TWI382911B - The structure of the molded product in the mold decoration process - Google Patents
The structure of the molded product in the mold decoration process Download PDFInfo
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- TWI382911B TWI382911B TW099101435A TW99101435A TWI382911B TW I382911 B TWI382911 B TW I382911B TW 099101435 A TW099101435 A TW 099101435A TW 99101435 A TW99101435 A TW 99101435A TW I382911 B TWI382911 B TW I382911B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/103—Metal fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2274/00—Thermoplastic elastomer material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2451/00—Decorative or ornamental articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2571/00—Protective equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/2419—Fold at edge
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Description
一種模內裝飾製程的成形品結構,特別是指利用模內裝飾製程形成一種包含電磁隔離層的成形品。
工業製品除了追求本身具有卓越的性能以外,為了提升商品的外觀、觸感,甚至於商品識別度,因而不斷的試圖透過外觀設計的創新以及美觀的設計以提升產品的定位與價格。而習知的工業製品,如手機或筆記型電腦,習知的材質可能為塑膠外殼,雖外表以塗料包覆,使其具有異於塑膠之表面色澤,但其觸感仍可明顯識別出塑膠之感覺,且長期使用或經過摩擦後,表面之塗料會被磨去而露出塑膠表面。整體而言,產品外殼以塑膠單純經過塗料覆蓋的外觀與觸感不佳。
因此開發了IMD技術(In-Mold decoration,模內裝飾技術),IMD更由製程的改進與變化區分為IMR、IMF等多種製程。但其技術的軸心思想是在於:利用將已印刷上設計色彩與圖樣的裝飾膜片置入射出模具中,將塑料直接射出於該裝飾膜片上,讓該塑料與裝飾膜片一併定形成一成形品。其中一種習知的該類創作如中華民國專利公開第200819272號「模內裝飾印刷方法」,在該前案中揭示了其改良的方式是將一圖案化薄膜預先配置於模具的內壁,且模具的澆注口將塑料注入模穴內,使塑料與該圖案化薄膜結合。但為了要改善圖案化薄膜在塑料注入過程中產生皺摺的問題,該前案更在模具上設置
多個進氣孔與該模穴相通,並由該些進氣孔引入氣流,使得塑料被氣流擠壓至該圖案化薄膜上,令該圖案化薄膜平整地貼附於該模具之內壁。由該前案可見IMD技術中包含了射出塑料在薄膜上,該薄膜可讓該塑料的外表具有圖案與色彩的變化。
IMD技術不斷的發展之下,其生產速度、成本以及產品的良率、外觀、物理強度都隨之改善,但上述IMD的成品特點仍僅具有外觀的改變,若使用在部份電子產品上還需費心的在成品上設置電磁隔離材料,徒增設計與生產的成本。於是本案申請人思及IMD技術應可更進一步在成形品上附加裝飾膜片以外的材料,使該成形品具有更優異的特性,進而著手研發改進的技術。
有鑑於習用的膜內裝飾技術(In-Mold decoration)仍有改進的空間,因此本案的目的在於提供一種改善的膜內裝飾(In-Mold decoration)製程,使其產品具有除了美麗外表以外的附加功能。
本案為一種模內裝飾製程的成形品結構,該成形品包括一電磁防護材、一承載層以及一定形塑料材。其中該電磁防護材包含了一金屬薄層、一結構補強層以及一電磁隔離層,該金屬薄層的表面具有一圖樣區域,該結構補強層則位於該金屬薄層與該電磁隔離層之間以加強該電磁防護材的物理強度。該承載層包含佈有一第一黏著層的一黏著面以及一承載面,在模內裝飾製程中,該電磁防護材係置放於一母模內,並且該承載層位於該電磁防
護材上方,使該承載層的黏著面與該電磁防護材相對;更具體的是,該承載層的黏著面與該電磁防護材的電磁隔離層相對。而在公、母模結合後,該公、母模之間形成一模穴,並且有一塑料澆道將塑料注入該模穴,射出於該承載層的承載面上形成該定形塑料材,該定形塑料材更區分為一與該承載面結合的第一表面以及相對於該第一表面另一側的第二表面。由於,該電磁防護材與射出的定形塑料材之間具有承載層作為連接前述兩者的中介,更可避免該電磁防護材被壓力或溫度破壞。上述技術內容所形成的成形品結構可作為適用於各種產品的外殼或面板(例如電子器材的外殼,或者交通工具內裝等領域,但並非限於此處所舉的例子),該電磁防護材表面的圖樣區域可提供產品多樣且美觀的外表。又由於該電磁防護材包含了一電磁隔離層,使其可隔離電磁波,以避免訊號干擾。
綜上所述,本案利用模內裝飾製程提供了一種成形品,該成形品具有美觀的表面以及隔離電磁波的功效,可廣泛適用於多種產品。
本案為一種模內裝飾製程的成形品結構,該成形品結構包括了一電磁防護材、一承載層以及一定形塑料材。請先參閱圖1,圖1中示出該電磁防護材1的結構,該電磁防護材1更包含一金屬薄層11、一結構補強層12以及一電磁隔離層13,並且該金屬薄層11與結構補強層12之間具有一第二黏著層14相互黏接,該結構補強層12與電磁隔離
層13亦具有一第二黏著層14相互黏接。該金屬薄層11的厚度在0.02mm至1.0mm之間,並且該金屬薄層11表面具有一圖樣區域111,該金屬薄層11相對於該圖樣區域111的另一側透過該第二黏著層14與該結構補強層12相互黏接。該結構補強層12位於該金屬薄層11與該電磁隔離層13之間加強該電磁防護材1的物理強度,且該結構補強層12的厚度在0.02mm至1.0mm之間;該結構補強層12係選自於由聚對苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、二醇變性聚乙烯對苯二甲酸酯、熱塑性聚胺基甲酸酯、聚胺酯、聚丙烯、聚碳酸酯、非結晶化聚對苯二甲酸二醇酯、聚氯乙烯、壓克力、苯乙烯甲基丙烯酸甲酯、丙烯晴-丁二烯-苯乙烯共聚物、聚苯乙烯、聚縮荃以及尼龍所組成群組或其組合,可依據需求的耐壓或耐熱能力而選擇該結構補強層12的材質。該結構補強層12黏貼該金屬薄層11的相對另一側黏貼該電磁隔離層13,該電磁隔離層13可為有效隔離電磁波的金屬的網狀物或金屬鍍層或金屬編織網布。如此上述各層相互黏貼結合成一電磁防護材1,並且利用該金屬薄層11表面的圖樣區域111提供預先設計的圖樣或紋路。
而該電磁防護材1係應用於模內裝飾製程與其他結構結合,請再參閱圖2-1與圖2-2。圖2-1、圖2-2中可見一公模41以及一母模42,並且設定該公模41上具有至少一塑料澆道411。在該模內裝飾製程中,該電磁防護材1先行置於該母模42中,並且依據預先計算的成形品長度而預留一彎折段10(可見於圖3-1、圖3-2)的長度,該彎折段
10待稍後再詳細敘述。該母模42上更置入一承載層2位於該電磁防護材1上方,該承載層2包含一承載面以及佈有一第一黏著層21的一黏著面,其中該黏著面與該電磁防護材1的電磁隔離層13相對。該公模41與母模42相結合時,該公模41與母模42之間形成一模穴,而該塑料澆道411將塑料射出於該承載層2的承載面上,並於該模穴中形成一定形塑料材3,該承載層2需具有足夠的耐壓與耐高溫能力承受塑料射出的壓力與溫度,除了避免該電磁防護材1被壓力或溫度破壞以外,更作為連接該電磁防護材1與該定形塑料材3的中介。先行定義該定形塑料材3與該承載面結合的一側為第一表面,而相對於該第一表面的另一側則為第二表面。經過上述模內裝飾製程所構成的結構請參閱圖3-1。圖3-1中可見上述的電磁防護材1、承載層2以及定形塑料材3依公、母模41、42的壓迫與射出結合為一體(由於該承載層2的厚度較薄,又由於在射出定形塑料材3時,高溫與高壓使該定形塑料材3與該承載層2呈溶融狀態,可視為該承載層2融合於該定形塑料材3表面,故在圖3-1與圖3-2中未示出該承載層2),並且由於承載層2與該電磁防護材1在母模42內的相對位置,使得該電磁防護材1位於該承載層2的黏著面一側,該定形塑料材3位於該承載層2的承載面一側。其中由於該電磁防護材1在模內裝飾製程中預留了一段長度,使該電磁防護材1具有面積匹配該承載層2以及定形塑料材3的覆蓋區域,且該電磁防護材1更包括至少一延伸在該覆蓋區域外的彎折段10。請參閱圖3-2,該電磁防護材1預留的長度經彎折後附著於該定形塑料材3的第二表面形成該彎折段
10,使該電磁防護材1完整的包覆於該承載層2與該定形塑料材3的其中一側,形成完整的成形品結構。該彎折段10彎折後更可在組裝於產品上時連接至少一接地點(圖中未示)以將電荷導向接地點。
上述的成形品結構透過因該電磁隔離層13而具有隔離電磁波的能力。又,該金屬薄層11可為鋁或銅或不鏽鋼或鎳合金,除了提供美麗的外觀以外亦具有金屬的質感與保護效果。上述圖式中所示的成形品形態為一實施例,並非用於限制該成形品的形態,模具形態的改變可形成不同造形、尺寸的成形品,透過模具的塑形可客製化的提供適用於各種產品的外殼或面板(例如電子器材的外殼,或者交通工具內裝等領域,但並非限於此處所舉的例子)。
雖然本發明已以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內而所作之些許更動與潤飾,皆應涵蓋於本發明中,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。
綜上所述,本發明較習知之結構增進上述功效,應已充分符合新穎性及進步性之法定創新專利要件,爰依法提出申請,懇請 貴局核准本件發明專利申請案,以勵創作,至感德便。
1‧‧‧電磁防護材
11‧‧‧金屬薄層
111‧‧‧圖樣區域
12‧‧‧結構補強層
13‧‧‧電磁隔離層
14‧‧‧第二黏著層
2‧‧‧承載層
21‧‧‧第一黏著層
3‧‧‧定形塑料材
41‧‧‧公模
42‧‧‧母模
411‧‧‧塑料澆道
圖1為該電磁防護材之結構示意圖。
圖2-1為該模內裝飾製程的示意圖(一)。
圖2-2為該模內裝飾製程的示意圖(二)。
圖3-1為該彎折段成形前之示意圖。
圖3-2為該彎折段成形後之示意圖。
1‧‧‧電磁防護材
11‧‧‧金屬薄層
111‧‧‧圖樣區域
12‧‧‧結構補強層
13‧‧‧電磁隔離層
14‧‧‧第二黏著層
Claims (10)
- 一種模內裝飾製程的成形品結構,係包括:一電磁防護材,係包含表面具有一圖樣區域的一金屬薄層、一結構補強層以及一電磁隔離層所構成,其中該結構補強層位於該金屬薄層與該電磁隔離層之間加強該電磁防護材的物理強度;一承載層,該承載層包含一承載面以及佈有一第一黏著層的一黏著面,在模內裝飾製程中利用該第一黏著層而附著於該電磁防護材;一在模內裝飾製程中射出於該承載面的定形塑料材,該定形塑料材具有一與該承載面結合的第一表面,以及一第二表面。
- 如申請專利範圍第1項所述的模內裝飾製程的成形品結構,其中該電磁防護材具有一面積匹配該承載層以及該定形塑料材的覆蓋區域,且該電磁防護材更包括至少一延伸在該覆蓋區域外的彎折段,該彎折段經彎折後附著於該定形塑料材的該第二表面。
- 如申請專利範圍第1項所述的模內裝飾製程的成形品結構,其中該電磁防護材具有一面積匹配該承載層以及該定形塑料材的覆蓋區域,且該電磁防護材更包括至少一延伸在該覆蓋區域外的彎折段,該彎折段經彎折後連接至少一接地點。
- 如申請專利範圍第1項至第3項中任一項所述的模內裝飾製程的成形品結構,其中該金屬薄層為鋁或銅或不鏽鋼或鎳合金。
- 如申請專利範圍第1項所述的模內裝飾製程的成形品結構,其中該金屬薄層的厚度在0.02mm至1.0mm之間。
- 如申請專利範圍第1項所述的模內裝飾製程的成形品結構,其中該結構補強層的厚度在0.02mm至1.0mm之間。
- 如申請專利範圍第1項所述的模內裝飾製程的成形品結構,其中該電磁防護材的結構補強層係選自於由聚對苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、二醇變性聚乙烯對苯二甲酸酯、熱塑性聚胺基甲酸酯、聚胺酯、聚丙烯、聚碳酸酯、非結晶化聚對苯二甲酸二醇酯、聚氯乙烯、壓克力、苯乙烯甲基丙烯酸甲酯、丙烯晴-丁二烯-苯乙烯共聚物、聚苯乙烯、聚縮荃以及尼龍所組成群組或其組合。
- 如申請專利範圍第1項所述的模內裝飾製程的成形品結構,其中該金屬薄層與該結構補強層之間具有一第二黏著層相互黏接,該結構補強層與該電磁隔離層亦具有該第二黏著層相互黏接。
- 如申請專利範圍第1項所述的模內裝飾製程的成形品結構,其中該承載層利用該黏著面上的第一黏著層而與該電磁防護材的電磁隔離層相互黏接。
- 如申請專利範圍第1項所述的模內裝飾製程的成形品結構,其中該電磁隔離層為金屬的網狀物或金屬鍍層或金屬編織網布。
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