TW201805174A - Curved surface laminating device and laminating method - Google Patents
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Description
本發明涉及一種貼合裝置，特別涉及一種曲面貼合裝置及貼合方法。The invention relates to a laminating device, in particular to a curved surface bonding device and a bonding method.
顯示器分為平面顯示器與曲面顯示器。隨著智慧手錶、手機及大型顯示面板等多種曲面顯示器的陸續上市，精確高效曲面顯示器的貼合技術越顯重要。The display is divided into a flat display and a curved display. With the introduction of a variety of curved displays such as smart watches, mobile phones and large display panels, the bonding technology of accurate and efficient curved displays is becoming more and more important.
曲面顯示器包括柔性基板與曲面3D保護玻璃的貼合總成，柔性基板通常為觸摸屏傳感器或柔性OLED顯示屏。曲面顯示器的製作流程之一為將柔性基板與曲面玻璃基板相貼合。The curved display includes a bonding assembly of a flexible substrate and a curved 3D protective glass, which is typically a touch screen sensor or a flexible OLED display. One of the processes of the curved display is to bond the flexible substrate to the curved glass substrate.
觸摸屏生產操作時，通常先將光學膠貼合在玻璃基板與柔性基板之間，再用滾輪滾壓，將柔性基板壓在玻璃基板上。採用這種方式貼合曲面顯示器時，一般需要先將柔性基板撐平，再用滾輪將柔性基板壓在曲面玻璃基板上。 然而，柔性基板的張力過大時容易產生電路缺陷，若玻璃基板的曲率較小時，則柔性基板與曲面玻璃基板容易產生干涉而增加貼合的困難度，且柔性基板與曲面玻璃基板之間容易產生氣泡，造成曲面顯示器的品質不佳，製造良率較低。In the production operation of the touch screen, the optical adhesive is usually bonded between the glass substrate and the flexible substrate, and then rolled by a roller to press the flexible substrate against the glass substrate. When the curved display is attached in this way, it is generally required to flatten the flexible substrate first, and then press the flexible substrate against the curved glass substrate with a roller. However, when the tension of the flexible substrate is too large, circuit defects are likely to occur. If the curvature of the glass substrate is small, the flexible substrate and the curved glass substrate are likely to interfere, which increases the difficulty of bonding, and the flexible substrate and the curved glass substrate are easy to be used. Air bubbles are generated, resulting in poor quality of the curved display and low manufacturing yield.
有鑒於此，有必要提供一種曲面貼合裝置，解決柔性基板與曲面玻璃基板不易貼合的問題，以及貼合後的曲面顯示器的品質不佳的問題。In view of the above, it is necessary to provide a curved surface bonding apparatus that solves the problem that the flexible substrate and the curved glass substrate are not easily bonded, and the problem of poor quality of the curved display after bonding.
有鑒於此，還有必要提供一種貼合方法，解決柔性基板與曲面玻璃基板不易貼合的問題，以及貼合後的曲面顯示器的品質不佳的問題。In view of this, it is also necessary to provide a bonding method to solve the problem that the flexible substrate and the curved glass substrate are not easily bonded, and the problem of poor quality of the curved display after bonding.
本發明提供一種曲面貼合裝置，其包括上真空腔與下真空腔，該上真空腔與該下真空腔相對設置且可相對移動，以在該上真空腔與該下真空腔閉合時形成一密閉腔體，該上真空腔及該下真空腔至少之一設有與該密閉腔體相通的真空抽氣孔。該曲面貼合裝置還包括相對設置的上模與下模，該上模包括第一本體、第一靜電吸盤與第一推桿，該第一本體收容於該上真空腔中，該第一靜電吸盤設於該第一本體朝向該下模的第一表面上，該第一靜電吸盤為彎曲狀且用於吸附一第一基板，該第一推桿可活動地穿設於該上模上且與該第一本體相連接，以推動該第一本體及該第一靜電吸盤朝向靠近或遠離該下模的方向運動；該下模包括第二本體及第二靜電吸盤，該第二本體收容於該下真空腔中，該第二靜電吸盤設於該第二本體朝向該上模的第二表面上，該第二靜電吸盤為彎曲狀且用於吸附一第二基板，當該上真空腔與該下真空腔形成該密閉腔體後，該第一推桿帶動該第一靜電吸盤及該第一基板朝向該下模運動，以使該第一靜電吸盤上的該第一基板與該第二靜電吸盤上的該第二基板相貼合。The invention provides a curved surface fitting device, which comprises an upper vacuum chamber and a lower vacuum chamber. The upper vacuum chamber is opposite to the lower vacuum chamber and is relatively movable to form a first vacuum chamber and the lower vacuum chamber when the upper vacuum chamber is closed. The closed cavity, at least one of the upper vacuum chamber and the lower vacuum chamber is provided with a vacuum suction hole communicating with the closed cavity. The curved surface fitting device further includes an upper mold and a lower mold, the upper mold includes a first body, a first electrostatic chuck and a first push rod, and the first body is received in the upper vacuum chamber, the first static electricity The suction cup is disposed on the first surface of the first body facing the lower mold, the first electrostatic chuck is curved and is used for adsorbing a first substrate, wherein the first push rod is movably disposed on the upper mold and Connecting the first body and the first electrostatic chuck to move toward or away from the lower mold; the lower mold includes a second body and a second electrostatic chuck, and the second body is received in the second body In the lower vacuum chamber, the second electrostatic chuck is disposed on the second surface of the second body facing the upper mold, the second electrostatic chuck is curved and used for adsorbing a second substrate, when the upper vacuum chamber is After the lower vacuum chamber forms the closed cavity, the first push rod drives the first electrostatic chuck and the first substrate to move toward the lower mold, so that the first substrate and the second on the first electrostatic chuck The second substrate on the electrostatic chuck is attached.
本發明還提供一種貼合方法，該貼合方法包括以下步驟：提供曲面貼合裝置；將第二基板置於該下模的該第二靜電吸盤上；該上真空腔與該下真空腔相閉合以形成密閉腔體，該第一推桿帶動該上模朝向該下模運動，將該第二基板壓合成曲面，第二靜電吸盤吸附該第二基板並使該第二基板保持曲面；該上真空腔與該下真空腔相分離，該第一推桿帶動該上模朝向遠離該下模的方向運動；將第一基板放置於第一靜電吸盤上，且該第一靜電吸盤吸附該第一基板；該上真空腔與該下真空腔相閉合以形成密閉腔體，對該密閉腔體進行抽氣以在密閉腔體中形成真空；該第一推桿帶動該上模朝向該下模運動，使該第一基板與該第二基板相貼合。The present invention also provides a bonding method, the bonding method comprising the steps of: providing a curved surface fitting device; placing a second substrate on the second electrostatic chuck of the lower mold; the upper vacuum chamber and the lower vacuum chamber Closing to form a closed cavity, the first push rod drives the upper mold toward the lower mold, presses the second substrate into a curved surface, and the second electrostatic chuck adsorbs the second substrate and holds the second substrate to a curved surface; The upper vacuum chamber is separated from the lower vacuum chamber, the first push rod drives the upper mold to move away from the lower mold; the first substrate is placed on the first electrostatic chuck, and the first electrostatic chuck absorbs the first a substrate; the upper vacuum chamber is closed with the lower vacuum chamber to form a closed cavity, and the closed cavity is evacuated to form a vacuum in the sealed cavity; the first push rod drives the upper die toward the lower die Movement causes the first substrate to conform to the second substrate.
相較於先前技術，上述曲面貼合裝置包括第一靜電吸盤與第二靜電吸盤，能夠分別吸附第一基板與第二基板，且不會使第一基板與第二基板產生環形的缺陷。利用上真空腔與下真空腔形成密閉腔體，並藉由真空抽氣來形成真空環境，可避免在貼合第一基板與第二基板時產生氣泡。因此，上述曲面貼合裝置及貼合方法可用於貼合曲面玻璃與柔性基板，解決了曲面玻璃與柔性基板不易貼合的問題，且貼合後的顯示品質不會受到影響，從而顯示品質較佳。Compared with the prior art, the curved surface bonding apparatus includes a first electrostatic chuck and a second electrostatic chuck, which can respectively adsorb the first substrate and the second substrate without causing annular defects in the first substrate and the second substrate. The closed cavity is formed by the upper vacuum chamber and the lower vacuum chamber, and the vacuum environment is formed by vacuum pumping, thereby avoiding generation of air bubbles when the first substrate and the second substrate are bonded. Therefore, the curved surface bonding apparatus and the bonding method can be used for bonding curved glass and a flexible substrate, thereby solving the problem that the curved glass and the flexible substrate are not easily adhered, and the display quality after bonding is not affected, so that the display quality is better. good.
圖1係本發明實施方式的曲面貼合裝置的結構示意圖。1 is a schematic structural view of a curved surface bonding apparatus according to an embodiment of the present invention.
圖2至圖9分別係圖1所示的曲面貼合裝置在不同貼合狀態的結構示意圖。2 to 9 are respectively schematic structural views of the curved surface bonding apparatus shown in FIG. 1 in different bonding states.
圖10係本發明實施方式的貼合方法的流程圖。Fig. 10 is a flow chart showing a bonding method of an embodiment of the present invention.
下面將結合本發明實施例中的附圖，對本發明實施例中的技術方案進行清楚、完整地描述，顯然，所描述的實施例僅是本發明一部分實施例，而不是全部的實施例。基於本發明中的實施例，本領域普通技術人員在沒有做出創造性勞動前提下所獲得的所有其他實施例，都屬於本發明保護的範圍。The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
需要說明的是，當一元件被認為是“連接”另一元件，它可以是直接連接到另一元件或者可能同時存在居中設置的元件。當一元件被認為是“設置在”另一元件，它可以是直接設置在另一元件上或者可能同時存在居中設置的元件。It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or. When an element is considered to be "disposed on" another element, it can be directly disposed on the other element or.
除非另有定義，本文所使用的所有的技術與科學術語與屬於本發明的技術領域的技術人員通常理解的含義相同。本文中在本發明的說明書中所使用的術語只是為了描述具體的實施例的目的，不是旨在於限制本發明。本文所使用的術語“及／或”包括一或複數相關的所列項目的任意的與所有的組合。All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. The terminology used in the description of the present invention is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and/or" used herein includes any and all combinations of one or more of the associated listed items.
本發明提供一種適用於曲面顯示器的曲面貼合裝置，用於貼合曲面玻璃與柔性基板。在本實施方式中，曲面玻璃為曲面顯示器的玻璃蓋板，具有一定的弧度，柔性基板為觸摸屏傳感器，但不限於此。The invention provides a curved surface fitting device suitable for a curved display for fitting a curved glass and a flexible substrate. In the present embodiment, the curved glass is a glass cover of a curved display having a certain curvature, and the flexible substrate is a touch screen sensor, but is not limited thereto.
請參照圖1，曲面貼合裝置100包括相對設置的上真空腔10與下真空腔20，收容於上真空腔10中的上模30，以及收容於下真空腔20中的下模40。Referring to FIG. 1 , the curved surface bonding apparatus 100 includes an upper vacuum chamber 10 and a lower vacuum chamber 20 , an upper mold 30 housed in the upper vacuum chamber 10 , and a lower mold 40 received in the lower vacuum chamber 20 .
上真空腔10開設有第一凹槽11，上模30可活動地收容於第一凹槽11中，上真空腔10的中部上開設有二相互平行的第一通孔12。The upper vacuum chamber 10 is provided with a first recess 11 , and the upper mold 30 is movably received in the first recess 11 , and the first through hole 12 parallel to each other is opened in the middle of the upper vacuum chamber 10 .
下真空腔20開設有第二凹槽21，下模40固定收容於第二凹槽21中，下真空腔20上開設有二第二通孔22及一真空抽氣孔23，二第二通孔22相互平行，真空抽氣孔23靠近第二凹槽21的邊緣。上真空腔10與下真空腔20相閉合後，藉由真空抽氣孔23進行抽氣，上真空腔10與下真空腔20之間可形成真空環境。The lower vacuum chamber 20 is provided with a second recess 21, and the lower mold 40 is fixedly received in the second recess 21. The lower vacuum chamber 20 is provided with two second through holes 22 and a vacuum exhausting hole 23, and two second through holes. 22 are parallel to each other, and the vacuum suction holes 23 are close to the edge of the second groove 21. After the upper vacuum chamber 10 is closed with the lower vacuum chamber 20, the vacuum is extracted by the vacuum suction hole 23, and a vacuum environment is formed between the upper vacuum chamber 10 and the lower vacuum chamber 20.
下真空腔20朝向上真空腔10的端面上設有密封墊收容部24及密封墊25，密封墊25至少部分收容於密封墊收容部24中。在本實施方式中，密封墊收容部24為環狀的凹槽，密封墊25為圓環形的柔性墊圈。The lower vacuum chamber 20 is provided with a gasket accommodating portion 24 and a gasket 25 on the end surface of the upper vacuum chamber 10, and the gasket 25 is at least partially housed in the gasket accommodating portion 24. In the present embodiment, the gasket accommodating portion 24 is an annular groove, and the gasket 25 is a circular flexible gasket.
上真空腔10與下真空腔20可在控制台（圖未示）的控制下相對移動，以相貼合形成一密閉腔體。在本實施方式中，下真空腔20固定在控制台上，上真空腔10可在控制台作用下朝向靠近或遠離下真空腔20的方向運動，但不限於此，亦可將上真空腔10固定在控制台上，下真空腔20可在控制台作用下朝向靠近或遠離上真空腔10的方向運動，或者上真空腔10、下真空腔20均可運動。The upper vacuum chamber 10 and the lower vacuum chamber 20 are relatively movable under the control of a console (not shown) to form a closed cavity. In the present embodiment, the lower vacuum chamber 20 is fixed on the console, and the upper vacuum chamber 10 can be moved toward or away from the lower vacuum chamber 20 under the action of the console, but is not limited thereto, and the upper vacuum chamber 10 can also be used. Fixed on the console, the lower vacuum chamber 20 can be moved toward or away from the upper vacuum chamber 10 under the action of the console, or the upper vacuum chamber 10 and the lower vacuum chamber 20 can be moved.
上模30包括第一本體31，設於第一本體31一側的第一推桿32，以及設於第一本體31另一側的第一靜電吸盤（electrostatic chuck，ESC）33。The upper mold 30 includes a first body 31, a first push rod 32 disposed on one side of the first body 31, and a first electrostatic chuck (ESC) 33 disposed on the other side of the first body 31.
第一本體31上朝向下模40的表面為第一表面311，第一本體31中設有加熱件312與真空吸附組件313。加熱件312用於對上模30進行加熱，使後續連接到上模30上的工件軟化，以便於貼合。在本實施方式中，加熱件312為設於第一本體31內的加熱管，但不限於此。The surface of the first body 31 facing the lower mold 40 is a first surface 311, and the first body 31 is provided with a heating member 312 and a vacuum adsorption assembly 313. The heating member 312 is used to heat the upper mold 30 to soften the workpiece subsequently attached to the upper mold 30 to facilitate the bonding. In the present embodiment, the heating member 312 is a heating pipe provided in the first body 31, but is not limited thereto.
真空吸附組件313包括設於第一本體31中的第一吸附通道3131及複數第二吸附通道3132。第一吸附通道3131包括設於第一本體31邊緣的抽氣口3133，且第一吸附通道3131沿著與第一推桿32垂直的方向延伸。複數第二吸附通道3132分別與第一吸附通道3131垂直且相連通，但不限於此。The vacuum adsorption assembly 313 includes a first adsorption channel 3131 and a plurality of second adsorption channels 3132 disposed in the first body 31. The first adsorption channel 3131 includes an air suction port 3133 disposed at an edge of the first body 31, and the first adsorption channel 3131 extends in a direction perpendicular to the first push rod 32. The plurality of second adsorption channels 3132 are perpendicular and in communication with the first adsorption channels 3131, respectively, but are not limited thereto.
第一靜電吸盤33固定於第一本體31的第一表面311上且第一靜電吸盤33呈彎曲狀。第一靜電吸盤33包括介電層與一或複數電極（圖未示），藉由將電壓施加給位於介電層下方的一或複數電極，由工件與第一靜電吸盤33之間產生的靜電吸引力，將工件吸附到第一靜電吸盤33的表面。第一靜電吸盤33用於吸附第一基板。在本實施方式中，該第一基板為曲面玻璃210（參圖8）。The first electrostatic chuck 33 is fixed on the first surface 311 of the first body 31 and the first electrostatic chuck 33 is curved. The first electrostatic chuck 33 includes a dielectric layer and one or more electrodes (not shown). The static electricity generated between the workpiece and the first electrostatic chuck 33 is applied by applying a voltage to one or more electrodes located under the dielectric layer. Attraction, the workpiece is attracted to the surface of the first electrostatic chuck 33. The first electrostatic chuck 33 is for adsorbing the first substrate. In the present embodiment, the first substrate is a curved glass 210 (see FIG. 8).
在本實施方式中，第一靜電吸盤33上設有複數透氣孔（圖未示），複數透氣孔分別與相應地第二吸附通道3132相連通。當曲面玻璃210置於上模30上時，先藉由真空吸附組件313吸附曲面玻璃210，再有第一靜電吸盤33將曲面玻璃210固定在上模30上。In the present embodiment, the first electrostatic chuck 33 is provided with a plurality of vent holes (not shown), and the plurality of vent holes are respectively connected to the corresponding second adsorption channels 3132. When the curved glass 210 is placed on the upper mold 30, the curved glass 210 is first adsorbed by the vacuum adsorption unit 313, and the curved glass 210 is fixed to the upper mold 30 by the first electrostatic chuck 33.
在本實施方式中，第一推桿32的數量為二，二第一推桿32分別可活動地穿設於上真空腔10相應的第一通孔12中，並與第一本體31固定連接。第一推桿32與一驅動件（圖未示）連接，在驅動件的驅動下，第一推桿32能夠帶動上模30朝向靠近或遠離下模40的方向運動。可以理解，在其它實施方式中，第一推桿32的數量可以為一或二以上。In the present embodiment, the number of the first push rods 32 is two, and the two first push rods 32 are movably disposed in the corresponding first through holes 12 of the upper vacuum chamber 10, and are fixedly connected to the first body 31. . The first push rod 32 is coupled to a driving member (not shown). Under the driving of the driving member, the first push rod 32 can drive the upper mold 30 to move toward or away from the lower mold 40. It can be understood that in other embodiments, the number of the first push rods 32 may be one or two.
下模40包括第二本體41、緩衝墊42、第二靜電吸盤43及第二推桿44。The lower mold 40 includes a second body 41, a cushion 42, a second electrostatic chuck 43, and a second push rod 44.
第二本體41朝向上模30的表面為第二表面411，緩衝墊42及第二靜電吸盤43依次設於第二表面411上。第二本體41中設有加熱件412，加熱件412用於加熱第二本體41及第二本體41承載的工件。The surface of the second body 41 facing the upper mold 30 is a second surface 411, and the cushion 42 and the second electrostatic chuck 43 are sequentially disposed on the second surface 411. The second body 41 is provided with a heating member 412 for heating the workpiece carried by the second body 41 and the second body 41.
緩衝墊42設於第二本體41與第二靜電吸盤43之間，緩衝墊42用於在貼合工件時提供緩衝。在本實施方式中，緩衝墊42及第二靜電吸盤43均為彎曲狀，且頂面均為曲面。The cushion 42 is disposed between the second body 41 and the second electrostatic chuck 43 for providing cushioning when the workpiece is attached. In the present embodiment, the cushion 42 and the second electrostatic chuck 43 are both curved, and the top surfaces are curved surfaces.
第二靜電吸盤43的結構與第一靜電吸盤33大致相同，第二靜電吸盤用於吸附第二基板，在本實施方式中，該第二基板為柔性基板220（參圖8）。可以理解，為了使柔性基板220與曲面玻璃210完全貼合，第一靜電吸盤33、第二靜電吸盤43可具有相同或相近似的曲率半徑。較佳地，第一表面311、第二表面411、第一靜電吸盤33、第二靜電吸盤43均具有相同的曲率半徑。The structure of the second electrostatic chuck 43 is substantially the same as that of the first electrostatic chuck 33. The second electrostatic chuck is used to adsorb the second substrate. In the embodiment, the second substrate is a flexible substrate 220 (see FIG. 8). It can be understood that, in order to make the flexible substrate 220 and the curved glass 210 completely fit, the first electrostatic chuck 33 and the second electrostatic chuck 43 may have the same or similar radius of curvature. Preferably, the first surface 311, the second surface 411, the first electrostatic chuck 33, and the second electrostatic chuck 43 all have the same radius of curvature.
在本實施方式中，第二本體41、緩衝墊42及第二靜電吸盤43在對應第二通孔22的位置均開設有通孔（圖未示）。第二推桿44的數量為二，二第二推桿44分別可活動地穿設於下真空腔20、第二本體41、緩衝墊42及第二靜電吸盤43中，第二推桿44的一端設於下真空腔20遠離上真空腔10的一側。二第二推桿44與一驅動件（圖未示）連接。在驅動件的驅動下，二第二推桿44能夠朝向靠近或遠離上模30的方向移動。可以理解，在其他實施方式中，第二推桿44的數量亦可以為一或二以上。In the present embodiment, the second body 41, the cushion 42 and the second electrostatic chuck 43 are provided with through holes (not shown) at positions corresponding to the second through holes 22. The number of the second push rods 44 is two, and the second push rods 44 are movably disposed in the lower vacuum chamber 20, the second body 41, the cushion 42 and the second electrostatic chuck 43 respectively. One end is disposed on a side of the lower vacuum chamber 20 away from the upper vacuum chamber 10. The second push rod 44 is coupled to a driving member (not shown). The second second push rod 44 can be moved toward or away from the upper mold 30 by the driving member. It can be understood that in other embodiments, the number of the second push rods 44 may also be one or two.
請參照圖2， 第一推桿32包括第一桿部321、第一抵持部322及第一密封套筒323，第一桿部321與第一本體31相連接，第一抵持部322設於第一桿部321遠離下真空腔20的一端，第一密封套筒323套設在第一桿部321上，且兩端分別與第一抵持部322及上真空腔10相抵持。第一密封套筒323具有較佳的彈性，能夠防止第一推桿32的運動破壞上真空腔10與下真空腔20之間的真空環境。Referring to FIG. 2 , the first push rod 32 includes a first rod portion 321 , a first abutting portion 322 , and a first sealing sleeve 323 . The first rod portion 321 is connected to the first body 31 , and the first abutting portion 322 . The first sealing sleeve 323 is sleeved on the first rod portion 321 and the two ends abut against the first abutting portion 322 and the upper vacuum chamber 10 respectively. The first sealing sleeve 323 has better elasticity and can prevent the movement of the first push rod 32 from damaging the vacuum environment between the upper vacuum chamber 10 and the lower vacuum chamber 20.
第二推桿44包括第二桿部441、第二抵持部442及第二密封套筒443，第二桿部441的一端設於上真空腔10與下真空腔20之間，另一端位於下真空腔20遠離上真空腔10的一側。第二桿部441能夠相對於下真空腔20上下移動。第二抵持部442設於第二桿部遠離上真空腔10的一端，第二密封套筒443套設在第二桿部441上，且兩端分別抵持於第二抵持部442及下真空腔20。第二密封套筒443具有較佳的彈性，能夠防止第二推桿44的運動破壞上真空腔10與下真空腔20之間的真空環境。The second push rod 44 includes a second rod portion 441, a second abutting portion 442 and a second sealing sleeve 443. One end of the second rod portion 441 is disposed between the upper vacuum chamber 10 and the lower vacuum chamber 20, and the other end is located at The lower vacuum chamber 20 is away from the side of the upper vacuum chamber 10. The second rod portion 441 is movable up and down with respect to the lower vacuum chamber 20. The second abutting portion 442 is disposed at an end of the second rod portion away from the upper vacuum chamber 10 , and the second sealing sleeve 443 is sleeved on the second rod portion 441 , and the two ends respectively abut against the second abutting portion 442 and Lower vacuum chamber 20. The second sealing sleeve 443 has better elasticity and can prevent the movement of the second push rod 44 from damaging the vacuum environment between the upper vacuum chamber 10 and the lower vacuum chamber 20.
請同時參照圖1、圖2與圖8，上述曲面貼合裝置100中，第二推桿44能夠朝向靠近或遠離上真空腔10的方向移動，以承接柔性基板220，並將柔性基板220放置於第二靜電吸盤43上。上模30能夠在第一推桿32的驅動下朝向下模40運動，以將柔性基板220壓合在第二靜電吸盤43上，使柔性基板220呈彎曲狀。第一靜電吸盤33與第二靜電吸盤43通電後能夠分別吸附曲面玻璃210與柔性基板220，上真空腔10與下真空腔20能夠相貼合形成真空腔體，此時，第一推桿32再次驅動上模30朝向下模40運動，使曲面玻璃210與柔性基板220在一定的壓力下相貼合。Referring to FIG. 1 , FIG. 2 and FIG. 8 , in the curved surface bonding apparatus 100 , the second push rod 44 can move toward or away from the upper vacuum chamber 10 to receive the flexible substrate 220 and place the flexible substrate 220 . On the second electrostatic chuck 43. The upper mold 30 is movable toward the lower mold 40 under the driving of the first push rod 32 to press the flexible substrate 220 against the second electrostatic chuck 43 to make the flexible substrate 220 curved. After the first electrostatic chuck 33 and the second electrostatic chuck 43 are energized, the curved glass 210 and the flexible substrate 220 can be respectively adsorbed, and the upper vacuum chamber 10 and the lower vacuum chamber 20 can be attached to each other to form a vacuum chamber. At this time, the first push rod 32 The upper mold 30 is again driven to move toward the lower mold 40, so that the curved glass 210 and the flexible substrate 220 are attached under a certain pressure.
圖10為本發明提供的一種曲面貼合方法的流程圖。該曲面貼合方法包括以下步驟。FIG. 10 is a flow chart of a curved surface bonding method provided by the present invention. The surface fitting method includes the following steps.
S101：請參照圖2，在初始狀態，上真空腔10與下真空腔20相分離，加熱件312、412分別加熱上模30與下模40，使上模30與下模40保持貼合需求的溫度。S101: Referring to FIG. 2, in the initial state, the upper vacuum chamber 10 is separated from the lower vacuum chamber 20, and the heating members 312 and 412 respectively heat the upper mold 30 and the lower mold 40 to keep the upper mold 30 and the lower mold 40 in conformity. temperature.
S102：第二推桿44朝向上模30的方向運動以凸出於第二靜電吸盤43表面，接著，柔性基板220被放置於第二推桿44上方。此時，柔性基板220大致呈平面狀。S102: The second push rod 44 moves toward the upper mold 30 to protrude from the surface of the second electrostatic chuck 43, and then the flexible substrate 220 is placed above the second push rod 44. At this time, the flexible substrate 220 is substantially planar.
S103：請參照圖3，第二推桿44帶動柔性基板220朝向遠離上模30的方向運動，使柔性基板220被放置於在第二靜電吸盤43上。S103: Referring to FIG. 3, the second push rod 44 drives the flexible substrate 220 to move away from the upper mold 30, so that the flexible substrate 220 is placed on the second electrostatic chuck 43.
S104：請參照圖4，上真空腔10與下真空腔20相閉合以形成密閉腔體50，第一推桿32驅動第一本體31朝向下模40運動，將柔性基板220壓合成貼合需求之曲面，向第二靜電吸盤43施加電壓，使第二靜電吸盤吸附柔性基板220並使柔性基板220保持曲面。S104: Referring to FIG. 4, the upper vacuum chamber 10 is closed with the lower vacuum chamber 20 to form a closed cavity 50. The first push rod 32 drives the first body 31 to move toward the lower mold 40, and presses the flexible substrate 220 into a fitting requirement. The curved surface applies a voltage to the second electrostatic chuck 43, so that the second electrostatic chuck absorbs the flexible substrate 220 and maintains the flexible substrate 220 in a curved surface.
在壓合柔性基板220時，柔性基板220位於第一靜電吸盤33與第二靜電吸盤43之間，所以柔性基板220能夠被壓合成曲面，且柔性基板220的曲率與第一靜電吸盤33、第二靜電吸盤43曲率大致相同。When the flexible substrate 220 is pressed, the flexible substrate 220 is located between the first electrostatic chuck 33 and the second electrostatic chuck 43 , so that the flexible substrate 220 can be pressed into a curved surface, and the curvature of the flexible substrate 220 and the first electrostatic chuck 33 , The two electrostatic chucks 43 have substantially the same curvature.
S105：請參照圖5，上真空腔10與下真空腔20相分離，第一推桿32帶動上模30朝向遠離下模40的方向運動。此時，吸附在第二靜電吸盤43上的柔性基板220仍保持曲面的狀態。S105: Referring to FIG. 5, the upper vacuum chamber 10 is separated from the lower vacuum chamber 20, and the first push rod 32 drives the upper mold 30 to move away from the lower mold 40. At this time, the flexible substrate 220 adsorbed on the second electrostatic chuck 43 remains in a curved state.
S106：將曲面玻璃210放置於第一靜電吸盤33的表面，且第一靜電吸盤33吸附曲面玻璃210。請參照圖6，在本實施方式中，將曲面玻璃210放置於第一靜電吸盤33的表面，先由真空吸附組件313吸附曲面玻璃210，接著，對第一靜電吸盤33施加電壓，使第一靜電吸盤33與曲面玻璃210之間產生靜電吸引力，從而將曲面玻璃210吸附在第一靜電吸盤33上。另外，撕掉柔性基板220上的保護膜（圖未示）。S106: The curved glass 210 is placed on the surface of the first electrostatic chuck 33, and the first electrostatic chuck 33 adsorbs the curved glass 210. Referring to FIG. 6 , in the present embodiment, the curved glass 210 is placed on the surface of the first electrostatic chuck 33 , and the curved glass 210 is first adsorbed by the vacuum adsorption assembly 313 , and then the voltage is applied to the first electrostatic chuck 33 to make the first An electrostatic attraction force is generated between the electrostatic chuck 33 and the curved glass 210, so that the curved glass 210 is adsorbed on the first electrostatic chuck 33. In addition, the protective film (not shown) on the flexible substrate 220 is torn off.
S107：請參照圖8，上真空腔10與下真空腔20相閉合以形成密閉腔體50，利用真空抽氣孔23對密閉腔體50進行抽氣，以在密閉腔體50中形成真空。此時，曲面玻璃210與柔性基板220之間尚具有一定的距離。S107: Referring to FIG. 8, the upper vacuum chamber 10 and the lower vacuum chamber 20 are closed to form a closed cavity 50, and the closed cavity 50 is evacuated by the vacuum suction hole 23 to form a vacuum in the sealed cavity 50. At this time, the curved glass 210 and the flexible substrate 220 still have a certain distance.
S 108：請參照圖9，第一推桿32帶動上模30朝向下模40運動一定的距離，使曲面玻璃210與柔性基板220在一定的壓力下相貼合。S 108: Referring to FIG. 9 , the first push rod 32 drives the upper mold 30 to move toward the lower mold 40 by a certain distance, so that the curved glass 210 and the flexible substrate 220 are pressed under a certain pressure.
貼合完成後，第一推桿32帶動上模30朝向遠離下模40的方向移動，並且下真空腔20與上真空腔10相離運動。After the fitting is completed, the first push rod 32 drives the upper mold 30 to move away from the lower mold 40, and the lower vacuum chamber 20 moves away from the upper vacuum chamber 10.
在另一實施方式中，步驟S 101中可以僅對上模30進行加熱，或者可以取消步驟101，即可以不對上模30與下模40加熱，或者僅對上模30加熱。In another embodiment, only the upper mold 30 may be heated in step S101, or step 101 may be eliminated, that is, the upper mold 30 and the lower mold 40 may not be heated, or only the upper mold 30 may be heated.
在另一實施方式中，步驟S102與S103可以取消，此時，在步驟S 101之後，直接將柔性基板220放置於第二靜電吸盤43上。In another embodiment, steps S102 and S103 may be canceled. At this time, after step S101, the flexible substrate 220 is directly placed on the second electrostatic chuck 43.
在另一實施方式中，上述曲面貼合方法還包括在貼合前分別對該曲面玻璃210與柔性基板220進行取像，以使曲面玻璃210與柔性基板220對齊。請參照圖7，在步驟S106之後，將一上模視覺檢測機構61與一下模視覺檢測機構62移動至上模30與下模40之間，使用上模視覺檢測機構61、下模視覺檢測機構62分別對曲面玻璃210與柔性基板220進行取像，以檢測曲面玻璃210與柔性基板220是否對位準確。若對位準確，則直接進入步驟107。若對位不準確，則移動曲面玻璃210或柔性基板220的位置，使曲面玻璃210與柔性基板220重新對位，對位準確後再進入步驟107。In another embodiment, the curved surface bonding method further includes taking the curved glass 210 and the flexible substrate 220 separately before bonding to align the curved glass 210 with the flexible substrate 220. Referring to FIG. 7, after step S106, an upper die visual detecting mechanism 61 and a lower mode visual detecting mechanism 62 are moved between the upper die 30 and the lower die 40, and the upper die visual detecting mechanism 61 and the lower die visual detecting mechanism 62 are used. The curved glass 210 and the flexible substrate 220 are respectively imaged to detect whether the curved glass 210 and the flexible substrate 220 are aligned accurately. If the alignment is accurate, proceed directly to step 107. If the alignment is not accurate, the position of the curved glass 210 or the flexible substrate 220 is moved, and the curved glass 210 and the flexible substrate 220 are realigned, and the alignment is accurate, and then the process proceeds to step 107.
上述曲面貼合裝置100能夠在真空環境下貼合曲面玻璃210與柔性基板220，避免產生貼合氣泡；第一靜電吸盤33與第二靜電吸盤43分別吸附曲面玻璃210與柔性基板220，能夠避免工件產生環狀的缺陷。因此，上述曲面貼合裝置100解決了曲面玻璃210與柔性基板220不易貼合的問題，且貼合後的顯示品質不會受到影響。The curved surface bonding apparatus 100 can adhere the curved glass 210 and the flexible substrate 220 in a vacuum environment to avoid the formation of the bonding bubbles; the first electrostatic chuck 33 and the second electrostatic chuck 43 respectively adsorb the curved glass 210 and the flexible substrate 220, thereby avoiding The workpiece produces a ring-shaped defect. Therefore, the above-described curved surface bonding apparatus 100 solves the problem that the curved glass 210 and the flexible substrate 220 are not easily attached, and the display quality after bonding is not affected.
可以理解，在其它實施方式中，第一靜電吸盤33可用於吸附柔性基板220，第二靜電吸盤43可用於吸附曲面玻璃210。貼合時，在第一靜電吸盤33吸附柔性基板220後，第一推桿32帶動上模30朝向下模40運動，以將柔性基板220壓合成曲面。It can be understood that in other embodiments, the first electrostatic chuck 33 can be used to adsorb the flexible substrate 220, and the second electrostatic chuck 43 can be used to adsorb the curved glass 210. At the time of bonding, after the first electrostatic chuck 33 adsorbs the flexible substrate 220, the first push rod 32 drives the upper mold 30 to move toward the lower mold 40 to press the flexible substrate 220 into a curved surface.
可以理解，在其它實施方式中，第二推桿44可活動地穿設在下真空腔20上並與下模40固定連接，此時，第二推桿44可推動下模40朝向上模30運動。It can be understood that in other embodiments, the second push rod 44 is movably disposed on the lower vacuum chamber 20 and fixedly coupled to the lower mold 40. At this time, the second push rod 44 can push the lower mold 40 toward the upper mold 30. .
在本實施方式中，上模包括真空吸附組件313，在其它實施方式中，真空吸附組件313可以取消，直接使用第一靜電吸盤33吸附曲面玻璃即可。In the present embodiment, the upper mold includes a vacuum adsorption assembly 313. In other embodiments, the vacuum adsorption assembly 313 can be eliminated, and the curved glass can be directly adsorbed by using the first electrostatic chuck 33.
可以理解，在其它實施方式中，上真空腔10的加熱件312與下真空腔20的加熱件412可以取消，此時，可將上真空腔10、下真空腔20放入一加熱裝置（圖未示）內進行加熱，該加熱裝置例如為電熱鼓風乾燥箱，但不限於此。It can be understood that in other embodiments, the heating member 312 of the upper vacuum chamber 10 and the heating member 412 of the lower vacuum chamber 20 can be eliminated. At this time, the upper vacuum chamber 10 and the lower vacuum chamber 20 can be placed into a heating device (Fig. Heating is performed in the inside, which is, for example, an electric blast drying oven, but is not limited thereto.
在本實施方式中，真空抽氣孔23開設在下真空腔20上，可以理解，在其它實施方式中，真空抽氣孔23可以開設在上真空腔10上，或者同時開設在上真空腔10與下真空腔20上。In the present embodiment, the vacuum suction hole 23 is opened on the lower vacuum chamber 20. It can be understood that in other embodiments, the vacuum suction hole 23 can be opened on the upper vacuum chamber 10 or simultaneously open in the upper vacuum chamber 10 and the lower vacuum. On the cavity 20.
可以理解，在其它實施方式中，下真空腔20的密封墊25及密封墊收容部24可以取消，只要上真空腔10與下真空腔20之間能夠實現密封即可；下模40的緩衝墊42亦可以取消。It can be understood that in other embodiments, the gasket 25 and the gasket accommodating portion 24 of the lower vacuum chamber 20 can be eliminated, as long as the sealing between the upper vacuum chamber 10 and the lower vacuum chamber 20 can be achieved; the cushion of the lower mold 40 42 can also be cancelled.
可以理解，第一密封套筒323能夠恢復彈性形變以帶動第一推桿32復位，或者第一推桿32在驅動件的驅動下復位。相似地，第二密封套筒443能夠恢復彈性形變以帶動第二推桿44復位，或者第二推桿44在驅動件的驅動下復位。It can be understood that the first sealing sleeve 323 can restore the elastic deformation to bring the first push rod 32 to reset, or the first push rod 32 is driven under the driving of the driving member. Similarly, the second sealing sleeve 443 can restore elastic deformation to bring the second push rod 44 to reset, or the second push rod 44 is driven under the driving of the driving member.
綜上所述，本發明符合發明專利要件，爰依法提出申請專利。惟，以上該者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在爰依本發明精神所作之等效修飾或變化，皆應涵蓋於以下之如申請專利範圍內。In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
100‧‧‧曲面貼合裝置100‧‧‧Surface fitting device
210‧‧‧曲面玻璃210‧‧‧Surface glass
220‧‧‧柔性基板220‧‧‧Flexible substrate
10‧‧‧上真空腔10‧‧‧Upper vacuum chamber
11‧‧‧第一凹槽11‧‧‧First groove
12‧‧‧第一通孔12‧‧‧ first through hole
20‧‧‧下真空腔20‧‧‧Under vacuum chamber
21‧‧‧第二凹槽21‧‧‧second groove
22‧‧‧第二通孔22‧‧‧Second through hole
23‧‧‧真空抽氣孔23‧‧‧vacuum evacuation holes
24‧‧‧密封墊收容部24‧‧‧Seaket accommodating department
25‧‧‧密封墊25‧‧‧ Seal
30‧‧‧上模30‧‧‧上模
31‧‧‧第一本體31‧‧‧First Ontology
311‧‧‧第一表面311‧‧‧ first surface
312，412‧‧‧加熱件312,412‧‧‧heating parts
313‧‧‧真空吸附組件313‧‧‧Vacuum adsorption assembly
3131‧‧‧第一吸附通道3131‧‧‧First adsorption channel
3132‧‧‧第二吸附通道3132‧‧‧Second adsorption channel
3133‧‧‧抽氣口3133‧‧‧Exhaust port
32‧‧‧第一推桿32‧‧‧First putt
321‧‧‧第一桿部321‧‧‧ first pole
322‧‧‧第一抵持部322‧‧‧First Responsible Department
323‧‧‧第一密封套筒323‧‧‧First sealing sleeve
33‧‧‧第一靜電吸盤33‧‧‧First electrostatic chuck
40‧‧‧下模40‧‧‧下模
41‧‧‧第二本體41‧‧‧Second ontology
411‧‧‧第二表面411‧‧‧ second surface
42‧‧‧緩衝墊42‧‧‧ cushion
43‧‧‧第二靜電吸盤43‧‧‧Second electrostatic chuck
44‧‧‧第二推桿44‧‧‧Second putter
441‧‧‧第二桿部441‧‧‧Second pole
442‧‧‧第二抵持部442‧‧‧ Second Responsible Department
443‧‧‧第二密封套筒443‧‧‧Second sealing sleeve
50‧‧‧密閉腔體50‧‧‧Closed cavity
61‧‧‧上模視覺檢測機構61‧‧‧Upper visual inspection agency
62‧‧‧下模視覺檢測機構62‧‧‧Down visual inspection agency
無no
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| TW (1) | TW201805174A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109733669A (en) * | 2018-12-23 | 2019-05-10 | 武汉抱冰工业发展有限公司 | Automatically it cuts equipment for coating film and cuts overlay film integrated packing method |
| CN111640371A (en) * | 2018-04-20 | 2020-09-08 | 云谷（固安）科技有限公司 | Attaching device and attaching method for special-shaped curved surface cover plate and flexible screen |
| TWI818552B (en) * | 2022-05-25 | 2023-10-11 | 天虹科技股份有限公司 | Bonding machine for improving alignment accuracy |
| TWI819616B (en) * | 2022-05-20 | 2023-10-21 | 天虹科技股份有限公司 | Bonding machine with movable suction modules |
-
2016
- 2016-08-01 TW TW105124365A patent/TW201805174A/en unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111640371A (en) * | 2018-04-20 | 2020-09-08 | 云谷（固安）科技有限公司 | Attaching device and attaching method for special-shaped curved surface cover plate and flexible screen |
| CN111640371B (en) * | 2018-04-20 | 2022-04-15 | 云谷（固安）科技有限公司 | Attaching device and attaching method for special-shaped curved surface cover plate and flexible screen |
| US11367860B2 (en) | 2018-04-20 | 2022-06-21 | Yungu (Gu'an) Technology Co., Ltd. | Bonding devices and bonding methods for irregular-shaped curved cover plates and flexible screens |
| CN109733669A (en) * | 2018-12-23 | 2019-05-10 | 武汉抱冰工业发展有限公司 | Automatically it cuts equipment for coating film and cuts overlay film integrated packing method |
| TWI819616B (en) * | 2022-05-20 | 2023-10-21 | 天虹科技股份有限公司 | Bonding machine with movable suction modules |
| TWI818552B (en) * | 2022-05-25 | 2023-10-11 | 天虹科技股份有限公司 | Bonding machine for improving alignment accuracy |
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