CN113299582B - Packaging method and cover plate attaching jig - Google Patents
Packaging method and cover plate attaching jig Download PDFInfo
- Publication number
- CN113299582B CN113299582B CN202110476897.5A CN202110476897A CN113299582B CN 113299582 B CN113299582 B CN 113299582B CN 202110476897 A CN202110476897 A CN 202110476897A CN 113299582 B CN113299582 B CN 113299582B
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- attached
- cover plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Quality & Reliability (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention relates to a packaging method and a cover plate attaching jig, wherein the packaging method comprises the following steps: (1) providing a cover plate to be bonded and a substrate to be bonded; (2) Coating glue on the upper surface of the substrate to be bonded; (3) The cover plate to be attached and the substrate to be attached move relatively along the direction parallel to the upper surface of the substrate to be attached, the cover plate to be attached pushes away the glue on the substrate to be attached and the lower surface of the cover plate to be attached overcomes the friction force suffered by the cover plate to be attached and the residual glue on the substrate to be attached are attached together after sliding contact, and the attachment of the cover plate to be attached and the substrate to be attached is completed. According to the packaging method and the cover plate attaching jig disclosed by the invention, the cover plate to be attached is attached together after being horizontally contacted with the glue on the substrate to be attached in a sliding manner, so that no bubbles are generated in the attaching process, and the yield of products is improved.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a packaging method and a cover plate attaching jig.
Background
In the technical fields of liquid crystal display and photoelectric display, chip cover plate lamination is an important technology, and along with the rapid development of semiconductor technology, the application of the chip cover plate lamination technology is becoming wider and wider. At present, the chip cover plate is generally attached by adopting a process route that the cover plate is directly attached from top to bottom, and the cover plate is directly faced to the chip, so that a small amount of bubbles can be generated in the process and remain in the curing adhesive, the product yield is affected, the failure rate of the product is increased, and the cost is seriously affected, so that the problem that needs to be solved in the field is how to reduce the generation of bubbles in the attaching process.
Disclosure of Invention
Therefore, the invention aims to provide a packaging method and a cover plate attaching jig, wherein the cover plate to be attached is pushed to push away the sacrificial colloid from the side surface, so that the attachment of the chip and the cover plate to be attached is completed, and no bubbles are generated in the attaching process.
In order to solve the technical problems, the invention provides a packaging method, which comprises the following steps:
(1) Providing a cover plate to be bonded and a substrate to be bonded;
(2) Coating glue on the upper surface of the substrate to be bonded;
(3) The cover plate to be attached and the substrate to be attached move relatively along the direction parallel to the upper surface of the substrate to be attached, the cover plate to be attached pushes away the glue on the substrate to be attached and the lower surface of the cover plate to be attached overcomes the friction force suffered by the cover plate to be attached and the residual glue on the substrate to be attached are attached together after sliding contact, and the attachment of the cover plate to be attached and the substrate to be attached is completed.
Further, in the step (2), first glue is coated on the upper surface of the substrate to be laminated, then second glue is coated on the upper surface of the first glue, the viscosity of the second glue is smaller than that of the first glue, in the step (3), the second glue on the substrate to be laminated is pushed away, and the lower surface of the cover plate to be laminated is laminated together after sliding contact with the first glue on the substrate to be laminated.
Further, in step (3), the cover plate to be attached pushes away the glue on the substrate to be attached and the lower surface of the cover plate to be attached overcomes the friction force of the cover plate to be attached so as to be in sliding contact with the residual glue on the substrate to be attached, and the cover plate to be attached maintains an inclined state, namely, one end of the cover plate to be attached, which is opposite to the friction force direction, is tilted upwards, so that an included angle is formed between the lower surface of the cover plate to be attached and the upper surface of the substrate to be attached.
Further, the included angle is set to be greater than 0 ° and less than or equal to 1 °.
The invention also provides another technical scheme: the utility model provides a apron laminating tool, includes the last anchor clamps that are used for fixed laminating apron and the lower anchor clamps that are used for fixed laminating base plate, go up the anchor clamps with lower anchor clamps are followed with the parallel direction relative motion of upper surface of base plate of waiting to laminate sets up, the lower surface of waiting to laminate the apron overcome its frictional force that receives with laminate together after sliding contact between the glue on the base plate of waiting to laminate.
Further, the end, which is fixed by the upper clamp, of the lower surface of the cover plate to be attached, which is opposite to the direction of the friction force, is tilted upwards, so that an included angle is formed between the lower surface of the cover plate to be attached and the upper surface of the substrate to be attached.
Further, the included angle is greater than 0 ° and less than or equal to 1 °.
Further, the side surface of the cover plate to be attached comprises a first side surface facing away from the friction force direction, and a first isolation part for isolating the first side surface from glue on the substrate to be attached is arranged on the outer side of the first side surface.
Further, the side surface of the cover plate to be attached comprises two second side surfaces parallel to the friction force direction, and a second isolation part for isolating the second side surfaces from glue on the substrate to be attached is arranged on the outer sides of the second side surfaces.
Further, the lower clamp is provided with a glue extraction channel for guiding out the glue pushed away or overflowed from between the substrate to be attached and the cover plate to be attached.
Compared with the prior art, the technical scheme of the invention has the following advantages:
1) According to the packaging method and the cover plate attaching jig disclosed by the invention, the cover plate to be attached is attached together after being horizontally contacted with the glue on the substrate to be attached in a sliding manner, so that no bubbles are generated in the attaching process, and the yield of products is improved;
2) According to the packaging method and the cover plate laminating jig disclosed by the invention, two layers of glue with different viscosities are coated, so that the processing difficulty and cost of the pushed glue are reduced as much as possible on the premise that the cover plate to be laminated can be in horizontal sliding contact with the glue on the substrate to be laminated;
3) According to the packaging method and the cover plate attaching jig disclosed by the invention, the cover plate to be attached is set to be slightly inclined, so that the rear end of the cover plate can keep an attaching state with the colloid after pushing away the colloid at the front end of the cover plate;
4) According to the packaging method and the cover plate attaching jig disclosed by the invention, the first isolation part and the second isolation part are arranged, and the glue overflowing from three sides is isolated by the first isolation part and the second isolation part, so that redundant glue is prevented from being arranged on the side edges of the cover plate and the base plate, the interference of residual glue on a chip is reduced, and the stability of a product is improved;
5) According to the packaging method and the cover plate attaching jig disclosed by the invention, the glue extraction pipeline is adopted, so that the interference of residual glue on a chip is further reduced, and the stability of a product is improved.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings, in which
FIG. 1 is a schematic diagram of the operation of the cover plate to be bonded for preparing glue on the substrate to be bonded;
FIG. 2 is a schematic diagram of the operation of the cover plate to be bonded according to the present invention when pushing the glue on the substrate to be bonded;
FIG. 3 is a schematic diagram of the operation of the present invention in which the cover plate to be bonded and the substrate to be bonded are bonded;
FIG. 4 is a front view of the cover plate attaching jig of the present disclosure;
FIG. 5 is a top view of the cover plate attaching jig of the present disclosure;
FIG. 6 is a side view of the upper clamp of the present disclosure;
fig. 7 is a side view of the upper clamp of the present disclosure.
Description of the specification reference numerals: 10. a cover plate to be attached; 11. a first side; 12. a second side; 20. a substrate to be bonded; 30. glue; 31. a first glue; 32. a second glue; 40. a clamp is arranged; 50. a lower clamp; 51. a glue extracting channel; 52. a bottom plate; 53. a side plate; 60. a first isolation member; 70. a second isolation member; 81. a guide wheel assembly; 82. a guide groove.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
Example 1
Referring to fig. 1-3, as shown in the legend therein, a packaging method comprises the steps of:
(1) Providing a cover plate 10 to be bonded and a substrate 20 to be bonded;
(2) Coating glue 30 on the upper surface of the substrate 20 to be bonded;
(3) The cover plate 10 to be attached and the substrate 20 to be attached move relatively along the direction parallel to the upper surface of the substrate 20 to be attached, the cover plate 10 to be attached pushes away the glue 30 on the substrate 20 to be attached, the lower surface of the cover plate 10 to be attached overcomes the friction force F suffered by the glue to be attached so as to be attached together after being in sliding contact with the residual glue on the substrate 20 to be attached, and the attachment of the cover plate 10 to be attached and the substrate 20 to be attached is completed.
In the above, the substrate to be bonded may be fixed and the cover plate to be bonded may be moved, the cover plate to be bonded may be fixed and the substrate to be bonded may be moved, or both the substrate to be bonded and the cover plate to be bonded may be moved. The optimization mode can be selected according to actual production requirements. Typically, the substrate to be bonded is fixed and the cover plate to be bonded is moved. The cover plate to be attached is attached together after being in horizontal sliding contact with the glue on the base plate to be attached, so that no bubbles are generated in the attaching process, and the yield of products is improved.
In the preferred embodiment of the present embodiment, in step (2), first, the first glue 31 is coated on the upper surface of the substrate 20 to be bonded, then, the second glue 32 is coated on the upper surface of the first glue 31, the viscosity of the second glue 32 is smaller than that of the first glue 31, and in step (3), the second glue 32 on the substrate 20 to be bonded is pushed away, and the lower surface of the cover plate 10 to be bonded is bonded together after sliding contact with the first glue 31 on the substrate 20 to be bonded.
Above, scribble two-layer glue that viscosity is different, the second glue viscosity that is pushed away is lower, and the first glue viscosity of remaining between waiting to laminate the apron and waiting to laminate the base plate is higher, under the prerequisite of guaranteeing to wait to laminate the apron and wait glue horizontal sliding contact and guaranteeing surplus glue bonding performance on the base plate, reduce the processing degree of difficulty and the cost of the glue that is pushed away as far as possible.
In the preferred embodiment of the present embodiment, one end of the cover plate 10 to be bonded facing away from the direction of the friction force F is tilted upward, so that an included angle is formed between the lower surface of the cover plate 10 to be bonded and the upper surface of the substrate 20 to be bonded.
Above, because machining tolerance or installation tolerance, the lower surface of waiting to laminate the apron hardly accomplishes the complete level, wait to laminate the apron and in the in-process of side direction flat-push laminating, after the front end of waiting to laminate the apron pushes away glue, wait to laminate the rear end of apron and the non-contact condition between glue that passes through, lead to side direction flat-push laminating effect not ideal. Through setting up the apron of waiting to laminate to slight slope, guarantee that the apron front end pushes away behind the colloid, the apron rear end can keep laminating state with the colloid.
In a preferred embodiment of this embodiment, the included angle is greater than 0 ° and equal to or less than 1 °.
The included angle cannot be set too large, otherwise, the lateral flat pushing and attaching effect is not ideal. The included angle may be a slight inclination angle.
Referring to fig. 4 to 7, as shown in the drawings, a cover plate attaching jig includes an upper clamp 40 for fixing a cover plate 10 to be attached and a lower clamp 50 for fixing a substrate 20 to be attached, wherein the upper clamp 40 and the lower clamp 50 are relatively moved along a direction parallel to an upper surface of the substrate 20 to be attached, and a lower surface of the cover plate 10 to be attached overcomes friction force applied by the lower surface to be attached to the lower surface of the cover plate to be attached so as to be attached to glue on the substrate 20 to be attached after sliding contact.
In the above, the substrate to be bonded may be fixed and the cover plate to be bonded may be moved, the cover plate to be bonded may be fixed and the substrate to be bonded may be moved, or both the substrate to be bonded and the cover plate to be bonded may be moved. The optimization mode can be selected according to actual production requirements. Typically, the substrate to be bonded is fixed and the cover plate to be bonded is moved. The cover plate to be attached is attached together after being in horizontal sliding contact with the glue on the base plate to be attached, so that no bubbles are generated in the attaching process, and the yield of products is improved.
In the preferred embodiment of the present embodiment, one end of the lower surface of the cover plate 10 to be bonded, which is fixed by the upper clamp 40 and is opposite to the direction of the friction force F, is tilted upward, so that an included angle is formed between the lower surface of the cover plate 10 to be bonded and the upper surface of the substrate 20 to be bonded.
Above, because machining tolerance or installation tolerance, the lower surface of waiting to laminate the apron hardly accomplishes the complete level, wait to laminate the apron and in the in-process of side direction flat-push laminating, after the front end of waiting to laminate the apron pushes away glue, wait to laminate the rear end of apron and the non-contact condition between glue that passes through, lead to side direction flat-push laminating effect not ideal. Through setting up the apron of waiting to laminate to slight slope, guarantee that the apron front end pushes away behind the colloid, the apron rear end can keep laminating state with the colloid.
In a preferred embodiment of this embodiment, the included angle is greater than 0 ° and equal to or less than 1 °. For example 1 deg. or 0.5 deg..
In a preferred embodiment of the present embodiment, the side surface of the cover plate 10 to be bonded includes a first side surface 11 facing away from the direction of the friction force F, and a first isolation member 60 for isolating the first side surface 11 from the glue on the substrate 20 to be bonded is disposed on the outer side of the first side surface.
In the preferred embodiment of the present embodiment, the side surface of the cover plate 10 to be bonded includes two second side surfaces 12 parallel to the direction of the friction force F, and the second side surfaces 12 are provided with second isolation members 70 on the outer sides for isolating them from the glue on the substrate 20 to be bonded.
Above, glue does not contact with the side edge of the cover plate to be attached, redundant colloid is prevented from being arranged on the side edges of the cover plate and the base plate, the interference of residual colloid on the chip is reduced, and the stability of the product is improved.
In the preferred embodiment of the present embodiment, the lower fixture 50 is provided with a glue extraction channel 51 for guiding out glue that has been pushed away or overflowed from between the substrate 20 to be bonded and the cover plate 10 to be bonded.
In the above, the excessive, pushed away or overflowed glue is timely extracted, so that the interference of the residual glue on the chip is further reduced, and the stability of the product is improved.
Specifically, the upper jig 40 guides the wheel assembly 81, and the lower jig 50 is provided with a guide groove 82, and the wheel assembly 81 moves in the guide groove 82.
The cover plate 10 to be attached is vacuum-absorbed on the upper clamp;
the first isolation part 60 covers the whole surface of the first side surface 11 and is used for pushing the pushed-away glue on the substrate to be attached, the first isolation part is arranged as an isolation strip, the first isolation part is relatively fixed with the upper clamp, and the lower end of the first isolation part 60 is approximately flush with the upper surface of the substrate 20 to be attached;
the second isolation part 70 covers the whole surface of the second side 12 or nearly covers the area of the second side close to the first side, and is used for pushing the pushed-away glue on the substrate to be attached to overflow, the first isolation part is provided as an isolation strip or an isolation column, the second isolation part is fixed relative to the upper clamp, and the lower end of the second isolation part 70 is approximately flush with the lower surface of the cover plate 10 to be attached;
the lower jig 50 includes a flat bottom plate 52 and upright side plates 53, and the bottom plate 52 and the side plates 53 enclose a semi-closed space that is open at the upper side and open at one side.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (10)
1. A method of packaging comprising the steps of:
(1) Providing a cover plate to be bonded and a substrate to be bonded;
(2) Coating glue on the upper surface of the substrate to be bonded;
(3) The cover plate to be attached and the substrate to be attached move relatively along the direction parallel to the upper surface of the substrate to be attached, the cover plate to be attached pushes away the glue on the substrate to be attached and the lower surface of the cover plate to be attached overcomes the friction force suffered by the cover plate to be attached and the residual glue on the substrate to be attached are attached together after sliding contact, and the attachment of the cover plate to be attached and the substrate to be attached is completed.
2. The packaging method according to claim 1, wherein in the step (2), a first glue is coated on the upper surface of the substrate to be bonded, then a second glue is coated on the upper surface of the first glue, the viscosity of the second glue is smaller than that of the first glue, in the step (3), the second glue on the substrate to be bonded is pushed away, and the lower surface of the cover plate to be bonded is bonded together after sliding contact with the first glue on the substrate to be bonded.
3. The packaging method according to claim 1, wherein in the step (3), the cover plate to be attached keeps an inclined state in a process that the cover plate to be attached pushes away the glue on the substrate to be attached and the lower surface of the cover plate to be attached overcomes the friction force of the glue to be attached so as to be in sliding contact with the residual glue on the substrate to be attached, namely, one end of the cover plate to be attached, which is opposite to the friction force direction, is tilted upwards, so that an included angle is formed between the lower surface of the cover plate to be attached and the upper surface of the substrate to be attached.
4. A packaging method according to claim 3, wherein the included angle is set to be greater than 0 ° and equal to or less than 1 °.
5. A packaging method for packaging by using a cover plate attaching jig is characterized in that: the cover plate laminating jig comprises an upper clamp for fixing a cover plate to be laminated and a lower clamp for fixing a substrate to be laminated, wherein the upper clamp and the lower clamp are arranged in a relative motion mode along the direction parallel to the upper surface of the substrate to be laminated, the lower surface of the cover plate to be laminated overcomes the friction force suffered by the lower surface of the cover plate to be laminated so as to be laminated together after being in sliding contact with glue on the substrate to be laminated, and the packaging method comprises the following steps:
(1) Providing a cover plate to be bonded and a substrate to be bonded;
(2) Coating glue on the upper surface of the substrate to be bonded;
(3) The cover plate to be attached and the substrate to be attached move relatively along the direction parallel to the upper surface of the substrate to be attached, the cover plate to be attached pushes away the glue on the substrate to be attached and the lower surface of the cover plate to be attached overcomes the friction force suffered by the cover plate to be attached and the residual glue on the substrate to be attached are attached together after sliding contact, and the attachment of the cover plate to be attached and the substrate to be attached is completed.
6. The method for packaging by using a cover plate attaching jig according to claim 5, wherein an end, facing away from the friction force direction, of the lower surface of the cover plate to be attached, which is fixed by the upper clamp, is tilted upward, so that an included angle is formed between the lower surface of the cover plate to be attached and the upper surface of the substrate to be attached.
7. The method of claim 6, wherein the included angle is greater than 0 ° and less than or equal to 1 °.
8. The method according to claim 5, wherein the side surface of the cover plate to be bonded includes a first side surface facing away from the direction of the friction force, and a first isolation component for isolating the first side surface from the glue on the substrate to be bonded is disposed on the outer side of the first side surface.
9. The method according to claim 5, wherein the side surface of the cover plate to be bonded includes two second sides parallel to the friction force direction, and a second isolation member for isolating the second sides from the glue on the substrate to be bonded is disposed outside the second sides.
10. The method according to claim 5, wherein the lower jig is provided with a glue extraction channel for guiding out glue that is pushed away or overflowed from between the substrate to be bonded and the cover to be bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110476897.5A CN113299582B (en) | 2021-04-29 | 2021-04-29 | Packaging method and cover plate attaching jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110476897.5A CN113299582B (en) | 2021-04-29 | 2021-04-29 | Packaging method and cover plate attaching jig |
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| Publication Number | Publication Date |
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| CN113299582A CN113299582A (en) | 2021-08-24 |
| CN113299582B true CN113299582B (en) | 2023-08-25 |
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| CN112382593A (en) * | 2020-11-27 | 2021-02-19 | 苏州茂特斯自动化设备有限公司 | Tool apron of blanking machine is torn open and is closed mechanism in chip assembly |
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| TW515062B (en) * | 2001-12-28 | 2002-12-21 | Delta Optoelectronics Inc | Package structure with multiple glue layers |
| TW200913180A (en) * | 2007-09-12 | 2009-03-16 | Tpk Touch Solutions Inc | Substrate-laminating apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN113299582A (en) | 2021-08-24 |
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