TWI388028B - Buffer system for adjusting first-in first-out - Google Patents
Buffer system for adjusting first-in first-out Download PDFInfo
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- TWI388028B TWI388028B TW096119471A TW96119471A TWI388028B TW I388028 B TWI388028 B TW I388028B TW 096119471 A TW096119471 A TW 096119471A TW 96119471 A TW96119471 A TW 96119471A TW I388028 B TWI388028 B TW I388028B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/34—Devices for discharging articles or materials from conveyor
- B65G47/46—Devices for discharging articles or materials from conveyor and distributing, e.g. automatically, to desired points
- B65G47/51—Devices for discharging articles or materials from conveyor and distributing, e.g. automatically, to desired points according to unprogrammed signals, e.g. influenced by supply situation at destination
- B65G47/5104—Devices for discharging articles or materials from conveyor and distributing, e.g. automatically, to desired points according to unprogrammed signals, e.g. influenced by supply situation at destination for articles
- B65G47/5109—Devices for discharging articles or materials from conveyor and distributing, e.g. automatically, to desired points according to unprogrammed signals, e.g. influenced by supply situation at destination for articles first In - First Out systems: FIFO
- B65G47/514—Devices for discharging articles or materials from conveyor and distributing, e.g. automatically, to desired points according to unprogrammed signals, e.g. influenced by supply situation at destination for articles first In - First Out systems: FIFO using stacking and/or destacking arrangements or stacks of articles or article carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
- Y10T29/49829—Advancing work to successive stations [i.e., assembly line]
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Description
本發明關於一種調整先入先出之緩衝系統，尤指關於一種能夠暫時存放複數基板，並能夠調整先入先出之緩衝系統。The present invention relates to a buffer first-in, first-out buffer system, and more particularly to a buffer system capable of temporarily storing a plurality of substrates and capable of adjusting a first-in first-out.
概言之，緩衝設備為一種在半導體製程一系列的製程中，或是製造平板顯示器的製程期間，用以暫時存放基板的設備。當時間根據一系列製程中所要執行的製程而改變或是任何一個製程暫時停止時，該緩衝設備可以提供在其它製程當中的基板可以暫時停留的空間。例如，該緩衝設備可以用於一清洗處理及薄膜沉積處理之間，或是在清洗處理及檢測處理之間，其係以不同的操作速率進行，藉以調整整個製造程序的操作時間。In summary, the buffer device is a device for temporarily storing a substrate during a series of processes in a semiconductor process or during a process of manufacturing a flat panel display. The buffering device can provide a space in which the substrate can temporarily stay in other processes when the time is changed according to the process to be executed in a series of processes or when any one of the processes is temporarily stopped. For example, the buffering device can be used between a cleaning process and a thin film deposition process, or between a cleaning process and a detection process, at different operating rates, thereby adjusting the operating time of the entire manufacturing process.
圖1為依據習知技術之緩衝設備的架構圖。習知的緩衝設備在其中具有一垂直移動的輸送單元，以存放要傳送到該緩衝設備的基板，並移動該基板到該緩衝設備的上方部份。因此，先傳送的基板即定位在該緩衝設備的該上方部份處。為了將存放在該緩衝設備中的基板傳送到下一個製程的處理設備，最下方的基板會最先傳送。這是因為用於傳送基板的裝置係由安裝到最下方主軸的滾輪旋轉所驅動。FIG. 1 is a block diagram of a buffer device according to the prior art. A conventional buffer device has a vertically moving transport unit therein for storing a substrate to be transferred to the buffer device and moving the substrate to an upper portion of the buffer device. Therefore, the first transferred substrate is positioned at the upper portion of the buffer device. In order to transfer the substrate stored in the buffer device to the processing device of the next process, the lowermost substrate is transferred first. This is because the means for transporting the substrate is driven by the rotation of the roller mounted to the lowermost spindle.
因此，由於先進入的基板會最後傳送，先進入的基板在該緩衝設備中相對地會停留較長的時間。當該基板在該緩衝設備中停留較長時，灰塵或外來物可能會黏著到該基板上。再者，雖然該基板需要在一預定時間之前即進行下一製程，但下一製程甚至可能會在預定時間之後才會執行，因此可能造成較低的良率。Therefore, since the substrate that is first entered will be finally transferred, the substrate that first enters will relatively stay in the buffer device for a relatively long time. When the substrate stays longer in the buffer device, dust or foreign matter may adhere to the substrate. Furthermore, although the substrate needs to be subjected to the next process a predetermined time, the next process may even be performed after a predetermined time, and thus may result in a lower yield.
此外，採用機械手臂個別傳送基板之系統若要調整先入先出可能需要一昂貴的機械手臂，因此可能增加製造成本。In addition, systems that use robotic arms to individually transport substrates may require an expensive robotic arm to adjust for first-in, first-out, which may increase manufacturing costs.
本發明的目的之一在於提供一種緩衝系統，其中具有一垂直移動單元，並能夠調整基板的先入先出。One of the objects of the present invention is to provide a buffer system having a vertical moving unit and capable of adjusting the first in first out of the substrate.
本發明的目的並不限於上述所提到的，本發明的其它目的對於本技藝專業人士將可藉由以下的說明而更加瞭解。The object of the present invention is not limited to the above-mentioned, and other objects of the present invention will become more apparent to those skilled in the art from the following description.
依據本發明一範例提供用於調整先入先出之一緩衝系統，該系統包含一或多個具有主軸之緩衝層，以及配合及固定於該主軸的滾輪，藉以暫時地存放或傳送基板，一垂直移動單元，其上下移動該緩衝層，使得在其上具有一要被傳送之基板的一緩衝層連接到一驅動單元，以及該驅動單元旋轉在其上具有要被傳送的該基板的緩衝層之主軸來傳送該基板。According to an embodiment of the present invention, a buffer system for adjusting a first in first out is provided, the system comprising one or more buffer layers having a main shaft, and a roller matched and fixed to the main shaft, thereby temporarily storing or transferring the substrate, a vertical a moving unit that moves the buffer layer up and down such that a buffer layer having a substrate to be transferred thereon is coupled to a driving unit, and the driving unit rotates a buffer layer having the substrate to be transferred thereon The spindle transfers the substrate.
本發明之好處及特徵，以及用於達成該等好處及特徵之方法，將可藉由參照以下對於較佳實施範例及附屬圖式之詳細說明而更加瞭解。但是本發明可以實施成許多不同的型式，且不應視為受限於在此處所提出的實施範例。再者，所提供的這些實施範例之說明，對於習知本技術之專業人士而言皆為完善與完整，並可完全涵蓋本發明的觀念，且本發明僅由所附申請專利範圍所定義。在整份說明書中類似的參考編號代表類似的元件。The advantages and features of the present invention, as well as the methods for achieving such advantages and features, will become more apparent from the following detailed description of the preferred embodiments and the accompanying drawings. However, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. In addition, the description of the embodiments provided is intended to be complete and complete, and the subject matter of the present invention is fully covered, and the invention is defined only by the scope of the appended claims. Like reference numerals refer to like elements throughout the specification.
現在本發明將參照附屬圖式進行更為完整的說明，其中顯示了本發明之較佳實施範例。The invention now will be described more fully hereinafter with reference to the accompanying drawings, in which a preferred embodiment of the invention.
圖2為根據本發明一實施範例中用於調整先入先出之緩衝系統的透視圖。圖3A為根據本發明一實施範例中用於調整先入先出之緩衝系統中一驅動單元的架構圖。2 is a perspective view of a buffer system for adjusting a first in first out according to an embodiment of the present invention. 3A is a block diagram of a driving unit for adjusting a first-in first-out buffer system according to an embodiment of the invention.
根據本發明一實施範例之調整先入先出之緩衝系統包括一或多個緩衝層，該緩衝層具有主軸，以及配合與固定於該主軸之滾輪，藉以暫時地存放或傳送基板，一驅動單元，其旋轉該緩衝層之一的主軸並傳送該基板；以及一垂直移動單元，用於上下移動該緩衝層。再者，該緩衝系統可包括一緩衝體，其中具有孔洞用於支撐該主軸。The first-in first-out buffering system according to an embodiment of the present invention includes one or more buffer layers, the buffer layer has a main shaft, and a roller that is coupled to and fixed to the main shaft, thereby temporarily storing or transferring the substrate, a driving unit, It rotates the main axis of one of the buffer layers and transports the substrate; and a vertical moving unit for moving the buffer layer up and down. Furthermore, the cushioning system can include a bumper having holes for supporting the spindle.
如圖2所示，一緩衝體210支撐一或多個緩衝層215。緩衝體210可提供一空間來放置緩衝層215，使得在該緩衝系統中可以盡可能地存放基板。也就是說，具有複數緩衝層215之該緩衝系統可以具有一相當高的空間。緩衝體210使得緩衝層215在其間配置了預定的間距。As shown in FIG. 2, a buffer body 210 supports one or more buffer layers 215. The buffer body 210 can provide a space for the buffer layer 215 to be placed such that the substrate can be stored as much as possible in the buffer system. That is, the buffer system having the plurality of buffer layers 215 can have a relatively high space. The buffer body 210 is such that the buffer layer 215 is disposed with a predetermined pitch therebetween.
緩衝層215可暫時存放該基板。再者，緩衝層215另可具有當該基板需要傳送時可用於傳送該基板的傳送單元。在此可以提供複數個緩衝層215，使得該基板可以被暫時存放。一基板已經在前一製程中被傳送者，即可由該緩衝系統傳送到緩衝層215。再者，在該緩衝系統中緩衝層215可暫時存放該基板，然後傳送該基板到下一製程。The buffer layer 215 can temporarily store the substrate. Furthermore, the buffer layer 215 may further have a transfer unit that can be used to transport the substrate when the substrate needs to be transferred. A plurality of buffer layers 215 can be provided here so that the substrate can be temporarily stored. A substrate has been transferred in the previous process, and is transferred from the buffer system to the buffer layer 215. Furthermore, in the buffer system, the buffer layer 215 can temporarily store the substrate and then transfer the substrate to the next process.
用於傳送該基板之該傳送單元可以包括主軸120，做為旋轉軸，以及滾輪110，其能夠藉由主軸120的旋轉來傳送該基板。因為滾輪110係固定於主軸120，滾輪110亦可由主軸120的旋轉而旋轉。因此，在滾輪110上的基板可由滾輪110的旋轉而在一個方向上傳送。該傳送單元用於支撐該基板，藉以暫時地存放該基板，且當該基板需要被傳送時，該傳送單元亦可用以傳送該基板。The transfer unit for transporting the substrate may include a spindle 120 as a rotating shaft, and a roller 110 capable of transferring the substrate by rotation of the spindle 120. Since the roller 110 is fixed to the main shaft 120, the roller 110 can also be rotated by the rotation of the main shaft 120. Therefore, the substrate on the roller 110 can be transported in one direction by the rotation of the roller 110. The transfer unit is configured to support the substrate to temporarily store the substrate, and the transfer unit can also be used to transport the substrate when the substrate needs to be transferred.
圖1中所示的習知技術之緩衝設備，該傳送單元係提供在下端，而暫時存放基板之邊緣部份係支撐於上端，使得該基板可上下移動。因此，為了將已經朝向上端移動的基板傳送到下一製程，在下端的基板會被傳送，然後存放在上端的基板即朝向下端移動。In the buffer device of the prior art shown in Fig. 1, the transfer unit is provided at the lower end, and the edge portion of the temporary storage substrate is supported at the upper end so that the substrate can be moved up and down. Therefore, in order to transfer the substrate that has moved toward the upper end to the next process, the substrate at the lower end is transferred, and then the substrate stored at the upper end is moved toward the lower end.
請參照圖2及圖3A，一驅動單元220用於旋轉緩衝層215之主軸120。概言之，驅動單元220包括一動力單元310，用於產生動力，而動力傳輸單元320、330係用於傳送機械或電功率到動力單元310。動力單元310為產生動力的一部份，並可包括一馬達，其由電力或引擎驅動，用於轉換化學能量成為機械運動。Referring to FIG. 2 and FIG. 3A, a driving unit 220 is used to rotate the main shaft 120 of the buffer layer 215. In summary, the drive unit 220 includes a power unit 310 for generating power, and the power transfer units 320, 330 are for transmitting mechanical or electrical power to the power unit 310. Power unit 310 is part of the power generation and may include a motor that is powered by an electric or engine for converting chemical energy into mechanical motion.
由動力單元310所產生的動力係藉由提供多種動力傳輸單元320、330來傳送。舉例來說，如圖3所示，可以使用磁性螺旋齒輪320,330。即使使用所謂的「螺旋齒輪」，該螺旋齒輪實質上係做為一蝸齒輪(worm gear)，其中垂直於驅動齒輪320之驅動齒輪330係由驅動齒輪320之旋轉而旋轉。The power generated by the power unit 310 is transmitted by providing a plurality of power transmission units 320, 330. For example, as shown in FIG. 3, magnetic helical gears 320, 330 can be used. Even if a so-called "helical gear" is used, the helical gear is essentially a worm gear in which the drive gear 330 perpendicular to the drive gear 320 is rotated by the rotation of the drive gear 320.
圖3B所示為依據本發明之實施範例中一用於調整先入先出之緩衝系統的磁性螺旋齒輪的原理。3B shows the principle of a magnetic helical gear for adjusting a first-in first-out buffer system in accordance with an embodiment of the present invention.
概言之，齒輪代表一種結構，其中該齒輪的齒會彼此嚙合以傳送動力到另一主軸。但是，當使用磁鐵時，其有可能在不需要齒輪的齒之間的直接嚙合的情形下傳送動力。如圖3B所示，驅動齒輪320與驅動齒輪330之主軸係定位成90°的角度，而具有N極及S極之磁鐵係附加在該齒輪的一邊緣部份，並在以一預定角度傾斜的方向上。因此，當驅動齒輪320旋轉時，於驅動齒輪320的N極及與其對應的驅動齒輪330的S極之間，以及驅動齒輪320的S極及與其對應的驅動齒輪330的N極之間會產生吸力，使得驅動齒輪330可以旋轉。因此，即使該主軸以90°的角度交叉，且齒輪的齒並未彼此咬合，驅動齒輪330仍會旋轉以傳送該基板。In summary, a gear represents a structure in which the teeth of the gear mesh with each other to transmit power to the other spindle. However, when a magnet is used, it is possible to transmit power without direct engagement between the teeth of the gear. As shown in FIG. 3B, the drive gear 320 is positioned at an angle of 90 with the main shaft of the drive gear 330, and a magnet having N and S poles is attached to an edge portion of the gear and is inclined at a predetermined angle. In the direction. Therefore, when the driving gear 320 rotates, between the N pole of the driving gear 320 and the S pole of the corresponding driving gear 330, and the S pole of the driving gear 320 and the N pole of the driving gear 330 corresponding thereto are generated. Suction causes the drive gear 330 to rotate. Therefore, even if the main shafts cross at an angle of 90° and the teeth of the gears do not mesh with each other, the drive gear 330 rotates to convey the substrate.
圖4A為依據本發明一實施範例中用於調整先入先出之緩衝系統中一磁碟驅動單元的架構圖，而圖4B所示為依據本發明一實施範例中用於調整先入先出之緩衝系統的磁碟齒輪之原理。4A is a block diagram of a disk drive unit for adjusting a first-in first-out buffer system according to an embodiment of the present invention, and FIG. 4B is a block diagram for adjusting a first-in first-out buffer according to an embodiment of the invention. The principle of the system's disk gear.
其可使用例如使用磁力來傳輸動力的方法，例如磁性螺旋齒輪、磁碟齒輪。It can use, for example, a method of transmitting power using a magnetic force, such as a magnetic helical gear, a magnetic disk gear.
如圖4A所示，當一驅動齒輪420由一驅動單元旋轉時，其有可能旋轉平行於驅動齒輪420之一驅動齒輪430。如圖4B所示，磁鐵被附加於彼此面對的驅動齒輪420與驅動齒輪430，使得相對應附加的磁鐵可彼此相對。因此，施加了該磁鐵之間的吸力，以及當驅動齒輪420旋轉時，其有可能配合驅動齒輪420來旋轉驅動齒輪430。As shown in FIG. 4A, when a drive gear 420 is rotated by a drive unit, it is possible to rotate parallel to one of the drive gears 420 to drive the gear 430. As shown in FIG. 4B, the magnets are attached to the drive gear 420 and the drive gear 430 which face each other, so that the corresponding additional magnets can oppose each other. Therefore, the suction force between the magnets is applied, and when the drive gear 420 rotates, it is possible to rotate the drive gear 430 in cooperation with the drive gear 420.
上述的磁性齒輪320,420,330及430之驅動狀態為該齒輪彼此並不接觸，而彼此之間有一預定距離之間隔。因此，因為該緩衝層可上下移動，由驅動單元220旋轉位在上面具有要被傳送的一基板之該緩衝層之該驅動齒輪是有可能的。驅動單元220可包括一滑軌224或一軌道。驅動單元220可在滑軌224及軌道上左右移動。因此，當緩衝層215上下移動時，驅動單元220即向後移動來造成緩衝層215的移動。The driving states of the magnetic gears 320, 420, 330 and 430 described above are such that the gears are not in contact with each other with a predetermined distance therebetween. Therefore, since the buffer layer can be moved up and down, it is possible for the drive unit 220 to rotate the drive gear having the buffer layer on a substrate to be transferred thereon. The drive unit 220 can include a slide rail 224 or a track. The drive unit 220 is movable left and right on the slide rails 224 and the rails. Therefore, when the buffer layer 215 moves up and down, the driving unit 220 moves backward to cause the movement of the buffer layer 215.
一垂直移動單元230可上下移動一或多個緩衝層215。為了上下移動緩衝層215，可附加複數緩衝層215到緩衝體210。因此，垂直移動單元230可藉由上下移動緩衝體210來上下移動緩衝層215。A vertical moving unit 230 can move one or more buffer layers 215 up and down. In order to move the buffer layer 215 up and down, a plurality of buffer layers 215 may be added to the buffer 210. Therefore, the vertical moving unit 230 can move the buffer layer 215 up and down by moving the buffer body 210 up and down.
為了上下移動緩衝層215，可安裝一活塞230到緩衝體之下方部份。活塞230需要匹配緩衝層215之高度，其上具有要由驅動單元220傳送的基板連同驅動單元220，使得該基板可被傳送到下一個製程。驅動單元220可上下移動，其即造成傳送該等基板到下一製程的不便。In order to move the buffer layer 215 up and down, a piston 230 can be mounted to the lower portion of the buffer body. The piston 230 needs to match the height of the buffer layer 215 with the substrate to be transferred by the drive unit 220 along with the drive unit 220 so that the substrate can be transferred to the next process. The driving unit 220 can move up and down, which causes inconvenience of transferring the substrates to the next process.
除了活塞之外，一螺旋齒輪可做為該垂直移動單元。該活塞或該等螺旋齒輪可以定位在緩衝體以下或在緩衝體之上。In addition to the piston, a helical gear can be used as the vertical moving unit. The piston or the helical gears can be positioned below the buffer or above the buffer.
概言之，先進入的基板即向上存放，並定位在最上方的部份。因此，垂直移動單元230可以降低最上方的緩衝層到該驅動單元的高度，使得在最上方緩衝層215上的基板可以傳送到下一製程。依此方式，其有可能實現一種緩衝系統，其能夠藉由依序由最上方緩衝層到最下方緩衝層來傳送該緩衝層的方式來調整基板之先入先出。In summary, the substrate that is first entered is stored upward and positioned at the uppermost portion. Therefore, the vertical moving unit 230 can lower the height of the uppermost buffer layer to the driving unit, so that the substrate on the uppermost buffer layer 215 can be transferred to the next process. In this way, it is possible to implement a buffer system capable of adjusting the first-in first-out of the substrate by sequentially transferring the buffer layer from the uppermost buffer layer to the lowermost buffer layer.
類似地，其假設該最上方緩衝層之基板已經被傳送，而下一個基板要被傳送到下一製程。但是，當在前一製程中有一基板要傳送到緩衝系統，且該基板已經被放置在該最上方緩衝層，其並不能夠說該基板會最先進入，即使該基板已存在於該最上方緩衝層上。因此，在此實施範例中，該垂直移動單元可感測基板已經暫時停留在個別緩衝層上的時間，並依序先由最久的基板來傳送該基板到下一個製程。為此目的，可另包含一時間感測器，用於感測一基板停留在一緩衝層上的時間。也就是說，其有可能藉由感測該基板停留在該緩衝層上的時間，在當該基板要被傳送到下一製程時，可以釋放能夠調整基板之先入先出的緩衝系統。Similarly, it is assumed that the substrate of the uppermost buffer layer has been transferred and the next substrate is transferred to the next process. However, when a substrate is transferred to the buffer system in the previous process and the substrate has been placed on the uppermost buffer layer, it cannot be said that the substrate will enter first, even if the substrate already exists at the top On the buffer layer. Therefore, in this embodiment, the vertical moving unit can sense the time when the substrate has temporarily stayed on the individual buffer layer, and sequentially transfer the substrate to the next process by the oldest substrate. For this purpose, a time sensor can be further included for sensing the time that a substrate stays on a buffer layer. That is, it is possible to release the buffering system capable of adjusting the substrate's first-in first-out, when the substrate is to be transferred to the next process, by sensing the time that the substrate stays on the buffer layer.
以下將說明具有依據本發明之具體實施例的上述結構之用於調整先入先出之緩衝系統的操作。The operation for adjusting the first-in first-out buffer system having the above structure according to the embodiment of the present invention will be described below.
首先，因為在前一製程中的一基板並不能夠立即進行到下一製程，該基板可暫時地存放在該緩衝系統中。已經佔據了緩衝系統中一緩衝層215之基板即會升高到一上方緩衝層，且新傳送的基板即放置在一下方緩衝層。對於依照此方法存放的基板，首先進入的基板可以存放在位於上端之一緩衝層。因此，為了首先傳送先進入的基板，位在上端的該緩衝層之基板可以先傳送到下一製程。當該緩衝體由垂直移動單元230向下移動，其有可能向下移動緩衝層215。在此，緩衝層215可移動到在緩衝層215中的滾輪110可接觸到驅動單元220之高度，藉以做驅動。First, since a substrate in the previous process is not immediately able to proceed to the next process, the substrate can be temporarily stored in the buffer system. The substrate that has occupied a buffer layer 215 in the buffer system is raised to an upper buffer layer, and the newly transferred substrate is placed in a lower buffer layer. For substrates stored in accordance with this method, the first incoming substrate can be stored in a buffer layer at the upper end. Therefore, in order to first transfer the substrate that is first entered, the substrate of the buffer layer located at the upper end can be transferred to the next process. When the buffer is moved downward by the vertical moving unit 230, it is possible to move the buffer layer 215 downward. Here, the buffer layer 215 can be moved to a height at which the roller 110 in the buffer layer 215 can contact the driving unit 220, thereby driving.
當在其上具有要傳送的基板之緩衝層215到達驅動單元220可以操作的高度時，驅動單元220即旋轉驅動馬達310，以傳送動力到該動力傳輸單元。例如，驅動齒輪320可由使用磁性螺旋齒輪320、330以旋轉，而驅動齒輪320旋轉緩衝層215之以90(的角度附加於驅動齒輪320之驅動齒輪330。再者，主軸120及附加於主軸120之滾輪110將被旋轉，使得該基板可被傳送到下一製程。另外，當使用磁碟齒輪420,430時，驅動齒輪420旋轉平行於驅動齒輪420之驅動齒輪430，使得在緩衝層215中的該基板可被傳送到下一製程。When the buffer layer 215 having the substrate to be transferred thereon reaches a height at which the driving unit 220 can operate, the driving unit 220 rotationally drives the motor 310 to transmit power to the power transmitting unit. For example, the drive gear 320 can be rotated by using the magnetic helical gears 320, 330, and the drive gear 320 can rotate the buffer layer 215 by 90 (the angle is added to the drive gear 330 of the drive gear 320. Further, the spindle 120 and the spindle 120 are attached to the spindle 120. The roller 110 will be rotated such that the substrate can be transferred to the next process. Additionally, when the disk gears 420, 430 are used, the drive gear 420 rotates parallel to the drive gear 430 of the drive gear 420 such that the buffer layer 215 The substrate can be transferred to the next process.
依據上述相同的方法，為了傳送下一基板，在其上具有要由垂直移動單元230傳送之基板的緩衝層215必須到達驅動單元220之高度。當緩衝層215到達驅動單元220之高度時，驅動單元220可傳送在緩衝層215上的該基板到下一製程。According to the same method as described above, in order to transport the next substrate, the buffer layer 215 having the substrate to be transferred by the vertical moving unit 230 must reach the height of the driving unit 220. When the buffer layer 215 reaches the height of the driving unit 220, the driving unit 220 can transfer the substrate on the buffer layer 215 to the next process.
雖然本發明已配合本發明之實施範例來做說明，習知技術之專業人士將可瞭解到其可進行多種修正與變化，而皆不背離本發明之範圍與精神。因此，其將可瞭解到上述的實施範例並非限制性，而是所有可能的實施範例之例示。While the present invention has been described in connection with the embodiments of the present invention, it will be understood by those skilled in the art that various modifications and changes can be made without departing from the scope and spirit of the invention. Therefore, it will be appreciated that the above-described embodiments are not limiting, but are illustrative of all possible embodiments.
依據上述用於調整先入先出之緩衝系統，可以達到以下的效果。According to the above buffer system for adjusting the first in first out, the following effects can be achieved.
藉由調整基板之先入先出並使得在緩衝系統中的等待時間相等，即有可能維持製程當中的平衡。By adjusting the substrate's first-in-first-out and making the latency in the buffer system equal, it is possible to maintain balance in the process.
再者，藉由相對地降低緩衝系統中的等待時間來防止外來物質掉落在一基板上。Furthermore, foreign matter is prevented from falling onto a substrate by relatively reducing the waiting time in the buffer system.
本發明的效果並不限於上述所提到的，本發明的其它效果對於習知技術之專業人士將可藉由以下的申請專利範圍而更加瞭解。The effects of the present invention are not limited to the above-mentioned, and other effects of the present invention will become more apparent to those skilled in the art from the following claims.
110．．．滾輪110. . . Wheel
120．．．主軸120. . . Spindle
210．．．緩衝體210. . . Buffer
215．．．緩衝層215. . . The buffer layer
220．．．驅動單元220. . . Drive unit
224．．．滑軌224. . . Slide rail
230．．．活塞230. . . piston
310．．．驅動馬達310. . . Drive motor
320、330．．．磁性螺旋齒輪320, 330. . . Magnetic helical gear
420、430．．．磁碟齒輪420, 430. . . Disk gear
上述以及其它本發明之特徵與好處將可藉由以下詳細說明其實施範例並參照附屬圖式而更加瞭解，其中：圖1為依據習知技術之緩衝設備的架構圖；圖2為依據本發明之實施範例中一用於調整先入先出之緩衝系統的透視圖；圖3A為依據本發明之實施範例中一用於調整先入先出之緩衝系統的驅動單元之架構圖；圖3B所示為依據本發明之實施範例中一用於調整先入先出之緩衝系統的磁性螺旋齒輪的原理；圖4A為依據本發明之實施範例中一用於調整先入先出之緩衝系統的磁碟驅動單元之架構圖；以及圖4B所示為依據本發明之實施範例中一用於調整先入先出之緩衝系統的磁碟齒輪的原理。The above and other features and advantages of the present invention will be understood by the following detailed description of the embodiments of the present invention. Referring to the accompanying drawings, FIG. 1 is an architectural diagram of a buffer device according to the prior art; FIG. 3A is a perspective view of a driving unit for adjusting a first-in first-out buffer system according to an embodiment of the present invention; FIG. 3B is a schematic diagram of a driving unit for adjusting a first-in first-out buffer system according to an embodiment of the present invention; The principle of a magnetic helical gear for adjusting a first-in first-out buffer system according to an embodiment of the present invention; FIG. 4A is a disk drive unit for adjusting a first-in first-out buffer system according to an embodiment of the present invention; The architecture diagram; and FIG. 4B illustrates the principle of a disk gear for adjusting the first-in first-out buffer system in accordance with an embodiment of the present invention.
110．．．滾輪110. . . Wheel
120．．．主軸120. . . Spindle
210．．．緩衝體210. . . Buffer
215．．．緩衝層215. . . The buffer layer
220．．．驅動單元220. . . Drive unit
224．．．滑軌224. . . Slide rail
230．．．活塞230. . . piston
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