TWI397368B - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
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- TWI397368B TWI397368B TW96151212A TW96151212A TWI397368B TW I397368 B TWI397368 B TW I397368B TW 96151212 A TW96151212 A TW 96151212A TW 96151212 A TW96151212 A TW 96151212A TW I397368 B TWI397368 B TW I397368B
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Description
本發明涉及一種散熱裝置，特別涉及一種用於為電子元件進行散熱之散熱裝置。 The present invention relates to a heat sink, and more particularly to a heat sink for dissipating heat from an electronic component.
諸如電腦中央處理器、北橋晶片、顯卡等高功率電子元件在運行時會產生大量之熱量，這些熱量如果不能被有效地散去，將直接導致溫度急劇上升，而嚴重影響到電子元件之正常運行。為此，需要散熱裝置來對這些電子元件進行散熱，傳統之散熱裝置通常包括散熱器以及置於散熱器一側之風扇，該風扇提供強制氣流用以增強散熱效果。 High-power electronic components such as computer central processing units, north bridge chips, and graphics cards generate a large amount of heat during operation. If this heat cannot be effectively dissipated, it will directly cause a sharp rise in temperature, which will seriously affect the normal operation of electronic components. . To this end, heat sinks are needed to dissipate these electronic components. Conventional heat sinks typically include a heat sink and a fan placed on one side of the heat sink that provides a forced air flow to enhance heat dissipation.
目前風扇固定於散熱器上之方法一般採用一固定於散熱器上之風扇固定件，藉由風扇與風扇固定件鎖合從而將風扇固定於散熱器上。然而習知技術中之風扇固定件往往採取彈性卡扣方式與散熱器結合，要麼結合不牢，影響風扇之穩定性；要麼結合過牢，造成將固定件從散熱器上拆卸困難。 Currently, the method of fixing the fan to the heat sink generally adopts a fan fixing member fixed on the heat sink, and the fan is fixed to the heat sink by fixing the fan to the heat sink. However, the fan fixing member in the prior art is often combined with the heat sink by an elastic snapping method, or the combination is not strong, which affects the stability of the fan; or the bonding is too strong, which makes it difficult to remove the fixing member from the heat sink.
有鑒於此，有必要提供一風扇固定件與散熱器之間結合牢緊、且拆卸方便之散熱裝置。 In view of the above, it is necessary to provide a heat dissipating device that is tightly coupled between the fan fixing member and the heat sink and is easy to disassemble.
一種散熱裝置，用於對一電子元件散熱，包括一與該電子元件貼設之導熱板、與導熱板連接之複數散熱鰭片、一固定架及一固定在固定架上之風扇，該散熱鰭片相對兩端設有開槽，該固定架包括一頂板及二連接頂板之擋 板，該等散熱鰭片設有通孔，該頂部上對應散熱鰭片之通孔設有固定孔，擋板側邊延伸有卡扣部，該卡扣部沿開槽延伸方向滑動並伸入散熱鰭片之開槽以與散熱鰭片卡合，該散熱裝置還包括一螺釘，該螺釘穿過頂板之固定孔與散熱鰭片之通孔並將該頂板固定在散熱鰭片頂部。 A heat dissipating device for dissipating heat to an electronic component, comprising: a heat conducting plate attached to the electronic component, a plurality of heat radiating fins connected to the heat conducting board, a fixing frame, and a fan fixed on the fixing frame, the heat sink fin The opposite ends of the piece are provided with a slot, and the fixing frame comprises a top plate and two connecting top plates a heat dissipation fin is provided with a through hole, and a through hole corresponding to the heat dissipation fin is disposed on the top portion, and a fastening portion is formed on a side of the baffle, and the buckle portion slides along the extending direction of the slot and extends into the slot The heat sink fin is slotted to engage with the heat sink fin. The heat sink further includes a screw that passes through the through hole of the top plate and the heat sink fin and fixes the top plate on the top of the heat sink fin.
上述散熱裝置中，藉由散熱鰭片設有開槽以供固定架之卡扣部滑入，再將頂板固定在散熱鰭片上，安裝簡捷方便。 In the above heat dissipating device, the heat dissipating fin is provided with a slot for sliding the buckle portion of the fixing frame, and then the top plate is fixed on the heat dissipating fin, and the installation is simple and convenient.
請同時參照圖1和圖2，為本發明較佳實施例之散熱裝置，該散熱裝置安裝於一電路板(圖未示)上用以散發電路板上之電子元件(圖未示)產生之熱量。該散熱裝置包括一散熱器組合10、組裝於該散熱器組合10上之固定架20、及安裝於該固定架20之一風扇30。 Referring to FIG. 1 and FIG. 2, a heat dissipating device is mounted on a circuit board (not shown) for dissipating electronic components (not shown) on the circuit board. Heat. The heat sink includes a heat sink assembly 10, a mounting bracket 20 assembled to the heat sink assembly 10, and a fan 30 mounted to the mounting bracket 20.
請一併參閱圖3，該散熱器組合10包括一導熱板12、二散熱鰭片組14、及用以將導熱板12、散熱鰭片組14連接在一起之並行排列之三熱管16，其中：導熱板12大致呈矩形板狀體，其底部設有三平行相隔之凹槽124。二安裝架13藉由螺釘133固定於導熱板12之底部之相對兩端，每一安裝架13相對兩端凸伸有凸耳132。導熱板12藉由穿過凸耳132之四緊固件(圖未示)與電路板連接，並與電子元件保持緊密接觸。 As shown in FIG. 3 , the heat sink assembly 10 includes a heat conducting board 12 , two heat dissipating fin sets 14 , and three heat pipes 16 arranged in parallel to connect the heat conducting board 12 and the heat dissipating fin set 14 . The heat conducting plate 12 has a substantially rectangular plate-like body, and the bottom portion thereof is provided with three parallel spaced grooves 124. The two mounting brackets 13 are fixed to opposite ends of the bottom of the heat conducting plate 12 by screws 133. The mounting brackets 13 have protrusions 132 protruding from opposite ends. The heat conducting plate 12 is connected to the circuit board by four fasteners (not shown) passing through the lugs 132 and is kept in close contact with the electronic components.
每一熱管16呈U形設置包括一水準之吸熱部160及從吸熱 部160兩端豎直向上延伸之二平行放熱部162。該吸熱部160收容於導熱板12之凹槽124內，其底面與導熱板12之底面共面，以與導熱板12之底部形成平整之底面以貼設於電子元件頂面上，吸收來自電子元件之熱量。這些熱管16之同一側並排之三放熱部162貫穿其中一散熱鰭片組14，另一側三並排之三放熱部162貫穿另一散熱鰭片組14，使散熱鰭片組14置於熱管16之放熱部162上。 Each heat pipe 16 has a U-shaped arrangement including a level of heat absorbing portion 160 and heat absorption from Two parallel heat radiating portions 162 extending vertically upward from both ends of the portion 160. The heat absorbing portion 160 is received in the recess 124 of the heat conducting plate 12, and the bottom surface thereof is coplanar with the bottom surface of the heat conducting plate 12 to form a flat bottom surface with the bottom of the heat conducting plate 12 to be attached to the top surface of the electronic component to absorb the electrons. The heat of the component. The three heat radiating portions 162 of the same side of the heat pipe 16 are inserted through one of the heat radiating fin groups 14 , and the three heat radiating portions 162 of the other side are inserted through the other heat radiating fin group 14 to place the heat radiating fin group 14 on the heat pipe 16 . On the heat release portion 162.
每一散熱鰭片組14由複數相互平行之散熱鰭片140自上而下堆疊排列而成，每一散熱鰭片140與導熱板12平行。每一散熱鰭片140呈縱長翼狀，其兩側邊緣由不同之圓弧連接而成。每一散熱鰭片140上均勻設置有三並排之貫穿孔142，這些貫穿孔142用以收容熱管16之放熱部162。每一散熱鰭片140自這些貫穿孔142邊緣延伸設有環壁146以增大散熱鰭片140與放熱部162接觸表面積，並且使相鄰之散熱鰭片140間隔一定之距離以形成沿前後方向延伸之通風道(圖未標)。每一散熱鰭片140沿其縱向方向兩端各設有一通孔148，一開槽149連通該通孔148至散熱鰭片140靠近該通孔148之兩端外側邊緣。 Each of the heat dissipation fins 14 is formed by stacking a plurality of mutually parallel heat dissipation fins 140 from top to bottom, and each of the heat dissipation fins 140 is parallel to the heat conduction plate 12. Each of the heat dissipation fins 140 has a longitudinally long wing shape, and both side edges are connected by different arcs. Each of the heat dissipation fins 140 is uniformly provided with three parallel through holes 142 for receiving the heat radiation portion 162 of the heat pipe 16 . Each of the heat dissipation fins 140 extends from the edge of the through hole 142 to form a ring wall 146 to increase the surface area of the heat dissipation fin 140 and the heat radiation portion 162, and to position the adjacent heat dissipation fins 140 at a certain distance to form a front and rear direction. Extended air duct (not shown). Each of the heat dissipation fins 140 is provided with a through hole 148 at each end of the heat dissipation fin 140. A slot 149 communicates with the through hole 148 to the outer edge of the heat dissipation fin 140 adjacent to the through hole 148.
請參閱圖4，固定架20包括一頂板22及自該頂板22兩端垂直向下延伸之二擋板28。頂板22包括相對之二固定部24及連接二固定部24兩端之連接部26。每一固定部24之形狀與每一散熱鰭片14之形狀相同，其設有三貫穿孔242以對應散熱鰭片14之貫穿孔142。每一固定部24之兩端部設有二固定孔248以對應散熱鰭片14之通孔148。固定部24及連接部26圍設有一開口(圖未標)，一呈拱橋形之操 作部29連接二連接部26並置於該開口上方。擋板28自頂板22之連接部26向下垂直延伸，每一擋板28上設有彎月狀之穿孔280，當扇葉上裝有LED燈時以起透光作用。每一擋板28兩側邊中部延伸有彎折之卡扣部21，每一卡扣部21伸入至各散熱鰭片140之開槽149中。其中二擋板28之同一側之側邊上下兩端形成一用於安裝風扇30之安裝部212，每一安裝部212設有一對用於固定風扇30之安裝孔2120。 Referring to FIG. 4, the mounting bracket 20 includes a top plate 22 and two baffles 28 extending vertically downward from opposite ends of the top plate 22. The top plate 22 includes two opposite fixing portions 24 and a connecting portion 26 connecting the two ends of the two fixing portions 24. Each fixing portion 24 has the same shape as each of the heat dissipation fins 14 and is provided with three through holes 242 to correspond to the through holes 142 of the heat dissipation fins 14 . Two fixing holes 248 are defined at two ends of each fixing portion 24 to correspond to the through holes 148 of the heat dissipation fins 14 . The fixing portion 24 and the connecting portion 26 are surrounded by an opening (not shown), and an arch bridge is used. The working portion 29 connects the two connecting portions 26 and is placed above the opening. The baffle 28 extends vertically downward from the connecting portion 26 of the top plate 22. Each baffle 28 is provided with a meniscus-shaped perforation 280 for transmitting light when the LED lamp is mounted on the fan blade. A bent portion 21 is formed in a middle portion of each of the two sides of each of the baffles 28, and each of the latching portions 21 extends into the slot 149 of each of the fins 140. A mounting portion 212 for mounting the fan 30 is formed on the upper and lower ends of the side of the same side of the two baffles 28, and each mounting portion 212 is provided with a pair of mounting holes 2120 for fixing the fan 30.
風扇30之外形大致呈方形設置，其包括帶有開口之前後二平板32、34。風扇30收容於固定架20之頂板22及擋板28圍成之空間內，且平板32安裝貼緊於固定架20之四安裝部212上，藉由螺釘60鎖固。 The fan 30 is generally rectangular in shape and includes a rear plate 32, 34 with an opening. The fan 30 is received in the space enclosed by the top plate 22 and the baffle plate 28 of the mounting frame 20, and the flat plate 32 is mounted and attached to the four mounting portions 212 of the mounting frame 20, and is locked by screws 60.
散熱裝置組裝時，首先散熱鰭片組14穿設焊接在熱管16之放熱部162上，相鄰散熱鰭片140形成通風道，導熱板12與熱管16之吸熱部160焊接使得熱管16之吸熱部160收容於導熱板12之凹槽124內；導熱板12底部兩端固定該安裝架13，散熱鰭片組14頂部安裝固定板18。然後散熱器組合10藉由該緊固件固定在電路板上與電子元件緊密接觸。接著將固定架20、已經安裝於固定架20內之風扇30一併自上而下安裝在散熱器組合10上，其中固定架20之四卡扣部21分別沿著各散熱鰭片140之開槽149及通孔148形成之通道自上而下滑入，使得卡扣部21伸入至散熱鰭片140之開槽149中與散熱鰭片組14扣合。最後用螺釘40穿過固定架20之頂板22之固定孔248與散熱鰭片140之通孔148螺合，因而風扇30固定於二散熱鰭片組140之間 ，整個散熱裝置安裝完成。 When the heat dissipating device is assembled, the heat dissipating fin group 14 is firstly welded to the heat radiating portion 162 of the heat pipe 16, the adjacent heat dissipating fins 140 form a ventilation passage, and the heat conducting plate 12 and the heat absorbing portion 160 of the heat pipe 16 are welded to the heat absorbing portion of the heat pipe 16. The heat receiving plate 12 is received in the recess 124 of the heat conducting plate 12; the mounting bracket 13 is fixed at both ends of the heat conducting plate 12, and the fixing plate 18 is mounted on the top of the heat radiating fin group 14. The heat sink assembly 10 is then secured to the circuit board by the fasteners in close contact with the electronic components. Then, the fixing frame 20 and the fan 30 that has been installed in the fixing frame 20 are mounted on the heat sink assembly 10 from top to bottom. The four fastening portions 21 of the fixing frame 20 are respectively opened along the heat dissipation fins 140. The channel formed by the slot 149 and the through hole 148 slides in from the top, so that the latching portion 21 protrudes into the slot 149 of the heat dissipation fin 140 and engages with the heat dissipation fin group 14. Finally, the fixing hole 248 of the top plate 22 of the fixing frame 20 is screwed into the through hole 148 of the heat dissipation fin 140 by the screw 40, so that the fan 30 is fixed between the two heat dissipation fin groups 140. The entire heat sink is installed.
電子元件工作時，其產生之熱量藉由導熱板12、熱管16傳遞至散熱鰭片組14上，再藉由散熱鰭片組14將部分熱量散發至通風道之空氣中。藉由散熱鰭片140設有通孔148及連通通孔148之開槽149以供固定架20滑入，再藉由螺釘40直接螺合在通孔148中，安裝簡捷方便。並且固定架20之卡扣部21同時與二散熱鰭片組14結合，使整個散熱裝置之結構更加穩固。另外，固定架20頂部之操作部29呈拱橋形設置，使得安裝後整個散熱裝置攜帶方便。 When the electronic component is in operation, the heat generated by the heat-dissipating plate 12 and the heat pipe 16 is transmitted to the heat-dissipating fin group 14, and a part of the heat is radiated to the air of the air passage by the heat-dissipating fin group 14. The heat dissipation fins 140 are provided with through holes 148 and slots 149 for communicating the through holes 148 for the mounting bracket 20 to slide in, and then screwed directly into the through holes 148 by the screws 40, which is simple and convenient to install. Moreover, the latching portion 21 of the fixing frame 20 is simultaneously combined with the two heat dissipating fin sets 14, so that the structure of the entire heat dissipating device is more stable. In addition, the operation portion 29 at the top of the fixing frame 20 is disposed in an arch shape, so that the entire heat dissipation device is conveniently carried after installation.
綜上所述，本發明符合發明專利之要件，爰依法提出專利申請。惟以上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
10‧‧‧散熱器組合 10‧‧‧ radiator combination
12‧‧‧導熱板 12‧‧‧heat conducting plate
124‧‧‧凹槽 124‧‧‧ Groove
13‧‧‧安裝架 13‧‧‧ Mounting frame
132‧‧‧凸耳 132‧‧‧ lugs
133、40、60‧‧‧螺釘 133, 40, 60‧‧‧ screws
14‧‧‧散熱鰭片組 14‧‧‧Solid fin group
140‧‧‧散熱鰭片 140‧‧‧Heat fins
142‧‧‧貫穿孔 142‧‧‧through holes
146‧‧‧環壁 146‧‧‧Circle
148‧‧‧通孔 148‧‧‧through hole
149‧‧‧開槽 149‧‧‧ slotting
16‧‧‧熱管 16‧‧‧heat pipe
160‧‧‧吸熱部 160‧‧‧heat absorption department
162‧‧‧放熱部 162‧‧‧heating department
20‧‧‧固定架 20‧‧‧ fixed frame
21‧‧‧卡扣部 21‧‧‧Snap Department
212‧‧‧安裝部 212‧‧‧Installation Department
2120‧‧‧安裝孔 2120‧‧‧ mounting holes
22‧‧‧頂板 22‧‧‧ top board
24‧‧‧固定部 24‧‧‧Fixed Department
26‧‧‧連接部 26‧‧‧Connecting Department
242‧‧‧貫穿孔 242‧‧‧through holes
248‧‧‧固定孔 248‧‧‧Fixed holes
28‧‧‧擋板 28‧‧ ‧Baffle
280‧‧‧穿孔 280‧‧‧Perforation
29‧‧‧操作部 29‧‧‧Operation Department
30‧‧‧風扇 30‧‧‧Fan
32、34‧‧‧平板 32, 34‧‧‧ tablet
圖1係本發明散熱裝置之組合圖。 1 is a combination diagram of a heat sink of the present invention.
圖2係圖1之部分組合圖。 Figure 2 is a partial combination diagram of Figure 1.
圖3係圖2中散熱裝置之散熱器組合之分解圖。 3 is an exploded view of the heat sink assembly of the heat sink of FIG. 2.
圖4係圖2中散熱裝置之固定架及風扇之分解圖。 4 is an exploded view of the fixing frame and the fan of the heat dissipating device of FIG. 2.
10‧‧‧散熱器組合 10‧‧‧ radiator combination
12‧‧‧導熱板 12‧‧‧heat conducting plate
14‧‧‧散熱鰭片組 14‧‧‧Solid fin group
16‧‧‧熱管 16‧‧‧heat pipe
20‧‧‧固定架 20‧‧‧ fixed frame
30‧‧‧風扇 30‧‧‧Fan
40‧‧‧螺釘 40‧‧‧ screws
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96151212A TWI397368B (en) | 2007-12-31 | 2007-12-31 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96151212A TWI397368B (en) | 2007-12-31 | 2007-12-31 | Heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200930274A TW200930274A (en) | 2009-07-01 |
| TWI397368B true TWI397368B (en) | 2013-05-21 |
Family
ID=44864889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96151212A TWI397368B (en) | 2007-12-31 | 2007-12-31 | Heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI397368B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM261973U (en) * | 2004-02-17 | 2005-04-11 | Hon Hai Prec Ind Co Ltd | Heat pipe assembly |
| TWM264827U (en) * | 2004-09-03 | 2005-05-11 | Hon Hai Prec Ind Co Ltd | Securing device for fan |
-
2007
- 2007-12-31 TW TW96151212A patent/TWI397368B/en not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM261973U (en) * | 2004-02-17 | 2005-04-11 | Hon Hai Prec Ind Co Ltd | Heat pipe assembly |
| TWM264827U (en) * | 2004-09-03 | 2005-05-11 | Hon Hai Prec Ind Co Ltd | Securing device for fan |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200930274A (en) | 2009-07-01 |
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