TWI395953B - Socket and test probe thereof - Google Patents
Socket and test probe thereof Download PDFInfo
- Publication number
- TWI395953B TWI395953B TW98103630A TW98103630A TWI395953B TW I395953 B TWI395953 B TW I395953B TW 98103630 A TW98103630 A TW 98103630A TW 98103630 A TW98103630 A TW 98103630A TW I395953 B TWI395953 B TW I395953B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- test
- test probe
- base
- bending
- Prior art date
Links
Description
本發明係關於一種測試探針及探針座，特別是關於一種用於積體電路元件封裝測試的測試探針及探針座。The present invention relates to a test probe and probe holder, and more particularly to a test probe and probe holder for integrated circuit component package testing.
在進行積體電路(IC)元件的封裝測試時，傳統的測試探針，如美國專利第5,306,167號中所揭露，在進行下壓測試時，因為探針頭的位移行程太小，在待測積體電路元件與測試探針之間，或是測試探針與所接觸之印刷電路板之間等各接觸點的累積應力很大，長時間反覆測試所累積的應力會造成印刷電路板的應力變形，進而導致測試探針或是印刷電路板損壞，降低了測試效率、增加生產成本。In the case of a package test for an integrated circuit (IC) component, a conventional test probe, as disclosed in U.S. Patent No. 5,306,167, is incorporated in the down-pressure test because the displacement of the probe head is too small to be tested. The cumulative stress at each contact point between the integrated circuit component and the test probe, or between the test probe and the printed circuit board that is in contact with it is large, and the stress accumulated over a long period of time may cause stress on the printed circuit board. Deformation, which in turn leads to damage to the test probe or printed circuit board, reducing test efficiency and increasing production costs.
此外，美國專利第5,634,801號提出另一種測試探針，具有呈S形結構的測試探針本體，以及嵌設於S形結構彎折部之中的彈性元件。在進行下壓測試時，由於測試探針的S形結構且為斜放設置，將會與其接觸的印刷電路板有平行方向的摩擦力產生，所以在進行反覆測試之後，測試探針與其所接觸的印刷電路板即會因反覆摩擦而雙雙導致磨損消耗。In addition, U.S. Patent No. 5,634,801 teaches another test probe having a test probe body having an S-shaped configuration and an elastic member embedded in the bent portion of the S-shaped structure. During the down-pressure test, due to the S-shaped structure of the test probe and the oblique arrangement, the printed circuit board that is in contact with it has a frictional force in parallel direction, so after the repeated test, the test probe is in contact with it. The printed circuit board will cause wear and tear due to repeated friction.
此外，傳統的測試探針，亦有採取嵌設於射出成型所製成的探針座中的設置方式，如美國專利第6,046,597號中所揭露。但當採用此種設置形式之探針座，在某個或某些探針損壞時，要進行局部更換或修復相當困難。且此類探針並非一體成形，其包含了套筒、彈簧與探針頭等相關組件，在組件相接的介面具有較高的電阻值，探針整體的阻抗較高，不利於高頻測試。In addition, conventional test probes are also provided in a manner that is embedded in a probe holder made by injection molding, as disclosed in U.S. Patent No. 6,046,597. However, when using this type of probe holder, it is quite difficult to perform partial replacement or repair when one or some of the probes are damaged. And such probes are not integrally formed, and include related components such as a sleeve, a spring and a probe head, and have a high resistance value in the interface where the components are connected, and the overall impedance of the probe is high, which is disadvantageous for high frequency testing. .
因此，如何解決上述傳統測試探針之缺點，實為業界的迫切課題。Therefore, how to solve the shortcomings of the above-mentioned conventional test probes is an urgent issue in the industry.
為克服上述缺點，本發明係提供一種測試探針，具有一體成型之彈性的金屬本體。金屬本體包含第一彎折部以及第二彎折部，且測試探針由第一彎折部的一端延伸出第一探針部，可供接觸於待測之積體電路元件，另外，測試探針由第二彎折部相反於第一彎折部的另一端延伸出懸臂狀的第二探針部，可供接觸於印刷電路板。此外，第一彎折部的彎折方向相同於第二彎折部的彎折方向。In order to overcome the above disadvantages, the present invention provides a test probe having an integrally formed elastic metal body. The metal body includes a first bent portion and a second bent portion, and the test probe extends from one end of the first bent portion to the first probe portion for contacting the integrated circuit component to be tested, and further, testing The probe extends from the other end of the first bent portion opposite to the other end of the first bent portion to a cantilever-shaped second probe portion for contacting the printed circuit board. Further, the bending direction of the first bent portion is the same as the bending direction of the second bent portion.
因此，本發明的主要目的在於提供一種測試探針，由於具有一體成形之結構，相較習知非一體成形構造的測試探針，具有較低的阻抗，在進行積體電路元件測試時，可避免訊號衰減所導致的測試誤差，且利於高頻測試。SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a test probe which, since it has an integrally formed structure, has a lower impedance than a test probe of a conventional non-integrally formed configuration, and can be used for testing integrated circuit components. Avoid test errors caused by signal attenuation and facilitate high frequency testing.
本發明的另一目的在於提供一種測試探針，具有懸臂樑結構，進行積體電路元件測試時，與待測積體電路元件及印刷電路板的接觸係以懸臂樑的末端作為接觸，接觸壓力較小，可避免因為測試時的應力累積所導致的印刷電路板損壞。Another object of the present invention is to provide a test probe having a cantilever structure. When testing an integrated circuit component, the contact with the integrated circuit component and the printed circuit board is contacted with the end of the cantilever beam, and the contact pressure is applied. Smaller to avoid damage to printed circuit boards due to stress build-up during testing.
本發明亦提供一種探針座，包含有座體、複數個測試探針，以及至少一個第一蓋板與至少一個第二蓋板。其中，探針座的座體頂面設有複數個第一開槽，底面設有複數個第二開槽，第一蓋板蓋設於複數個第一開槽上，第二蓋板蓋設於複數個第二開槽上，測試探針的第一探針部從座體的第一開槽穿設而出，測試探針的第二探針部，從座體的第二開槽穿設而出。The invention also provides a probe holder comprising a seat body, a plurality of test probes, and at least one first cover plate and at least one second cover plate. The top surface of the base of the probe base is provided with a plurality of first slots, and the bottom surface is provided with a plurality of second slots, the first cover is disposed on the plurality of first slots, and the second cover is disposed The first probe portion of the test probe is pierced from the first slot of the base body on the plurality of second slots, and the second probe portion of the test probe is worn from the second slot of the base Set it out.
因此，本發明的另一目的在於提供一種探針座，其所使用的測試探針具有一體成形之結構，相較習知非一體成形構造的測試探針，具有較低的阻抗，在進行積體電路元件測試時，可避免訊號衰減所導致的測試誤差，且利於高頻測試。Accordingly, it is another object of the present invention to provide a probe holder having a test probe having an integrally formed structure which has a lower impedance than a test probe of a conventional non-integrally formed configuration. When the body circuit component is tested, the test error caused by signal attenuation can be avoided, and the high frequency test is facilitated.
本發明的另一目的在於提供一種探針座，由於具有懸臂樑結構的測試探針，進行積體電路元件測試時，與待測積體電路元件及印刷電路板的接觸係以懸臂樑的末端作為接觸，接觸壓力較小，可避免因為測試時的應力累積所導致的印刷電路板損壞。Another object of the present invention is to provide a probe holder which is connected to the integrated circuit component to be tested and the printed circuit board by the end of the cantilever beam when testing the integrated circuit component due to the test probe having the cantilever structure. As a contact, the contact pressure is small, which avoids damage to the printed circuit board due to stress accumulation during testing.
本發明的又一目的在於提供一種探針座，其中所使用的測試探針損壞時，可以單獨地更換，不會因為單一測試探針的損壞而造成整體探針座無法使用。It is still another object of the present invention to provide a probe holder in which the test probe used can be replaced individually when damaged, without the entire probe holder being unusable due to damage of a single test probe.
本發明係揭露一種測試探針及探針座，其中利用到的積體電路元件基本測試程序及測試原理，均屬於該領域具有專業知識之人士所能輕易理解者，故以下文中之說明，不再作完整描述。而以下文中所對照之圖式，係表達與本創作特徵有關之結構示意，並未亦不需要依據實際尺寸完整繪製，合先敘明。The invention discloses a test probe and a probe base, wherein the basic test procedure and the test principle of the integrated circuit component used are all easily understood by those skilled in the field, so the following description does not A full description is given. The drawings in the following texts express the structural schematics related to the creative features, and do not need to be completely drawn according to the actual size.
請參考第1圖，係為本發明第一較佳實施例的測試探針示意圖。測試探針1具有一體成型之彈性的金屬本體11，金屬本體11具有第一彎折部111、第二彎折部112，以及第一彎折部111與第二彎折部112之間的連接結構113。測試探針1自第一彎折部111的一端延伸出第一探針部12，用以接觸預測試的積體電路元件3。另外，測試探針1從第二彎折部112相反於第一彎折部111的另一端延伸出懸臂狀的第二探針部13，用來接觸印刷電路板4，且第一彎折部111的彎折方向跟第二彎折部112的彎折方向相同。此外，在本實施例中，第一彎折部111與第二彎折部112之間的連接結構113係為直線狀，然此領域具有專業知識之人士均可知連接結構113可以是其他不同的形狀，例如弧形，以因應不同的設置需求。Please refer to FIG. 1 , which is a schematic diagram of a test probe according to a first preferred embodiment of the present invention. The test probe 1 has an integrally formed elastic metal body 11 having a first bent portion 111, a second bent portion 112, and a connection between the first bent portion 111 and the second bent portion 112. Structure 113. The test probe 1 extends from one end of the first bent portion 111 out of the first probe portion 12 for contacting the pre-tested integrated circuit component 3. In addition, the test probe 1 extends from the second bent portion 112 opposite to the other end of the first bent portion 111 to a cantilever-shaped second probe portion 13 for contacting the printed circuit board 4, and the first bent portion The bending direction of 111 is the same as the bending direction of the second bending portion 112. In addition, in the present embodiment, the connection structure 113 between the first bent portion 111 and the second bent portion 112 is linear, but those skilled in the art can know that the connection structure 113 can be different. Shapes, such as curved shapes, to accommodate different setup needs.
請繼續參考第1圖，第一探針部12的長度a小於第二探針部13的長度b。另外，第一探針部12亦可呈懸臂狀，使其更容易接觸積體電路元件3。為達方便接觸積體電路元件3與印刷電路板4的效果，第一彎折部111的彎折角度θ1大致上為90度，而第二彎折部112的彎折角度θ2會大於90度。此外，金屬本體11剖面形狀大致為矩形或圓形。採用此種設計的測試探針1整體結構近似ㄈ型，且由於具有一體成形的懸臂樑結構，故在封裝測試過程中，積體電路元件3施加在第一探針部12的力、及印刷電路板4施加在第二探針部13之力，皆由懸臂樑的彈性撓曲所吸收，具有極佳的緩衝效果，進而避免測試時因應力累積所導致的印刷電路板毀損。又，第一探針部12上可進一步包含有凹部121，以供測試探針1與其裝設之座體(未圖示)有更緊密的卡合，避免在測試時由於測試探針1的移動所導致的測試誤差，進而影響測試品質。Referring to FIG. 1 again, the length a of the first probe portion 12 is smaller than the length b of the second probe portion 13. Further, the first probe portion 12 may be cantilevered to make it easier to contact the integrated circuit component 3. In order to facilitate the contact between the integrated circuit component 3 and the printed circuit board 4, the bending angle θ1 of the first bending portion 111 is substantially 90 degrees, and the bending angle θ2 of the second bending portion 112 is greater than 90 degrees. . Further, the metal body 11 has a substantially rectangular or circular cross-sectional shape. The test probe 1 having such a design has an overall structure of approximately ㄈ type, and since it has an integrally formed cantilever beam structure, the force applied to the first probe portion 12 by the integrated circuit component 3 and printing during the package test are performed. The force exerted by the circuit board 4 on the second probe portion 13 is absorbed by the elastic deflection of the cantilever beam, and has an excellent buffering effect, thereby avoiding damage of the printed circuit board caused by stress accumulation during testing. Moreover, the first probe portion 12 may further include a recess portion 121 for tighter engagement of the test probe 1 with the mounted body (not shown) to avoid testing the probe 1 during testing. The test error caused by the movement, which in turn affects the quality of the test.
本發明除提供上述第一較佳實施例的測試探針之外，亦提供一種包含測試探針的探針座，其中測試探針的特徵構造係與上述第一較佳實施例大致相同，故在此不再贅述，以下僅就第二較佳實施例之特徵加以說明。In addition to the test probe of the first preferred embodiment, the present invention also provides a probe holder including a test probe, wherein the test probe has a characteristic structure which is substantially the same as that of the first preferred embodiment described above. It is not described herein anyway, and only the features of the second preferred embodiment will be described below.
請參考第2A圖，為本發明第二較佳實施例的探針座之示意圖。探針座2包含有座體21、複數個測試探針1、第一蓋板22，以及第二蓋板23。測試探針1所具有的元件及其特徵結構均與第一較佳實施例相同，其中第一蓋板22及第二蓋板23此處雖僅各設置一個，但此領域具有專業知識之人士均可知蓋板之設置數量，可視情況需要變更為兩個或兩個以上。Please refer to FIG. 2A, which is a schematic diagram of a probe holder according to a second preferred embodiment of the present invention. The probe holder 2 includes a seat body 21, a plurality of test probes 1, a first cover plate 22, and a second cover plate 23. The components of the test probe 1 and the features thereof are the same as those of the first preferred embodiment, wherein the first cover 22 and the second cover 23 are each provided only one, but those skilled in the art. It is known that the number of the cover plates can be changed to two or more depending on the situation.
請繼續參考第2B圖，為本發明第二較佳實施例的探針座***示意圖。如圖所示，座體21具有頂面211及底面212，在座體21的頂面211的四個側邊設有複數個第一開槽213，而在座體21的底面212的四個側邊則設有複數個第二開槽214。此外，第一蓋板22係蓋設於複數個第一開槽213上，第二蓋板23則蓋設於複數個第二開槽214上。Please refer to FIG. 2B for a schematic diagram of the explosion of the probe base according to the second preferred embodiment of the present invention. As shown, the base body 21 has a top surface 211 and a bottom surface 212. A plurality of first slots 213 are formed on four sides of the top surface 211 of the base body 21, and four sides of the bottom surface 212 of the base body 21 are provided. A plurality of second slots 214 are provided. In addition, the first cover plate 22 is disposed on the plurality of first slots 213, and the second cover plate 23 is disposed on the plurality of second slots 214.
當第一蓋板22、座體21、第二蓋板23，及各測試探針1組裝完成之後，測試探針1的第一探針部12係自座體21的第一開槽213穿設而出，而測試探針1之第二探針部13則自座體21的第二開槽214穿設而出。After the first cover 22, the base 21, the second cover 23, and the test probes 1 are assembled, the first probe portion 12 of the test probe 1 is worn from the first slot 213 of the base 21. The second probe portion 13 of the test probe 1 is pierced from the second slot 214 of the base 21.
為配合各種不同的待測積體電路元件所具有的不同封裝結構，探針座2中各個測試探針1之尺寸可為相同或是不相同。此外，本實施例中，第一開槽213、第二開槽214及測試探針1雖係設置於座體21的四邊，但對於本技術領域之具有通常知識者均可了解，為配合各種不同的封裝構造，第一開槽213、第二開槽214及測試探針1的設置位置均可相應變更為設至於座體之兩側邊，且亦係屬本發明所揭示之精神下所完成的等效改變與修飾。In order to match the different package structures of the various integrated circuit components to be tested, the size of each test probe 1 in the probe holder 2 may be the same or different. In addition, in the embodiment, the first slot 213, the second slot 214, and the test probe 1 are disposed on the four sides of the base 21, but those skilled in the art can understand that In different package configurations, the positions of the first slot 213, the second slot 214, and the test probe 1 can be changed to be disposed on both sides of the base, and are also under the spirit of the present invention. Completed equivalent changes and modifications.
以上所述者，僅為本發明之較佳實施例，並非用以限定本發明之申請專利權利；以上的描述對於本技術領域之具有通常知識者應可以明瞭及實施，因此，其他未脫離本發明所揭示之精神下所完成的等效改變與修飾，均應包含在以下所列之申請範圍。The above is only the preferred embodiment of the present invention, and is not intended to limit the patent application rights of the present invention; the above description should be understood and implemented by those skilled in the art, and therefore, the other is not departing from the present invention. Equivalent changes and modifications made in the spirit of the invention should be included in the scope of the application listed below.
1．．．測試探針1. . . Test probe
11．．．金屬本體11. . . Metal body
111．．．第一彎折部111. . . First bend
θ1、θ2．．．彎折角度Θ1, θ2. . . Bending angle
112．．．第二彎折部112. . . Second bend
113．．．連接結構113. . . Connection structure
12．．．第一探針部12. . . First probe part
a．．．第一探針部12的長度a. . . Length of the first probe portion 12
121．．．凹部121. . . Concave
13．．．第二探針部13. . . Second probe
b．．．第二探針部13的長度b. . . Length of the second probe portion 13
2．．．探針座2. . . Probe holder
21．．．座體twenty one. . . Seat
211．．．頂面211. . . Top surface
212．．．底面212. . . Bottom
213．．．第一開槽213. . . First slot
214．．．第二開槽214. . . Second slot
22．．．第一蓋板twenty two. . . First cover
23．．．第二蓋板twenty three. . . Second cover
3．．．積體電路元件3. . . Integrated circuit component
4．．．印刷電路板4. . . A printed circuit board
第1圖，為本發明第一較佳實施例的測試探針示意圖。Fig. 1 is a schematic view showing a test probe according to a first preferred embodiment of the present invention.
第2A圖，為本發明第二較佳實施例的探針座之示意圖。2A is a schematic view of a probe holder in accordance with a second preferred embodiment of the present invention.
第2B圖，為本發明第二較佳實施例的探針座***示意圖。FIG. 2B is a schematic view showing the explosion of the probe base according to the second preferred embodiment of the present invention.
1．．．測試探針1. . . Test probe
11．．．金屬本體11. . . Metal body
111．．．第一彎折部111. . . First bend
θ1、θ2．．．彎折角度Θ1, θ2. . . Bending angle
112．．．第二彎折部112. . . Second bend
113．．．連接結構113. . . Connection structure
12．．．第一探針部12. . . First probe part
a．．．第一探針部12的長度a. . . Length of the first probe portion 12
121．．．凹部121. . . Concave
13．．．第二探針部13. . . Second probe
b．．．第二探針部13的長度b. . . Length of the second probe portion 13
3．．．積體電路元件3. . . Integrated circuit component
4．．．印刷電路板4. . . A printed circuit board
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98103630A TWI395953B (en) | 2009-02-05 | 2009-02-05 | Socket and test probe thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98103630A TWI395953B (en) | 2009-02-05 | 2009-02-05 | Socket and test probe thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201030344A TW201030344A (en) | 2010-08-16 |
| TWI395953B true TWI395953B (en) | 2013-05-11 |
Family
ID=44854258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98103630A TWI395953B (en) | 2009-02-05 | 2009-02-05 | Socket and test probe thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI395953B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02206765A (en) * | 1989-02-06 | 1990-08-16 | Giga Puroobu Kk | Probe card |
| US5151653A (en) * | 1990-03-08 | 1992-09-29 | Kabushiki Kaisha Kobe Seiko Sho | Inspection probe having thin metal wires with self resiliency |
| JPH06213929A (en) * | 1993-01-19 | 1994-08-05 | Sharp Corp | Manufacture of probe head of inspecting apparatus and the probe head |
| TW522242B (en) * | 2000-10-25 | 2003-03-01 | Advantest Corp | Contact structure and production method thereof and probe contact assembly using same |
| TW200734649A (en) * | 2006-02-19 | 2007-09-16 | Gunsei Kimoto | Probe assembly |
| TW200739084A (en) * | 2005-12-26 | 2007-10-16 | Kwang-Suk Song | Probe card for semiconductor test |
| TW200841020A (en) * | 2006-12-04 | 2008-10-16 | Touchdown Technologies Inc | Lateral interposer contact design and probe card assembly |
| TW200900346A (en) * | 2007-06-23 | 2009-01-01 | Mjc Probe Inc | Integrally formed micro extending type elastic probe |
-
2009
- 2009-02-05 TW TW98103630A patent/TWI395953B/en active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02206765A (en) * | 1989-02-06 | 1990-08-16 | Giga Puroobu Kk | Probe card |
| US5151653A (en) * | 1990-03-08 | 1992-09-29 | Kabushiki Kaisha Kobe Seiko Sho | Inspection probe having thin metal wires with self resiliency |
| JPH06213929A (en) * | 1993-01-19 | 1994-08-05 | Sharp Corp | Manufacture of probe head of inspecting apparatus and the probe head |
| TW522242B (en) * | 2000-10-25 | 2003-03-01 | Advantest Corp | Contact structure and production method thereof and probe contact assembly using same |
| TW200739084A (en) * | 2005-12-26 | 2007-10-16 | Kwang-Suk Song | Probe card for semiconductor test |
| TW200734649A (en) * | 2006-02-19 | 2007-09-16 | Gunsei Kimoto | Probe assembly |
| TW200841020A (en) * | 2006-12-04 | 2008-10-16 | Touchdown Technologies Inc | Lateral interposer contact design and probe card assembly |
| TW200900346A (en) * | 2007-06-23 | 2009-01-01 | Mjc Probe Inc | Integrally formed micro extending type elastic probe |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201030344A (en) | 2010-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20180011126A1 (en) | Testing head comprising vertical probes | |
| TWI490510B (en) | High-precision semiconductor device probing apparatus and system thereof | |
| EP1154276B1 (en) | Testing head for microstructures | |
| JP6149060B2 (en) | Vertical probe module and its columnar support | |
| KR101422566B1 (en) | Probe and Probe Card | |
| JP5944755B2 (en) | Vertical motion probe card | |
| JP2018515752A (en) | Vertical contact probe for high frequency applications and test head with vertical contact probe | |
| JP2020504302A (en) | Inspection probe and socket | |
| JP4571511B2 (en) | Probe for current test | |
| JP5065489B2 (en) | Cantilever type micro contact probe with hinge structure | |
| JP2012173263A (en) | Electrical contact and electrical contact unit | |
| JP4021457B2 (en) | Socket and test device | |
| CN101813711B (en) | Test probe and probe bed | |
| KR20200109349A (en) | Cantilever probe head and corresponding contact probe | |
| TWI395953B (en) | Socket and test probe thereof | |
| KR20150090017A (en) | Cantilever contact probe for a testing head | |
| TWI418794B (en) | Vertical probe card | |
| TW202223407A (en) | Contact probe for probe heads of electronic devices and corresponding probe head | |
| JP4237191B2 (en) | Probe card | |
| JP6505420B2 (en) | Probe and probe card | |
| JP6373011B2 (en) | Probe card | |
| CN112526178A (en) | Probe and testing device | |
| CN211263556U (en) | Probe and testing device | |
| WO2023181754A1 (en) | Probe, probe-holding device, and method for manufacturing probe | |
| JP2007192719A (en) | Probe card |