九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置， 元件進行散熱之散熱裝置。及—種用於為電子 【先前技術】 諸如電腦中央處理哭卜抹 -,,. τ六蜒埋„。北橋晶片、顯卡等高功 几件在運行時會産味夫旦旦 效地料此古 ！ ’這些熱量如果不能被有 -政去，將直接導致溫度急劇上升，而嚴重影 凡件的Μ運行。為此，需要散㈣置來對這些^子元件 散熱，傳統之散熱裝置通常包括散熱器以及置於散献 盗側^風扇，該風扇提供強制氣流用以增強散熱效果。 。目别風扇固定於散熱器上之方法一般採用一固定於散 熱器上之風扇固定件’通過風扇與風扇固定件鎖合從而將 几扇口疋於政熱器上。例如美國專利第6，％8,536及 7风236號便揭示了這種利用風扇固定架固定風扇的方 式。由於這種固定風扇之方式需要額外、成型風扇固定件， 不僅工序夕、浪費材料而且組裝不方便，隨著電腦朝向越 來越j 1化的方向發展，省去不必要的元件以適應電腦内 部越來越小的空間亦是發展的一種趨勢。 【發明内容】 有雲於此’有必要提供一種結構簡單、無需其他輔助 元件固定風扇的散熱裝置。 種散熱裝置’包括一導熱板、與導熱板連接之複數 散熱鰭片及安裝於該等散妖妹 Μ φ ^ Σ , “一，曰片上之一風扇，該等散熱鳍 7 Μ散熱H片上形成有扣片，風扇連接至該扣 月，進而相對該等散熱鰭片垂直固定。 ^述散熱裝置中，採用於散熱籍片上形成扣片用以固 疋$羽’ k種固定風扇之方式不僅簡單而且節省材料，即 :需額外成型單獨固定風扇之固定元件，於此，有必 要提供一種可安裝於不同架構主機板上之散熱裝置。 【實施方式】 請同時參照圖1和圖2’揭示本發明第一實施例之一散 熱裝置，該散熱裝置安裝於-電路板（圖未示）用以散發電路 板上之中央處理器産生的熱量，該散熱裝置包括一散熱器 組合10及組裝於該散熱器組合1〇上之風扇2〇。 一該散熱器組合10包括一導熱板12,一第一鰭片組14, 一第二鰭片組18及用以將導熱板12、第一鰭片組14和第 二鰭片組18連接在一起的並行排列之三熱管16，其中： 該導熱板12具有一底面（圖未標）和一頂面122，該底 面與電路板上之中央處理器接觸以吸收熱量，該頂面U設 有二凹槽124,二安裝架13貼附於導熱板12的底面的相對 兩端’每一安裝架13相對兩端凸伸有凸耳132。導熱板12 通過穿過凸耳132之四緊固件50與電路板連接，並與中央 處理器保持緊密接觸。 母一熱管16呈U形設置包括一水平的吸熱段及從 吸熱段160兩端豎直向上延伸的二平行放熱段162,該吸熱 段160收谷於導熱板12之凹槽124内以吸收來自導熱板12 1320883 -之熱量，該二放熱段162之其中一放熱段162貫穿第一鰭 •片組14，另一放熱段162則貫穿第二鰭片組18，使該第一及 第二鰭片組14、18並列置於熱管16之放熱段162上。 該第一、第二鰭片組14、18分別由複數相互扣合之第 一、第二散熱鰭片（圖未標）自上而下堆疊排列而成，每一第 一、第二散熱鰭片分別具有一與導熱板12平行之第一、第 二本體140、180，每兩相鄰第一、第二散熱鰭片之第一、 第二本體140之間形成沿前後方向延伸的流道。第一、第 B二本體140、180上設有貫穿孔142、182，這些貫穿孔142、 182用以收容熱管16之放熱段162，貫穿孔142、182邊緣 延伸設有環壁144、184，以增大第一、第二散熱鰭片與放 熱段162接觸表面積。第一鰭片組14具有二散熱鰭片146、 -147,其中散熱鰭片146位於第一鰭片組14最上方，散熱 鰭片147位於第一鰭片組14的最下方，該二散熱鰭片146、 147共同作用以固定風扇20到第一鰭片組14 一側。在本實 鲁施例中風扇置於第一鰭片組14 一侧且夾置於第一及第二鰭 片組14、18之間。位於頂部及底部之散熱鰭片146、147 具有大致相同之結構，分別包括一與其他第一鰭片組14中 之其他第一散熱鰭片之第一本體140結構相同之第一本體 1460、1470。頂部之散熱鰭片146朝向風扇20之二相對末 端垂直向上彎折形成有一對扣片1462,底部之散熱鰭片147 朝向風扇20之二相對末端垂直向下彎折形成有一對扣片 1472。扣片1462、1472對應於風扇20之四角落且設有相 應之螺紋孔1464、1474。 8 1320883 風扇20之外形大致呈方形設置，其包括帶有開口之前後二平板 • 22、24，其中平板22朝向第一鰭片組14，平板24朝向第 二籍片組18。 該風扇20安裝至散熱器組合10上時，首先風扇20插 入置組裝好的散熱器組合10的第一及第二鰭片組14、18 之間；四螺絲30穿過平板22之四角落進而與第一鰭片組 14之扣片1462、1472上的螺紋孔1464、1474螺鎖；這樣 風扇20便穩固地安裝於第一鰭片組14的一側。當風扇20 *工作時，風扇20産生的氣流同時吹向其兩側的第一及第二 鰭片組14、18，進而將中央處理器産生的熱量快速地從第 一及第二鰭片組14、18散發。 ' 請同時參閱圖3及圖4,揭示本發明第二實施例之散熱 裝置，該散熱裝置包括一散熱器組合l〇a及安裝於散熱器 組合10a —側之風扇20a。 該散熱器組合l〇a包括一導熱板12a、一第一鰭片組 鲁14a、一第二鰭片組18a及連接導熱板12a、第一、二鰭片 組14a、18a之三U形熱管16a。該散熱器組合10a之大部 分元件與第一實施例中之對應元件構造相同，不同的元件 為第二鰭片組18a。該導熱板12a頂部設有三並行的直的溝 槽124a，每一熱管16a包括一水平的吸熱段160a及自吸熱 段160a兩端向上延伸設置之二平行放熱段162a，其中該吸 熱段160a焊接收容於導熱板12a之溝槽124a中。第一鰭片 組14a包括複數第一散熱鰭片（圖未標），每一第一散熱鰭片 具有一平行於導熱板12a之第一本體140a，該第一本體140a 1320883 -上設有供熱管16a之放熱段162a穿設之貫穿孔142a。該第 -一鰭片組14a具有二散熱鰭片146a、147a，其中散熱鰭片 146a位於第一鰭片組14a最上方，鰭片147a位於第一鰭片 組14a的最下方，該二散熱鰭片146a、147a共同作用以固 定風扇20a到第一鰭片組14a —側。位於頂部及底部之散 熱鰭片146a、147a具有大致相同之結構，分別包括一與其 他第一鰭片組14a中之其他第一散熱鰭片之第一本體140a 結構相同之第一本體1460a、1470a。頂部之散熱鰭片146a ®朝向風扇20之二相對末端垂直向上彎折形成有一對扣片 1462a，底部之散熱鰭片147a朝向風扇20之二相對末端垂 直向下彎折形成有一對扣片1472a。扣片1462a、1472a對 應於風扇20a之四角落且設有相應之螺紋孔1464a、1474a。 '該底部之散熱鰭片147a之本體1470a與扣片1472a相對一 側之邊緣向下彎折延伸出一導流板1471a以便將風扇20a 産生之部分氣流導向中央處理器周圍之其他電子元件上， 鲁該導流板1471a呈弧形彎曲；本體1470a另外相對兩側邊 緣各向下彎折延伸出一第一和第二擋風板1473a、1475a， 該第一和第二擋風板1473a、1475a與本體1470a垂直。請 同時參閱圖5,該第二擋風板1475a沿前後方向的長度比第 一擋風板1473a短，一隔板1476a從第二擋風板1475a靠近 導流板1471a的一侧向第一擋風板1473a方向垂直延伸設 置。第一擋風板1473a可阻止風扇20a産生的氣流向側面 發散。 該第二鰭片組18a可由鋁等材料一體擠製成形並形成 1320883 有複數沿前後方向延伸的流道，該第二散熱體18a包括複 數與第一散熱鰭片相互垂直之第二散熱鰭片（圖未標），第二 散熱鰭片之底部與熱管16a之吸熱段160a焊接連接，第二 ‘散熱鰭片之頂部與第一鰭片組14a之底部散熱鰭片147a之 本體1470a底面焊接，如此，熱管16a吸收之熱量便可迅 速傳至第二鰭片組18a上。第一鰭片組沿溝槽124a延伸方 向之長度大於導熱板12a對應方向之長度使得第二擋風板 1475a和該隔板1476a之一部分定位於導熱板12a之側面空 ®間，隔板1476a之自由端與第二鰭片組18a相應之側面貼 近，隔板1476a之底端與導熱板12a之頂面貼合，如此以 來，流經第二擋風板1475a和第二鰭片組18a側面之間的 氣流被限制沿前後方向流動，由此風扇20a産生的部分氣 流便可直接被導向位元於中央處理器周圍的其他電子元件 上。 本發明第二實施例中之風扇20a組裝至散熱器組合10a 籲的過程與第一實施例相似，散熱器組合l〇a組裝完畢後， 將風扇20a置於第一鰭片組14a帶有扣片1462a、1472a的 一側，使風扇20a之四角落對應於該扣片1462a、1472a ; 然後通過四螺絲30a穿過風扇20a相應之四角落進而與第 一鰭片組14a之扣片1462a、1472a上之螺紋孔1464a、1474a 螺鎖；這樣風扇20a便穩固地安裝於第一鰭片組14a之一 侧。 本發明通過於散熱鰭片上一體成型扣片，使扣片與風 扇配合從而將風扇穩固安裝於其上；如此設計，既簡單實 11 1320883 用、又節約材料和空間，不必單獨成型將風扇固定於散埶 器上的其他固定件，亦不需要佔據額外之空間。 可以理解地，本發明之第一散熱鰭片組亦可垂直形成 於導熱板上’只要第一散熱鰭片組的至少一散熱鰭片上形 成有用以與風扇配合且固定風扇之結構均為本發明之實施 方式。 綜上所述，本發明符合發明專利要件，爰依法提出專 籲利申明。惟，以上該者僅為本發明之較佳實施例，舉凡熟 心本案技藝之人士’在爰依本發明精神所作之等效修部或 邊化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明第一實施例中散熱裝置之立體組合圖。 圖2係圖1之立體分解圖。 圖3係本發明第二實施例中散熱裝置之立體組合圖。 圖4係圖3之立體分解圖。 鲁 圖5係圖4中一散熱鰭片之立體圖。 【主要元件符號說明】 散熱器組合10、l〇a 頂面 122 安裝架 13 導熱板 12、12a 凹槽 124、124a 凸耳 132 第一本體 140、1460、1470、140a、1460a、1470a 貫穿孔 142、182、142a 環壁 144、184 第一轉片組14、14a 導流板1471a 12 1320883 散熱鰭片 146 、 147 、 146a 、 147a 扣片 1462 、 1472 、1462a 、 1472a 螺紋孔 1464 、 1474 、1464a、 1474a 第一擋風板1473a 第二擋風板1475a 隔板 1476a 敎管 *、》、 16 、 16a 吸熱段 160 、 160a 放熱段 162 ' 162a 第二縛片 組 18 、 18a 第二本] It 180 風扇 20 、 20a 平板 22 > 24 螺絲 30 、 30a 緊固件 50 13IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device in which a component dissipates heat. And - for the use of electronic [prior art] such as computer central processing crying wipe -,,. τ six 蜒 buried „. Northbridge wafers, graphics cards and other high-performance pieces will produce a good taste during operation Ancient! 'If these heats can't be taken--government, it will directly lead to a sharp rise in temperature, and it will seriously affect the operation of the pieces. For this reason, it is necessary to dissipate heat to these components, and the conventional heat sink usually includes The heat sink and the fan are placed on the side of the fan. The fan provides forced airflow to enhance the heat dissipation effect. The method of fixing the fan to the heat sink generally adopts a fan fixing member fixed on the heat sink 'through the fan and The fan fixtures are locked to place a few ports on the politician. For example, U.S. Patent No. 6, No. 8, 536, and No. 236, No. 236, discloses the manner in which the fan is fixed by a fan holder. The method requires additional, molded fan fixtures, which not only saves the process, wastes materials, but also is inconvenient to assemble. As the computer moves toward more and more j1, unnecessary components are omitted to fit the computer. The smaller and smaller space is also a trend of development. [Summary] There is a need to provide a heat sink with a simple structure and no need for other auxiliary components to fix the fan. The heat sink includes a heat conducting plate, and The heat radiating plate is connected to the plurality of heat radiating fins and is mounted on the floating monster Μ φ ^ Σ , "one, one of the fans on the cymbal, the heat radiating fins 7 Μ the heat sinking H forms a buckle, the fan is connected to the buckle And then fixed perpendicularly to the heat dissipation fins. In the heat dissipating device, it is not only simple but also saves material to form a fastening piece on the heat dissipating piece for fixing the feathers, and the material is saved, that is, it is necessary to separately form a fixing component for separately fixing the fan. A heat sink that can be mounted on a motherboard of a different architecture is provided. [Embodiment] Referring to FIG. 1 and FIG. 2', a heat dissipating device according to a first embodiment of the present invention is disclosed. The heat dissipating device is mounted on a circuit board (not shown) for distributing a central processor generated on a circuit board. The heat sink includes a heat sink assembly 10 and a fan 2〇 assembled to the heat sink assembly 1〇. The heat sink assembly 10 includes a heat conducting plate 12, a first fin set 14, a second fin set 18, and a heat sink 12, a first fin set 14 and a second fin set 18 connected thereto. The three heat pipes 16 are arranged in parallel, wherein: the heat conducting plate 12 has a bottom surface (not labeled) and a top surface 122, the bottom surface is in contact with a central processing unit on the circuit board to absorb heat, and the top surface U is provided Two recesses 124, two mounting brackets 13 are attached to opposite ends of the bottom surface of the heat conducting plate 12. A lug 132 is protruded from opposite ends of each mounting bracket 13. The thermally conductive plate 12 is coupled to the circuit board by four fasteners 50 that pass through the lugs 132 and remain in intimate contact with the central processor. The female heat pipe 16 has a U-shaped arrangement including a horizontal heat absorption section and two parallel heat release sections 162 extending vertically upward from both ends of the heat absorption section 160. The heat absorption section 160 is received in the groove 124 of the heat conduction plate 12 to absorb The heat-dissipating plate 12 1320883 - the heat-dissipating portion 162 of the two heat-dissipating segments 162 penetrates the first fin-plate group 14 , and the other heat-dissipating portion 162 extends through the second fin group 18 to make the first and second fins The set of sheets 14, 18 are juxtaposed on the heat release section 162 of the heat pipe 16. The first and second fin sets 14 and 18 are respectively arranged by stacking a plurality of first and second heat dissipating fins (not labeled) from top to bottom, and each of the first and second heat dissipating fins Each of the first and second bodies 140 and 180 is parallel to the heat conducting plate 12, and a flow path extending in the front-rear direction is formed between the first and second bodies 140 of each of the two adjacent first and second heat radiating fins. . The through holes 142 and 182 are disposed in the first and second bodies 140 and 180. The through holes 142 and 182 are used for receiving the heat releasing portion 162 of the heat pipe 16, and the annular walls 144 and 184 are extending from the edges of the through holes 142 and 182. In order to increase the surface area of the first and second heat dissipation fins and the heat release section 162. The first fin group 14 has two heat dissipation fins 146 and -147 , wherein the heat dissipation fins 146 are located at the top of the first fin group 14 , and the heat dissipation fins 147 are located at the bottom of the first fin group 14 . The sheets 146, 147 cooperate to secure the fan 20 to one side of the first fin set 14. In the present embodiment, the fan is placed on one side of the first fin set 14 and sandwiched between the first and second fin sets 14, 18. The heat dissipation fins 146 and 147 at the top and the bottom have substantially the same structure, and respectively include a first body 1460, 1470 having the same structure as the first body 140 of the other first heat dissipation fins of the other first fin groups 14 . . The top fins 146 are bent upwardly opposite the opposite ends of the fan 20 to form a pair of cleats 1462. The bottom fins 147 are bent downwardly toward the opposite ends of the fan 20 to form a pair of cleats 1472. The cleats 1462, 1472 correspond to the four corners of the fan 20 and are provided with corresponding threaded holes 1464, 1474. 8 1320883 The fan 20 is generally square in shape and includes a second plate 22, 24 with an opening, wherein the plate 22 faces the first fin set 14 and the plate 24 faces the second set of sheets 18. When the fan 20 is mounted on the heat sink assembly 10, the fan 20 is first inserted between the first and second fin sets 14, 18 of the assembled heat sink assembly 10; the four screws 30 pass through the four corners of the flat plate 22 The threaded holes 1464, 1474 on the cleats 1462, 1472 of the first fin set 14 are screwed; thus the fan 20 is securely mounted to one side of the first fin set 14. When the fan 20* is in operation, the airflow generated by the fan 20 is simultaneously blown to the first and second fin sets 14, 18 on both sides thereof, thereby rapidly generating heat generated by the central processor from the first and second fin sets. 14, 18 distributed. Referring to FIG. 3 and FIG. 4 simultaneously, a heat dissipating device according to a second embodiment of the present invention is disclosed. The heat dissipating device includes a heat sink assembly 10a and a fan 20a mounted on the side of the heat sink assembly 10a. The heat sink assembly 10a includes a heat conducting plate 12a, a first fin set 14a, a second fin set 18a, and a triple U-shaped heat pipe connecting the heat conducting plate 12a and the first and second fin sets 14a and 18a. 16a. Most of the components of the heat sink assembly 10a are identical in construction to the corresponding components of the first embodiment, and the different components are the second fin set 18a. The top of the heat conducting plate 12a is provided with three parallel straight grooves 124a. Each heat pipe 16a includes a horizontal heat absorbing section 160a and two parallel heat releasing sections 162a extending upward from opposite ends of the heat absorbing section 160a. The heat absorbing section 160a is welded and received. In the groove 124a of the heat conducting plate 12a. The first fin group 14a includes a plurality of first heat dissipating fins (not labeled), each of the first heat dissipating fins has a first body 140a parallel to the heat conducting plate 12a, and the first body 140a 1320883 is provided with The heat releasing portion 162a of the heat pipe 16a is bored through the through hole 142a. The first fin group 14a has two heat dissipation fins 146a and 147a, wherein the heat dissipation fins 146a are located at the top of the first fin group 14a, and the fins 147a are located at the bottom of the first fin group 14a. The sheets 146a, 147a cooperate to secure the fan 20a to the side of the first fin set 14a. The heat dissipating fins 146a and 147a at the top and bottom have substantially the same structure, and respectively include a first body 1460a, 1470a having the same structure as the first body 140a of the other first fins of the other first fin group 14a. . The top heat dissipation fins 146a® are vertically bent upwardly toward the opposite ends of the fan 20 to form a pair of buckle pieces 1462a, and the bottom heat dissipation fins 147a are bent downwardly toward the opposite ends of the fan 20 to form a pair of buckle pieces 1472a. The cleats 1462a, 1472a correspond to the four corners of the fan 20a and are provided with corresponding threaded holes 1464a, 1474a. The body 1470a of the bottom heat-dissipating fin 147a and the edge of the opposite side of the buckle 1472a are bent downwardly to extend a baffle 1471a to direct a part of the airflow generated by the fan 20a to other electronic components around the central processing unit. The baffle 1471a is curved in a curved shape; the body 1470a is further bent downwardly to extend a first and second wind deflectors 1473a, 1475a, and the first and second wind deflectors 1473a, 1475a It is perpendicular to the body 1470a. Referring to FIG. 5 simultaneously, the length of the second wind deflector 1475a in the front-rear direction is shorter than that of the first wind deflector 1473a, and a partition plate 1476a is from the side of the second wind deflector 1475a adjacent to the deflector 1471a to the first block. The wind plate 1473a extends vertically. The first wind deflector 1473a prevents the airflow generated by the fan 20a from diverging to the side. The second fin group 18a may be integrally extruded from a material such as aluminum and formed into a 1320883 having a plurality of flow paths extending in the front-rear direction. The second heat sink 18a includes a plurality of second heat dissipating fins perpendicular to the first heat dissipating fins. (not shown), the bottom of the second heat dissipation fin is soldered to the heat absorption section 160a of the heat pipe 16a, and the top of the second heat dissipation fin is welded to the bottom surface of the body 1470a of the bottom heat dissipation fin 147a of the first fin set 14a. Thus, the heat absorbed by the heat pipe 16a can be quickly transferred to the second fin group 18a. The length of the first fin group extending along the groove 124a is greater than the length of the corresponding direction of the heat conducting plate 12a such that one of the second wind deflector 1475a and the partition 1476a is positioned between the side walls of the heat conducting plate 12a, and the partition 1476a The free end is adjacent to the corresponding side of the second fin set 18a, and the bottom end of the partition 1476a is in contact with the top surface of the heat conducting plate 12a, and thus flows through the side of the second wind deflector 1475a and the second fin set 18a. The air flow between them is restricted to flow in the front-rear direction, whereby part of the air flow generated by the fan 20a can be directly directed to the other electronic components around the central processing unit. The process of assembling the fan 20a to the heat sink assembly 10a in the second embodiment of the present invention is similar to that of the first embodiment. After the heat sink assembly 10a is assembled, the fan 20a is placed on the first fin set 14a with a buckle. One side of the strips 1462a, 1472a, such that the four corners of the fan 20a correspond to the cleats 1462a, 1472a; then through the four corners 30a through the corresponding four corners of the fan 20a and then the cleats 1462a, 1472a of the first fin set 14a The threaded holes 1464a, 1474a are screwed; thus the fan 20a is securely mounted to one side of the first fin set 14a. The invention integrally forms the buckle on the heat dissipation fin, so that the buckle and the fan cooperate to securely mount the fan thereon; the design is simple and practical, and saves material and space, and does not need to be separately formed to fix the fan to the fan. The other fixtures on the diffuser do not need to occupy extra space. It can be understood that the first heat dissipation fin group of the present invention can also be vertically formed on the heat conduction plate. The structure of the at least one heat dissipation fin of the first heat dissipation fin group is formed to cooperate with the fan and fix the fan. Implementation method. In summary, the present invention complies with the requirements of the invention patent, and arbitrarily proposes a special claim. However, the above is only a preferred embodiment of the present invention, and those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat dissipating device in a first embodiment of the present invention. 2 is an exploded perspective view of FIG. 1. Figure 3 is a perspective assembled view of a heat sink in a second embodiment of the present invention. Figure 4 is an exploded perspective view of Figure 3. Lutu 5 is a perspective view of a heat sink fin in FIG. [Main component symbol description] Heat sink assembly 10, l〇 top surface 122 Mounting bracket 13 heat conducting plate 12, 12a Groove 124, 124a Lug 132 First body 140, 1460, 1470, 140a, 1460a, 1470a through hole 142 182, 142a ring wall 144, 184 first rotor set 14, 14a deflector 1471a 12 1320883 heat sink fins 146, 147, 146a, 147a cleats 1462, 1472, 1462a, 1472a threaded holes 1464, 1474, 1464a, 1474a First windshield 1473a Second windshield 1475a Separator 1476a Manifold*, ”, 16, 16a Heat absorbing section 160, 160a Heat release section 162 ' 162a Second patch set 18, 18a Second] It 180 Fan 20, 20a flat 22 > 24 screws 30, 30a fasteners 50 13