresist layer 11 can The surface 22 of the substrate 2 is filled, whereby the gap between the photoresist layer 11 and the surface 22 of the substrate 2 can be reduced to improve the yield of the press, so that the object of the present invention can be achieved.
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
1‧‧‧預壓薄膜1‧‧‧Pre-pressed film
11‧‧‧光阻層11‧‧‧Photoresist layer
12‧‧‧保護層12‧‧‧Protective layer
2‧‧‧基材2‧‧‧Substrate
21‧‧‧凸部21‧‧‧ convex
22‧‧‧表面22‧‧‧ Surface
221‧‧‧凹部221‧‧‧ recess
300‧‧‧壓合裝置300‧‧‧ Pressing device
3‧‧‧承載座3‧‧‧ bearing seat
31‧‧‧固定座體31‧‧‧ fixed seat
310‧‧‧座本體310‧‧‧
311‧‧‧頂面311‧‧‧ top surface
312‧‧‧安裝槽312‧‧‧Installation slot
313‧‧‧開口313‧‧‧ openings
314‧‧‧氣密環314‧‧‧ airtight ring
315‧‧‧第二氣體流道315‧‧‧Second gas flow path
316‧‧‧下加熱元件316‧‧‧ Lower heating element
317‧‧‧加熱部317‧‧‧ heating department
318‧‧‧導熱部318‧‧‧Transfer Department
319‧‧‧隔熱部319‧‧‧Insulation Department
320‧‧‧孔部320‧‧‧ hole department
32‧‧‧頂推件32‧‧‧Pushing pieces
321‧‧‧吸氣孔321‧‧‧ suction holes
322‧‧‧孔部322‧‧‧ Hole Department
323‧‧‧溝槽部323‧‧‧ Groove Department
324‧‧‧溝槽部324‧‧‧ Groove Department
325‧‧‧第三氣體流道325‧‧‧ third gas flow path
326‧‧‧孔部326‧‧‧ Hole Department
327‧‧‧溝槽部327‧‧‧ Groove
4‧‧‧壓合盤4‧‧‧Compression plate
41‧‧‧座體41‧‧‧ body
42‧‧‧彈性壓膜42‧‧‧Elastic film
43‧‧‧壓環43‧‧‧ Pressure ring
44‧‧‧上加熱元件44‧‧‧Upper heating element
441‧‧‧加熱部441‧‧‧ heating department
442‧‧‧導熱部442‧‧‧Transfer Department
443‧‧‧隔熱部443‧‧‧Insulation Department
45‧‧‧第一氣體流道45‧‧‧First gas flow path
5‧‧‧腔室5‧‧‧ chamber
51~55‧‧‧步驟51~55‧‧‧Steps
I、II‧‧‧箭頭I, II‧‧‧ arrows
圖1是本發明壓合裝置的一較佳實施例的局部放大圖，說明預壓薄膜貼覆於基材上；Figure 1 is a partial enlarged view of a preferred embodiment of the press-fit apparatus of the present invention, illustrating that the pre-pressed film is attached to the substrate;
圖2是本發明壓合裝置的一較佳實施例的剖視示意圖，說明頂推件位在收合位置，壓合盤位在初始位置；2 is a cross-sectional view showing a preferred embodiment of the pressing device of the present invention, illustrating that the pushing member is in the folded position, and the pressing plate is in the initial position;
圖3是本發明壓合裝置的一較佳實施例的承載座的俯視圖；Figure 3 is a plan view of a carrier of a preferred embodiment of the press-fit apparatus of the present invention;
圖4是本發明壓合裝置的一較佳實施例的壓合盤的仰視圖；Figure 4 is a bottom plan view of a compression plate of a preferred embodiment of the press-fit device of the present invention;
圖5是本發明壓合裝置的一較佳實施例的壓合方法流程圖；Figure 5 is a flow chart of a pressing method of a preferred embodiment of the pressing device of the present invention;
圖6是本發明壓合裝置的一較佳實施例的剖視示意圖，說明頂推件位在承載位置；Figure 6 is a cross-sectional view showing a preferred embodiment of the pressing device of the present invention, illustrating the pushing member in the carrying position;
圖7是本發明壓合裝置的一較佳實施例的剖視示意圖，說明頂推件下移到收合位置；Figure 7 is a cross-sectional view showing a preferred embodiment of the press-fit apparatus of the present invention, illustrating that the push-up member is moved down to the collapsed position;
圖8是本發明壓合裝置的一較佳實施例的剖視示意圖，說明壓合盤下移到壓合位置；Figure 8 is a cross-sectional view showing a preferred embodiment of the press-fit apparatus of the present invention, illustrating the lowering of the press-fit disc to the press-fit position;
圖9是本發明壓合裝置的一較佳實施例的剖視示意圖，說明第一氣體流道對彈性壓膜朝下吹氣，彈性壓膜會向下壓迫預壓薄膜使其貼覆在基材的表面；Figure 9 is a cross-sectional view showing a preferred embodiment of the press-fit apparatus of the present invention, illustrating that the first gas flow path blows the elastic film downward, and the elastic film presses the pre-press film downward to adhere it to the base. Surface of the material;
圖10是本發明壓合裝置的一較佳實施例的局部放大圖，說明彈性壓膜將預壓薄膜的光阻層擠壓入基材表面的凹部內；Figure 10 is a partial enlarged view of a preferred embodiment of the pressing device of the present invention, illustrating that the elastic pressing film presses the photoresist layer of the pre-pressed film into the concave portion of the surface of the substrate;
圖11是本發明壓合裝置的一較佳實施例的剖視示意圖，說明第一氣體流道對彈性壓膜朝上吸氣；Figure 11 is a cross-sectional view showing a preferred embodiment of the press-fit apparatus of the present invention, illustrating that the first gas flow path inhales the elastic film upward;
圖12是本發明壓合裝置的一較佳實施例的局部放大圖，說明預壓薄膜的光阻層填覆於基材表面的凹部內；Figure 12 is a partial enlarged view of a preferred embodiment of the press-fit apparatus of the present invention, illustrating that the photoresist layer of the pre-pressed film is filled in the recess of the surface of the substrate;
圖13是本發明壓合裝置的一較佳實施例的剖視示意圖，說明壓合盤復位到初始位置；及Figure 13 is a cross-sectional view showing a preferred embodiment of the press-fit apparatus of the present invention, illustrating the reduction of the pressure plate to the initial position;
圖14是本發明壓合裝置的一較佳實施例的剖視示意圖，說明頂推件將基材及預壓薄膜頂推到承載位置。Figure 14 is a cross-sectional view showing a preferred embodiment of the press-fit apparatus of the present invention, illustrating the pusher pushing the substrate and the pre-compressed film to the carrying position.
300．．．壓合裝置300. . . Pressing device
3．．．承載座3. . . Carrier
31．．．固定座體31. . . Fixed seat
310．．．座本體310. . . Seat body
311．．．頂面311. . . Top surface
312．．．安裝槽312. . . Mounting slot
313．．．開口313. . . Opening
314．．．氣密環314. . . Airtight ring
315．．．第二氣體流道315. . . Second gas flow path
316．．．下加熱元件316. . . Lower heating element
317．．．加熱部317. . . Heating department
318．．．導熱部318. . . Heat transfer department
319．．．隔熱部319. . . Thermal insulation
320．．．孔部320. . . Hole
32．．．頂推件32. . . Pusher
321．．．吸氣孔321. . . Suction hole
322．．．孔部322. . . Hole
323．．．溝槽部323. . . Groove
324．．．溝槽部324. . . Groove
325．．．第三氣體流道325. . . Third gas flow path
326．．．孔部326. . . Hole
327．．．溝槽部327. . . Groove
4．．．壓合盤4. . . Press plate
41．．．座體41. . . Seat
42．．．彈性壓膜42. . . Elastic film
43．．．壓環43. . . Pressure ring
44．．．上加熱元件44. . . Upper heating element
441．．．加熱部441. . . Heating department
442．．．導熱部442. . . Heat transfer department
443．．．隔熱部443. . . Thermal insulation
45．．．第一氣體流道45. . . First gas flow path
Claims (6)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99138817A TWI402171B (en) | 2010-11-11 | 2010-11-11 | Pressing device and pressing method thereof |
| CN201110196868XA CN102468140A (en) | 2010-11-11 | 2011-07-14 | pressing device and pressing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99138817A TWI402171B (en) | 2010-11-11 | 2010-11-11 | Pressing device and pressing method thereof |
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| TW201219218A TW201219218A (en) | 2012-05-16 |
| TWI402171B true TWI402171B (en) | 2013-07-21 |
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| US11312123B2 (en) | 2020-05-26 | 2022-04-26 | Eleadtk Co., Ltd. | Vacuum lamination system and vacuum lamination method |
| TWI823702B (en) * | 2022-12-05 | 2023-11-21 | 斯託克精密科技股份有限公司 | Device configured to push electronic substrate |
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| CN103755161B (en) | 2013-12-31 | 2016-03-30 | 深圳市华星光电技术有限公司 | The rigging machine mounting structure of sheet material mounting block and top board, rigging machine |
| TWI755165B (en) * | 2020-07-24 | 2022-02-11 | 盟立自動化股份有限公司 | Attaching device and curved-surface attaching intermediary |
| TWI755166B (en) * | 2020-07-24 | 2022-02-11 | 盟立自動化股份有限公司 | Attaching apparatus with internal recycle mechanism |
| TWI755167B (en) * | 2020-07-24 | 2022-02-11 | 盟立自動化股份有限公司 | Attaching device and complex curved-surface attaching intermediary |
| CN112373791B (en) * | 2020-11-10 | 2022-05-20 | 业成科技（成都）有限公司 | Film sticking device and jig thereof |
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| JPH1148408A (en) * | 1997-08-05 | 1999-02-23 | Mitsuboshi Belting Ltd | Real-wood decorative panel and its manufacture |
| JP2001225195A (en) * | 2000-02-17 | 2001-08-21 | Hitachi Electronics Eng Co Ltd | Press-fitting device for substrate |
| TW200938371A (en) * | 2007-11-07 | 2009-09-16 | Advanced Display Proc Eng Co | Substrate bonding apparatus |
| JP2009286028A (en) * | 2008-05-30 | 2009-12-10 | Takahiro Ohashi | Hot embossing device and hot embossing method with diaphragm serving as push mechanism |
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| US11312123B2 (en) | 2020-05-26 | 2022-04-26 | Eleadtk Co., Ltd. | Vacuum lamination system and vacuum lamination method |
| TWI823702B (en) * | 2022-12-05 | 2023-11-21 | 斯託克精密科技股份有限公司 | Device configured to push electronic substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102468140A (en) | 2012-05-23 |
| TW201219218A (en) | 2012-05-16 |
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