TWI381495B - Substrate bonding device - Google Patents
Substrate bonding device Download PDFInfo
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- TWI381495B TWI381495B TW96134107A TW96134107A TWI381495B TW I381495 B TWI381495 B TW I381495B TW 96134107 A TW96134107 A TW 96134107A TW 96134107 A TW96134107 A TW 96134107A TW I381495 B TWI381495 B TW I381495B
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- substrate
- bonding
- flexible
- fixture
- recessed space
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
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- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Liquid Crystal (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
本發明係關於一種基板貼合之裝置，特別是關於一種使一可撓性基板結合於另一基板之裝置之設計。The present invention relates to a device for bonding substrates, and more particularly to a device for bonding a flexible substrate to another substrate.
按，目前一般大眾所使用之手機、PDA、影音3C產品等，其顯示螢幕或觸控螢幕係由至少兩種不同種類之基板貼合製作而成，而習用之基板貼合技術如第1圖所示，其係在一標的基板1之一貼合面11塗佈有一層光學膠12，為了將一可撓性基板2貼合於基板1之貼合面11，乃藉由向著一方向I滾動之一滾輪3對可撓性基板2施予一壓合力II，以使可撓性基板2隨著滾輪3之滾壓而逐漸經由光學膠12貼合於基板1之貼合面11，其間之空氣則從開放的一端排出。According to the current mobile phone, PDA, audio and video 3C products used by the general public, the display screen or the touch screen is made of at least two different types of substrates, and the conventional substrate bonding technology is as shown in FIG. As shown in the figure, one of the bonding surfaces 11 of a target substrate 1 is coated with a layer of optical glue 12, and a flexible substrate 2 is bonded to the bonding surface 11 of the substrate 1 by a direction I. A rolling roller 3 is applied to the flexible substrate 2 to apply a pressing force II so that the flexible substrate 2 is gradually adhered to the bonding surface 11 of the substrate 1 via the optical adhesive 12 as the roller 3 is rolled. The air is discharged from the open end.
此種使用滾輪將基板滾壓貼合之缺點為，滾輪係屬一種機械機構，其有行程時間(Cycle Time)之限制以及貼合工件數量之限制，且其會產生邊角壓力集中效應(Edge Effect)造成氣體包覆於貼合介面形成氣泡之不良現象。基於這些缺點，因而有其它的基板貼合技術被研發出來，例如美國發明專利第6,106,665號專利案中，其揭露出一種製造眼鏡片之設備，其係把上下兩透明柔性片包裹在具有光學曲度的合成鏡片周圍，並抽真空使合成鏡片黏合，再以UV燈照射養護成型。The disadvantage of using a roller to roll the substrate is that the roller is a mechanical mechanism that has a limitation of the Cycle Time and a limit on the number of workpieces to be attached, and it has a corner pressure concentration effect (Edge). Effect) The phenomenon that the gas is coated on the bonding interface to form bubbles. Based on these shortcomings, other substrate bonding techniques have been developed, for example, in U.S. Patent No. 6,106,665, which discloses a device for manufacturing ophthalmic lenses, which is wrapped with upper and lower transparent flexible sheets. The synthetic lens is surrounded by a vacuum, and the synthetic lens is bonded, and then cured by UV light irradiation.
又例如美國發明專利第5,501,910號專利案中，其揭露出一種在一真空袋中貼合一玻璃和一塑膠薄板之三明治結構之技術，除同樣利用抽真空之方式外，並藉助一以金屬製成之蓋板之壓力來幫助塑膠薄板和玻璃之貼合。For example, in the U.S. Patent No. 5,501,910, the disclosure of a sandwich structure in which a glass and a plastic sheet are bonded in a vacuum bag is used, except that the vacuum is also used, and The pressure of the cover plate helps the plastic sheet and glass fit.
然而，上述美國發明專利第6,106,665號專利案係在一圍圈結構中來進行貼合，而上述美國發明專利第5,501,910號專利案係僅在一真空袋中進行貼合，其均未提供一種穩定的貼合治具，因此在貼合之過程中難免產生基板偏移定位之情形。However, the above-mentioned U.S. Patent No. 6,106,665 is incorporated in a lapped structure, and the above-mentioned U.S. Patent No. 5,501,910 is only attached in a vacuum bag, which does not provide a stability. The fitting fixture is inevitable, so that the substrate offset positioning is inevitable during the bonding process.
並且，上述兩專利案除藉助真空壓力外，頂多再輔以蓋板之壓力來幫助不同之基板進行貼合，並無設計一機構以再施加一外力予基板以使基板之貼合面更完全緊密地貼合。Moreover, in addition to the vacuum pressure, the above two patents are supplemented by the pressure of the cover plate to help the different substrates to be bonded. There is no design mechanism to apply an external force to the substrate to make the bonding surface of the substrate more. Fit completely tightly.
再者，上述美國發明專利第6,106,665號專利案係僅應用於眼鏡片之生產製作，並不包含顯示螢幕以及觸控式螢幕之製作或其它不同基板貼合技術之應用。Furthermore, the above-mentioned U.S. Patent No. 6,106,665 is only applied to the production of ophthalmic lenses, and does not include the application of display screens and touch screens or other different substrate bonding techniques.
緣此，本發明之主要目的即是提供一種具有穩定貼合治具之基板貼合裝置，以使基板穩定地貼合而不偏移定位。Accordingly, it is a primary object of the present invention to provide a substrate bonding apparatus having a stable bonding fixture such that the substrate is stably attached without offset positioning.
本發明之另一目的是提供一種具有頂推機構之基板貼合裝置，以使兩基板更完全緊密地貼合一起。Another object of the present invention is to provide a substrate bonding apparatus having a push mechanism to bring the two substrates together more completely.
本發明之另一目的是提供一種可應用於各種領域之基板貼合裝置。Another object of the present invention is to provide a substrate bonding apparatus which can be applied to various fields.
本發明為解決習知技術之問題所採用之技術手段係提供一種基板貼合裝置，用以將一可撓性基板貼合在一標的基板之貼合面。包括一貼合治具、一可撓性基板承托結構和一軟性板。貼合治具係由一對相對應之側壁形成一凹部空間，並在凹部空間之頂面形成一開放頂面，凹部空間係連通有一抽氣通道。可撓性基板承托結構係形成在貼合治具之凹部空間中，用以承托可撓性基板之兩端緣，並使可撓性基板之底面與標的基板之貼合面之間具有一預定間距。軟性板係蓋覆在貼合治具之開放頂面，以在軟性板與貼合治具之凹部空間之間形成一氣密貼合艙室。當軟性板與貼合治具之凹部空間之間形成之氣密貼合艙室由一真空抽氣裝置經由抽氣通道予以抽真空時，軟性板受真空壓力作用變形下凹，而將可撓性基板向下壓，使可撓性基板之底面貼合於標的基板之貼合面。The technical means adopted by the present invention to solve the problems of the prior art provides a substrate bonding apparatus for bonding a flexible substrate to a bonding surface of a target substrate. The utility model comprises a bonding fixture, a flexible substrate supporting structure and a flexible board. The fitting fixture forms a recessed space by a pair of corresponding side walls, and forms an open top surface on the top surface of the recessed space, and the recessed space is connected to an air suction passage. The flexible substrate supporting structure is formed in the recessed space of the bonding fixture for supporting both end edges of the flexible substrate, and has a surface between the bottom surface of the flexible substrate and the target substrate a predetermined spacing. The flexible panel cover overlies the open top surface of the conforming fixture to form an airtight fit compartment between the flexible panel and the recessed space of the conforming fixture. When the airtight fitting compartment formed between the flexible plate and the recessed space of the fitting jig is evacuated by a vacuum suction device via the suction passage, the flexible plate is deformed by the vacuum pressure to be concave, and the flexibility is obtained. The substrate is pressed downward, and the bottom surface of the flexible substrate is bonded to the bonding surface of the target substrate.
於本發明之較佳實施例中，基板貼合裝置更可包括一頂推機構，設置於貼合治具之底部所開設之一槽孔中，當氣密貼合艙室中之空氣被抽空後，頂推機構將標的基板向上頂推一預定距離，以使標的基板之貼合面完全貼合於可撓性基板之底面。In a preferred embodiment of the present invention, the substrate bonding apparatus further includes a pushing mechanism disposed in one of the slots formed in the bottom of the bonding fixture, and the air in the airtight fitting compartment is evacuated. The pushing mechanism pushes the target substrate upward by a predetermined distance so that the bonding surface of the target substrate completely conforms to the bottom surface of the flexible substrate.
經由本發明所採用之技術手段，可以使得兩不同之基板在貼合之過程中穩定地貼合，而不致偏移定位。且藉由頂推機構之設計可使兩基板更完全緊密地貼合一起，並且本發明之結構設計係可應用於各種需貼合兩種基板之不同應用領域中。Through the technical means adopted by the present invention, two different substrates can be stably attached during the bonding without offset positioning. Moreover, the two substrates can be more closely attached together by the design of the pushing mechanism, and the structural design of the present invention can be applied to various application fields in which the two substrates need to be bonded.
本發明所採用的具體實施例，將藉由以下之實施例及附呈圖式作進一步之說明。The specific embodiments of the present invention will be further described by the following examples and the accompanying drawings.
參閱第2圖所示，其係顯示本發明基板貼合裝置第一實施例之剖視圖。本發明基板貼合裝置100係用以將一可撓性基板2貼合在一標的基板1之貼合面11，亦即標的基板1之貼合面11係塗佈有一層光學膠12，可撓性基板2係可經由光學膠12而貼合於標的基板1之貼合面11。Referring to Fig. 2, there is shown a cross-sectional view showing a first embodiment of the substrate bonding apparatus of the present invention. The substrate bonding apparatus 100 of the present invention is used for bonding a flexible substrate 2 to the bonding surface 11 of a target substrate 1, that is, the bonding surface 11 of the target substrate 1 is coated with a layer of optical glue 12, The flexible substrate 2 can be bonded to the bonding surface 11 of the target substrate 1 via the optical adhesive 12 .
本發明基板貼合裝置100包括一貼合治具31、一軟性板4和一壓合構件41。The substrate bonding apparatus 100 of the present invention comprises a bonding fixture 31, a flexible board 4 and a pressing member 41.
貼合治具31係由一對相對應之側壁形成一凹部空間32，並在凹部空間32之頂面形成一開放頂面33，凹部空間32中係供承置標的基板1。且凹部空間32中係形成有一可撓性基板承托結構34，用以承托可撓性基板2之兩端緣，並使可撓性基板2之底面與標的基板1之貼合面11之間具有一預定間距。於本實施例中，可撓性基板承托結構34係為形成在貼合治具31之凹部空間32中之一對應側壁之段階結構。凹部空間32連通有一抽氣通道35，且貼合治具31之選定位置係開設有一排氣孔36。The fitting jig 31 forms a recessed space 32 by a pair of corresponding side walls, and forms an open top surface 33 on the top surface of the recessed space 32. The recessed space 32 is for holding the target substrate 1. A flexible substrate supporting structure 34 is formed in the recessed space 32 for supporting both end edges of the flexible substrate 2, and the bottom surface of the flexible substrate 2 and the bonding surface 11 of the target substrate 1 are formed. There is a predetermined spacing between them. In the present embodiment, the flexible substrate supporting structure 34 is a stepped structure formed on one of the corresponding side walls of the recessed space 32 of the bonding jig 31. The recessed space 32 is connected to an air suction passage 35, and a selected position of the fitting jig 31 defines a venting opening 36.
軟性板4係蓋覆在貼合治具31之開放頂面33，以在軟性板4與貼合治具31之凹部空間32之間形成一氣密貼合艙室37。或者，軟性板4亦可以一撓性板來替代。壓合構件41係位在貼合治具31之開放頂面33，用以將軟性板4緊密蓋覆在貼合治具31之開放頂面33，並且軟性板4係距離可撓性基板2之頂面一預定距離。軟性板4係可使用橡膠、矽膠(Silicon Rubber)、PVC、PET、PE等軟性或彈性之材料。The flexible panel 4 is covered on the open top surface 33 of the bonding jig 31 to form an airtight bonding compartment 37 between the flexible panel 4 and the recessed space 32 of the bonding fixture 31. Alternatively, the flexible board 4 can be replaced by a flexible board. The pressing member 41 is fastened to the open top surface 33 of the bonding jig 31 for closely covering the flexible panel 4 to the open top surface 33 of the bonding fixture 31, and the flexible panel 4 is spaced apart from the flexible substrate 2 The top surface is a predetermined distance. The flexible sheet 4 can be made of a soft or elastic material such as rubber, silicone rubber, PVC, PET, or PE.
參閱第3圖所示，當軟性板4與貼合治具31之凹部空間32之間形成之氣密貼合艙室37由一真空抽氣裝置5經由一抽氣管路51和抽氣通道35予以抽真空時，軟性板4受一真空壓力III作用變形下凹，而將可撓性基板2向下壓，使可撓性基板2之底面貼合於標的基板1之貼合面11。當可撓性基板2之底面貼合於標的基板1之貼合面11後，由於貼合治具31之排氣孔36係經由一導管61連接於一開關閥62，操控者係可開啟開關閥62以使氣密貼合艙室37中之殘留氣體經由排氣孔36和導管61排出。Referring to Fig. 3, the airtight fitting compartment 37 formed between the flexible panel 4 and the recessed space 32 of the bonding jig 31 is supplied by a vacuum pumping device 5 via an air suction line 51 and an air suction passage 35. When the vacuum is applied, the flexible sheet 4 is deformed by a vacuum pressure III, and the flexible substrate 2 is pressed downward, and the bottom surface of the flexible substrate 2 is bonded to the bonding surface 11 of the target substrate 1. After the bottom surface of the flexible substrate 2 is attached to the bonding surface 11 of the target substrate 1, the vent hole 36 of the bonding fixture 31 is connected to an on-off valve 62 via a conduit 61, and the controller can open the switch. The valve 62 is configured to discharge residual gas in the airtight bonding chamber 37 through the exhaust hole 36 and the duct 61.
參閱第4圖所示，其係顯示本發明基板貼合裝置第二實施例之剖視圖。本發明基板貼合裝置200之結構設計與前述之第一實施例大致相同，故相同之構件乃標示以相同之元件編號，以資對應。其差異在於基板貼合裝置200係包括一頂推機構7，頂推機構7係設置於貼合治具31之底部所開設之一槽孔38中。Referring to Fig. 4, there is shown a cross-sectional view showing a second embodiment of the substrate bonding apparatus of the present invention. The structural design of the substrate bonding apparatus 200 of the present invention is substantially the same as that of the first embodiment described above, and the same components are denoted by the same component numbers. The difference is that the substrate bonding apparatus 200 includes a pushing mechanism 7 which is disposed in one of the slots 38 formed in the bottom of the bonding fixture 31.
參閱第5圖所示，在本發明之第二實施例中，當氣密貼合艙室37中之空氣被抽空後，頂推機構7施以一頂推力IV予標的基板1，而將標的基板1向上頂推一預定距離，以使標的基板1之貼合面11完全貼合於可撓性基板2之底面。同樣地，此時操控者係可開啟開關閥62以使氣密貼合艙室37中之殘留氣體經由排氣孔36和導管61排出。Referring to FIG. 5, in the second embodiment of the present invention, when the air in the airtight fitting compartment 37 is evacuated, the pushing mechanism 7 applies a substrate 1 with a thrust IV pre-standard, and the target substrate is used. 1 Pushing a predetermined distance upward so that the bonding surface 11 of the target substrate 1 is completely attached to the bottom surface of the flexible substrate 2. Similarly, at this time, the controller can open the on-off valve 62 to discharge the residual gas in the airtight fitting chamber 37 through the exhaust hole 36 and the duct 61.
參閱第6圖所示，其係顯示本發明基板貼合裝置第三實施例之剖視圖。本發明基板貼合裝置300之結構設計與前述之第一實施例大致相同，故相同之構件乃標示以相同之元件編號，以資對應。其差異在於基板貼合裝置300之貼合治具31a之一對應側壁並不形成有可撓性基板承托結構34，因此可撓性基板2係經由一層靜電膠42貼附於軟性板4之底面，並使用一對CCD影像感測器81和一對設置於軟性板4之頂面之定位點82來進行標的基板1和可撓性基板2之相對位置的判定與對準。Referring to Fig. 6, there is shown a cross-sectional view showing a third embodiment of the substrate bonding apparatus of the present invention. The structural design of the substrate bonding apparatus 300 of the present invention is substantially the same as that of the first embodiment described above, and the same components are denoted by the same component numbers. The difference is that one of the bonding fixtures 31a of the substrate bonding apparatus 300 does not have the flexible substrate supporting structure 34 corresponding to the side wall. Therefore, the flexible substrate 2 is attached to the flexible board 4 via a layer of electrostatic adhesive 42. The bottom surface uses a pair of CCD image sensors 81 and a pair of positioning points 82 provided on the top surface of the flexible board 4 to determine and align the relative positions of the target substrate 1 and the flexible substrate 2.
參閱第7圖所示，在本發明之第三實施例中，當氣密貼合艙室37由真空抽氣裝置5經由抽氣管路51和抽氣通道35予以抽真空時，軟性板4以及貼附於軟性板4之可撓性基板2受一真空壓力III作用變形下凹，而使可撓性基板2之底面貼合於標的基板1之貼合面11。當可撓性基板2之底面貼合於標的基板1之貼合面11後，操控者係可開啟開關閥62以使氣密貼合艙室37中之殘留氣體經由排氣孔36和導管61排出。Referring to Fig. 7, in the third embodiment of the present invention, when the airtight fitting compartment 37 is evacuated by the vacuum pumping means 5 via the suction line 51 and the suction passage 35, the flexible board 4 and the sticker The flexible substrate 2 attached to the flexible board 4 is deformed by a vacuum pressure III, and the bottom surface of the flexible substrate 2 is bonded to the bonding surface 11 of the target substrate 1. After the bottom surface of the flexible substrate 2 is attached to the bonding surface 11 of the target substrate 1, the controller can open the switching valve 62 to discharge the residual gas in the airtight bonding chamber 37 through the vent hole 36 and the conduit 61. .
參閱第8圖所示，其係顯示本發明基板貼合裝置第四實施例之剖視圖。本發明基板貼合裝置400之結構設計與前述之第三實施例大致相同，故相同之構件乃標示以相同之元件編號，以資對應。其差異在於基板貼合裝置400係包括一頂推機構7，頂推機構7係設置於貼合治具31之底部所開設之一槽孔38中。Referring to Fig. 8, there is shown a cross-sectional view showing a fourth embodiment of the substrate bonding apparatus of the present invention. The structural design of the substrate bonding apparatus 400 of the present invention is substantially the same as that of the third embodiment described above, and the same components are denoted by the same component numbers. The difference is that the substrate bonding apparatus 400 includes a pushing mechanism 7 which is disposed in one of the slots 38 formed in the bottom of the bonding fixture 31.
參閱第9圖所示，在本發明之第四實施例中，當氣密貼合艙室37中之空氣被抽空後，頂推機構7施以一頂推力IV予標的基板1，而將標的基板1向上頂推一預定距離，以使標的基板1之貼合面11完全貼合於可撓性基板2之底面。同樣地，此時操控者係可開啟開關閥62以使氣密貼合艙室37中之殘留氣體經由排氣孔36和導管61排出。Referring to FIG. 9, in the fourth embodiment of the present invention, when the air in the airtight fitting compartment 37 is evacuated, the pushing mechanism 7 applies a substrate 1 with a thrust IV pre-standard, and the target substrate is used. 1 Pushing a predetermined distance upward so that the bonding surface 11 of the target substrate 1 is completely attached to the bottom surface of the flexible substrate 2. Similarly, at this time, the controller can open the on-off valve 62 to discharge the residual gas in the airtight fitting chamber 37 through the exhaust hole 36 and the duct 61.
由以上之實施例可知，本發明所提供之基板貼合裝置確具產業上之利用價值，故本發明業已符合於專利之要件。惟以上之敘述僅為本發明之較佳實施例說明，凡精於此項技藝者當可依據上述之說明而作其它種種之改良，惟這些改變仍屬於本發明之發明精神及以下所界定之專利範圍中。It can be seen from the above embodiments that the substrate bonding apparatus provided by the present invention has industrial utilization value, and thus the present invention has met the requirements of the patent. The above description is only for the preferred embodiment of the present invention, and those skilled in the art can make other various improvements according to the above description, but these changes still belong to the inventive spirit of the present invention and the following definitions. In the scope of patents.
100、200、300、400．．．基板貼合裝置100, 200, 300, 400. . . Substrate bonding device
1．．．標的基板1. . . Target substrate
11．．．貼合面11. . . Fitting surface
12．．．光學膠12. . . Optical glue
2．．．可撓性基板2. . . Flexible substrate
3．．．滾輪3. . . Wheel
31、31a．．．貼合治具31, 31a. . . Fitting fixture
32．．．凹部空間32. . . Concave space
33．．．開放頂面33. . . Open top
34．．．可撓性基板承托結構34. . . Flexible substrate support structure
35．．．抽氣通道35. . . Pumping channel
36．．．排氣孔36. . . Vent
37．．．氣密貼合艙室37. . . Airtight fitting compartment
38．．．槽孔38. . . Slot
4．．．軟性板4. . . Soft board
41．．．壓合構件41. . . Pressing member
42．．．靜電膠42. . . Electrostatic glue
5．．．真空抽氣裝置5. . . Vacuum pumping device
51．．．抽氣管路51. . . Suction line
61．．．導管61. . . catheter
62．．．開關閥62. . . Switch valve
7．．．頂推機構7. . . Push mechanism
81．．．CCD影像感測器81. . . CCD image sensor
82．．．定位點82. . . location point
I．．．方向I. . . direction
II．．．壓合力II. . . Pressing force
III．．．真空壓力III. . . Vacuum pressure
IV．．．頂推力IV. . . Top thrust
第1圖係習用以滾輪貼合基板之示意圖；第2圖係本發明基板貼合裝置第一實施例之剖視圖；第3圖係本發明基板貼合裝置第一實施例之基板貼合動作示意圖；第4圖係本發明基板貼合裝置第二實施例之剖視圖；第5圖係本發明基板貼合裝置第二實施例之基板貼合動作示意圖；第6圖係本發明基板貼合裝置第三實施例之剖視圖；第7圖係本發明基板貼合裝置第三實施例之基板貼合動作示意圖；第8圖係本發明基板貼合裝置第四實施例之剖視圖；第9圖係本發明基板貼合裝置第四實施例之基板貼合動作示意圖。1 is a schematic view of a substrate for attaching a roller; FIG. 2 is a cross-sectional view showing a first embodiment of the substrate bonding apparatus of the present invention; and FIG. 3 is a schematic view of a substrate bonding operation of the first embodiment of the substrate bonding apparatus of the present invention. Figure 4 is a cross-sectional view showing a second embodiment of the substrate bonding apparatus of the present invention; Figure 5 is a schematic view showing a substrate bonding operation of the second embodiment of the substrate bonding apparatus of the present invention; and Figure 6 is a substrate bonding apparatus of the present invention. 3 is a cross-sectional view showing a substrate bonding operation of a substrate bonding apparatus according to a third embodiment of the present invention; and FIG. 8 is a cross-sectional view showing a fourth embodiment of the substrate bonding apparatus of the present invention; A substrate bonding operation diagram of the fourth embodiment of the substrate bonding apparatus.
200．．．基板貼合裝置200. . . Substrate bonding device
1．．．標的基板1. . . Target substrate
11．．．貼合面11. . . Fitting surface
12．．．光學膠12. . . Optical glue
2．．．可撓性基板2. . . Flexible substrate
31．．．貼合治具31. . . Fitting fixture
32．．．凹部空間32. . . Concave space
33．．．開放頂面33. . . Open top
34．．．可撓性基板承托結構34. . . Flexible substrate support structure
35．．．抽氣通道35. . . Pumping channel
36．．．排氣孔36. . . Vent
37．．．氣密貼合艙室37. . . Airtight fitting compartment
38．．．槽孔38. . . Slot
4．．．軟性板4. . . Soft board
41．．．壓合構件41. . . Pressing member
5．．．真空抽氣裝置5. . . Vacuum pumping device
51．．．抽氣管路51. . . Suction line
61．．．導管61. . . catheter
62．．．開關閥62. . . Switch valve
7．．．頂推機構7. . . Push mechanism
III．．．真空壓力III. . . Vacuum pressure
IV．．．頂推力IV. . . Top thrust
Claims (14)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96134107A TWI381495B (en) | 2007-09-12 | 2007-09-12 | Substrate bonding device |
| JP2007009685U JP3140061U (en) | 2007-09-12 | 2007-12-18 | Substrate bonding equipment |
| DE200820000705 DE202008000705U1 (en) | 2007-09-12 | 2008-01-18 | Apparatus for laminating flexible substrates to a target substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW96134107A TWI381495B (en) | 2007-09-12 | 2007-09-12 | Substrate bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200913180A TW200913180A (en) | 2009-03-16 |
| TWI381495B true TWI381495B (en) | 2013-01-01 |
Family
ID=39597932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96134107A TWI381495B (en) | 2007-09-12 | 2007-09-12 | Substrate bonding device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3140061U (en) |
| DE (1) | DE202008000705U1 (en) |
| TW (1) | TWI381495B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9655244B1 (en) | 2015-11-20 | 2017-05-16 | Industrial Technology Research Institute | Flexible electronic device and method for manufacturing the same |
| TWI643696B (en) * | 2015-11-20 | 2018-12-11 | 財團法人工業技術研究院 | Bonding/debonding device and bonding method and debonding method for using the same |
| US10173407B2 (en) | 2015-11-20 | 2019-01-08 | Industrial Technology Research Institute | Device for removing and adhering substrate and method for using the device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102476487B (en) * | 2010-11-25 | 2014-07-02 | 联茂电子股份有限公司 | Substrate stitching device, stitching method and substrate groupware thereof |
| US20130312907A1 (en) * | 2012-05-23 | 2013-11-28 | Lg Display Co., Ltd. | Substrate-bonding apparatus for display device and method for manufacturing bonded substrate |
| CN106853711B (en) * | 2015-12-09 | 2019-01-22 | 宸鸿光电科技股份有限公司 | Abutted equipment and applying method |
| CN211467477U (en) * | 2019-11-30 | 2020-09-11 | 向波 | Cell-phone screen sticking film machine is taken out vacuum to gasbag |
| CN113805296B (en) * | 2020-05-29 | 2023-02-21 | 上海微电子装备（集团）股份有限公司 | Optical assembly and manufacturing method thereof |
| CN113299582B (en) * | 2021-04-29 | 2023-08-25 | 江苏集萃有机光电技术研究所有限公司 | Packaging method and cover plate attaching jig |
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| TWI278793B (en) * | 2005-01-27 | 2007-04-11 | Shibaura Mechatronics Corp | Substrate bonding apparatus and a bonding method and a bonding method for judging of a substrates bonding |
| TWI286626B (en) * | 2003-03-04 | 2007-09-11 | Shibaura Mechatronics Corp | Method of bonding substrates and apparatus for bonding substrates |
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|---|---|---|---|---|
| US5393365A (en) | 1993-11-19 | 1995-02-28 | E. I. Du Pont De Nemours And Company | Embossed glass/plastic laminate and process for preparing the same |
| US5858163A (en) | 1996-03-22 | 1999-01-12 | Gerber Optical, Inc. | Apparatus for making ophthalmic lenses by vacuum lamination |
-
2007
- 2007-09-12 TW TW96134107A patent/TWI381495B/en not_active IP Right Cessation
- 2007-12-18 JP JP2007009685U patent/JP3140061U/en not_active Expired - Lifetime
-
2008
- 2008-01-18 DE DE200820000705 patent/DE202008000705U1/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI286626B (en) * | 2003-03-04 | 2007-09-11 | Shibaura Mechatronics Corp | Method of bonding substrates and apparatus for bonding substrates |
| TWI278793B (en) * | 2005-01-27 | 2007-04-11 | Shibaura Mechatronics Corp | Substrate bonding apparatus and a bonding method and a bonding method for judging of a substrates bonding |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9655244B1 (en) | 2015-11-20 | 2017-05-16 | Industrial Technology Research Institute | Flexible electronic device and method for manufacturing the same |
| TWI643696B (en) * | 2015-11-20 | 2018-12-11 | 財團法人工業技術研究院 | Bonding/debonding device and bonding method and debonding method for using the same |
| US10173407B2 (en) | 2015-11-20 | 2019-01-08 | Industrial Technology Research Institute | Device for removing and adhering substrate and method for using the device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3140061U (en) | 2008-03-13 |
| DE202008000705U1 (en) | 2008-07-10 |
| TW200913180A (en) | 2009-03-16 |
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