TWI383493B - Solid-state imaging device - Google Patents
Solid-state imaging device Download PDFInfo
- Publication number
- TWI383493B TWI383493B TW096129138A TW96129138A TWI383493B TW I383493 B TWI383493 B TW I383493B TW 096129138 A TW096129138 A TW 096129138A TW 96129138 A TW96129138 A TW 96129138A TW I383493 B TWI383493 B TW I383493B
- Authority
- TW
- Taiwan
- Prior art keywords
- wiring
- pixel
- solid
- pixel array
- imaging device
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title claims description 84
- 230000002093 peripheral effect Effects 0.000 claims description 18
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000013041 optical simulation Methods 0.000 description 2
- 210000001747 pupil Anatomy 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/80—Camera processing pipelines; Components thereof
- H04N23/81—Camera processing pipelines; Components thereof for suppressing or minimising disturbance in the image signal generation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006244992A JP4992352B2 (ja) | 2006-09-11 | 2006-09-11 | 固体撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200830544A TW200830544A (en) | 2008-07-16 |
TWI383493B true TWI383493B (zh) | 2013-01-21 |
Family
ID=39183570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096129138A TWI383493B (zh) | 2006-09-11 | 2007-08-08 | Solid-state imaging device |
Country Status (7)
Country | Link |
---|---|
US (1) | US8134620B2 (ko) |
EP (1) | EP2083444B1 (ko) |
JP (1) | JP4992352B2 (ko) |
KR (1) | KR101350758B1 (ko) |
CN (1) | CN101512766B (ko) |
TW (1) | TWI383493B (ko) |
WO (1) | WO2008032502A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5751766B2 (ja) * | 2010-07-07 | 2015-07-22 | キヤノン株式会社 | 固体撮像装置および撮像システム |
JP5785398B2 (ja) * | 2011-02-17 | 2015-09-30 | キヤノン株式会社 | 撮像装置及び画像信号処理装置 |
JP2015185823A (ja) * | 2014-03-26 | 2015-10-22 | ソニー株式会社 | 固体撮像素子、及び、撮像装置 |
JP2016111425A (ja) * | 2014-12-03 | 2016-06-20 | ルネサスエレクトロニクス株式会社 | 撮像装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003273342A (ja) * | 2002-03-13 | 2003-09-26 | Sony Corp | 固体撮像素子及びその製造方法 |
US20040159774A1 (en) * | 2003-02-19 | 2004-08-19 | Koji Mishina | Solid-state image pickup device and image pickup camera |
JP2006237315A (ja) * | 2005-02-25 | 2006-09-07 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3677977B2 (ja) | 1997-12-25 | 2005-08-03 | ソニー株式会社 | マイクロレンズの形成方法 |
JP2006059847A (ja) * | 2004-08-17 | 2006-03-02 | Sony Corp | 固体撮像装置 |
WO2006040963A1 (ja) * | 2004-10-15 | 2006-04-20 | Konica Minolta Holdings, Inc. | 固体撮像装置 |
US20060113460A1 (en) * | 2004-11-05 | 2006-06-01 | Tay Hiok N | Image sensor with optimized wire routing |
JP4763424B2 (ja) * | 2005-11-08 | 2011-08-31 | 富士フイルム株式会社 | 固体撮像素子の駆動方法 |
TW200742425A (en) * | 2006-03-24 | 2007-11-01 | Matsushita Electric Ind Co Ltd | Solid-state image pickup device |
-
2006
- 2006-09-11 JP JP2006244992A patent/JP4992352B2/ja not_active Expired - Fee Related
-
2007
- 2007-08-02 KR KR1020097004998A patent/KR101350758B1/ko not_active IP Right Cessation
- 2007-08-02 CN CN2007800336985A patent/CN101512766B/zh not_active Expired - Fee Related
- 2007-08-02 EP EP07791839.9A patent/EP2083444B1/en not_active Not-in-force
- 2007-08-02 US US12/440,064 patent/US8134620B2/en not_active Expired - Fee Related
- 2007-08-02 WO PCT/JP2007/065159 patent/WO2008032502A1/ja active Application Filing
- 2007-08-08 TW TW096129138A patent/TWI383493B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003273342A (ja) * | 2002-03-13 | 2003-09-26 | Sony Corp | 固体撮像素子及びその製造方法 |
US20040159774A1 (en) * | 2003-02-19 | 2004-08-19 | Koji Mishina | Solid-state image pickup device and image pickup camera |
JP2004253568A (ja) * | 2003-02-19 | 2004-09-09 | Sony Corp | 固体撮像装置及び撮像カメラ |
JP2006237315A (ja) * | 2005-02-25 | 2006-09-07 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
Also Published As
Publication number | Publication date |
---|---|
US8134620B2 (en) | 2012-03-13 |
CN101512766B (zh) | 2012-08-08 |
KR101350758B1 (ko) | 2014-01-13 |
CN101512766A (zh) | 2009-08-19 |
EP2083444B1 (en) | 2014-05-14 |
JP2008066614A (ja) | 2008-03-21 |
WO2008032502A1 (fr) | 2008-03-20 |
TW200830544A (en) | 2008-07-16 |
JP4992352B2 (ja) | 2012-08-08 |
KR20090057380A (ko) | 2009-06-05 |
EP2083444A4 (en) | 2013-06-26 |
US20100039545A1 (en) | 2010-02-18 |
EP2083444A1 (en) | 2009-07-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |