WO2020000189A1 - Heat dissipating assembly, and circuit board assembly and unmanned aerial vehicle having the heat dissipating assembly - Google Patents

Heat dissipating assembly, and circuit board assembly and unmanned aerial vehicle having the heat dissipating assembly Download PDF

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Publication number
WO2020000189A1
WO2020000189A1 PCT/CN2018/092894 CN2018092894W WO2020000189A1 WO 2020000189 A1 WO2020000189 A1 WO 2020000189A1 CN 2018092894 W CN2018092894 W CN 2018092894W WO 2020000189 A1 WO2020000189 A1 WO 2020000189A1
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WO
WIPO (PCT)
Prior art keywords
air outlet
region
area
circuit board
sub
Prior art date
Application number
PCT/CN2018/092894
Other languages
French (fr)
Chinese (zh)
Inventor
熊荣明
唐尹
王登
熊贤武
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN202110145895.8A priority Critical patent/CN112996348A/en
Priority to CN201880012031.5A priority patent/CN110313225B/en
Priority to PCT/CN2018/092894 priority patent/WO2020000189A1/en
Publication of WO2020000189A1 publication Critical patent/WO2020000189A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64U—UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR
    • B64U20/00—Constructional aspects of UAVs
    • B64U20/90—Cooling
    • B64U20/94—Cooling of rotors or rotor motors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D33/00—Arrangements in aircraft of power plant parts or auxiliaries not otherwise provided for
    • B64D33/08—Arrangements in aircraft of power plant parts or auxiliaries not otherwise provided for of power plant cooling systems
    • B64D33/10—Radiator arrangement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • the invention relates to the field of heat dissipation, in particular to a heat dissipation component, a circuit board component having the same, and an unmanned aerial vehicle.
  • a large number of heating elements are set in the electronic equipment, and the heat emitted by the heating elements needs to be timely discharged to ensure the normal operation of the electronic equipment.
  • a fan is installed in an electronic device or a heat-conducting member is provided in the electronic device.
  • the heat accumulated in the electronic device is exported to the outside through the fan or the heat-conducting member, but the heat conduction efficiency of the separate fan or the heat-conducting member cannot meet the demand.
  • the invention provides a heat dissipation component, a circuit board component having the same, and an unmanned aerial vehicle.
  • the present invention is implemented by the following technical solutions:
  • a heat dissipation assembly includes a fan and a heat dissipation member connected to the fan.
  • the heat dissipation member includes a main body portion and a fin region provided on the main body portion.
  • An air outlet area provided on the main body portion, wherein the main body portion is connected to the fan; the fin area is provided near the air outlet of the fan, and cooperates with the air outlet of the fan, so The air outlet area is in communication with the fin area, and the airflow flowing out of the air outlet of the fan flows into the air outlet area through the fin area, and is then derived from the air outlet area.
  • a circuit board assembly includes a circuit board and a heat dissipation component connected to the circuit board, wherein the heat dissipation component includes a fan and a heat sink connected to the fan.
  • the heat sink includes a main body portion, a fin region provided on the main body portion, and an air outlet region provided on the main body portion, wherein the main body portion is connected to the fan; the fins
  • the area is arranged close to the air outlet of the fan, and cooperates with the air outlet of the fan.
  • the air outlet area is in communication with the fin area, and the airflow flowing from the air outlet of the fan flows into the air outlet through the fin area.
  • the air-out area is derived from the air-out area.
  • an unmanned aerial vehicle includes a fuselage having a storage space, a circuit board stored in the storage space, and a heat dissipation component stored in the storage space.
  • the heat dissipating component includes a fan and a heat dissipating member connected to the fan.
  • the heat dissipating member includes a main body portion, a fin region provided on the main body portion, and an air outlet region provided on the main body portion, wherein
  • the main body portion is connected with the fan; the fin region is provided near the fan outlet of the fan and cooperates with the fan outlet; the air outlet region is in communication with the fin region; The airflow flowing out of the fan's air outlet flows into the air outlet area through the fin area, and is then led out from the air outlet area.
  • the present invention cooperates with a fan, a fin area, and an air outlet area.
  • the airflow from the fan outlet can dissipate the heat absorbed by the fin area.
  • the fin area has the function of guiding the airflow.
  • the airflow from the fan is introduced into the airflow area, so that the airflow is led out from the airflow area.
  • the airflow from the airflow area can directly dissipate the heat-generating components or directly outside the electronic equipment to dissipate heat. The efficiency is high, and the structure of the heat dissipation component of the present invention is simple.
  • FIG. 1 is a perspective view of a heat dissipation component according to an embodiment of the present invention
  • FIG. 2 is a schematic structural exploded view of a heat dissipation component according to an embodiment of the present invention
  • FIG. 3 is a schematic structural exploded view of a circuit board assembly according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural exploded view of a part of a circuit board assembly according to an embodiment of the present invention.
  • FIG. 5 is a perspective view of a circuit board assembly according to an embodiment of the present invention.
  • FIG. 6 is a partially enlarged view of FIG. 5;
  • FIG. 7 is a perspective view of part of the structure of an unmanned aerial vehicle in an embodiment of the present invention.
  • FIG. 8 is a schematic exploded view of the structure of FIG. 7.
  • 100 fuselage; 110: containment space; 120: air outlet; 121: first air outlet; 122: second air outlet; 123: third air outlet; 130: first side wall; 140: first Two side walls; 150: the third side wall;
  • 200 circuit board; 210: first area; 220: second area; 230: third area; 240: functional element; 250: positioning section;
  • 300 heat dissipation component; 1: fan; 11: housing; 111: fixed part; 12: fan blades; 2: heat sink; 21: main body part; 211: first mounting part; 22: fin area; 23: air outlet Area; 231: first sub-area; 232: second sub-area; 233: third sub-area; 24: cover body; 241: second mounting portion; 3: damping element; 4: fastener.
  • the heat dissipation assembly 300 may include a fan 1 and a heat sink 2, wherein the fan 1 is connected to the heat sink 2.
  • the heat sink 2 includes a main body portion 21, a fin area 22, and an air outlet area 23.
  • the fin area 22 and the air outlet area 23 are both disposed on the main body portion 21.
  • the main body portion 21 is connected to the fan 1
  • the fin region 22 is disposed near the air outlet of the fan 1, and cooperates with the air outlet of the fan 1, the air outlet
  • the region 23 is in communication with the fin region 22.
  • the airflow flowing from the air outlet of the fan 1 in this embodiment flows into the air outlet area 23 through the fin area 22, and is then led out from the air outlet area 23.
  • the airflow from the air outlet of the fan 1 can dissipate the heat absorbed by the fin region 22, and on the other hand, the fin region 22 has The function of guiding the airflow, the airflow from the fan 1 is introduced into the air outlet area 23, so that the airflow is led out from the air outlet area 23, and the airflow derived from the air outlet area 23 can directly dissipate each heating element or directly lead to the outside of the electronic device for heat dissipation
  • the efficiency is high, and the structure of the heat dissipation assembly 300 of the present invention is simple.
  • the fin region 22 of this embodiment includes a plurality of fins, the plurality of fins are spaced apart, and the heat dissipation surfaces of the plurality of fins are parallel to each other, and the heat dissipation of each fin is The surface extends away from the air outlet of the fan 1.
  • Two adjacent fins form an airflow guiding area, and guide the airflow flowing out of the air outlet of the fan 1 to the air outlet area 23.
  • Each fin can absorb the heat accumulated in the electronic device.
  • each fin absorbs heat on a heating element located below it through heat conduction.
  • the airflow from the fan 1 air outlet can quickly dissipate the fins. .
  • the ends of the plurality of fins are close to the air outlet of the fan 1, so as to accelerate the heat dissipation speed of the fins.
  • the air outlet area 23 includes a plurality of sub-areas, and ends of the plurality of sub-areas communicate with the fin area 22.
  • the airflow from the fan 1 is introduced into multiple sub-regions through the fin region 22, so that the airflow is respectively derived from the multiple sub-regions.
  • Part of the airflow derived from the multiple sub-regions can be directly led to the outside of the electronic device, and the other part Can directly dissipate heat from each heating element.
  • the air outlet area 23 includes a first sub-area 231, a second sub-area 232, and a third sub-area 233, and the second sub-area 232 and the third sub-area 233 are respectively disposed on the first Both sides of the sub-region 231.
  • the airflow derived from the first sub-region 231 can directly dissipate the heating element.
  • an end of the first sub-region 231 away from the fin region 22 is directly aligned with the heating element.
  • the air flow from the second sub-region 232 and the third sub-region 233 can be directly exported to the outside of the electronic device.
  • the air outlet area 23 may also include a plurality of fins, and the fins are consistent with the direction of the partition that divides the air outlet area 23 into multiple sub-areas.
  • a plurality of fins in the air outlet area 23 may be connected to the fins in the fin area 22.
  • the wind directions of the first sub-region 231, the second sub-region 232, and the third sub-region 233 are different, so that the fin region 22 flows out.
  • the airflow is directed in different directions to meet different needs.
  • the air outlet of the first sub-region 231 gradually increases in a direction away from the fin region 22, so that the airflow flowing out of the first sub-region 231 can be from multiple directions. Outflow, so as to dissipate heating elements in different directions.
  • the fan 1 includes a casing 11 and a fan blade 12 provided on the casing 11, and the casing 11 is connected to the main body portion 21.
  • the air outlet of the fan 1 is provided on the casing 11.
  • the casing 11 is a thermally conductive member, that is, the casing 11 is made of a thermally conductive material (such as a thermally conductive metal).
  • the fan 1 not only functions as a wind source power, but also has a heat conduction function and directly participates in heat conduction. Specifically, when the fan 1 is in use, the casing 11 can directly or indirectly contact the heating element in the electronic device to conduct heat, absorb heat on the heating element, and further improve heat dissipation efficiency.
  • the casing 11 of this embodiment may be made of a thermally conductive material with a high thermal conductivity, and may be specifically selected according to needs, which is not specifically limited in this embodiment.
  • the heat dissipating assembly 300 further includes a shock absorbing element 3, which is disposed on the casing 11 and the main body 21 Connection.
  • the housing 11 and the main body portion 21 are connected through the shock absorbing element 3.
  • the main body portion 21 is less affected by the vibration of the fan 1, thereby reducing the influence of the main body portion 21 on some heating elements that are sensitive to vibration in electronic equipment.
  • the casing 11 is provided with a fixing portion 111
  • the main body portion 21 is provided with a first mounting portion 211.
  • the first mounting portion 211 is connected to the fixing portion 111
  • the damping element 3 is disposed between the first mounting portion 211 and the fixing portion 111.
  • the first mounting portion 211 is a plug-in portion
  • the fixing portion 111 is a plug-in slot
  • the plug-in portion and the plug-in slot are mated
  • the damping element 3 is sleeved on the socket. Mentioned connector.
  • the fixing portion 111 may include a plurality of, for example, in one embodiment, the fixing portion 111 includes two, and the two fixing portions 111 They are respectively disposed on two sides of the casing 11.
  • the first mounting portion 211 also includes two, the two first mounting portions 211 are respectively disposed on both sides of the main body portion 21, the two first mounting portions 211 and the two The fixing portions 111 are connected correspondingly.
  • the type of the shock absorbing element 3 can be selected according to requirements.
  • the shock absorbing element 3 is an elastic member.
  • the shock absorbing element 3 is made of an elastic material.
  • the shock absorbing element 3 includes an elastic structure such as a spring.
  • the heat dissipation assembly 300 further includes a cover body 24 that cooperates with the main body portion 21 to seal the fin area 22 and the air outlet area 23.
  • the cover body 24 and the main body portion 21 may be formed integrally or separately.
  • the cover body 24 and the main body portion 21 are provided separately, and the cover body 24 covers the main body portion 21.
  • the fin region 22 and the air outlet region 23 are sealed in a space formed by the main body portion 21 and the cover body 24, thereby ensuring a heat dissipation effect.
  • the fin region 22 and the air outlet region 23 are sealed, and the structure is simple.
  • the cover body 24 is provided with a second mounting portion 241.
  • the first mounting portion 211 passes through the fixing portion 111 and is fixedly connected to the second mounting portion 241, thereby improving the casing 11.
  • the heat dissipation assembly 300 further includes a fastener 4 that fixes the second mounting portion 241 on the first mounting portion 211, further improving the casing 11 and the The firmness of the connection of the main body portion 21.
  • the fastener 4 may be a nut or other fastening structures.
  • the heat dissipating component 300 can be applied to various electronic devices or structures that need to dissipate heat.
  • the heat dissipating component 300 is applied to The circuit board 200 dissipates heat generated from various electronic components on the circuit board 200.
  • the heat dissipating component 300 is applied to electronic equipment such as an unmanned aerial vehicle, a remote-control vehicle, etc., so as to dissipate the electronic equipment and ensure the normal operation of the electronic equipment.
  • the second embodiment and the third embodiment respectively take the heat dissipating component 300 applied to the circuit board 200 and an unmanned aerial vehicle as examples for detailed description.
  • the second embodiment of the present invention provides a circuit board assembly.
  • the circuit board assembly includes a circuit board 200 and a heat dissipation assembly 300 connected to the circuit board 200.
  • the circuit board 200 and the heat dissipation assembly 300 of this embodiment are combined to form a circuit board assembly.
  • the heat dissipation assembly 300 can dissipate the circuit board 200 without adding additional wind sources or components to assist heat dissipation. .
  • the circuit board 200 is provided with a plurality of heat-generating functional elements 240.
  • the functional element 240 includes a chip, a sensor, and the like.
  • the functional element 240 is a chip, for example, a control chip, a driving chip, and the like.
  • the fan 1, the fin region 22, and the air outlet region 23 of the heat dissipating component 300 can dissipate heat from different positions of the circuit board 200.
  • the circuit board 200 includes a first region 210, a second region 220, and a third region 230.
  • the fan 1 of the heat dissipating component 300 is matched with the first region 210, and the fin region 22 is connected with the first region 210.
  • the second area 220 cooperates, and the air outlet area 23 cooperates with the third area 230.
  • the fan 1 is a thermally conductive material, and the fan 1 is in contact with the first region 210 to conduct heat from the first region 210 and conduct the heat to the heat sink 2.
  • the casing 11 of the fan 1 is in direct or indirect contact with the functional element 240 in the first region 210, so as to conduct heat from the first region 210 and conduct the heat to the heat sink 2 .
  • the fin region 22 is in contact with the second region 22 to conduct heat to the heat generated by the second region 22 and conduct the heat to the air outlet region 23, specifically, the The fin region 22 is in direct or indirect contact with the functional element 240 in the second region 220, so as to conduct heat to the heat generated in the second region 220 and conduct the heat to the air outlet region 23.
  • the airflow from the air outlet area 23 flows directly or at intervals to the third area 230 to dissipate the functional elements 240 in the third area 230.
  • the air outlet of the air outlet region 23 is aligned with the third region 230, and the third region 230 of this embodiment is directly aligned with the air outlet region.
  • the 23 air outlet has high heat dissipation efficiency.
  • the air outlet of the air outlet area 23 is disposed near the third area 230, so as to improve the heat dissipation speed of the third area 230.
  • the housing 11 of the heat dissipation assembly 300 is connected to the circuit board 200 to form an integrated structure.
  • the shock absorbing element 3 of the heat dissipation assembly 300 is disposed between the casing 11 and the circuit board 200.
  • the vibration element in this embodiment reduces the vibration force transmitted by the fan 1 to the circuit board 200, thereby reducing the influence on some of the vibration-sensitive functional elements 240 on the circuit board 200.
  • a part of the main body portion 21 of the heat dissipation assembly 300 is located between the housing 11 and the circuit board 200, and the damping element 3 is disposed between the main body portion 21 and the housing 11.
  • the circuit board 200 is provided with a positioning portion 250.
  • the positioning portion 250 is plug-in connected to the first mounting portion 211 on the main body portion 21.
  • the first mounting portion 211 is connected to the first mounting portion 211.
  • the upper and lower fixing portions 111 are connected, and the damping element 3 of the heat dissipation assembly 300 is disposed between the first mounting portion 211 and the fixing portion 111.
  • the positioning portion 250 is a positioning protrusion
  • the first mounting portion 211 is provided with a mounting hole
  • the positioning protrusion is inserted into the mounting hole.
  • the fixing portion 111 includes two fixing portions 111 disposed on two sides of the casing 11.
  • shock absorbing element 3 is sleeved on the first mounting portion 211.
  • the cover body 24 of the heat dissipation assembly 300 is provided with a second mounting portion 241, and the first mounting portion 211 passes through the fixing portion 111 and is fixedly connected to the second mounting portion 241.
  • the heat dissipation assembly 300 further includes a fastener 4 that fixes the second mounting portion 241 on the first mounting portion 211.
  • connection structures of the fan 1 and the heat dissipating member 2 refer to the description of the first embodiment, and will not be repeated here.
  • a third embodiment of the present invention provides an unmanned aerial vehicle.
  • the unmanned aerial vehicle may include a fuselage 100, a circuit board 200, and a heat dissipation component 300.
  • the body 100 has a receiving space 110, and the circuit board 200 and the heat dissipating component 300 are both contained in the receiving space 110.
  • the structure, function, working principle, and effect of the heat dissipation component 300 refer to the description of the heat dissipation component 300 in the first embodiment, and for the structure, function, working principle, and effect of the circuit board 200, see the circuit in the second embodiment. The description of the board 200 is not repeated here.
  • the fuselage 100 is provided with a plurality of air outlet portions 120, for example, two, three, or more than two, and the plurality of air outlet portions 120 cooperate with the air outlet area 23,
  • the airflow out of the air outlet area 23 is led out of the airframe 100 through the air outlet 120.
  • the air outlet portion 120 includes a first air outlet portion 121, a second air outlet portion 122, and a third air outlet portion 123, which are respectively connected to the first sub-region 231 and the second sub-region 232 of the heat dissipation component 300.
  • the third sub-region 233 is correspondingly matched.
  • the first air outlet 121 is in communication with the receiving space 110, the air outlet of the first sub-region 231 is spaced from the first air outlet 121, and the first The three regions 230 are disposed between the first air outlet 121 and the air outlet of the first sub-region 231. After the air flow from the first sub-region 231 passes through the third region 230, The first air outlet 121 is led out. In order to better dissipate heat from the third region 230 of the circuit board 200, the size of the air outlet of the first sub-region 231 in this embodiment needs to match the third region 230.
  • the second air outlet portion 122 is in communication with the second sub-region 232, and the air outlet of the second sub-region 232 is connected to the second air outlet 122, and the second sub-region 232 flows out The airflow is directly led from the second air outlet 122.
  • the third air outlet portion 123 is in communication with the third sub-region 233, and the air outlet of the third sub-region 233 is connected to the third air outlet 123, and the airflow from the third sub-region 233 is directly Derived from the third air outlet 123.
  • the air outlet of the second sub-region 232 and the second air outlet 122, and the air outlet of the third sub-region 233 and the third air outlet 123 are all hermetically connected, so that as much as possible The airflow from the second sub-region 232 and the third sub-region 233 is directed outside the fuselage 100.
  • the fuselage 100 includes a first side wall 130, a second side wall 140, and a third side wall 150.
  • the first side wall 130 is located at the front of the body and the second side wall 140.
  • the third sidewall 150 is located on both sides of the first sidewall 130.
  • the first air outlet 121 is opened on the first side wall 130
  • the second air outlet 122 is opened on the second side wall 140
  • the third air outlet 123 is opened on the first side 130.
  • Third side wall 150 the positions where the first air outlet 121, the second air outlet 122, and the third air outlet 123 are disposed on the fuselage 100 are not limited to this, and the first air outlet 121 can be provided as required.
  • the air outlet portion 121, the second air outlet portion 122, and the third air outlet portion 123 are disposed on the body 100.
  • the first air outlet portion 121 and / or the second air outlet portion 122 and / or the third air outlet portion 123 each include a plurality.
  • the first air outlet 121 includes two, and the two first air outlets 121 are disposed on two sides of the first side wall 130.
  • the second air outlet portion 122 includes three, and the three second air outlet portions 122 are spaced apart from the second side wall 140, and the three second air outlet portions 122 are all connected to the second sub-portion.
  • the air outlets of the region 232 cooperate to guide the airflow out of the second sub-region 232 to the outside of the fuselage 100.
  • the third air outlet portion 123 includes three, and the three third air outlet portions 123 are spaced apart from the third side wall 150, and the three third air outlet portions 123 and the third air outlet portion 123 are spaced apart from each other.
  • the air outlets of the three sub-regions 233 cooperate to guide the airflow out of the third sub-region 233 to the outside of the fuselage 100.
  • each air outlet part 120 includes multiple air outlet holes.
  • the air outlet 120 may be an air outlet or a grid structure.
  • the heat dissipation component 300 is connected to the circuit board 200.
  • the circuit board 200 and the heat dissipation component 300 of this embodiment are combined to form a circuit board component, During the physical test, the heat dissipating component 300 can dissipate heat to the circuit board 200 without additional wind sources or components to assist in dissipating heat.
  • connection structure between the heat dissipating component 300 and the circuit board 200 reference may be made to the description of the second embodiment, and details are not described herein again.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Remote Sensing (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention provides a heat dissipating assembly, and a circuit board assembly and an unmanned aerial vehicle having the heat dissipating assembly. The heat dissipating assembly comprises a fan and a heat dissipating member connected to the fan, the heat dissipating member comprises a main body, a fin region provided on the main body, and an air outlet region provided on the main body, and the main body is connected to the fan; the fin region is provided at a position close to an air outlet of the fan and fits the air outlet of the fan, the air outlet region is in communication with the fin region, and an airflow flowing out of the air outlet of the fan flows through the fin region to the air outlet region and is then guided to flow out by means of the air outlet region. By means of the cooperation of the fan, the fin region and the air outlet region, on one hand, the airflow flowing out of the air outlet of the fan is able to dissipate the heat absorbed by the fin region, and on the other hand, the fin region has the function of guiding the airflow, so as to guide the airflow flowing out of the fan into the air outlet region, such that the airflow is guided by means of the air outlet region to exit, and the airflow from the air outlet region can directly dissipate the heat of heat generating elements or directly flow to the outside of an electronic device, realizing a high heat dissipation efficiency.

Description

散热组件及具有其的电路板组件、无人飞行器Radiating component, circuit board component having the same, and unmanned aerial vehicle 技术领域Technical field
本发明涉及散热领域，尤其涉及一种散热组件及具有其的电路板组件、无人飞行器。The invention relates to the field of heat dissipation, in particular to a heat dissipation component, a circuit board component having the same, and an unmanned aerial vehicle.
背景技术Background technique
电子设备内设置有大量的发热元件，需要对发热元件散出的热量及时导出，才能保证电子设备正常工作。目前，在电子设备内设置风扇或者在电子设备内设置导热件，通过风扇或者导热件将电子设备内集聚的热量导出至外部，但单独的风扇或导热件的导热效率并不能满足需求。A large number of heating elements are set in the electronic equipment, and the heat emitted by the heating elements needs to be timely discharged to ensure the normal operation of the electronic equipment. At present, a fan is installed in an electronic device or a heat-conducting member is provided in the electronic device. The heat accumulated in the electronic device is exported to the outside through the fan or the heat-conducting member, but the heat conduction efficiency of the separate fan or the heat-conducting member cannot meet the demand.
发明内容Summary of the invention
本发明提供一种散热组件及具有其的电路板组件、无人飞行器。The invention provides a heat dissipation component, a circuit board component having the same, and an unmanned aerial vehicle.
具体地，本发明是通过如下技术方案实现的：Specifically, the present invention is implemented by the following technical solutions:
根据本发明的第一方面，提供一种散热组件，所述散热组件包括风扇以及与所述风扇连接的散热件，所述散热件包括主体部及设于所述主体部上的鳍片区域和设于所述主体部上的出风区域，其中，所述主体部与所述风扇相连接；所述鳍片区域靠近所述风扇的出风口设置，并与所述风扇的出风口配合，所述出风区域与所述鳍片区域连通，所述风扇的出风口流出的气流经所述鳍片区域流入所述出风区域，再由所述出风区域导出。According to a first aspect of the present invention, a heat dissipation assembly is provided. The heat dissipation assembly includes a fan and a heat dissipation member connected to the fan. The heat dissipation member includes a main body portion and a fin region provided on the main body portion. An air outlet area provided on the main body portion, wherein the main body portion is connected to the fan; the fin area is provided near the air outlet of the fan, and cooperates with the air outlet of the fan, so The air outlet area is in communication with the fin area, and the airflow flowing out of the air outlet of the fan flows into the air outlet area through the fin area, and is then derived from the air outlet area.
根据本发明的二方面，提供一种电路板组件，所述电路板组件包括电路板以及与所述电路板连接的散热组件，其中，所述散热组件包括风扇以及与所述风扇连接的散热件，所述散热件包括主体部及设于所述主体部上的鳍片区域和设于所述主体部上的出风区域，其中，所述主体部与所述风扇相连接；所述鳍片区域靠近所述风扇的出风口设置，并与所述风扇的出风口配合，所述出风区域与所述鳍片区域连通，所述风扇的出风口流出的气流经所述鳍片区域流入所述出风区域，再由所述出风区域导出。According to two aspects of the present invention, a circuit board assembly is provided. The circuit board assembly includes a circuit board and a heat dissipation component connected to the circuit board, wherein the heat dissipation component includes a fan and a heat sink connected to the fan. The heat sink includes a main body portion, a fin region provided on the main body portion, and an air outlet region provided on the main body portion, wherein the main body portion is connected to the fan; the fins The area is arranged close to the air outlet of the fan, and cooperates with the air outlet of the fan. The air outlet area is in communication with the fin area, and the airflow flowing from the air outlet of the fan flows into the air outlet through the fin area. The air-out area is derived from the air-out area.
根据本发明的第三方面，提供一种无人飞行器，所述无人飞行器包括具有一收容空间的机身、收容在所述收容空间内的电路板以及收容在所述收容空间内的散热组件，所述散热组件包括风扇以及与所述风扇连接的散热件，所述散热件包括主体部及设于所述主体部上的鳍片区域和设于所述主体部上的出风区域，其中，所述主体部与所述风扇相连接；所述鳍片区域靠近所述风扇的出风口设置，并与所述风扇的出风口配合，所述出风区域与所述鳍片区域连通，所述风扇的出风口流出的气流经所述鳍片区域流入所述出风区域，再由所述出风区域导出。According to a third aspect of the present invention, an unmanned aerial vehicle is provided. The unmanned aerial vehicle includes a fuselage having a storage space, a circuit board stored in the storage space, and a heat dissipation component stored in the storage space. The heat dissipating component includes a fan and a heat dissipating member connected to the fan. The heat dissipating member includes a main body portion, a fin region provided on the main body portion, and an air outlet region provided on the main body portion, wherein The main body portion is connected with the fan; the fin region is provided near the fan outlet of the fan and cooperates with the fan outlet; the air outlet region is in communication with the fin region; The airflow flowing out of the fan's air outlet flows into the air outlet area through the fin area, and is then led out from the air outlet area.
由以上本发明实施例提供的技术方案可见，本发明通过风扇、鳍片区域和出风区域的配合，一方面风扇出风口流出的气流能够对鳍片区域所吸收的热量进行散热，另一方面鳍片区域具有引导气流的功能，将风扇流出的气流导入出风区域，使得气流由出风区域导出，出风区域导出的气流可直接对各发热元件进行散热或者直接导出电子设备的外部，散热效率高，并且本发明散热组件的结构简单。It can be seen from the technical solutions provided by the embodiments of the present invention that the present invention cooperates with a fan, a fin area, and an air outlet area. On the one hand, the airflow from the fan outlet can dissipate the heat absorbed by the fin area. The fin area has the function of guiding the airflow. The airflow from the fan is introduced into the airflow area, so that the airflow is led out from the airflow area. The airflow from the airflow area can directly dissipate the heat-generating components or directly outside the electronic equipment to dissipate heat. The efficiency is high, and the structure of the heat dissipation component of the present invention is simple.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。In order to explain the technical solutions in the embodiments of the present invention more clearly, the drawings used in the description of the embodiments are briefly introduced below. Obviously, the drawings in the following description are just some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without paying creative labor.
图1是本发明一实施例中散热组件的立体图；FIG. 1 is a perspective view of a heat dissipation component according to an embodiment of the present invention;
图2是本发明一实施例中散热组件的结构拆分示意图；2 is a schematic structural exploded view of a heat dissipation component according to an embodiment of the present invention;
图3是本发明一实施例中电路板组件的结构拆分示意图；3 is a schematic structural exploded view of a circuit board assembly according to an embodiment of the present invention;
图4是本发明一实施例中电路板组件部分结构的结构拆分示意图；4 is a schematic structural exploded view of a part of a circuit board assembly according to an embodiment of the present invention;
图5是本发明一实施例中电路板组件的立体图；5 is a perspective view of a circuit board assembly according to an embodiment of the present invention;
图6是图5的局部放大图；6 is a partially enlarged view of FIG. 5;
图7是本发明一实施例中无人飞飞行器部分结构的立体图；7 is a perspective view of part of the structure of an unmanned aerial vehicle in an embodiment of the present invention;
图8是图7的结构拆分示意图。FIG. 8 is a schematic exploded view of the structure of FIG. 7.
附图标记：Reference signs:
100：机身；110：收容空间；120：出风部；121：第一出风部；122：第二出风部；123：第三出风部；130：第一侧壁；140：第二侧壁；150：第三侧壁；100: fuselage; 110: containment space; 120: air outlet; 121: first air outlet; 122: second air outlet; 123: third air outlet; 130: first side wall; 140: first Two side walls; 150: the third side wall;
200：电路板；210：第一区域；220：第二区域；230：第三区域；240：功能元件；250：定位部；200: circuit board; 210: first area; 220: second area; 230: third area; 240: functional element; 250: positioning section;
300：散热组件；1：风扇；11：外壳；111：固定部；12：扇叶；2：散热件；21：主体部；211：第一安装部；22：鳍片区域；23：出风区域；231：第一子区域；232：第二子区域；233：第三子区域；24：盖体；241：第二安装部；3：减震元件；4：紧固件。300: heat dissipation component; 1: fan; 11: housing; 111: fixed part; 12: fan blades; 2: heat sink; 21: main body part; 211: first mounting part; 22: fin area; 23: air outlet Area; 231: first sub-area; 232: second sub-area; 233: third sub-area; 24: cover body; 241: second mounting portion; 3: damping element; 4: fastener.
具体实施方式detailed description
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获 得的所有其他实施例，都属于本发明保护的范围。In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
下面结合附图，对本发明的散热组件及具有其的电路板组件、无人飞行器进行详细说明。在不冲突的情况下，下述的实施例及实施方式中的特征可以相互组合。The heat dissipation assembly, the circuit board assembly having the same, and the unmanned aerial vehicle of the present invention will be described in detail below with reference to the drawings. In the case of no conflict, the features of the following embodiments and implementations can be combined with each other.
实施例一Example one
结合图1和图2，本发明实施例一提供一种散热组件300，所述散热组件300可以包括风扇1和散热件2，其中，所述风扇1与所述散热件2连接。所述散热件2包括主体部21、鳍片区域22和出风区域23，所述鳍片区域22和所述出风区域23均设于所述主体部21上。在本实施例中，所述主体部21与所述风扇1相连接，所述鳍片区域22靠近所述风扇1的出风口设置，并与所述风扇1的出风口配合，所述出风区域23与所述鳍片区域22连通。本实施例的风扇1的出风口流出的气流经所述鳍片区域22流入所述出风区域23，再由所述出风区域23导出。With reference to FIGS. 1 and 2, a first embodiment of the present invention provides a heat dissipation assembly 300. The heat dissipation assembly 300 may include a fan 1 and a heat sink 2, wherein the fan 1 is connected to the heat sink 2. The heat sink 2 includes a main body portion 21, a fin area 22, and an air outlet area 23. The fin area 22 and the air outlet area 23 are both disposed on the main body portion 21. In this embodiment, the main body portion 21 is connected to the fan 1, and the fin region 22 is disposed near the air outlet of the fan 1, and cooperates with the air outlet of the fan 1, the air outlet The region 23 is in communication with the fin region 22. The airflow flowing from the air outlet of the fan 1 in this embodiment flows into the air outlet area 23 through the fin area 22, and is then led out from the air outlet area 23.
本发明实施例通过风扇1、鳍片区域22和出风区域23的配合，一方面风扇1出风口流出的气流能够对鳍片区域22所吸收的热量进行散热，另一方面鳍片区域22具有引导气流的功能，将风扇1流出的气流导入出风区域23，使得气流由出风区域23导出，出风区域23导出的气流可直接对各发热元件进行散热或者直接导出电子设备的外部，散热效率高，并且本发明散热组件300的结构简单。In the embodiment of the present invention, through the cooperation of the fan 1, the fin region 22, and the air outlet region 23, on the one hand, the airflow from the air outlet of the fan 1 can dissipate the heat absorbed by the fin region 22, and on the other hand, the fin region 22 has The function of guiding the airflow, the airflow from the fan 1 is introduced into the air outlet area 23, so that the airflow is led out from the air outlet area 23, and the airflow derived from the air outlet area 23 can directly dissipate each heating element or directly lead to the outside of the electronic device for heat dissipation The efficiency is high, and the structure of the heat dissipation assembly 300 of the present invention is simple.
又结合图1和图2，本实施例的鳍片区域22包括多个鳍片，多个所述鳍片间隔设置，并且多个所述鳍片的散热面相互平行，每个鳍片的散热面朝远离所述风扇1的出风口方向延伸。相邻两个鳍片形成一气流引导区域，将风扇1的出风口所流出的气流引导至出风区域23。其中，每个鳍片可吸收电子设备内集聚的热量，例如，每个鳍片通过热传导吸收位于其下方的发热元件上的热量，所述风扇1出风口流出的气流能够对鳍片进行快速散热。可选的，多个所述鳍片的端部靠近所述风扇1的出风口，从而加快对鳍片的散热速度。1 and 2 in combination, the fin region 22 of this embodiment includes a plurality of fins, the plurality of fins are spaced apart, and the heat dissipation surfaces of the plurality of fins are parallel to each other, and the heat dissipation of each fin is The surface extends away from the air outlet of the fan 1. Two adjacent fins form an airflow guiding area, and guide the airflow flowing out of the air outlet of the fan 1 to the air outlet area 23. Each fin can absorb the heat accumulated in the electronic device. For example, each fin absorbs heat on a heating element located below it through heat conduction. The airflow from the fan 1 air outlet can quickly dissipate the fins. . Optionally, the ends of the plurality of fins are close to the air outlet of the fan 1, so as to accelerate the heat dissipation speed of the fins.
进一步的，所述出风区域23包括多个子区域，多个所述子区域的端部均连通所述鳍片区域22。本实施例通过鳍片区域22将风扇1流出的气流导入多个子区域，使得气流由多个子区域分别导出，多个子区域中的一部分导出的气流可直接导出电子设备的外部，另一部分导出的气流可直接对各发热元件进行散热。Further, the air outlet area 23 includes a plurality of sub-areas, and ends of the plurality of sub-areas communicate with the fin area 22. In this embodiment, the airflow from the fan 1 is introduced into multiple sub-regions through the fin region 22, so that the airflow is respectively derived from the multiple sub-regions. Part of the airflow derived from the multiple sub-regions can be directly led to the outside of the electronic device, and the other part Can directly dissipate heat from each heating element.
具体的，所述出风区域23包括第一子区域231、第二子区域232和第三子区域233，所述第二子区域232和所述第三子区域233分别设于所述第一子区域231的两侧。在本实施例中，所述第一子区域231导出的气流可直接对发热元件进行散热，比如，所述第一子区域231远离鳍片区域22的一端直接对准发热元件。所述第二子区域232和所述第三子区域233流出的气流可直接导出至电子设备的外部。可以理解，所述出风区域23也可包括多个鳍片，所述鳍片与将所述出风区域23分成多个子区域的隔挡的走向一致。所述出风区域23的多个鳍片可以与所述鳍片区域22的鳍片连接。Specifically, the air outlet area 23 includes a first sub-area 231, a second sub-area 232, and a third sub-area 233, and the second sub-area 232 and the third sub-area 233 are respectively disposed on the first Both sides of the sub-region 231. In this embodiment, the airflow derived from the first sub-region 231 can directly dissipate the heating element. For example, an end of the first sub-region 231 away from the fin region 22 is directly aligned with the heating element. The air flow from the second sub-region 232 and the third sub-region 233 can be directly exported to the outside of the electronic device. It can be understood that the air outlet area 23 may also include a plurality of fins, and the fins are consistent with the direction of the partition that divides the air outlet area 23 into multiple sub-areas. A plurality of fins in the air outlet area 23 may be connected to the fins in the fin area 22.
进一步的，又结合图1和图2，所述第一子区域231、所述第二子区域232及所述第三子区域233的出风方向各不相同，从而将鳍片区域22流出的气流引导至不同的方向，以满足不同的需求。Further, in combination with FIG. 1 and FIG. 2, the wind directions of the first sub-region 231, the second sub-region 232, and the third sub-region 233 are different, so that the fin region 22 flows out. The airflow is directed in different directions to meet different needs.
此外，在本实施例中，所述第一子区域231的出风口朝远离所述鳍片区域22的方向逐渐增大，这样，所述第一子区域231流出的气流就能够从多个方向流出，从而对不同方向的发热元件进行散热。In addition, in this embodiment, the air outlet of the first sub-region 231 gradually increases in a direction away from the fin region 22, so that the airflow flowing out of the first sub-region 231 can be from multiple directions. Outflow, so as to dissipate heating elements in different directions.
参见图2，所述风扇1包括外壳11和设置在外壳11上的扇叶12，所述外壳11与所述主体部21相连接。在本实施例中，所述风扇1的出风口设于所述外壳11上，风扇1工作时，扇叶12旋转产生的气流由所述出风口导出，进入所述鳍片区域22。Referring to FIG. 2, the fan 1 includes a casing 11 and a fan blade 12 provided on the casing 11, and the casing 11 is connected to the main body portion 21. In this embodiment, the air outlet of the fan 1 is provided on the casing 11. When the fan 1 is operating, the airflow generated by the rotation of the fan blades 12 is led out by the air outlet and enters the fin region 22.
本实施例中，所述外壳11为导热件，即外壳11由导热材料(如导热金属)制作。本实施例中，风扇1不仅作为风源动力的作用，还具备导热功能，直接参与导热。具体的，风扇1在使用时，外壳11可与电子设备中的发热元件直接或间接接触而导热，吸收发热元件上的热量，进一步提高散热效率。本实施例的外壳11可选择导热率较高的导热材质制作，具体可根据需要选择，本实施例对此不作具体限定。In this embodiment, the casing 11 is a thermally conductive member, that is, the casing 11 is made of a thermally conductive material (such as a thermally conductive metal). In this embodiment, the fan 1 not only functions as a wind source power, but also has a heat conduction function and directly participates in heat conduction. Specifically, when the fan 1 is in use, the casing 11 can directly or indirectly contact the heating element in the electronic device to conduct heat, absorb heat on the heating element, and further improve heat dissipation efficiency. The casing 11 of this embodiment may be made of a thermally conductive material with a high thermal conductivity, and may be specifically selected according to needs, which is not specifically limited in this embodiment.
进一步的，为减少风扇1运行过程中产生的震动对散热件2的影响，所述散热组件300还包括减震元件3，所述减震元件3设置于所述外壳11和所述主体部21的连接处。本实施例通过减震元件3来连接外壳11和主体部21，主体部21受风扇1震动的影响较小，从而减小主体部21对电子设备中一些对震动较为敏感的发热元件的影响。Further, in order to reduce the influence of the vibration generated during the operation of the fan 1 on the heat dissipating member 2, the heat dissipating assembly 300 further includes a shock absorbing element 3, which is disposed on the casing 11 and the main body 21 Connection. In this embodiment, the housing 11 and the main body portion 21 are connected through the shock absorbing element 3. The main body portion 21 is less affected by the vibration of the fan 1, thereby reducing the influence of the main body portion 21 on some heating elements that are sensitive to vibration in electronic equipment.
又参见图2，所述外壳11设有固定部111，所述主体部21上设有第一安装部211。在本实施例中，所述第一安装部211与所述固定部111连接，所述减震元件3设置于所述第一安装部211和所述固定部111之间。具体的，所述第一安装部211为插接部，所述固定部111为插接槽，所述插接部和所述插接槽插接配合，所述减震元件3套设于所述插接部。Referring also to FIG. 2, the casing 11 is provided with a fixing portion 111, and the main body portion 21 is provided with a first mounting portion 211. In this embodiment, the first mounting portion 211 is connected to the fixing portion 111, and the damping element 3 is disposed between the first mounting portion 211 and the fixing portion 111. Specifically, the first mounting portion 211 is a plug-in portion, the fixing portion 111 is a plug-in slot, the plug-in portion and the plug-in slot are mated, and the damping element 3 is sleeved on the socket. Mentioned connector.
为提高外壳11和主体部21之间连接的稳定性，所述固定部111可包括多个，例如，在其中一实施例中，所述固定部111包括两个，两个所述固定部111分别设置于所述外壳11的两侧。对应的，所述第一安装部211也包括两个，两个所述第一安装部211分别设置于所述主体部21的两侧，两个所述第一安装部211与两个所述固定部111对应连接。In order to improve the stability of the connection between the housing 11 and the main body portion 21, the fixing portion 111 may include a plurality of, for example, in one embodiment, the fixing portion 111 includes two, and the two fixing portions 111 They are respectively disposed on two sides of the casing 11. Correspondingly, the first mounting portion 211 also includes two, the two first mounting portions 211 are respectively disposed on both sides of the main body portion 21, the two first mounting portions 211 and the two The fixing portions 111 are connected correspondingly.
其中，所述减震元件3的类型可根据需要选择，可选的，所述减震元件3为弹性件。在一些实施例中，所述减震元件3由弹性材质制作。在另一些实施例中，所述减震元件3包括弹簧等弹性结构。The type of the shock absorbing element 3 can be selected according to requirements. Optionally, the shock absorbing element 3 is an elastic member. In some embodiments, the shock absorbing element 3 is made of an elastic material. In other embodiments, the shock absorbing element 3 includes an elastic structure such as a spring.
此外，还参见图2，所述散热组件300还包括盖体24，所述盖体24与所述主体部21配合，以密封所述鳍片区域22和所述出风区域23。其中，所述盖体24与所 述主体部21可一体成型，也可分开设置。本实施例中，所述盖体24和所述主体部21分开设置，所述盖体24盖设在所述主体部21上。本实施例的所述鳍片区域22和所述出风区域23被密封在所述主体部21和所述盖体24所形成的空间内，从而保证散热效果，无需单独设置外部结构来对所述鳍片区域22和所述出风区域23进行密封，结构简单。In addition, referring to FIG. 2, the heat dissipation assembly 300 further includes a cover body 24 that cooperates with the main body portion 21 to seal the fin area 22 and the air outlet area 23. Wherein, the cover body 24 and the main body portion 21 may be formed integrally or separately. In this embodiment, the cover body 24 and the main body portion 21 are provided separately, and the cover body 24 covers the main body portion 21. In this embodiment, the fin region 22 and the air outlet region 23 are sealed in a space formed by the main body portion 21 and the cover body 24, thereby ensuring a heat dissipation effect. The fin region 22 and the air outlet region 23 are sealed, and the structure is simple.
进一步的，所述盖体24上设有第二安装部241，所述第一安装部211穿设所述固定部111后，与所述第二安装部241固定连接，提高了所述外壳11和所述主体部21连接的牢固度。更进一步的，所述散热组件300还包括紧固件4，所述紧固件4将所述第二安装部241固定在所述第一安装部211上，进一步提高所述外壳11和所述主体部21连接的牢固度。所述紧固件4可以为螺母，也可以为其他紧固结构。Further, the cover body 24 is provided with a second mounting portion 241. The first mounting portion 211 passes through the fixing portion 111 and is fixedly connected to the second mounting portion 241, thereby improving the casing 11. Fastness of connection with the main body portion 21. Further, the heat dissipation assembly 300 further includes a fastener 4 that fixes the second mounting portion 241 on the first mounting portion 211, further improving the casing 11 and the The firmness of the connection of the main body portion 21. The fastener 4 may be a nut or other fastening structures.
值得一提的是，本发明实施例的散热组件300可以应用在各种需要进行散热的电子设备或结构中，例如，在一些实施例中，结合图3至图5，将散热组件300应用在电路板200上，对电路板200上各种电子元器件产生的热量进行散热。在另一些实施例中，将散热组件300应用在无人飞行器、遥控车辆等电子设备上，从而对电子设备进行散热，确保电子设备的正常工作。It is worth mentioning that the heat dissipating component 300 according to the embodiment of the present invention can be applied to various electronic devices or structures that need to dissipate heat. For example, in some embodiments, in conjunction with FIGS. 3 to 5, the heat dissipating component 300 is applied to The circuit board 200 dissipates heat generated from various electronic components on the circuit board 200. In other embodiments, the heat dissipating component 300 is applied to electronic equipment such as an unmanned aerial vehicle, a remote-control vehicle, etc., so as to dissipate the electronic equipment and ensure the normal operation of the electronic equipment.
实施例二和实施例三分别以将所述散热组件300应用在电路板200和无人飞行器为例进行详细说明。The second embodiment and the third embodiment respectively take the heat dissipating component 300 applied to the circuit board 200 and an unmanned aerial vehicle as examples for detailed description.
实施例二Example two
结合图3至图5，本发明实施例二提供一种电路板组件，所述电路板组件包括电路板200以及与所述电路板200连接的散热组件300。其中，所述散热组件300的结构、功能、工作原理及效果可参见实施例一中的散热组件300的描述，此处不再赘述。本实施例的电路板200和散热组件300组合形成一电路板组件，在电路板200进行单体测试时，散热组件300能够对电路板200进行散热，无需额外增加其他风源或部件来辅助散热。With reference to FIG. 3 to FIG. 5, the second embodiment of the present invention provides a circuit board assembly. The circuit board assembly includes a circuit board 200 and a heat dissipation assembly 300 connected to the circuit board 200. For the structure, function, working principle, and effect of the heat dissipation component 300, reference may be made to the description of the heat dissipation component 300 in Embodiment 1, and details are not described herein again. The circuit board 200 and the heat dissipation assembly 300 of this embodiment are combined to form a circuit board assembly. When the circuit board 200 is subjected to a unit test, the heat dissipation assembly 300 can dissipate the circuit board 200 without adding additional wind sources or components to assist heat dissipation. .
在本实施例中，所述电路板200设有多个发热的功能元件240。所述功能元件240包括芯片、传感器等。在本实施例中，所述功能元件240为芯片，例如，控制芯片、驱动芯片等。In this embodiment, the circuit board 200 is provided with a plurality of heat-generating functional elements 240. The functional element 240 includes a chip, a sensor, and the like. In this embodiment, the functional element 240 is a chip, for example, a control chip, a driving chip, and the like.
所述散热组件300的风扇1、鳍片区域22和出风区域23能够对所述电路板200的不同位置进行散热。具体的，所述电路板200包括第一区域210、第二区域220和第三区域230，所述散热组件300的风扇1与所述第一区域210配合，所述鳍片区域22与所述第二区域220配合，出风区域23与所述第三区域230配合。在本实施例中，所述风扇1为导热材料，并且，所述风扇1与所述第一区域210接触以对所述第一区域210产生的热量进行导热并将热量传导至所述散热件2，具体的，所述风扇1的外壳11与所述第一区域210中的功能元件240直接或间接接触，从而对所述第一区域 210产生的热量进行导热并将热量传导至散热件2。另外，在本实施例中，所述鳍片区域22与所述第二区域22接触以对所述第二区域22产生的热量进行导热并将热量传导至出风区域23，具体的，所述鳍片区域22与所述第二区域220中的功能元件240直接或间接接触，实现对第二区域220产生的热量进行导热并将热量传导至出风区域23。所述出风区域23导出的气流直接或间隔流向第三区域230，对第三区域230中的功能元件240进行散热。The fan 1, the fin region 22, and the air outlet region 23 of the heat dissipating component 300 can dissipate heat from different positions of the circuit board 200. Specifically, the circuit board 200 includes a first region 210, a second region 220, and a third region 230. The fan 1 of the heat dissipating component 300 is matched with the first region 210, and the fin region 22 is connected with the first region 210. The second area 220 cooperates, and the air outlet area 23 cooperates with the third area 230. In this embodiment, the fan 1 is a thermally conductive material, and the fan 1 is in contact with the first region 210 to conduct heat from the first region 210 and conduct the heat to the heat sink 2. Specifically, the casing 11 of the fan 1 is in direct or indirect contact with the functional element 240 in the first region 210, so as to conduct heat from the first region 210 and conduct the heat to the heat sink 2 . In addition, in this embodiment, the fin region 22 is in contact with the second region 22 to conduct heat to the heat generated by the second region 22 and conduct the heat to the air outlet region 23, specifically, the The fin region 22 is in direct or indirect contact with the functional element 240 in the second region 220, so as to conduct heat to the heat generated in the second region 220 and conduct the heat to the air outlet region 23. The airflow from the air outlet area 23 flows directly or at intervals to the third area 230 to dissipate the functional elements 240 in the third area 230.
为提高第三区域230的散热速度，在一实施例中，所述出风区域23的出风口对准所述第三区域230，本实施例的第三区域230直接对准所述出风区域23的出风口上，散热效率高。在另一实施例中，所述出风区域23的出风口靠近所述第三区域230设置，从而提高第三区域230的散热速度。In order to improve the heat dissipation speed of the third region 230, in an embodiment, the air outlet of the air outlet region 23 is aligned with the third region 230, and the third region 230 of this embodiment is directly aligned with the air outlet region. The 23 air outlet has high heat dissipation efficiency. In another embodiment, the air outlet of the air outlet area 23 is disposed near the third area 230, so as to improve the heat dissipation speed of the third area 230.
结合图5和图6，所述散热组件300的外壳11与所述电路板200相连接，从而组成一整体结构。在本实施例中，所述散热组件300的减震元件3设置于所述外壳11和所述电路板200之间。本实施例的震元件会削减所述风扇1传递到所述电路板200的震动力度，从而减小对所述电路板200上的一些对震动较为敏感的功能元件240的影响。With reference to FIGS. 5 and 6, the housing 11 of the heat dissipation assembly 300 is connected to the circuit board 200 to form an integrated structure. In this embodiment, the shock absorbing element 3 of the heat dissipation assembly 300 is disposed between the casing 11 and the circuit board 200. The vibration element in this embodiment reduces the vibration force transmitted by the fan 1 to the circuit board 200, thereby reducing the influence on some of the vibration-sensitive functional elements 240 on the circuit board 200.
具体的，所述散热组件300的主体部21的一部分位于所述外壳11和所述电路板200之间，所述减震元件3设置于所述主体部21和所述外壳11之间。Specifically, a part of the main body portion 21 of the heat dissipation assembly 300 is located between the housing 11 and the circuit board 200, and the damping element 3 is disposed between the main body portion 21 and the housing 11.
结合图5和图6，所述电路板200设有定位部250，所述定位部250与所述主体部21上的第一安装部211插接连接，所述第一安装部211与所述外上的固定部111连接，所述散热组件300的减震元件3设置于所述第一安装部211和所述固定部111之间。本实施例中，所述定位部250为定位凸起，所述第一安装部211设有安装孔，所述定位凸起插接在所述安装孔中。With reference to FIGS. 5 and 6, the circuit board 200 is provided with a positioning portion 250. The positioning portion 250 is plug-in connected to the first mounting portion 211 on the main body portion 21. The first mounting portion 211 is connected to the first mounting portion 211. The upper and lower fixing portions 111 are connected, and the damping element 3 of the heat dissipation assembly 300 is disposed between the first mounting portion 211 and the fixing portion 111. In this embodiment, the positioning portion 250 is a positioning protrusion, the first mounting portion 211 is provided with a mounting hole, and the positioning protrusion is inserted into the mounting hole.
进一步的，所述固定部111包括两个，设置于所述外壳11的两侧。Further, the fixing portion 111 includes two fixing portions 111 disposed on two sides of the casing 11.
进一步的，所述减震元件3套设于所述第一安装部211。Further, the shock absorbing element 3 is sleeved on the first mounting portion 211.
进一步的，所述散热组件300的盖体24上设有第二安装部241，所述第一安装部211穿设所述固定部111后，与所述第二安装部241固定连接。Further, the cover body 24 of the heat dissipation assembly 300 is provided with a second mounting portion 241, and the first mounting portion 211 passes through the fixing portion 111 and is fixedly connected to the second mounting portion 241.
进一步的，所述散热组件300还包括紧固件4，所述紧固件4将所述第二安装部241固定在所述第一安装部211上。Further, the heat dissipation assembly 300 further includes a fastener 4 that fixes the second mounting portion 241 on the first mounting portion 211.
关于所述风扇1和所述散热件2的其他连接结构，可参见上述实施例一的描述，此处不再赘述For other connection structures of the fan 1 and the heat dissipating member 2, refer to the description of the first embodiment, and will not be repeated here.
实施例三Example three
结合图7和图8，本发明实施例三提供一种无人飞行器，所述无人飞行器可包括机身100、电路板200以及散热组件300。其中，所述机身100具有一收容空间110， 所述电路板200和所述散热组件300均收容在所述收容空间110内。所述散热组件300的结构、功能、工作原理及效果可参见实施例一中的散热组件300的描述，而所述电路板200的结构、功能、工作原理及效果可参见实施例二中的电路板200的描述，此处不再赘述。With reference to FIGS. 7 and 8, a third embodiment of the present invention provides an unmanned aerial vehicle. The unmanned aerial vehicle may include a fuselage 100, a circuit board 200, and a heat dissipation component 300. Wherein, the body 100 has a receiving space 110, and the circuit board 200 and the heat dissipating component 300 are both contained in the receiving space 110. For the structure, function, working principle, and effect of the heat dissipation component 300, refer to the description of the heat dissipation component 300 in the first embodiment, and for the structure, function, working principle, and effect of the circuit board 200, see the circuit in the second embodiment. The description of the board 200 is not repeated here.
在本实施例中，所述机身100设有多个出风部120，例如，两个、三个或者三个以上，多个所述出风部120与所述出风区域23配合，由所述出风区域23流出的气流，经所述出风部120导出至所述机身100外。具体的，所述出风部120包括第一出风部121、第二出风部122和第三出风部123，分别与所述散热组件300的第一子区域231、第二子区域232、第三子区域233对应配合。In this embodiment, the fuselage 100 is provided with a plurality of air outlet portions 120, for example, two, three, or more than two, and the plurality of air outlet portions 120 cooperate with the air outlet area 23, The airflow out of the air outlet area 23 is led out of the airframe 100 through the air outlet 120. Specifically, the air outlet portion 120 includes a first air outlet portion 121, a second air outlet portion 122, and a third air outlet portion 123, which are respectively connected to the first sub-region 231 and the second sub-region 232 of the heat dissipation component 300. The third sub-region 233 is correspondingly matched.
本实施例中，所述第一出风部121与所述收容空间110连通，所述第一子区域231的出风口与所述第一出风部121间隔设置，所述电路板200的第三区域230设置于所述第一出风部121和所述第一子区域231的出风口之间，所述第一子区域231流出的气流，经过所述第三区域230后，由所述第一出风部121导出。为更好的对所述电路板200的第三区域230进行散热，本实施例的第一子区域231的出风口大小需要与所述第三区域230相匹配。In this embodiment, the first air outlet 121 is in communication with the receiving space 110, the air outlet of the first sub-region 231 is spaced from the first air outlet 121, and the first The three regions 230 are disposed between the first air outlet 121 and the air outlet of the first sub-region 231. After the air flow from the first sub-region 231 passes through the third region 230, The first air outlet 121 is led out. In order to better dissipate heat from the third region 230 of the circuit board 200, the size of the air outlet of the first sub-region 231 in this embodiment needs to match the third region 230.
进一步的，所述第二出风部122与所述第二子区域232连通，并且，所述第二子区域232的出风口与所述第二出风部122连接，第二子区域232流出的气流直接由所述第二出风部122导出。所述第三出风部123与所述第三子区域233连通，并且，所述第三子区域233的出风口与所述第三出风部123连接，第三子区域233流出的气流直接由所述第三出风部123导出。可选地，所述第二子区域232的出风口与所述第二出风部122、所述第三子区域233的出风口与所述第三出风部123均密封连接，从而尽可能的将第二子区域232和第三子区域233的气流导出机身100外部。Further, the second air outlet portion 122 is in communication with the second sub-region 232, and the air outlet of the second sub-region 232 is connected to the second air outlet 122, and the second sub-region 232 flows out The airflow is directly led from the second air outlet 122. The third air outlet portion 123 is in communication with the third sub-region 233, and the air outlet of the third sub-region 233 is connected to the third air outlet 123, and the airflow from the third sub-region 233 is directly Derived from the third air outlet 123. Optionally, the air outlet of the second sub-region 232 and the second air outlet 122, and the air outlet of the third sub-region 233 and the third air outlet 123 are all hermetically connected, so that as much as possible The airflow from the second sub-region 232 and the third sub-region 233 is directed outside the fuselage 100.
参见图8，在本实施例中，所述机身100包括第一侧壁130、第二侧壁140和第三侧壁150，该第一侧壁130位于机体前部，第二侧壁140和第三侧壁150位于该第一侧壁130的两侧。其中，所述第一出风部121开设于所述第一侧壁130，所述第二出风部122开设于所述第二侧壁140，所述第三出风部123开设于所述第三侧壁150。当然，所述第一出风部121、所述第二出风部122和所述第三出风部123设置在机身100上的位置并不限于此，具体可根据需要设置所述第一出风部121、所述第二出风部122和所述第三出风部123设置在机身100上的位置。Referring to FIG. 8, in this embodiment, the fuselage 100 includes a first side wall 130, a second side wall 140, and a third side wall 150. The first side wall 130 is located at the front of the body and the second side wall 140. The third sidewall 150 is located on both sides of the first sidewall 130. The first air outlet 121 is opened on the first side wall 130, the second air outlet 122 is opened on the second side wall 140, and the third air outlet 123 is opened on the first side 130. Third side wall 150. Of course, the positions where the first air outlet 121, the second air outlet 122, and the third air outlet 123 are disposed on the fuselage 100 are not limited to this, and the first air outlet 121 can be provided as required. The air outlet portion 121, the second air outlet portion 122, and the third air outlet portion 123 are disposed on the body 100.
其中，所述第一出风部121和/或所述第二出风部122和/或所述第三出风部123分别包括多个。例如，在一实施例中，所述第一出风部121包括两个，两个所述第一出风部121开设于所述第一侧壁130的两侧。所述第二出风部122包括三个，三个所述第二出风部122间隔开设于所述第二侧壁140，并且，三个第二出风部122均与所述第二子区域232的出风口配合，以将所述第二子区域232流出的气流导出所述机身 100外部。所述第三出风部123包括三个，三个所述第三出风部123间隔开设于所述第三侧壁150，并且，三个所述第三出风部123均与所述第三子区域233的出风口配合，以将所述第三子区域233流出的气流导出所述机身100外部。Wherein, the first air outlet portion 121 and / or the second air outlet portion 122 and / or the third air outlet portion 123 each include a plurality. For example, in one embodiment, the first air outlet 121 includes two, and the two first air outlets 121 are disposed on two sides of the first side wall 130. The second air outlet portion 122 includes three, and the three second air outlet portions 122 are spaced apart from the second side wall 140, and the three second air outlet portions 122 are all connected to the second sub-portion. The air outlets of the region 232 cooperate to guide the airflow out of the second sub-region 232 to the outside of the fuselage 100. The third air outlet portion 123 includes three, and the three third air outlet portions 123 are spaced apart from the third side wall 150, and the three third air outlet portions 123 and the third air outlet portion 123 are spaced apart from each other. The air outlets of the three sub-regions 233 cooperate to guide the airflow out of the third sub-region 233 to the outside of the fuselage 100.
所述出风部120的类型可包括多种，例如，本实施例中，每个出风部120包括多个出风孔。而在其他实施例中，所述出风部120也可以为出风口或者栅格结构。There may be multiple types of the air outlet part 120. For example, in this embodiment, each air outlet part 120 includes multiple air outlet holes. In other embodiments, the air outlet 120 may be an air outlet or a grid structure.
另外，在本实施例中，参见图8，所述散热组件300与所述电路板200相连接，本实施例的电路板200和散热组件300组合形成一电路板组件，在电路板200进行单体测试时，散热组件300能够对电路板200进行散热，无需额外增加其他风源或部件来辅助散热。In addition, in this embodiment, referring to FIG. 8, the heat dissipation component 300 is connected to the circuit board 200. The circuit board 200 and the heat dissipation component 300 of this embodiment are combined to form a circuit board component, During the physical test, the heat dissipating component 300 can dissipate heat to the circuit board 200 without additional wind sources or components to assist in dissipating heat.
所述散热组件300与所述电路板200之间的连接结构可参见上述实施例二的描述，此处不再赘述。For the connection structure between the heat dissipating component 300 and the circuit board 200, reference may be made to the description of the second embodiment, and details are not described herein again.
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。It should be noted that in this article, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that these entities or operations There is any such actual relationship or order among them. The term "comprising", "including" or any other variation thereof is intended to encompass non-exclusive inclusion, such that a process, method, article, or device that includes a series of elements includes not only those elements but also other elements that are not explicitly listed Elements, or elements that are inherent to such a process, method, article, or device. Without more restrictions, the elements defined by the sentence "including a ..." do not exclude the existence of other identical elements in the process, method, article, or equipment that includes the elements.
以上对本发明实施例所提供的散热组件及具有其的电路板组件、无人飞行器进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的方法及其核心思想；同时，对于本领域的一般技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。The heat dissipation components, circuit board components, and unmanned aerial vehicles provided with the embodiments of the present invention have been described in detail above. The specific examples are used herein to explain the principles and implementation of the present invention. It is used to help understand the method of the present invention and its core ideas; at the same time, for those of ordinary skill in the art, according to the ideas of the present invention, there will be changes in the specific implementation and scope of application. The contents of the description should not be construed as limiting the invention.

Claims (61)

  1. 一种散热组件，其特征在于，所述散热组件包括：A heat dissipation component, characterized in that the heat dissipation component includes:
    风扇；以及Fans; and
    与所述风扇连接的散热件，所述散热件包括主体部及设于所述主体部上的鳍片区域和设于所述主体部上的出风区域，其中，所述主体部与所述风扇相连接；所述鳍片区域靠近所述风扇的出风口设置，并与所述风扇的出风口配合，所述出风区域与所述鳍片区域连通，所述风扇的出风口流出的气流经所述鳍片区域流入所述出风区域，再由所述出风区域导出。A heat dissipation member connected to the fan, the heat dissipation member includes a main body portion, a fin region provided on the main body portion, and an air outlet region provided on the main body portion, wherein the main body portion and the The fan is connected; the fin area is arranged near the fan outlet of the fan and cooperates with the fan outlet, the air outlet area is in communication with the fin area, and the airflow from the fan outlet is It flows into the air outlet area through the fin area, and is derived from the air outlet area.
  2. 根据权利要求1所述的散热组件，其特征在于，所述出风区域包括多个子区域，多个所述子区域的端部均连通所述鳍片区域。The heat dissipation assembly according to claim 1, wherein the air outlet area includes a plurality of sub-areas, and ends of the plurality of sub-areas are in communication with the fin area.
  3. 根据权利要求2所述的散热组件，其特征在于，所述出风区域包括第一子区域、第二子区域和第三子区域，其中，所述第二子区域和所述第三子区域分别设于所述第一子区域的两侧。The heat dissipation assembly according to claim 2, wherein the air outlet area comprises a first sub-area, a second sub-area, and a third sub-area, wherein the second sub-area and the third sub-area Respectively disposed on two sides of the first sub-region.
  4. 根据权利要求3所述的散热组件，其特征在于，所述第一子区域、所述第二子区域及所述第三子区域的出风方向各不相同。The heat-dissipating component according to claim 3, wherein the wind directions of the first sub-region, the second sub-region, and the third sub-region are different.
  5. 根据权利要求3所述的散热组件，其特征在于，所述第一子区域的出风口朝远离所述鳍片区域的方向逐渐增大。The heat dissipation assembly according to claim 3, wherein the air outlet of the first sub-region gradually increases in a direction away from the fin region.
  6. 根据权利要求1所述的散热组件，其特征在于，所述风扇包括外壳和设置在外壳上的扇叶；The heat dissipation assembly according to claim 1, wherein the fan comprises a casing and a fan blade disposed on the casing;
    所述外壳与所述主体部相连接。The casing is connected to the main body portion.
  7. 根据权利要求6所述的散热组件，其特征在于，所述散热组件还包括减震元件，所述减震元件设置于所述外壳和所述主体部的连接处。The heat-dissipating component according to claim 6, wherein the heat-dissipating component further comprises a shock-absorbing element, and the shock-absorbing element is disposed at a connection between the housing and the main body portion.
  8. 根据权利要求7所述的散热组件，其特征在于，所述外壳设有固定部，所述主体部上设有第一安装部；The heat dissipation assembly according to claim 7, wherein the housing is provided with a fixing portion, and the main body portion is provided with a first mounting portion;
    所述第一安装部与所述固定部连接；The first mounting portion is connected to the fixing portion;
    所述减震元件设置于所述第一安装部和所述固定部之间。The damping element is disposed between the first mounting portion and the fixing portion.
  9. 根据权利要求8所述的散热组件，其特征在于，所述减震元件套设于所述第一安装部。The heat dissipation assembly according to claim 8, wherein the shock absorbing element is sleeved on the first mounting portion.
  10. 根据权利要求8～9任一项所述的散热组件，其特征在于，所述散热组件还包括与所述主体部配合的用于密封所述鳍片区域和所述出风区域的盖体。The heat-dissipating component according to any one of claims 8 to 9, wherein the heat-dissipating component further comprises a cover body that cooperates with the main body portion to seal the fin region and the air outlet region.
  11. 根据权利要求10所述的散热组件，其特征在于，所述盖体上设有第二安装部；The heat dissipation assembly according to claim 10, wherein the cover is provided with a second mounting portion;
    所述第一安装部穿设所述固定部后，与所述第二安装部固定连接。After the first mounting portion passes through the fixing portion, it is fixedly connected to the second mounting portion.
  12. 根据权利要求11所述的散热组件，其特征在于，所述散热组件还包括紧固件，所述紧固件将所述第二安装部固定在所述第一安装部上。The heat-dissipating component according to claim 11, wherein the heat-dissipating component further comprises a fastener that fixes the second mounting portion on the first mounting portion.
  13. 根据权利要求8所述的散热组件，其特征在于，所述固定部包括两个，设置于所述外壳的两侧。The heat-dissipating component according to claim 8, wherein the fixing portion comprises two and is disposed on both sides of the casing.
  14. 根据权利要求7所述的散热组件，其特征在于，所述减震元件为弹性件。The heat dissipation assembly according to claim 7, wherein the shock absorbing element is an elastic member.
  15. 根据权利要求6所述的散热组件，其特征在于，所述外壳为导热件。The heat-dissipating component according to claim 6, wherein the casing is a thermally conductive member.
  16. 一种电路板组件，其特征在于，所述电路板组件包括：A circuit board assembly, characterized in that the circuit board assembly includes:
    电路板；以及Circuit board; and
    与所述电路板连接的散热组件，其中，所述散热组件包括：A heat dissipation component connected to the circuit board, wherein the heat dissipation component includes:
    风扇；以及Fans; and
    与所述风扇连接的散热件，所述散热件包括主体部及设于所述主体部上的鳍片区域和设于所述主体部上的出风区域，其中，所述主体部与所述风扇相连接；所述鳍片区域靠近所述风扇的出风口设置，并与所述风扇的出风口配合，所述出风区域与所述鳍片区域连通，所述风扇的出风口流出的气流经所述鳍片区域流入所述出风区域，再由所述出风区域导出。A heat dissipation member connected to the fan, the heat dissipation member includes a main body portion, a fin region provided on the main body portion, and an air outlet region provided on the main body portion, wherein the main body portion and the The fan is connected; the fin area is arranged near the fan outlet of the fan and cooperates with the fan outlet, the air outlet area is in communication with the fin area, and the airflow from the fan outlet is It flows into the air outlet area through the fin area, and is derived from the air outlet area.
  17. 根据权利要求16所述的电路板组件，其特征在于，所述出风区域包括多个子区域，多个所述子区域的端部均连通所述鳍片区域。The circuit board assembly according to claim 16, wherein the air outlet area includes a plurality of sub-areas, and ends of the plurality of sub-areas are in communication with the fin area.
  18. 根据权利要求17所述的电路板组件，其特征在于，所述出风区域包括第一子区域、第二子区域和第三子区域，其中，所述第二子区域和所述第三子区域分别设于所述第一子区域的两侧。The circuit board assembly according to claim 17, wherein the air outlet area comprises a first sub-area, a second sub-area, and a third sub-area, wherein the second sub-area and the third sub-area The regions are respectively disposed on two sides of the first sub-region.
  19. 根据权利要求18所述的电路板组件，其特征在于，所述第一子区域、所述第二子区域及所述第三子区域的出风方向各不相同。The circuit board assembly according to claim 18, wherein the wind directions of the first sub-region, the second sub-region, and the third sub-region are different.
  20. 根据权利要求18所述的电路板组件，其特征在于，所述第一子区域的出风口朝远离所述鳍片区域的方向逐渐增大。The circuit board assembly according to claim 18, wherein the air outlet of the first sub-region gradually increases in a direction away from the fin region.
  21. 根据权利要求16所述的电路板组件，其特征在于，所述风扇包括外壳和设置在外壳上的扇叶；The circuit board assembly according to claim 16, wherein the fan comprises a casing and a fan blade provided on the casing;
    所述外壳与所述主体部相连接，并与所述电路板相连接。The casing is connected to the main body portion, and is connected to the circuit board.
  22. 根据权利要求21所述的电路板组件，其特征在于，所述散热组件还包括减震元件，所述减震元件设置于所述外壳和所述电路板之间。The circuit board assembly according to claim 21, wherein the heat dissipating assembly further comprises a shock absorbing element, and the shock absorbing element is disposed between the housing and the circuit board.
  23. 根据权利要求22所述的电路板组件，其特征在于，所述主体部的一部分位于所述外壳和所述电路板之间，所述减震元件设置于所述主体部和所述外壳之间。The circuit board assembly according to claim 22, wherein a part of the main body portion is located between the housing and the circuit board, and the damping element is disposed between the main body portion and the housing .
  24. 根据权利要求23所述的电路板组件，其特征在于，所述电路板设有定位部，所述外壳设有固定部，所述主体部上设有第一安装部；The circuit board assembly according to claim 23, wherein the circuit board is provided with a positioning portion, the housing is provided with a fixing portion, and the main body portion is provided with a first mounting portion;
    所述定位部与所述第一安装部插接连接，所述第一安装部与所述固定部连接；The positioning portion is plug-in connected to the first mounting portion, and the first mounting portion is connected to the fixing portion;
    所述减震元件设置于所述第一安装部和所述固定部之间。The damping element is disposed between the first mounting portion and the fixing portion.
  25. 根据权利要求24所述的电路板组件，其特征在于，所述减震元件套设于所述第一安装部。The circuit board assembly according to claim 24, wherein the shock absorbing element is sleeved on the first mounting portion.
  26. 根据权利要求24～25任一项所述的电路板组件，其特征在于，所述散热组件还包括与所述主体部配合的用于密封所述鳍片区域和所述出风区域的盖体。The circuit board assembly according to any one of claims 24 to 25, wherein the heat dissipating assembly further comprises a cover body for sealing the fin area and the air outlet area, which is matched with the main body portion. .
  27. 根据权利要求26所述的电路板组件，其特征在于，所述盖体上设有第二安装 部；The circuit board assembly according to claim 26, wherein a second mounting portion is provided on the cover;
    所述第一安装部穿设所述固定部后，与所述第二安装部固定连接。After the first mounting portion passes through the fixing portion, it is fixedly connected to the second mounting portion.
  28. 根据权利要求27所述的电路板组件，其特征在于，所述散热组件还包括紧固件，所述紧固件将所述第二安装部固定在所述第一安装部上。The circuit board assembly according to claim 27, wherein the heat dissipating assembly further comprises a fastener that fixes the second mounting portion on the first mounting portion.
  29. 根据权利要求24所述的电路板组件，其特征在于，所述固定部包括两个，设置于所述外壳的两侧。The circuit board assembly according to claim 24, wherein the fixing portion includes two and is disposed on both sides of the casing.
  30. 根据权利要求22所述的电路板组件，其特征在于，所述减震元件为弹性件。The circuit board assembly according to claim 22, wherein the shock absorbing element is an elastic member.
  31. 根据权利要求21所述的电路板组件，其特征在于，所述风扇的外壳为导热件。The circuit board assembly according to claim 21, wherein a housing of the fan is a heat conducting member.
  32. 根据权利要求16所述的电路板组件，其特征在于，所述电路板设有多个发热的功能元件，所述电路板包括第一区域、第二区域和第三区域，所述散热组件的风扇与所述第一区域配合，所述鳍片区域与所述第二区域配合，出风区域与所述第三区域配合。The circuit board assembly according to claim 16, wherein the circuit board is provided with a plurality of heat-generating functional elements, and the circuit board includes a first region, a second region, and a third region. The fan cooperates with the first area, the fin area cooperates with the second area, and the air outlet area cooperates with the third area.
  33. 根据权利要求32所述的电路板组件，其特征在于，所述出风区域的出风口对准或靠近所述第三区域。The circuit board assembly according to claim 32, wherein an air outlet of the air outlet area is aligned with or near the third area.
  34. 根据权利要求32所述的电路板组件，其特征在于，所述风扇为导热材料并与所述电路板的第一区域接触以对所述第一区域产生的热量进行导热并将热量传导至散热件；及/或The circuit board assembly according to claim 32, wherein the fan is a thermally conductive material and is in contact with a first region of the circuit board to conduct heat from the first region and conduct heat to the heat Pieces; and / or
    所述散热件的鳍片区域与所述电路板的第二区域接触以对所述第二区域产生的热量进行导热并将热量传导至出风区域。The fin region of the heat sink is in contact with the second region of the circuit board to conduct heat from the second region and conduct the heat to the air outlet region.
  35. 根据权利要求32所述的电路板组件，其特征在于，所述功能元件为芯片。The circuit board assembly according to claim 32, wherein the functional element is a chip.
  36. 一种无人飞行器，其特征在于，所述无人飞行器包括：An unmanned aerial vehicle is characterized in that the unmanned aerial vehicle includes:
    机身，具有一收容空间；Fuselage with a containment space;
    收容在所述收容空间内的电路板；以及A circuit board contained in the containing space; and
    收容在所述收容空间内的散热组件，所述散热组件包括：A heat dissipation component contained in the containing space, the heat dissipation component includes:
    风扇；以及Fans; and
    与所述风扇连接的散热件，所述散热件包括主体部及设于所述主体部上的鳍片区域和设于所述主体部上的出风区域，其中，所述主体部与所述风扇相连接；所述鳍片区域靠近所述风扇的出风口设置，并与所述风扇的出风口配合，所述出风区域与所述鳍片区域连通，所述风扇的出风口流出的气流经所述鳍片区域流入所述出风区域，再由所述出风区域导出。A heat dissipation member connected to the fan, the heat dissipation member includes a main body portion, a fin region provided on the main body portion, and an air outlet region provided on the main body portion, wherein the main body portion and the The fan is connected; the fin area is arranged near the fan outlet of the fan and cooperates with the fan outlet, the air outlet area is in communication with the fin area, and the airflow from the fan outlet is It flows into the air outlet area through the fin area, and is derived from the air outlet area.
  37. 根据权利要求36所述的无人飞行器，其特征在于，所述出风区域包括多个子区域，多个所述子区域的端部均连通所述鳍片区域。The unmanned aerial vehicle according to claim 36, wherein the air outlet area includes a plurality of sub-areas, and ends of the plurality of sub-areas are connected to the fin area.
  38. 根据权利要求37所述的无人飞行器，其特征在于，所述出风区域包括第一子区域、第二子区域和第三子区域，其中，所述第二子区域和所述第三子区域分别设于所述第一子区域的两侧。The unmanned aerial vehicle according to claim 37, wherein the air outlet area comprises a first sub-area, a second sub-area, and a third sub-area, wherein the second sub-area and the third sub-area The regions are respectively disposed on two sides of the first sub-region.
  39. 根据权利要求38所述的无人飞行器，其特征在于，所述第一子区域、所述第 二子区域及所述第三子区域的出风方向各不相同。The unmanned aerial vehicle according to claim 38, wherein the wind directions of the first sub-region, the second sub-region, and the third sub-region are different.
  40. 根据权利要求38所述的无人飞行器，其特征在于，所述第一子区域的出风口朝远离所述鳍片区域的方向逐渐增大。The unmanned aerial vehicle according to claim 38, wherein the air outlet of the first sub-region gradually increases in a direction away from the fin region.
  41. 根据权利要求36所述的无人飞行器，其特征在于，所述机身设有多个出风部，多个所述出风部与所述出风区域配合，其中由所述出风区域流出的气流，经所述出风部导出至所述机身外。The unmanned aerial vehicle according to claim 36, wherein the fuselage is provided with a plurality of air outlet portions, and the plurality of air outlet portions cooperate with the air outlet area, and the air flows from the air outlet area The airflow is led out of the fuselage through the air outlet.
  42. 根据权利要求41所述的无人飞行器，其特征在于，所述出风部包括第一出风部、第二出风部和第三出风部，分别与所述散热组件的第一子区域、第二子区域、第三子区域对应配合。The unmanned aerial vehicle according to claim 41, wherein the air outlet portion includes a first air outlet portion, a second air outlet portion, and a third air outlet portion, respectively, and the first sub-region of the heat dissipation component , The second sub-region, and the third sub-region correspond to each other.
  43. 根据权利要求42所述的无人飞行器，其特征在于，所述机身包括第一侧壁、第二侧壁和第三侧壁，该第一侧壁位于机体前部，第二侧壁和第三侧壁位于该第一侧壁的两侧；The unmanned aerial vehicle according to claim 42, wherein the fuselage comprises a first side wall, a second side wall, and a third side wall, the first side wall is located at the front of the fuselage, the second side wall and The third side wall is located on both sides of the first side wall;
    其中，所述第一出风部开设于所述第一侧壁，所述第二出风部开设于所述第二侧壁，所述第三出风部开设于所述第三侧壁。The first air outlet is provided on the first side wall, the second air outlet is provided on the second side wall, and the third air outlet is provided on the third side wall.
  44. 根据权利要求42或43所述的无人飞行器，其特征在于，所述第一出风部和/或所述第二出风部和/或所述第三出风部分别包括多个。The unmanned aerial vehicle according to claim 42 or 43, wherein each of the first air outlet portion and / or the second air outlet portion and / or the third air outlet portion includes a plurality.
  45. 根据权利要求41所述的无人飞行器，其特征在于，每个出风部包括多个出风孔。The unmanned aerial vehicle according to claim 41, wherein each air outlet includes a plurality of air outlets.
  46. 根据权利要求36所述的无人飞行器，其特征在于，所述散热组件与所述电路板相连接。The unmanned aerial vehicle according to claim 36, wherein the heat dissipation component is connected to the circuit board.
  47. 根据权利要求46所述的无人飞行器，其特征在于，所述风扇包括外壳和设置在外壳上的扇叶；The unmanned aerial vehicle according to claim 46, wherein the fan comprises a casing and fan blades provided on the casing;
    所述外壳与所述主体部相连接，并与所述电路板相连接。The casing is connected to the main body portion, and is connected to the circuit board.
  48. 根据权利要求47所述的无人飞行器，其特征在于，所述散热组件还包括减震元件，所述减震元件设置于所述外壳和所述电路板之间。The unmanned aerial vehicle according to claim 47, wherein the heat dissipation component further comprises a shock absorbing element, and the shock absorbing element is disposed between the housing and the circuit board.
  49. 根据权利要求48所述的无人飞行器，其特征在于，所述主体部的一部分位于所述风扇的外壳和所述电路板之间，所述减震元件设置于所述主体部和所述风扇的外壳之间。The unmanned aerial vehicle according to claim 48, wherein a part of the main body portion is located between a casing of the fan and the circuit board, and the damping element is provided between the main body portion and the fan Between the shells.
  50. 根据权利要求49所述的无人飞行器，其特征在于，所述电路板设有定位部，所述外壳设有固定部，所述主体部上设有第一安装部；The unmanned aerial vehicle according to claim 49, wherein the circuit board is provided with a positioning portion, the housing is provided with a fixing portion, and the main body portion is provided with a first mounting portion;
    所述定位部与所述第一安装部插接连接，所述第一安装部与所述固定部连接；The positioning portion is plug-in connected to the first mounting portion, and the first mounting portion is connected to the fixing portion;
    所述减震元件设置于所述第一安装部和所述固定部之间。The damping element is disposed between the first mounting portion and the fixing portion.
  51. 根据权利要求50所述的无人飞行器，其特征在于，所述减震元件套设于所述第一安装部。The unmanned aerial vehicle according to claim 50, wherein the shock absorbing element is sleeved on the first mounting portion.
  52. 根据权利要求50或51所述的无人飞行器，其特征在于，所述散热组件还包括与所述主体部配合的用于密封所述鳍片区域和所述出风区域的盖体。The unmanned aerial vehicle according to claim 50 or 51, wherein the heat dissipating component further comprises a cover body matched with the main body portion for sealing the fin area and the air outlet area.
  53. 根据权利要求52所述的无人飞行器，其特征在于，所述盖体上设有第二安装部；The unmanned aerial vehicle according to claim 52, wherein a second mounting portion is provided on the cover;
    所述第一安装部穿设所述固定部后，与所述第二安装部固定连接。After the first mounting portion passes through the fixing portion, it is fixedly connected to the second mounting portion.
  54. 根据权利要求53所述的无人飞行器，其特征在于，所述散热组件还包括紧固件，所述紧固件将所述第二安装部固定在所述第一安装部上。The unmanned aerial vehicle according to claim 53, wherein the heat dissipation assembly further comprises a fastener, the fastener fixing the second mounting portion to the first mounting portion.
  55. 根据权利要求50所述的无人飞行器，其特征在于，所述固定部包括两个，设置于所述外壳的两侧。The unmanned aerial vehicle according to claim 50, wherein the fixing portion includes two and is disposed on both sides of the casing.
  56. 根据权利要求48所述的无人飞行器，其特征在于，所述减震元件为弹性件。The unmanned aerial vehicle according to claim 48, wherein the shock absorbing element is an elastic member.
  57. 根据权利要求47所述的无人飞行器，其特征在于，所述外壳为导热件。The unmanned aerial vehicle according to claim 47, wherein the housing is a thermally conductive member.
  58. 根据权利要求36所述的无人飞行器，其特征在于，所述电路板设有多个发热的功能元件，所述电路板包括第一区域、第二区域和第三区域，所述散热组件的风扇与所述第一区域配合，鳍片区域与所述第二区域配合，出风区域与所述第三区域配合。The unmanned aerial vehicle according to claim 36, wherein the circuit board is provided with a plurality of heat-generating functional elements, and the circuit board includes a first region, a second region, and a third region, The fan cooperates with the first area, the fin area cooperates with the second area, and the air outlet area cooperates with the third area.
  59. 根据权利要求58所述的无人飞行器，其特征在于，所述出风区域的出风口对准或靠近所述第三区域。The unmanned aerial vehicle according to claim 58, wherein the air outlet of the air outlet area is aligned with or close to the third area.
  60. 根据权利要求58所述的无人飞行器，其特征在于，所述风扇为导热材料制成并与所述电路板的第一区域接触以对所述第一区域产生的热量进行导热并将热量传导至散热件；及/或The unmanned aerial vehicle according to claim 58, wherein the fan is made of a thermally conductive material and is in contact with a first region of the circuit board to conduct heat and conduct heat from the first region. To the heat sink; and / or
    所述散热件的鳍片区域与所述电路板的第二区域接触以对所述第二区域产生的热量进行导热并将热量传导至出风区域。The fin region of the heat sink is in contact with the second region of the circuit board to conduct heat from the second region and conduct the heat to the air outlet region.
  61. 根据权利要求58所述的无人飞行器，其特征在于，所述功能元件为芯片。The unmanned aerial vehicle according to claim 58, wherein the functional element is a chip.
PCT/CN2018/092894 2018-06-26 2018-06-26 Heat dissipating assembly, and circuit board assembly and unmanned aerial vehicle having the heat dissipating assembly WO2020000189A1 (en)

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CN201880012031.5A CN110313225B (en) 2018-06-26 2018-06-26 Heat dissipation assembly, circuit board assembly with same and unmanned aerial vehicle
PCT/CN2018/092894 WO2020000189A1 (en) 2018-06-26 2018-06-26 Heat dissipating assembly, and circuit board assembly and unmanned aerial vehicle having the heat dissipating assembly

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